CN1288924A - Single-component organic heat-conducting daub - Google Patents

Abstract

The present invention discloses a single-component organic type heat-conducting daub. The described heat-conducting daub is a material using heat-conductive material and bonding material as main body, and in made into paste-like material by means of proper working production method. The service temp. of said daub can be up to 160 deg.C, binding shear strength can be up to above 10 MPa, and its heat cnductivity can be up to above 12 K cal/m,hr,deg.C. It possesses the advantages of high bond strength, good heat conductivity, convenient use and low cost, etc..

Description

Single-component organic heat-conducting daub

The invention belongs to the adhesive technology field, relate to a kind of organic adhesion agent, relate in particular to a kind of organic heat-conducting daub.

Organic heat-conducting daub in industries such as oil, chemical industry, pharmacy, adopt companion's pipe to accompany heat or accompany cold material conveying pipe and reaction or storage facilities in have very and use widely.At present, many products are arranged also on the market, as the THERMON series product of U.S. THERMON company, but it costs an arm and a leg, and generally wants 30,000 dollars/ton.The Z01 heat-conducting daub of producing as the holy day chemical institute in Harbin in addition, but it is an a kind of pair of component heat-conducting daub, and it is very inconvenient to use.

The object of the present invention is to provide the organic heat-conducting daub of a kind of single-component, use inconvenience to overcome prior art, defect of high cost, this heat-conducting daub also has the advantage that thermal conductivity height, bonding strength are good, hardware had the corrosionproof protection effect simultaneously.

Realize that the object of the invention technical scheme is as described below:

Press the practical use and the using method of heat-conducting daub, heat-conducting daub requires to have following Specifeca tion speeification:

1) thermal conductivity, high thermal conductivity helps the transmission of heat, and the product that therefore requires to be studied has high as far as possible thermal conductivity.

2) linear expansivity, heat-conducting daub are laid between two metals usually, and are everlasting to differ under the bigger temperature with room temperature and work, and therefore require the coefficient of expansion of heat-conducting daub approaching as much as possible with the coefficient of expansion of steel, in order to avoid the bigger temperature stress of generation.

3) bonding strength, because the thermal conductivity of heat-conducting daub and the thermal conductivity of steel have a certain distance, it is imperative therefore to produce temperature stress, cracks in the course of the work for preventing heat-conducting daub, requires heat-conducting daub and steel to have certain bonding strength.

4) the heat resisting temperature heat-conducting daub under higher or lower temperature and the occasion work of temperature alternating, therefore requires heat-conducting daub can bear this temperature usually, and the major requirement material is not weightless under specified maximum operating temperature, softening, do not ftracture.

5). heat-conducting daub should be easy to the scene and lay, and is nuisanceless, and relevant device is had provide protection.

6). for the pipeline and the equipment of frequent maintenance, require heat-conducting daub should be easy to the dismounting, with satisfy chemical pipeline and equipment by the dress and maintenance requirement.

Self cure heat-conducting daub of the present invention be a kind of with thermally conductive material and matrix material as material of main part, by the mashed prod that suitable method for producing is made, its component and content are:

Resins, epoxy 10～55%

Thinner 10～30%

Filler 20～60%

Solidifying agent 1～15%

Toughner 5～20%

More than be weight percentage.

Said Resins, epoxy is the dihydroxyphenyl propane based epoxy resin, preferably adopts Shanghai Resin Factory to produce, and the trade mark is the Resins, epoxy of E51;

Said thinner is a propylene oxide phenyl ethers reactive thinner, preferably adopts Shanghai Resin Factory to produce, and the trade mark is 501 thinner;

Said filler is that graphite is or/and zinc powder;

Said solidifying agent is 2-methyl 4 ethyl imidazol(e)s;

Said toughner is commercially available end carboxyl nitrile (HTBN).

Preferred content is:

Resins, epoxy 20～40%

Thinner 10～25%

Filler 25～50%

Solidifying agent 2～12%

Toughner 6～10%.

Best content is:

Resins, epoxy 32%

Thinner 10%

Filler 45%

Solidifying agent 5%

Toughner 7%

Above-mentioned heat-conducting daub is preparation like this:

Resins, epoxy and hydroxyl terminated butyl nitrile (HTBN) are placed reactor, stirring reaction is 1.5 hours under 10～50 ℃ of temperature, adds 2-methyl 4 ethyl imidazol(e)s, heats up to cause 1 hour postcooling of 50～70 ℃ of reactions to room temperature, add 501 thinners in proportion, go out still behind the thorough mixing.In stirrer, add components such as graphite, zinc powder in proportion, after fully stirring, promptly obtain the organic heat-conducting daub of self cure, the use temperature of this clay can reach 160 ℃, bond shear strength can reach more than the 10MPa, and thermal conductivity can reach more than 12Kcal/m.hr. ℃.

This shows that heat-conducting daub of the present invention has advantages such as bonding strength height, thermal conductivity is good, easy to use, price is easy.The heat-conducting daub of this type is used for pipeline and equipment, not only can reduce the investment of equipment and pipeline, and obstruction capable of reducing energy consumption, as to prevent pipeline, makes pipeline be heated evenly, help improving the advantages such as quality of product.

Embodiment 1

The proportioning of heat-conducting daub (weight percent):

Resins, epoxy 32% (E51, Shanghai Resin Factory produces)

Thinner 10% (501, Shanghai Resin Factory produces)

Filler 45% (graphite)

Solidifying agent 5% (2-methyl 4 ethyl imidazol(e)s)

Toughner 7% (end carboxyl nitrile (HTBN))

Preparation process:

Resins, epoxy and hydroxyl terminated butyl nitrile (HTBN) are placed reactor, quick stirring reaction adds 2-methyl 4 ethyl imidazol(e)s under 30 ℃ of temperature after 1.5 hours, heats up to cause 1 hour postcooling of 50 ℃ of reactions to room temperature, adds 501 thinners, go out still behind the thorough mixing, obtain a kind of caking agent.In stirrer, add components such as the caking agent that will prepare as stated above, graphite, zinc powder in proportion, after fully stirring, promptly obtain the organic heat-conducting daub of self cure.This clay use temperature after 120 ℃ of curing can reach 160 ℃, and bond shear strength can reach more than the 10MPa, and thermal conductivity can reach more than 12Kcal/m.hr. ℃.

Embodiment 2

The proportioning of heat-conducting daub (weight percent):

Resins, epoxy 32% (E51, Shanghai Resin Factory produces)

Thinner 10% (501, Shanghai Resin Factory produces)

Filler 45% (graphite+zinc powder, 2: 1, weight ratio)

Solidifying agent 5% (2-methyl 4 ethyl imidazol(e)s)

Toughner 7% (end carboxyl nitrile (HTBN))

Preparation process such as embodiment 1.

The use temperature of this clay can reach 160 ℃, and bond shear strength can reach more than the 10MPa, and thermal conductivity can reach 14Kcal/m.hr. ℃, and can play the protection hardware by the effect of dielectric corrosion.

Claims (4)

1. a single-component organic heat-conducting daub is characterized in that, its component and weight percent content are:

Resins, epoxy 10～55%

Thinner 10～30%

Filler 20～60%

Solidifying agent 1～15%

Toughner 5～20%

Said Resins, epoxy is the dihydroxyphenyl propane based epoxy resin;

Said thinner is a propylene oxide phenyl ethers reactive thinner;

Said filler is that graphite is or/and zinc powder;

Said solidifying agent is 2-methyl 4 ethyl imidazol(e)s;

Said toughner is end carboxyl nitrile (HTBN).

2. heat-conducting daub as claimed in claim 1 is characterized in that, its component and content are:

Resins, epoxy 20～40%

Thinner 10～25%

Filler 25～50%

Solidifying agent 2～12%

Toughner 6～10%.

3. heat-conducting daub as claimed in claim 2 is characterized in that, its component and content are:

Resins, epoxy 32%

Thinner 10%

Filler 45%

Solidifying agent 5%

Toughner 7%.

4. as claim 1,2 or 3 described heat-conducting daubs, it is characterized in that said Resins, epoxy is that Shanghai Resin Factory produces, the trade mark is the Resins, epoxy of E51; Said thinner is that Shanghai Resin Factory produces, and the trade mark is 501 thinner.