CN114769026A - Special tool for spraying chip crystal oscillator - Google Patents
Special tool for spraying chip crystal oscillator Download PDFInfo
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- CN114769026A CN114769026A CN202210377064.8A CN202210377064A CN114769026A CN 114769026 A CN114769026 A CN 114769026A CN 202210377064 A CN202210377064 A CN 202210377064A CN 114769026 A CN114769026 A CN 114769026A
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- Prior art keywords
- crystal oscillator
- spraying
- negative pressure
- conveying
- chip crystal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
- B05B14/20—Arrangements for collecting, re-using or eliminating excess spraying material from moving belts, e.g. filtering belts or conveying belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention belongs to the technical field of a chip mounting tool device, and particularly relates to a special tool for spraying a chip mounting crystal oscillator, which is characterized in that: the special tool comprises a conveying assembly and a feeding assembly; the conveying component comprises a first vertical plate, a second vertical plate and a conveying belt; bear the wafer that the material loading subassembly dropped through the activity cavity in the conveyer belt, when the wafer was carried on the conveyer belt with first sensor, the touching detection of second sensor is used, the position when accurate judgement wafer carried on the conveyer belt, and accept the signal that first sensor and second sensor transmission come constantly through PLC, it is qualified whether to detect the product, to unqualified work piece, in time filter and get rid of, the direct output of spraying, export again after spraying qualified work piece, and export qualified products and defective products respectively, the qualification rate and the letter sorting efficiency of the paster crystal oscillator of improvement output.
Description
Technical Field
The invention belongs to the technical field of chip mounting tool devices, and particularly relates to a special tool for chip mounting crystal oscillator spraying.
Background
The patch crystal oscillator is one of the important component elements of the oscillator, and is an indispensable electronic component in modern science and technology due to the characteristics of high stability, high precision, low power consumption and the like, and the patch crystal oscillator is used in the aspects of consumption, industry, automobiles, medical treatment, security protection and the like and is an indispensable and irreplaceable element in electronic products.
The conventional chip crystal oscillator needs to be matched with a professional tool for use in a spraying process, and is small in size, difficult to fix, easy to deviate after feeding or in a conveying process and incapable of being adjusted in time after the feeding deviates, so that the stability of the chip crystal oscillator in the conveying process and the effect of the chip crystal oscillator in the spraying process are influenced; and for unqualified workpieces, the workpieces cannot be screened and eliminated in time, spraying is still carried out and output is carried out, and the qualification rate of the chip crystal oscillator is influenced.
Disclosure of Invention
Aiming at the problems, the invention provides a special tool for spraying a chip crystal oscillator, which comprises a conveying assembly, a spraying machine, a discharging assembly, a negative pressure assembly and a feeding assembly; a feeding component, a spraying machine and a blanking component are sequentially arranged along the transmission direction of the conveying component, the feeding component is fixedly connected with the upper part of the conveying component and is close to one end of the spraying machine,
the conveying assembly comprises one or more groups of conveying mechanisms, and each conveying mechanism comprises a first vertical plate, a second vertical plate and a conveying belt;
the conveying belt is rotatably connected between the adjacent inner walls of the first vertical plate and the second vertical plate, and a movable cavity is arranged in the middle of the conveying belt;
a recovery mechanism is fixedly connected to one side wall of the second vertical plate, a plurality of groups of clamping protrusions are arranged at intervals at the top end of the conveying belt, each group of clamping protrusions is provided with four clamping protrusions matched for use, a first sensor is fixedly connected to the inner side wall of each clamping protrusion, a second sensor is further arranged on the inner side of each first sensor, and a patch crystal oscillator is placed in each group of clamping protrusions;
the negative pressure assembly is fixedly connected to one end of the conveying assembly, and the air suction end of the negative pressure assembly extends into the conveying assembly;
the feeding assembly is fixedly connected to the upper part of the conveying assembly and one end of the conveying assembly close to the spraying machine, and the discharging end of the bottom of the feeding assembly corresponds to the movable cavity;
the outer wall of one side of material loading subassembly is fixedly connected with PLC controller still, and the work of the signal of sensor and control special frock is received to the PLC controller.
Furthermore, the negative pressure component is fixedly connected to the tops of the first vertical plate and the second vertical plate and is far away from one end of the blanking component, the air suction ends of the negative pressure component extend into the movable cavity and are communicated with each other, and negative pressure of the negative pressure component acts on the chip crystal oscillator in the movable cavity;
the upper part of the conveying component is fixedly connected with a spraying machine, the bottom of the spraying machine is provided with spraying nozzles, and the spraying nozzles are distributed on the top and two side parts of the conveying component.
Furthermore, the corner of a first vertical plate side wall is connected with four groups of first driving wheels in a rotating mode, the corner of a second vertical plate side wall is connected with four groups of second driving wheels in a rotating mode, and the conveying belt is connected with the four groups of first driving wheels and the four groups of second driving wheels in a driving mode.
Further, the recovery mechanism comprises a transverse plate; the top end of the transverse plate is fixedly connected with at least four groups of first electric push rods, second electric push rods and guide wheels, the outer wall of one side of each first electric push rod is fixedly connected with a second electric push rod, the output end of each second electric push rod is rotatably connected with a guide wheel, and the guide wheels are all in rolling fit with the inner wall of the conveying belt;
the recovery mechanism also comprises a material guide rail;
the bottom fixedly connected with of diaphragm retrieves the box, the orbital both ends of guide are downward sloping form fixed connection on the top of diaphragm, just the orbital both ends of guide are seted up with the baffle box that retrieves mutual intercommunication of box, the clout backward flow groove has been seted up on the surface of activity cavity, just the clout backward flow groove communicates with each other with the guide track.
Further, the blanking assembly comprises a blanking collecting box;
the blanking collecting box is characterized in that a separating plate is fixedly connected to the bottom end of the inner wall of the blanking collecting box, an unqualified product area is formed in one side of the separating plate, a qualified product area is formed in the other side of the separating plate, a movable plate is connected to the top end of the separating plate in a rotating mode, a second servo motor is fixedly connected to the outer wall of the blanking collecting box and connected with the end portion of the movable plate, a material receiving opening is formed in the top end of the blanking collecting box, and the material receiving opening is perpendicularly formed in the top end of the qualified product area.
Furthermore, the bottom end of the blanking collection box is connected with a material carrying flat plate in a sliding mode, and the material carrying flat plate is located at the bottom ends of the unqualified product area and the qualified product area.
Further, the negative pressure subassembly includes a set of or multiunit negative pressure mechanism, and conveying component and negative pressure subassembly correspond the setting, and a set of conveying mechanism includes a conveyer belt, sets up a set of negative pressure mechanism in the conveyer belt, and every negative pressure mechanism of group includes that negative pressure aspirator pump and negative pressure violently manage, the negative pressure is violently managed and is all extended to in the activity cavity.
Further, the tip that the negative pressure was violently managed is enclosed construction, the top that the negative pressure was violently managed is vertical fixed and the intercommunication has a plurality of groups negative pressure standpipe, a plurality of groups the top of negative pressure standpipe all is provided with the suction nozzle, just the suction nozzle uses with the bottom absorption cooperation of paster crystal oscillator, and the suction nozzle is the loudspeaker form towards the paster crystal oscillator.
Further, the feeding mechanism of the feeding assembly comprises a mounting shell;
an upper charging barrel is embedded in the inner wall of the mounting shell, a feeding port is formed in the upper end of the upper charging barrel, a discharging port is formed in the lower end of the upper charging barrel, a feeding door is arranged on the feeding port, and a discharging door is arranged on the discharging port; the upper charging barrel is communicated with the corresponding movable cavity and is matched with the movable cavity for use.
Further, according to the working method of the special tool for spraying the chip crystal oscillator, different types of chip crystal oscillators are sequentially stored in the corresponding feeding assemblies, and the stored chip crystal oscillators are put into the movable cavity by the feeding assemblies;
detecting whether four corners of the bottom end of the chip crystal oscillator are in contact with the sensors through the first sensor, judging whether the chip crystal oscillator is horizontal or qualified during transmission, if the chip crystal oscillator is not detected by the first sensor for many times, transmitting a signal to the PLC, and judging that the chip crystal oscillator is an unqualified piece by the PLC without further judgment; if the first sensors detect the surface mount crystal oscillator, the next judgment is carried out;
whether the bottom end of the chip crystal oscillator is qualified or not is judged through the contact of the second sensors and the bottom end of the chip crystal oscillator, if the positions of the bottom ends of the chip crystal oscillator cannot be detected by all the four second sensors, the second sensors transmit signals to the PLC, and the chip crystal oscillator is judged to be unqualified by the PLC; if the positions of the bottom ends of the chip crystal oscillators are detected by all the four second sensors, the second sensors transmit signals to the PLC, and the chip crystal oscillators are judged to be qualified by the PLC;
the conveying belt conveys the chip crystal oscillator backwards, and spraying is not carried out when the conveying belt inputs the chip crystal oscillator into a spraying area for the workpiece which is judged to be an unqualified workpiece according to the received signal by the PLC; for the workpiece which is judged to be a qualified workpiece by the PLC according to the received signal, the spraying machine simultaneously performs spraying operation on the top surface and the side surface of the chip crystal oscillator on the chip crystal oscillator below, the spraying machine is closed after spraying is finished, and the spraying machine is started again for spraying when the next chip crystal oscillator enters a spraying area;
when the conveying belt conveys the chip mounting crystal oscillator backwards to the discharging area, the PLC controls a second servo motor to rotate when judging that the chip mounting crystal oscillator is a workpiece of an unqualified part according to a received signal, drives the movable plate to rotate towards one side of the material receiving port, so that the chip mounting crystal oscillator falling in the material receiving port slides into an unqualified product area through the movable plate, and the PLC controls the second servo motor to rotate after primary product classification is completed, so that the movable plate is reset; if the PLC controller judges that the received signals are qualified, the second servo motor does not work, and the chip crystal oscillator directly falls into the qualified product area through the material receiving port.
The beneficial effects of the invention are:
1. the wafer dropped from the feeding assembly is loaded through a movable cavity in the conveying belt, each chip crystal oscillator is clamped and connected in a limiting mode through four clamping protrusions and matched with the negative pressure assembly, the air suction end of the negative pressure assembly extends into the conveying assembly to act on the chip crystal oscillator in the movable cavity, and the chip crystal oscillator can be stably fixed on the surface of the conveying assembly under the action of the negative pressure assembly; in addition, when the blanking is carried out, because the work piece loses the suction effect of negative pressure, the wafer is separated from the conveying belt under the action of gravity, and the blanking is convenient and quick.
2. When the wafer is conveyed on the conveying belt, the wafer is touched with the first sensor and the second sensor for detection, the position of the wafer when the wafer is conveyed on the conveying belt is accurately judged, signals transmitted by the first sensor and the second sensor are received constantly through the PLC, whether the surface-mounted crystal oscillator is a qualified piece is judged, so that the qualified piece is sprayed, the qualified piece and an unqualified piece are screened out, the spraying and sorting efficiency of the workpiece is improved, and the qualification rate of an output product is improved.
3. A first group of negative pressure vertical pipes connected with the negative pressure transverse pipes through hoses are arranged right below the feeding mechanism, the angle of the first group of negative pressure vertical pipes can be changed under the action of the driving mechanism, when the feeding mechanism feeds materials, at least one of the four first sensors does not detect the chip crystal oscillator, the PLC controller controls the driving mechanism to drive the first group of negative pressure vertical pipes to adjust the angle, the first group of negative pressure vertical pipes face to the position of one of the first sensors which does not detect the chip crystal oscillator and return to the right after working for 1-3 seconds, after working for four times, if the first sensor does not detect the chip crystal oscillator, a signal is transmitted to the PLC controller, the PLC controller judges the chip crystal oscillator to be an unqualified piece, after multiple times of adjustment, the unqualified piece caused by the fact that the chip crystal oscillator is not placed horizontally can be eliminated, and the unqualified piece caused by the uneven surface of the chip crystal oscillator due to the error of product processing is further determined, can more accurately screen out the unqualified part.
4. Receive the signal of PLC controller through second servo motor, if after the PLC controller analyzed out the piece that does not conform, PLC controller control second servo motor rotated, the drive fly leaf rotates to one side of receiving the material mouthful, make the crystal oscillator body that drops in receiving the material mouthful regional by fly leaf landing to defective products, accomplish a product classification back PLC controller drive second servo motor, make the fly leaf reset, if after the PLC controller analyzed out the piece that conforms, the crystal oscillator body is directly fallen into the defective products by receiving the material mouthful regional in, subsequent letter sorting has been avoided, the output time of qualified products is practiced thrift.
5. Through the clout backward flow groove that the activity cavity surface was seted up, retrieve the unnecessary spraying liquid in conveyer belt surface, make spraying liquid fall to the guide track in to the guide track structure that utilizes both ends inclined plane makes the spraying liquid of its inflow pass through the baffle box and store in retrieving the box, has improved the effect of clean and tidy nature in the conveyer belt use again when reaching coating recycle.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a special tool according to an embodiment of the present invention;
FIG. 2 is an exploded view of a conveyor assembly according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a recovery mechanism according to an embodiment of the present invention;
FIG. 4 shows a cross-sectional end view of a delivery assembly according to an embodiment of the present invention;
FIG. 5 shows a structural cross-sectional view of a blanking assembly of an embodiment of the present invention;
FIG. 6 shows a cross-sectional view of a construction of a blanking assembly of an embodiment of the present invention;
FIG. 7 is a schematic diagram of a negative pressure assembly according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a feeding assembly according to an embodiment of the present invention.
In the figure: 1. a delivery assembly; 11. a first vertical plate; 12. a first drive pulley; 13. a conveyor belt; 14. a second vertical plate; 15. a second transmission wheel; 16. a movable cavity; 17. a residual material reflux tank; 18. a recovery mechanism; 181. a transverse plate; 182. a first electric push rod; 183. a second electric push rod; 1831. a guide wheel; 184. a recovery box; 185. a material guiding rail; 186. a material guide chute; 19. clamping convex; 110. a first sensor; 111. a second sensor; 112. chip mounting crystal oscillator; 2. a spray coater; 3. a blanking assembly; 31. a blanking collecting box; 32. a separator plate; 33. a defective product area; 34. a qualified product area; 35. a movable plate; 36. a material receiving port; 4. a negative pressure assembly; 41. a negative pressure getter pump; 42. a negative pressure horizontal pipe; 43. sealing the plug; 44. a negative pressure vertical pipe; 45. a suction nozzle; 5. a feeding assembly; 51. installing a shell; 52. a first charging barrel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The embodiment of the invention provides a special tool for spraying a chip crystal oscillator, which comprises a conveying assembly 1, a spraying machine 2, a blanking assembly 3, a negative pressure assembly 4 and a feeding assembly 5; illustratively, as shown in FIG. 1.
Have set gradually material loading subassembly 5, flush coater 2 and unloading subassembly 3 along conveying component 1's transmission direction, material loading subassembly 5 fixed connection just is close to flush coater 2's one end on conveying component 1's upper portion, conveying component 1's upper portion fixedly connected with flush coater 2, just flush coater 2's bottom is provided with the spraying mouth, and the spraying mouth distributes at conveying component 1's top and both sides portion, 3 fixed connection of unloading subassembly are at conveying component 1's the other end, just unloading subassembly 3 is close to the work piece completion unloading in order to receive conveying component to lift off with conveying component 1's transport end, 4 fixed connection of negative pressure subassembly is in conveying component 1's one end, the end of breathing in of negative pressure subassembly 4 extends to conveying component 1 interior negative pressure and acts on the work piece on conveying component 1.
Furthermore, the outer wall of one side of the feeding assembly 5 is also fixedly connected with a PLC controller.
Specifically, material loading subassembly 5 includes a set of or multiunit feed mechanism, conveying component 1 includes a set of or multiunit conveying mechanism, negative pressure component 4 includes a set of or multiunit negative pressure mechanism, material loading subassembly 5 and conveying component 1 correspond the setting, conveying component 1 and negative pressure component 4 correspond the setting, every a set of feed mechanism correspondence sets up a set of conveying mechanism, a set of conveying mechanism includes a conveyer belt, it is fixed with carrying out the negative pressure to the work piece on this conveyer belt to set up a set of negative pressure mechanism in the conveyer belt, the bottom of flush coater 2 corresponds each conveyer belt and is provided with at least three shower nozzle, arrange respectively on the upper portion of conveyer belt, left side and right side.
For example, the loading assembly 5 is provided with three groups of loading mechanisms, correspondingly, the conveying assembly 1 is provided with three groups of conveying mechanisms, one group of the loading mechanisms is correspondingly provided with one group of the conveying mechanisms, three groups of wafers are simultaneously and respectively thrown onto three conveying belts, the air suction end of the negative pressure assembly 4 is used for sucking and fixing the bottoms of the wafers falling on the conveying assembly 1, when the conveying assembly 1 conveys the wafers to the spraying part where the spraying machine 2 is located, the spraying machine 2 is used for simultaneously spraying the top surface and the side surface of the wafer on the lower wafer, after the spraying is finished, the spraying machine is closed, when the next wafer enters a spraying area, the spraying machine is started again for spraying, the conveying assembly 1 is continuously operated to convey the sprayed wafers backwards, when the conveying assembly 3 reaches the unloading assembly 3, the wafers are separated from the conveying belts under the action of gravity due to the fact that the workpieces lose the suction effect of negative pressure, and the wafers are classified according to quality detection results, and the detection signals transmitted by the PLC controller of the unloading assembly 3 are used for classifying the entering wafers .
The conveying mechanism comprises a first vertical plate 11, a conveying belt 13 and a second vertical plate 14; illustratively, as shown in fig. 2.
A corner of one side wall of the first vertical plate 11 is rotatably connected with four groups of first driving wheels 12, a corner of one side wall of the second vertical plate 14 is rotatably connected with four groups of second driving wheels 15, the four groups of first driving wheels 12 and the four groups of second driving wheels 15 are both in transmission connection with a conveying belt 13, a movable cavity 16 is arranged in the middle of the conveying belt 13, a residual material reflux groove 17 is formed in the surface of the movable cavity 16, and the residual material reflux groove 17 is in a long round hole shape;
14 a lateral wall fixedly connected with of second riser retrieves mechanism 18, just retrieve the other end of mechanism 18 and the inner wall fixed connection of first riser 11, the top fixed interval of conveyer belt 13 sets up the protruding 19 of multiunit card, and every group card is protruding 19 has the protruding 19 of card that four cooperations were used, and four card are protruding 19 and set up at the outer border at four angles of paster crystal oscillator, just the equal fixedly connected with first sensor 110 of a lateral wall of the protruding 19 of card, every the inboard of first sensor 110 still is provided with second sensor 111, and two sets of the bottom of second sensor 111 all with the top fixed connection of conveyer belt 13.
Furthermore, the outer walls of the first vertical plate 11 and the second vertical plate 14 are fixedly connected with first servo motors, and the output ends of the first servo motors are in transmission connection with the first driving wheel 12 and the second driving wheel 15 respectively.
Specifically, the four clamping protrusions 19 are used for limiting and clamping the patch crystal oscillator falling off from the feeding assembly 5.
The wafers stored on the feeding assembly 5 are sequentially placed on the conveying belt 13, and the wafers fed to the conveying belt 13 are clamped among the four clamping protrusions 19, so that the stability of the wafers during transmission on the conveying belt 13 is improved, and the wafers are moved to the other end from one end of the conveying belt when the conveying belt 13 transmits.
The recycling mechanism 18 comprises a transverse plate 181 and a material guiding track 185; illustratively, as shown in FIG. 3.
The top end of the horizontal plate 181 is fixedly connected with at least four groups of first electric push rods 182, second electric push rods 183 and guide wheels 1831, the number of the first electric push rods 182, the second electric push rods 183 and the guide wheels 1831 is adjusted according to the length of the conveying belt 13, for example, six groups, eight groups or more are uniformly distributed on two sides of the conveying belt along the length direction of the conveying belt 13, the left side and the right side are symmetrically distributed, so as to ensure that the shape of the movable cavity 16 on the conveying belt 13 is consistent when the guide wheels adjust the shape of the movable cavity, the outer wall of one side of each first electric push rod 182 is fixedly connected with the second electric push rod 183, the output end of each second electric push rod 183 is rotatably connected with the guide wheel 1831, the guide wheels 1831 can be adjusted up and down and left and right under the effect of the first electric push rods 182 and the second electric push rods 183, so as to change the position of the guide wheels acting on the movable cavity 16, so as to adapt to patch crystal oscillators with different thicknesses, four corners at the bottom end of the chip crystal oscillator 112 are ensured to be respectively contacted with the four second sensors 111.
The bottom end of the transverse plate 181 is fixedly connected with a recovery box 184, two ends of the guide track 185 are fixedly connected to the top end of the transverse plate 181 in a downward inclined manner, and two ends of the guide track 185 are provided with guide chutes 186 communicated with the recovery box 184.
Furthermore, both ends of the horizontal plate 181 are fixedly connected to the inner walls of the first vertical plate 11 and the second vertical plate 14, respectively.
Further, the width of the material guiding track 185 is greater than the width of the movable cavity 16, the material guiding track 185 is located at the bottom end of the excess material backflow groove 17, and the excess material backflow groove 17 is communicated with the material guiding track 185 and is used in cooperation therewith.
The conveying assembly 1 conveys the patch crystal oscillator 112; illustratively, as shown in FIG. 4.
112 level settings of paster crystal oscillator are in activity cavity 16, four equal joint in four angles of paster crystal oscillator 112 are between four protruding 19 of card, just the bottom at four angles of paster crystal oscillator 112 all is connected with first sensor 110, four angles in bottom of paster crystal oscillator 112 all are connected with second sensor 111.
Further, the guide wheels 1831 are all rolled and attached to the inner wall of the conveyor belt 13.
Specifically, the first sensor 110 detects whether four corners of the bottom end of the chip crystal oscillator 112 contact with the sensor, and determines whether the chip crystal oscillator 112 is accurately clamped between the four clamping protrusions 9 and horizontally placed during transmission, if one of the four first sensors 110 does not detect the chip crystal oscillator 112, the first sensor 110 at the position transmits a signal to the PLC controller, the first sensor 110 transmits the signal to the PLC controller, and the chip crystal oscillator 112 is determined to be a defective piece by the PLC controller, where the defective piece may be a defective piece caused by the fact that the chip crystal oscillator is not horizontally placed, or a defective piece caused by the fact that the surface of the chip crystal oscillator is not flat due to an error in product processing, and the spraying effect is affected by the fact that the non-horizontal piece is placed, so that the workpiece which is not horizontally placed needs to be screened out and then removed.
And contacting the bottom end of the chip crystal oscillator 112 through the second sensor 111 to judge whether the bottom end of the chip crystal oscillator 112 is qualified, if all the four second sensors 111 cannot detect the positions of the bottom pin ends of the chip crystal oscillator 112, transmitting a signal to the PLC by the second sensor 111, and judging by the PLC to obtain that the chip crystal oscillator 112 is an unqualified piece.
The blanking assembly 3 comprises a blanking collecting box 31; as shown, for example, in fig. 5 and 6.
The bottom end of the inner wall of the blanking collection box 31 is fixedly connected with a partition plate 32, one side of the partition plate 32 is provided with a defective product area 33, the other side of the partition plate 32 is provided with a defective product area 34, the top end of the partition plate 32 is rotatably connected with a movable plate 35, the outer wall of the blanking collection box 31 is fixedly connected with a second servo motor rotatably connected with the end part of the movable plate 35, the top end of the blanking collection box 31 is provided with a material receiving port 36, and the material receiving port 36 is arranged right above the defective product area 34.
Further, the bottom end of the blanking collecting box 31 is slidably connected with a material carrying flat plate, and the material carrying flat plate is located at the bottom end of the unqualified product area 33 and the qualified product area 34.
Specifically, the second servo motor receives the signal of the PLC controller, if the PLC controller analyzes that a qualified product is not found, the PLC controller controls the second servo motor to rotate, the movable plate 35 is driven to rotate towards one side of the material receiving port 36, the qualified product area 34 is closed, the unqualified product area 33 is opened, the chip crystal oscillator 112 falling in the material receiving port 36 slides from the movable plate 35 to the unqualified product area 33, the PLC controller drives the second servo motor after the primary product classification is completed, the movable plate 35 is reset, and if the PLC controller analyzes that a qualified product is found, the chip crystal oscillator 112 directly falls into the qualified product area 34 through the material receiving port 36.
The negative pressure assembly 4 comprises one or more groups of negative pressure mechanisms, and each group of negative pressure mechanisms comprises a negative pressure air suction pump 41 and a negative pressure transverse pipe 42; exemplarily, as shown in fig. 7.
The negative pressure air suction pump 41 is fixedly connected to the end parts of the first vertical plate 11 and the second vertical plate 14, the air suction end of the negative pressure air suction pump 41 is fixed and communicated with a negative pressure horizontal tube 42, and the negative pressure horizontal tubes 42 extend into the movable cavity 16;
the end of the horizontal negative pressure pipe 42 is of a closed structure, for example, the end is fixedly connected with a sealing plug 43, the top end of the horizontal negative pressure pipe 42 is vertically fixed and communicated with a plurality of groups of vertical negative pressure pipes 44, the top ends of the vertical negative pressure pipes 44 are provided with suction nozzles 45, the suction nozzles 45 are used in adsorption cooperation with the bottom end of the chip crystal oscillator 112, and the suction nozzles 45 are horn-shaped towards the chip crystal oscillator 112.
Specifically, the negative pressure suction pump 41 is started to generate negative pressure near the plurality of sets of suction nozzles 45, so as to adsorb and fix the bottom end of the chip crystal oscillator 112 in the movable cavity 16, thereby improving the stability of the chip crystal oscillator 112 in the movable cavity 16.
The feeding mechanism of the feeding assembly 5 comprises a mounting shell 51; exemplarily, as shown in fig. 8.
The material loading barrel 52 is installed in the inner wall embedding of the installation shell 51, the upper end of the material loading barrel 52 is provided with a material loading opening, the lower end of the material loading barrel 52 is provided with a material discharging opening, the material loading opening is provided with a material loading door, the material discharging opening is provided with a material discharging door, when the material loading is needed, the material loading door is controlled to be opened by the PLC, and when the material discharging is needed, the material discharging door is controlled to be opened by the PLC.
Further, the upper cartridge 52 is communicated with and used in cooperation with the corresponding movable cavity 16.
Specifically, according to the type of the patch crystal oscillator to be sprayed, different types of charging barrels are arranged, the different types of patch crystal oscillators 112 are sequentially stored in the corresponding charging barrels, and the stored patch crystal oscillators 112 are put into the movable cavity 16 through the charging barrels, so that the patch crystal oscillators 112 can be charged more efficiently and accurately.
Further, regarding the negative pressure assembly 4, disposed directly below the feeding mechanism is a first group of negative pressure vertical pipes 44, the first group of negative pressure vertical pipes 44 are connected to the negative pressure horizontal pipe 42 through a hose, the first group of negative pressure vertical pipes 44 are connected to a driving mechanism for angle adjustment, and under the action of the driving mechanism, the first group of negative pressure vertical pipes 44 can change the angle thereof, for example, when the feeding mechanism feeds, at least one of the four first sensors 110 does not detect a chip crystal oscillator, the PLC controller controls the driving mechanism to drive the first group of negative pressure vertical pipes 44 to adjust the angle, and with respect to the orientation of one of the first sensors 110 that does not detect a chip crystal oscillator, the PLC controller returns to positive after 1-3 seconds of operation, that is, the first group of negative pressure vertical pipes 44 returns to a position perpendicular to the negative pressure horizontal pipe 42, and if the first sensor 110 does not detect a chip crystal oscillator, then drives the first group of negative pressure vertical pipes 44 to adjust the angle, with respect to the first sensor 110 that does not detect a chip crystal oscillator, working for 1-3 seconds, wherein when the first sensor 110 which does not detect the chip crystal oscillator is different from the previous time, the first sensor 110 which does not detect the chip crystal oscillator is opposite to the previous sensor 110, the first sensor works for 1-3 seconds, and after the first group of negative pressure vertical pipes 44 work for 4-8 times opposite to the first sensor, if the first sensor 110 does not detect the chip crystal oscillator, a signal is transmitted to the PLC controller, and the PLC controller judges that the chip crystal oscillator is an unqualified piece; after multiple adjustments, disqualification caused by the fact that the surface of the chip crystal oscillator is not placed horizontally can be further eliminated, disqualification caused by the fact that the surface of the chip crystal oscillator is not flat due to errors in product processing is further determined, unqualified parts can be screened out more accurately, and misjudgment caused by placing of the unqualified parts is reduced.
The special tool for spraying the chip crystal oscillator provided by the embodiment of the invention has the following working principle:
the different types of patch crystal oscillators 112 are sequentially stored in the corresponding upper charging barrels 52, and the stored patch crystal oscillators 112 are thrown into the movable cavity 16 by the upper charging barrels 52, so that the feeding of the patch crystal oscillators 112 is more efficient and accurate;
detecting whether four corners at the bottom end of a chip crystal oscillator 112 are contacted with the first sensors 110 or not by the first sensors 110, judging whether the chip crystal oscillator 112 is horizontal or qualified during transmission, if at least one of the four first sensors 110 does not detect the chip crystal oscillator 112, transmitting a signal to a PLC controller by the first sensor 110 at the position, controlling a driving mechanism by the PLC controller to drive a first group of negative pressure vertical pipes 44 to adjust the angle, sucking air in the direction of one first sensor 110 which does not detect the chip crystal oscillator, returning to the positive state after working for 1-3 seconds, namely returning the first group of negative pressure vertical pipes 44 to the position vertical to a negative pressure horizontal pipe 42, if the first sensor 110 does not detect the chip crystal oscillator, then driving the first group of negative pressure vertical pipes 44 to adjust the angle, and working for 1-3 seconds in the direction of the first sensor 110 which does not detect the chip crystal oscillator, wherein when the first sensor 110 which does not detect the chip crystal oscillator is different from the previous time, the position of a first sensor 110 which is different from the previous time and does not detect the chip crystal oscillator is faced, the first sensor 110 works for 1-3 seconds, after the first group of negative pressure vertical pipes 44 face the first sensor for 4-8 times, if the first sensor 110 does not detect the chip crystal oscillator, a signal is transmitted to a PLC (programmable logic controller), the PLC judges that the chip crystal oscillator is an unqualified piece, the next step of judgment is not needed, and if the chip crystal oscillator is a qualified piece, the next step of judgment is carried out;
contacting the bottom end of the chip crystal oscillator 112 through the second sensor 111, judging whether the bottom end of the chip crystal oscillator 112 is qualified, if the positions of the bottom end of the chip crystal oscillator 112 cannot be detected by all the four second sensors 111, transmitting a signal to the PLC by the second sensor 111, and judging by the PLC to obtain that the chip crystal oscillator 112 is an unqualified product;
the conveying belt conveys the chip crystal oscillator 112 backwards, and when the conveying belt inputs the chip crystal oscillator 112 into a spraying area, spraying is not carried out for the workpiece which is judged to be a qualified workpiece by the PLC according to the received signal; for the workpiece which is judged to be a qualified workpiece by the PLC according to the received signal, the spraying machine 2 simultaneously carries out spraying operation on the top surface and the side surface of the wafer for the chip crystal oscillator below, the spraying machine is closed after the spraying is finished, and the spraying machine is started again for spraying when the next chip crystal oscillator enters a spraying area;
when the conveying belt conveys the chip crystal oscillator 112 backwards to the blanking area, when the PLC judges that the chip crystal oscillator is a workpiece of a qualified product, the PLC controls the second servo motor to rotate according to the received signal, the movable plate 35 is driven to rotate towards one side of the material receiving port 36, the chip crystal oscillator 112 falling from the material receiving port 36 slides from the movable plate 35 to the unqualified product area 33, after the primary product classification is completed, the PLC controls the second servo motor to rotate, the movable plate 35 resets, when the PLC judges that the chip crystal oscillator is a qualified product according to the received signal, the second servo motor does not work, and the chip crystal oscillator 112 directly falls into the qualified product area 34 from the material receiving port 36;
the surplus spraying liquid on the surface of the conveying belt 13 is recovered through the surplus material backflow groove 17 formed on the surface of the movable cavity 16, so that the spraying liquid falls into the guide rails 185, and the spraying liquid flowing into the guide rails 185 with the inclined surfaces at the two ends is stored in the recovery box 184 through the guide grooves 186.
Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides a paster crystal oscillator spraying is with special frock which characterized in that: the special tool comprises a conveying assembly (1), a spraying machine (2), a discharging assembly (3), a negative pressure assembly (4) and a feeding assembly (5); a feeding component (5), a coating machine (2) and a discharging component (3) are sequentially arranged along the transmission direction of the conveying component (1), the feeding component (5) is fixedly connected to the upper part of the conveying component (1) and is close to one end of the coating machine (2),
the conveying assembly (1) comprises one or more groups of conveying mechanisms, and each conveying mechanism comprises a first vertical plate (11), a second vertical plate (14) and a conveying belt (13);
the conveying belt (13) is rotatably connected between adjacent inner walls of a first vertical plate (11) and a second vertical plate (14), and a movable cavity (16) is arranged in the middle of the conveying belt (13);
a recovery mechanism (18) is fixedly connected to one side wall of the second vertical plate (14), a plurality of groups of clamping protrusions (19) are arranged at the top end of the conveying belt (13) at intervals, each group of clamping protrusions (19) is provided with four clamping protrusions (19) matched with each other for use, the inner side wall of each clamping protrusion (19) is fixedly connected with a first sensor (110), a second sensor (111) is further arranged on the inner side of each first sensor (110), and a patch crystal oscillator (112) is placed in each group of clamping protrusions (19);
the negative pressure assembly (4) is fixedly connected to one end of the conveying assembly (1), and the air suction end of the negative pressure assembly (4) extends into the conveying assembly (1) and acts on a chip crystal oscillator (112) in the movable cavity (16);
the feeding assembly (5) is fixedly connected to the upper part of the conveying assembly (1) and one end, close to the spraying machine (2), of the conveying assembly, and the blanking end of the bottom of the feeding assembly (5) corresponds to the movable cavity (16);
the outer wall of one side of material loading subassembly (5) still fixedly connected with PLC controller, the PLC controller receives the signal of sensor and controls the work of special frock.
2. The special tool for spraying the patch crystal oscillator according to claim 1, wherein the tool comprises:
the negative pressure component (4) is fixedly connected to the tops of the first vertical plate (11) and the second vertical plate (14) and is far away from one end of the blanking component (3), the air suction ends of the negative pressure component (4) extend into the movable cavity (16) and are communicated with each other, and negative pressure of the negative pressure component (4) acts on the patch crystal oscillator (112) in the movable cavity (16);
the upper portion fixedly connected with flush coater (2) of conveying subassembly (1), just the bottom of flush coater (2) is provided with the spraying mouth, and the spraying mouth distributes in the top and both sides portion of conveying subassembly (1).
3. The special tool for spraying the patch crystal oscillator according to claim 1, wherein the tool comprises: the corner of a first riser (11) a lateral wall rotates and is connected with four sets of first drive wheels (12), the corner of a second riser (14) a lateral wall rotates and is connected with four sets of second drive wheels (15), conveyer belt (13) transmission is connected in four sets first drive wheel (12) and four sets on second drive wheel (15).
4. The special tool for spraying the patch crystal oscillator according to claim 1, wherein the tool comprises: the recovery mechanism (18) comprises a transverse plate (181); the top end of the transverse plate (181) is fixedly connected with at least four groups of first electric push rods (182), second electric push rods (183) and guide wheels (1831), the outer wall of one side of each first electric push rod (182) is fixedly connected with a second electric push rod (183), the output end of each second electric push rod (183) is rotatably connected with a guide wheel (1831), and the guide wheels (1831) are all in rolling fit with the inner wall of the conveying belt (13);
the recovery mechanism (18) further comprises a material guide track (185);
the bottom fixedly connected with of diaphragm (181) retrieves box (184), the both ends of guide track (185) are downward sloping form fixed connection on the top of diaphragm (181), just guide chute (186) that communicates each other with retrieving box (184) is seted up at the both ends of guide track (185), clout return chute (17) has been seted up on the surface of activity cavity (16), just clout return chute (17) communicates each other with guide track (185).
5. The special tool for spraying the patch crystal oscillator according to claim 2, characterized in that: the blanking assembly (3) comprises a blanking collecting box (31);
inner wall bottom fixedly connected with division board (32) of box (31) is collected to the unloading, one side of division board (32) is provided with the regional (33) of defective products, the opposite side of division board (32) is provided with the regional (34) of defective products, the top of division board (32) is rotated and is connected with fly leaf (35), just the outer wall fixedly connected with of box (31) and the second servo motor of the end connection of fly leaf (35) are collected to the unloading, receiving opening (36) have been seted up on the top of box (31) is collected to the unloading, just receiving opening (36) set up the top in the regional (34) of defective products perpendicularly.
6. The special tool for spraying the patch crystal oscillator according to claim 5, wherein the special tool comprises: the bottom end of the blanking collection box (31) is connected with a material carrying flat plate in a sliding mode, and the material carrying flat plate is located at the bottom ends of the unqualified product area (33) and the qualified product area (34).
7. The special tool for spraying the patch crystal oscillator according to claim 2, wherein the special tool comprises: negative pressure subassembly (4) are including a set of or multiunit negative pressure mechanism, and conveying subassembly (1) and negative pressure subassembly (4) correspond the setting, and a set of conveying mechanism includes a conveyer belt, sets up a set of negative pressure mechanism in the conveyer belt, and every negative pressure mechanism of group includes that negative pressure aspirator pump (41) and negative pressure violently manage (42), negative pressure violently manages (42) and all extends to activity cavity (16) in.
8. The special tool for spraying the patch crystal oscillator according to claim 7, wherein the special tool comprises: the tip that the horizontal pipe (42) of negative pressure is enclosed construction, the top of the horizontal pipe (42) of negative pressure is vertical fixed and the intercommunication has a plurality of groups negative pressure standpipe (44), a plurality of groups the top of negative pressure standpipe (44) all is provided with suction nozzle (45), just suction nozzle (45) and the bottom of paster crystal oscillator (112) adsorb the cooperation and use, and suction nozzle (45) are towards the loudspeaker form of paster crystal oscillator (112).
9. The special tool for spraying the patch crystal oscillator according to claim 2, characterized in that: the feeding mechanism of the feeding assembly (5) comprises a mounting shell (51);
an upper charging barrel (52) is embedded in the inner wall of the mounting shell (51), the upper end of the upper charging barrel (52) is provided with a feeding port, the lower end of the upper charging barrel is provided with a discharging port, the feeding port is provided with a feeding door, and the discharging port is provided with a discharging door; the upper charging barrel (52) is communicated with the corresponding movable cavity (16) and is matched for use.
10. The working method of the special tool for spraying the patch crystal oscillator according to any one of claims 1 to 9, which is characterized in that:
sequentially storing different types of chip crystal oscillators (112) in corresponding feeding assemblies (5), and putting the stored chip crystal oscillators (112) into the movable cavity (16) by the feeding assemblies (5);
whether four corners of the bottom end of the chip crystal oscillator (112) are in contact with the sensors or not is detected through the first sensor (110), whether the chip crystal oscillator (112) is horizontal or qualified in transmission is judged, if the chip crystal oscillator is not detected for many times by the first sensor (110), a signal is transmitted to the PLC, the PLC judges that the chip crystal oscillator is an unqualified piece, and the next judgment is not needed; if the first sensors (110) detect the chip crystal oscillator, the next step of judgment is carried out;
whether the bottom end of the chip crystal oscillator (112) is qualified or not is judged through the contact of the second sensor (111) and the bottom end of the chip crystal oscillator (112), if the positions of the bottom ends of the chip crystal oscillator (112) cannot be detected by all the four second sensors (111), the second sensor (111) transmits signals to a PLC (programmable logic controller), and the chip crystal oscillator (112) is judged to be a unqualified part by the PLC; if all the four second sensors (111) detect the position of the bottom end of the chip crystal oscillator (112), the second sensors (111) transmit signals to the PLC, and the chip crystal oscillator (112) is judged to be a qualified piece by the PLC;
the conveying belt conveys the chip crystal oscillator (112) backwards, and when the conveying belt inputs the chip crystal oscillator (112) into a spraying area, spraying is not carried out for the workpiece which is judged to be a qualified workpiece by the PLC according to the received signal; for the workpiece which is judged to be a qualified workpiece by the PLC according to the received signal, the spraying machine (2) simultaneously performs spraying operation on the top surface and the side surface of the chip crystal oscillator on the chip crystal oscillator below, the spraying machine is closed after spraying is finished, and the spraying machine is started again for spraying when the next chip crystal oscillator enters a spraying area;
when the conveying belt conveys the chip crystal oscillator (112) backwards to the blanking area, and the PLC controller judges that the chip crystal oscillator is a workpiece which is not qualified according to the received signal, the PLC controller controls the second servo motor to rotate, drives the movable plate (35) to rotate towards one side of the material receiving port (36), so that the chip crystal oscillator (112) falling in the material receiving port (36) slides into the unqualified product area (33) from the movable plate (35), and controls the second servo motor to rotate after primary product classification is completed, so that the movable plate (35) is reset; if the PLC controller judges that the qualified product is a qualified product according to the received signal, the second servo motor does not work, and the chip crystal oscillator (112) directly falls into the qualified product area (34) through the material receiving port (36).
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| CN202210377064.8A CN114769026B (en) | 2022-04-11 | 2022-04-11 | Special tool for chip crystal oscillator spraying |
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| CN202210377064.8A CN114769026B (en) | 2022-04-11 | 2022-04-11 | Special tool for chip crystal oscillator spraying |
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| CN114769026B CN114769026B (en) | 2023-05-23 |
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| CN113210157A (en) * | 2021-05-18 | 2021-08-06 | 赵龙科 | Intelligent uniform spraying device for flame retardant production and flame retardant production method |
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| US4241102A (en) * | 1979-06-04 | 1980-12-23 | Occidental Research Corporation | Apparatus and method for the selective wetting of particles |
| JP2005262450A (en) * | 2004-03-16 | 2005-09-29 | Toshiba Corp | Inkjet applicator |
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| CN114769026B (en) | 2023-05-23 |
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