CN114760815A - Embedment base plate, current conversion module and current conversion device - Google Patents
Embedment base plate, current conversion module and current conversion device Download PDFInfo
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- CN114760815A CN114760815A CN202210364754.XA CN202210364754A CN114760815A CN 114760815 A CN114760815 A CN 114760815A CN 202210364754 A CN202210364754 A CN 202210364754A CN 114760815 A CN114760815 A CN 114760815A
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- circuit board
- board assembly
- substrate
- encapsulation
- potting
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 230000017525 heat dissipation Effects 0.000 claims abstract description 97
- 238000005538 encapsulation Methods 0.000 claims abstract description 88
- 238000004382 potting Methods 0.000 claims abstract description 83
- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims description 21
- 239000003990 capacitor Substances 0.000 claims description 18
- 239000002826 coolant Substances 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 5
- 239000003351 stiffener Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 24
- 239000000565 sealant Substances 0.000 abstract description 8
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 17
- 230000003014 reinforcing effect Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 238000011900 installation process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a potting substrate, a current conversion module and a current conversion device, wherein the potting substrate comprises: a first fixing portion for fixing the circuit board assembly; a second fixing part for fixing the case; the encapsulating bin is used for accommodating at least one heating device of the circuit board assembly and encapsulating adhesive with insulativity and heat conductivity; wherein, the encapsulation base plate is the heat conduction base plate. The encapsulation substrate enables the chassis not to be matched with the circuit board assembly, and the encapsulation substrate is matched with the circuit board assembly to realize modularization of the circuit board assembly, so that the circuit board assembly can be suitable for different chassis, the adaptability of the circuit board assembly to the chassis is effectively improved, and the mobility of the circuit board assembly is improved; meanwhile, the encapsulation substrate can dissipate heat of a heating device of the circuit board assembly through the encapsulation adhesive and the encapsulation substrate, so that the heat dissipation effect is effectively improved; the pouring sealant has a buffering effect and improves the vibration resistance.
Description
Technical Field
The invention relates to the technical field of power supply products, in particular to an encapsulating substrate, a current conversion module and a current conversion device.
Background
In power supply products of new energy automobiles, a vehicle-mounted direct current conversion device is one of important devices. The vehicle-mounted direct current conversion device mainly comprises a case and a circuit board assembly arranged on the case.
In the working process of the vehicle-mounted direct current conversion device, the circuit board assembly can generate a large amount of heat, the heat is required to be dissipated, and a heat dissipation structure is usually arranged on a case. Therefore, the circuit board assembly and the chassis need to be adapted to each other, that is, the circuit board assembly needs to be installed on a specific chassis, resulting in poor adaptability of the circuit board assembly to the chassis and poor mobility of the circuit board assembly.
In summary, how to improve the adaptability of the circuit board assembly to the chassis to improve the mobility of the circuit board assembly is an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a potting substrate, which improves the adaptability of a circuit board assembly to a chassis, so as to improve the mobility of the circuit board assembly. Another object of the present invention is to provide a current transformation module including the encapsulation substrate, and a current transformation apparatus including the current transformation module.
In order to achieve the purpose, the invention provides the following technical scheme:
An encapsulated substrate comprising:
the first fixing part is used for fixing the circuit board assembly;
the second fixing part is used for fixing the case;
the encapsulation bin is used for accommodating at least one heating device of the circuit board assembly and encapsulation glue with insulativity and thermal conductivity;
wherein, the encapsulation base plate is a heat conduction base plate.
Optionally, the potting substrate further comprises:
the heat dissipation boss is used for supporting at least one heating device of the circuit board assembly, and is in heat conduction connection and insulation connection with the heating device.
Optionally, the heat dissipation boss is sequentially provided with at least one insulating layer and at least one heat conduction layer, and the heat conduction layer is used for being in heat conduction connection with the heating device; wherein the sum of the thicknesses of all the insulating layers and all the heat conducting layers is not more than 1 mm.
Optionally, the heat dissipation boss has at least one heat dissipation cavity for accommodating a cooling medium, the heat dissipation cavity is configured to communicate with the cooling channel of the chassis, and the potting substrate further includes a sealing surface configured to be sealingly connected to the chassis.
Optionally, the inner side wall of the encapsulation cabin comprises at least one side wall of at least one heat dissipation boss.
Optionally, the encapsulation substrate further comprises a stiffener, and the stiffener is located inside the encapsulation bin and/or outside the encapsulation bin.
Optionally, the first fixing portion includes: the first fixing hole and a positioning structure for positioning the circuit board assembly;
and/or the second fixing part comprises a second fixing hole.
Optionally, the potting substrate is a unitary structure.
According to the encapsulating substrate provided by the invention, the encapsulating bin is used for containing at least one heating device and the encapsulating adhesive of the circuit board assembly, and the encapsulating adhesive has thermal conductivity and is a heat-conducting substrate, so that the heating device is radiated through the encapsulating adhesive and the encapsulating substrate, the radiating requirement of the circuit board assembly can be met, and a radiating structure matched with the circuit board assembly does not need to be arranged in the case; meanwhile, the circuit board assembly is fixed through the first fixing part, and the case is fixed through the second fixing part, so that the circuit board assembly can be indirectly fixed on the case through the encapsulation substrate, and the case and the circuit board assembly are not needed to be matched. Therefore, the encapsulation substrate enables the case not to be matched with the circuit board assembly, and the encapsulation substrate is matched with the circuit board assembly to realize the modularization of the circuit board assembly, so that the circuit board assembly can be suitable for different cases, the adaptability of the circuit board assembly to the case is effectively improved, and the mobility of the circuit board assembly is improved.
Meanwhile, the encapsulation substrate can dissipate heat of a heating device of the circuit board assembly through the encapsulation adhesive and the encapsulation substrate, so that the heat dissipation effect is effectively improved; the pouring sealant has a buffering effect and improves the vibration resistance.
Based on the encapsulation substrate provided above, the present invention also provides a current conversion module, which includes: a circuit board assembly having a current conversion function, and the potting substrate described in any one of the above;
wherein, circuit board assembly is used for being fixed in the first fixed part of embedment base plate.
Optionally, the circuit board assembly comprises: the circuit board is arranged on the heating device of the circuit board; the at least one heating device is a magnetic part, the at least one heating device is a power tube, and the power tube is paved on the circuit board.
Optionally, the magnets are for distribution within the potting bin.
Optionally, at least one of the heat generating devices is one or a combination of at least two of an inductor, a transformer, a capacitor and a power tube;
the inductor, the transformer and the capacitor are all used for being distributed in the encapsulation bin, and the power tubes are used for being distributed outside the encapsulation bin.
Optionally, if the encapsulation substrate includes a heat dissipation boss, the heat dissipation boss supports the power tube, and the heat dissipation boss is thermally conductive and connected to the power tube in an insulating manner.
Optionally, the circuit board assembly is for being flipped over on the potting substrate.
Optionally, the circuit board of the circuit board assembly is provided with at least one glue injection hole;
and/or, the circuit board assembly comprises: the circuit board comprises a circuit board, an input laminated busbar connected with an input end of the circuit board and an output busbar connected with an output end of the circuit board, wherein the output busbar is provided with a stress release hole;
and/or, the circuit board assembly is used for being detachably fixed on the first fixing part.
Optionally, the current conversion module is a vehicle-mounted direct current conversion module.
Based on the current conversion module provided above, the present invention also provides a current conversion apparatus, including: the current conversion module comprises a chassis and any one of the current conversion modules; and the case is fixed on the second fixing part of the encapsulation substrate.
Optionally, if the chassis is provided with a cooling channel, the chassis is further provided with an inlet and an outlet both communicated with the cooling channel.
Optionally, a circuit board of the circuit board assembly is provided with an avoiding structure for fixedly connecting the encapsulation substrate and the chassis;
and/or the case is detachably fixed to the second fixing part.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an encapsulation substrate according to an embodiment of the present invention;
FIG. 2 is a top view of the structure shown in FIG. 1;
fig. 3 is a schematic structural diagram of another direction of the encapsulation substrate according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a current conversion module according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of the circuit board assembly of FIG. 4;
FIG. 6 is a schematic diagram of the power plate assembly of FIG. 5;
FIG. 7 is a schematic view of the structure of FIG. 4 with the power plate removed;
fig. 8 is a schematic structural diagram of a current converting apparatus according to an embodiment of the present invention;
Fig. 9 is an assembly view of a current converting apparatus according to an embodiment of the present invention;
FIG. 10 is a schematic view of the structure of FIG. 8 with the power plate removed;
fig. 11 is a schematic structural diagram of a chassis in a current conversion device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
As shown in fig. 1, a potting substrate according to an embodiment of the present invention is a heat conducting substrate, and specifically, the potting substrate includes: a first fixing part 2.6, a second fixing part 2.11, and a potting chamber 2.10.
The first fixing part 2.6 is used for fixing the circuit board assembly 1; the second fixing part 2.11 is used for fixing the case 3; the potting bin 2.10 is used for accommodating at least one heating device of the circuit board assembly 1 and the potting adhesive with insulation property and heat conductivity.
It can be understood that the potting adhesive is used for potting the potting cabin 2.10, so as to fix the heat generating device in the potting cabin 2.10. Since the potting chamber 2.10 is used for accommodating at least one heat generating device of the circuit board assembly 1, the circuit board assembly 1 is reversely buckled on the potting substrate.
The type of the pouring sealant is selected according to actual needs, and only the insulativity and the thermal conductivity are ensured. The material of the encapsulation substrate is also selected according to actual needs, for example, the encapsulation substrate is an aluminum alloy plate, which is not limited in this embodiment.
The number and the type of the heating devices that can be accommodated in the potting bin 2.10 are selected according to actual needs, and the number and the type are not limited in the implementation. Correspondingly, the size and shape of the potting cabin 2.10 are designed according to the heat dissipation requirement, which is not limited in this embodiment.
In the potting substrate provided by the embodiment, the potting bin 2.10 is used for accommodating at least one heating device and the potting adhesive of the circuit board assembly 1, and the potting adhesive has thermal conductivity and the potting substrate is a heat-conducting substrate, so that the heating device is radiated through the potting adhesive and the potting substrate, the heat radiation requirement of the circuit board assembly 1 can be met, and a heat radiation structure matched with the circuit board assembly 1 does not need to be arranged in the case 3; simultaneously, through first fixed part 2.6 fixed circuit board subassembly 1, through the fixed quick-witted case 3 of second fixed part 2.11, then can realize that circuit board subassembly 1 passes through above-mentioned embedment base plate indirect fixation on quick-witted case 3, need not quick-witted case 3 and the adaptation of circuit board subassembly 1. Therefore, the encapsulation substrate enables the case 3 to be not matched with the circuit board assembly 1, and the encapsulation substrate is matched with the circuit board assembly 1 to realize modularization of the circuit board assembly 1, so that the circuit board assembly 1 can be suitable for different cases 3, the adaptability of the circuit board assembly 1 to the case 3 is effectively improved, and the mobility of the circuit board assembly 1 is improved.
Meanwhile, the encapsulation substrate provided by the embodiment can dissipate heat of the heating device of the circuit board assembly 1 through the encapsulation adhesive and the encapsulation substrate, so that the heat dissipation effect is effectively improved; the pouring sealant has a buffering effect and improves the vibration resistance.
In the circuit board assembly 1, the height of the heating devices is different, and in order to facilitate heat dissipation of the heating devices with lower height, the encapsulation substrate further comprises a heat dissipation boss, and the heat dissipation boss is used for supporting at least one heating device of the circuit board assembly 1 and is in heat conduction connection and insulation connection with the heating device. It is understood that the lower height heat generating device refers to a lower height heat generating device on the circuit board.
The heat dissipation boss is in heat conduction connection with the heating device, so that the heating device can be effectively cooled, and the heat dissipation effect is improved. Therefore, the heat generating devices with larger heat generation amount and the heat generating devices with lower height can be selected to be distributed on the heat dissipation bosses.
The number, height and shape of the radiating bosses are selected according to actual requirements. As shown in fig. 1 and 2, the number of the heat dissipation bosses is four, and the heat dissipation bosses are respectively a heat dissipation boss a2.2, a heat dissipation boss b2.3, a heat dissipation boss c2.4, and a heat dissipation boss d 2.5.
One or two heating devices for supporting each heat dissipation boss can be arranged; the same heating device can be distributed on one heat dissipation boss only, and can also be distributed on different heat dissipation bosses, and the heating device is selected according to actual needs, which is not limited in the embodiment.
In order to facilitate the insulating connection and the heat conduction connection of the heat dissipation boss and the heating device, the heat dissipation boss is sequentially provided with at least one insulating layer and at least one heat conduction layer, and the heat conduction layer is used for being in heat conduction connection with the heating device. It will be appreciated that the insulating layer is located between the heat dissipating bosses and the heat conducting layer.
The type of the insulating layer is selected according to actual needs, for example, the insulating layer is an insulating film, which is not limited in this embodiment. The type of the heat conducting layer is also selected according to actual needs, which is not limited in this embodiment.
The thickness and the number of layers of the insulating layer and the heat conducting layer need to be reasonably set, and the insulating layer is not too large easily, otherwise, the heat dissipation effect is influenced. Optionally, the sum of the thickness of all insulating layers and the thickness of all thermally conductive layers is no greater than 1 mm. In order to facilitate control of the sum of the thickness of all insulating layers and the thickness of all heat conducting layers, a difference in height between the fastening surface of the first fastening portion 2.6 and the heat dissipating projection may be defined. It will be understood that the fixing surface of the first fixing part 2.6 is in contact with the circuit board of the circuit board assembly 1.
In the above embodiment, in order to further improve the heat dissipation effect, the heat dissipation boss has at least one heat dissipation cavity for accommodating a cooling medium, the heat dissipation cavity is used for communicating with the cooling channel 3.3 of the chassis 3, and the encapsulation substrate further includes a sealing surface 2.9 for sealing connection with the chassis 3.
It should be noted that the cooling channel 3.3 is used for flowing a cooling medium, and the cooling medium may be a liquid medium such as water or a gas medium such as air, which is not limited herein. If the case 3 has the cooling channel 3.3, the sealing surface 2.9 of the encapsulation substrate is matched with the sealing groove surface of the case 3 to play a sealing role. The area where the sealing surface 2.9 is matched with the case 3 is a plane with higher planeness, and other protruding structures are not allowed on the plane, so that sealing is ensured. Of course, the sealing surface 2.9 may be another structure, which is not limited in this embodiment. If the housing 3 has no cooling channels 3.3, the potting substrate does not need to be sealed to the housing 3.
The heat dissipation boss may have one heat dissipation cavity or more than two heat dissipation cavities, which is selected according to actual needs and is not limited in this embodiment.
Specifically, as shown in fig. 1 and fig. 2, the four heat dissipation bosses are a heat dissipation boss a2.2, a heat dissipation boss b2.3, a heat dissipation boss c2.4, and a heat dissipation boss d2.5, respectively; as shown in fig. 1 to 3, the heat dissipating boss a2.2 has a heat dissipating cavity 1a2.2.1 and a heat dissipating cavity 2a2.2.2, the heat dissipating boss b2.3 has a heat dissipating cavity b2.3.1, the heat dissipating boss c2.4 has a heat dissipating cavity c2.4.1, and the heat dissipating boss d2.5 has a heat dissipating cavity d 2.5.1. The sizes of the heat dissipation cavity 1a2.2.1 and the heat dissipation cavity 2a2.2.2 may be the same or different, for example, the heat dissipation cavity 1a2.2.1 is larger than the heat dissipation cavity 2a2.2.2, and the size is selected according to actual needs, which is not limited in this embodiment.
It is understood that the heat dissipation cavity 1a2.2.1, the heat dissipation cavity 2a2.2.2, the heat dissipation cavity b2.3.1, the heat dissipation cavity c2.4.1 and the heat dissipation cavity d2.5.1 are collectively referred to as a heat dissipation cavity.
In the structure, the heat dissipation of the cooling medium to the heat dissipation boss and the heating device is enhanced by arranging the heat dissipation cavity, and the heat dissipation effect is improved.
For convenience of production and manufacture, the encapsulation substrate may be selected to protrude to one side to form a heat dissipation boss with a heat dissipation cavity.
In practical application, the heat dissipation effect can be improved in other modes. In particular, the potting compartment inner side wall 2.1 of the above-mentioned potting compartment 2.10 comprises at least one side wall of at least one heat dissipation boss. It will be appreciated that a side wall may be an entire side wall or may be a portion of a side wall.
As shown in fig. 1 and 2, the potting bin inner side wall 2.1 includes: one side wall of the heat dissipation boss a2.2, a part of one side wall of the heat dissipation boss b2.3, two side walls of the heat dissipation boss c2.4, and two side walls of the heat dissipation boss d2.5.
In the structure, the heat transfer efficiency of the potting adhesive and the heat dissipation boss is improved, and the heat dissipation effect is improved.
In practical applications, the sidewall 2.1 of the encapsulation cabin may not include the sidewall of the heat dissipation boss, and is not limited to the above embodiment.
In order to improve the supporting strength of the encapsulation substrate, the encapsulation substrate further comprises reinforcing ribs, and specifically, the reinforcing ribs are located inside the encapsulation bin 2.10 and/or outside the encapsulation bin 2.10.
As shown in fig. 1 and 2, the reinforcing ribs include a first reinforcing rib 2.12, the first reinforcing rib 2.12 is located in the potting bin 2.10, and the distance between the first reinforcing rib 2.12 and the heat generating device satisfies a safety distance. It can be understood that in order to satisfy the safety distance, the height of the heat generating device opposite to the first reinforcing rib 2.12 is small, thereby satisfying the safety distance. The height of the heating device is the height of the heating device on the circuit board.
As shown in fig. 1 and 2, the reinforcing ribs include a second reinforcing rib 2.13, and the second reinforcing rib 2.13 is located outside the filling and sealing cabin 2.10. It will be appreciated that the first and second reinforcing ribs 2.12, 2.13 are collectively referred to as reinforcing ribs.
The specific positions, sizes and shapes of the first reinforcing ribs 2.12 and the second reinforcing ribs 2.13 are selected according to actual needs, and the embodiment does not limit the positions, sizes and shapes.
Above-mentioned embedment base plate through setting up the strengthening rib, has effectively improved bulk strength and rigidity. If the case 3 has the cooling channel 3.3, the reinforcing ribs also improve the compressive rigidity of the potting substrate.
In the above-mentioned potting base plate, in order to facilitate the installation of circuit board assembly 1, first fixed part 2.6 includes: a first fixing hole 2.6.1 and a positioning structure for positioning the circuit board assembly 1.
It should be noted that, in order to ensure the fixing, the circuit board assembly 1 is provided with a first mounting hole 1.1.18 corresponding to the first fixing hole 2.6.1. The size, number and distribution of the first fixing holes 2.6.1 are selected according to actual needs, and this embodiment does not limit this.
In order to facilitate the arrangement of the first fixing hole 2.6.1, the first fixing portion 2.6 is a fixing column.
The specific structure of the positioning structure is selected according to actual needs, for example, the positioning structure is a positioning pin, and one or more than two positioning pins may be used. As shown in fig. 1 and 2, there are two positioning pins, positioning pin a2.7 and positioning pin b 2.8. Above-mentioned locating pin a2.7 is located the one end of embedment base plate, and locating pin b2.8 is located the other end of embedment base plate to improve the location effect. It is to be understood that, as shown in fig. 6, the above-described circuit board assembly 1 has: positioning holes a1.1.17 for positioning pin a2.7 and positioning holes b1.1.15 for positioning pin b 2.8.
In practical applications, the positioning pins may be distributed in other manners, and the positioning pins may be combined into other manners, which is not limited in this embodiment.
In the potting substrate, the second fixing portion 2.11 includes a second fixing hole 2.11.1 in order to facilitate mounting of the housing 3.
It is understood that, in order to ensure the fixing, as shown in fig. 11, the case 3 is provided with a second mounting hole 3.5 corresponding to the second fixing hole 2.11.1. The size, number and distribution of the second fixing holes 2.11.1 are selected according to actual needs, and this embodiment does not limit this.
In order to facilitate the arrangement of the second fixing hole 2.11.1, the second fixing portion 2.11 is a fixing plate.
In the above-mentioned encapsulation base plate, in order to facilitate the arrangement of circuit board assembly 1 and chassis 3, the fixing surface that can select first fixed part 2.6 to be used for fixed circuit board assembly 1 is located the one end of encapsulation base plate and is close to the top in encapsulation storehouse 2.10, and second fixed part 2.11 is used for fixed chassis 3's fixing surface is located the other end of encapsulation base plate and is close to the bottom in encapsulation storehouse 2.10.
The encapsulation substrate can be of an integrated structure or a split structure, and the encapsulation substrate can be of an integrated structure for convenience of manufacturing and simplification of installation.
The encapsulation substrate provided by the embodiment has four functions of supporting, fixing, accommodating, heat conducting and sealing. For the support fixation, firstly, the positioning structure provides guidance for the installation process of the circuit board assembly 1; secondly, the first fixing part 2.6 can provide supporting and fixing functions for the circuit board assembly 1; finally, the heat dissipation boss can provide a supporting function for the insulating layer, the heat conduction layer and the circuit board assembly 1. For accommodation, firstly, the encapsulation bin 2.10 surrounds at least one heating device on the circuit board assembly 1 by a plane area as small as possible, and then pouring the pouring sealant into the surrounded area to play a role in accommodating the pouring sealant; secondly, the encapsulation bin 2.10 plays a role in accommodating a heating device; and finally, the heat dissipation boss is provided with a heat dissipation cavity to contain a cooling medium, so that the heat dissipation capacity of the heat dissipation boss is enhanced. For heat conduction, first, the potting substrate 2 has a heat conduction function; secondly, the pouring sealant of the pouring bin 2.10 has the functions of insulation and heat conduction; finally, the heat dissipation boss and the heat conduction layer thereon also have a heat conduction effect. For sealing, the case 3 has a cooling channel 3.3, and the potting substrate 2 is hermetically connected to the case 3 to ensure that the cooling medium in the case 3 cools the potting substrate 2.
The functions of the circuit board assembly 1 to which the encapsulation substrate is applied are selected according to actual needs, for example, the circuit board assembly 1 has a current conversion function or other functions, and this embodiment does not limit this.
Based on the encapsulation base plate that above-mentioned embodiment provided, this embodiment still provides a current conversion module, as shown in fig. 4, this current conversion module includes: a circuit board assembly 1 having a current converting function and the potting substrate 2 provided in the above embodiments. The circuit board assembly 1 is used for being fixed to the first fixing portion 2.6 of the potting substrate 2.
Since the encapsulation substrate provided by the above embodiment has the above technical effects, and the current conversion module includes the encapsulation substrate, the current conversion module also has corresponding technical effects, which are not described herein again.
The type of the above-described circuit board assembly 1 is selected according to actual needs. Specifically, the above circuit board assembly 1 includes: the circuit board is arranged on the heating device of the circuit board. In order to facilitate the arrangement of the heating device, the heating device can be selectively welded on the circuit board. Of course, the heat generating device may be mounted on the circuit board in other manners, which is not limited in this embodiment.
The specific type and number of the heat generating devices are designed according to the function of the circuit board assembly 1, and this embodiment is not limited thereto.
Optionally, among the heat generating devices on the circuit board, at least one heat generating device is a magnetic device, at least one heat generating device is a power tube, and the power tube is flatly laid on the circuit board. It can be understood that the power transistor is a MOS transistor. The Chinese of the MOS Transistor is referred to as a Metal-Oxide-Semiconductor Field-Effect Transistor for short, and the English of the MOS Transistor is a Metal-Oxide-Semiconductor Transistor.
Compared with the existing tiled structure, the structure uniformly installs the power tube and the magnetic piece to the circuit board, realizes small volume and modularization, and is convenient to be made into a platform product for other projects to migrate and use.
In practical applications, the power tube may be mounted on the circuit board by other methods, and is not limited to the tiling method.
To facilitate heat dissipation of the magnetic members, they may be selected for distribution within the potting chamber 2.10. The magnetic member may be an inductor, a transformer 1.1.6, etc., which is not limited in this embodiment.
The current conversion module generates a large amount of heat during the conversion process, and the heat is mainly generated by the magnetic elements such as the inductor and the transformer 1.1.6, the capacitor and the power tube. In order to improve the heat dissipation effect, the at least one heat generating device may be selected to be one of an inductor, a transformer 1.1.6, a capacitor and a power tube, or a combination of at least two of the inductors, the transformer and the power tube.
It should be understood that one or more of the inductor, the transformer 1.1.6, the capacitor and the power tube may be one or more, and are selected according to actual needs, which is not limited in this embodiment.
In order to reduce the use of potting compound to reduce the potting cost, only a few heat generating devices may be selected for distribution within the potting bin 2.10. Specifically, the inductor, the transformer 1.1.6 and the capacitor are all used to be distributed in the encapsulation bin 2.10, and the power tubes are used to be distributed outside the encapsulation bin 2.10.
Further, if the encapsulation substrate 2 includes a heat dissipation boss, the heat dissipation boss is selected to support the power tube, and the heat dissipation boss is thermally connected and insulated with the power tube.
In the structure, the inductor, the capacitor and the transformer 1.1.6 can be radiated by the potting adhesive and the potting substrate 2, and the power tube can be radiated by the potting substrate and the radiating boss thereof, so that the radiating effect is improved.
As shown in fig. 7 and 10, there are three inductors, namely, inductor a1.1.1, inductor b1.1.3, and inductor c 1.1.5; one transformer 1.1.6; the number of the capacitors is three, namely a capacitor a1.1.2, a capacitor b1.1.4 and a capacitor c 1.1.7; the number of the power tubes is four, and the power tubes are respectively power tube a1.1.8, power tube b1.1.9, power tube c1.1.10 and power tube d1.1.11, the inductor a1.1.1, inductor b1.1.3, inductor c1.1.5, transformer 1.1.6, capacitor a1.1.2, capacitor b1.1.4 and capacitor c1.1.7 are all located in the encapsulation cabin 2.10, the power tube a1.1.8 is located on the heat dissipation boss a2.2, the power tube b1.1.9 is located on the heat dissipation boss b2.3, the power tube c1.1.10 is located on the heat dissipation boss c2.4, and the power tube d1.1.11 is located on the heat dissipation boss d 2.5.
The connection relationship among the inductor, the capacitor, the transformer 1.1.6 and the power tube is well known to those skilled in the art, and will not be described herein.
In practical applications, the inductor, the transformer 1.1.6, the capacitor and the power tube may be arranged in other ways, and are not limited to the above limitations.
In the current conversion module, the circuit board assembly 1 may be mounted on the potting substrate 2 in a reverse manner or may be mounted on the potting substrate 2 in a normal manner. If the whole circuit board assembly 1 is encapsulated, the circuit board assembly 1 can be selected to be reversely buckled or positively installed on the encapsulating substrate 2; if only a part of the circuit board assembly 1 is encapsulated, the circuit board assembly 1 can be selected only for being reversed on the encapsulation substrate 2. To increase flexibility, the circuit board assembly 1 may be selected for being flipped over on the potting substrate 2, so that the circuit board assembly 1 may be selected for full potting or partial potting as desired.
It is understood that the circuit board assembly 1 is used for being flipped over on the potting substrate 2, which means that the circuit board front side of the circuit board assembly 1 faces the potting bin 2.10; the circuit board assembly 1 is used for being mounted on the encapsulation base plate 2, and means that the back surface of the circuit board assembly 1 faces the encapsulation bin 2.10.
In the current conversion module, in the installation process, the potting adhesive needs to be injected into the potting cabin 2.10. In order to facilitate potting, the circuit board of the circuit board assembly 1 is provided with at least one glue injection hole.
In order to improve embedment efficiency and embedment effect, optional notes gluey hole is two at least, and distributes in proper order along the length direction in embedment storehouse 2.10.
Specifically, as shown in fig. 6, there are three glue injection holes, which are a glue injection hole a1.1.12, a glue injection hole b1.1.13, and a glue injection hole c 1.1.14. The glue injection holes a1.1.12, b1.1.13 and c1.1.14 are distributed in sequence along the length direction of the encapsulation bin 2.10, so that the encapsulation efficiency and the encapsulation effect are improved.
In practical applications, the number of the glue injection holes can be selected to be other and distributed in other manners, and is not limited to the above embodiments.
The circuit board assembly 1 further includes an input member connected to the input terminal of the circuit board and an output member connected to the output terminal of the circuit board. The input and output members may be wires or the like. In order to simplify installation and facilitate assembly, as shown in fig. 4 and 5, the input member may be selected to be an input laminated busbar 1.3.
Specifically, the pins of the input laminated busbar 1.3 are connected to the input device on the circuit board assembly 1, and specifically, the pins of the input laminated busbar 1.3 and the input device are subjected to wave soldering together. Therefore, the conducting wire is replaced by the input laminated busbar 1.3, the manual hole aligning and screwing process of the traditional conducting wire is omitted, and the input laminated busbar 1.3 is small in size and small in stray inductance.
It should be noted that the input device is a heat generating device, and the type of the input device is selected according to actual needs, which is not limited in this embodiment.
Accordingly, as shown in fig. 4 and 5, the output member is an output busbar 1.4. Optionally, as shown in fig. 5, the output bus bar 1.4 is provided with a stress relief hole 1.4.1. Like this, the flexibility that the female row 1.4 of output was arranged has been increased to stress release hole 1.4.1 for female row 1.4 of output is changeed the deformation by the screw tightening in-process, has reduced female row 1.4 internal stress of output and to circuit board components 1's effort, has prolonged female row 1.4 of output itself and circuit board components 1's life-span, has still improved resistant vibration ability.
The specific structure of the stress relief hole 1.4.1 is selected according to actual needs. Specifically, the stress relief hole 1.4.1 is a strip-shaped hole, for example, the stress relief hole 1.4.1 is a waist hole, and the like, which is not limited in this embodiment.
The number and distribution of the stress relief holes 1.4.1 are selected according to actual needs. In order to improve the stress release effect, at least two stress release holes 1.4.1 can be selected.
In order to facilitate maintenance of the circuit board assembly 1, the circuit board assembly 1 is adapted to be detachably fixed to the first fixing portion 2.6. In particular, the circuit board assembly 1 is adapted to be detachably fixed to the first fixing portion 2.6 by means of a first fastening member 4. The first fastening member 4 may be a screw, the first fixing portion 2.6 is provided with a first fixing hole 2.6.1 for the screw to pass through, and the first fixing hole 2.6.1 is a threaded hole.
The type of the current conversion module is selected according to actual needs. Specifically, the current conversion module is a dc conversion module. The DC conversion module has a DC conversion function of converting a high-voltage low current into a low-voltage high current. The specific process is as follows: the high-voltage low-current direct current is input through the input laminated busbar 1.3 and can be converted into low-voltage high-current direct current through electric energy conversion, and the direct current is output through the output copper bar 1.4.
Optionally, the current conversion module is a vehicle-mounted dc conversion module. Of course, the current conversion module can also be applied to a photovoltaic power generation system, a wind power generation system and the like, and is not limited to new energy automobiles.
In the current conversion module, the specific structure of the circuit board assembly 1 is selected according to actual needs. Specifically, the above circuit board assembly 1 includes: the power board assembly 1.1 for converting the electric energy and the control board assembly 1.2 for controlling the conversion, wherein the control board assembly 1.2 is fixed on the power board assembly 1.1, and the power board assembly 1.1 is used for being fixed on the first fixing part 2.6 of the encapsulation base plate 2. The above circuit board assembly 1 includes: power board 1.1.19, the heating element who installs in power board 1.1.19. In this case, the circuit board is the power board 1.1.19, and the potting bin 2.10 is used for accommodating at least one heat generating device on the power board 1.1.19.
As shown in fig. 6, the aforementioned first mounting hole 1.1.18, positioning hole a1.1.17, positioning hole b1.1.15, glue injection hole a1.1.12, glue injection hole b1.1.13, and glue injection hole c1.1.14 are disposed on the power board 1.1.19 of the power board assembly 1.1.
In practical applications, the circuit board assembly 1 may be selected to have other structures, and is not limited to the above embodiment.
Based on the current conversion module provided in the foregoing embodiment, this embodiment further provides a current conversion apparatus, as shown in fig. 8, the current conversion apparatus includes: a chassis 3 and the current conversion module described in the above embodiments. The housing 3 is fixed to the second fixing portion 2.11 of the potting substrate 2.
Since the current conversion module provided in the above embodiment has the above technical effects, and the current conversion device includes the above current conversion module, the current conversion device also has corresponding technical effects, which are not described herein again.
The type and application scenario of the chassis 3 are selected according to actual needs, and this embodiment does not limit this.
The above-mentioned chassis 3 can be a cooling chassis, i.e. the chassis 3 has cooling channels 3.3; the above-mentioned cabinet 3 may also be a non-cooled cabinet, i.e. the cabinet 3 does not have cooling channels 3.3. In order to improve the heat dissipation effect, the case 3 may be selected to have the cooling channel 3.3, so that the whole current conversion device exchanges heat through the potting substrate 2 and the cooling medium in the case 3 to realize heat dissipation, thereby improving the heat dissipation effect.
As shown in fig. 11, if the cabinet 3 is provided with the cooling channel 3.3, in order to improve the heat dissipation effect, the cabinet 3 is further provided with an inlet 3.1 and an outlet 3.2 both communicated with the cooling channel 3.3. Thus, the cooling medium enters the cooling channel 3.3 from the inlet 3.1, and the cooling medium flowing through the cooling channel 3.3 is discharged through the outlet 3.2, so that the fluidity of the cooling medium is improved, and the heat dissipation effect is improved.
Furthermore, a flow distribution plate 3.4 is arranged in the cooling channel 3.3 to distribute the cooling medium, accelerate the flow of the cooling medium, and improve the distribution uniformity of the cooling medium, thereby improving the uniformity of heat dissipation.
The inlet 3.1 and the outlet 3.2 may be located at the same end of the chassis 3, or may be located at different two ends of the chassis 3, and are selected according to actual needs, which is not limited in this embodiment.
The housing 3 is detachably fixed to the second fixing part 2.11 for maintenance and repair. Specifically, the chassis 3 is detachably fixed to the second fixing portion 2.11 by the second fastening member 5. The second fastening member 5 may be a screw, and the second fixing portion 2.11 is provided with a second fixing hole 2.11.1, and the second fixing hole 2.11.1 is a threaded hole.
In the above current converter, there are two main mounting methods for the circuit board assembly 1, the potting substrate 2, and the chassis 3. As shown in fig. 9, the first is: firstly, assembling the circuit board assembly 1 and the encapsulation substrate 2 together to form a current conversion module, and then assembling the current conversion module and the case 3 together; the second method is as follows: the encapsulation substrate 2 and the case 3 are assembled together, and then the circuit board assembly 1 is fixed on the encapsulation substrate 2.
The first method will be specifically described below as an example. The assembly process of the current conversion device comprises the following steps: the circuit board assembly 1 is first assembled upside down onto the potting substrate 2, and then the circuit board assembly 1 and the potting substrate 2 are assembled onto the chassis 3 as one assembly. The specific process is that an insulating layer is coated on the surface of the heat dissipation boss on the encapsulation substrate 2 (which can also be finished in the process of producing the encapsulation substrate 2), and a heat conduction layer is coated on the insulating layer (which can also be finished in the process of producing the encapsulation substrate 2); then, the circuit board assembly 1 is assembled to the potting substrate 2 in an inverted manner, and the circuit board assembly 1 and the potting substrate 2 are locked by the first fastening piece 4 (the first fastening piece 4 is finally locked in the first fixing hole 2.6.1 of the first fixing part 2.6); pouring the pouring sealant through the glue injection hole by using equipment such as a glue gun and the like; heating and curing the potting adhesive; the circuit board assembly 1 and the potting substrate 2 are assembled as one assembly to the chassis 3.
In the above-described mounting process, the fastening of the second fastening member 5 is more susceptible to interference of the circuit board assembly 1 during the mounting of the potting substrate 2 and the chassis 3. In this case, the potting substrate 2 and the chassis 3 can be enlarged to avoid interference from the circuit board. However, this results in a large overall size and high cost of the device. In order to avoid interference and increase in size and cost, the circuit board may be optionally provided with an escape structure 1.1.16 for fixedly connecting the potting substrate 2 and the chassis 3, as shown in fig. 6. Therefore, the circuit board assembly 1 and the encapsulation substrate 2 can be conveniently manufactured into an integrated module, and the integrated module is convenient to move and use.
As for the specific structure of the avoiding structure 1.1.16, the avoiding structure 1.1.16 is selected according to actual needs, for example, the avoiding structure is an avoiding groove located at the edge of the circuit board, which is not limited in this embodiment.
It can be understood that, when the circuit board is the power board 1.1.19, the avoiding structure 1.1.16 is disposed on the power board 1.1.19.
For the second installation method, reference may be made to the first installation method, and details are not described herein again.
The current conversion device provided by the embodiment adopts the circuit board assembly 1 integrated with the magnetic component, the circuit board assembly 1 is installed in a reverse buckling mode, and the power tube in the circuit board assembly 1 is arranged in a flatwise mode. Wherein, through installing the magnetism spare on circuit board of circuit board assembly 1, then install circuit board assembly 1 back-off on embedment base plate 2, realized the current conversion modularization.
Compared with the existing tiled structure, the current conversion device provided by the embodiment uniformly installs the power tube and the magnetic part on the circuit board, realizes small volume and modularization, and is convenient to be made into a platform product for other projects to use; moreover, the unique encapsulating substrate 2 and encapsulating measures ensure that the magnetic piece and the power tube can realize good heat dissipation; through setting up female 1.3 of arranging of input stack and female 1.4 of arranging of output, realized wireless bundle setting, simplified the assembly.
Compared with the existing vertical structure, the current conversion device provided by the embodiment has the advantages of better manufacturability, lower cost, smaller height and size and modularization.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (19)
1. An encapsulated substrate, comprising:
the first fixing part is used for fixing the circuit board assembly;
the second fixing part is used for fixing the case;
the encapsulating bin is used for accommodating at least one heating device of the circuit board assembly and encapsulating adhesive with insulativity and heat conductivity;
wherein, the encapsulation base plate is the heat conduction base plate.
2. The potting substrate of claim 1, further comprising:
The heat dissipation boss is used for supporting at least one heating device of the circuit board assembly and is in heat conduction connection and insulation connection with the heating device.
3. The encapsulation substrate according to claim 2, wherein the heat dissipation bosses are sequentially provided with at least one insulating layer and at least one heat conduction layer, and the heat conduction layers are used for being in heat conduction connection with the heat generating devices; wherein the sum of the thicknesses of all the insulating layers and all the heat conducting layers is not more than 1 mm.
4. The potting substrate of claim 2 wherein the heat sink boss has at least one heat sink cavity for receiving a cooling medium, the heat sink cavity for communicating with the cooling channel of the chassis, and the potting substrate further comprises a sealing face for sealing connection with the chassis.
5. The encapsulation substrate of claim 2, wherein the encapsulation compartment interior sidewall of the encapsulation compartment comprises at least one sidewall of the at least one heat sink boss.
6. The encapsulation substrate of claim 1, further comprising a stiffener inside and/or outside the encapsulation compartment.
7. The potting substrate of claim 1,
the first fixing portion includes: the first fixing hole and a positioning structure for positioning the circuit board assembly;
and/or the second fixing part comprises a second fixing hole.
8. The potting substrate of any of claims 1-7, wherein the potting substrate is a unitary structure.
9. A current conversion module comprises a circuit board assembly with a current conversion function; wherein the current conversion module further comprises the potting substrate of any of claims 1-8;
the circuit board assembly is used for being fixed on the first fixing portion of the encapsulation substrate.
10. The current conversion module of claim 9, wherein the circuit board assembly comprises: a circuit board mounted on a heat generating device of the circuit board; at least one heating device is a magnetic part, at least one heating device is a power tube, and the power tube is paved on the circuit board.
11. The current conversion module of claim 10, wherein the magnets are configured to be distributed within the potting pocket.
12. The current converting module according to claim 10, wherein at least one of the heat generating devices is one or a combination of at least two of an inductor, a transformer, a capacitor and a power tube; the inductor, the transformer and the capacitor are all used for being distributed in the encapsulation bin, and the power tubes are used for being distributed outside the encapsulation bin.
13. The current conversion module of claim 12, wherein if the encapsulation substrate comprises a heat dissipation boss, the heat dissipation boss supports the power tube, and the heat dissipation boss and the power tube are thermally and insulatively connected.
14. The current conversion module of claim 9, wherein the circuit board assembly is configured to be flipped over on the potting substrate.
15. The current converting module of claim 9,
the circuit board of the circuit board assembly is provided with at least one glue injection hole;
and/or, the circuit board assembly comprises: the circuit board comprises a circuit board, an input laminated busbar connected with an input end of the circuit board and an output busbar connected with an output end of the circuit board, wherein the output busbar is provided with a stress release hole;
and/or, the circuit board assembly is used for being detachably fixed on the first fixing part.
16. The current conversion module according to any one of claims 9-15, wherein the current conversion module is an on-board dc conversion module.
17. A current converting apparatus, comprising: a chassis, and a current conversion module according to any one of claims 9-15; the case is fixed to the second fixing portion of the potting substrate.
18. The current converting apparatus according to claim 17, wherein if the housing is provided with a cooling channel, the housing is further provided with an inlet and an outlet both communicating with the cooling channel.
19. The current converting device according to claim 17,
the circuit board of the circuit board assembly is provided with an avoidance structure for fixedly connecting the encapsulation substrate and the case;
and/or the case is detachably fixed to the second fixing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210364754.XA CN114760815A (en) | 2022-04-08 | 2022-04-08 | Embedment base plate, current conversion module and current conversion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210364754.XA CN114760815A (en) | 2022-04-08 | 2022-04-08 | Embedment base plate, current conversion module and current conversion device |
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| CN114760815A true CN114760815A (en) | 2022-07-15 |
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| CN202210364754.XA Pending CN114760815A (en) | 2022-04-08 | 2022-04-08 | Embedment base plate, current conversion module and current conversion device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109152302A (en) * | 2018-10-10 | 2019-01-04 | 北京友信宏科电子科技股份有限公司 | Electric industry vehicle controller containing radiator |
| CN109616452A (en) * | 2018-10-26 | 2019-04-12 | 武汉光迅科技股份有限公司 | A kind of radiating subassembly, corresponding radiator and corresponding circuit board |
| CN210053642U (en) * | 2019-04-09 | 2020-02-11 | 苏州汇川联合动力系统有限公司 | Heat radiation component of circuit board and electronic equipment |
| CN214852485U (en) * | 2021-06-03 | 2021-11-23 | 广东高标电子科技有限公司 | Electric vehicle controller and electric vehicle |
| CN215342253U (en) * | 2021-03-18 | 2021-12-28 | 联合汽车电子有限公司 | Direct insertion type integrated transformer inductance structure and power electronic controller |
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- 2022-04-08 CN CN202210364754.XA patent/CN114760815A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152302A (en) * | 2018-10-10 | 2019-01-04 | 北京友信宏科电子科技股份有限公司 | Electric industry vehicle controller containing radiator |
| CN109616452A (en) * | 2018-10-26 | 2019-04-12 | 武汉光迅科技股份有限公司 | A kind of radiating subassembly, corresponding radiator and corresponding circuit board |
| CN210053642U (en) * | 2019-04-09 | 2020-02-11 | 苏州汇川联合动力系统有限公司 | Heat radiation component of circuit board and electronic equipment |
| CN215342253U (en) * | 2021-03-18 | 2021-12-28 | 联合汽车电子有限公司 | Direct insertion type integrated transformer inductance structure and power electronic controller |
| CN214852485U (en) * | 2021-06-03 | 2021-11-23 | 广东高标电子科技有限公司 | Electric vehicle controller and electric vehicle |
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