CN114752218A - Heat conduction material for electronic product and preparation method and application thereof - Google Patents
Heat conduction material for electronic product and preparation method and application thereof Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000000945 filler Substances 0.000 claims abstract description 87
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000002156 mixing Methods 0.000 claims abstract description 23
- 239000003054 catalyst Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 15
- 239000003085 diluting agent Substances 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011787 zinc oxide Substances 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 9
- 239000004917 carbon fiber Substances 0.000 claims abstract description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 9
- 229910052582 BN Inorganic materials 0.000 claims abstract description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 8
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 6
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 6
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229920002545 silicone oil Polymers 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
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- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention discloses a heat conduction material for electronic products, which comprises the following components in parts by weight: 5-20 parts of main resin, 140 parts of heat-conducting filler 110-140 parts, 0.5-3 parts of interfacial agent, 3-10 parts of diluent, 0.1-1 part of cross-linking agent and 0.01-0.05 part of catalyst; the heat-conducting filler is formed by mixing a heat-conducting filler A or a heat-conducting filler B with a heat-conducting filler C; the heat-conducting filler A is one or a mixture of more of aluminum oxide, aluminum hydroxide, aluminum nitride, zinc oxide, magnesium oxide and boron nitride; the heat-conducting filler B is aluminum powder or silver powder; the heat conducting filler C is one or a mixture of more of graphene, carbon nanotubes, carbon fibers and liquid metal. The heat conducting plate has excellent heat conducting performance and can rapidly conduct heat out of the heating body. In addition, the invention also provides a preparation method and application of the heat conduction material for the electronic product.
Description
Technical Field
The invention relates to the technical field of heat dissipation materials of electronic products, in particular to a heat conduction material for electronic products, and a preparation method and application thereof.
Background
Along with the rapid development of the integration process of electronic components, the integration degree of the electronic components is higher and higher. Design engineers strive to mount more electronic components on a smaller area to achieve miniaturization of instrumentation. To ensure stable operation of these highly integrated electronic components, the heat generated by each electronic component must be efficiently and timely transferred to the surrounding environment. A common method is to mount a high thermal conductivity metal heat sink such as copper or aluminum on the surface of an electronic component to increase the heat dissipation area. However, the surfaces of the electronic component and the heat sink are not absolutely flat, and an air gap is inevitably generated when the electronic component and the heat sink are in contact with each other, and the heat dissipation efficiency is greatly reduced due to the existence of the air gap. Therefore, how to reduce the thermal interface resistance between the electronic component and the heat dissipation device is one of the keys for improving the heat dissipation efficiency of the electronic component.
In the prior art, the heat conduction material is formed by compounding the heat conduction filler and the organic polymer material, and is filled in the contact surface between the electronic component and the heat dissipation device, so that air in the pores of the contact interface can be removed, a continuous heat conduction channel is formed on the whole contact interface, and the heat dissipation efficiency of the electronic component is improved. The organic polymer material in the heat conduction material has good insulation property, but the heat conduction coefficient is mostly below 0.25W/(m.K), so the purpose of improving the heat conduction coefficient of the material by selecting the heat conduction filler to be compounded with the organic polymer material is achieved.
In order to ensure that the existing heat conduction material has higher heat conduction coefficient, a large amount of heat conduction filler (usually alumina, aluminum nitride or metal powder) is added into a system, but the heat conduction performance of the heat conduction filler is limited, and in order to improve the heat conduction performance of the heat conduction material, a large amount of heat conduction filler is added into the system, so that the product is heavier and thicker.
Disclosure of Invention
In order to solve the above-mentioned problems in the background art, the present invention provides a heat conductive material for electronic products, which has excellent heat conductive performance and can rapidly conduct heat away from a heat generating body. In addition, the invention also provides a preparation method and application of the heat conduction material for the electronic product.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect of the invention, the invention provides a heat conduction material for electronic products, which comprises the following components in parts by weight: 5-20 parts of main resin, 140 parts of heat-conducting filler 110-140 parts, 0.5-3 parts of interfacial agent, 3-10 parts of diluent, 0.1-1 part of cross-linking agent and 0.01-0.05 part of catalyst;
the heat-conducting filler is formed by mixing a heat-conducting filler A or a heat-conducting filler B with a heat-conducting filler C;
the heat-conducting filler A is one or a mixture of more of aluminum oxide, aluminum hydroxide, aluminum nitride, zinc oxide, magnesium oxide and boron nitride;
The heat-conducting filler B is aluminum powder or silver powder;
the heat conducting filler C is one or a mixture of more of graphene, carbon nanotubes, carbon fibers and liquid metal.
Preferably, the thermally conductive filler C is a mixture of graphene and carbon fibers.
The liquid metal is at least one selected from gallium metal, indium metal, rubidium metal and cesium metal.
In the formula, the heat-conducting filler A has excellent insulating property, and the electric-conducting filler B has electric conductivity; when the heat conduction material needs to have excellent insulating property, the heat conduction filler A and the heat conduction filler C are compounded to be used as the heat conduction filler, so that the final finished heat conduction material has excellent heat conduction property and excellent insulating property; when the heat conduction material needs to have certain electric conductivity, the heat conduction filler B and the heat conduction filler C are compounded to be used as the heat conduction filler, so that the final finished heat conduction material has certain electric conductivity while showing excellent heat conduction performance.
Preferably, the content of the heat conductive filler C in the heat conductive filler is 1-5 wt%.
The heat conducting filler C has excellent heat conducting performance, the heat conducting performance of the heat conducting material can be greatly improved by adding a small amount of the heat conducting filler C into a heat conducting filler system, and when the adding amount of the heat conducting filler C exceeds 5 wt%, aggregation can occur in the system, and the heat conducting performance of the heat conducting material can be influenced.
Preferably, the heat-conducting filler is powder with the average particle diameter D50 of 0.5-100 μm.
In practical application, the particle size and the morphology of each component in the heat-conducting filler are screened, and when a component with a large particle size is matched with a component with a small particle size, the filling degree of the filler is increased.
Preferably, the host resin is a silicone rubber, an epoxy resin, or a polyurethane resin.
Preferably, the interfacial agent is a silane coupling agent.
The addition of the interface agent can promote the compatibility of the main resin and the heat-conducting filler and ensure that the main resin and the heat-conducting filler are uniformly dispersed and mixed.
Preferably, the diluent is a vinyl silicone oil.
Preferably, the cross-linking agent is hydrogen-containing silicone oil, and the catalyst is a metal salt catalyst.
In a second aspect of the present invention, a method for preparing the above thermal conductive material for electronic products is provided, including the following steps:
s1, adding the main resin and the heat-conducting filler into a reaction container, and stirring and mixing uniformly;
s2, adding a diluent and an interfacial agent into the reaction container, and stirring and mixing uniformly;
s3, adding a cross-linking agent and a catalyst into the container, vacuumizing, and stirring at 90-110 ℃ for reaction for 1-4 hours;
and S4, stopping heating, and cooling to room temperature in a water bath under the stirring state to obtain the finished product.
When main resin and heat conduction filler mix, can adopt the mode of adding the mixture in batches many times to guarantee that both mix more evenly.
The product prepared by the preparation method is pasty and can be directly packaged for use. When a gasket-shaped product is required to be obtained, the prepared paste-shaped product is subjected to calendaring treatment and high-temperature curing (heating at 80-150 ℃ for 10-30min) to prepare the gasket-shaped heat conduction material with the thickness of 0.5-5 mm.
The invention also provides a heat-conducting material for electronic products, which is characterized in that the heat-conducting material is in a gasket shape, and the heat-conducting material is attached to a gap formed between a heat-emitting end of the electronic product and a radiator when the heat-conducting material is used.
The heat conducting material is paste, and when the heat conducting material is used, the heat conducting material is coated in a gap formed between the heat emitting end of the electronic product and the radiator.
Compared with the prior art, the invention has the following beneficial effects:
in the invention, the heat-conducting filler C (one or a mixture of more of graphene, carbon nano tube, carbon fiber and liquid metal) with excellent heat-conducting property is mixed with the conventional heat-conducting filler A (one or a mixture of more of aluminum oxide, aluminum hydroxide, aluminum nitride, zinc oxide, magnesium oxide and boron nitride) or the heat-conducting filler B (aluminum powder or silver powder), and the two are mutually promoted, so that the prepared heat-conducting filler has excellent heat-conducting property and can be filled in large quantity; the heat-conducting filler is compounded with other components finally, and the prepared finished heat-conducting material has excellent heat-conducting property, can rapidly lead heat out of a heating body, is low in heat resistance, and is better in flexibility, lighter and thinner when in use; in addition, the product can be used in a paste or pad form, is convenient to use and has wide application occasions.
Detailed Description
Example 1
A heat conduction material for electronic products comprises the following components: 9 parts of main resin (organic silicon rubber), 125 parts of heat-conducting filler, 2 parts of interface agent (silane coupling agent), 5 parts of diluent (vinyl silicone oil), 0.3 part of cross-linking agent (hydrogen-containing silicone oil) and 0.03 part of catalyst (metal salt catalyst);
wherein the heat-conducting filler is formed by mixing 97 wt% of heat-conducting filler A and 3 wt% of heat-conducting filler C;
the heat-conducting filler A is a mixture of aluminum oxide, aluminum hydroxide and zinc oxide in a mass ratio of 3:1:1, the aluminum oxide is spherical, the average particle size D50 of the aluminum oxide is 20-60 mu m, the aluminum hydroxide is spherical, the average particle size D50 of the aluminum hydroxide is 20-60 mu m, the zinc oxide is hexagonal, and the average particle size D50 of the zinc oxide is 1-10 mu m;
the heat conducting filler C is a mixture of graphene and carbon fibers in a mass ratio of 1: 1.
The preparation method of the heat conduction material for the electronic product comprises the following steps:
s1, adding the main resin and the heat-conducting filler into a reaction container, and uniformly stirring and mixing at the rotating speed of 5rmp for 30 min;
s2, adding a diluent and an interfacial agent into the reaction container, and then stirring and mixing uniformly at the rotating speed of 5rmp for 30 min;
S3, adding a cross-linking agent and a catalyst into the container, stirring and mixing for 30min at the rotating speed of 5rmp, vacuumizing at normal temperature, and stirring and reacting for 2h at the temperature of 90 ℃;
and S4, stopping heating, and cooling to room temperature in a water bath under the stirring state to obtain a paste finished product.
Example 2
A heat conduction material for electronic products comprises the following components: 5 parts of main resin (epoxy resin), 110 parts of heat-conducting filler, 0.5 part of interface agent (silane coupling agent), 3 parts of diluent (vinyl silicone oil), 0.1 part of cross-linking agent (hydrogen-containing silicone oil) and 0.01 part of catalyst (metal salt catalyst);
wherein the heat-conducting filler is formed by mixing 95 wt% of heat-conducting filler A and 5 wt% of heat-conducting filler C;
the heat-conducting filler A is a mixture of aluminum oxide, zinc oxide and boron nitride in a mass ratio of 1:1:2, the aluminum oxide is spherical, the average particle size D50 of the aluminum oxide is 20-60 mu m, the zinc oxide is hexagonal crystal, the average particle size D50 of the zinc oxide is 1-10 mu m, the boron nitride is a sheet structure, and the aspect ratio of the boron nitride is (2-10): 1, the length is 20-50 μm;
the heat conducting filler C is a mixture of carbon nanotubes and carbon fibers in a mass ratio of 1: 1.
The preparation method of the heat conduction material for the electronic product comprises the following steps:
s1, adding the main resin and the heat-conducting filler into a reaction container, and uniformly stirring and mixing at the rotating speed of 3rmp for 30 min;
S2, adding a diluent and an interfacial agent into the reaction container, and then stirring and mixing uniformly at the rotating speed of 3rmp for 30 min;
s3, adding a cross-linking agent and a catalyst into the container at the rotation speed of 3rmp, stirring and mixing for 30min, vacuumizing at normal temperature, and stirring and reacting at the temperature of 100 ℃ for 2 h;
and S4, stopping heating, and cooling to room temperature in a water bath under the stirring state to obtain a paste finished product.
Example 3
A heat conduction material for electronic products comprises the following components: 10 parts of main resin (organic silicon rubber), 140 parts of heat-conducting filler, 1.5 parts of interface agent (silane coupling agent), 3 parts of diluent (vinyl silicone oil), 1 part of cross-linking agent (hydrogen-containing silicone oil) and 0.03 part of catalyst (metal salt catalyst);
wherein, the heat-conducting filler is formed by mixing 99 wt% of heat-conducting filler A and 1 wt% of heat-conducting filler C;
the heat-conducting filler A is a mixture of aluminum oxide, aluminum nitride and zinc oxide in a mass ratio of 1:1:1, the aluminum oxide is spherical, the average particle size D50 of the aluminum oxide is 20-60 mu m, the aluminum nitride is spherical, the average particle size D50 of the aluminum nitride is 60-100 mu m, the zinc oxide is hexagonal crystal, and the average particle size D50 of the zinc oxide is 1-10 mu m;
the heat conducting filler C is liquid metal, namely gallium metal.
The preparation method of the heat conduction material for the electronic product comprises the following steps:
S1, adding the main resin and the heat-conducting filler into a reaction container, and uniformly stirring and mixing at the rotating speed of 5rmp for 30 min;
s2, adding a diluent and an interfacial agent into the reaction container, and then stirring and mixing uniformly at the rotating speed of 5rmp for 30 min;
s3, adding a cross-linking agent and a catalyst into the container, stirring and mixing for 30min at the rotating speed of 5rmp, vacuumizing at normal temperature, and stirring and reacting for 2h at the temperature of 110 ℃;
and S4, stopping heating, and cooling to room temperature in a water bath under the stirring state to obtain a paste finished product.
Example 4
A heat conduction material for electronic products comprises the following components: 10 parts of main resin (polyurethane resin), 140 parts of heat-conducting filler, 3 parts of interface agent (silane coupling agent), 10 parts of diluent (vinyl silicone oil), 0.8 part of cross-linking agent (hydrogen-containing silicone oil) and 0.05 part of catalyst (metal salt catalyst);
wherein, the heat-conducting filler is formed by mixing 96 wt% of heat-conducting filler B and 4 wt% of heat-conducting filler C;
the heat-conducting filler B is silver powder which is of a spherical structure, and the average particle size D50 is 10-30 mu m;
the mass ratio of the heat-conducting filler C is 3: 1 graphene and carbon fiber.
The preparation method of the heat conduction material for the electronic product comprises the following steps:
S1, adding the main resin and the heat-conducting filler into a reaction container, and stirring and mixing uniformly at the rotating speed of 5rmp for 30 min;
s2, adding a diluent and an interfacial agent into the reaction container, and then stirring and mixing uniformly at the rotating speed of 5rmp for 30 min;
s3, adding a cross-linking agent and a catalyst into the container, stirring and mixing for 30min at the rotating speed of 5rmp, vacuumizing at normal temperature, and stirring and reacting for 3h at the temperature of 90 ℃;
s4, stopping heating, and cooling to room temperature in a water bath under a stirring state to obtain a paste;
s5, rolling the paste, and curing at high temperature (heating at 120 deg.C for 10min) to obtain pad-shaped heat conduction material with thickness of 2 mm.
Examples of the experiments
The heat conductivity, hardness, viscosity and maximum particle size of the heat conducting materials of the products prepared in examples 1-4 were measured, and the specific test results are shown in table 1.
TABLE 1
As can be seen from the test results in Table 1, the thermal conductivity of the heat conducting materials prepared in the examples 1 to 4 is 12 to 14W/m.k, which is higher than that of the same type of products on the market (the thermal conductivity is 3 to 10W/m.k), and the paste-like products have moderate viscosity, are easy to coat in the gap formed between the heating end of the electronic product and the radiator, and the maximum particle size D100 of the paste-like products is less than or equal to 100 μm, so that the products can be coated to form a thinner structure; for gasket products, the gasket products are lower in hardness, softer and higher in fitting property, can be tightly filled into a gap formed between a heating end of an electronic product and a radiator, and can better exert a heat conduction effect.
In summary, in the invention, the heat-conducting filler C (one or a mixture of several of graphene, carbon nanotube, carbon fiber and liquid metal) with excellent heat-conducting property is mixed with the conventional heat-conducting filler a (one or a mixture of several of alumina, aluminum hydroxide, aluminum nitride, zinc oxide, magnesium oxide and boron nitride) or the heat-conducting filler B (aluminum powder or silver powder), and the two are mutually promoted, so that the prepared heat-conducting filler has excellent heat-conducting property and can be filled in large amount; the heat-conducting filler is compounded with other components finally, and the prepared finished heat-conducting material has excellent heat-conducting property, can rapidly lead heat out of a heating body, is low in heat resistance, and is better in flexibility, lighter and thinner when in use; in addition, the product can be used in a paste or gasket form, is convenient to use and has wide application occasions.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (10)
1. The heat conduction material for the electronic product is characterized by comprising the following components in parts by weight: 5-20 parts of main resin, 140 parts of heat-conducting filler 110-140 parts, 0.5-3 parts of interfacial agent, 3-10 parts of diluent, 0.1-1 part of cross-linking agent and 0.01-0.05 part of catalyst;
The heat-conducting filler is formed by mixing a heat-conducting filler A or a heat-conducting filler B with a heat-conducting filler C;
the heat-conducting filler A is one or a mixture of more of aluminum oxide, aluminum hydroxide, aluminum nitride, zinc oxide, magnesium oxide and boron nitride;
the heat-conducting filler B is aluminum powder or silver powder;
the heat conducting filler C is one or a mixture of more of graphene, carbon nanotubes, carbon fibers and liquid metal.
2. The heat conductive material for electronic products according to claim 1, wherein the content of the heat conductive filler C in the heat conductive filler is 1 to 5 wt%.
3. The heat conductive material for electronic products according to claim 2, wherein the heat conductive filler is a powder having an average particle diameter D50 in the range of 0.5 to 100 μm.
4. The heat conductive material for electronic products according to claim 1, wherein the host resin is a silicone rubber, an epoxy resin, or a urethane resin.
5. The heat conductive material for electronic products according to claim 1, wherein the interface agent is a silane coupling agent.
6. The heat conductive material for electronic products according to claim 1, wherein the diluent is vinyl silicone oil.
7. The heat conductive material for electronic products according to claim 1, wherein the crosslinking agent is hydrogen-containing silicone oil, and the catalyst is a metal salt catalyst.
8. A method of preparing a heat conductive material for electronic products as claimed in claim 1, comprising the steps of:
s1, adding the main resin and the heat-conducting filler into a reaction container, and stirring and mixing uniformly;
s2, adding a diluent and an interfacial agent into the reaction vessel, and stirring and mixing uniformly;
s3, adding a cross-linking agent and a catalyst into the container, vacuumizing, and stirring to react at 90-110 ℃ for 1-4 h;
and S4, stopping heating, and cooling to room temperature in a water bath under a stirring state to obtain a finished product.
9. Use of a heat conducting material according to claim 1, wherein the heat conducting material is in the form of a mat, and in use, the heat conducting material is attached to a gap formed between a heat generating end of an electronic product and a heat sink.
10. Use of a heat-conducting material for electronic products according to claim 1, wherein the heat-conducting material is in the form of paste, and is applied to a gap formed between a heat-emitting end of the electronic product and a heat sink in use.
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