CN114749390A - Wafer detection device - Google Patents

Wafer detection device Download PDF

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Publication number
CN114749390A
CN114749390A CN202210350682.3A CN202210350682A CN114749390A CN 114749390 A CN114749390 A CN 114749390A CN 202210350682 A CN202210350682 A CN 202210350682A CN 114749390 A CN114749390 A CN 114749390A
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China
Prior art keywords
placing
wafer
detection
material taking
slide rail
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Pending
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CN202210350682.3A
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Chinese (zh)
Inventor
韩志刚
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Wuxi Guangnuo Automation Technology Co ltd
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Wuxi Guangnuo Automation Technology Co ltd
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Application filed by Wuxi Guangnuo Automation Technology Co ltd filed Critical Wuxi Guangnuo Automation Technology Co ltd
Priority to CN202210350682.3A priority Critical patent/CN114749390A/en
Publication of CN114749390A publication Critical patent/CN114749390A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/38—Collecting or arranging articles in groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00—Marking-out or setting-out work
    • B25H7/04—Devices, e.g. scribers, for marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention relates to a wafer detection device, which comprises a base, a first detection position slide rail, a first detection position material taking and placing slide rail, a direction detection frame and a dotting frame, wherein the first detection position slide rail, the first detection position material taking and placing slide rail, the direction detection frame and the dotting frame are respectively arranged on the base; a first detection position moving cylinder is fixedly arranged on the first detection position slide rail; a first placing seat is arranged between the first detection position slide rail and the first detection position material taking and placing slide rail in a sliding manner; the first detection position moving cylinder is connected with the first placing seat; a first placing device is arranged on the first placing seat and used for placing the wafer and rotationally positioning the wafer; a first material taking and placing device is arranged on one side of the first material taking and placing slide rail at the detection position and used for taking a wafer from the wafer box and placing the wafer into the first material placing device or taking the wafer from the first material placing device and placing the wafer into the wafer box; a first direction detection camera is arranged on one side of the direction detection frame; a defect detection camera is arranged on the other side of the direction detection frame; the dotting frame is provided with a dotting machine. The invention has the advantages of conveniently detecting the wafer defects, dotting and marking the detected defects, improving the production efficiency and the like.

Description

Wafer detection device
The technical field is as follows:
the invention relates to the technical field of chips, in particular to a wafer detection device.
Background art:
during the production and manufacturing process of the wafer, scratches often occur on the surface of the wafer, and surface stains exist during the production process, the quality of the chips at the scratches or the stains is generally poor when the wafer containing the scratches or the surface stains is subsequently sliced into chips, in order to avoid the poor phenomenon, the wafer is detected before slicing, a poor wafer is removed, or the poor position of the wafer is marked, and the wafer at the marked position is removed during slicing, so that the poor quality of the sliced chips is avoided. At present, the detection of wafer scratches or stains generally adopts manual identification, the efficiency is low, and the detection is easy to miss.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
The invention content is as follows:
in order to achieve the purpose, the invention provides a wafer detection device which comprises a base, a first detection position slide rail, a first detection position material taking and placing slide rail, a direction detection frame and a dotting frame, wherein the first detection position slide rail, the first detection position material taking and placing slide rail, the direction detection frame and the dotting frame are respectively arranged on the base; a first detection position moving cylinder is fixedly arranged on the first detection position slide rail; a first placing seat is arranged between the first detection position slide rail and the first detection position material taking and placing slide rail in a sliding mode; the first detection position moving cylinder is connected with the first placing seat and drives the first placing seat to move between the first detection position sliding rail and the first detection position material taking and placing sliding rail; a first material placing device is arranged on the first placing seat and used for placing a wafer and rotationally positioning the wafer; a first material taking and placing device is arranged on one side of the material taking and placing slide rail of the detection position and used for taking a wafer from the wafer box and placing the wafer into the first material taking device or taking the wafer from the first material taking device and placing the wafer into the wafer box; a first direction detection bracket is arranged on one side of the direction detection bracket in a sliding manner; a first direction detection light source and a first direction detection camera frame are fixedly arranged on the first direction detection support respectively; a direction detection camera I is arranged on the direction detection camera frame I; a defect detection slide rail is arranged on the other side of the direction detection frame; a defect detection bracket is arranged on the defect detection slide rail in a sliding manner; a defect detection light source and a defect detection camera frame are fixedly arranged on the defect detection bracket in a sliding manner respectively; arranging a defect detection camera on the defect detection camera frame; arranging a dotting slide rail on the dotting frame; a dotting seat is arranged on the dotting slide rail in a sliding manner; and a dotting machine is arranged on the dotting seat.
Furthermore, the device also comprises a second detection position slide rail arranged on the base; a second detection position moving cylinder is fixedly arranged on the second detection position slide rail; a placing seat II is arranged between the detection position slide rail II and the detection position material taking and placing slide rail in a sliding mode; the second detection position moving cylinder is connected with the second placing seat and drives the second placing seat to move between the second detection position sliding rail and the second detection position material taking and placing sliding rail; a second material placing device is arranged on the second placing seat and used for placing the wafer and rotationally positioning the wafer; a second material taking and placing device is arranged on the other side of the material taking and placing slide rail at the detection position and used for taking the wafer from the wafer box and placing the wafer into the second placing device or taking the wafer from the second placing device and placing the wafer into the wafer box; a direction detection bracket II is arranged on the direction detection bracket; a direction detection light source II and a direction detection camera frame II are fixedly arranged on the direction detection support II respectively; a second direction detection camera is arranged on the second direction detection camera frame; a defect detection cylinder is arranged on the direction detection frame; the defect detection air cylinder is connected with the defect detection support and drives the defect detection support to move on the defect detection slide rail; a dotting cylinder is arranged on the dotting frame; the dotting cylinder is connected with the dotting seat and drives the dotting seat to move on the dotting slide rail.
Further, a back light source is arranged on the base; a back side slide rail is arranged on the back side of the base; a back side camera frame is arranged on the back side slide rail in a sliding manner; and a back measurement camera is arranged on the back measurement camera frame.
Further, a back side measuring cylinder is arranged on the back side of the base; the back measurement cylinder is connected with the back measurement camera frame to drive the back measurement camera frame to move on the back measurement slide rail.
Further, the first material placing device and the second material placing device both comprise an upper material placing plate, a lower material placing plate which is rotatably arranged on the first placing seat or the second placing seat, a gear clutch slider which is slidably arranged on the first placing seat or the second placing seat, and a gear clutch cylinder, a direction adjusting driving device and a direction adjusting belt pulley which are fixedly arranged on the first placing seat or the second placing seat respectively; a distance adjusting screw rod is arranged between the feeding upper tray and the feeding lower tray; the pitch adjusting screw rod is respectively provided with a positive thread and a negative thread; the feeding upper disc and the feeding lower disc are respectively connected with the positive thread and the negative thread of the pitch adjusting screw rod, the pitch adjusting screw rod is rotated, and the feeding upper disc and the feeding lower disc are close to or separated from each other; a slack gear is arranged on the distance adjusting screw rod; a driving gear set and a gear set driving device are arranged on the gear clutch sliding block, and the gear set driving device drives the driving gear set to rotate; the gear clutch cylinder is connected with the gear clutch sliding block, and the gear clutch sliding block is driven to move on the placing seat I or the placing seat II so that the driving gear set is meshed with or separated from the elastic gear; the direction-adjusting driving device is connected with the direction-adjusting belt pulley and drives the direction-adjusting belt pulley to rotate; a direction-adjusting belt is sleeved between the direction-adjusting belt pulley and the discharging lower disc.
Furthermore, the first material taking and placing device and the second material taking and placing device both comprise a driving seat, a rotating seat and a rotating device which are respectively and fixedly arranged on the detection position slide rail, and a material taking and placing lifting cylinder which is arranged on the detection position slide rail in a sliding manner; a driving shaft is rotatably arranged on the driving seat; a driving wheel is arranged on the driving shaft; a rotating shaft is rotatably arranged on the rotating seat; a rotating wheel is arranged on the rotating shaft; a belt is sleeved between the driving wheel and the rotating wheel; the belt is connected with the material taking and placing lifting cylinder to drive the material taking and placing lifting cylinder to move on the detection position slide rail; the rotating device is connected with the driving shaft belt and drives the driving shaft to rotate; a material taking and placing frame is arranged on the material taking and placing lifting cylinder, and the material taking and placing lifting cylinder drives the material taking and placing frame to rise or fall; a material taking and placing cylinder, a material taking and placing fixing clamp and a material taking and placing sliding clamp are fixedly arranged on the material taking and placing frame respectively; the material taking and placing cylinder is connected with the material taking and placing sliding clamp, and the material taking and placing sliding clamp is driven to move on the material taking and placing frame to clamp or release the wafer.
Further, still include central control unit, central control unit includes:
the positioning picture extraction module is used for extracting wafer positioning pictures shot by the first direction detection camera and the second direction detection camera;
the positioning identification module is used for analyzing whether the wafer notching direction of the wafer positioning picture meets the requirement or not;
the defect picture extraction module is used for extracting wafer pictures shot by the defect detection camera and the back measurement camera;
the defect identification module is used for finding the wafer defects on the wafer picture;
the defect printing module is used for controlling the dotting machine to print the wafer defects found by the defect identification module on the wafer;
and the work scheduling module is used for controlling the work of the detection position moving cylinder I, the detection position moving cylinder II, the defect detection cylinder, the dotting cylinder, the back detection cylinder, the rotating device, the material taking and placing lifting cylinder, the material taking and placing cylinder, the gear clutch cylinder, the gear set driving device and the direction adjusting driving device.
Compared with the prior art, the wafer detection device is provided with a first slidable placing seat, a first placing device is arranged on the first placing seat and used for placing a wafer and rotationally positioning the wafer, a first material taking and placing device is arranged and used for taking the wafer from a wafer box and placing the wafer into the first placing device or taking the wafer from the first placing device and placing the wafer into the wafer box, a first direction detection camera, a first defect detection camera and a dotting machine are further arranged, the direction detection camera takes pictures in the wafer nicking direction, the placing device rotationally positions the wafer which does not meet the requirements, the defect detection camera takes pictures of the positioned wafer, the wafer defects are identified from the wafer pictures, and the dotting machine prints the defects on the wafer. Therefore, the method has the advantages of conveniently detecting the wafer defects, dotting and marking the detected defects, improving the production efficiency and the like.
Description of the drawings:
FIG. 1 is a schematic left-side view of a wafer inspection apparatus according to the present invention;
FIG. 2 is a right-side view of a wafer inspection apparatus according to the present invention;
FIG. 3 is a bottom view of a wafer inspection device according to the present invention;
FIG. 4 is a schematic view of a material pick-and-place device of a wafer inspection apparatus according to the present invention;
FIG. 5 is a schematic view of a first or second placing device of a wafer inspection apparatus according to the present invention;
FIG. 6 is a schematic diagram of a top view of a wafer inspection apparatus according to the present invention;
the reference signs are: 1-base, 2-first material taking and placing device, 201-driving seat, 202-rotating seat, 203-rotating device, 204-rotating shaft, 205-driving shaft, 206-driving wheel, 207-rotating wheel, 208-belt, 209-material taking and placing lifting cylinder, 210-material taking and placing frame, 211-material taking and placing cylinder, 212-material taking and placing slider clamp, 213-material taking and placing fixing clamp, 3-first placing seat, 4-detection position moving cylinder, 5-material placing device, 501-gear clutch cylinder, 502-gear set driving device, 503-driving gear set, 504-loose gear, 505-material placing lower disc, 506-material placing upper disc, 507-direction adjusting belt, 508-direction adjusting driving device, 509-direction adjusting belt pulley, 510-gear clutch slide block, 6-direction detection frame, 7-direction detection support frame I, 8-direction detection camera frame I, 9-direction detection camera I, 10-direction detection light source I, 11-material placing device II, 12-direction detection light source II, 13-direction detection support frame II, 14-direction detection camera frame II, 15-direction detection camera II, 16-wafer box, 17-defect detection slide rail, 18-defect detection air cylinder, 19-defect detection support frame, 20-defect detection camera frame, 21-defect detection camera, 22-defect detection light source, 23-dotting frame, 24-dotting slide rail, 25-dotting seat, 26-dotting machine, 27-dotting air cylinder, 28-back detection light source, 29-back detection camera, 30-back side measuring slide rail, 31-back side measuring camera frame, 32-back side measuring cylinder, 33-detection position material taking and placing slide rail, 34-detection position slide rail I, 35-detection position slide rail II, 36-placing seat II, 37-detection position moving cylinder II and 38-material taking and placing device II.
The specific implementation mode is as follows:
the following detailed description of specific embodiments of the invention is provided, but it should be understood that the scope of the invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations such as "comprises" or "comprising", etc., will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
As shown in FIGS. 1 to 3, a wafer inspection apparatus comprises a base 1, a first inspection position slide rail 34, a first inspection position material taking and placing slide rail 33, a direction inspection frame 6 and a dotting frame 23 are respectively arranged on the base 1, a first inspection position moving cylinder 4 is fixedly arranged on the first inspection position slide rail 34, a first placing seat 3 is arranged between the first inspection position slide rail 34 and the first inspection position material taking and placing slide rail 33 in a sliding manner, the first inspection position moving cylinder 4 is connected with the first placing seat 3, the first inspection position moving cylinder 4 drives the first placing seat 3 to move between the first inspection position slide rail 34 and the first inspection position material taking and placing slide rail 33, a first placing device 5 is arranged on the first placing seat 3 for placing wafers and rotationally positioning the wafers, a first taking and placing device 2 is arranged on one side of the first inspection position material taking and placing slide rail 33 for taking wafers from wafer boxes and placing the wafers into the first placing device 5 or taking wafers from the first placing device 5 and placing the wafers into wafer boxes, a direction detection bracket I7 is arranged on one side of a direction detection frame 6 in a sliding way, a direction detection light source I10 and a direction detection camera frame I8 are respectively and fixedly arranged on the direction detection bracket I7, a direction detection camera I9 is arranged on the direction detection camera frame I8, a defect detection slide rail 17 is arranged on the other side of the direction detection frame 6, a defect detection bracket 19 is arranged on the defect detection slide rail 17 in a sliding way, a defect detection light source 22 and a defect detection camera frame 20 are respectively and fixedly arranged on the defect detection bracket 19, a defect detection camera 21 is arranged on the defect detection camera frame 20, a dotting slide rail 24 is arranged on a dotting frame 23, a dotting seat 25 is arranged on the dotting slide rail 24 in a sliding way, a dotting machine 26 is arranged on the dotting seat 25, the found wafer defects are printed on a wafer by the dotting machine 26, and the dotting machine 26 adopts the prior art to use a three-axis fine adjustment, the dotting device is driven by an electromagnet, a filament is clamped to move up and down to drive ink in the ink fountain to a wafer, and the size of the dotting can be adjusted by the retraction length or thickness of the filament to control the size of the ink dots.
Furthermore, in order to improve the wafer detection efficiency, a second detection position slide rail 35 is further arranged on the base 1, a second detection position moving air cylinder 37 is fixedly arranged on the second detection position slide rail 35, a second placing seat 36 is arranged between the second detection position slide rail 35 and the second detection position material taking and placing slide rail 33 in a sliding manner, the second detection position moving air cylinder 37 is connected with the second placing seat 36, the second detection position moving air cylinder 37 drives the second placing seat 36 to move between the second detection position slide rail 35 and the second detection position material taking and placing slide rail 33, a second placing device 11 is arranged on the second placing seat 36 and used for placing wafers and rotationally positioning the wafers, a second placing device 38 is arranged on the other side of the second detection position material taking and placing slide rail 33 and used for taking the wafers from the wafer boxes and placing the wafers into the second placing device 11 or taking the wafers from the second placing device 11 and placing the wafers into the wafer boxes, a second direction detection support 13 is arranged on the direction detection frame 6, a direction detection light source II 12 and a direction detection camera frame II 14 are fixedly arranged on a direction detection support II 13 respectively, a direction detection camera II 15 is arranged on the direction detection camera frame II 14, a defect detection cylinder 18 is arranged on the direction detection frame 6, the defect detection cylinder 18 is connected with a defect detection support 19, the defect detection cylinder 18 drives the defect detection support 19 to move on a defect detection slide rail 17, a dotting cylinder 27 is arranged on a dotting frame 23, the dotting cylinder 27 is connected with a dotting seat 25, and the dotting cylinder 27 drives the dotting seat 25 to move on a dotting slide rail 24.
Further, in order to test defects on the back surface of the wafer, a back measurement light source 28 is disposed on the base 1, a back measurement slide rail 30 is disposed on the back surface of the base 1, a back measurement camera frame 31 is slidably disposed on the back measurement slide rail 30, and a back measurement camera 29 is disposed on the back measurement camera frame 31.
Further, in order to switch and move the back side camera 29, a back side cylinder 32 is arranged on the back side of the base 1, the back side cylinder 32 is connected with a back side camera frame 31, and the back side cylinder 32 drives the back side camera frame 31 to move on the back side slide rail 30.
Further, the present invention provides a specific embodiment of the first discharging device 5 and the second discharging device 11, as shown in fig. 5, each of which comprises an upper discharging disc 506, a lower discharging disc 505 rotatably disposed on the first placing seat 3 or the second placing seat 36, a gear clutch slider 510 slidably disposed on the first placing seat 3 or the second placing seat 36, and a gear clutch cylinder 501, a direction adjusting driving device 508 and a direction adjusting pulley 509 fixedly disposed on the first placing seat 3 or the second placing seat 36, respectively, a pitch adjusting screw is disposed between the upper discharging disc 506 and the lower discharging disc 505, a positive thread and a negative thread are disposed on the pitch adjusting screw, respectively, the upper discharging disc 506 and the lower discharging disc 505 are connected with the positive thread and the negative thread of the pitch adjusting screw, the pitch adjusting screw is rotated, the upper discharging disc 506 and the lower discharging disc 505 are close to or separated, a slack gear 504 is disposed on the pitch adjusting screw, a driving gear set 503 and a gear set driving device 502 are disposed on the gear clutch slider 510, the gear set driving device 502 drives the driving gear set 503 to rotate, the gear clutch cylinder 501 is connected with the gear clutch slider 510, the gear clutch cylinder 501 drives the gear clutch slider 510 to move on the first placing seat 3 or the second placing seat 36, so that the driving gear set 503 is meshed with or separated from the elasticity gear 504, the direction adjusting driving device 508 is connected with the direction adjusting belt pulley 509 and drives the direction adjusting belt pulley 509 to rotate, and the direction adjusting belt 507 is sleeved between the direction adjusting belt pulley 509 and the discharging lower disc 506.
Further, the present invention provides a specific embodiment of the first material taking and placing device 2 and the second material taking and placing device 38, as shown in fig. 4, each of which comprises a driving seat 201, a rotating seat 202, a rotating device 203 and a material taking and placing lifting cylinder 209 slidably disposed on the material taking and placing slide rail 33 at the detection position, wherein the driving seat 201 is rotatably disposed with a driving shaft 205, the driving shaft 205 is disposed with a driving wheel 206, the rotating seat 202 is rotatably disposed with a rotating shaft 204, the rotating shaft 204 is disposed with a rotating wheel 207, a belt 208 is disposed between the driving wheel 206 and the rotating wheel 207, the belt 208 is connected with the material taking and placing lifting cylinder 209 to drive the material taking and placing lifting cylinder 209 to move on the material taking and placing slide rail 33 at the detection position, the rotating device 203 is connected with the driving shaft 205 by a belt, the driving shaft 205 rotates, the material taking and placing frame 210 is disposed on the material taking and placing lifting cylinder 209, the material taking and placing frame 210 is driven to rise or fall, a material taking and placing cylinder 211, a material taking and placing fixing clamp 213 and a material taking and placing sliding clamp 212 are respectively and fixedly arranged on the material taking and placing frame 210, the material taking and placing cylinder 211 is connected with the material taking and placing sliding clamp 212, the material taking and placing sliding clamp 212 is driven to move on the material taking and placing frame 210 to clamp or release a wafer, and during specific work, the wafer is taken from a wafer box and placed in a first material placing device (a second material placing device): the material taking and placing lifting cylinder 209 drives the material taking and placing frame 210 to descend- > the rotating device 203 drives the driving wheel 206 to rotate, a belt is driven to move, the material taking and placing lifting cylinder 209 is moved to the position near a wafer box, a wafer is positioned between the material taking and placing sliding clamp 212 and the material taking and placing fixing clamp 213- > the material taking and placing cylinder 211 drives the material taking and placing sliding clamp 212 to clamp the wafer- > the rotating device 203 drives the driving wheel 206 to rotate, the belt is driven to move, the material taking and placing lifting cylinder 209 is moved to the front of the first placing device (the second placing device), the material taking and placing lifting cylinder 209 drives the material taking and placing frame 210 to ascend- > the rotating device 203 drives the driving wheel 206 to rotate, the belt is driven to move, the material taking and placing lifting cylinder 209 is moved to the rear of the first placing device (the second placing device), and as the material taking frame 210 is ascended, the material taking and placing sliding clamp 212 and the wafer of the material taking and placing fixing clamp 213 are also moved to the rear of the first placing device (the second placing device) The material placing lifting cylinder 209 drives the material placing and taking frame 210 to descend- > the rotating device 203 drives the driving wheel 206 to rotate, so as to drive the belt to move, and the wafer clamped on the material placing and taking frame 210 is placed on the first placing device (the second placing device); taking the wafer from the first material placing device (the second material placing device) and placing the wafer into a wafer box: the specific process is the reverse process of the process of taking the wafer from the wafer box and placing the wafer into the first material placing device (the second material placing device).
Further, still include central control unit, central control unit includes:
the positioning picture extracting module is used for extracting wafer positioning pictures shot by the first direction detection camera 9 and the second direction detection camera 15;
the positioning identification module is used for analyzing whether the wafer notching direction of the wafer positioning picture meets the requirement or not; the positioning identification module can use a processor capable of running graph identification software;
a defect picture extraction module, configured to extract wafer pictures taken by the defect detection camera 21 and the backside measurement camera 29;
the defect identification module is used for finding the wafer defects on the wafer picture; the defect identification module may use a processor capable of running pattern recognition software;
the defect printing module is used for controlling the dotting machine 26 to print the wafer defects found by the defect identification module onto the wafer;
and the work scheduling module is used for controlling the work of the first detection displacement moving cylinder 4, the second detection position moving cylinder 37, the defect detection cylinder 18, the dotting cylinder 27, the back detection cylinder 32, the rotating device 203, the material taking and placing lifting cylinder 209, the material taking and placing cylinder 211, the gear clutch cylinder 501, the gear set driving device 502 and the direction adjusting driving device 508.
The working process of the invention is explained in conjunction with fig. 6 as follows:
the first detection position moving cylinder moves the first material placing device to A position, the second material placing device and a rotating device drive driving shaft to drive a driving wheel to drive a belt to move to drive a material placing slide block to move, so that a wafer on a wafer box is between the material placing fixed clamp and the material placing slide clamp, the first material placing device and the second material placing device drive driving shaft to drive the driving wheel to move to drive a material placing slide block to move, the first material placing device and the second material placing device clamp the wafer are moved to the first material placing device (the first material placing device and the second material placing device drive the first material placing device to ascend (can cross the first material placing device) and descend (the height of the wafer is descended to the first material placing device) and the second material placing device drive the material placing slide clamp to move, the wafer is placed on the first material placing device, the gear clutch cylinder of the first material placing device drives the gear clutch slide block to move, the driving gear set is meshed with the elastic gear, the gear set driving device drives the driving gear set to rotate to drive the elastic gear to rotate, the distance adjusting screw rod connected with the elastic gear rotates, under the action of the positive thread and the negative thread of the pitch adjusting screw, the upper feeding disc and the lower feeding disc clamp the wafers, the gear clutch cylinder drives the gear clutch slide block to move, the driving gear set and the elastic gear are separated, the direction detection camera takes pictures of the wafers, the positioning picture extraction module extracts the wafer pictures, the positioning recognition module, judging the wafer notch direction of the wafer positioning picture, if the wafer notch direction does not meet the requirement, driving the direction-adjusting belt pulley to rotate by the direction-adjusting driving device, driving the direction-adjusting belt to rotate, enabling the discharging lower disc to rotate, carrying out rotation positioning on the wafer direction- > moving the first emptying device to the B position by the first detection position moving cylinder; meanwhile, the second material taking and placing device finishes placing the wafer on the second material placing device, and the second material placing device finishes clamping and rotating and positioning the wafer, and the defect detection cylinder moves the defect detection camera to the B position; the back measurement cylinder moves the back measurement camera to the B position- > defect detection camera to photograph the front side of the wafer; the back side camera shoots the back side of the wafer, the defect picture extraction module extracts a picture of the front side of the wafer and a picture of the back side of the wafer, the defect identification module identifies the picture of the front side of the wafer and the picture of the back side of the wafer, the detection position moving cylinder moves the first material placing device to the C position; meanwhile, the second discharging device is moved to the position B 'by the second detection displacement moving cylinder, and the defect detection camera is moved to the position B' by the defect detection cylinder; the back measurement cylinder moves the back measurement camera to the B' position- > the dotting cylinder drives the dotting machine to move to the C position, and the defect printing module controls the dotting machine to print the wafer defects found by the defect identification module on the wafer; meanwhile, a defect detection camera, a back side detection camera, is used for shooting the front side and the back side of the wafer on the placing device II, and identifying the defects of the front side picture and the back side picture of the wafer, and a detection position moving cylinder I is used for moving the placing device I to the A position; meanwhile, the second material placing device is moved to the position C' by the second detection displacement moving cylinder; the dotting cylinder drives the dotting machine to move to the C' position, the gear clutch cylinder of the first discharging device drives the gear clutch slider to move, so that the driving gear set is meshed with the elastic gear, the gear set driving device drives the driving gear set to rotate, the elastic gear is driven to rotate, the pitch adjusting screw rod connected with the elastic gear rotates, under the action of the positive thread and the negative thread of the pitch adjusting screw rod, the upper discharging disc and the lower discharging disc loosen the wafer, the material taking device and the rotating device drive the driving wheel to drive the belt to move and drive the discharging slider to move, so that the wafer of the first discharging device is positioned between the material taking fixing clamp and the material taking sliding clamp (including the material taking lifting cylinder driving the material taking frame to descend), the material taking cylinder drives the material taking sliding clamp to move, the wafer clamping device and the rotating device drive the driving wheel to drive the belt to move and drive the material discharging slider to move, and (2) moving the first material taking and placing device for clamping the wafer to the wafer box (wherein the first material taking and placing device comprises a material taking and placing lifting cylinder for driving the material taking and placing frame to ascend), and the second material taking and placing cylinder for driving the material taking and placing sliding clamp to move, placing the wafer into the wafer box (wherein the second material taking and placing lifting cylinder for driving the material taking and placing frame to descend), and simultaneously, carrying out defect dotting marking on the wafer on the second material taking device located at the C' position by the dotting machine, and repeating the steps to complete the detection of the wafer and the defect dotting marking.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (7)

1. A wafer detection device is characterized in that: the device comprises a base (1), a first detection position slide rail (34), a first detection position material taking and placing slide rail (33), a direction detection frame (6) and a dotting frame (23), wherein the first detection position slide rail, the first detection position material taking and placing slide rail, the direction detection frame and the dotting frame are respectively arranged on the base (1); a first detection position moving cylinder (4) is fixedly arranged on the first detection position sliding rail (34); a first placing seat (3) is arranged between the first detection position slide rail (34) and the first detection position material taking and placing slide rail (33) in a sliding mode; the first detection displacement moving cylinder (4) is connected with the first placing seat (3) and drives the first placing seat (3) to move between a first detection position sliding rail (34) and a first detection position material taking and placing sliding rail (33); a first material placing device (5) is arranged on the first placing seat (3) and used for placing a wafer and rotationally positioning the wafer; a first material taking and placing device (2) is arranged on one side of the first material taking and placing slide rail (33) of the detection position and used for taking a wafer from the wafer box and placing the wafer into the first placing device (5) or taking the wafer from the first placing device (5) and placing the wafer into the wafer box; a first direction detection bracket (7) is arranged on one side of the direction detection bracket (6) in a sliding manner; a first direction detection light source (10) and a first direction detection camera frame (8) are fixedly arranged on the first direction detection support (7) respectively; a first direction detection camera (9) is arranged on the first direction detection camera frame (8); a defect detection slide rail (17) is arranged on the other side of the direction detection frame (6); a defect detection bracket (19) is arranged on the defect detection slide rail (17) in a sliding manner; a defect detection light source (22) and a defect detection camera frame (20) are respectively and fixedly arranged on the defect detection bracket (19); a defect detection camera (21) is arranged on the defect detection camera frame (20); a dotting slide rail (24) is arranged on the dotting frame (23); a dotting seat (25) is arranged on the dotting slide rail (24) in a sliding manner; and a dotting machine (26) is arranged on the dotting seat (25).
2. The wafer inspection device of claim 1, wherein: the detection device also comprises a second detection position slide rail (35) arranged on the base (1); a second detection position moving cylinder (37) is fixedly arranged on the second detection position slide rail (35); a second placing seat (36) arranged between the second detection position slide rail (35) and the second detection position material taking slide rail (33) in a sliding manner; the second detection displacement moving cylinder (37) is connected with the second placing seat (36) and drives the second placing seat (36) to move between the second detection position sliding rail (35) and the second detection position material taking and placing sliding rail (33); a second placing device (11) is arranged on the second placing seat (36) and used for placing the wafer and rotationally positioning the wafer; a second material taking and placing device (38) is arranged on the other side of the material taking and placing slide rail (33) at the detection position and used for taking the wafer from the wafer box and placing the wafer into the second placing device (11) or taking the wafer from the second placing device (11) and placing the wafer into the wafer box; a second direction detection bracket (13) is arranged on the direction detection frame (6); a second direction detection light source (12) and a second sliding direction detection camera frame (14) are fixedly arranged on the second direction detection support (13) respectively; a second direction detection camera (15) is arranged on the second direction detection camera frame (14); a defect detection cylinder (18) is arranged on the direction detection frame (6); the defect detection cylinder (18) is connected with the defect detection bracket (19) and drives the defect detection bracket (19) to move on the defect detection slide rail (17); a dotting cylinder (27) is arranged on the dotting frame (23); the dotting cylinder (27) is connected with the dotting seat (25) and drives the dotting seat (25) to move on the dotting slide rail (24).
3. A wafer inspection apparatus as claimed in claim 1 or 2, wherein: a back side light source (28) is arranged on the base (1), and a back side slide rail (30) is arranged on the back side of the base (1); a back side camera frame (31) is arranged on the back side slide rail (30) in a sliding way; and a back measurement camera (29) is arranged on the back measurement camera frame (31).
4. The wafer inspection device of claim 3, wherein: a back side measuring cylinder (32) is arranged on the back side of the base (1); the back measurement cylinder (32) is connected with the back measurement camera frame (31) and drives the back measurement camera frame (31) to move on the back measurement slide rail (30).
5. The wafer inspection device of claim 4, wherein: the first material placing device (5) and the second material placing device (11) respectively comprise an upper material placing disc (506), a lower material placing disc (505) which is rotatably arranged on the first placing seat (3) or the second placing seat (36), a gear clutch sliding block (510) which is slidably arranged on the first placing seat (3) or the second placing seat (36), and a gear clutch cylinder (501), a direction adjusting driving device (508) and a direction adjusting belt pulley (509) which are fixedly arranged on the first placing seat (3) or the second placing seat (36); a distance adjusting screw rod is arranged between the feeding upper disc (506) and the feeding lower disc (505); the pitch adjusting screw rod is respectively provided with a positive thread and a negative thread; the feeding upper disc (506) and the feeding lower disc (505) are respectively connected with the positive thread and the negative thread of the pitch adjusting screw rod, the pitch adjusting screw rod is rotated, and the feeding upper disc (506) and the feeding lower disc (505) are close to or separated from each other; a loose and tight gear (504) is arranged on the distance adjusting screw rod; a driving gear set (503) and a gear set driving device (502) are arranged on the gear clutch sliding block (510), and the gear set driving device (502) drives the driving gear set (503) to rotate; the gear clutch cylinder (501) is connected with the gear clutch sliding block (510), and the gear clutch sliding block (510) is driven to move on the placing seat I (3) or the placing seat II (36) so that the driving gear set (503) is meshed with or separated from the elastic gear (504); the direction-adjusting driving device (508) is connected with the direction-adjusting belt pulley (509) and drives the direction-adjusting belt pulley (509) to rotate; a direction adjusting belt (507) is sleeved between the direction adjusting belt wheel (509) and the discharging lower disc (506).
6. The wafer inspection apparatus of claim 5, wherein: the material taking and placing device I (2) and the material taking and placing device II (38) respectively comprise a driving seat (201), a rotating seat (202), a rotating device (203) and a material taking and placing lifting cylinder (209), wherein the driving seat, the rotating seat and the rotating device are respectively and fixedly arranged on the material taking and placing slide rail (33) at the detection position; a driving shaft (205) is arranged on the driving seat (201) in a rotating way; -providing a drive wheel (206) on the drive shaft (205); a rotating shaft (204) is rotatably arranged on the rotating seat (202); a rotating wheel (207) is arranged on the rotating shaft (204); a belt (208) is sleeved between the driving wheel (206) and the rotating wheel (207); the belt (208) is connected with the material taking and placing lifting cylinder (209) to drive the material taking and placing lifting cylinder (209) to move on the material taking and placing slide rail (33) at the detection position; the rotating device (203) is in belt connection with the driving shaft (205) and drives the driving shaft (205) to rotate; a material taking and placing frame (210) is arranged on the material taking and placing lifting cylinder (209), and the material taking and placing lifting cylinder (209) drives the material taking and placing frame (210) to rise or fall; a material taking and placing cylinder (211), a material taking and placing fixing clamp (213) and a material taking and placing sliding clamp (212) are respectively and fixedly arranged on the material taking and placing frame (210); the material taking and placing cylinder (211) is connected with the material taking and placing sliding clamp (212), and the material taking and placing sliding clamp (212) is driven to move in the material taking and placing frame (210) to clamp or release the wafer.
7. The wafer inspection apparatus of claim 6, wherein: still include central control unit, central control unit includes:
the positioning picture extracting module is used for extracting wafer positioning pictures shot by the first direction detection camera (9) and the second direction detection camera (15);
the positioning identification module is used for analyzing whether the wafer notching direction of the wafer positioning picture meets the requirement or not;
the defect picture extraction module is used for extracting wafer pictures shot by the defect detection camera (21) and the back side camera (29);
the defect identification module is used for finding the wafer defects on the wafer picture;
the defect printing module is used for controlling the dotting machine (26) to print the wafer defects found by the defect identification module on the wafer;
and the work scheduling module is used for controlling the work of the detection position moving cylinder I (4), the detection position moving cylinder II (37), the defect detection cylinder (18), the dotting cylinder (27), the back detection cylinder (32), the rotating device (203), the material taking and discharging lifting cylinder (209), the material taking and discharging cylinder (211), the gear clutch cylinder (501), the gear set driving device (502) and the direction adjusting driving device (508).
CN202210350682.3A 2022-04-02 2022-04-02 Wafer detection device Pending CN114749390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210350682.3A CN114749390A (en) 2022-04-02 2022-04-02 Wafer detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210350682.3A CN114749390A (en) 2022-04-02 2022-04-02 Wafer detection device

Publications (1)

Publication Number Publication Date
CN114749390A true CN114749390A (en) 2022-07-15

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ID=82328510

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210350682.3A Pending CN114749390A (en) 2022-04-02 2022-04-02 Wafer detection device

Country Status (1)

Country Link
CN (1) CN114749390A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115629086A (en) * 2022-07-21 2023-01-20 创新奇智(重庆)科技有限公司 Wafer appearance detection machine
CN115728233A (en) * 2022-09-14 2023-03-03 深圳市智佳能自动化有限公司 Wafer detection platform and method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115629086A (en) * 2022-07-21 2023-01-20 创新奇智(重庆)科技有限公司 Wafer appearance detection machine
CN115728233A (en) * 2022-09-14 2023-03-03 深圳市智佳能自动化有限公司 Wafer detection platform and method thereof
CN115728233B (en) * 2022-09-14 2023-08-29 深圳市智佳能自动化有限公司 Wafer detection platform and method thereof

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