CN114743918A - Wafer vacuum adsorption rotating device with gas protection - Google Patents
Wafer vacuum adsorption rotating device with gas protection Download PDFInfo
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- CN114743918A CN114743918A CN202210446129.XA CN202210446129A CN114743918A CN 114743918 A CN114743918 A CN 114743918A CN 202210446129 A CN202210446129 A CN 202210446129A CN 114743918 A CN114743918 A CN 114743918A
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- motor
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- oil blanket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor equipment, in particular to a wafer vacuum adsorption rotating device with gas protection, which comprises a shell and a boss fixed in the shell, wherein a brushless direct current motor, a vacuum adsorption mechanism, a belt transmission mechanism and a blowing mechanism are assembled in the shell, the vacuum adsorption mechanism comprises an adsorption component and an air extraction component fixed at the bottom of the adsorption component, and the brushless direct current motor is linked with the air extraction component through the belt transmission mechanism. The motor is connected with the hollow shaft in a belt transmission mode, so that the motor is prevented from being positioned under a vacuum chuck, the motor is prevented from being isolated from chemical liquid by matching the bulges with the chuck retainer ring, nitrogen purging is carried out at the same time, and the O-shaped sealing ring is arranged on the vacuum chuck, so that the corrosion of the motor caused by the contact of the chemical liquid with the motor is avoided while the wafer rotates at a high speed, and the vacuum chuck has the advantages of simple structure, lower cost, excellent performance, wide application range and the like.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a wafer vacuum adsorption rotating device with gas protection.
Background
With the diversification of semiconductor processes, in the field of wafer processing, processes such as spin coating, developing, wet etching and the like need to be processed while the wafer rotates at a high speed, and chemical liquids such as glue solution, developing solution, etching solution and the like are processed on the surface of the wafer.
At present, the fixed mode that generally adopts vacuum adsorption of wafer, the wafer probably leads to the leakproofness not enough at high-speed rotatory in-process, can't satisfy the needs of evacuation, consequently at high-speed rotatory in-process, it is a challenge to guarantee the adsorbed high stability of wafer, and traditional wafer vacuum adsorption rotary device adopts the hollow shaft motor to drive the wafer rotatory, specifically for motor shaft one end directly drives the vacuum chuck rotatory, the other end is connected the vacuum channel and is carried out the evacuation to realize the wafer vacuum adsorption in rotatory in-process.
However, in the conventional vacuum chuck, if the flatness of the edge of the vacuum chuck is not good or the wafer to be adsorbed is warped, the wafer may be incompletely adsorbed in the edge area of the vacuum chuck, so that vacuum leakage occurs, and in a serious case, chemical liquid may be sucked into the hollow portion of the vacuum chuck along the leakage portion. The vacuum adsorption function of the traditional spin coating, developing and wet etching equipment is realized through the internal structure of the motor, namely, the hollow shaft of the hollow shaft motor is connected with the vacuum sucker, so that chemical liquid is easy to leak into the motor, and the motor is burnt out
To this end, chinese patent publication no: CN105291006A discloses a vacuum chuck capable of stably adsorbing a wafer, as shown in fig. 2, 11 is a hollow motor, 12 is a seal ring fixing ring, 13 is a seal ring, 14 is an O-ring, and 15 is a seal ring pressing plate. The lower end of the motor shaft is connected with an air suction connector 16, the upper end of the motor shaft is connected with a vacuum sucker 10, and the motor shaft is connected with the vacuum sucker through a hollow shaft of the motor to form a vacuum channel.
Patent ZL1020120106539 proposes a glue homogenizing machine capable of stably fixing and coating large-size samples, wherein a vacuum adsorption rotating device of the glue homogenizing machine mainly comprises a vacuum chuck 20, a driving motor 30, a driving shaft 31, a coupler 41 and the like, and the device adopts a hollow shaft motor, and the driving motor 30 is directly arranged under the vacuum chuck 20, and the device has poor blocking effect on coating liquid, if the coating liquid is sucked into the motor along the leakage part of the vacuum chuck 20, the driving motor 30 can be failed, a fire hazard can be generated in the driving motor 30, and even the coating liquid can be sucked into the vacuum pump, so that the damage to the vacuum pump can be caused, and the service life of the equipment can be greatly reduced.
Therefore, the traditional vacuum adsorption rotating device adopts the hollow shaft motor to be directly connected with the vacuum sucker, and the method is difficult to avoid chemical liquid from entering the motor, so that the motor is damaged. In addition, the hollow shaft motor has small market quantity and high price, the assembly space occupied by the hollow shaft motor in the device is large, the hollow shaft motor cannot use a servo motor, and only a universal motor with the rotating speed and the rotating angle control performance lower than that of the servo motor can be used, so that the rotating speed of the motor is difficult to control accurately. Therefore, the traditional vacuum adsorption device adopting the hollow shaft motor has great limitation, and the problem that chemical liquid enters the motor is solved.
Therefore, it is desirable to design a wafer vacuum adsorption rotation apparatus with gas protection to solve the above problems.
Disclosure of Invention
The invention aims to provide a wafer vacuum adsorption rotating device with gas protection, which aims to solve the problems that the vacuum adsorption device adopting a hollow shaft motor in the background art has great limitation and chemical liquid enters the motor.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a wafer vacuum adsorption rotary device who contains gas protection, includes the shell and fixes the boss in the shell inside, be equipped with brushless DC motor, vacuum adsorption mechanism, area drive mechanism and the mechanism of blowing in the shell and constitute, vacuum adsorption mechanism includes adsorption component and fixes the subassembly of bleeding in the adsorption component bottom, brushless DC motor passes through area drive mechanism and the subassembly interlock of bleeding, and the subassembly of blowing comprises Teflon pipe joint, Teflon pipe and Teflon partition plate joint, Teflon pipe joint passes through the thread tightening on the boss, Teflon partition plate joint passes through the thread tightening on the shell, the both ends of Teflon pipe respectively with Teflon pipe joint and Teflon pipe fixed connection.
Preferably, the adsorption component comprises a vacuum chuck and a fluororubber O-shaped sealing ring arranged on the vacuum chuck, and a through hole is formed in the axis of the vacuum chuck in a penetrating manner.
Preferably, the air exhaust assembly comprises a hollow shaft and an internal and external threaded joint, one end of the internal and external threaded joint is fixedly connected with the through hole through a thread, the other end of the internal and external threaded joint is fixedly connected with the hollow shaft, a first bearing is sleeved in the middle of the hollow shaft, and the middle of the hollow shaft is rotatably connected with the boss through the first bearing.
Preferably, the bottom of first bearing is rotated and is connected with rotary seal, and rotary seal includes skeleton oil blanket clamp plate, skeleton oil blanket, second bearing and skeleton oil blanket mount pad, skeleton oil blanket mount pad cover is established in the quill shaft bottom, just the skeleton oil blanket mount pad rotates with the quill shaft through the second bearing to be connected, skeleton oil blanket clamp plate passes through the threaded fixation in the bottom of skeleton oil blanket mount pad, the skeleton oil blanket sets up between skeleton oil blanket clamp plate and skeleton oil blanket mount pad, just the skeleton oil blanket cup joints on the quill shaft.
Preferably, the bottom of the framework oil seal pressing plate is fixed with an air pipe connector, the other end of the air pipe connector is fixed on the shell, and the inner cavity of the air pipe connector is communicated with the inner cavity of the hollow shaft.
Preferably, the upper surface of boss is fixed with first arch, first bellied inner chamber and the inner chamber intercommunication of teflon coupling, first bellied surface cover is equipped with the sucking disc retaining ring, just the sucking disc retaining ring is fixed on vacuum chuck's lower surface.
Preferably, the belt transmission mechanism comprises two synchronous belt wheels and a synchronous belt, the first synchronous belt wheel is sleeved on the hollow shaft, the other synchronous belt wheel is connected with the output end of the brushless direct current motor, two ends of the synchronous belt are respectively sleeved on the two synchronous belt wheels, the outer surface of the hollow shaft is sleeved with a fixing ring, and the fixing ring is abutted against the synchronous belt wheels.
Preferably, a fixing frame is fixed at the bottom of the brushless direct current motor, and the top end of the fixing frame is fixed on the boss.
Compared with the prior art, the invention has the beneficial effects that: the wafer vacuum adsorption rotating device with the gas protection transmits the power of the brushless direct current motor to the hollow shaft, a hollow shaft motor is not needed, the cost is greatly saved, the motor is prevented from being positioned under a vacuum chuck, and the motor is fundamentally prevented from being corroded by chemical liquid. Secondly the scheme is installed the O shape sealing washer on vacuum chuck, installs the vacuum chuck retaining ring in vacuum chuck lower part, cooperates the first arch of cavity again, carries out nitrogen gas simultaneously and sweeps for chemical liquid is difficult to get into the inside of cavity, avoids other important spare parts such as its corruption motor, makes the security of device greatly improve. The device has the advantages of simple structure, low cost, excellent performance, wide application range and the like.
Drawings
FIG. 1 is a schematic view of the entire structure of the present invention;
FIG. 2 is a schematic top view of the structure of the present invention;
FIG. 3 is a schematic cross-sectional front view of the structure at A-A of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of the structure at B in FIG. 3 according to the present invention;
FIG. 5 is an enlarged view of the structure at C in FIG. 4 according to the present invention.
In the figure: 1. a housing; 2. a vacuum chuck; 3. a suction cup retaining ring; 4. a Teflon pipe joint; 5. a Teflon tube; 6. a Teflon spacer joint; 7. a hollow shaft; 8. a fixed mount; 9. a first bearing; 10. a fixing ring; 11. a gas pipe joint; 12. a framework oil seal pressing plate; 13. framework oil seal; 14. a second bearing; 15. a framework oil seal mounting seat; 16. an internal and external threaded joint; 17. a first protrusion; 18. a boss; 19. a fluororubber O-ring seal; 20. a synchronous belt; 21. a synchronous pulley; 22. a brushless DC motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides an embodiment:
a wafer vacuum adsorption rotating device with gas protection comprises a vacuum sucker 2, a sucker retainer ring 3, a hollow shaft 7, a framework oil seal 13, a synchronous belt pulley 21, a synchronous belt 20, a Teflon pipe joint 4, a brushless direct current motor 22 and the like, wherein the vacuum sucker 2 is connected to the hollow shaft 7 with external threads through an internal and external thread joint 16;
the upper end of the hollow shaft 7 is arranged at the hollow part of the cavity 23 through the inner ring of the first bearing 9, the outer ring of the first bearing 9 is clamped on the stepped hole of the cavity 23 in an interference fit manner, the lower end of the hollow shaft 7 is arranged on the framework oil seal mounting seat 15 through the second bearing 4, and the outer ring of the second bearing 4 is fixed in the stepped hole of the framework oil seal mounting seat 15;
the outer ring of the framework oil seal 13 is arranged on the framework oil seal mounting seat 15 in an interference fit manner, the inner ring of the framework oil seal 13 tightly holds the hollow shaft 7 for sealing, the hollow shaft 7 is not in contact with the framework oil seal mounting seat 15, the framework oil seal pressing plate 12 is provided with a tubular protruding part for supporting the framework oil seal 13 on a step, so that the position of the framework oil seal is more stable, and meanwhile, the framework oil seal pressing plate has a better sealing effect, the air pipe connector 11 is screwed on the framework oil seal pressing plate 12, the framework oil seal pressing plate 12 is fixed on the framework oil seal mounting seat 15 through screws, the air pipe connector 11 can be connected to a partition plate connector through an air pipe, and then is connected with a vacuum pump through another air pipe, so that a vacuum channel from the vacuum sucker 2 to the air pipe connector 11 is formed; the framework oil seal mounting seat 15 is mounted on the motor fixing frame 8 through bolts, the motor fixing frame 8 is fixed at the middle interlayer of the cavity 23 through screws, the brushless direct current motor 22 is mounted on the motor fixing frame 8, the brushless direct current motor 22 is connected with the hollow shaft 7 through the synchronous belt pulley 21 and the synchronous belt 20, and the brushless direct current motor 22 and the synchronous belt pulley 21 on the hollow shaft 7 are axially positioned by the fixing ring 10.
The cavity 23 is cylindrical, the middle part of the cavity is provided with a first bulge 17 and a boss 18, the cylindrical side surface of the boss 18 is provided with an air inlet channel, the Teflon pipe joint 4 is arranged on the air inlet channel, the Teflon pipe joint 4 is connected with the Teflon partition plate joint 6 through the Teflon pipe 5, and the outer side of the Teflon partition plate joint 6 can be connected to a nitrogen generating device, so that a stable nitrogen channel is formed; the first bulge 17 and the sucker retainer ring 3 arranged at the lower part of the vacuum sucker 2 form a height difference which can prevent chemical liquid from entering a hollow hole of the cavity 23; a viton O-ring 19 is installed in the outermost gullies of the vacuum chuck 2 to prevent the chemical liquid from being sucked into the vacuum chuck 2 through the edge of the wafer 1 contacting the vacuum chuck 2.
The working principle of the invention is as follows: during the process, the wafer 1 is placed on the vacuum chuck 2 centrally, so that a vacuum passage is formed from the vacuum chuck 2 to the air pipe connector 11, the vacuum pump is turned on to perform vacuum pumping, the wafer 1 is adsorbed on the vacuum chuck 2, and the backside of the wafer 1 contacts with the viton O-ring 19 at the outermost side of the vacuum chuck 2 to form a seal, so as to prevent the chemical liquid from being sucked into the vacuum chuck 2 along the backside of the wafer 1.
It is worth mentioning that the motor fixing frame and the hollow shaft are machined parts which are made of stainless steel; the framework oil seal pressing plate and the framework oil seal mounting seat are machined parts and are made of 7075 aluminum alloy; the cavity, the vacuum sucker and the sucker retainer ring are all made of NPP (polypropylene), all parts possibly contacted with chemical liquid are subjected to Teflon surface treatment, and the Teflon surface treatment device can be used in occasions of strong acid, strong alkali and the like, so that the application range is very wide.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a wafer vacuum adsorption rotary device who contains gas protection, includes shell (1) and fixes boss (18) inside shell (1), its characterized in that: be equipped with brushless DC motor (22), vacuum adsorption mechanism, belt drive mechanism and the mechanism of blowing in shell (1) and constitute, vacuum adsorption mechanism includes adsorption component and fixes the subassembly of bleeding in the adsorption component bottom, brushless DC motor (22) are through belt drive mechanism and the subassembly interlock of bleeding, and the subassembly of blowing comprises teflon coupling (4), teflon pipe (5) and teflon baffle joint (6), teflon coupling (4) are fixed on boss (18) through the screw thread, teflon baffle joint (6) are fixed on shell (1) through the screw thread, the both ends of teflon pipe (5) respectively with teflon coupling (4) and teflon pipe (5) fixed connection.
2. The wafer vacuum chucking rotary apparatus with gas shield as recited in claim 1, wherein: the adsorption component consists of a vacuum chuck (2) and a fluororubber O-shaped sealing ring (19) arranged on the vacuum chuck (2), and a through hole is formed in the axis of the vacuum chuck (2) in a run-through manner.
3. The wafer vacuum chucking rotary apparatus with gas shield as recited in claim 2, wherein: the air extraction assembly comprises a hollow shaft (7) and an inner and outer threaded connector (16), one end of the inner and outer threaded connector (16) is fixedly connected with the through hole through threads, the other end of the inner and outer threaded connector (16) is fixedly connected with the hollow shaft (7), a first bearing (9) is sleeved in the middle of the hollow shaft (7), and the middle of the hollow shaft (7) is rotatably connected with a boss (18) through the first bearing (9).
4. The wafer vacuum chucking rotary apparatus with gas shield as recited in claim 3, wherein: the bottom of first bearing (9) is rotated and is connected with rotary seal, and rotary seal includes skeleton oil blanket clamp plate (12), skeleton oil blanket (13), second bearing (14) and skeleton oil blanket mount pad (15), skeleton oil blanket mount pad (15) cover is established in quill shaft (7) bottom, just skeleton oil blanket mount pad (15) are rotated with quill shaft (7) through second bearing (14) and are connected, skeleton oil blanket clamp plate (12) are fixed in the bottom of skeleton oil blanket mount pad (15) through the screw thread, skeleton oil blanket (13) set up between skeleton oil blanket clamp plate (12) and skeleton oil blanket mount pad (15), just skeleton oil blanket (13) cup joint on quill shaft (7).
5. The wafer vacuum chucking rotary apparatus with gas shield as recited in claim 4, wherein: the bottom of the framework oil seal pressing plate (12) is fixed with an air pipe connector (11), the other end of the air pipe connector (11) is fixed on the shell (1), and the inner cavity of the air pipe connector (11) is communicated with the inner cavity of the hollow shaft (7).
6. The wafer vacuum chucking rotary apparatus with gas shield as recited in claim 1, wherein: the upper surface of boss (18) is fixed with first arch (17), the inner chamber of first arch (17) and the inner chamber intercommunication of special fluorine coupling (4), the surface cover of first arch (17) is equipped with sucking disc retaining ring (3), just sucking disc retaining ring (3) are fixed on the lower surface of vacuum chuck (2).
7. The wafer vacuum chucking apparatus of claim 1, wherein: the belt transmission mechanism comprises two synchronous belt wheels (21) and a synchronous belt (20), the first synchronous belt wheel (21) is sleeved on the hollow shaft (7), the other synchronous belt wheel (21) is connected with the output end of the brushless direct current motor (22), the two ends of the synchronous belt (20) are respectively sleeved on the two synchronous belt wheels (21), the outer surface of the hollow shaft (7) is sleeved with a fixing ring (10), and the fixing ring (10) is abutted to the synchronous belt wheels (21).
8. The wafer vacuum chucking rotary apparatus with gas shield as recited in claim 1, wherein: the bottom of the brushless direct current motor (22) is fixed with a fixing frame (8), and the top end of the fixing frame (8) is fixed on the boss (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210446129.XA CN114743918A (en) | 2022-04-26 | 2022-04-26 | Wafer vacuum adsorption rotating device with gas protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210446129.XA CN114743918A (en) | 2022-04-26 | 2022-04-26 | Wafer vacuum adsorption rotating device with gas protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114743918A true CN114743918A (en) | 2022-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210446129.XA Pending CN114743918A (en) | 2022-04-26 | 2022-04-26 | Wafer vacuum adsorption rotating device with gas protection |
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| CN (1) | CN114743918A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241114A (en) * | 2022-08-17 | 2022-10-25 | 常熟市兆恒众力精密机械有限公司 | Crystal disc clamp |
-
2022
- 2022-04-26 CN CN202210446129.XA patent/CN114743918A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241114A (en) * | 2022-08-17 | 2022-10-25 | 常熟市兆恒众力精密机械有限公司 | Crystal disc clamp |
| CN115241114B (en) * | 2022-08-17 | 2023-10-10 | 常熟市兆恒众力精密机械有限公司 | Crystal disc clamp |
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