CN114733718A - Dispensing method, semiconductor packaging method and dispensing machine - Google Patents
Dispensing method, semiconductor packaging method and dispensing machine Download PDFInfo
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- CN114733718A CN114733718A CN202210472831.3A CN202210472831A CN114733718A CN 114733718 A CN114733718 A CN 114733718A CN 202210472831 A CN202210472831 A CN 202210472831A CN 114733718 A CN114733718 A CN 114733718A
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 447
- 238000004026 adhesive bonding Methods 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 230000033001 locomotion Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention provides a glue dispensing method, a semiconductor packaging method and a glue dispenser, wherein the glue dispensing method is used for dispensing glue in a chip mounting area on a chip carrier plate, and the glue dispensing method comprises the following steps: adjusting the glue yield according to the thickness of the chip mounting area; when the mounting region is thin, the glue discharging amount is increased, the problem of electric performance influence caused by insufficient glue discharging amount below the chip is reduced, when the mounting region is thick, the glue discharging amount is reduced, the problem of chip welding pad pollution caused by excessive glue discharging amount below the chip is greatly reduced, the quality of a final semiconductor packaging structure is improved, and the productivity of a production line is improved.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a glue dispensing method, a semiconductor packaging method and a glue dispenser.
Background
The semiconductor packaging method comprises a chip mounting process, wherein glue is dispensed in a chip mounting area of a chip carrier plate, and then the chip is mounted. At present, the problem of poor thickness uniformity exists in a chip carrier plate, that is, only a single point of thickness on the chip carrier plate can meet the requirement of the thickness of the chip carrier plate of 200 +/-30 um, a thick place on the whole chip carrier plate is thicker, a thin place is thinner, and the maximum height difference can reach 60 um.
When mounting operation is carried out, machine parameters are certain, namely the glue yield is certain, the chip mounting height is certain, the actual glue thickness of a thinner part of the chip carrier plate is thinner due to the uneven thickness of the whole chip carrier plate, after chip mounting, the chip mounting glue cannot completely coat the lower surface of the chip, and the risk of abnormal electrical performance is caused; the actual glue thickness of the thicker part of the chip carrier plate is thicker, and after the chip carrier plate is mounted, the glue overflow amount is too large, so that the chip welding pad can be polluted. When the machine detects that the glue overflow amount is too much or too little, an alarm is triggered, and the machine needs to be reset to continue operation.
In view of the above, it is desirable to provide a new dispensing method, a semiconductor packaging method, and a dispenser to solve the above problems.
Disclosure of Invention
The invention aims to provide a dispensing method, a semiconductor packaging method and a dispensing machine.
In order to achieve the purpose, the invention adopts the following technical scheme: a glue dispensing method is used for dispensing glue in a chip mounting area on a chip carrier plate, and comprises the following steps: and adjusting the glue outlet amount according to the thickness of the mounting area.
As a further improved technical scheme of the invention, the 'adjustment of the glue yield' is specifically as follows: the size of the glue inlet on the glue outlet nozzle is adjusted to adjust the glue outlet amount.
As a further improved technical scheme of the invention, the step of adjusting the glue outlet amount according to the thickness of the chip mounting area specifically comprises the following steps: the glue outlet amount of a first glue outlet positioned in the middle on the glue outlet nozzle is adjusted according to the thickness of the mounting area, and meanwhile, the glue outlet amount of a second glue outlet positioned on the peripheral side of the first glue outlet is unchanged.
As a further improved technical scheme of the present invention, "adjusting the glue outlet amount of the first glue outlet positioned in the middle on the glue outlet nozzle according to the thickness of the mounting area" specifically includes: the number of the glue inlets which are shielded by the adjusting piece and communicated with the first glue outlet is controlled according to the thickness of the mounting area so as to adjust the glue outlet amount of the first glue outlet.
As a further improved technical scheme of the present invention, "controlling the number of glue inlets communicating with the first glue outlet and shielded by the adjusting member according to the thickness of the mounting region" specifically includes:
driving the dispenser to move until the glue outlet nozzle is positioned at a preset position;
the driving piece is movably arranged at the first glue outlet to contact the chip mounting area, and the adjusting piece connected with the driving piece in a linkage manner is driven to move so as to control the number of glue inlets which are shielded by the adjusting piece and communicated with the first glue outlet.
As a further improved technical scheme of the invention, the step of driving the adjusting member in linkage connection with the driving member to move by contacting the driving member movably arranged at the first glue outlet with the chip mounting area specifically comprises the following steps:
when the thickness T of the chip mounting area is in the interval (T)1，T2) When the driving piece contacts the chip mounting area, the adjusting piece shields the glue inlet communicated with the first glue outlet; when the thickness T of the chip mounting area is not more than T1When the first glue outlet is communicated with the first glue outlet, the driving part moves downwards to contact the chip mounting area, and drives the adjusting part to move downwards to open all the glue inlets communicated with the first glue outlet; when the thickness T of the chip mounting area is not less than T2When the first glue outlet is communicated with the first glue outlet, the driving piece contacted with the chip mounting area moves upwards to drive the adjusting piece to move upwards to shield all the glue inlets communicated with the first glue outlet.
As a further improved technical scheme of the invention, the adjusting piece is spherical, and when the thickness T of the chip mounting area is positioned in the interval (T)1，T2) When the first glue outlet is closed, the adjusting piece moves upwards to cover the glue inlet; when the thickness T of the chip mounting area is not less than T2When the adjusting piece moves upwards, the adjusting piece shields the glue inlet communicated with the first glue outlet and the glue inlet at the side in the circumferential direction of the glue inlet.
As a further improved technical scheme of the invention, the driving piece is spherical, and a glue outlet gap is formed between the driving piece and the first glue outlet.
In order to achieve the above object, the present invention further provides a semiconductor packaging method, which includes a dispensing step using the above dispensing method.
In order to achieve the above object, the present invention further provides a dispensing machine for dispensing glue in a chip mounting area on a chip carrier, wherein the dispensing machine includes a glue outlet, and the glue outlet includes:
the bottom of the shell is provided with a glue outlet;
the adjusting part, the adjusting part is located in the casing, the adjusting part is including the driving piece that can acquire the regional thickness of mounting, adjust according to the regional thickness of mounting the play regulation piece of gluing the volume of gluing of mouth.
As a further improved technical scheme of the invention, the glue outlet comprises a first glue outlet positioned in the middle and a second glue outlet positioned on the peripheral side of the first glue outlet; the glue outlet nozzle is provided with a first glue outlet channel communicated with the first glue outlet and a second glue outlet channel communicated with the second glue outlet, and the adjusting assembly is arranged in the first glue outlet channel to adjust the glue outlet amount of the first glue outlet.
As a further improved technical scheme of the invention, a first glue inlet communicated with the first glue outlet channel and a second glue inlet communicated with the second glue outlet channel are also arranged in the shell; the driving piece is movably arranged at the first glue outlet along the vertical direction, and the lower end of the driving piece is positioned at the outer side of the first glue outlet so as to contact the chip mounting area; the regulating part with the driving piece is connected in a linkage manner, and the regulating part is close to the first glue inlet and is arranged to regulate the size of the first glue inlet.
As a further improved technical scheme of the invention, one of the adjusting piece and the first glue outlet channel is provided with a support frame protruding towards the other, and the support frame is used for limiting the lowest position of the adjusting piece moving downwards.
As a further improved technical scheme, the support frame is hollow.
As a further improved technical scheme of the invention, the adjusting piece is spherical; the glue outlet nozzle also comprises a separator arranged in the shell, and the first glue outlet channel is formed in the separator; the top of the separator is provided with a concave elastic part, and the first glue inlet comprises a top glue inlet arranged on the elastic part and a plurality of side glue inlets arranged at intervals in the circumferential direction of the elastic part; when the adjusting piece moves upwards to the highest position, the elastic part is driven to deform upwards, and the adjusting piece shields the jacking glue opening and the side glue inlet.
As a further improved technical scheme, the adjusting assembly further comprises a connecting rod for connecting the driving piece and the adjusting piece.
As a further improved technical scheme of the invention, the driving piece is spherical, and a glue outlet gap is formed between the driving piece and the first glue outlet.
The invention has the beneficial effects that: the glue dispensing method can adjust the glue discharging amount according to the thickness of the chip mounting area, increase the glue discharging amount when the chip mounting area is thin, and reduce the problem of electric performance influence caused by insufficient glue below the chip.
Drawings
FIG. 1 is a cross-sectional view of a dispensing nozzle in a dispenser of the present invention;
fig. 2 is a schematic view of dispensing by using the glue outlet nozzle in fig. 1.
Detailed Description
The present invention will be described in detail with reference to the embodiments shown in the drawings, and reference is made to fig. 1-2, which illustrate preferred embodiments of the present invention. It should be noted that these embodiments do not limit the invention, and the functional, method, or structural equivalents and substitutions that are made by those skilled in the art according to these embodiments are all within the scope of the invention.
It should be noted that the words for expressing the position and direction described in the present invention refer to the end of the dispensing nozzle facing the chip carrier during dispensing as "lower" and "bottom", and refer to the end of the dispensing nozzle away from the chip carrier during dispensing as "upper" and "top". Meanwhile, the terms first, second, etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
Referring to fig. 1-2, the present invention provides a dispensing method, that is, a corresponding dispensing machine employs the dispensing method of the present invention to dispense a dispensing glue on a chip mounting area 201 on a chip carrier 20, that is, dispensing a mounting glue, so as to fix a chip on the chip mounting area 201 by the mounting glue.
The dispensing method comprises the following steps: the glue yield is adjusted according to the thickness of the die bonding area 201. The point gum machine that corresponds can the adaptability adjust out the volume of gluing when the operation, and when mounting region 201 is thinner, the increase goes out the volume of gluing, reduces the influence electrical property problem that the not enough volume of gluing of chip below leads to, when mounting region 201 is thicker, reduces out the volume of gluing, and the problem of the too much pollution chip weld pad that leads to of the volume of gluing of greatly reduced chip below improves final semiconductor package structure's quality, promotes the productivity of production line.
Further, the glue outlet nozzle 10 in the dispenser has a glue inlet for feeding glue and a glue outlet for discharging glue. The "adjusting the glue yield" specifically comprises: the size of the glue inlet on the glue outlet nozzle 10 is adjusted to adjust the glue outlet amount. Get into out through the regulation and glue the volume and pass through in order to adjust finally the play of the mouth of gluing is glued the volume, is guaranteed the play of the mouth of gluing glues the area, promptly, certainly go out to glue mouthful a little to the mounting of the regional 201 of mounting and glue and can cover the regional 201 of mounting avoids the chip below certain side mounting to glue the influence electrical property problem that not enough leads to.
Further, the glue outlet has a first glue outlet 11 located in the middle and a second glue outlet 12 located on the peripheral side of the first glue outlet 11, and the "adjusting the glue outlet amount according to the thickness of the mounting area 201" specifically includes: the glue outlet amount of the first glue outlet 11 positioned in the middle of the glue outlet nozzle 10 is adjusted according to the thickness of the loading area 201, and meanwhile, the glue outlet amount of the second glue outlet 12 positioned on the peripheral side of the first glue outlet 11 is unchanged. Further guarantee go out the play of gluing mouthful glue the area, promptly, certainly go out the gluey mouthful point of gluing to the mounting of the regional 201 of mounting glue can cover in circumference the regional 201 of mounting, even be located the centre first play is glued mouthful 11 and is not gone out to glue, and the mounting glue has mobility and removes from the centre and cover wholly the regional 201 of mounting avoids the chip below a certain side mounting to glue the influence electrical property problem that not enough leads to.
Meanwhile, in the invention, the thickness of the chip mounting area 201 is sensed by the driving part 21 movably arranged at the first glue outlet 11 contacting the chip mounting area 201, that is, the thickness of the chip mounting area 201 corresponding to the first glue outlet 11 is obtained, so that the glue outlet amount of the first glue outlet 11 is adjusted, and the problem of uneven thickness of the chip mounting area 201 can be compensated by controlling the glue outlet amount in a targeted manner.
Correspondingly, the glue inlet in the glue outlet nozzle 10 comprises a first glue inlet 15 corresponding to the first glue outlet 11 and a second glue inlet 16 corresponding to the second glue outlet 12, and the glue outlet channel in the glue outlet nozzle 10 also comprises a first glue outlet channel 13 communicating the first glue inlet 15 with the first glue outlet 11 and a second glue outlet channel 14 communicating the second glue inlet 16 with the second glue outlet 12.
Specifically, the glue outlet nozzle 10 has an adjusting member 22 disposed near the first glue inlet 15, and the size of the first glue inlet 15 is adjusted by the adjusting member 22 to adjust the glue outlet amount of the first glue outlet 11. Of course, this is not a limitation.
In one embodiment, the number of the first glue inlets 15 communicating with the first glue outlets 11 is plural, and the "adjusting the glue outlet amount of the first glue outlet 11 located in the middle on the glue outlet 10 according to the thickness of the mounting area 201" specifically includes: the number of glue inlets communicated with the first glue outlet 11 and shielded by the adjusting piece 22 is controlled according to the thickness of the mounting area 201, so as to adjust the glue outlet amount of the first glue outlet 11. Of course, the size of the first glue inlet 15 may be adjusted by adjusting the area of the first glue inlet 15 covered by the adjusting member 22, and the size of the first glue inlet 15 may also be adjusted in other embodiments.
It is known that the "glue inlet connected to the first glue outlet 11" refers to the first glue inlet 15.
Further, "the number of the glue inlets communicating with the first glue outlet 11 and shielded by the adjusting member 22 according to the thickness of the mounting region 201" is specifically:
driving the dispenser to move until the glue outlet 10 is located at a preset position;
the driving part 21 movably arranged at the first glue outlet 11 contacts the chip mounting area 201, so that the adjusting part 22 connected with the driving part 21 in a linkage manner is driven to move, and the number of glue inlets communicated with the first glue outlet 11 and shielded by the adjusting part 22 is controlled.
Specifically, the driving part 21 is linked with the adjusting part 22 through a connecting rod 23, so that the driving part 21 can move up and down to drive the adjusting part 22 to move up and down. Move down to the in-process of presetting the position at play jiao zui 10, driving piece 21 contact dress piece region 201 go out jiao zui 10 with during the regional 201 relative movement of dress piece, driving piece 21 removes, drives regulating part 22 synchronous motion strengthens out the reliability of gluing the volume regulation, and the play jiao zui 10's that corresponds simple structure.
It can be known that the driving member 21 movably disposed at the first glue outlet 11 is at the lowest position under the action of its own gravity. After the glue nozzle 10 is located at the preset position, the driving member 21 will contact the die bonding area 201 and move according to the thickness of the die bonding area 201.
When the thickness of the mounting region 201 satisfies the thickness requirement, that is, the thickness T of the mounting region 201 is within the interval (T)1，T2) When the glue outlet nozzle 10 moves downwards to a preset position, the driving part 21 is in contact with the chip mounting area 201 and moves upwards relative to the chip mounting area 201, after the glue outlet nozzle 10 moves to the preset position, the driving part 21 drives the adjusting part 22 to shield the glue inlet with a part communicated with the first glue outlet 11, and at the moment, the first glue outlet 11 is a normal glue outlet amount, namely, the glue outlet is a normal glue outlet amount. When the die bonding area 201 is thin, that is, the thickness T in the die bonding area 201 is not more than T1The driving member 21 is located at the lowest position, and the adjusting member 22 is also located at the corresponding lowest positionAnd placing the chip to open all the glue inlets communicated with the first glue outlet 11, and increasing the glue outlet amount of the first glue outlet 11, namely increasing the glue outlet amount of the glue outlet so as to reduce the problem of influence on electrical performance caused by insufficient glue amount below the chip. When the die bonding area 201 is thicker, that is, the thickness T of the die bonding area 201 is not less than T2When the glue outlet nozzle 10 moves downwards to a preset position, the driving piece 21 is in contact with the mounting area 201 and is opposite to the mounting area 201 moving upwards to drive the adjusting piece 22 to move upwards to a corresponding highest position to shield all glue inlets communicated with the first glue outlet 11, so that the glue outlet amount of the first glue outlet 11 is reduced, namely the glue outlet amount of the glue outlet is reduced, the problem of chip welding pad pollution caused by excessive glue amount below the chip is greatly reduced, the quality of a final semiconductor packaging structure is improved, and the productivity of a production line is improved.
In one embodiment, the T is1275 μm, said T2295 μm. Of course, this is not a limitation.
In a specific embodiment, the adjusting member 22 is spherical, the first glue inlet 15 includes a glue inlet 151 located at the top of the separating member 3 of the first glue inlet 15 in the glue outlet 10, and a plurality of glue inlet 152 located at the circumferential side of the glue inlet 151 and arranged at intervals, the top of the separating member 3 has a recessed elastic portion 31, and the glue inlet 151 is located on the elastic portion 31. When the adjusting member 22 is at the lowest position, the top glue inlet 151 and the side glue inlet 152 are both in an open state. When the adjusting member 22 moves upward, the adjusting member 22 shields the glue ejecting port 151 first, and if the adjusting member 22 continues to move upward, the elastic portion 31 is driven to deform upward, and when the adjusting member 22 moves to the highest position, the adjusting member 22 shields the glue ejecting port 151 and the side glue inlet 152.
Specifically, as shown in fig. 2, when the thickness T of the die bonding region 201 is in the interval (T)1，T2) When the thickness of the chip carrier 20 is within the predetermined range, the adjusting member 22 moves upward to cover the glue-ejecting opening 151, and the side-entry is closedThe glue inlet 152 can normally feed glue so that the glue outlet has a normal glue outlet amount. When the thickness T of the die bonding region 201b is not less than T2When the thickness of the first glue outlet 11 is too thick, the adjusting member 22 moves upward and shields the glue inlet 151 and the glue inlet 152 communicated with the first glue outlet 11, so as to reduce the glue outlet amount of the first glue outlet 11. When the thickness T of the chip-mounting region 201a is not more than T1When the adjusting member 22 is at the lowest position, the top glue inlet 151 and the side glue inlet 152 are both in a communicating state.
According to the dispensing method, the adjusting piece 22 is driven to move by the driving piece 21 movably arranged at the first dispensing opening 11 contacting the chip mounting area 201, so that the dispensing amount can be adaptively adjusted, when the chip mounting area 201 is thin, the dispensing amount is increased, the problem of electric performance influence caused by insufficient dispensing amount below a chip is reduced, when the chip mounting area 201 is thick, the dispensing amount is reduced, the problem of chip welding pad pollution caused by excessive dispensing amount below the chip is greatly reduced, the quality of a final semiconductor packaging structure is improved, and the productivity of a production line is improved; and the reliability is high.
Furthermore, the invention also provides a semiconductor packaging method which comprises the dispensing step adopting the dispensing method.
The dispensing method is as described above, and besides the dispensing steps, other steps of the semiconductor packaging method, such as wire bonding, plastic packaging, etc., can follow the existing steps, and are not described herein again.
Further, as shown in fig. 1-2, the present invention further provides a dispenser, which is configured to dispense glue on the chip mounting area 201 of the chip carrier 20 by using the above-mentioned dispensing method.
The dispensing machine comprises a glue outlet nozzle 10, wherein the glue outlet nozzle 10 comprises a shell 1 and an adjusting component 2 arranged in the shell 1. Have out the passageway of gluing, be located the mouth that advances of passageway upside of gluing, be located the play mouth of gluing passageway bottom in the casing 1, when the point gum machine operation, the mounting is glued certainly advance the mouth of gluing and get into go out behind the passageway warp go out the mouth of gluing and flow out.
It should be noted that, the dispensing machine of the present invention can use the existing dispensing machine except the glue outlet 10, and the description is omitted here.
The adjusting assembly 2 comprises a driving part 21 capable of acquiring the thickness of the chip mounting area 201 and an adjusting part 22 for adjusting the glue outlet amount of the glue outlet according to the thickness of the chip mounting area 201. Therefore, the glue dispenser can adjust the glue discharging amount according to the thickness adaptability of the mounting area 201 during operation, when the mounting area 201 is thin, the glue discharging amount is increased, the problem of electric performance influence caused by insufficient glue discharging amount below the chip is reduced, when the mounting area 201 is thick, the glue discharging amount is reduced, the problem of chip welding pads pollution caused by excessive glue discharging amount below the chip is greatly reduced, the quality of a final semiconductor packaging structure is improved, and the productivity of a production line is improved.
Further, the glue outlet comprises a first glue outlet 11 located in the middle and a second glue outlet 12 located on the peripheral side of the first glue outlet 11. Correspondingly, the glue outlet channel comprises a first glue outlet channel 13 communicated with the first glue outlet 11 and a second glue outlet channel 14 communicated with the second glue outlet 12, and the glue inlet comprises a first glue inlet 15 communicated with the first glue outlet channel 13 and a second glue inlet 16 communicated with the second glue outlet channel 14.
Specifically, the glue outlet nozzle 10 further comprises a partition 3 arranged in the housing 1, the first glue outlet channel 13 is formed in the partition 3, the first glue inlet 15 is arranged at the top of the partition 3, and the first glue outlet 11 is arranged at the bottom of the partition 3.
Further, the adjusting component 2 is disposed in the first glue outlet channel 13 to adjust the glue outlet amount of the first glue outlet 11. Namely, when the dispensing machine performs dispensing operation, the glue outlet amount of the glue outlet nozzle 10 is adjusted by adjusting the glue outlet amount of the first glue outlet 11, and the glue outlet amount of the second glue outlet 12 is kept unchanged. Guarantee go out the gluey area of play of jiao kou, promptly, certainly go out gluey mouthful point to the mounting of the regional 201 of mounting and glue can cover in circumference mounting region 201, even be located the centre first play jiao kou 11 does not go out glues, and the mounting carries out the reflow soldering after, and under the cohesive force that the mounting was glued and the effect that the metal received the infiltration attribute, the mounting is glued and can be removed to the centre and cover wholly mounting region 201 avoids the influence electrical property problem that chip below certain side mounting glue is not enough to lead to.
Meanwhile, the driving part 21 in the adjusting assembly 2 obtains the thickness of the mounting area 201 corresponding to the first glue outlet 11, so that the glue outlet amount of the first glue outlet 11 is adjusted, and the problem of uneven thickness of the mounting area 201 can be compensated by controlling the glue outlet amount in a targeted manner.
Of course, this is not a limitation. It can be understood that the position of the adjusting component 2 can be correspondingly set according to the glue outlet amount of the glue outlet which needs to be adjusted.
In one embodiment, the driving member 21 is movably disposed at the first glue outlet 11 along the vertical direction, and the lower end of the driving member 21 is located outside the first glue outlet 11 to contact the die bonding area 201; the adjusting piece 22 is linked with the driving piece 21, and the adjusting piece 22 is close to the first glue inlet 15 to adjust the size of the first glue inlet 15. The driving part 21 contacted with the chip mounting area 201 moves up and down to drive the adjusting part 22 to move up and down so as to adjust the size of the first glue inlet 15. That is, in the process that the glue outlet nozzle 10 moves downwards to the preset position, the driving member 21 contacts the mounting area 201, when the glue outlet nozzle 10 moves relative to the mounting area 201, the driving member 21 moves to drive the adjusting member 22 to move synchronously, so that the reliability of glue outlet amount adjustment is enhanced, and the corresponding glue outlet nozzle 10 is simple in structure.
Meanwhile, in the invention, the amount of the mounting glue entering the first glue outlet channel 13 is adjusted by adjusting the size of the first glue inlet 15, so as to adjust the glue outlet amount finally passing through the first glue outlet 11.
Further, the number of the first glue inlets 15 is plural, and the adjusting member 22 controls the number of the first glue inlets 15 shielded by the adjusting member 22 according to the thickness of the mounting area 201, so as to adjust the glue outlet amount of the first glue outlet 11. Of course, the present invention is not limited thereto, and in other embodiments, the first glue inlet 15 may be provided as an integral one glue inlet, and the size of the first glue inlet 15 may be adjusted by adjusting the area of the first glue inlet 15 covered by the adjusting member 22.
It can be known that the driving member 21 movably disposed at the first glue outlet 11 is at the lowest position under the action of its own gravity. After the glue nozzle 10 is located at the preset position, the driving member 21 will contact the die bonding area 201 and move according to the thickness of the die bonding area 201.
When the thickness of the mounting region 201 satisfies the thickness requirement, that is, the thickness T of the mounting region 201 is within the interval (T)1，T2) When the glue outlet nozzle 10 moves downwards to a preset position, the driving part 21 contacts with the chip mounting area 201 and moves upwards relative to the chip mounting area 201, and after the glue outlet nozzle 10 moves to the preset position, the driving part 21 drives the adjusting part 22 to shield a glue inlet with a part communicated with the first glue outlet 11, at the moment, the first glue outlet 11 is a normal glue outlet amount, namely, the glue outlet is a normal glue outlet amount. When the die bonding area 201 is thin, that is, the thickness T in the die bonding area 201 is not more than T1When the first glue outlet 11 is opened, the glue outlet amount of the first glue outlet 11 is increased, that is, the glue outlet amount of the first glue outlet is increased, so as to reduce the problem of the electrical performance influence caused by insufficient glue below the chip. When the die bonding area 201 is thicker, that is, the thickness T of the die bonding area 201 is not less than T2When the glue outlet nozzle 10 moves downwards to a preset position, the driving piece 21 is in contact with the mounting area 201 and is opposite to the mounting area 201 moving upwards to drive the adjusting piece 22 to move upwards to a corresponding highest position to shield all glue inlets communicated with the first glue outlet 11, so that the glue outlet amount of the first glue outlet 11 is reduced, namely the glue outlet amount of the glue outlet is reduced, the problem of chip welding pad pollution caused by excessive glue amount below the chip is greatly reduced, the quality of a final semiconductor packaging structure is improved, and the productivity of a production line is improved.
In one embodiment, the adjustment member 22 is spherical. The top of the separator 3 has a concave elastic portion 31, and the first glue inlet 15 includes a top glue inlet 151 disposed on the elastic portion 31 and a plurality of side glue inlets 152 disposed at intervals in the circumferential direction of the elastic portion 31. When the adjusting member 22 is at the lowest position, the top glue inlet 151 and the side glue inlet 152 are both in an open state. When the adjusting member 22 moves upward, the adjusting member 22 shields the glue ejecting port 151 first, if the adjusting member 22 continues to move upward, the elastic portion 31 is driven to deform upward, when the adjusting member 22 moves to the highest position, the elastic portion 31 is driven to deform upward, and the adjusting member 22 shields the glue ejecting port 151 and the glue side inlet 152.
Specifically, as shown in fig. 2, when the thickness T of the die bonding region 201 is in the interval (T)1，T2) When the thickness of the chip carrier 20 is within the predetermined range, the adjusting member 22 moves upward to shield the glue inlet 151, and at this time, the glue inlet 152 can normally feed glue to make the glue outlet have a normal glue outlet amount. When the thickness T of the die bonding region 201b is not less than T2When the thickness of the first glue outlet 11 is too thick, the adjusting member 22 moves upward and shields the glue inlet 151 and the glue inlet 152 communicated with the first glue outlet 11, so as to reduce the glue outlet amount of the first glue outlet 11. When the thickness T of the chip-mounting region 201a is not more than T1When the adjusting member 22 is at the lowest position, the top glue inlet 151 and the side glue inlet 152 are both in a communicating state.
Further, one of the adjusting member 22 and the first glue outlet channel 13 is provided with a support frame 4 protruding toward the other, and the support frame 4 is used for limiting the lowest position of the adjusting member 22 moving downwards. To avoid the adjusting member 22 from closing the first glue outlet channel 13.
In one embodiment, the supporting frame 4 is connected to the adjusting element 22 or the first glue outlet channel 13 only, that is, when the supporting frame 4 protrudes from the adjusting element 22 toward the first glue outlet channel 13, there is no connection between one end of the supporting frame 4 facing the first glue outlet channel 13 and the first glue outlet channel 13, and when the adjusting element 22 moves upward, the supporting frame 4 is driven to separate from the first glue outlet channel 13. When the supporting frame 4 protrudes from the first glue outlet channel 13 toward the adjusting part 22, there is no connection between one end of the supporting frame 4 facing the adjusting part 22 and the adjusting part 22, and when the adjusting part 22 moves upward, the adjusting part 22 is separated from the supporting frame 4. Thus, the support frame 4 can restrict the lowest position where the adjusting member 22 moves down, and can not interfere with the upward movement of the adjusting member 22. Certainly, the present invention is not limited to this, in other embodiments, two ends of the supporting frame 4 may also be connected to the adjusting element 22 and the first glue outlet channel 13, and in this case, a part of the structure of the supporting frame 4 may be flexible or telescopic, so that the supporting frame 4 can both limit the lowest position where the adjusting element 22 moves down and can also not interfere with the upward movement of the adjusting element 22.
Further, the support frame 4 is hollow so as not to affect the circulation of the chip mounting glue in the first glue outlet channel 13.
Further, the driving member 21 is spherical, and a glue outlet gap is formed between the driving member 21 and the first glue outlet 11. The driving member 21 can be prevented from damaging the chip carrier 20 when contacting the chip carrier 20, and meanwhile, the first glue outlet 11 can be ensured to smoothly discharge glue.
Further, the adjusting assembly 2 further includes a connecting rod 23 connecting the driving member 21 and the adjusting member 22, so that the driving member 21 and the adjusting member 22 are linked, and thus the driving member 21 can move up and down to drive the adjusting member 22 to move up and down. In the process that the glue outlet nozzle 10 moves downwards to the preset position, the driving part 21 contacts the chip mounting area 201, and when the glue outlet nozzle 10 and the chip mounting area 201 move relatively, the driving part 21 moves to drive the adjusting part 22 to move synchronously, so that the reliability of glue outlet amount adjustment is enhanced.
Compared with the prior art, the glue dispensing method can adjust the glue discharging amount according to the thickness of the chip mounting area 201, increase the glue discharging amount when the chip mounting area 201a is thin, and reduce the problem of electric performance influence caused by insufficient glue below a chip, reduce the glue discharging amount when the chip mounting area 201b is thick, greatly reduce the problem of chip welding pad pollution caused by excessive glue below the chip, improve the quality of a final semiconductor packaging structure, and improve the productivity of a production line.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (17)
1. A glue dispensing method is used for dispensing glue in a chip mounting area on a chip carrier plate, and is characterized in that: the dispensing method comprises the following steps: and adjusting the glue outlet amount according to the thickness of the mounting area.
2. The dispensing method of claim 1, wherein: the 'adjustment of the glue yield' is as follows: the size of the glue inlet on the glue outlet nozzle is adjusted to adjust the glue outlet amount.
3. The dispensing method of claim 1, wherein: the specific method for adjusting the glue yield according to the thickness of the mounting area comprises the following steps: the glue outlet amount of a first glue outlet positioned in the middle on the glue outlet nozzle is adjusted according to the thickness of the mounting area, and meanwhile, the glue outlet amount of a second glue outlet positioned on the peripheral side of the first glue outlet is unchanged.
4. The dispensing method of claim 3, wherein: the glue outlet quantity of the first glue outlet positioned in the middle on the glue outlet nozzle is adjusted according to the thickness of the mounting area, and the method specifically comprises the following steps: the number of the glue inlets which are shielded by the adjusting piece and communicated with the first glue outlet is controlled according to the thickness of the mounting area so as to adjust the glue outlet amount of the first glue outlet.
5. The dispensing method of claim 4, wherein: the number of the glue inlets which are communicated with the first glue outlet and shielded by the adjusting piece is controlled according to the thickness of the mounting area, and the number of the glue inlets is specifically as follows:
driving the dispenser to move until the glue outlet nozzle is positioned at a preset position;
the driving piece is movably arranged at the first glue outlet to contact the chip mounting area, and the adjusting piece connected with the driving piece in a linkage manner is driven to move so as to control the number of glue inlets which are shielded by the adjusting piece and communicated with the first glue outlet.
6. The dispensing method of claim 5, wherein: "set up in the driving piece contact mounting region of first play jiao kou department through the activity, drive with the regulating part that the driving piece linkage is connected removes" specifically does:
when the thickness T of the chip mounting area is in the interval (T)1，T2) When the driving piece contacts the chip mounting area, the adjusting piece shields the glue inlet communicated with the first glue outlet; when the thickness T of the chip mounting area is not more than T1When the first glue outlet is communicated with the first glue outlet, the driving part moves downwards to contact the chip mounting area, and drives the adjusting part to move downwards to open all the glue inlets communicated with the first glue outlet; when the thickness T of the chip mounting area is not less than T2When the first glue outlet is communicated with the first glue outlet, the driving piece contacted with the chip mounting area moves upwards to drive the adjusting piece to move upwards to shield all the glue inlets communicated with the first glue outlet.
7. The dispensing method of claim 6, wherein: the adjusting piece is spherical, and when the thickness T of the chip mounting area is in the interval (T)1，T2) When the first glue outlet is closed, the adjusting piece moves upwards to cover the glue inlet; when the thickness T of the chip mounting area is not less than T2When the adjusting piece moves upwards, the adjusting piece shields the rubber jacking port communicated with the first rubber outlet and is positionedAnd a side glue inlet in the circumferential direction of the glue inlet is ejected.
8. The dispensing method of any of claims 5-7, wherein: the driving piece is spherical, and a glue outlet gap is formed between the driving piece and the first glue outlet.
9. A semiconductor packaging method, characterized by: the semiconductor packaging method comprises a dispensing step using the dispensing method according to any one of claims 1 to 8.
10. A dispensing machine is used for dispensing in a chip mounting area on a chip carrier plate and comprises a dispensing nozzle; the method is characterized in that: the glue outlet nozzle comprises:
the bottom of the shell is provided with a glue outlet;
the adjusting part, the adjusting part is located in the casing, the adjusting part is including the driving piece that can acquire the regional thickness of mounting, adjust according to the regional thickness of mounting the play regulation piece of gluing the volume of gluing of mouth.
11. The dispenser of claim 10, wherein: the glue outlet comprises a first glue outlet positioned in the middle and a second glue outlet positioned on the periphery of the first glue outlet; the glue outlet nozzle is provided with a first glue outlet channel communicated with the first glue outlet and a second glue outlet channel communicated with the second glue outlet, and the adjusting assembly is arranged in the first glue outlet channel to adjust the glue outlet amount of the first glue outlet.
12. The dispenser of claim 11, wherein: the shell is also internally provided with a first glue inlet communicated with the first glue outlet channel and a second glue inlet communicated with the second glue outlet channel; the driving piece is movably arranged at the first glue outlet along the vertical direction, and the lower end of the driving piece is positioned at the outer side of the first glue outlet so as to contact the chip mounting area; the regulating part with the driving piece is connected in a linkage manner, and the regulating part is close to the first glue inlet and is arranged to regulate the size of the first glue inlet.
13. The dispenser of claim 12, wherein: one of the adjusting piece and the first glue outlet channel is provided with a support frame protruding towards the other, and the support frame is used for limiting the lowest position of the adjusting piece moving downwards.
14. The dispenser of claim 13, wherein: the support frame is hollow.
15. The dispenser of claim 12, wherein: the adjusting piece is spherical; the glue outlet nozzle also comprises a separator arranged in the shell, and the first glue outlet channel is formed in the separator; the top of the separator is provided with a concave elastic part, and the first glue inlet comprises a top glue inlet arranged on the elastic part and a plurality of side glue inlets arranged at intervals in the circumferential direction of the elastic part; when the adjusting piece moves upwards to the highest position, the elastic part is driven to deform upwards, and the adjusting piece shields the jacking glue opening and the side glue inlet.
16. The dispenser of claim 12, wherein: the adjusting assembly further comprises a connecting rod connecting the driving piece and the adjusting piece.
17. The dispenser of claim 12, wherein: the driving piece is spherical, and a glue outlet gap is formed between the driving piece and the first glue outlet.
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| CN114733718B (en) | 2024-04-02 |
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