CN114724957A - Isolated guide plating process for ceramic packaging body - Google Patents
Isolated guide plating process for ceramic packaging body Download PDFInfo
- Publication number
- CN114724957A CN114724957A CN202210151557.XA CN202210151557A CN114724957A CN 114724957 A CN114724957 A CN 114724957A CN 202210151557 A CN202210151557 A CN 202210151557A CN 114724957 A CN114724957 A CN 114724957A
- Authority
- CN
- China
- Prior art keywords
- isolated
- ceramic
- plate
- polishing
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000007747 plating Methods 0.000 title claims abstract description 15
- 238000005498 polishing Methods 0.000 claims abstract description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005266 casting Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000004080 punching Methods 0.000 claims abstract description 8
- 239000002002 slurry Substances 0.000 claims abstract description 8
- 238000005219 brazing Methods 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 238000001465 metallisation Methods 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract 2
- 238000007517 polishing process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides an isolated guide plating process for a ceramic packaging body, which comprises the following steps: preparing ceramic slurry, injecting the ceramic slurry into a casting machine for casting to form a green belt material, and cutting the green belt material into a plate blank; punching and grouting each plate blank, printing a corresponding line on each plate blank, laminating and cutting; the plate blank is respectively printed with circuits, so that a needed lead is metalized and led out from one bottom plate, and the punching hole is used for communicating the isolated conducting area on the bottom plate with the other bottom plate so that the isolated conducting area is led out from the other bottom plate for conduction; performing end printing, and connecting the lead with the isolated conductor and the sealing area in a metallization manner; and sintering is carried out; carrying out chemical nickel plating, assembling, brazing and electroplating, and finally polishing the end head to obtain a ceramic packaging body; so that no bump exists on the bonding region of the chip.
Description
Technical Field
The invention relates to an isolated guide plating process for a ceramic packaging body.
Background
The existing method adopts gold wire bonding and plating-leading arc-leading mode; by adopting the mode, the gold wire on the bonding is not easy to remove, and the product has salient points, thereby influencing the use of users; if the salient points need to be completely removed, the requirement on the process is high, the requirement on attention concentration of staff is very strict, and otherwise, the phenomenon that the salient points are not cleaned cleanly is very easy to occur on the product.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an isolated guide plating process for a ceramic packaging body, so that no salient point exists on a bonding area and a chip bonding area.
The invention is realized by the following steps: an isolated guide plating process for a ceramic package body comprises the following steps:
and 4, carrying out chemical nickel plating, assembling, brazing and electroplating, and finally polishing the end head to obtain the ceramic packaging body.
Further, the polishing in the step 4 requires providing a polishing device, wherein the polishing device comprises a polishing machine, a pedestal, a three-dimensional moving mechanism, a fixing plate, a polishing table and a baffle plate, and the polishing machine is placed on a workbench;
the pedestal is fixed on the workbench and positioned on one side of the grinding machine; the three-dimensional moving mechanism is fixed to the pedestal;
the fixing plate is arranged on the three-dimensional moving mechanism;
the polishing table is arranged on the fixing plate; a guide groove is arranged on the polishing table; one end part of the guide groove is attached to the baffle;
the baffle is arranged on one side face of the fixing plate, an opening is formed in the baffle, a grinding disc is arranged on the grinding machine, and the grinding disc penetrates through the opening;
and placing the sintered ceramic packaging body on the guide groove, and then polishing the end head of the ceramic packaging body by a polisher.
Further, the polishing table is detachably arranged on the fixing plate.
Further, the three-dimensional moving mechanism is a precision displacement sliding table.
The invention has the following advantages: through the process, the bonding area and the chip bonding area are not provided with the salient points, the polishing device is used for preventing the phenomenon of ceramic lack in the polishing process, the technical requirements on polishing workers do not exist, the polishing position can be limited, the product is more attractive, workers only need to place the ceramic packaging body on a pedestal of the polishing device and then tightly press the ceramic packaging body to polish the end of the ceramic packaging body, the polishing depth and the polishing position are consistent, the baffle is arranged, the hands of the workers can be effectively protected, the workers can be on duty without training, and the cost of enterprises is greatly reduced.
Drawings
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic view of a base sheet of the present invention;
FIG. 3 is a schematic view of another backsheet of the present invention;
FIG. 4 is a schematic view of an unpolished end of the present invention;
FIG. 5 is a schematic view of a polished tip of the present invention;
FIG. 6 is a front view of the grinding apparatus of the present invention;
figure 7 is a side view of the grinding device of the present invention.
Detailed Description
As shown in fig. 1, the isolated guide plating process for ceramic package body of the present invention comprises the following steps:
and 4, carrying out chemical nickel plating, assembling, brazing and electroplating, and finally polishing the end d to obtain a ceramic packaging body which is a ceramic shell of which the end d is not polished yet as shown in fig. 4, and polishing the end d by half as shown in fig. 5 after polishing.
As shown in fig. 6 and 7, in the step 4, a grinding device is required to be provided, the grinding device comprises a grinding machine 1, a pedestal 2, a three-dimensional moving mechanism 3, a fixing plate 4, a grinding table 5 and a baffle 6, the grinding machine 1 is placed on a working table a, and the three-dimensional moving mechanism 3 is a precision displacement sliding table;
the pedestal 2 is fixed on the worktable a and is positioned at one side of the sander 1; the three-dimensional moving mechanism 3 is fixed to the pedestal 2;
the fixing plate 4 is arranged on the three-dimensional moving mechanism 3;
the polishing table 5 is detachably arranged on the fixing plate 4; a guide groove 51 is arranged on the grinding table 5; one end part of the guide groove 51 is attached to the baffle 6, and the ceramic packaging bodies of which the ends are required to be polished have various types and different sizes, so that the guide groove 51 can be adapted to the ceramic packaging bodies by arranging various polishing tables 5 and arranging the guide grooves 51 with different sizes on the polishing tables 5, and the corresponding polishing tables 5 can be replaced during polishing, so that the ceramic packaging bodies cannot shake in the polishing process;
baffle 6 is located 4 a side of fixed plate, just be equipped with an opening 61 on the baffle 6, be equipped with mill 11 on the polisher 1, mill 11 passes opening 61.
After knowing the model of the ceramic package body that needs to polish, the platform 5 of polishing that corresponds is changed, later through adjusting three-dimensional moving mechanism 3, make fixed plate 4 adjustment position, make baffle 6 definite with the relative position of mill 11, make the end that the ceramic package body needs to polish just to mill 11, later open polisher 1, later place the ceramic package body in the guide way 51 on platform 5 of polishing through the staff, then impel to baffle 6 direction, make the end of ceramic package body polished by mill 11, after accomplishing to polish, place new ceramic package body and carry out next end and polish.
Although specific embodiments of the invention have been described above, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the appended claims.
Claims (4)
1. An isolated guide plating process for a ceramic packaging body is characterized in that: the method comprises the following steps:
step 1, preparing ceramic slurry, injecting the ceramic slurry into a casting machine for casting to form a green strip, and cutting the green strip into a plate blank;
step 2, punching and grouting each plate blank, printing a corresponding line on each plate blank, and then laminating and cutting; the plate blank is respectively printed with circuits, so that a needed lead is metalized and led out from one bottom plate, and the punching hole is used for communicating the isolated conducting area on the bottom plate with the other bottom plate so that the isolated conducting area is led out from the other bottom plate for conduction;
step 3, end printing is carried out, and the lead is connected with the isolated conductor and the sealing area in a metallization mode; and sintering is carried out;
and 4, carrying out chemical nickel plating, assembling, brazing and electroplating, and finally polishing the end head to obtain the ceramic packaging body.
2. The isolated lead plating process for ceramic packages according to claim 1, wherein: in the step 4, a grinding device is required to be provided for grinding, the grinding device comprises a grinding machine, a pedestal, a three-dimensional moving mechanism, a fixing plate, a grinding table and a baffle plate, and the grinding machine is placed on a workbench;
the pedestal is fixed on the workbench and positioned on one side of the grinding machine; the three-dimensional moving mechanism is fixed to the pedestal;
the fixing plate is arranged on the three-dimensional moving mechanism;
the polishing table is arranged on the fixing plate; a guide groove is arranged on the polishing table; one end part of the guide groove is attached to the baffle;
the baffle is arranged on one side face of the fixing plate, an opening is formed in the baffle, a grinding disc is arranged on the grinding machine, and the grinding disc penetrates through the opening;
and placing the sintered ceramic packaging body on the guide groove, and then polishing the end head of the ceramic packaging body by a polisher.
3. The isolated lead plating process for ceramic packages according to claim 2, wherein: the polishing platform is detachably arranged on the fixing plate.
4. The isolated lead plating process for ceramic packages according to claim 2, wherein: the three-dimensional moving mechanism is a precision displacement sliding table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210151557.XA CN114724957A (en) | 2022-02-18 | 2022-02-18 | Isolated guide plating process for ceramic packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210151557.XA CN114724957A (en) | 2022-02-18 | 2022-02-18 | Isolated guide plating process for ceramic packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114724957A true CN114724957A (en) | 2022-07-08 |
Family
ID=82236146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210151557.XA Pending CN114724957A (en) | 2022-02-18 | 2022-02-18 | Isolated guide plating process for ceramic packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114724957A (en) |
-
2022
- 2022-02-18 CN CN202210151557.XA patent/CN114724957A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213468458U (en) | Full-automatic point gum machine based on production of PCB board | |
| CN106553063A (en) | Compressor steel valve plate Integral producing apparatus and its using method | |
| CN211992356U (en) | Automatic glue grinding device | |
| CN203875187U (en) | Chip shaping device | |
| CN114724957A (en) | Isolated guide plating process for ceramic packaging body | |
| CN207770576U (en) | Cylinder sleeve punching tool | |
| CN206276801U (en) | For the compound unloading mechanism of flange positioning of car panel die | |
| CN114769414B (en) | Semiconductor forming and separating die | |
| CN216989658U (en) | Bending machine for chip pins | |
| CN207058298U (en) | It is a kind of to be machined special damping grinding machine | |
| CN206702673U (en) | Clamping device for processing mold workpiece pressing inclined-plane | |
| CN215544267U (en) | Flanging hole stamping die capable of removing burrs | |
| CN213198070U (en) | Ceramic multifunctional processing platform of large press | |
| CN218679781U (en) | Automatic chip mounter for integrated circuit packaging | |
| CN114789409A (en) | Automatic feeding mechanism for grinding outer chamfer of ceramic cleaver | |
| CN206104680U (en) | Embedded mould of drift | |
| CN209598836U (en) | One kind being conveniently replaceable polishing pad wolfram steel stick peripheral milling fine grinding device | |
| CN209206109U (en) | A kind of Kato shaping tool | |
| CN218875126U (en) | Pinhole type ceramic CBN grinding wheel and forming device | |
| CN207770592U (en) | A kind of production transfer line for automobile rear case | |
| CN211363542U (en) | Auxiliary material tool is pasted to push type | |
| CN205551197U (en) | Smart die stamping device | |
| CN205551912U (en) | Eye cream container metal head processing equipment | |
| KR100736655B1 (en) | Process for press forming small case | |
| CN217192512U (en) | A mould for producing amorphous SMT support plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |