CN217192512U

CN217192512U - A mould for producing amorphous SMT support plate

Info

Publication number: CN217192512U
Application number: CN202221006698.4U
Authority: CN
Inventors: 杜朝晖; 王荣胜; 陈凯
Original assignee: Anhui Haofang Electromechanics Co Ltd
Current assignee: Anhui Haofang Electromechanics Co Ltd
Priority date: 2022-04-28
Filing date: 2022-04-28
Publication date: 2022-08-16
Anticipated expiration: 2032-04-28

Abstract

The utility model provides a mould for producing amorphous SMT support plate: it is including corresponding complex cover half (1) and movable mould (2), its characterized in that: the die-casting die is characterized in that a support plate forming groove (3) is formed in the movable die (2), the support plate forming groove (3), a group of material flow channels (4) and a group of exhaust passages (5) are formed, and one end of each material flow channel (4) is communicated with a material injection cylinder (6) of the die-casting machine. The novel die-casting forming machine has the advantages of convenience in operation, high production efficiency and high product yield, and solves the problem that the basic forming process cannot solve by adopting a novel front edge forming process-amorphous die-casting process.

Description

A mould for producing amorphous SMT support plate

The technical field is as follows:

this novel production field that sets up amorphous SMT support plate specifically speaking is exactly a mould for producing amorphous SMT support plate.

Background art:

SMT surface mount technology is the most popular technology and process in the electronics assembly industry. Reflow soldering is a key process in SMT production, and mechanical and electrical connection between the soldering end of the surface-mounted component and the PCB pad is realized by melting solder paste on the circuit board pad to form an electrical loop. In order to ensure that good electrical connection is achieved when the surface mount device and the bonding pads corresponding to the PCB are subjected to reflow soldering again, and the surface mount device and the PCB have enough mechanical strength, the surface mount device and the bonding pads corresponding to the PCB are required to be placed on the SMT carrier plate in a unified manner to be compressed and fixed one by one after being in one-to-one correspondence, and then the surface mount device and the PCB are stably connected together by melting solder paste through a reflow soldering furnace along with the SMT carrier plate, so that the SMT carrier plate plays a vital role in ensuring that the surface mount device and the PCB are connected.

The SMT carrier plate has higher plane requirement, generally less than 0.05mm, and if the planeness of the SMT carrier plate is too large, the PCB has welding defects of incomplete welding, insufficient welding, component tilting and the like, so that the product quality is influenced. The manufacturing process of the SMT carrier plate generally adopts stainless steel plate stamping, then milling processing is carried out, and finally double-side grinding is carried out, so that the whole processing process is long in time consumption, the material utilization rate is low, and few products capable of meeting the flatness requirement exist in the produced products, and the yield is low.

The utility model has the following contents:

the utility model provides a mold for producing amorphous SMT carrier plates and a using method thereof for overcoming the defects in the prior art.

The application provides the following technical scheme:

a mould for producing amorphous SMT support plate: it is including corresponding complex cover half and movable mould, its characterized in that: the movable die is provided with a support plate forming groove, the support plate forming groove, a group of material flow passages and a group of exhaust passages, one end of each material flow passage is communicated with a material injection cylinder of the die casting machine, and a group of thimble through holes correspondingly matched with thimbles of the die casting machine are further arranged in the material flow passages.

On the basis of the technical scheme, the following further technical scheme can be provided:

the material flow channels comprise main flow channels distributed on two sides of the support plate forming groove, a group of branch flow grooves are distributed between the main flow grooves and the support plate forming groove, and one end of each main flow groove is communicated with the material injection cylinder of the die casting machine.

The group of exhaust passages comprise first exhaust passages distributed at the upper end part and the lower end part of the support plate forming groove, and second exhaust passages are distributed at the outer side of each material flow passage.

The support plate molding groove is internally provided with a group of first cylinders, a group of second cylinders, a group of third cylinders and a fourth cylinder, the group of first cylinders and the group of second cylinders are arranged in the support plate molding groove in a matrix-shaped staggered manner, the third cylinders are distributed at the end parts of the two ends of the support plate molding groove, and the fourth cylinders are distributed at one side of the length edge of the support plate molding groove.

The diameter of one end of the main flow groove is larger than that of the other end of the main flow groove, and a water-drop-shaped groove body extends out of the other end of the main flow groove. The thimble through holes are distributed at the bottom of the main runner.

Utility model advantage:

the utility model discloses convenient operation has, production efficiency is high, the product yield is high, adopts emerging amorphous die casting technology once only with the product shaping to perfect replication mould's precision, make the product have higher size precision, only need assist a small amount of CNC processing simultaneously can, but greatly reduced manufacturing cost. Amorphous SMT support plate has higher plane degree, can satisfy below the plane degree 0.05mm through the test, and hardness can reach about HV460, and the process is simple, and process time is short, and material utilization is high, can accomplish near shaping, is favorable to guaranteeing that welding defects such as incomplete, rosin joint, component perk are stood up can not appear in the PCB board to guarantee product quality.

Description of the drawings:

fig. 1 is a schematic structural view of a middle moving die of the present invention;

FIG. 2 is a schematic structural diagram of the fixed mold in the present invention;

FIG. 3 is a schematic view of the fixed mold and the movable mold when the fixed mold and the movable mold are assembled;

FIG. 4 is a schematic structural diagram of an amorphous SMT carrier plate blank after die casting;

fig. 5 shows a finished structure of an amorphous SMT carrier.

The specific implementation mode is as follows:

as shown in fig. 1-5, a mold for producing an amorphous SMT carrier plate: it includes can install and corresponds complex cover half 1 and movable mould 2 on the die casting machine. The fixed die 1 is of a flat structure, and a first abdicating groove 1b correspondingly matched with the material injection barrel 6 is formed in the lower end of the fixed die. A temperature control medium runner 1a is arranged in each of the fixed die 1 and the movable die 2, and an inlet and an outlet of the temperature control medium runner 1a are communicated with a die temperature controller on one side of a die casting machine through pipelines. As both are prior art, nothing is done here to avoid redundancy.

The lower end of the movable die 2 is provided with a second abdicating groove 2a correspondingly matched with the material injection cylinder 6, and the matching surface of the movable die 2 and the fixed die 1 is provided with a support plate forming groove 3, a group of material flow passages 4 and a group of exhaust passages 5. A group of first cylinders 3a, a group of second cylinders 3b, a group of third cylinders 3c and a fourth cylinder 3d vertically extend in the carrier plate forming groove 3.

The group of first cylinders 3a and the group of second cylinders 3b are arranged in the carrier plate forming groove 3 in a matrix shape in a staggered manner. The first column 3a corresponds to a finished circuit mounting hole a of the amorphous SMT carrier plate, and the second column 3b corresponds to a finished magnet mounting hole b.

The third cylinder 3c is distributed at the end parts of two ends in the support plate forming groove 3 and corresponds to a positioning hole c after the finished product of the non-crystal SMT support plate, and the fourth cylinder is distributed at one side of the length edge of the support plate forming groove 3 and corresponds to a laser two-dimensional code slide mounting hole d after the finished product of the non-crystal SMT support plate.

The group of material flow channels 4 comprise main flow channels 4a distributed on two sides of the carrier plate forming groove 3, one ends of the two main flow channels 4a are communicated with a material injection cylinder 6 of a die casting machine located below the fixed die 1, the diameter of the main flow channel 4a at the end is larger, the diameter of the main flow channel 4a is gradually reduced towards the other end, and a water drop-shaped groove body 4c is further extended from the top of the other end so that part of residual gas can be pressed into the main flow channel 4a during die casting. Three branch grooves 4b communicated with the carrier plate forming groove 3 are distributed on one side of the main flow groove 4 a. A push rod 6a is arranged in the material injection cylinder 6, the end part of the push rod 6a is connected with a material injection plug 6b, and the push rod drives the material injection plug to move so as to press the liquid material flowing into the material injection cylinder into the main runner.

The group of exhaust passages 5 includes a pair of first exhaust passages 5a and a pair of second exhaust passages 5 b. The first exhaust ducts 5a are respectively distributed at the upper end and the lower end of the carrier plate forming groove 3 and are communicated with the first exhaust ducts 5a of the carrier plate forming groove 3. The second exhaust ducts 5b are distributed on the other side of each main flow groove 4a and communicated with the main flow groove 4a, and materials cannot enter because the first exhaust ducts 5a and the pair of second exhaust ducts 5b are small in hole diameter.

And a group of thimble through holes 4d correspondingly matched with thimbles of the die casting machine are distributed at the bottom of the main runner 4 a. After the fixed die and the movable die are separated, an ejector pin of the die-casting machine can extend out of the ejector pin through hole to eject the die-cast amorphous SMT carrier plate blank out of the carrier plate forming groove 3, so that the amorphous SMT carrier plate blank can be taken out by a tool.

And finally, cutting off residual materials formed on two sides of the amorphous SMT carrier plate, wherein the residual materials comprise an x part and a z part corresponding to the shapes of the material flow channel and the discharging end of the material injection cylinder. And then polishing and flattening the cut part to obtain the amorphous SMT carrier plate. The cutting part is a communication part of the branch flow groove and the carrier plate forming groove.

Claims

1. The utility model provides a mould for producing amorphous SMT support plate, includes corresponding complex cover half (1) and movable mould (2), its characterized in that: the die casting machine is characterized in that a support plate forming groove (3) is formed in the movable die (2), the support plate forming groove (3), a group of material flow channels (4) and a group of exhaust passages (5) are formed, one end of each material flow channel (4) is communicated with an injection cylinder (6) of the die casting machine, and a group of thimble through holes (4 d) corresponding to and matched with thimbles of the die casting machine are formed in the material flow channels (4).

2. A mold for producing an amorphous SMT carrier plate according to claim 1, wherein: a set of material runner (4) distributes between mainstream groove (4 a) and support plate shaping groove (3) and has a set of branch chute (4 b) including mainstream groove (4 a) that distributes in support plate shaping groove (3) both sides, the one end of mainstream groove (4 a) and notes feed cylinder (6) intercommunication of die casting machine.

3. A mold for producing an amorphous SMT carrier plate according to claim 1, wherein: the group of exhaust passages (5) comprises first exhaust passages (5 a) distributed at the end parts of the upper end and the lower end of the carrier plate forming groove (3), and second exhaust passages (5 b) are further distributed on the outer side of each material flow passage (4).

4. A mold for producing an amorphous SMT carrier plate according to claim 1, wherein: support plate shaping groove (3) in still distribute and have a set of first cylinder (3 a), a set of second cylinder (3 b), a set of third cylinder (3 c) and a fourth cylinder (3 d), a set of first cylinder (3 a) and a set of second cylinder (3 b) become matrix form dislocation arrangement in support plate shaping groove (3), both ends tip in support plate shaping groove (3) is distributed in third cylinder (3 c), and the fourth cylinder distributes in one side on support plate shaping groove (3) length limit.

5. A mold for producing an amorphous SMT carrier plate according to claim 2, wherein: the diameter of one end of the main flow groove (4 a) is larger than that of the other end of the main flow groove, and a drop-shaped groove body (4 c) extends out of the other end of the main flow groove (4 a).

6. A mold for producing an amorphous SMT carrier plate according to claim 2, wherein: the thimble through holes (4 d) are distributed at the bottom of the main flow groove (4 a).