CN114720733B

CN114720733B - Solid-liquid mixed aluminum electrolytic capacitor life test switching PCB

Info

Publication number: CN114720733B
Application number: CN202210637777.3A
Authority: CN
Inventors: 景俊峰; 丰骏; 钱鹏; 杨振江; 季张林; 沙雪飞; 柏林林; 成俊烽
Original assignee: NANTONG JIANGHAI CAPACITOR CO Ltd
Current assignee: NANTONG JIANGHAI CAPACITOR CO Ltd
Priority date: 2022-06-08
Filing date: 2022-06-08
Publication date: 2022-09-09
Anticipated expiration: 2042-06-08
Also published as: CN114720733A

Abstract

The invention provides a solid-liquid mixed aluminum electrolytic capacitor life test switching PCB which comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are overlapped to form a base body, an insulating area and two electrode areas are symmetrically arranged on two planes far away from each other of the first substrate and the second substrate, a plurality of connecting holes penetrating through the first substrate and the second substrate are arranged in the electrode areas, copper layers are plated in the electrode areas and the connecting holes, a plugging part and a first welding part are also arranged on the electrode areas, the plugging part is a gold layer plated on the copper layer, and a plurality of welding holes convenient for lead capacitors of different specifications to be directly plugged are arranged in the first welding part. According to the through PCB for the solid-liquid mixed aluminum electrolytic capacitor life test, the first welding part and the second welding part are arranged on the base body, so that the through PCB can be compatible with products with all current diameters, including lead type follow-up sheets, and in the installation process, leads are not stressed and only need to be welded once.

Description

Solid-liquid mixed aluminum electrolytic capacitor life test switching PCB

Technical Field

The invention relates to the technical field of capacitors, in particular to a service life test switching PCB of a solid-liquid mixed aluminum electrolytic capacitor.

Background

Along with the technical progress and the market demand, the solid-liquid mixed aluminum electrolytic capacitor is more and more widely applied. The solid-liquid mixed capacitor has the characteristics of small size and high frequency and large ripple waves. The conventional life test method faces some problems due to the large ripple.

As shown in fig. 1, the conventional method uses a lead wire of a lead wire capacitor 1 to be directly inserted into a jig 2 on a test apparatus for electrical connection. Firstly, the lead is not matched with the clamp, and can be plugged and pulled only after being subjected to external expansion and bending, so that the lead is stressed and the performance of a product is possibly influenced; secondly, the diameter of the lead is small, the contact area between the lead and the clamp is small due to a direct insertion mode, the contact resistance is large, the heating is obvious under large ripples, and the service life test of a product is influenced; thirdly, when testing midway, all need plug the product, the lead wire can atress many times, causes the product damage, produces the product property and influences, and the life-span is longer, and the pilot scale is more frequent, and the influence is big.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: in order to overcome the defects in the prior art, the invention provides a switching PCB for a service life test of a solid-liquid mixed aluminum electrolytic capacitor.

The technical scheme adopted for solving the technical problems is as follows: the utility model provides a solid-liquid mixture aluminum electrolytic capacitor life test switching PCB board, includes first base plate and second base plate, first base plate and second base plate are folded and are established the formation base member, the symmetry is equipped with insulating zone and two electrode areas on the biplane that first base plate and second base plate kept away from each other, two the both sides of insulating zone are located to the electrode area, be equipped with a plurality of connecting holes that run through first base plate and second base plate in the electrode area, all plated the copper layer in electrode area and the connecting hole, still be equipped with the grafting portion that is used for being connected with test device on the electrode area and be used for carrying out welded first weld part with the lead wire capacitor, grafting portion does the gold layer of plating on the copper layer, be equipped with the welding hole that a plurality of convenient different specification lead wire capacitors cut straightly in the first weld part.

The connecting holes are used for connecting the copper layers on the two sides of the first substrate and the second substrate to form a parallel connection relation, so that the copper-clad resistance is reduced; set up a plurality of welding holes on the first welding portion, can be compatible with the lead wire condenser of all current specifications, in the installation, the condenser lead wire need not to buckle, directly injects the welding hole of corresponding specification into to cut unnecessary lead wire, disposable welding reduces lead wire resistance on the base member. The connection of grafting portion on the base member with the anchor clamps on the test device, adopt lead wire and anchor clamps lug connection to compare in with traditional mode, increased area of contact, reduce the contact resistance of anchor clamps with the switching PCB board to grafting portion adopts gilding technology, can further reduce contact resistance. During the test in the middle of the test, only need will switch over the whole plug of PCB, and need not to touch the product, avoided the secondary damage product, more be close to the situation of product in-service use.

Further, be equipped with four welding holes of locating on the collinear in the first welding portion, be first welding hole, second welding hole, third welding hole and fourth welding hole respectively, first welding hole and second welding hole are located in an electrode zone, third welding hole and fourth welding hole are located in another electrode zone, first welding hole and second welding hole interval are 1mm, second welding hole and third welding hole interval are 2.5mm, third welding hole and fourth welding hole interval are 1.5mm, first welding hole and fourth welding hole interval are 5 mm.

The four welding holes can meet the lead capacitor with lead spacing of 2.5mm, 3.5mm and 5mm, namely can be suitable for lead capacitors with diameters of phi 5, phi 6.3, phi 8 and phi 10.

Furthermore, in order to enable the patch capacitors to be welded on the transfer PCB, a second welding part is further arranged in the electrode area, and the patch capacitors with the diameters of phi 5, phi 6.3, phi 8 and phi 10 can be welded in the second welding part. And the lead of the chip capacitor is welded and connected with the second welding part by attaching the lead of the chip capacitor to the second welding part.

Further, the copper layer thickness is 90 um.

Further, the thickness of the gold layer is 140 um.

Furthermore, in order to increase the contact area between the switching PCB and the clamp of the test device and reduce the contact resistance, the width of the plug-in part is 8-10 mm.

The beneficial effects of the invention are: according to the through PCB for the solid-liquid mixed aluminum electrolytic capacitor life test, the first welding part and the second welding part are arranged on the base body, so that the through PCB can be compatible with products with all current diameters, including lead type follow-up sheets, and in the installation process, leads do not need to be stressed and can be welded once, so that the through PCB is consistent with practical application; the part in contact with the high-frequency clamp adopts a gold plating process, so that the contact area is large, the contact resistance is small, and the contact is firm; during test midway, only the PCB needs to be plugged and pulled, the product body does not need to be stressed, and the product performance cannot be influenced.

Drawings

The invention is further illustrated by the following figures and examples.

FIG. 1 is a schematic diagram of a prior art capacitor connected to a test fixture;

FIG. 2 is a schematic structural diagram of a preferred embodiment of the present invention;

FIG. 3 is a schematic diagram of the structure of the capacitor connected to the test fixture through the transfer PCB;

fig. 4 is a schematic structural view of a patch capacitor.

In the figure: 1. lead capacitor, 2, clamp, 3, base body, 31, first base plate, 32, second base plate, 33, insulating region, 34, electrode region, 341, connecting hole, 342, plug part, 343, welding hole, 344, second welding part, 4, chip capacitor.

Detailed Description

The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.

As shown in fig. 2 and 3, the solid-liquid mixed aluminum electrolytic capacitor life test switching PCB of the present invention includes a first substrate 31 and a second substrate 32, the first substrate 31 and the second substrate 32 are stacked to form a base body 3, two planes of the first substrate 31 and the second substrate 32 away from each other are symmetrically provided with an insulating region 33 and two electrode regions 34, the two electrode regions 34 are provided at two sides of the insulating region 33, the electrode regions 34 are provided with a plurality of connection holes 341 penetrating through the first substrate 31 and the second substrate 32, the electrode regions 34 and the connection holes 341 are plated with copper layers, and the thickness of the copper layers is 90 um. The electrode area 34 is further provided with a plug portion 342 used for being connected with a test device and a first welding portion used for being welded with the lead capacitor 1, the plug portion 342 is a gold layer plated on the copper layer, and the thickness of the gold layer is 140 microns. The width of the plug part 342 is 9mm, and the length thereof is 20 mm. A plurality of welding holes 343 which facilitate the direct insertion of lead capacitors 1 with different specifications are formed in the first welding portion.

Be equipped with four welding holes 343 of locating on the collinear in the first welding portion, be first welding hole, second welding hole, third welding hole and fourth welding hole respectively, first welding hole and second welding hole are located in an electrode zone 34, third welding hole and fourth welding hole are located in another electrode zone 34, first welding hole and second welding hole interval are 1mm, second welding hole and third welding hole interval are 2.5mm, third welding hole and fourth welding hole interval are 1.5mm, first welding hole and fourth welding hole interval are 5 mm.

A second welding part 344 is further arranged in the electrode area 34, and the chip capacitors 4 with the diameters phi 5, phi 6.3, phi 8 and phi 10 can be welded in the second welding part 344.

The test process comprises the following steps:

the lead capacitor 1 needing to be tested is selected, the lead of the lead capacitor 1 is directly inserted into the corresponding welding hole 343 according to the specification, redundant leads are cut off, the lead is welded on the base body 3 at one time, then the through-connection PCB is inserted into the test fixture 2 through the inserting part 342, during testing midway, the PCB only needs to be inserted and pulled out, the product body does not need to be stressed, and the product performance cannot be influenced.

The patch capacitor 4 to be tested is selected, the lead of the patch capacitor 4 corresponds to the position of the second welding part 344 according to specifications, the patch capacitor 4 is welded on the base body 3 at one time, then the through-connection PCB is inserted into the test fixture 2 through the inserting part 342, during testing midway, the PCB is only required to be plugged and pulled out, the product body is not required to be stressed, and the product performance is not influenced.

Directions and references (e.g., up, down, left, right, etc.) may be used in the present disclosure only to aid in the description of features in the figures. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.

In light of the foregoing description of preferred embodiments in accordance with the invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and must be determined according to the scope of the claims.

Claims

1. A solid-liquid mixed aluminum electrolytic capacitor life test switching PCB board is characterized in that: comprises a first substrate (31) and a second substrate (32), wherein the first substrate (31) and the second substrate (32) are overlapped to form a base body (3), an insulating region (33) and two electrode regions (34) are symmetrically arranged on two planes of the first substrate (31) and the second substrate (32) which are far away from each other, the two electrode regions (34) are arranged on two sides of the insulating region (33), a plurality of connecting holes (341) penetrating through the first substrate (31) and the second substrate (32) are arranged in the electrode area (34), copper layers are plated in the electrode area (34) and the connecting hole (341), an inserting part (342) used for being connected with a test device and a first welding part used for being welded with the lead capacitor (1) are further arranged on the electrode area (34), the inserting part (342) is a gold layer plated on the copper layer, and a plurality of welding holes (343) which are convenient for lead capacitors (1) of different specifications to be directly inserted are formed in the first welding part.

2. The solid-liquid mixed aluminum electrolytic capacitor life test adapter PCB board of claim 1, wherein: be equipped with four welding holes (343) of locating on the collinear in the first welding portion, be first welding hole, second welding hole, third welding hole and fourth welding hole respectively, first welding hole and second welding hole are located in one electrode zone (34), third welding hole and fourth welding hole are located in another electrode zone (34), first welding hole and second welding hole interval are 1mm, second welding hole and third welding hole interval are 2.5mm, third welding hole and fourth welding hole interval are 1.5mm, first welding hole and fourth welding hole interval are 5 mm.

3. The solid-liquid mixed aluminum electrolytic capacitor life test adapter PCB board of claim 1 or 2, characterized in that: and a second welding part (344) is also arranged in the electrode area (34), and the second welding part (344) can be internally welded with chip capacitors (4) with the diameters of phi 5, phi 6.3, phi 8 and phi 10.

4. The solid-liquid mixed aluminum electrolytic capacitor life test switching PCB board of claim 1, characterized in that: the copper layer thickness is 90 um.

5. The solid-liquid mixed aluminum electrolytic capacitor life test adapter PCB board of claim 1, wherein: the gold layer thickness is 140 um.

6. The solid-liquid mixed aluminum electrolytic capacitor life test switching PCB board of claim 1, characterized in that: the width of the insertion part (342) is 8-10 mm.