CN114713972A - Laser head idle moving control method and device and readable storage medium - Google Patents
Laser head idle moving control method and device and readable storage medium Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The application provides a laser head idle moving control method, a laser head idle moving control device and a readable storage medium, and the method comprises the following steps: judging whether a machined contour exists on a path between the current machined contour and the next machined contour; if the machined contour exists, acquiring time T1 required by a laser head to move from the current machined contour to the machined contour along the horizontal direction; acquiring the time T2 required by the laser head to be lifted to a preset safe height H along the vertical direction; and judging the time between the time T1 and the time T2, if the time T1 is more than or equal to the time T2, the laser head moves along a preset first motion track mode, otherwise, the laser head moves along a preset second motion track mode. Therefore, the control method can ensure the movement efficiency of the laser head from the current processing contour to the next processing contour and can also ensure that the laser head does not collide with the processed contour.
Description
Technical Field
The application belongs to the technical field of laser processing, and particularly relates to a laser head idle moving control method and device and a readable storage medium.
Background
With the rapid development of numerical control technology, the requirements on laser processing efficiency are more and more strict. For example, in the laser cutting process, after the laser head cuts the current contour, the laser head needs to move from the end position of the current contour to the starting position of the next cut contour, and the process of moving the laser head from the end position to the starting position is the idle movement.
However, in some cutting processes, a cut contour may exist between the end position and the starting position, so in order to avoid collision between the laser head and the processed contour during the idle movement of the laser head, the laser head is generally lifted along the Z-axis direction at the end position, then translated for a certain distance along the X-axis direction and/or the Y-axis direction, and finally lowered along the Z-axis direction at the starting position as shown in fig. 5, but the lifting efficiency of the existing laser head lifting mode is too low.
Disclosure of Invention
The present application provides a method and an apparatus for controlling laser head idle movement, and a readable storage medium, so as to solve the technical problems mentioned in the background art.
The technical scheme adopted by the application is a laser head idle moving control method, which comprises the following steps:
judging whether a machined contour exists on a path between the current machined contour and the next machined contour;
if the machined contour exists, acquiring time T1 required by a laser head to move from the current machined contour to the machined contour along the horizontal direction;
acquiring the time T2 required by the laser head to be lifted to a preset safe height H along the vertical direction; and
and judging the time between the time T1 and the time T2, if the time T1 is more than or equal to the time T2, moving the laser head along a preset first motion track mode, otherwise, moving the laser head along a preset second motion track mode, wherein the time required for lifting in the preset second motion track mode is longer than the time required for lifting in the preset first motion track mode.
It can be seen that, in the control method of the application, if a processed contour exists on a path between a current processing contour and a next processing contour, by acquiring time T1 required by the current processing contour to move to the processed contour along a horizontal direction and acquiring time T2 required by the laser head to lift to a preset safety height H along a vertical direction, and judging the time T1 and the time T2, it can be obtained whether the laser head moves along a preset first motion track mode or a preset second motion track mode, and by this way, the laser head can select the most appropriate motion track, so that the motion efficiency of the laser head from the current processing contour and the next processing contour is ensured, and the laser head cannot collide with the processed contour.
Further, the acquiring time T1 when the laser head moves from the current processing contour to the processed contour along the horizontal direction further includes:
acquiring a distance S1 between the current processing contour and the next processing contour;
acquiring a distance S2 between the current processing contour and the processed contour; and
and calculating the movement time T1 of the laser head at the distance S2 according to the distance S1 and the preset movement speed V1 of the laser head in the horizontal direction.
Further, the calculating the moving time T1 of the laser head at the distance S2 according to the distance S1 and the preset moving speed V1 of the laser head in the horizontal direction further includes:
calculating the speed V2 of the laser head at the distance S2 according to the distance S1 and the preset horizontal movement speed V1 of the laser head; and
the time T1 is calculated according to the speed V2 and the distance S2.
Further, acquire laser head and rise to safe height H required time T2 along vertical direction, still include:
and calculating the time T2 according to a preset safety height H and a preset lifting speed V3 of the laser head in the vertical direction.
Further, the first motion track mode comprises a first lifting track and a first descending track, wherein the laser head is lifted to a safety height H along the first lifting track, and moves to a next processing profile along the first descending track; and
the first lifting track is formed by interpolation motion of the laser head along the horizontal direction while the laser head moves along the vertical direction at the time of T2.
Further, the second motion track mode comprises a second lifting track and a second descending track, wherein the laser head is lifted to a safety height H along the second lifting track, and moves to the next processing profile along the second descending track; and
the second lifting track is formed by the fact that the laser head moves for a time T3 along the vertical direction and then performs interpolation movement for a time T4 in the horizontal direction, wherein the time T4 is equal to the time T2-the time T3, and the time T4 is equal to or less than the time T1.
Further, the movement time T3 is a preset time.
Further, the moving time T3 is calculated according to the time T2 required by the laser head to lift to the preset safety height H and the time T1 required by the laser head to move from the current machining profile to the machined profile.
Further, if the machined contour does not exist, the laser head moves along a third motion track.
Further, the third motion track is formed by the laser head moving in the horizontal direction within the distance S1.
A laser head idle movement control apparatus, the apparatus comprising:
a processor configured to execute computer-executable instructions;
a memory storing one or more computer-executable instructions that, when executed by the processor, implement the method of any one of the above.
A computer-readable storage medium, on which a computer program is stored which, when executed by a processor, carries out the method of any one of the above.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.
Fig. 1 is a flowchart of a laser head idle movement control method according to an embodiment of the present application;
FIG. 2 is a flowchart illustrating details of step 104 in accordance with the corresponding embodiment of FIG. 1;
FIG. 3 is a flowchart illustrating details of step 206 of the corresponding embodiment of FIG. 2;
fig. 4 is a second flowchart of a laser head idle movement control method according to an embodiment of the present application;
FIG. 5 is a schematic view of a prior art motion profile of a laser head moving from a current machining profile to a next machining profile;
fig. 6 is a schematic diagram of a first motion trajectory module for moving a laser head from a current processing profile to a next processing profile according to an embodiment of the present application;
fig. 7 is a schematic diagram of a second motion trajectory module for moving the laser head from the current processing profile to the next processing profile according to an embodiment of the present application;
fig. 8 is a schematic diagram of a third motion trajectory module for moving the laser head from the current processing profile to the next processing profile according to an embodiment of the present application;
FIG. 9 is a schematic diagram of the positions of a current machining profile, a machined profile and a next machining profile provided in an embodiment of the present application;
fig. 10 is a block diagram of a laser processing control apparatus according to an embodiment of the present application.
Description of the drawings:
100. the current machining profile; 200. a machined profile; 300. next machining the profile; 400. a processor; 500. a memory.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that, when a meta-structure is referred to as being "fixed" or "disposed" to another meta-structure, it may be directly on the other meta-structure or indirectly on the other meta-structure. When a meta structure is referred to as being "connected to" another meta structure, it can be directly connected to the other meta structure or indirectly connected to the other meta structure.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings that is used solely to facilitate the description of the application and to simplify the description, and do not indicate or imply that the referenced device or element structure must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of some applications, "plurality" means two or more unless specifically limited otherwise.
The application provides a laser head idle moving control method, which can control a laser head to select a proper motion path in the process of jumping from a current contour position to a next cutting contour position from the current contour position after the laser head cuts a current contour, so that the laser head can move to the next cutting contour position at the highest speed, and meanwhile, the collision between the laser head and a processing contour position can be avoided.
Specifically, referring to fig. 1, the laser head idle movement control method provided in the present application includes the following steps:
in step 102, it is determined whether a machined profile 200 exists on the path between the current machined profile 100 and the next machined profile 300.
Specifically, referring to fig. 1 and 9, after the laser head finishes processing the current processing contour 100, the laser head needs to move from the end position of the current processing contour 100 to the start position of the next processing contour 300, and during the movement of the laser head, it needs to determine whether there is a processed contour 200 on the movement path between the end position of the current processing contour 100 and the start position of the next processing contour 300, so as to determine whether the laser head needs to perform a lifting action to jump over the processed contour 200. The determination of whether the machined contour 200 exists may be performed by recognizing a machining drawing.
Specifically, when it is determined that the machined profile 200 exists on the path between the current machining profile 100 and the next machining profile 300 after step 102, it is necessary to know the time T1 taken for the laser head to move from the current machining profile 100 to the machined profile 200 in the horizontal direction. That is, the laser head needs to be raised to the mounting height before time T1 to prevent the laser head from colliding with the machined profile 200 without having been raised to the mounting height.
And 106, acquiring the time T2 required by the laser head to be lifted to the preset safe height H along the vertical direction.
Specifically, after step 202, it is determined that there is a machined profile 200 on the path between the current machined profile 100 and the next machined profile 300, the laser head needs to be lifted to a position with a safety height H to ensure that the laser head does not collide with the machined profile 200 when passing through the machined profile 200.
And 108, judging the time T1 and the time T2, if the time T1 is more than or equal to the time T2, moving the laser head along a preset first motion track mode, otherwise, moving the laser head along a preset second motion track mode, wherein the lifting time in the preset second motion track mode is longer than the lifting time in the preset first motion track mode.
Specifically, after the time T1 is obtained in step 204 and the time T2 is obtained in step 206, the time between the time T1 and the time T2 needs to be determined, so as to determine whether the laser head can reach the preset safety height H before the time T1 or the time T1.
For example, referring to FIGS. 1, 6, 7 and 9, when time T1 ≧ time T2, it is demonstrated that the laser head is able to reach the preset safety height H before time T1 or time T1. That is, the laser head is already raised to the safety height H just after moving to the processed profile 200 or not yet moving to the processed profile, and at this time, the laser head can move from the end position of the current processing profile 100 to the start position of the next processing profile 300 along the first motion trajectory pattern.
When time T1 < time T2, it is proved that the laser head cannot reach the preset safety height H before time T1 or time T1. That is, when the laser head has moved to the processed profile 200, the laser head has not been lifted to the safety height H, and at this time, the laser head risks colliding with the processed profile 200, so the laser head needs to move from the end position of the current processed profile 100 to the start position of the next processed profile 300 along the second motion trajectory pattern.
It can be seen that, in the control method of the present application, if there is a processed contour 200 on the path between the current processing contour 100 and the next processing contour 300, by obtaining the time T1 required for the current processing contour 100 to move to the processed contour 200 along the horizontal direction and obtaining the time T2 required for the laser head to lift to the preset safety height H along the vertical direction, and determining the time T1 and the time T2, it can be obtained whether the laser head moves along the preset first motion trajectory mode or the preset second motion trajectory mode, and this way enables the laser head to select the most appropriate motion trajectory, which not only ensures the motion efficiency of the laser head from the current processing contour 100 and the next processing contour 300, but also ensures that the laser head does not collide with the processed contour 200.
Referring to fig. 2, in an embodiment, the step 104 further includes the following steps:
in step 202, the distance S1 between the current machining profile 100 and the next machining profile 300 is obtained.
Specifically, referring to fig. 9, the coordinates (X1, Y1) of the end point of the current machining contour 100 and the coordinates (X2, Y2) of the start point of the next machining contour 300 may be determined in the machining map file, and the straight-line distance between the end point and the start point, i.e., the distance S1 between the current machining contour 100 and the next machining contour 300, is calculated from the coordinates (X1, Y1) of the end point and the coordinates (X2, Y2) of the start point.
In step 204, the distance S2 between the current machined contour 100 and the machined contour 200 is obtained.
Specifically, referring to fig. 9, coordinates (X3, Y3) of an initial position of the processed contour 200 passed by the laser head (i.e., an initial point when the laser head passes through the processed contour 200) may be determined in the processing map file, and a straight-line distance between the end point position and the initial position, i.e., a distance S2 between the current processed contour 100 and the processed contour 200, may be calculated from the end point position coordinates (X1, Y1) and the initial position coordinates (X3, Y3).
And step 206, calculating the movement time T1 of the laser head at the distance S2 according to the distance S1 and the preset movement speed V1 of the laser head in the horizontal direction.
Specifically, the moving speed V1 of the laser head in the horizontal direction during the idle movement process is preset, the speed V1 is the moving speed of the laser head moving from the current processing profile 100 to the next processing profile 300, and the time T1 required by the laser head to move in the distance S2 can be calculated according to the obtained distance S1, the distance S2 and the preset moving speed V1.
Referring to fig. 3, in an embodiment, the step 206 further includes the following steps:
and step 302, calculating the speed V2 of the laser head within the distance S2 according to the distance S1 and the preset speed V1 of the laser head moving along the horizontal direction.
It will be appreciated that the predetermined movement velocity V1 is generally the maximum movement velocity of the laser head, i.e. the maximum rapid movement velocity that the laser head can reach between the movement of the laser head from the current machining profile to the next machining profile. In the process that the laser head moves from the current machining profile 100 to the next machining profile 300, the laser head needs to be gradually accelerated from the speed of 0 to the highest movement speed V1 and then reduced from the movement speed V1 to 0, that is, the whole movement process of the laser head includes an acceleration stage, a uniform speed stage and a deceleration stage, so that the speed of the laser head in the acceleration stage and the deceleration stage changes continuously except that the speed in the uniform speed stage is kept constant at V1, and therefore the movement speed V2 of the laser head within the distance S2 needs to be calculated through the distance S1 and the movement speed V1, wherein the movement speed V2 may be an average speed.
In step 304, time T1 is calculated according to speed V2 and distance S2.
Specifically, after the moving speed V2 of the laser head within the distance S2 is obtained, the time T1 required for the laser head to move within the distance S2 can be calculated.
Referring to fig. 6 or fig. 7, in step 106, acquiring a time T2 required for the laser head to be lifted to the preset safety height H along the vertical direction may specifically include:
and calculating the time T2 according to the preset safety height H and the lifting speed V3 of the preset laser head in the vertical direction.
That is to say, in this embodiment, the safety height H may be fixed, the lifting speed V3 of the laser head along the vertical direction may be fixed, and further, the time T2 that the laser head lifts to the safety height H may also be fixed, that is, regardless of whether the movement speed of the laser head in the horizontal direction is fast or slow, the time that the laser head moves to the safety height H in the vertical direction is fixed, so in each idle movement process of the laser head, it is only necessary to determine the time T1 that the laser head moves from the current processing contour 100 to the processed contour 200, and thus it is possible to determine which motion trajectory module the laser head needs to select, and it is possible to effectively simplify the control difficulty.
It should be noted that the safety height H can be determined according to the thickness of the substrate to be processed by the desired laser head and the size of the profile to be processed, and the thinner the substrate thickness and the smaller the processing profile, the greater the warpage at the processed profile 200 may be, i.e. the higher the preset safety height H may be. Therefore, the control method can be compatible with different processing objects, can be realized only by adjusting the size of the safety height H, and is simple and quick to debug and high in universality.
Referring to fig. 6, in an embodiment, the first motion profile mode includes a first lift profile and a first drop profile.
Specifically, if the laser head selects the first motion trajectory mode and moves from the current processing contour 100 to the next processing contour 300, the laser head may first lift from the end position of the current processing contour 100 to the safety height H along the first lifting trajectory, and then move to the start position of the next processing contour 300 along the first lowering trajectory.
Further, the first motion profile module may further include a first horizontal profile.
Specifically, in some embodiments, if the distance S1 between the current processing profile 100 and the next processing profile 300 is long, after the laser head is lifted from the end position of the current processing profile 100 to the safety height H along the first lifting track, the laser head needs to translate the distance L along the first horizontal track in the horizontal direction, and then move to the start position of the next processing profile 300 along the first descending track, so as to ensure that the laser head can move from the current processing profile 100 to the next processing profile 300 without colliding with the processed profile 200.
Further, the first lift trajectory is formed by interpolating the movement in the horizontal direction while the laser head moves in the vertical direction at time T2.
Specifically, during the process that the laser head is lifted to the safety height H at the preset lifting speed V3 of the laser head along the vertical direction in the time T2, the laser head is simultaneously interpolated in the horizontal direction at the preset moving speed V1 of the laser head along the horizontal direction. That is, when the laser head moves in the Z-axis direction at the lifting speed V3 at the time T2, a spline curve or a parabola formed by interpolation movement in the X-axis and/or Y-axis direction is performed, and the interpolation movement in the X-axis and/or Y-axis direction performed by the laser head is a horizontal movement track of the laser head from the current machining profile 100 to the next machining profile 300.
In an embodiment, the first descending track and the first ascending track can be arranged to be symmetrical with each other, so that the control difficulty can be effectively simplified, and the control efficiency can be improved. And the first horizontal track is formed by stopping the vertical motion of the laser head and only performing interpolation motion in the horizontal direction.
During actual control, in the process of lifting the laser head, the laser head is controlled to move along the Z-axis direction and simultaneously move along the X-axis and/or the Y-axis in the horizontal direction; after the laser head is lifted to the safe height H, closing the Z-axis direction movement of the laser head, and enabling the laser head to continue to move horizontally along the X-axis and/or the Y-axis; and after the laser head moves for a distance L along the horizontal direction, starting the Z-axis direction movement of the laser head, so that the laser head moves vertically along the Z-axis direction and interpolates along the X-axis and/or Y-axis direction, and the landing of the laser head is realized.
It can be understood that when the first descending trajectory and the first ascending trajectory are set to be symmetrical to each other, the time for the laser head to ascend and the time for the laser head to descend are both T2, and the time T1 required for the laser head to move from the current processing profile 100 to the processed profile 200 in the horizontal direction can be obtained, so that the time required for the laser head to move the distance L in the horizontal direction is T1-2T 2. From this, can see that, in this application, can enough guarantee the laser head with the highest speed lifting through setting up first drop orbit and first lifting orbit into mutual symmetry, can guarantee again that the laser head moves the efficiency of next processing profile 300, and can also effectual simplification control degree of difficulty.
Referring to fig. 7, in an embodiment, the second motion profile mode includes a second lift profile and a second drop profile.
Specifically, if the laser head selects the second motion trajectory mode and moves from the current processing contour 100 to the next processing contour 300, the laser head may first lift from the end position of the current processing contour 100 to the safety height H along the second lifting trajectory and then move to the start position of the next processing contour 300 along the second lowering trajectory.
Further, the second motion trajectory module may further include a second horizontal trajectory.
Specifically, in some embodiments, if the distance S1 between the current processing profile 100 and the next processing profile 300 is long, after the laser head is lifted from the end position of the current processing profile 100 to the safety height H along the second lifting track, the laser head needs to translate the distance L along the second horizontal track in the horizontal direction, and then move to the start position of the next processing profile 300 along the first descending track, so as to ensure that the laser head can move from the current processing profile 100 to the next processing profile 300 without colliding with the processed profile 200.
Furthermore, the second lifting track is formed by moving the laser head along the vertical direction for a time T3 and then simultaneously performing interpolation movement in the horizontal direction for a time T4, wherein the time T4 is a time T2-a time T3, and the time T4 is not more than the time T1.
Specifically, after the laser head is lifted by a preset height h at a lifting speed V3 of the laser head along the vertical direction in time T3, the laser head is simultaneously interpolated with a preset movement speed V1 of the laser head along the horizontal direction for a movement time T4. That is, in the second lifting trajectory, the lifting motion of the laser head is divided into two parts, wherein the first part is that the laser head needs to move by the height h along the Z-axis direction at the lifting speed V3 in time T3, the second part is that the laser head moves along the Z-axis direction at the lifting speed V3 in time T4 and simultaneously carries out a spline curve or a parabola formed by interpolation motion along the X-axis and/or Y-axis direction, and the interpolation motion along the X-axis and/or Y-axis direction of the laser head is the horizontal motion trajectory of the laser head from the current processing contour 100 to the next processing contour 300.
It will be appreciated that in the second track mode, the second lift track is divided into two parts, the first part being the laser head which moves only in the Z-axis direction, and the second part being the same as the first lift track which moves both in the Z-axis direction and interpolated in the X-axis and/or Y-axis directions. When the distance between the current processing profile 100 and the processed profile 200 is short, it means that the time T1 required by the laser head to move from the current processing profile 100 to the processed profile 200 is shorter, and the time T2 required by the laser head to lift to the preset safety height H in the vertical direction is fixed, so that the laser head needs to buffer the time T3 in the vertical direction, and then simultaneously perform interpolation movement in the X-axis and/or Y-axis direction in the time T4, and the time T4 can be calculated from the time T2 to the time T3, so that the time T4 is not more than the time T1, that is, the laser head can not collide with the processed profile 200 before lifting to the safety height H.
That is, when the time T4 is the time T1, it is stated that the laser head can just move to the safety height H corresponding to the processed contour 200 in the time T4; when time T4 < time T1, the laser head is illustrated as having been raised to a safe height H before reaching the machined profile 200. Therefore, in the second lifting track of the present application, the laser head moves for a time T3 in the vertical direction for buffering, and then performs interpolation movement in the X-axis and/or Y-axis direction within a time T4, so that the movement efficiency of the laser head in the horizontal direction can be ensured while preventing the laser head from colliding with the processed contour 200.
Further, in one embodiment, the movement time T3 may be a preset time. Specifically, the required time T3 for the laser head to lift the buffer height H can be calculated by presetting the buffer height H and according to the preset safety height H and the preset lifting speed V3 of the laser head in the vertical direction, wherein the buffer height H can be set according to an actual processing object.
In other embodiments, the movement time T3 may be calculated from the time T2 required for the laser head to be raised to the preset safety height H and the time T1 required for the laser head to move from the current machining profile 100 to the machined profile 200, specifically, time T3-time T2-time T1. That is, the laser head may determine the buffer time T3 of the laser head according to the time T1 required for the laser head to move from the current machining profile 100 to the machined profile 200, so as to ensure that the laser head can be precisely lifted to the safety height H while moving to the machined profile 200.
In an embodiment, the second descending track and the second ascending track can be arranged to be symmetrical to each other, so that the control difficulty can be effectively simplified, and the control efficiency can be improved. And the second horizontal track can be formed by stopping the vertical motion of the laser head and only performing interpolation motion in the horizontal direction.
In other embodiments, the second descending track may also be a descending motion of the laser head along the Z-axis direction, and an interpolating motion of the laser head along the X-axis and/or Y-axis direction, so as to realize the fastest descending of the laser head.
Referring to fig. 8, in an embodiment, the step 102 further includes the following steps:
and step 110, if the machined contour 200 does not exist, the laser head moves along a third motion track.
Specifically, the third motion trajectory may be formed by the laser head moving in the horizontal direction within the distance S1. That is, the laser head moves in the distance S1 at the preset horizontal direction moving speed V1 in the X axis and/or the Y axis. That is, when there is no machined profile 200 between the home machined profile and the next machined profile 300, the laser head may be directly moved to the next machined profile 300 in the horizontal direction.
In addition, referring to fig. 9, the present application also provides a laser head idle movement control apparatus, which includes a process 400 and a memory 500.
Wherein, the processor 400 is configured to execute computer-executable instructions; the memory 500 is used to store one or more computer-executable instructions that, when executed by the processor 400, implement the laser head idle control method described above.
The present application also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the above-described laser head idle movement control method.
The present application is intended to cover any variations, uses, or adaptations of the invention using its general principles and without departing from the spirit or essential characteristics thereof.
Claims (12)
1. A laser head idle movement control method is characterized by comprising the following steps:
judging whether a machined contour exists on a path between the current machined contour and the next machined contour;
if the machined contour exists, acquiring time T1 required by a laser head to move from the current machined contour to the machined contour along the horizontal direction;
acquiring the time T2 required by the laser head to be lifted to a preset safe height H along the vertical direction; and
and judging the time between the time T1 and the time T2, if the time T1 is more than or equal to the time T2, moving the laser head along a preset first motion track mode, otherwise, moving the laser head along a preset second motion track mode, wherein the time required for lifting in the preset second motion track mode is longer than the time required for lifting in the preset first motion track mode.
2. The laser head idle control method of claim 1 in which the acquiring laser head moves horizontally from a current machining profile to a time T1 of a machined profile further comprises:
acquiring a distance S1 between the current processing contour and the next processing contour;
acquiring a distance S2 between the current processing contour and the processed contour; and
and calculating the movement time T1 of the laser head at the distance S2 according to the distance S1 and the preset movement speed V1 of the laser head in the horizontal direction.
3. The laser head idle movement control method of claim 2, characterized in that the time T1 of the laser head moving at the distance S2 is calculated according to the distance S1 and a preset laser head moving speed V1 in the horizontal direction, and further comprising:
calculating the speed V2 of the laser head at the distance S2 according to the distance S1 and the preset horizontal movement speed V1 of the laser head; and
the time T1 is calculated according to the speed V2 and the distance S2.
4. The laser head idle movement control method of claim 1, characterized in that the acquiring of the time T2 required for the laser head to be lifted to the safe height H in the vertical direction further comprises:
and calculating the time T2 according to a preset safety height H and a preset lifting speed V3 of the laser head in the vertical direction.
5. The laser head idle motion control method of any one of claims 1 to 4 characterized in that the first motion trajectory pattern comprises a first lift trajectory along which the laser head is raised to a safety height H and a first drop trajectory along which the laser head is moved to a next machining profile; and
the first lifting track is formed by interpolation motion of the laser head along the horizontal direction while the laser head moves along the vertical direction at the time of T2.
6. The laser head idle motion control method of any one of claims 1 to 4 characterized in that the second motion trajectory pattern comprises a second lift trajectory along which the laser head is lifted to a safety height H and a second drop trajectory along which the laser head is moved to a next machining profile; and
the second lifting track is formed by the fact that the laser head moves for a time T3 along the vertical direction and then performs interpolation movement for a time T4 in the horizontal direction, wherein the time T4 is equal to the time T2-the time T3, and the time T4 is equal to or less than the time T1.
7. The laser head idle movement control method of claim 6 in which the movement time T3 is a preset time.
8. The laser head idle control method of claim 6 in which the movement time T3 is calculated based on the time T2 required for the laser head to raise to a preset safety height H and the time T1 required for the laser head to move from the current machining profile to the machined profile.
9. The laser head lost motion control method of claim 1 in which the laser head moves along a third motion trajectory if no machined profile is present.
10. The laser head idle motion control method of claim 9 in which the third motion trajectory is formed by the horizontal motion of the laser head over a distance S1.
11. A laser head air displacement control device, characterized in that the device includes:
a processor configured to execute computer-executable instructions;
a memory storing one or more computer-executable instructions that, when executed by the processor, implement the method of any one of claims 1-10.
12. A computer-readable storage medium, having stored thereon a computer program which, when executed by a processor, implements a method according to any one of the preceding claims 1 to 10.
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