CN114625070A - Laser processing control method, device and readable storage medium - Google Patents
Laser processing control method, device and readable storage medium Download PDFInfo
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- CN114625070A CN114625070A CN202210160625.9A CN202210160625A CN114625070A CN 114625070 A CN114625070 A CN 114625070A CN 202210160625 A CN202210160625 A CN 202210160625A CN 114625070 A CN114625070 A CN 114625070A
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- 238000000034 method Methods 0.000 title claims abstract description 74
- 238000003860 storage Methods 0.000 title claims description 7
- 238000003754 machining Methods 0.000 claims abstract description 69
- 238000004590 computer program Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 208000032368 Device malfunction Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/35—Nc in input of data, input till input file format
- G05B2219/35349—Display part, programmed locus and tool path, traject, dynamic locus
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- Laser Beam Processing (AREA)
Abstract
The application provides a laser processing control method, which comprises the following steps: moving the laser head along a predetermined processing path while emitting a laser beam toward the workpiece; when the laser head receives an interrupt signal, the laser head stops emitting laser beams to the workpiece, and the laser head firstly lifts from the machining height of the interrupt position to a preset safety height and then retreats for a preset distance; and when the laser head receives a restart signal, the laser head descends to a processing height and then continuously moves along a preset processing path and simultaneously emits a laser beam to the workpiece. It can be seen that in the control method of the present application it is ensured that the workpiece at the interruption position can be machined completely without micro-joining.
Description
Technical Field
The present application relates to laser processing technology, and more particularly, to a laser processing control method and apparatus, and a readable storage medium.
Background
During laser machining, there are often some sudden situations that can cause interruption of laser machining. For example, in the laser cutting process, if the laser head collides with a workpiece during cutting, or if a laser cutting device malfunctions, or if the laser cutting device is manually and actively suspended, the cutting by the laser is interrupted.
In some control methods, the laser head returns to the beginning of the cut after the cut is interrupted, and when the cut is started again, the laser head is positioned to the interrupted position and then starts to cut the workpiece. However, the above control method is prone to have the situation that the broken part is cut continuously, and micro-connection exists, so that the machined workpiece is scrapped.
Disclosure of Invention
The present application provides a laser processing control method, a laser processing control apparatus, and a readable storage medium, so as to solve the technical problems mentioned in the background art.
The technical scheme adopted by the application is a laser processing control method, which comprises the following steps:
moving a laser head along a predetermined processing path while emitting a laser beam toward a workpiece;
when the laser head receives an interrupt signal, the laser head stops emitting laser beams to the workpiece, and the laser head firstly lifts from the machining height of the interrupt position to a preset safety height and then retreats for a preset distance; and
and when the laser head receives a restarting signal, the laser head descends to the processing height and continues to move along the preset processing path and simultaneously emits the laser beam to the workpiece.
It can be seen that in the control method of the present application, after the laser processing is interrupted, the laser head is retracted by a predetermined distance, so that after the laser processing is restarted, the laser head can process the workpiece at the interrupted position again, so as to ensure that the workpiece at the interrupted position can be completely processed. In addition, in this application, the laser head carries out the lifting earlier and rolls back again and can guarantee that the laser head can not bump with the work piece at the in-process that rolls back.
Further, after the laser head receives a restart signal, the laser head is lowered to a processing height and then continues to emit a laser beam to the workpiece along a predetermined processing path, and the laser machining method further includes:
if the laser head is lowered to the machining height and then collides with the workpiece or has the risk of colliding with the workpiece, the laser head is lifted to a preset avoidance height from the current machining height, then moves along a preset machining path and emits laser beams to the workpiece at the same time.
Further, after the laser head receives a restart signal, the laser head is lowered to a processing height and then continues to emit a laser beam to the workpiece along a predetermined processing path, and the laser machining method further includes:
and in the process that the laser head continuously moves to the interruption position along the preset processing path, if the laser head collides with the workpiece or has the risk of colliding with the workpiece in the moving process, the laser head is lifted to the preset avoidance height from the current position height and then moves along the preset processing path.
Further, the in-process that the laser head moved to the interrupt position from the restart position, if the laser head had the lift to when predetermined dodging the height, still include:
and after the laser head moves to the interruption position, the laser head descends to a processing height and then moves along a preset processing path.
Further, the laser head lifts to predetermined dodge height from current processing height, still includes:
and lifting the laser head from the current machining height to a preset safety height and then descending to a preset avoiding height.
Further, after the laser head moves to the interruption position, the laser head is lowered to a processing height and then moves along a predetermined processing path, and the laser machining device further comprises:
and lifting the laser head from the current machining height to a preset safe height and then descending the laser head to the machining height.
Further, before the moving the laser head along the predetermined processing path and simultaneously emitting the laser beam to the workpiece, the method further includes:
and the laser head descends to the processing height from the preset safety height after receiving the processing starting signal.
Further, the laser head is retracted by a predetermined distance after being lifted from the processing height at the interruption position to a predetermined safety height, and the method further includes:
determining an intersection point formed by a circle and a preset processing path, wherein the circle is formed by taking the interruption position as a circle center and taking the retraction preset distance as a radius; and
and retracting the laser head from the interruption position to the intersection point position.
A laser machining control apparatus, the apparatus comprising:
a processor configured to execute computer-executable instructions;
a memory storing one or more computer-executable instructions that, when executed by the processor, implement the method of any of the preceding claims.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the method of any of the preceding claims.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flowchart of a laser processing control method according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a motion track of the laser head shown in the corresponding embodiment of FIG. 1;
fig. 3 is a second flowchart of a laser processing control method according to an embodiment of the present application;
fig. 4 is a third flowchart of a laser processing control method according to an embodiment of the present application;
fig. 5 is a fourth flowchart of a laser processing control method according to an embodiment of the present disclosure;
fig. 6 is a fifth flowchart of a laser processing control method according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a motion trajectory of the laser head shown in a corresponding embodiment of FIG. 6;
fig. 8 is a block diagram of a laser processing control apparatus according to an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that, when a meta-structure is referred to as being "fixed" or "disposed" to another meta-structure, it may be directly on the other meta-structure or indirectly on the other meta-structure. When a meta structure is referred to as being "connected to" another meta structure, it can be directly connected to the other meta structure or indirectly connected to the other meta structure.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings that is used solely to facilitate the description of the application and to simplify the description, and do not indicate or imply that the referenced device or element structure must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of some applications, "plurality" means two or more unless specifically limited otherwise.
The application provides a laser processing control method, which can ensure that the interruption position of a workpiece can be completely processed after a laser head is interrupted and restarted in processing. For example, in the laser cutting process, when the laser cutting is restarted after being interrupted, the machining method can ensure that the interrupted position can be completely cut off, and the micro-connection condition does not exist.
Specifically, referring to fig. 1, the laser processing control method provided in the present application includes the steps of:
Specifically, when the laser head receives a machining start signal, the laser head moves relative to the workpiece along a predetermined machining path and simultaneously emits a laser beam to the workpiece to achieve machining of the workpiece. For example, the laser head can perform cutting, marking, cleaning, welding, or the like of a workpiece by emitting a laser beam to the workpiece.
And step 104, after the laser head receives the interrupt signal, the laser head stops emitting the laser beam to the workpiece, and the laser head firstly lifts from the machining height of the interrupt position to a preset safety height and then retreats for a preset distance.
Specifically, in the process of processing a workpiece by using laser, if the laser head receives an interrupt signal, the laser head stops emitting the laser beam to the workpiece (that is, the laser head stops processing the workpiece), and the laser head is lifted from the current processing height at the interrupt position to a preset safety height and then retreats for a preset distance. That is to say, in this application, earlier lift laser head to predetermined safe height and then carry out the backspacing, can avoid laser head backspacing's in-process to collide with the work piece or avoid having the risk of colliding with the work piece.
It can be understood that in the laser processing process, particularly in the laser cutting process, protrusions formed by waste residues and other reasons may exist on the edge surfaces of two sides of a kerf formed on a workpiece by laser, if the laser head is directly retracted from an interruption position, the laser head may collide with the protrusions, so that the laser head is lifted to a preset safety height and then retracted, collision of the laser head with the workpiece in the retraction process can be effectively avoided, and meanwhile, the laser head is lifted to the preset safety height after receiving an interruption signal, and the reason checking of workers can be facilitated.
Further, in the present application, the cause of the interrupt signal may be a malfunction of the apparatus, a collision of the laser head with the workpiece or a risk of collision with the workpiece, or a manual interrupt, or the like.
In the present application, the predetermined distance of the retraction may be 1mm, 2mm, 3mm, or the like, which is not limited herein.
And 106, after the laser head receives the restarting signal, the laser head descends to the processing height and continues to move along the preset processing path, and simultaneously emits the laser beam to the workpiece.
Specifically, when the laser head receives a restart signal (i.e., the laser head needs to continue to process the workpiece), the laser head is lowered from the retracted end position to the processing height and then continues to move along the predetermined processing path while emitting the laser beam toward the workpiece. That is, in the present application, since the laser head is retracted by a predetermined distance upon receiving the interrupt signal, the laser head can process the workpiece at the interrupt position again after receiving the restart signal to ensure that the workpiece at the interrupt position can be completely processed.
For example, referring to FIG. 2, in one embodiment.
(1) After the laser head receives the starting signal, the laser head moves from a starting point A to an end point F along a preset processing path, and simultaneously emits laser to the workpiece.
(2) When the laser head moves to the point B and receives an interrupt signal, the laser head stops emitting laser to the workpiece, then firstly lifts the current machining height point B of the laser head to the safe height point C, and then enables the laser head to retreat from the safe height point C by a preset distance to the point D, and at the moment, the whole laser head can be in a stop state.
(3) And after the laser head receives the restarting signal, the laser head descends from the retreating end position D to the processing height E, then continuously moves to the position F along a preset processing path, and simultaneously emits a laser beam to the workpiece to continuously process the workpiece.
That is, in the above embodiment, the laser head repeatedly processes the workpiece between the points E and B, which can ensure that the workpiece at the point B can be completely processed.
It can be seen that in the control method of the present application, after the laser processing is interrupted, the laser head is retracted by a predetermined distance, so that after the laser processing is restarted, the laser head can process the workpiece at the interrupted position again, so as to ensure that the workpiece at the interrupted position can be completely processed. In addition, in this application, the laser head carries out the lifting earlier and rolls back again and can guarantee that the laser head can not bump with the work piece at the in-process that rolls back.
Further, referring to fig. 3, in an embodiment of the present application, step 106 may further include:
and 107, if the laser head collides with the workpiece after being lowered to the machining height or has the risk of collision with the workpiece, the laser head is lifted to a preset avoidance height from the current machining height and then moves along a preset machining path and emits laser beams to the workpiece at the same time.
Specifically, after the laser head receives the restart signal, the laser head needs to be lowered from the predetermined safety height of the retraction to the processing height to continue processing the workpiece, but as described above, in the process of processing the workpiece by the laser, a protrusion may be generated in the region of the processing position, so that when the predetermined safety height of the retraction position of the laser head is lowered to the processing height, the laser head may collide with the protrusion of the workpiece or risk of collision occurs, and therefore, after receiving the collision signal or the signal of the risk of collision during the lowering process, the laser head first raises from the current processing height by the predetermined retraction height, and then continues to move along the predetermined processing path and simultaneously emits the laser beam to the workpiece.
In addition, it should be noted that the laser head may receive the collision signal or the signal with the risk of collision may be acquired by a sensor disposed at the laser head, and this manner is a common measure and is not described herein in any greater detail.
Further, referring to fig. 4, in an embodiment of the present application, step 106 may further include:
and step 108, in the process that the laser head continues to move to the interruption position along the preset processing path, if the laser head collides with the workpiece in the moving process or risks of collision with the workpiece exist, the laser head is lifted to the preset avoidance height from the current position height and then moves along the preset processing path.
Specifically, in the process that the laser head moves to the interruption position along the predetermined processing path from the current position after the laser head is lowered to the processing height from the predetermined safety height, since the laser head has already processed the workpiece corresponding to the path between the current position and the interruption position before the laser processing is interrupted, the workpiece on the part of the path may have a protrusion generated by the processing, so that the laser head may interfere with the workpiece in the process of moving along the predetermined path, and therefore, after receiving a collision signal or a signal of a risk of collision during the moving process of the laser head, the laser head first lifts up from the current processing height by the predetermined avoidance height, then continues to move along the predetermined processing path and simultaneously emits the laser beam to the workpiece.
It should be noted that, in the above embodiment, the current processing height may be a current processing height formed by descending the laser head from the predetermined safety height to the processing height, or a current processing height formed by descending the laser head from the predetermined safety height to the processing height and then ascending the laser head by the predetermined avoiding height.
In addition, in some embodiments, if the laser head is lifted to the preset avoiding height in the process of moving to the interruption position, the laser head can be stopped to repair the processing equipment. For example, the laser head may be set to move to the interruption position after receiving the restart signal, the number of times that the laser head lifts the predetermined avoidance height is 3, and when the laser head lifts the predetermined avoidance height 3 times in the moving process, the laser head still receives the collision signal or the signal of the risk of collision, and stops working.
Optionally, in an embodiment, in order to simplify the difficulty of controlling the laser head to raise the predetermined avoidance height when encountering or at risk of collision, in steps 107 and 108, the laser head is raised from the current machining height to the predetermined avoidance height, further comprising:
and lifting the laser head from the current machining height to a preset safety height and then descending to a preset avoiding height.
Specifically, after the laser head receives a collision signal or a signal with a collision risk in the moving process, the laser head is lifted to a preset safety height from the current machining height and then is lowered to a preset avoidance height.
It can be understood that in some high-precision machining, due to reasons such as flatness of a workpiece, the laser head can start vertical follow-up motion while moving in the horizontal direction along a preset machining path so as to adjust the machining height of the laser head in real time, and thus the current machining height of the laser head may be in a variable value, and the control difficulty of lifting the laser head from the current machining height to the preset avoiding height becomes large. That is to say, in an embodiment provided in the present application, since the value of the safety height may be predetermined before the workpiece is processed, the height is a fixed value (that is, the position where the laser head is lifted to the safety height is fixed), and since the avoidance height may also be predetermined before the workpiece is processed, the control difficulty of the lifting motion of the laser head may be reduced by first lifting the laser head to the safety height and then lowering the laser head to the avoidance height.
In addition, since the laser head may be raised to the avoidance height several times when moving from the restart position to the interruption position, the avoidance height may be predetermined as a percentage value of the safety height, for example, the avoidance height at which the laser head is raised for the first time may be set to 30% of the safety height, the avoidance height at which the laser head is raised for the second time may be set to 60% of the safety height, and the like.
Further, in an embodiment, in order to ensure the machining accuracy of the workpiece after the restart, in steps 107 and 108, during the process that the laser head moves from the restart position to the interruption position, if the laser head is lifted to a predetermined avoidance height, the method further includes:
after the laser head moves to the interruption position, the laser head is lowered to the processing height and then moves along the preset processing path.
Specifically, if the laser head is lifted up and retracted to a height in the process of moving from the restart position to the interruption position, it is described that the laser head is not at the machining height of the laser head after moving to the interruption position, and the laser head needs to be readjusted to the machining height after moving to the interruption position in order to enable the laser head to continue high-precision machining of the workpiece after the interruption position.
It can be understood that, since the corresponding workpiece from the restart position (e.g. position E in fig. 2) to the interruption position (e.g. position B in fig. 2) has been processed by the laser head once before, and the workpiece at the interruption position is generally only in the case of micro-connection, the laser head has low requirements on the processing precision during the movement from the restart position to the interruption position. In contrast, since the workpiece corresponding to the position from the interruption position (e.g., the position of the point B in fig. 2) to the end point of the machining (e.g., the position of the point F in fig. 2) is not machined, the laser head needs to machine the workpiece strictly according to the machining parameters to ensure the machining accuracy.
Optionally, in an embodiment, in order to simplify the difficulty in controlling the lowering of the laser head from the avoiding height to the processing height, after the laser head moves to the interrupting position, the laser head is lowered to the processing height and then moves along the predetermined processing path, further comprising:
and lifting the laser head from the current machining height to a preset safety height and then descending to a preset avoiding height.
Specifically, after the laser head moves to the interrupting position, the laser head is lifted from the current machining height to a preset safety height, and then is lowered from the safety height to the machining height required by the workpiece.
It can be understood that, since the laser head may perform the action of lifting the avoiding height during the process of moving the laser head from the restarting position to the interrupting position, and the lifting times may be multiple times, the current processing height of the laser head after the laser head moves to the interrupting position is an uncertain value, and the control difficulty of the laser head from the current processing height to the processing height required by the workpiece is increased. That is to say, in an embodiment provided by the present application, since the value of the safety height can be predetermined before the workpiece is processed, the height is a fixed value (that is, the position where the laser head is lifted to the safety height is fixed), and since the processing height required by the workpiece can also be predetermined before the workpiece is processed, the control difficulty of the lifting motion of the laser head can be reduced by firstly lifting the laser head to the safety height and then lowering the laser head to the processing height required by the workpiece.
Referring to fig. 5, before step 102, the method may further include:
and 101, after receiving a machining starting signal, the laser head descends to a machining height from a preset safety height.
That is to say, the laser head is after receiving processing start signal, need just begin to process the work piece after descending to the required processing height of work piece from a height position, and set up this height position into safe height position in this application for the position that the laser head was located during processing interruption lifting every time is unanimous with the laser head initial processing to reduce the settlement of different parameters, and then simplify the control degree of difficulty of laser head.
Referring to fig. 6, in an embodiment, step 104 further includes:
Specifically, referring to fig. 7, since the coordinates of the interruption position B are known and the retreat distance can be predetermined, after an intersection point E is formed between a circle formed by taking the interruption position B as the center and taking the retreat predetermined distance as the radius and a predetermined processing path, the intersection point is the end position in the horizontal direction where the laser head is to retreat.
It will be appreciated that in some implementations the predetermined path of laser machining may be an irregular curve, so in order to ensure that the laser head can be retracted onto the predetermined path after the interruption so that the workpiece can be machined continuously along the predetermined path after the restart, and further to ensure that the laser head can machine the interrupted position again, it is necessary to determine the end point coordinates of the retracted position of the laser head.
And step 204, retracting the laser head from the interruption position to the intersection position.
Specifically, in some embodiments, the laser head may be retracted along a predetermined processing path to an intersection location. In other embodiments, the laser head is moved back in a linear motion from the interruption position to the intersection position.
In addition, referring to fig. 8, the present application further provides a laser head idle movement control device, which includes a processor, and a memory.
Wherein the processor is configured to execute computer-executable instructions; the memory is configured to store one or more computer-executable instructions that, when executed by the processor, implement the laser machining control method described above.
The present application also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the laser machining control method described above.
The present application is intended to cover any variations, uses, or adaptations of the invention using its general principles and without departing from the spirit or essential characteristics thereof.
Claims (10)
1. A laser machining control method, characterized by comprising:
moving a laser head along a predetermined processing path while emitting a laser beam toward a workpiece;
when the laser head receives an interrupt signal, the laser head stops emitting laser beams to the workpiece, and the laser head firstly lifts from the machining height of the interrupt position to a preset safety height and then retreats for a preset distance; and
and when the laser head receives a restart signal, the laser head descends to a processing height and then continues to move along a preset processing path and simultaneously emits a laser beam to the workpiece.
2. The laser machining control method of claim 1, wherein the laser head continues to emit the laser beam toward the workpiece along the predetermined machining path after being lowered to the machining height after receiving the restart signal, further comprising:
if the laser head is lowered to the machining height and then collides with the workpiece or has the risk of colliding with the workpiece, the laser head is lifted to a preset avoidance height from the current machining height, then moves along a preset machining path and emits laser beams to the workpiece at the same time.
3. The laser machining control method of claim 1, wherein the laser head continues to emit the laser beam toward the workpiece along the predetermined machining path after being lowered to the machining height after receiving the restart signal, further comprising:
and in the process that the laser head continuously moves to the interruption position along the preset processing path, if the laser head collides with the workpiece or has the risk of colliding with the workpiece in the moving process, the laser head is lifted to the preset avoidance height from the current position height and then moves along the preset processing path.
4. The laser machining control method of claim 2 or 3, wherein during the movement of the laser head from the restart position to the interruption position, if the laser head is lifted to a predetermined avoidance height, the method further comprises:
and after the laser head moves to the interruption position, the laser head descends to a processing height and then moves along a preset processing path.
5. The laser machining control method of claim 2 or 3, wherein the laser head is elevated from a current machining height to a predetermined avoidance height, further comprising:
and lifting the laser head from the current machining height to a preset safety height and then descending to a preset avoiding height.
6. The laser machining control method of claim 4, wherein the laser head is lowered to a machining height and then moved along a predetermined machining path after being moved to the interrupting position, further comprising:
and lifting the laser head from the current machining height to a preset safe height and then descending the laser head to the machining height.
7. The laser processing control method of claim 1, further comprising, before moving the laser head along the predetermined processing path while emitting the laser beam toward the workpiece:
and the laser head descends to the processing height from the preset safety height after receiving the processing starting signal.
8. The laser machining control method of claim 1, wherein the laser head is retracted by a predetermined distance after being raised from the machining height at the interruption position to a predetermined safety height, further comprising:
determining an intersection point formed by a circle which is formed by taking the interruption position as a circle center and taking the retroversion preset distance as a radius and a preset processing path; and
and retracting the laser head from the interruption position to the intersection position.
9. A laser machining control apparatus, characterized in that the apparatus comprises:
a processor configured to execute computer-executable instructions;
a memory storing one or more computer-executable instructions that, when executed by the processor, implement the method of any one of claims 1-8.
10. A computer-readable storage medium, having stored thereon a computer program which, when executed by a processor, implements the method of any of the preceding claims 1-8.
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| CN202210160625.9A CN114625070A (en) | 2022-02-22 | 2022-02-22 | Laser processing control method, device and readable storage medium |
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| CN202210160625.9A CN114625070A (en) | 2022-02-22 | 2022-02-22 | Laser processing control method, device and readable storage medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117620554A (en) * | 2024-01-16 | 2024-03-01 | 江苏科钛机器人有限公司 | Welding robot and welding path planning method thereof |
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