CN114709355B - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
- Publication number
- CN114709355B CN114709355B CN202210443443.2A CN202210443443A CN114709355B CN 114709355 B CN114709355 B CN 114709355B CN 202210443443 A CN202210443443 A CN 202210443443A CN 114709355 B CN114709355 B CN 114709355B
- Authority
- CN
- China
- Prior art keywords
- cathode
- anode
- auxiliary
- contact hole
- auxiliary cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 119
- 239000002346 layers by function Substances 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 238000011049 filling Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 19
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 24
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 18
- 239000005711 Benzoic acid Substances 0.000 claims description 17
- 235000010233 benzoic acid Nutrition 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 8
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 6
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 claims description 6
- 238000007641 inkjet printing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 238000000137 annealing Methods 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 238000000859 sublimation Methods 0.000 description 5
- 230000008022 sublimation Effects 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- -1 LTPS) Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application provides a preparation method of a display panel and the display panel, wherein the preparation method comprises the following steps: an anode and an auxiliary cathode are arranged on the substrate at intervals; providing a functional layer, wherein the functional layer comprises a functional part corresponding to the anode and a filling part corresponding to the auxiliary cathode; forming a contact hole on the filling part; a release part is arranged in the contact hole; arranging an electron transport layer on the functional layer to obtain an intermediate panel; heating the middle panel to sublimate the release part and hollowed out the part of the electron transport layer corresponding to the contact hole so as to expose the auxiliary cathode; the cathode is arranged such that the cathode is connected in parallel with the auxiliary cathode. Before the electron transport layer is prepared, a release part is arranged in the contact hole, after the electron transport layer is prepared, the release part is sublimated through heating and annealing, and the part of the electron transport layer corresponding to the contact hole is taken away to enable the contact hole to be hollowed out, so that the parallel connection of the cathode and the auxiliary cathode is facilitated, and the influence of the preparation process of the display panel on the overlap joint of the cathode and the auxiliary cathode is reduced.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel.
Background
An OLED (Organic Light-Emitting Diode) display device is a recent research hot spot, which has advantages of self-luminescence, all-solid state, high contrast, and the like, and can realize a soft screen design.
Among them, in order to increase the resolution of the OLED display device, more and more top emission type display devices have been developed. For top emission type display devices, the light transmittance and conductivity of the cathode have an important role for the device, however, good conductivity and high light transmittance are a pair of contradictors, and a cathode with high light transmittance generally has a large voltage drop. At present, an auxiliary cathode is arranged, namely an auxiliary cathode contact hole is manufactured in a display area of a display panel, current input is carried out through an auxiliary cathode wiring with low resistance at the lower layer, and the voltage and current loss of the display area of the display panel is reduced, so that the display uniformity of the display area is improved. However, the conventional display panel is prone to the problem of abnormal overlap of the cathode and the auxiliary cathode during the manufacturing process.
Disclosure of Invention
The embodiment of the application provides a preparation method of a display panel and the display panel, which are used for solving the problem that the existing display panel is easy to cause abnormal overlap joint of a cathode and an auxiliary cathode in the manufacturing process.
In a first aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:
an anode and an auxiliary cathode are arranged on the substrate at intervals;
providing a functional layer on the anode and the auxiliary cathode, wherein the functional layer comprises a functional part corresponding to the anode and a filling part corresponding to the auxiliary cathode;
forming a contact hole in the filling part to expose the auxiliary cathode;
a release part is arranged in the contact hole;
arranging an electron transport layer on the functional layer to obtain an intermediate panel;
heating the middle panel to sublimate the release part and hollowed out the part of the electron transport layer corresponding to the contact hole so as to expose the auxiliary cathode;
and disposing a cathode on the electron transport layer such that the cathode is connected in parallel with the auxiliary cathode.
Optionally, the heating the middle panel to sublimate the release portion and hollowed out a portion of the electron transport layer corresponding to the contact hole to expose the auxiliary cathode includes:
turning over the middle panel so that the electron transport layer is positioned below the substrate in the gravity direction;
and heating the middle panel to sublimate the release part and enable the part of the electron transport layer corresponding to the contact hole to fall off under the action of gravity so as to expose the auxiliary cathode.
Optionally, the disposing an electron transport layer on the functional layer to obtain an intermediate panel includes:
and setting the thickness of the electron transport layer corresponding to the contact hole area to be smaller than the thickness of the release part.
Optionally, the setting the thickness of the electron transport layer corresponding to the contact hole area to be smaller than the thickness of the release portion includes:
the ratio of the thickness of the release part to the thickness of the region of the electron transport layer corresponding to the contact hole is set to 2-10.
Optionally, heating the intermediate panel is performed in a vacuum chamber having a vacuum degree of 10Pa;
the temperature range for heating the intermediate panel is 80-100 ℃.
Optionally, the release part is made of benzoic acid; before the release part is arranged in the contact hole, the preparation method further comprises the following steps:
weighing benzoic acid with first mass;
adding the benzoic acid into a solvent with second mass to obtain a solution with first mass fraction, wherein the solvent is one or a mixture of diethylene glycol, triethylene glycol dimethyl ether and 2-benzyloxy ethanol;
the solution is heated to dissolve the benzoic acid sufficiently.
Optionally, the disposing a release portion in the contact hole includes:
printing the solution into the contact holes by inkjet printing;
and drying the solution to obtain the release part.
Optionally, the anode and the auxiliary cathode are disposed at intervals on the substrate, including:
a plurality of anodes arranged in an array are arranged on the substrate;
the auxiliary cathodes are arranged between two adjacent columns of anodes, the auxiliary cathodes extend from the first anode to the last anode of one column, or the auxiliary cathodes comprise a plurality of auxiliary sections, and the auxiliary sections are arranged at intervals.
Optionally, the anode and the auxiliary cathode are disposed at intervals on the substrate, and the method further includes:
a plurality of anodes arranged in an array are arranged on the substrate;
the auxiliary cathodes are arranged between two adjacent rows of the anodes, and the auxiliary cathodes extend from the first anode to the last anode of one row of the anodes.
In a second aspect, an embodiment of the present application further provides a display panel, which is prepared by the preparation method of any one of the foregoing methods, where the display panel includes:
an anode;
an auxiliary cathode spaced from the anode;
the functional layer is arranged on one side of the anode and the auxiliary cathode, and comprises a functional part corresponding to the anode and a filling part corresponding to the auxiliary cathode, and the filling part is provided with a contact hole so as to expose the auxiliary cathode;
the electron transmission layer is arranged on one side of the functional layer, which is away from the anode, and a through hole is formed in the position, corresponding to the contact hole, of the electron transmission layer so as to expose the auxiliary cathode; and
and the cathode is arranged on one side of the electron transmission layer, which is away from the anode, and the cathode is connected with the auxiliary cathode in parallel.
According to the manufacturing method of the display panel and the display panel, the release part is arranged in the contact hole before the electron transport layer is manufactured, the release part is sublimated through heating annealing after the electron transport layer is manufactured, the part, corresponding to the contact hole, of the electron transport layer is taken away to enable the part to be hollowed out, so that the auxiliary cathode is exposed, the parallel connection of the cathode and the auxiliary cathode is facilitated, the influence of the manufacturing process of the display panel on the lap joint of the cathode and the auxiliary cathode is reduced, the voltage drop between the cathode and the auxiliary cathode is reduced, and the display uniformity of the display panel is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort to a person skilled in the art.
For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.
Fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a manufacturing process of a display panel according to an embodiment of the present application.
Fig. 4 is a schematic view of a first structure of an anode and an auxiliary cathode in the display panel shown in fig. 1.
Fig. 5 is a schematic view showing a second structure of an anode and an auxiliary cathode in the display panel shown in fig. 1.
Fig. 6 is a schematic view of a third structure of an anode and an auxiliary cathode in the display panel shown in fig. 1.
Fig. 7 is a schematic view of a fourth structure of an anode and an auxiliary cathode in the display panel shown in fig. 1.
Fig. 8 is a flow chart of a preparation method of a release part according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the existing display panel, after the functional layer is printed, an electron transport layer needs to be evaporated, and the electron transport layer can cover the contact hole, so that the overlap joint between the cathode and the auxiliary cathode in the subsequent process is abnormal. In the prior art, a laser is generally used to carbonize an electron transport layer in a contact hole and then manufacture a cathode. However, the laser easily damages the electrode in the contact hole, resulting in abnormal overlap between the cathode and the auxiliary cathode, and further resulting in a problem of secondary voltage drop. In addition, the laser system is high in price, the laser source needs to be replaced frequently, the production cost is high, and the yield is low.
In order to solve the above problems, embodiments of the present application provide a manufacturing method of a display panel and a display panel, which will be described below with reference to the accompanying drawings.
For example, referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a display panel according to an embodiment of the disclosure. The embodiment of the application provides a display panel 1, wherein the display panel 1 can comprise an OLED device, the OLED device is a current type organic light emitting device, the phenomenon of light emission is caused by carrier injection and recombination, and the light emission intensity is in direct proportion to the injected current. Under the action of an electric field, holes generated by the anode and electrons generated by the cathode of the OLED move, are respectively injected into the hole transport layer and the electron transport layer, and migrate to the light emitting layer. When the two meet at the light emitting layer, an energy exciton is generated, thereby exciting the light emitting molecule to finally generate visible light.
It should be noted that the display panel 1 may include a driving layer and a pixel layer, where the driving layer is electrically connected to the pixel layer to drive light emission of the pixel layer. The pixel layer may include a plurality of sub-pixels arranged in an array, and a driving unit, that is, a thin film transistor (Thin Film Transistor, TFT), is disposed corresponding to each sub-pixel.
The display panel 1 may include an anode 10, an auxiliary cathode 20, a functional layer 30, an electron transport layer 40, and a cathode 50, for example. It is understood that the above-described anode 10, auxiliary cathode 20, functional layer 30, electron transport layer 40, and cathode 50 may be understood as constituent structures of pixel layers. The anode 10 and the auxiliary cathode 20 may be disposed at intervals, and each sub-pixel corresponds to one anode 10. For example, the auxiliary cathode 20 may be disposed between adjacent two anodes 10, i.e., the auxiliary cathode 20 may be disposed between adjacent two sub-pixels.
The functional layer 30 is disposed at one side of the anode 10 and the auxiliary cathode 20, and the functional layer 30 includes a functional portion 31 corresponding to the anode 10 and a filling portion 32 corresponding to the auxiliary cathode 20. The filling portion 32 is provided with a contact hole 320 to expose the auxiliary cathode 20. The functional part 31 may include a hole injection Layer (Hole Injection Layer, HIL), a hole transport Layer (Hole Transport Layer, HTL), and an Emission Layer (EML) stacked on the anode 10. It should be noted that in some embodiments, the electron transport layer 40 and the cathode 50 may also be part of the functional layer 30. The present embodiment is described taking an example in which the functional section 31 of the functional layer 30 includes the HIL, HTL, and EML, and should not be construed as limiting the functional layer 30 and the functional section 31. Further, the functional section 31 is not limited to the above-described components, and, for example, in some embodiments, the functional section 31 may further include, for example, a Hole Blocking Layer (HBL), an electron blocking Layer (Electron Block Layer, EBL), a Capping Layer (CPL), and the like.
Here, the functional portion 31 may further include a pixel defining layer disposed on the anode 10, and the pixel defining layer is provided with an accommodating space to accommodate the functional portion 31. It is understood that the pixel definition layer may be understood as a barrier of the interval between adjacent sub-pixels to distinguish between different sub-pixels or to prevent interference between different sub-pixels.
An electron transport layer (Electron Transport Layer, ETL) 40 is provided on the side of the functional layer 30 facing away from the anode 10. The electron transport layer 40 is provided with a through hole 41 at a position corresponding to the contact hole 320 to expose the auxiliary cathode 20.
The cathode 50 is disposed on a side of the electron transport layer 40 facing away from the anode 10, and the cathode 50 is connected in parallel with the auxiliary cathode 20 to reduce the impedance of the cathode 50 for transport, thereby reducing the voltage drop of the cathode 50, so that the display uniformity of the display panel 1 is improved.
It should be noted that, the electron transport layer 40 is generally disposed on the whole surface, and the electron transport layer 40 is generally prepared by an evaporation process. Accordingly, the electron transport layer 40 may be filled into the contact hole 320, resulting in poor overlap of the auxiliary cathode 20 and the cathode 50. Whereas the HIL, HTL, and EML for the functional part 31 are generally prepared by dot printing, there is no problem of shielding the contact hole 320. The electron transport layer 40 in the contact hole 320 is removed by laser in the prior art, but the laser easily damages the contact hole 320, resulting in a secondary voltage drop of the cathode 50 and the laser is expensive.
In order to solve the above-described problems, the present embodiment improves the manufacturing process of the display panel 1, and will be described below from the viewpoint of the manufacturing method of the display panel.
For example, please refer to fig. 1 in combination with fig. 2 and fig. 3, fig. 2 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application, and fig. 3 is a schematic flow chart of a process for manufacturing a display panel according to an embodiment of the present application. The preparation method of the display panel comprises the following steps:
101. an anode and an auxiliary cathode are disposed on the substrate at intervals.
In order to make the constituent parts of the display panel 1 relatively flat, the respective layer structures may be optionally prepared on a substrate 60, and the substrate 60 may be of a glass material.
The fabrication of the display panel 1 may further include fabrication of a driving layer, which may be a low temperature polysilicon (Low Temperature Poly-Silicon, LTPS), indium gallium zinc oxide (Indium Gallium Zinc Oxide, IGZO) or the like structure, before fabrication of the anode 10 and the auxiliary cathode 20. The driving layer is used to drive the pixel layer to emit light, and the pixel layer may include an anode 10, an auxiliary cathode 20, a functional layer, an electron transport layer, and a cathode. In order to facilitate the description of the process improvement of the contact hole location in the embodiments of the present application, the preparation of the driving layer is not described in detail herein.
The anode 10 and the auxiliary cathode 20 can be prepared in the same layer, so that the preparation of the auxiliary cathode 20 can be facilitated, and the preparation of the metal material of the auxiliary cathode 20 is not required to be additionally added.
The anode 10 may have a circular, square or diamond sheet structure, and each sub-pixel is correspondingly provided with one anode 10. In the display panel 1, the subpixels may be arranged in an array. Accordingly, in preparing the anode 10, a plurality of anodes 10 arranged in an array may be provided on the substrate 60. There may be various situations for the position and shape of the auxiliary cathode 20. For example, the auxiliary cathode 20 is disposed between two adjacent columns of anodes 10. Referring to fig. 4 in conjunction with fig. 1 to 3, fig. 4 is a schematic view of a first structure of an anode and an auxiliary cathode in the display panel shown in fig. 1. In the first case, the auxiliary cathode 20 extends from the first to the last of the anodes 10 in a row, that is, the auxiliary cathode 20 may have a strip shape, and the auxiliary cathode 20 may have a width of 15 μm. Referring to fig. 5 in conjunction with fig. 1 to 4, fig. 5 is a schematic view of a second structure of an anode and an auxiliary cathode in the display panel shown in fig. 1. In the second case, the auxiliary cathode 20 may include a plurality of auxiliary segments 21, the plurality of auxiliary segments 21 are spaced apart, and each auxiliary segment 21 may have a circular shape, and at least one anode 10 is spaced apart to be correspondingly provided with the auxiliary segment 21. For example, using a 65 inch television product as an example, the auxiliary segments 21 may be disposed between the anodes 10 corresponding to the R sub-pixels, the spacing between adjacent auxiliary segments 21 may be 175 microns, and the diameter of the auxiliary segments 21 may be 25 microns. Referring to fig. 6 in conjunction with fig. 1 to 5, fig. 6 is a schematic view of a third structure of an anode and an auxiliary cathode in the display panel shown in fig. 1. In the third case, the auxiliary cathode 20 may include a plurality of auxiliary segments 21 disposed at intervals, and each auxiliary segment 21 may have a rectangular shape. For example, using a 65 inch television product as an example, the width of auxiliary segment 21 may be 15 microns and the length of auxiliary segment 21 may be 88 microns. For another example, the auxiliary cathode 20 is disposed between two adjacent rows of the anodes 10. Referring to fig. 7 in conjunction with fig. 1 to 6, fig. 7 is a schematic diagram of a fourth structure of an anode and an auxiliary cathode in the display panel shown in fig. 1. In the fourth case, the auxiliary cathode 20 has an elongated structure, and the auxiliary cathode 20 extends from the first to the last of the anodes 10 of a row. The width of the auxiliary cathode 20 may be referred to as the width of the auxiliary cathode 20 in the first case, and will not be described again.
It should be noted that, the setting manner of the auxiliary cathode 20 may be any one of the above four cases, or the setting manner of the auxiliary cathode 20 may be any two, any three or a combination of the four cases, and when the auxiliary cathode 20 is combined, the length of the auxiliary cathode may be adjusted as required, which is not described herein.
102. Functional layers are arranged on the anode and the auxiliary cathode, and each functional layer comprises a functional part corresponding to the anode and a filling part corresponding to the auxiliary cathode.
The functional layer 30 is disposed at one side of the anode 10 and the auxiliary cathode 20, and the functional layer 30 includes a functional portion 31 corresponding to the anode 10 and a filling portion 32 corresponding to the auxiliary cathode 20. The filling portion 32 is provided with a contact hole 320 to expose the auxiliary cathode 20. The functional part 31 may include an HIL, an HTL, and an EML stacked on the anode 10. It should be noted that in some embodiments, the electron transport layer 40 and the cathode 50 may also be part of the functional layer 30. The present embodiment is described taking an example in which the functional section 31 of the functional layer 30 includes the HIL, HTL, and EML, and should not be construed as limiting the functional layer 30 and the functional section 31. Further, the functional section 31 is not limited to the above-described components, and, for example, in some embodiments, the functional section 31 may also include HBL, EBL, CPL, and the like.
Here, the functional portion 31 may further include a pixel defining layer disposed on the anode 10, and the pixel defining layer is provided with an accommodating space to accommodate the functional portion 31. It is understood that the pixel definition layer may be understood as a barrier of the interval between adjacent sub-pixels to distinguish between different sub-pixels or to prevent interference between different sub-pixels.
In the process of manufacturing the HIL, the HTL and the EML, the HIL, the HTL and the EML can be manufactured by means of ink-jet printing, and then the HIL, the HTL and the EML are manufactured through a vacuum drying and heating baking process.
103. And forming a contact hole on the filling part to expose the auxiliary cathode.
The filling portion 32 may be understood as an area between adjacent sub-pixels, the filling portion 32 is used to space different sub-pixels, and the filling portion 32 is disposed corresponding to the auxiliary cathode 20.
Since the auxiliary cathode 20 is connected in parallel with the cathode to reduce the impedance of cathode transmission, and the filling portion 32 and the electron transmission layer are disposed between the cathode and the auxiliary cathode 20, the auxiliary cathode 20 can be exposed by opening the contact hole 320 on the filling portion 32, so that the subsequent connection with the cathode can be facilitated.
104. A release portion is provided in the contact hole.
In this embodiment, in order to prevent the laser from damaging the contact hole 320 when processing the electron transport layer in the contact hole 320, the release portion 70 is selected to be disposed in the contact hole 320, and the release portion 70 can sublimate under the condition of thermal annealing, so that the release portion 70 in the contact hole 320 can be eliminated and the electron transport layer corresponding to the contact hole 320 can be taken away, and the contact hole 320 is not damaged.
Illustratively, the material of the release portion 70 may be selected to have a sublimation point between 80 ℃ and 100 ℃, for example, the material of the release portion 70 may be benzoic acid.
105. An electron transport layer is provided on the functional layer to obtain an intermediate panel.
The electron transport layer 40 is generally a whole-surface structure, and the electron transport layer 40 can be formed by an evaporation process at the time of formation. Because the vapor deposition process cannot achieve the fixed-point vapor deposition, or the vapor deposition process is very complicated in implementation means, the electron transport layer 40 after vapor deposition covers the contact hole 320, thereby blocking the connection between the auxiliary cathode 20 and the cathode. Therefore, when the release portion 70 is disposed, the sublimation treatment is performed on the release portion to carry away the electron transport layer 40 corresponding to the release portion 70, so as to expose the auxiliary cathode 20, thereby facilitating connection between the auxiliary cathode 20 and the cathode.
In the process of manufacturing the release portion 70 and the electron transport layer 40, the thickness of the region of the electron transport layer 40 corresponding to the contact hole 320 may be set smaller than the thickness of the release portion 70. For example, the ratio of the thickness of the release portion 70 to the thickness of the region of the electron transport layer 40 corresponding to the contact hole 320 may be set to 2 to 10, that is, the thickness of the release portion 70 is greater than the thickness of the electron transport layer 40. It will be appreciated that the electron transport layer 40 is entirely evaporated, and thus, the thickness of the electron transport layer 40 may be uniform in various regions to facilitate fabrication of the electron transport layer 40.
The prepared substrate 60, anode 10, auxiliary cathode 20, functional layer 30, release portion 70 and electron transport layer 40 are taken as an intermediate panel 80, and then the intermediate panel 80 may be subjected to a heat treatment to sublimate the release portion 70 and take away a portion of the electron transport layer 40 corresponding to the contact hole 320, whereby the auxiliary cathode 20 may be exposed to facilitate connection of the auxiliary cathode 20 with the cathode.
It should be noted that, an electron injection layer may be further disposed on the electron transport layer 40, then a cathode may be disposed, and finally the package is performed, thereby completing the preparation of the display panel 1. The electron injection layer can also be manufactured by adopting an evaporation process. The region of the electron injection layer corresponding to the contact hole 320 may also be hollowed out by sublimation of the release portion 70, and reference may be made to the description of the electron transport layer 40, which is not repeated here.
106. And heating the middle panel to sublimate the release part and hollowed out the part of the electron transport layer corresponding to the contact hole so as to expose the auxiliary cathode.
The heating of the intermediate panel 80 is performed in a vacuum chamber, and the vacuum degree of the vacuum chamber may be 10Pa. The temperature range for heating the intermediate panel 80 is 80-100 deg.c. The purpose of heating the intermediate panel 80 is to sublimate the release portion 70, and therefore, the heating temperature may be the sublimation point temperature of the release portion 70. And, the heating temperature cannot be excessively high to prevent the stability of the electron transport layer 40 from being affected.
When the intermediate panel 80 is heated, the release portion 70 sublimates from a solid to a gas under the action of high temperature, the radius of molecules becomes large, and the release portion 70 does work outwards according to the law of conservation of energy, so that the electron transport layer 40 corresponding to the contact hole 320 and the electron transport layer 40 in other regions can be broken, and the region of the electron transport layer 40 corresponding to the contact hole 320 can be hollowed out. In other words, the process is similar to the principle of explosion, after the releasing portion 70 reaches the sublimation point, the releasing portion 70 is converted from solid into gas, and the pressure in the contact hole 320 is increased, so that the region of the electron transport layer 40 corresponding to the contact hole 320 is broken, and the electron transport layer 40 corresponding to the contact hole 320 is taken away, so that the region of the electron transport layer 40 corresponding to the contact hole 320 is hollowed out.
Before heating, or when the intermediate panel 80 is placed, the intermediate panel 80 may be turned over so that the electron transport layer 40 is positioned under the substrate 60 in the direction of gravity. Then, the intermediate panel 80 is heated to sublimate the release portion 70 and to drop off the portion of the electron transport layer 40 corresponding to the contact hole 320 by gravity, so that the auxiliary cathode 20 can be exposed.
Of course, there may be other ways to remove the detached electron transport layer 40, such as oscillating and flipping the heated intermediate panel 80 multiple times to clean the detached electron transport layer 40. For another example, the heated intermediate panel 80 may be cleaned, and the detached electron transport layer 40 is washed away with water.
107. A cathode is disposed on the electron transport layer such that the cathode is connected in parallel with the auxiliary cathode.
The cathode 50 can also be manufactured by an evaporation process, and a part of cathode 50 material enters the contact hole 320 during the evaporation process of the cathode 50, so that the cathode 50 and the auxiliary cathode 20 are connected in parallel, thereby solving the problem of uneven display of the display panel caused by overlarge voltage drop of the cathode 50 in the prior art.
In the manufacturing method of the display panel and the display panel 1 of the embodiments of the present application, the release portion 70 is first disposed in the contact hole 320 before the electron transport layer 40 is manufactured, after the electron transport layer 40 is manufactured, the release portion 70 is sublimated by heating and annealing, and the portion of the electron transport layer 40 corresponding to the contact hole 320 is taken away to be hollowed out, so as to expose the auxiliary cathode 20, further facilitate the parallel connection of the cathode 50 and the auxiliary cathode 20, reduce the influence of the manufacturing process of the display panel 1 on the overlap joint of the cathode 50 and the auxiliary cathode 20, reduce the voltage drop between the cathode 50 and the auxiliary cathode 20, and improve the display uniformity of the display panel 1.
In the case of manufacturing the release portion 70, the following method may be referred to.
For example, please refer to fig. 1 to 7 in combination with fig. 8, fig. 8 is a flow chart of a preparation method of a release portion according to an embodiment of the present application. The embodiment of the application also provides a preparation method of the release part, which comprises the following steps:
201. the first mass of benzoic acid is weighed.
202. And adding benzoic acid into a second mass of solvent to obtain a first mass fraction solution, wherein the solvent is one or a mixture of diethylene glycol, triethylene glycol dimethyl ether and 2-benzyloxy ethanol.
Regarding steps 201 and 202:
to prepare the release portion 70 of a suitable thickness, the concentration thereof may be experimentally and adjusted. For example, experiments are performed on benzoic acid with different mass fractions, where the different mass fractions may be 50mg/mL, 100mg/mL, and 150mg/mL, that is, the ratio of the first mass of benzoic acid to the second mass of solvent may be the first mass fraction, and the experiment determines that, in order to obtain the release portion 70 with a suitable thickness, the release portion 70 prepared from a benzoic acid solution with the first mass fraction of 100mg/mL meets the requirements.
Any one solvent of diethylene glycol, triethylene glycol dimethyl ether and 2-benzyloxy ethanol can be selected as the solvent, any two solvents of diethylene glycol, triethylene glycol dimethyl ether and 2-benzyloxy ethanol can be selected as the solvent, and the three solvents of diethylene glycol, triethylene glycol dimethyl ether and 2-benzyloxy ethanol can be mixed according to a certain proportion.
203. The solution was heated to fully dissolve the benzoic acid.
The prepared solution was heated to allow the benzoic acid solid to dissolve sufficiently. The heating temperature may be, for example, 40 to 60℃and the heating period may be 0.5 to 2 hours.
204. The solution was printed into the contact holes by inkjet printing.
205. The solution was dried to obtain a release section.
Regarding steps 204 and 205:
the benzoic acid solution is printed into the contact holes 320 by means of inkjet printing and then dried under vacuum, thereby completing the preparation of the release portion 70.
In the manufacturing method of the display panel and the display panel 1 of the embodiments of the present application, the release portion 70 is first disposed in the contact hole 320 before the electron transport layer 40 is manufactured, after the electron transport layer 40 is manufactured, the release portion 70 is sublimated by heating and annealing, and the portion of the electron transport layer 40 corresponding to the contact hole 320 is taken away to be hollowed out, so as to expose the auxiliary cathode 20, further facilitate the parallel connection of the cathode 50 and the auxiliary cathode 20, reduce the influence of the manufacturing process of the display panel 1 on the overlap joint of the cathode 50 and the auxiliary cathode 20, reduce the voltage drop between the cathode 50 and the auxiliary cathode 20, and improve the display uniformity of the display panel 1.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.
The above description is made in detail on the preparation method of the display panel and the display panel provided by the embodiment of the present application, and specific examples are applied herein to illustrate the principles and embodiments of the present application, where the above description of the embodiment is only used to help understand the method of the present application and the core idea thereof; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.
Claims (8)
1. A method for manufacturing a display panel, comprising:
an anode and an auxiliary cathode are arranged on the substrate at intervals;
setting functional layers prepared by fixed-point printing on the anode and the auxiliary cathode, wherein the functional layers comprise functional parts corresponding to the anode and filling parts corresponding to the auxiliary cathode;
forming a contact hole in the filling part to expose the auxiliary cathode;
a release part is arranged in the contact hole;
arranging an entire electron transport layer on the functional layer to obtain an intermediate panel; setting the thickness of the electron transport layer corresponding to the contact hole area to be smaller than the thickness of the release part;
turning over the middle panel so that the electron transport layer is positioned below the substrate in the gravity direction;
heating the middle panel to sublimate the release part and enable the part of the electron transport layer corresponding to the contact hole to fall off under the action of gravity so as to expose the auxiliary cathode;
and disposing a cathode on the electron transport layer such that the cathode is connected in parallel with the auxiliary cathode.
2. The method according to claim 1, wherein the setting the thickness of the electron transport layer corresponding to the contact hole region smaller than the thickness of the release portion, comprises:
the ratio of the thickness of the release part to the thickness of the region of the electron transport layer corresponding to the contact hole is set to 2-10.
3. The method of claim 1, wherein heating the intermediate panel is performed in a vacuum chamber having a vacuum of 10Pa;
the temperature range for heating the intermediate panel is 80-100 ℃.
4. A method of manufacturing according to claim 3, wherein the material of the release portion is benzoic acid; before the release part is arranged in the contact hole, the preparation method further comprises the following steps:
weighing benzoic acid with first mass;
adding the benzoic acid into a solvent with second mass to obtain a solution with first mass fraction, wherein the solvent is one or a mixture of diethylene glycol, triethylene glycol dimethyl ether and 2-benzyloxy ethanol;
the solution is heated to dissolve the benzoic acid sufficiently.
5. The method of manufacturing according to claim 4, wherein the disposing a release portion in the contact hole comprises:
printing the solution into the contact holes by inkjet printing;
and drying the solution to obtain the release part.
6. The method of claim 1, wherein the disposing the anode and the auxiliary cathode on the substrate at intervals comprises:
a plurality of anodes arranged in an array are arranged on the substrate;
the auxiliary cathodes are arranged between two adjacent columns of anodes, the auxiliary cathodes extend from the first anode to the last anode of one column, or the auxiliary cathodes comprise a plurality of auxiliary sections, and the auxiliary sections are arranged at intervals.
7. The method of claim 1, wherein the anode and the auxiliary cathode are disposed on the substrate at intervals, further comprising:
a plurality of anodes arranged in an array are arranged on the substrate;
the auxiliary cathodes are arranged between two adjacent rows of the anodes, and the auxiliary cathodes extend from the first anode to the last anode of one row of the anodes.
8. A display panel prepared by the preparation method of any one of claims 1 to 7, wherein the display panel comprises:
an anode;
an auxiliary cathode spaced from the anode;
the functional layer is arranged on one side of the anode and the auxiliary cathode, and comprises a functional part corresponding to the anode and a filling part corresponding to the auxiliary cathode, and the filling part is provided with a contact hole so as to expose the auxiliary cathode;
the whole surface of the electron transmission layer is arranged on one side of the functional layer, which is away from the anode, and a through hole is arranged at the position of the electron transmission layer, which corresponds to the contact hole, so as to expose the auxiliary cathode; and
and the cathode is arranged on one side of the electron transmission layer, which is away from the anode, and the cathode is connected with the auxiliary cathode in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210443443.2A CN114709355B (en) | 2022-04-25 | 2022-04-25 | Display panel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210443443.2A CN114709355B (en) | 2022-04-25 | 2022-04-25 | Display panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114709355A CN114709355A (en) | 2022-07-05 |
| CN114709355B true CN114709355B (en) | 2024-01-26 |
Family
ID=82175053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210443443.2A Active CN114709355B (en) | 2022-04-25 | 2022-04-25 | Display panel and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114709355B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288075A (en) * | 2007-05-18 | 2008-11-27 | Sony Corp | Method of manufacturing display device, and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7306970B2 (en) * | 2004-08-30 | 2007-12-11 | International Business Machines Corporation | Method and apparatus for manufacturing an optoelectronic device |
| KR20140067527A (en) * | 2012-11-26 | 2014-06-05 | 삼성디스플레이 주식회사 | Display device and organic light emitting display device |
-
2022
- 2022-04-25 CN CN202210443443.2A patent/CN114709355B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288075A (en) * | 2007-05-18 | 2008-11-27 | Sony Corp | Method of manufacturing display device, and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114709355A (en) | 2022-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9018647B2 (en) | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method | |
| US9249493B2 (en) | Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same | |
| KR101738531B1 (en) | Method for manufacturing of organic light emitting display apparatus, and organic light emitting display apparatus manufactured by the method | |
| JP5676175B2 (en) | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same | |
| JP5611718B2 (en) | Thin film deposition apparatus and organic light emitting display device manufacturing method using the same | |
| TWI427681B (en) | Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same | |
| KR101801351B1 (en) | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same and organic light emitting display apparatus using the same | |
| US8833294B2 (en) | Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same | |
| JP5985796B2 (en) | Thin film deposition apparatus and organic light emitting display device manufacturing method | |
| US9012258B2 (en) | Method of manufacturing an organic light-emitting display apparatus using at least two deposition units | |
| US20120299016A1 (en) | Organic layer deposition apparatus and method of manufacturing organic light emitting display device using the organic layer deposition apparatus | |
| US20150217319A1 (en) | Organic Layer Deposition Apparatus, Frame Sheet Assembly For The Organic Layer Deposition Apparatus, And Method Of Manufacturing Organic Light Emitting Display Device Using The Frame Sheet Assembly | |
| KR101146996B1 (en) | Method for manufacturing of organic light emitting display apparatus | |
| US20120025182A1 (en) | Donor substrate, process for production of transfer film, and process for production of organic electroluminescent element | |
| US8486737B2 (en) | Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same | |
| US20120103253A1 (en) | Organic layer deposition apparatus | |
| US8883259B2 (en) | Thin film deposition apparatus | |
| US20090220680A1 (en) | Oled device with short reduction | |
| US9234270B2 (en) | Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus | |
| JP2008108482A (en) | Organic el display device | |
| US20090220705A1 (en) | Method for manufacturing organic el display device | |
| JP2006202510A (en) | Manufacturing method of organic el device | |
| JP2009230956A (en) | Manufacturing method of organic electroluminescent display device | |
| CN114709355B (en) | Display panel and preparation method thereof | |
| KR101174885B1 (en) | Apparatus for thin layer deposition and method for manufacturing of organic light emitting display apparatus using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |