CN114709265B - A display panel and a method for manufacturing the same - Google Patents
A display panel and a method for manufacturing the same Download PDFInfo
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- CN114709265B CN114709265B CN202210332833.2A CN202210332833A CN114709265B CN 114709265 B CN114709265 B CN 114709265B CN 202210332833 A CN202210332833 A CN 202210332833A CN 114709265 B CN114709265 B CN 114709265B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6723—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
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Abstract
The application provides a display panel and a preparation method thereof, wherein the display panel comprises a driving backboard, a driving circuit layer and a reflecting layer, the driving backboard comprises a substrate base plate, the driving circuit layer is arranged on the substrate base plate and comprises a plurality of terminal parts, the reflecting layer is arranged on the driving circuit layer and comprises a plurality of windows, the windows are arranged in one-to-one correspondence with the terminal parts, and the reflecting layer further comprises a plurality of openings which are arranged at intervals with the windows. According to the application, the opening is arranged on the reflecting layer, so that the internal stress generated in the baking treatment process of the reflecting layer can be released, the risk of cracking of the reflecting layer is effectively reduced, and the yield of the display panel is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
With the continuous improvement of display panel manufacturing technology, higher requirements are also put on the performance and quality of display panels. The Mini-LED can realize the highlight effect which is more than 1000nits, can be directly used as a pixel unit of a display panel to realize micro display, and can be applied to a backlight module and matched with a regional dimming technology to realize the high-contrast display effect of an OLED (organic light emitting diode).
In the existing display panel, the Mini-LED driving backboard generally comprises a driving circuit layer and LED chips arranged on the driving circuit layer in an array manner, wherein a plurality of Thin Film Transistors (TFTs) are arranged in the driving circuit layer, and in order to ensure the working stability of the TFTs, improve the light utilization rate and optical taste of the display panel, a reflecting layer is also covered on the driving circuit layer, and the reflecting layer is generally white oil. However, in the prior art, the white oil needs to be treated by a high-temperature process, internal stress is generated in the white oil after the high-temperature treatment, and the internal stress in the white oil can not be released in time in the process of thermal expansion and contraction, so that the problem of local cracking is generated, the product is scrapped, the yield is reduced, and the problem needs to be solved.
Disclosure of Invention
The application provides a display panel and a preparation method thereof, which can effectively reduce the risk of cracking of a reflecting layer and improve the yield of the display panel.
In order to achieve the above object, the display panel and the manufacturing method thereof of the present application adopt the following technical schemes.
The application provides a display panel, which comprises a driving backboard, wherein the driving backboard comprises:
A substrate base;
a driving circuit layer disposed on the substrate base plate and including a plurality of terminal portions;
The reflecting layer is arranged on the driving circuit layer and comprises a plurality of fenestrations, and each fenestration is arranged in one-to-one correspondence with each terminal part;
The reflecting layer further comprises a plurality of openings, and the openings are arranged at intervals with the windowing.
Optionally, the display panel further includes a packaging adhesive layer, where the packaging adhesive layer is disposed on the reflective layer, and the opening is not filled with the packaging adhesive layer.
Optionally, the reflective layer includes a plurality of repeating units arranged in an array, each repeating unit including a fixed number of the openings and a fixed number of the fenestrations.
Optionally, the plurality of windows includes a plurality of first windows, the plurality of terminal portions includes a plurality of first terminal portions, each first window is disposed corresponding to each first terminal portion, wherein the driving back plate further includes a plurality of LED chips disposed on the driving circuit layer in an array, each LED chip is disposed corresponding to each first window and electrically connected to each first terminal portion, and each repeating unit includes four first windows.
Optionally, the plurality of windows further includes a plurality of second windows, the plurality of terminal portions further includes a plurality of second terminal portions, each second window is disposed corresponding to each second terminal portion, each second terminal portion includes at least one MOS transistor, and each repeating unit further includes one second window.
Optionally, the area of the second opening is larger than the area of the opening, and the packaging adhesive layer is filled in the second opening.
Optionally, each of the repeating units includes m of the openings, wherein 3≤m≤5.
Optionally, each of the repeating units includes five openings, wherein, in one of the repeating units, four of the five openings are respectively disposed on four gap areas between adjacent first windows, and the other opening is located in a defined area surrounded by the four openings.
Optionally, the opening is circular in shape, the window is rectangular in shape, and the diameter of the opening is smaller than the side length of the window.
In another aspect, the present application also provides a method for manufacturing a display panel, including the steps of:
providing a substrate base plate;
Forming a driving circuit layer on the substrate base plate, the driving circuit layer including a plurality of terminal portions;
Forming a patterned reflecting layer on the driving circuit layer by using an ink-jet printing process, wherein the reflecting layer comprises a plurality of windows and a plurality of openings, each window is arranged in one-to-one correspondence with each terminal part, and the openings are arranged at intervals with the windows;
and baking the reflecting layer.
The application provides a display panel and a preparation method thereof, wherein the opening is arranged on the reflecting layer, so that the internal stress generated in the baking treatment process of the reflecting layer can be well released, the risk of cracking of the reflecting layer is effectively reduced, and the yield of the display panel is improved.
Drawings
Fig. 1 is a schematic top view of a driving back plate without a packaging adhesive layer according to a first embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of the drive backplate of FIG. 1 along line AA;
FIG. 3 is a schematic cross-sectional view of a driving back plate including a sealant layer according to an embodiment of the present application;
Fig. 4 is a flowchart of a preparation of a display panel according to a first embodiment of the present application;
Fig. 5 is a schematic top view of a driving back plate without a packaging adhesive layer according to a second embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of the drive back plate of FIG. 5 along line BB;
fig. 7 is a schematic cross-sectional view of a driving back plate including a packaging adhesive layer according to a second embodiment of the present application;
Fig. 8 is a schematic top view of a driving back plate without a packaging adhesive layer according to a third embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower directions of the device in actual use or operation, and specifically the directions of the drawings in the drawings, while "inner" and "outer" are used with respect to the outline of the device.
The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials. The following detailed description is given, respectively, to the description of the following embodiments, but the description of the embodiments is not to be taken as limiting the preferred embodiments.
Example 1
The application provides a display panel which comprises a driving backboard, wherein an LED chip is arranged on the driving backboard.
In this embodiment, the display panel is, for example, an LCD display panel, where the display panel includes the driving back plate and a liquid crystal box, and the driving back plate includes an LED chip, and the LED chip may be used as a light source in the display panel. Of course, the application does not limit the type of the display panel, the display panel can also be a Micro LED display panel, the LED chip in the driving backboard can also be directly used as a pixel unit of the display panel, in addition, the application does not limit the size of the LED chip, the LED chip can be any one of a conventional LED chip, a Mini-LED chip or a Micro-LED chip, generally, the size of the conventional LED chip is more than 200 mu m, the size of the Mini-LED chip is 50 mu m to 200 mu m, and the size of the Micro-LED chip is less than 50 mu m.
Fig. 1 is a schematic top view of a driving back plate without a packaging adhesive layer according to a first embodiment of the present application;
fig. 2 is a schematic cross-sectional view of the driving back plate of fig. 1 along AA line. Referring to fig. 1 and 2, in the present embodiment, the driving back plate includes a substrate base plate 10, a driving circuit layer 20, a reflective layer 30, and an LED chip 40.
In this embodiment, the material of the substrate 10 may be glass, plastic, polyimide, etc., and the substrate 10 may be a rigid substrate or a flexible substrate.
In this embodiment, the driving circuit layer 20 is disposed on the substrate 10 and includes a plurality of terminal portions 21, and the terminal portions 21 may be connection terminals (pads) or electrical components.
In this embodiment, the reflective layer 30 is disposed on the driving circuit layer 20, and the reflective layer 30 is made of, for example, white oil with high reflectivity. Specifically, the reflectance of the reflective layer 30 is greater than 80%, and the film thickness of the reflective layer 30 is less than or equal to 30 μm. In other embodiments of the present application, the reflective layer 30 may include a glue layer and the white oil coated on the glue layer, the glue layer enabling better adhesion of the white oil to the driving circuit layer 20.
In this embodiment, the reflective layer 30 includes a plurality of windows 31, and the windows 31 are hole-shaped structures penetrating through the reflective layer 30, and are used for exposing each terminal portion 21 in the driving circuit layer 20, so that the terminal portion 21 can be electrically connected with the LED chip 40 or other external devices through via connection, or achieve a photosensitive or monitoring function. Accordingly, each of the windows 31 is provided in one-to-one correspondence with each of the terminal portions 21.
In this embodiment, the reflective layer 30 further includes a plurality of openings 32, and the openings 32 are spaced from the window 31. That is, the front projection of the opening 32 on the driving circuit layer 20 is spaced from the terminal portion 21, and the opening 32 has a hole-like structure penetrating the reflective layer 30, but functions differently from the window 31. Specifically, in the existing manufacturing process of the driving back plate, the driving circuit layer 20 is covered by the reflective layer 30 except for the open window 31 at the position corresponding to the terminal portion 21, and the driving back plate needs to be subjected to at least one high-temperature baking treatment, internal stress is generated in the high-temperature treatment process of the reflective layer 30, and the reflective layer 30 contains more inorganic particles, and has a thicker film thickness, so that after the subsequent cooling, the reflective layer 30 generates thermal expansion and contraction, and the internal stress cannot be effectively released, thereby generating the problem of cracking of the reflective layer 30. According to the application, the internal stress generated in the high-temperature baking treatment process of the reflecting layer 30 is released by arranging the opening 32 on the reflecting layer 30, so that the problem of cracking of the reflecting layer 30 is effectively avoided, the yields of the driving back plate and the display panel are improved, and the production and manufacturing cost is reduced.
In this embodiment, the shape of the opening 32 is different from the shape of the window 31. Specifically, the window 31 is rectangular, the opening 32 is circular, and the circular opening 32 is more beneficial to improving the internal stress release capability of the reflecting layer. Further, the diameter of the opening 32 is smaller than the side length of the window 31, and the diameter of the opening 32 is, for example, 0.1 mm-1 mm. By controlling the size of the opening 32, the area of the opening 32 can be reduced as much as possible while ensuring the internal stress release effect of the reflective layer 30, thereby ensuring the reflective effect of the reflective layer 30 and ensuring the display quality of the display panel. Of course, the shape of the opening 32 is not limited in the present application, in other embodiments of the present application, the shape of the opening 32 may be a ring, the opening 32 is made into a ring shape, and by controlling the width of the ring, the area of each opening 32 may be further reduced while the effect of releasing the internal stress is better, so that the reflectivity of the reflective layer 30 is further improved, and the display effect of the display panel is improved.
In this embodiment, the reflective layer 30 includes a plurality of repeating units 300 arranged in an array, and the number of the windows 31 in each repeating unit 300 is fixed, and the number of the openings 32 in each repeating unit 300 is also fixed. That is, each repeating unit 300 includes a fixed number of the openings 32 and a fixed number of the fenestrations 31.
In this embodiment, the plurality of windows 31 includes a plurality of first windows 311, the plurality of terminal portions 21 includes a plurality of first terminal portions 211, each first window 311 is disposed corresponding to each first terminal portion 211, the first windows 311 are configured to accommodate each LED chip 40, and each repeating unit 300 includes four first windows 311.
In this embodiment, the driving back board further includes a plurality of LED chips 40 disposed on the driving circuit layer 20 in an array, and each of the LED chips 40 is disposed in each of the first windows 311 and electrically connected to each of the first terminal portions 211.
In this embodiment, each of the repeating units 300 includes m openings 32, wherein 3≤m≤5. The present application can control the stress releasing capability of the reflective layer 30 and the total area of the openings 32 in the reflective layer 30 by controlling the number of the openings 32 in each of the repeating units 300, thereby greatly reducing the risk of cracking of the reflective layer 30 while ensuring that the reflectivity of the reflective layer 30 is maintained within a high level range.
In this embodiment, each of the repeating units 300 includes five openings 32, where, in one repeating unit 300, four of the five openings 32 are respectively disposed on four gap areas between adjacent first windows 311, and another opening 32 is located in a defined area surrounded by the four openings 32. Further, in one of the repeating units 300, four of the openings 32 respectively provided in four gap regions between adjacent ones of the first windows 311 are respectively equal to the distances between adjacent ones of the first windows 311, and the other one of the openings 32 is located at the center of the repeating unit 300.
In this embodiment, n openings 32 are provided between two adjacent repeating units 300, wherein n is equal to or greater than 2 and equal to or less than 3.
In this embodiment, three openings 32 are disposed between two adjacent repeating units 300, where, in the area defined by two adjacent repeating units 300, two of the three openings 32 are disposed on two gap areas between two adjacent first windows 311, respectively, and the other opening 32 is located between two openings 32. As shown in fig. 1, in the reflective layer 30 provided by the present application, one first opening 32 is disposed between any two adjacent first windows 311, and each first opening 32 is disposed in a middle area of a smallest rectangular unit formed by four first windows 311, that is, each smallest rectangular unit area formed by four first windows 311 includes five openings 32, so that an area of the openings 32 is relatively fixed in a unit area of the reflective layer 30, reflection uniformity of the reflective layer 30 is improved, and an optical effect of the driving back plate and display quality of the display panel are improved.
Fig. 3 is a schematic cross-sectional view of a driving back plate including a packaging adhesive layer according to an embodiment of the present application, as shown in fig. 3, in this embodiment, the driving back plate further includes a packaging adhesive layer 50, the packaging adhesive layer 50 is disposed on the reflective layer 30 and covers the reflective layer 30, and the opening 32 is not filled with the packaging adhesive layer 50. Specifically, the area of the opening 32 provided by the application is smaller, the viscosity of the encapsulation adhesive layer 50 is larger, and when the encapsulation adhesive layer 50 is formed on the reflective layer 30 in a covering manner, the encapsulation adhesive layer 50 cannot fill the opening 32, so that the reflective layer 30 forms a hollowed-out area at the position of the opening 32. After the encapsulation glue layer 50 is manufactured, the driving back plate is baked at a high temperature, and the internal stress in the reflective layer 30 can be effectively released through the opening 32 because the encapsulation glue layer 50 is not filled in the opening 32, so that the risk of cracking problem of the reflective layer 30 is greatly reduced.
On the other hand, the application also provides a preparation method of the display panel. Fig. 4 is a flowchart of a preparation process of a display panel according to an embodiment of the application, and referring to fig. 1 to fig. 4, the preparation process of the display panel includes the following steps:
s01, providing a substrate base plate 10;
S02 forming a driving circuit layer 20 on the substrate base plate 10, the driving circuit layer 20 including a plurality of terminal portions 21;
S03, forming a patterned reflecting layer 30 on the driving circuit layer 20 by using an ink-jet printing process, wherein the reflecting layer 30 comprises a plurality of open windows 31 and a plurality of openings 32, each open window 31 is arranged in one-to-one correspondence with each terminal part 21, and the openings 32 are arranged at intervals with the open windows 31;
and S04, baking the reflecting layer 30.
In the step S02, the terminal portions 21 are, for example, first terminal portions 211, and the first terminal portions 211 are electrically connected to the LED chip 40 and transmit electrical signals.
In the step S03, a pattern corresponding to the plurality of windows 31 and the plurality of openings 32 is formed on a screen, and the patterned reflective layer 30 is formed on the driving circuit layer 20 using the screen as a mask. The windows 31 are, for example, first windows 311 for providing the LED chips 40, and each first window 311 is provided corresponding to each first terminal 211.
In the step S04, the baking treatment is performed for a period of 150 ℃ and a baking period of 60 minutes.
After the step S04, the method further includes the steps of:
S05, manufacturing and forming an LED chip 40 on the driving circuit layer 20, wherein the LED chip 40 is arranged in the window 31;
s06, forming a packaging adhesive layer 50 on the reflecting layer 30, and baking.
S07, carrying out a binding process.
In the step S05, the LED chip 40 is disposed in the window 31 by a reflow SMT bonding process, so that the LED chip 40 is electrically connected to the first terminal portion 211.
In the step S06, the encapsulation glue layer 50 covers the reflective layer 30, and the opening 32 is not filled with the encapsulation glue layer 50, and the baking process includes a first stage and a second stage, where the baking process temperature in the first stage is 100 ℃, the baking time period is 60 minutes, and the baking process temperature in the second stage is 150 ℃, and the baking time period is 120 minutes.
In the step S07, a driving circuit board for providing a driving signal is electrically connected to the driving back plate in a binding manner.
Example two
Fig. 5 is a schematic top view of a driving back plate without a packaging adhesive layer according to a second embodiment of the present application;
Fig. 6 is a schematic cross-sectional view of the driving back plate of fig. 5 along BB line. Referring to fig. 5-6, a second embodiment of the present application provides a display panel, where the display panel includes a driving back plate, the driving back plate includes a substrate 10, a driving circuit layer 20 disposed on the substrate 10 and including a plurality of terminal portions 21, and a reflective layer 30 disposed on the driving circuit layer 20 and including a plurality of windows 31, where each window 31 is disposed in one-to-one correspondence with each terminal portion 21, and the reflective layer 30 further includes a plurality of openings 32, and the openings 32 are disposed at intervals from the windows 31.
The display panel provided in the second embodiment of the present application is similar to the display panel in the first embodiment, and the same parts are not repeated in this embodiment, except that in the reflective layer 30 of the driving back plate, the plurality of windows 31 include a plurality of first windows 311 and a plurality of second windows 312. Correspondingly, in the driving circuit layer 20 of the driving back board, the plurality of terminal portions 21 further includes a plurality of second terminal portions 212 in addition to the plurality of first terminal portions 211, and each of the second terminal portions 212 includes at least one MOS transistor, that is, the driving circuit layer 20 is provided with a MOS transistor at a position corresponding to the second terminal portion 212.
In this embodiment, the second window 312 exposes the second terminal portion 212, so that the MOS transistor in the second terminal portion 212 can be cooled, and the cooling performance of the driving back plate is improved.
In this embodiment, each of the second windows 312 is disposed corresponding to each of the second terminal portions 212 and is used for exposing the MOS transistors of the second terminal portions 212, where each of the repeating units 300 includes one of the second windows 312, and the second windows 312 are located in a defined area surrounded by four of the first windows 311 in the repeating unit 300.
In this embodiment, each of the repeating units 300 includes five openings 32, where, in one repeating unit 300, four of the five openings 32 are respectively disposed on four gap areas between adjacent first windows 311, and another opening 32 is located in a defined area surrounded by the four openings 32. Further, in one repeating unit 300, at least one of the four openings 32 respectively disposed in the four gap regions between the adjacent first windows 311 is not equal to the distance between the adjacent two first windows 311, and another one of the four openings 32 other than the four openings 32 is disposed in the middle but not in the central region of the repeating unit 300.
Compared to the first embodiment, since one second window 312 is added in each repeating unit 300, in order to avoid the increase of the process difficulty caused by too close distance between the second window 312 and the openings 32, the positions of at least two openings 32 in the repeating units 300 are adjusted, and the two openings 32 with the adjusted positions shown in fig. 5 are the openings 32 in the middle area and the openings 32 in the lower area in each repeating unit 300, respectively.
Fig. 7 is a schematic cross-sectional view of a driving back plate including a packaging adhesive layer according to a second embodiment of the present application, where the driving back plate further includes a packaging adhesive layer 50, the packaging adhesive layer 50 is disposed on the reflective layer 30 and covers the reflective layer 30, the packaging adhesive layer 50 is not filled in the opening 32, and the packaging adhesive layer 50 is filled in the second window 312.
In this embodiment, the area of the second window 312 is larger than the area of the opening 32. Since the area of the opening 32 is smaller than that of the second window 312, the area of the opening 32 is smaller, the viscosity of the encapsulation adhesive layer 50 is larger, and when the encapsulation adhesive layer 50 is formed on the reflective layer 30 in a covering manner, the encapsulation adhesive layer 50 cannot fill the opening 32, so that the reflective layer 30 forms a hollowed-out area at the position of the opening 32. After the encapsulation glue layer 50 is manufactured, the driving back plate is baked at a high temperature, and the internal stress in the reflective layer 30 can be effectively released through the opening 32 because the encapsulation glue layer 50 is not filled in the opening 32, so that the risk of cracking problem of the reflective layer 30 is greatly reduced.
On the other hand, the second embodiment of the application also provides a preparation method of the display panel, which comprises the following steps:
s01, providing a substrate base plate 10;
S02 forming a driving circuit layer 20 on the substrate base plate 10, the driving circuit layer 20 including a plurality of terminal portions 21;
S03, forming a patterned reflecting layer 30 on the driving circuit layer 20 by using an ink-jet printing process, wherein the reflecting layer 30 comprises a plurality of open windows 31 and a plurality of openings 32, each open window 31 is arranged in one-to-one correspondence with each terminal part 21, and the openings 32 are arranged at intervals with the open windows 31;
s04, baking the reflecting layer 30;
S05, manufacturing and forming an LED chip 40 on the driving circuit layer 20, wherein the LED chip 40 is arranged in the window 31;
s06, forming a packaging adhesive layer 50 on the reflecting layer 30, and baking.
S07, carrying out a binding process.
The manufacturing method of the display panel provided in the second embodiment of the present application is similar to the manufacturing method of the display panel in the first embodiment, and the difference is that in the step S02, the plurality of terminal portions 21 further includes a plurality of second terminal portions 212 in addition to the plurality of first terminal portions 211, each of the second terminal portions 212 includes at least one MOS transistor, in the step S03, the plurality of open windows 31 further includes a plurality of second open windows 312 in addition to the plurality of first open windows 311, each of the second open windows 312 is disposed corresponding to the second terminal portions 212 and exposes the MOS transistor, and due to the disposition of the second terminal portions 212, at least a portion of the openings 32 is also correspondingly adjusted in position in the reflective layer 30, in the step S06, the encapsulation glue layer 50 is disposed on the reflective layer 30 and covers the reflective layer 30, wherein the openings 32 are not filled with the glue layer 50, and the second open windows 312 are not filled with the encapsulation glue layer 50.
Example III
Fig. 8 is a schematic top view of a driving back plate without a packaging adhesive layer according to a third embodiment of the present application, referring to fig. 6 to 8, a display panel is provided, and the display panel includes a driving back plate, wherein the driving back plate includes a substrate 10, a driving circuit layer 20 disposed on the substrate 10 and including a plurality of terminal portions 21, a reflective layer 30 disposed on the driving circuit layer 20 and including a plurality of windows 31, each window 31 is disposed in one-to-one correspondence with each terminal portion 21, and the reflective layer 30 further includes a plurality of openings 32, and the openings 32 are disposed at intervals with the windows 31.
The display panel provided in the third embodiment of the present application is similar to the display panel provided in the second embodiment, and the same portions are not repeated in this embodiment, except that in the reflective layer 30 of the driving back plate, each of the repeating units 300 includes four openings 32, where in one of the repeating units 300, the four openings 32 are respectively disposed on four gap regions between adjacent first windows 311. Further, in one repeating unit 300, at least one of the four openings 32 respectively provided in the four gap regions between the adjacent first windows 311 is not equal to the distance between the adjacent two first windows 311.
In this embodiment, two of the openings 32 are provided between two adjacent repeating units 300,
Wherein two of the openings 32 are respectively provided on two gap regions between adjacent ones of the first windows 311. As shown in fig. 8, in the reflective layer 30 provided by the present application, one first opening 32 is disposed between any two adjacent first openings 311, that is, each minimum rectangular unit area formed by four first openings 311 includes four openings 32, so that the area of the openings 32 in a unit area of the reflective layer 30 is relatively fixed, the reflective uniformity of the reflective layer 30 is improved, and the optical effect of the driving back plate and the display quality of the display panel are improved.
Compared with the second embodiment, the number of the openings 32 in the reflective layer 30 is smaller, so that the reflective layer 30 has higher reflectivity and better display effect.
On the other hand, the third embodiment of the application also provides a preparation method of the display panel, which comprises the following steps:
s01, providing a substrate base plate 10;
S02 forming a driving circuit layer 20 on the substrate base plate 10, the driving circuit layer 20 including a plurality of terminal portions 21;
S03, forming a patterned reflecting layer 30 on the driving circuit layer 20 by using an ink-jet printing process, wherein the reflecting layer 30 comprises a plurality of open windows 31 and a plurality of openings 32, each open window 31 is arranged in one-to-one correspondence with each terminal part 21, and the openings 32 are arranged at intervals with the open windows 31;
s04, baking the reflecting layer 30;
S05, manufacturing and forming an LED chip 40 on the driving circuit layer 20, wherein the LED chip 40 is arranged in the window 31;
s06, forming a packaging adhesive layer 50 on the reflecting layer 30, and baking.
S07, carrying out a binding process.
The manufacturing method of the display panel provided in the third embodiment of the present application is similar to the manufacturing method of the display panel in the second embodiment, and the same parts are not repeated in this embodiment, except that in the step S03, the layout manner of the openings 32 in the reflective layer 30 is different, so that the number of the openings 32 is reduced, so that the reflective layer 30 has a higher reflectivity, and the display effect of the display panel is better.
In summary, the application provides a display panel and a manufacturing method thereof, wherein the display panel comprises a driving backboard, a driving circuit layer and a reflecting layer, wherein the driving backboard comprises a substrate, the driving circuit layer is arranged on the substrate and comprises a plurality of terminal parts, the reflecting layer is arranged on the driving circuit layer and comprises a plurality of open windows, the open windows are arranged in one-to-one correspondence with the terminal parts, and the reflecting layer further comprises a plurality of openings which are arranged at intervals with the open windows. According to the application, the opening is arranged on the reflecting layer, so that the internal stress generated in the baking treatment process of the reflecting layer can be released, the risk of cracking of the reflecting layer is effectively reduced, and the yield of the display panel is improved.
The foregoing describes a display panel and a method for manufacturing the same in detail, wherein specific examples are used to illustrate the principles and embodiments of the present application, and the above examples are provided to assist in understanding the method and core ideas of the present application, and meanwhile, the present disclosure should not be construed as limiting the application to any extent by those skilled in the art, based on the ideas of the present application.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210332833.2A CN114709265B (en) | 2022-03-30 | 2022-03-30 | A display panel and a method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210332833.2A CN114709265B (en) | 2022-03-30 | 2022-03-30 | A display panel and a method for manufacturing the same |
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