CN114709143A - Bonding head, chip bonding machine and bonding method - Google Patents

Abstract

The invention relates to a bonding head, a chip bonding machine and a bonding method, wherein the bonding head comprises: the picking assembly is used for picking up chips and comprises a first connecting end and a second connecting end, the first connecting ends of the flexible bodies are connected with the picking assembly, the second connecting ends of the flexible bodies are correspondingly connected with the control pieces respectively, and the control pieces can control the distance between the first connecting ends and the second connecting ends. The bonding head can self-adaptively level the chip and the substrate, and improves the bonding precision of the chip and the substrate. The chip bonder comprises the bonding head, and can improve the bonding precision of the chip and the substrate. The bonding method is applied to the chip bonding machine, and can improve the bonding precision of the chip and the substrate.

Description

Bonding head, chip bonding machine and bonding method

Technical Field

The invention relates to the technical field of semiconductors, in particular to a bonding head, a chip bonding machine and a bonding method.

Background

A Flip Chip Bonder (FCB) is a key device for a subsequent packaging process in a flip chip production line, and has a function of completing area array bump interconnection between a chip and a substrate inside a package. Flip chip is a package in which the front surface of the chip (the surface on which the IC circuit is formed) is connected to the substrate in a downward direction.

With the development of semiconductor technology, the requirement for the precision of bonding between a chip and a substrate is also increased. The parallelism between the chip and the substrate is one of the important factors affecting the bonding precision between the chip and the substrate. If the parallelism error between the chip and the substrate is too large when the chip and the substrate are bonded, not only the bonding precision is affected, but also the bonding pressure distribution is not uniform. And part of the chips are damaged due to overlarge stress, and the bonding effect is influenced due to the overlarge pressure.

In the conventional technology, the parallelism between the chip and the substrate is usually adjusted by manual adjustment. However, the manual adjustment mode has high requirements on the adjustment personnel, and the adjustment precision and efficiency are low.

Disclosure of Invention

Therefore, it is necessary to provide a bonding head, a die bonder and a bonding method, which are directed to the problem of how to improve the accuracy and efficiency of bonding a chip to a substrate.

A bond head, the bond head comprising: the picking assembly is used for picking up chips and comprises a first connecting end and a second connecting end, the first connecting ends of the flexible bodies are connected with the picking assembly, and the second connecting ends of the flexible bodies are respectively correspondingly connected with the control pieces

In one embodiment, the bonding head further includes a first loading plate connected to all the first connection ends and a second loading plate connected to all the second connection ends, the pickup assembly is disposed on a side of the first loading plate away from the first connection ends, and the control element is connected to the second loading plate for controlling a distance between the first loading plate and the second loading plate.

In one embodiment, the control part comprises a driving part and a control shaft, the driving part is connected with the control shaft and used for driving the control shaft to rotate, a matching hole is formed in the second bearing plate, the control shaft penetrates through the matching hole, a first thread is arranged on the control shaft, and a second thread matched with the first thread is arranged on the hole wall of the matching hole.

In one embodiment, the bonding head further includes a plurality of reading heads and a plurality of grating rulers, all the reading heads are disposed on the second carrier plate, the number of the reading heads is the same as that of the grating rulers, and the reading heads are opposite to the grating rulers in a one-to-one correspondence manner.

In one embodiment, the pickup assembly further includes a heating assembly disposed on a side of the first carrier plate away from the flexible body, and the heating assembly is connected to the chip for heating the chip to a eutectic temperature.

In one embodiment, the pickup assembly further comprises a heat shield disposed between the heating assembly and the first carrier plate.

In one embodiment, the number of the control parts is the same as that of the flexible bodies, and the control parts are connected with the second connecting ends in a one-to-one correspondence manner.

In one embodiment, the bond head further includes a plurality of pressure sensors, the pressure sensors are electrically connected to the control element, the pressure sensors are disposed on the flexible body in a one-to-one correspondence, and the pressure sensors are configured to detect pressures of the first connection end and the second connection end.

A chip bonder for bonding a chip to a substrate, the chip bonder comprising:

a bond head as described in any of the above embodiments, the bond head being configured to pick up the chip;

and the driving device is connected with the bonding head, is used for driving the bonding head to be close to the substrate, and can also adjust the spatial position of the bonding head.

A bonding method of the die bonder according to the above embodiment, the bonding method comprising:

the picking assembly picks up the chip;

the driving device drives the bonding head to be close to the substrate until the chip is in contact with the substrate and keeps fit with the substrate;

the distance between the first connecting end and the second connecting end of the corresponding control element is adjusted through the control elements until the pressure between the first connecting end and the second connecting end of any one control element is equal;

the control piece adjusts and locks the distance between the first connecting end and the second connecting end.

The bonding head and the picking assembly are used for picking the chip. When the chip moves along with the bonding head to be bonded with the substrate, the flexible body deforms based on the reaction force of the substrate to the chip. Because the two ends of the flexible body are respectively connected with the picking assembly and the control piece, and the force causing the deformation of the flexible body is transferred to the flexible body by the picking assembly. That is, the most predominant deformation of the flexible body occurs in the direction from the first connection end to the second connection end. And the control piece can control the distance between the first connecting end and the second connecting end. That is, the control member can control the amount of deformation of the flexible body.

The above is mainly used to explain the control relationship between the control member and the flexible body. It can be understood that, since the second connecting ends of the plurality of flexible bodies are respectively and correspondingly connected with the plurality of control members, the plurality of control members can respectively control the deformation amount of the plurality of flexible bodies.

So set up, when the chip contacts with base plate with the attitude that is not parallel to the base plate. Because the flexible body is used for connecting the picking assembly, and the flexible body has the self-adaptive capacity of being capable of deforming. Thus, the chip can be kept in full-face fit with the substrate based on the self-adaptive capacity of the flexible body. It will be appreciated that the chip is now parallel to the substrate.

Then, the deformation amount of the corresponding flexible body is adjusted through the control part, so that the reaction force applied to each flexible body by the base plate is the same. That is, by adjusting the amount of deformation of the flexible body, the magnitude of the reaction force of the flexible body received by each region of the chip can be made equal. Then, when the reaction force is cancelled, the chip can be kept parallel to the substrate. In other words, the control member adjusts the amount of deformation of the corresponding flexible body, so that the chip can be kept parallel to the substrate even when the chip is separated from the substrate.

Drawings

Fig. 1 is a schematic side view of a die bonder according to an embodiment;

FIG. 2 is an isometric view of a bond head of the die bonder of FIG. 1;

FIG. 3 is a schematic cross-sectional view of the bonding head shown in FIG. 2 illustrating the connection relationship between the flexible body and the first and second carrier plates;

fig. 4 is a partially enlarged view of a in fig. 2.

Reference numerals: 10. a chip bonder; 100. a bond head; 110. a picking assembly; 111. a heating assembly; 112. a thermal insulation member; 120. a flexible body; 121. a first connection end; 122. a second connection end; 130. a control member; 131. a control shaft; 132. a drive member; 140. a fixed mount; 150. a first bearing plate; 160. a second carrier plate; 161. a mating hole; 170. a reading head; 200. a drive device; 20. and (3) a chip.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

Referring to fig. 1, fig. 1 is a schematic side view of a die bonder 10 for bonding a die 20 to a substrate (not shown, the same applies hereinafter) according to an embodiment of the present invention. The chip bonder 10 includes a bond head 100 and a driving device 200. The bond head 100 is used to pick up the chip 20. A driving device 200 is connected to the bond head 100, and the driving device 200 can adjust the spatial position of the bond head 100 to align the chip 20 with the substrate. Also, the bond head 100 can provide the pressure required for bonding the chip 20 to the substrate.

Specifically, referring to fig. 1, the driving apparatus 200 drives the chip 20 to approach the substrate through the bond head 100, referring to the Z axis in fig. 1. That is, the driving device 200 drives the chip 20 close to the substrate along the Z-axis through the bond head 100, and the driving device 200 can provide pressure in the Z-axis direction to bond the chip 20 with the substrate.

Further, the driving device 200 can be used to adjust the position of the chip 20 relative to the substrate in the X-axis, Y-axis and θ directions to ensure that the chip 20 can contact the substrate when approaching the substrate along the Z-axis.

Referring to fig. 2 in combination with fig. 3, in one embodiment, the bond head 100 includes a fixing frame 140, a picking assembly 110, a plurality of flexible bodies 120, and a plurality of control members 130. The pick-up assembly 110 is used to pick up the chip 20. The flexible body 120 includes a first connection end 121 and a second connection end 122. The first connecting ends 121 of the plurality of flexible bodies 120 are each connected to the picking assembly 110. The second connection ends 122 of the plurality of flexible bodies 120 are respectively connected with the plurality of control members 130. The control member 130 can control a distance between the first connection end 121 and the second connection end 122.

The bond head 100 and the pick assembly 110 are used to pick up the chip 20. When the chip 20 moves with the bond head 100 to bond with the substrate, the flexible body 120 deforms based on the reaction force of the substrate against the chip 20. Since both ends of the flexible body 120 are connected to the pick-up assembly 110 and the control member 130, respectively, and the force causing the deformation of the flexible body 120 is transmitted to the flexible body 120 by the pick-up assembly 110. That is, the most predominant deformation of the flexible body 120 occurs in the direction from the first connection end 121 toward the second connection end 122. And the control member 130 can control the distance between the first connection end 121 and the second connection end 122. That is, the control member 130 can control the amount of deformation of the flexible body 120. It is understood that the flexible body 120 may extend along the Z-axis direction, i.e. the extending direction of the flexible body 120 is the same as the bonding direction of the driving chip 20 of the driving device 200.

As described above, the control relationship between the control member 130 and the flexible body 120 is mainly explained. It can be understood that, since the second connecting ends 122 of the plurality of flexible bodies 120 are respectively connected with the plurality of control members 130, the plurality of control members 130 can respectively control the deformation amounts of the plurality of flexible bodies 120.

So arranged, when the chip 20 is in contact with the substrate in a posture not parallel to the substrate. Since the flexible body 120 is used to connect the pick-up assembly 110, the flexible body 120 has an adaptive ability to deform. Thus, the chip 20 can be kept in full-face contact with the substrate due to the self-adaptive ability of the flexible body 120. It will be appreciated that the chip 20 is now parallel to the substrate.

Subsequently, the control member 130 adjusts the deformation amount of the corresponding flexible body 120, so that the reaction force applied to each flexible body 120 by the substrate is the same. That is, by adjusting the amount of deformation of the flexible body 120, the reaction force of the flexible body 120 received by each region of the chip 20 can be made equal in magnitude. Then, when the reaction force is cancelled, the chip 20 can be kept parallel to the substrate. In other words, when the control member 130 adjusts the deformation amount of the corresponding flexible body 120, the chip 20 can be kept parallel to the substrate even when the chip 20 is separated from the substrate.

In the bonding head 100, since the control element 130 adjusts the parallelism between the chip 20 and the substrate, the chip 20 and the substrate are kept in full contact, that is, the chip 20 and the substrate are completely parallel. The parallelism accuracy between the chip 20 and the substrate thus obtained is adjusted to be higher. In addition, the chip 20 can be parallel to the substrate only by adjusting the distance between the first connection end 121 and the second connection end 122 of the plurality of flexible bodies 120, so that the adjustment mode is simpler and the adjustment efficiency is higher.

It should be understood that the parallelism described in the present embodiment refers to the degree of parallelism between the chip 20 and two faces of the substrate for bonding with each other. Namely, the included angle between the two surfaces is closer to zero, and the parallelism is better; the better the opposite is.

Referring to fig. 3 and 4, in an embodiment, the bond head 100 further includes a first carrier plate 150 connected to all the first connection ends 121 and a second carrier plate 160 connected to all the second connection ends 122. That is, all the flexible bodies 120 are disposed between the first carrier plate 150 and the second carrier plate 160. The picking assembly 110 is disposed on a side of the first carrier plate 150 away from the first connection end 121. The control member 130 is connected to the second carrier plate 160 for controlling a distance between the first carrier plate 150 and the second carrier plate 160. So set up, through first loading board 150 and second loading board 160, all flexible bodies 120 are all located between first loading board 150 and second loading board 160, can make bond head 100's structure compacter, prevent that the deformation of each flexible body 120 is uncontrolled.

Referring to fig. 3 and 4, the control member 130 further includes a driving member 132 and a control shaft 131. The driving member 132 is connected to the control shaft 131 for driving the control shaft 131 to rotate. The second carrier plate 160 has a fitting hole 161. The control shaft 131 is inserted through the fitting hole 161. The control shaft 131 is provided with a first thread (not shown, the same applies below), and the wall of the fitting hole 161 is provided with a second thread (not shown, the same applies below) that fits the first thread. It can be understood that the control shaft 131 is coupled to the second loading plate 160 by the first and second screw threads, so that the control shaft 131 can control the position of the second loading plate 160. In other words, the control shaft 131 can move the second loading plate 160 toward or away from the first loading plate 150 when rotating.

It is understood that the bond head 100 includes a plurality of control members 130. Then, the distance between the second carrier plate 160 and the first carrier plate 150 can be adjusted by the cooperation of the multiple control members 130. With the above embodiment, since all the flexible bodies 120 are disposed between the first carrier plate 150 and the second carrier plate 160, the distance between the first connection end 121 and the second connection end 122 of each flexible body 120 can be indirectly adjusted by adjusting the distance between the first carrier plate 150 and the second carrier plate 160, that is, the deformation of the flexible body 120 can be adjusted.

Further, the number of the control members 130 is the same as the number of the flexible bodies 120. The control members 130 are connected to the second connection ends 122 in a one-to-one correspondence. In this way, the control member 130 can adjust its corresponding flexible body 120 more specifically. Specifically, the number of the fitting holes 161 may be the same as that of the flexible bodies 120, and the opening positions of the fitting holes 161 also correspond to the positions of the second connection ends 122, respectively. In this way, each control shaft 131 can control the deformation of the flexible body 120 in a targeted manner, so as to improve the accuracy of the bond head 100 in adjusting the parallelism between the chip 20 and the substrate.

The plurality of flexible bodies 120 are uniformly bonded between the first carrier plate 150 and the second carrier plate 160. The control members 130 are uniformly spaced on the fixing frame 140. It can be understood that the fixing bracket 140 is connected to the second loading plate 160 through the control shaft 131 so that the control shaft 131 controls the position of the second loading plate 160.

In one embodiment, the bond head 100 further includes a plurality of pressure sensors (not shown, the same applies below). The pressure sensors are electrically connected to the control element 130, and the pressure sensors are disposed on the flexible body 120 in a one-to-one correspondence manner. The pressure sensor is used for detecting the pressure of the first connection end 121 and the second connection end 122. In this way, the control member 130 can adjust the pressure of each flexible body 120 to be equal, so as to adjust the chip 20 to be parallel to the substrate.

In other embodiments, the control member 130 may also be an electric push rod. The output shaft of the electric push rod is connected to the second carrier plate 160 to directly control the position of the second carrier plate 160.

In one embodiment, the bond head 100 further includes a plurality of reading heads 170 and a plurality of grating scales. All the reading heads 170 are disposed on the second carrier plate 160. The plurality of readheads 170 are movable with the second carrier plate 160. That is, when the control member 130 adjusts the distance between the first loading plate 150 and the second loading plate 160, the plurality of reading heads 170 can indirectly reflect the movement of the second loading plate 160.

The number of the reading heads 170 is the same as that of the grating scales, and the reading heads 170 are opposite to the grating scales in a one-to-one correspondence manner. The reading head 170 faces the grating, and when the reading head 170 is displaced, different readings are taken on the grating scales corresponding to the reading heads 170 in different positions. Thus, the movement of the second carrier plate 160 can be accurately obtained through the plurality of reading heads 170 and the grating ruler corresponding to the plurality of reading heads 170. It can be understood that the reading head 170 cooperates with the grating ruler to read the data in the prior art, and the description thereof is omitted here.

In one embodiment, the number of the reading heads 170 may be the same as that of the control members 130, and the reading heads 170 are disposed at the connection positions of the control members 130 and the second carrier plate 160 in a one-to-one correspondence manner to directly reflect the distance that the control members 130 control the movement of the second carrier plate 160. Specifically, in combination with the above embodiments, the control member 130 can be disposed on the second carrier plate 160 and located at the periphery of the hole wall of the matching hole 161.

In one embodiment, in conjunction with fig. 2, the control member 130, the flexible body 120, the reading head 170 and the grating (not shown, the same applies below) may be four in number. The 4 control members 130 are evenly distributed on the fixing frame 140 at intervals; the 4 flexible bodies 120 are uniformly distributed between the first bearing plate 150 and the second bearing plate 160 at intervals; the 4 reading heads 170 are uniformly distributed on the second bearing plate 160 at intervals, and the positions of the 4 grating rulers correspond to the positions of the reading heads 170, which is not described again.

It should be understood that the tilt angle with respect to the substrate is the same for the same model of chip 20. Therefore, after the chip 20 of a certain model is leveled, the numerical value read by the reading head 170 is recorded, and when the chip 20 of the same model is bonded again, the skin-adjusting process does not need to be repeated, and the position of the chip 20 can be adjusted according to the numerical value read by the reading head 170. By the arrangement, repeated leveling can be avoided, and bonding efficiency is improved.

Continuing to refer to fig. 2, in one embodiment, the pick-up assembly 110 further comprises a heating assembly 111. The heating element 111 is disposed on a side of the first carrier plate 150 away from the flexible body 120. The heating assembly 111 is coupled to the die 20 for heating the die 20 to a eutectic temperature.

Pickup assembly 110 also includes insulation 112. The heat insulation member 112 is disposed between the heating assembly 111 and the first carrier plate 150. It should be understood that the insulation 112 serves to insulate or reduce the transfer of heat. Since the heat insulation member 112 is disposed between the heating element 111 and the first carrier plate 150, the heat insulation member 112 can prevent or reduce heat from being transferred from the heat insulation member to the flexible body 120. With this arrangement, the deformation, expansion and contraction and elastic recovery of the flexible body 120 can be prevented from being affected by heat. Moreover, the heat insulation piece 112 can prevent heat dissipation, ensure that the chip 20 can reach eutectic temperature, and reduce energy consumption.

In one embodiment, a bonding method. The bonding method can be applied to the die bonder 10 according to the embodiments. The bonding method comprises the following steps:

the pick-up assembly 110 picks up the chip 20;

the driving device 200 drives the bond head 100 to approach the substrate until the chip 20 contacts and keeps attached to the substrate;

the distance between the first connecting end 121 and the second connecting end 122 of the corresponding control member 130 is respectively adjusted through the plurality of control members 130 until the pressure between the first connecting end 121 and the second connecting end 122 of any one control member 130 is equal;

the control member 130 adjusts and locks a distance between the first connection end 121 and the second connection end 122.

It will be appreciated that the flexible body 120 is in a natural state of tension under gravity when the chip 20 is not yet in contact with the substrate. When the chip 20 is brought into contact with and bonded to the substrate, the flexible body 120 is in a compressed state due to a reaction force of the substrate. Thus, whether the chip 20 is in contact with the substrate or not and whether the chip 20 is attached to the substrate or not can be determined by the plurality of pressure sensors.

Meanwhile, whether the chip 20 is in contact with the substrate may also be determined by the driving member 132. In particular, the drive member 132 may be a motor. When the flexible body 120 transmits the reaction force from the substrate to the driving member 132, the resistance of the driving member 132 to move the second carrier plate 160 increases, which results in an increase in the current of the driving member 132. In this way, whether or not the current of the plurality of drivers 132 has changed to a large extent can be determined whether or not the chip 20 is in contact with or bonded to the substrate.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A bond head, comprising: the picking assembly is used for picking up chips and comprises a first connecting end and a second connecting end, the first connecting ends of the flexible bodies are connected with the picking assembly, the second connecting ends of the flexible bodies are correspondingly connected with the control pieces respectively, and the control pieces can control the distance between the first connecting end and the second connecting end.

2. The bond head as recited in claim 1, further comprising a first carrier plate connected to all of the first connection ends and a second carrier plate connected to all of the second connection ends, wherein the pick assembly is disposed on a side of the first carrier plate away from the first connection ends, and wherein the control member is connected to the second carrier plate for controlling a distance between the first carrier plate and the second carrier plate.

3. The bonding head according to claim 2, wherein the control member includes a driving member and a control shaft, the driving member is connected to the control shaft for driving the control shaft to rotate, the second carrier plate has a mating hole, the control shaft is inserted into the mating hole, the control shaft has a first thread, and the mating hole has a second thread on a wall thereof for mating with the first thread.

4. The bonding head according to claim 2, further comprising a plurality of reading heads and a plurality of grating rulers, wherein all the reading heads are disposed on the second carrier plate, the number of the reading heads is the same as the number of the grating rulers, and the reading heads are opposite to the grating rulers in a one-to-one correspondence.

5. The bond head as recited in claim 2, wherein the pick assembly further comprises a heating assembly disposed on a side of the first carrier plate remote from the flexible body, the heating assembly being coupled to the die for heating the die to a eutectic temperature.

6. The bond head as recited in claim 5, wherein the pick assembly further comprises a thermal shield disposed between the heating assembly and the first carrier plate.

7. The bond head as recited in claim 1, wherein the number of the control members and the flexible bodies are the same, the control members being connected to the second connection end in a one-to-one correspondence.

8. The bond head as recited in claim 1, further comprising a plurality of pressure sensors electrically connected to the control member, wherein the pressure sensors are disposed on the flexible body in a one-to-one correspondence, and the pressure sensors are configured to detect pressures at the first connection end and the second connection end.

9. A die bonder for bonding a die to a substrate, the die bonder comprising:

the bond head as claimed in any one of claims 1 to 8, the bond head being configured to pick up the chip;

and the driving device is connected with the bonding head, is used for driving the bonding head to be close to the substrate, and can also adjust the spatial position of the bonding head.

10. A bonding method of a die bonder as claimed in claim 9, characterized in that the bonding method comprises:

the picking assembly picks up the chip;

the driving device drives the bonding head to be close to the substrate until the chip is in contact with the substrate and keeps fit with the substrate;

the distance between the first connecting end and the second connecting end of the corresponding control element is adjusted through the control elements until the pressure between the first connecting end and the second connecting end of any one control element is equal;

the control piece adjusts and locks the distance between the first connecting end and the second connecting end.

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