CN105074899A

CN105074899A - Mass transfer tool manipulator assembly and micro pick up array mount with integrated displacement sensor

Info

Publication number: CN105074899A
Application number: CN201480010122.7A
Authority: CN
Inventors: D·格尔达; J·A·希金森; A·比布尔; P·A·帕克斯; S·P·巴瑟斯特
Original assignee: Lux Dimension Scientific & Technical Corp
Current assignee: Apple Inc
Priority date: 2013-02-25
Filing date: 2014-02-14
Publication date: 2015-11-18
Anticipated expiration: 2034-02-14
Also published as: KR101787860B1; WO2014130353A1; TW201446443A; KR20150123858A; TWI610773B; CN105074899B

Abstract

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Description

Mass transfer tool manipulator assembly and the miniature pickup array bearing with integrated displacement sensor

Technical field

The present invention relates to microdevice.More specifically, embodiments of the invention relate to for the system and method from carrier substrate transfer microdevice.

Background technology

Commercialization microdevice is radio frequency (RF) MEMS (micro electro mechanical system) (MEMS) sensitive switch, light-emitting diode (LED) display system such as, and MEMS or be subject to a great extent and the restriction manufacturing difficulty that these devices are associated and cost based on the feasibility of quartz (controlled) oscillator.Manufacturing process generally includes processing based on wafer and transfer techniques.

Device shifting process comprises from transfer wafer transfer to reception wafer.A kind of this type of is embodied as " directly printing ", and it relates to device array from transfer wafer to the bonding steps receiving wafer, carries out afterwards shifting removing of wafer.Another kind of this type of is embodied as " transfer printing ", and it relates to two bondings/solution bonding steps.In transfer printing, device can be bonded to reception wafer from donor wafer device array by transfer wafer.After transfer, shift wafer can use and comprise laser lift-off (LLO), polishing or the technology of polishing and etching and remove.

Gimbal mechanism is used for polishing wafer equipment to contribute to this wafer uniform polishing.Such as, the passive gimbal mechanism in polissoir contributes to aiming at of wafer and polishing pad.

Summary of the invention

The invention discloses a kind of mass transfer tool manipulator assembly and the next method from carrier substrate transfer microdevice array of service quality transfer tool manipulator assemblies.In one embodiment, mass transfer tool manipulator assembly comprises shell, upset-inclination-z deflection division, actuator and miniature pickup array bearing.Miniature pickup array can provide independent of mass transfer tool manipulator assembly or integratedly with mass transfer tool manipulator assembly to be formed.Upset--z the deflection division that tilts can comprise top deflection member, and this top deflection member is engaged with shell and is connected with bottom deflection member by flexible coupling.Such as, top deflection member can for the flange be connected by flexible coupling with bottom deflection member.Actuator operationally can couple with bottom deflection member, makes to the actuating of actuator, bottom deflection member to be moved relative to top deflection member.Such as, in one embodiment, mass transfer tool manipulator assembly comprises distribution grid actuator and bottom deflection member coupled.Miniature pickup array bearing also can couple with bottom deflection member.In addition, miniature pickup array bearing can comprise the pivotable platform coupled with compliance element such as crossbeam.Displacement transducer can be integrated with compliance element.In one embodiment, the miniature pickup array having the substrate supporting electrostatic transfer head can engage with pivotable platform.

In one embodiment, miniature pickup array bearing can comprise base portion further, and this base portion is laterally around pivotable platform, and wherein compliance element to couple at pivot place and pivotable platform and base portion between pivotable platform and base portion.Such as, compliance element can couple at the outer pivot place be positioned in base edge and base portion and couple being positioned at pivot place and pivotable platform on pivotable platform edges, and this pivotable platform edges is orthogonal to base edge.Compliance element also pivot place and pivotable platform can couple in second, and couples at the second outer pivot place and base portion, wherein this in second pivot relative with interior pivot across pivotable platform, and this second outer pivot is relative with outer pivot across pivotable platform.In one embodiment, miniature pickup array bearing can comprise the second compliance element, and this second compliance element is by being positioned at the second outer pivot in the second base edge and base portion and coupling and by being positioned at the second pivot on the second pivotable platform edges and pivotable platform couples.In addition, second displacement sensor can be integrated with the second compliance element.

In one embodiment, displacement transducer can be the straingauge in the Large strain region close to interior pivot or outer pivot being attached to compliance element.Such as, straingauge can be bonded to Large strain region.Alternatively, straingauge can be deposited on Large strain region.In addition, straingauge is formed by adulterating to Large strain region.In one embodiment, miniature pickup array bearing can comprise the reference straingauge adjacent with the displacement transducer be positioned on compliance element.Displacement transducer and reference straingauge can provide the adjacent brachium pontis in Hui Sitong half-bridge.

In one embodiment, miniature pickup array bearing can comprise various contact element and electrical connector.Such as, miniature pickup array bearing can comprise the displacement transducer contact element be positioned on base portion be electrically connected with displacement transducer.In one embodiment, mass transfer tool manipulator assembly can comprise the location sensing modules be electrically connected with displacement transducer by displacement transducer contact element.Such as, displacement transducer contact element is electrically connected with location sensing modules by flexible circuit or spring contact.In one embodiment, miniature pickup array bearing can comprise the base portion operating voltage contact element be positioned on base portion, and this base portion operating voltage contact element is electrically connected with the pivotable platform operations voltage contact element be positioned on pivotable platform.In addition, miniature pickup array bearing can comprise the base portion clamper contact element be positioned on base portion, and this base portion clamper contact element is electrically connected with the clamper electrode at the bonding position place be positioned on pivotable platform.In one embodiment, miniature pickup array bearing can comprise the bonding position be positioned on pivotable platform, and this bonding position comprises metal such as gold, copper or aluminium.

In one embodiment, miniature pickup array bearing also can comprise and is positioned at temperature sensor on pivotable platform and heating element.Heating element can comprise such as electric resistance alloy or surface mounting technology resistor.In addition, mass transfer tool manipulator assembly can comprise the insulation board between heating element and location sensing modules.The base portion of miniature pickup array bearing can couple with insulation board and insulation board can couple with distribution grid further.

In one embodiment, the method comprises the electrostatic transfer head array that the pivotable platform that is positioned at microdevice array contact on carrier substrate and mass transfer tool manipulator assembly towards carrier substrate moving mass transfer tool manipulator assemblies and making couples.The method also can comprise the distortion of the compliance element that sensing couples with pivotable platform.Such as, sensing distortion can comprise the strain of the sensing displacement transducer integrated with compliance element.In one embodiment, after the method is included in sensing distortion further and before stopping the relative movement between mass transfer tool manipulator assembly and carrier substrate, the position of the base portion that adjustment and compliance element couple.Such as, adjust position can comprise and activate with by tilt or invert base makes the planar alignment of base portion and carrier substrate further to the actuator being coupled to base portion.The method also can comprise to electrostatic transfer head array applying voltage to produce clamp pressure and pick up microdevice array from carrier substrate on microdevice array.In one embodiment, heat is applied to electrostatic transfer head array when the method is included in pickup microdevice array.

In one embodiment, the method comprises the microdevice array towards receiving substrate motion quality transfer tool manipulator assemblies and the electrostatic transfer head array that makes reception substrate contact be coupled by the pivotable platform with mass transfer tool manipulator assembly and carrying.The method also can comprise the distortion of the compliance element that sensing couples with pivotable platform.Such as, sensing distortion can comprise the strain of the sensing displacement transducer integrated with compliance element.In one embodiment, after the method is included in sensing distortion further and before stopping mass transfer tool manipulator assembly and receiving the relative movement between substrate, the position of the base portion that adjustment and compliance element couple.Such as, adjust position can comprise and activate with by tilt or invert base makes the planar alignment of base portion and reception substrate further to the actuator coupled with base portion.The method also can comprise and removes voltage from electrostatic transfer head array, and is discharged into by microdevice array and receives on substrate.In one embodiment, the method is included in the forward direction electrostatic transfer head array removing voltage and applies heat.

Accompanying drawing explanation

Fig. 1 is the perspective view diagram of mass transfer instrument according to an embodiment of the invention.

Fig. 2 is the perspective view diagram of the mass transfer tool manipulator assembly keeping miniature pickup array according to an embodiment of the invention.

Fig. 3 is the perspective cross-sectional view diagram of the mass transfer tool manipulator assembly obtained relative to the hatching A-A of Fig. 2 according to an embodiment of the invention.

Fig. 4 A is the end view diagram of the actuator according to an embodiment of the invention with actuator and flexure attachment.

Fig. 4 B is the perspective view of the upset-inclination-z deflection division of mass transfer tool manipulator assembly according to an embodiment of the invention.

Fig. 5 A is the perspective view of the miniature pickup array bearing according to an embodiment of the invention with the displacement transducer integrated with compliance element.

Fig. 5 B is the plane graph of the displacement transducer integrated with the compliance element of miniature pickup array bearing of the details X taking from Fig. 5 A according to an embodiment of the invention.

Fig. 6 is the perspective view of the miniature pickup array bearing according to an embodiment of the invention with the heating element be positioned on pivotable platform.

Fig. 7 is the end view of the miniature pickup array according to an embodiment of the invention with the substrate supporting electrostatic transfer head array.

Fig. 8 is that the end view of the miniature pickup array bearing engaged with miniature pickup array according to an embodiment of the invention illustrates.

Fig. 9 is the perspective view of the miniature pickup array bearing having the displacement transducer integrated with compliance element according to an embodiment of the invention and be positioned at the electrostatic transfer head array on pivotable platform.

Figure 10 is the perspective view of the miniature pickup array bearing according to an embodiment of the invention with the heating element be positioned on pivotable platform.

Figure 11 is that the cross-sectional side view of the miniature pickup array bearing be electrically connected with spring contact obtained relative to the hatching of Fig. 9 according to an embodiment of the invention illustrates.

Figure 12 is the perspective view diagram of the miniature pickup array bearing according to an embodiment of the invention with flexible region.

Figure 13 is that the end view of the mass transfer tool manipulator assembly keeping miniature pickup array according to an embodiment of the invention and interconnect with control system illustrates.

Figure 14 is according to an embodiment of the invention for adjusting the schematic diagram of the control loop of mass transfer tool manipulator assembly.

Figure 15 illustrates according to an embodiment of the invention from the flow chart of the method for carrier substrate pickup microdevice array.

Figure 16 is according to an embodiment of the invention towards the schematic diagram of the mass transfer tool manipulator assembly of carrier substrate movement.

Figure 17 is the schematic diagram of the electrostatic transfer head array coupled with the mass transfer tool manipulator assembly of the microdevice array contacted on this carrier substrate according to an embodiment of the invention.

Figure 18 is the schematic diagram of the mass transfer tool manipulator assembly of the position adjusting miniature pickup array bearing according to an embodiment of the invention.

Figure 19 is according to an embodiment of the invention from the schematic diagram of the mass transfer tool manipulator assembly of carrier substrate pickup microdevice array.

Figure 20 illustrates the flow chart according to an embodiment of the invention microdevice array being placed in the method received on substrate.

Figure 21 is according to an embodiment of the invention towards the schematic diagram of the mass transfer tool manipulator assembly of reception substrate movement.

Figure 22 be by with the schematic diagram contacting the microdevice array that electrostatic transfer head array that the mass transfer tool manipulator assembly that receives substrate couples carries.

Figure 23 is the schematic diagram of the mass transfer tool manipulator assembly of the position adjusting miniature pickup array bearing according to an embodiment of the invention.

Figure 24 is the schematic diagram according to an embodiment of the invention microdevice array being discharged into the mass transfer tool manipulator assembly received on substrate.

Figure 25 is the schematic diagram of the computer system that can use according to embodiments of the invention.

Embodiment

Present embodiments describe for the system and method from carrier substrate transfer microdevice or microdevice array.Such as, microdevice or microdevice array can be at relevant U.S. Patent application 13/372,222,13/436,260,13/458,932 and 13/625, illustrate and any one miniature LED device structure in the miniature LED device structure described in 825.Although describe some embodiments of the present invention for miniature LED component particularly, but embodiments of the invention are not limited to this, and some embodiment is also applicable to other miniature LED component and microdevice such as diode, transistor, integrated circuit (IC) chip and MEM.

In various embodiments, reference will be made to the accompanying drawings.But some embodiment can be implemented with when configuring and combine in the one or more detail do not existed in these details or with other known methods.In the following description, illustrate that many details such as customized configuration, size and technique are to provide thorough understanding of the present invention.In other cases, the technique known and manufacturing technology are not described in detail especially, in order to avoid unnecessarily fuzzy the present invention." embodiment " (" oneembodiment ", " anembodiment ") etc. mentioned in whole specification refers to that in conjunction with the embodiments described special characteristic, structure, configuration or characteristic comprise at least one embodiment of the present invention.Therefore, in whole specification, many places occur that phrase " embodiment " (" oneembodiment ", " anembodiment ") etc. not necessarily refers to identical embodiment of the present invention.In addition, special characteristic, structure, configuration or characteristic can combine in one or more embodiments in any suitable manner.

Term as used herein " ... above ", " arriving ", " ... between " and " ... on " one deck or the parts relative position relative to other layers or parts can be referred to.One deck another layer " above " or " on " or bonding " to " another layer can be directly to contact with other layers maybe can have one or more intermediate layer.One deck layer " between " can be directly to contact with this layer and maybe can have one or more intermediate layer.

Term as used herein " miniature " device or " miniature " LED structure can refer to the descriptive size of some device or structure according to an embodiment of the invention.As used herein, term " miniature " device or structure refer to the yardstick of 1 μm to 100 μm.But embodiments of the invention might not be limited to this, and some aspect of embodiment is applicable to larger and may be less yardstick.In one embodiment, the single electrostatic transfer head in the single microdevice in microdevice array and electrostatic transfer head array all has the full-size of 1 μm to 100 μm, such as length or width.In one embodiment, the top contact of each microdevice or electrostatic transfer head has the full-size of 1 μm to 100 μm.In one embodiment, the top contact of each microdevice or electrostatic transfer head has the full-size of 3 μm to 20 μm.In one embodiment, the pitch of the pitch of microdevice array and corresponding electrostatic transfer head array can be (1 μm to 100 μm) × (1 μm to 100 μm), the pitch of such as 20 μm × 20 μm or 5 μm × 5 μm.In one aspect, when being not limited to particular theory, embodiments of the invention describe microdevice transfer head and head array, and described microdevice transfer head and head array use the attracting principle of picking up microdevice of the charges of different polarity to operate according to electrostatic chuck.According to embodiments of the invention, pick-up voltage can be applied to produce clamp pressure and pick up microdevice on microdevice to microdevice transfer head.

In one aspect, present embodiments describe the system and method that service quality transfer tool manipulator assemblies carries out the mass transfer of microdevice, this mass transfer tool manipulator assembly has the feedback mechanism aimed at the microdevice array on carrier substrate for adjusting electrostatic transfer head array.In one embodiment, mass transfer tool manipulator assembly comprises upset-inclination-z deflection division, actuator and miniature pickup array bearing, and this miniature pickup array bearing has the one or more displacement transducers integrated with one or more compliance element.Such as, displacement transducer can be the straingauge in the Large strain region being attached to compliance element.Like this, the distortion of compliance element is sensed when displacement transducer is used in electrostatic transfer head array contact microdevice array.In one embodiment, based on the feedback from one or more displacement transducer, the spatial orientation of the actuator adjustable miniature pickup array bearing of mass transfer tool manipulator assembly to change the center of pressure on miniature pickup array bearing.Therefore, mass transfer tool manipulator assembly can facilitate based on closed feedback loop the active alignment being arranged on electrostatic transfer head array on miniature pickup array bearing and microdevice array.Because fine alignment can complete when discharging microdevice when picking up microdevice and similarly, therefore active alignment can improve the transfer rate of microdevice.

On the other hand, the system and method using the upset-inclination-z deflection division coupled with the actuator of mass transfer tool manipulator assembly to carry out the mass transfer of microdevice is present embodiments described.In one embodiment, overturn-tilt-z deflection division and give reactive load to carry out the smooth motion of miniature pickup array bearing between being undertaken by actuator adjustment period to actuator.In one embodiment, overturn-tilt-z deflection division and give restorative load to pick up microdevice array from carrier substrate to miniature pickup array bearing.Therefore, mass transfer tool manipulator assembly can contribute to contacting and use electrostatic transfer head array to pick up microdevice array, and does not damage microdevice or electrostatic transfer head.

On the other hand, a kind of mode utilizing electrostatic transfer head array to carry out the mass transfer of the microdevice array of preproduction is present embodiments described.Such as, the microdevice of preproduction can have specific function, such as, but not limited to for the LED of luminescence, the silicon IC for logical block and memory, and for GaAs (GaAs) circuit that radio frequency (RF) communicates.In certain embodiments, the miniature LED component array being ready to pick up is described to have the pitch of 20 μm × 20 μm, or the pitch of 5 μm × 5 μm.Under these density, such as, the substrate of 6 inches the pitch of 10 μm × 10 μm can hold about 1.65 hundred million miniature LED component, or holds about 6.6 hundred million miniature LED component with the pitch of 5 μm × 5 μm.The mass transfer tool manipulator assembly comprising the electrostatic transfer head array matched with the integral multiple of the pitch of corresponding miniature LED component array can be used for picking up miniature LED component array and being transferred to reception substrate.Like this, can high transfer rate by integrated for miniature LED component and be assembled in foreign peoples's integrated system, comprise the substrate of any size of the scope from miniscope to large area display.Such as, the electrostatic transfer head array of 1cm × 1cm can be picked up and shift 100, the microdevice of more than 000, utilizes larger electrostatic transfer head array can shift more microdevice.

See Fig. 1, it illustrates the perspective view diagram of mass transfer instrument according to an embodiment of the invention.As shown in the figure, mass transfer instrument 100 can comprise mass transfer tool manipulator assembly 102, and this mass transfer tool manipulator assembly is for from the carrier substrate pickup microdevice array kept by carrier substrate retainer 104 and for shift microdevice array and being discharged into by the reception substrate that keeps of reception substrate holder 106.The operation of mass transfer instrument 100 and mass transfer tool manipulator assembly 102 can be controlled by computer system 108 at least in part.In one embodiment, be described in further detail as follows, computer system 108 can carry out the operation of Mass Control transfer tool manipulator assemblies 102 based on the feedback signal received from the various transducers be positioned on the miniature pickup array bearing that couples with mass transfer tool manipulator assembly 102.

In one embodiment, the parts of mass transfer instrument 100 and mass transfer tool manipulator assembly 102 and sub-component can relative to each other move.Such as, the spatial relationship between mass transfer instrument 100 and mass transfer tool manipulator assembly 102 adjustable parts is to contribute to utilizing electrostatic transfer head array to shift microdevice array.This type of adjustment may need the accurate movement of multiple degree of freedom.Such as, mass transfer tool manipulator assembly 102 can comprise the actuator for adjusting miniature pickup array bearing with at least three degree of freedom (such as, overturn, tilt and move in a z-direction).Similarly, carrier substrate retainer 104 can be moved by the x-y plate 110 with at least two degrees of freedom of such as interior along the horizontal plane normal axis of mass transfer instrument 100.Therefore, in one embodiment, the microdevice array that the electrostatic transfer head array supported by mass transfer tool manipulator assembly 102 and the carrier substrate kept by carrier substrate retainer 104 support can five degree of freedom relative to each other accurately movements.But mass transfer instrument 100 and mass transfer tool manipulator assembly 102 can be included between microdevice array and electrostatic transfer head array or provide the additional actuator of more freedom between the miscellaneous part of system.Such as, mass transfer tool manipulator assembly 102 can be arranged on the x-y plate relative to x-y plate 110 movement, between the microdevice array that the electrostatic transfer head array supported by mass transfer tool manipulator assembly 102 and the carrier substrate that kept by carrier substrate retainer 104 support, create two other degree of freedom.

See Fig. 2, it illustrates the perspective view diagram of the mass transfer tool manipulator assembly keeping miniature pickup array according to an embodiment of the invention.Fig. 2 presents the general introduction of the structure member of the embodiment of mass transfer tool manipulator assembly 102.Mass transfer tool manipulator assembly 102 can comprise the shell 210 coupled with the mass transfer tool support 200 of mass transfer instrument 100.Shell 210 can have and can completely or partially be included in shell 210 with the-z actuator 220 that overturn-tilts, and actuator 220 couples by distribution grid 240 and the-z deflection division 230 that overturn-tilts.Distribution grid 240 also can couple with miniature pickup array bearing 250.In one embodiment, miniature pickup array bearing 250 couples, such as, by making miniature pickup array bearing 250 directly remain on insulation board 260 by insulation board 260 and distribution grid 240.In one embodiment, miniature pickup array bearing 250 can engage with intermediate member such as holding plate 270, and this intermediate member keeps being close to insulation board 260 by retaining ring 280.In addition, the miniature pickup array 290 supporting electrostatic transfer head array can be integrated with miniature pickup array bearing 250.

See Fig. 3, it illustrates the perspective cross-sectional view diagram of the mass transfer tool manipulator assembly obtained relative to the hatching A-A of Fig. 2 according to an embodiment of the invention.Fig. 3 presents the more details of the mechanical interaction between the construction package of the embodiment of mass transfer tool manipulator assembly 102.Such as, actuator 220 can comprise one or more actuator 310, and this one or more actuator has the first actuator attachment 312 that can couple regularly with shell 210 and/or mass transfer tool support 200.Actuator 310 can comprise further can relative to the second actuator attachment 314 of the first actuator attachment 312 movement.As mentioned above, the second actuator attachment 314 can tighten together with distribution grid 240 further.Therefore, carry out activating the relative movement that can cause between distribution grid 240 and shell 210 to actuator 310.

Therefore, actuating is carried out to actuator 310 and can have at least two results.First, because miniature pickup array bearing 250 directly or indirectly can couple with distribution grid 240, therefore carry out activating the spatial relationship that can change miniature pickup array bearing 250 or between the miniature pickup array 290 that engages with miniature pickup array bearing 250 and shell 210 to actuator 310.Second, because distribution grid 240 and shell 210 can couple with the opposite end of-z deflection division 230 that overturn-tilts, therefore carrying out actuating when distribution grid 240 moves relative to shell 210 to actuator 310 can apply tension load, compressive load and/or torsional load to the upset--z deflection division 230 that tilts.

In one embodiment, insulation board 260 can be used for mode of heating, miniature pickup array bearing 250 being isolated with the miscellaneous part of mass transfer tool manipulator assembly 102.Such as, insulation board 260 can be placed between miniature pickup array bearing 250 and the miscellaneous part of actuator 220 or mass transfer tool manipulator assembly 102.In addition, by the contact area between limiting part, the contact between insulation board 260 and the miscellaneous part of miniature pickup array bearing 250 or mass transfer tool manipulator assembly 102 is minimized.Such as, insulation board 260 can use the insulated column utilizing securing member to be connected to parts to couple with distribution grid 240, instead of uses conducting coupling part such as weld seam and parts to couple.

In one embodiment, insulation board 260 such as can be formed lower than the material of the thermal conductivity of about 1.5W/m* DEG C by showing when being heated to 200 DEG C lower thermal conductivity.Such as, insulation board 260 can be formed by opaque fused silica material or the other materials with insulation characterisitic.In one embodiment, insulation board 260 is formed by comprising the equally distributed opaque fused silica material of high-purity being less than the micro-bubble of about 20 microns, such as, be located at Mentor by general headquarters, " Pyro-LD80 " of the PyromaticsCorp. manufacture of OH.Therefore, be described in further detail as follows, insulation board 260 can be used as thermal insulation layer and makes the parts of mass transfer tool manipulator assembly 102 such as actuator 310 (such as, piezo-activator) and sensing module 316 with mode of heating and isolate for the heating element heating the miniature pickup array 290 supporting electrostatic transfer head array.

In one embodiment, holding plate 270 and miniature pickup array bearing 250 can be formed by the material with similar thermal coefficient of expansion.Such as, miniature pickup array bearing 250 can be formed by silicon and holding plate 270 can be formed by controlled expansion nickel alloy such as low bulk " alloy 39 ".Alloy 39 is controlled expansion alloy, and in one embodiment, this controlled expansion alloy comprises the chemical composition of 0.05C, 0.40Mn, 0.25Si, 39.00Ni, BalFe.By comparing, alloy 39 shows the thermal coefficient of expansion of about 2 (× 10-6/ DEG C) near 25 DEG C, and silicon shows the thermal linear expansion coefficient of about 3 (× 10-6/ DEG C) near identical temperature.Therefore, miniature pickup array bearing 250 and holding plate 270 need not have identical thermal expansion character, but these parts can stretch when standing variations in temperature and shrink in the identical order of magnitude.

In one embodiment, retaining ring 280 can use fixture, threaded fastener or other known retention mechanisms are fastened on insulation board 260 or are directly fastened on distribution grid 240.In addition, retaining ring 280 can comprise one or more inserted sheet of pressing miniature pickup array 290 or holding plate 270 or antelabium to make holding plate 270 be close to clamping insulation board 260 and to make miniature pickup array bearing 250 couple with distribution grid 240.Also other modes for keeping miniature pickup array bearing 250 can be used.Such as, holding plate 270 can use known bonding or thermal bonding technology such as welding or welding Direct Bonding to insulation board 260.

See Fig. 4 A, it illustrates the end view diagram of the actuator according to an embodiment of the invention with actuator and flexure attachment.In one embodiment, actuator 220 is included at least one actuator 310 producing motion between the first actuator attachment 312 and the second actuator attachment 314.Such as, actuator 220 can comprise three linear actuators, and each linear actuators moves the first actuator attachment 312 relative to the second actuator attachment 314 on single linear direction.Therefore, the actuator 220 mass transfer tool support 200 that can couple at the first actuator attachment 312 and and the distribution grid 240 that couples of the second actuator attachment 314 between create the summation of at least two degrees of freedom.More specifically, actuator 220 can make distribution grid 240 overturn relative to mass transfer tool support 200 and tilt.Can change the quantity of the actuator 310 in actuator 220 and type to change the degree of freedom between mass transfer tool support 200 and distribution grid 240 and/or range of movement, such as actuator 310 can be revolving actuator instead of linear actuators.Therefore, in one embodiment, actuator 220 provides Three Degree Of Freedom in a z-direction by each linear actuators extended in three linear actuators simultaneously.But, in another embodiment, the other degree of freedom can be provided by the actuator outside mass transfer tool manipulator assembly 102, such as, can the single linear actuators of moving mass transfer tool bearing 200 in a z-direction provide by mass transfer instrument 100.Similarly, as mentioned above, x-y plate 110 can provide additional degree between mass transfer instrument 100 and the parts of mass transfer tool manipulator assembly 102.Therefore, in one embodiment, activate the movement that distribution grid 240 not only can depend on actuator 220, also can be dependent on external actuator.

In one embodiment, actuator 310 can be piezo-activator.Although can use other linear actuators, such as hydraulic actuator, pneumatic actuator or electromechanical actuator, piezo-activator is can show fine positioning resolution by during the signal controlling transmitted by actuator leads 404 by relatively short movement.In one embodiment, actuator 310 can be the piezo-activator with about 30 microns of range of movement.

In one embodiment, the first actuator attachment 312 can comprise the first flexure attachment 402.First flexure attachment 402 can comprise one or more flexure and alleviate part 406.Flexure is alleviated part 406 and can be configured to provide flexibility to the first flexure attachment 402 on the direction of the direction of motion being different from actuator 310.Such as, flexure alleviation part 406 can be included in the passage of processing in the first flexure attachment 402 to provide flexibility on the direction of length being orthogonal to actuator 310.In addition, the first flexure attachment 402 can provide without delayed movement to offset any recoil that may be present in actuator 310.Actuator 310 and the first flexure attachment 402 can couple with coupling axle 408, and this couples axle and has the end engaged the hole be formed in actuator 310 and the first flexure attachment 402.Known bonding and clamp method can be used, allow to couple axle 408 and float in hole or be rigidly secured in hole.

See Fig. 4 B, it illustrates the perspective view of the upset-inclination-z deflection division of mass transfer tool manipulator assembly according to an embodiment of the invention.Upset--z the deflection division 230 that tilts can comprise top deflection member 410 and bottom deflection member 412.In one embodiment, top deflection member 410 is connected by flexible coupling 414 with bottom deflection member 412.Flexible coupling 414 can have multiple configuration, and such as flexible coupling 414 can comprise crossbeam coupling or the spiral coupling of one or more radial slots 416 of a part for the sidewall had through the upset--z deflection division 230 that tilts.In one embodiment, radial slot 416 can be separated from each other by one or more separating part 418.Alternatively, radial slot 416 can be the groove of the single spiralization through the upset--z deflection division 230 that tilts.

Flexible coupling 414 can be configured to allow top deflection member 410 and bottom deflection member 412 along z-axis 420 and relative to each other move around trip shaft 422 and sloping shaft 424.Therefore, when top deflection member 410 is coupled by outer rigid housing 210 and mass transfer tool support 200 and bottom deflection member 412 is coupled with actuator 220 by stiffness distribution plate 240, the motion between top deflection member 410 and bottom deflection member 412 reflects the motion between mass transfer tool support 200 and distribution grid 240.Therefore, overturning-tilt-z deflection division 230 allows actuator 220 to adjust distribution grid 240 relative to mass transfer tool support 200 and the miniature pickup array bearing 250 that couples with distribution grid 240 and/or miniature pickup array 290.

Except permission activates the miniature pickup array bearing 250 and/or miniature pickup array 290 coupled with distribution grid 240, the upset--z deflection division 230 that tilts can also facilitate this type of to activate by various ways.Such as, miniature pickup array bearing 250 can be allowed to be out of shape when contacting the microdevice on carrier substrate to the rigidity adjustment of the flexible coupling 414 of the upset--z deflection division 230 that tilts.In addition, the fluent motion of actuator 220 can be made to the rigidity adjustment of the flexible coupling 414 of the upset--z deflection division 230 that tilts.In addition, can provide pickup force to the rigidity adjustment of the flexible coupling 414 of the upset--z deflection division 230 that tilts, this pickup force bounces back the microdevice clamped from carrier substrate by electrostatic transfer head 703.

In one embodiment, the rigidity of the compliance element of the comparable miniature pickup array bearing 250 be hereafter described in further detail of flexible coupling 414 is stronger.The rigidity of mating by this way between flexible coupling 414 and compliance element can allow the compliance element when electrostatic transfer head array contact microdevice array to be out of shape as required.That is, contact load is alternatively absorbed by compliance element, instead of contact load is absorbed by flexible coupling 414.In addition, compliance element can be out of shape under such loading and this distortion can be sensed by the displacement transducer 518 integrated with compliance element and be used as feed back to adjust actuator 220.

In one embodiment, when actuator 220 moves distribution grid 240, flexible coupling 414 can provide reactive load to distribution grid 240.Such as, when making distribution grid 240 overturn by the actuator 220 with three actuators, the kinematics of each actuator may slightly not mated, thus causes unwanted shake or torsion, such as the driftage of distribution grid 240.This kinematics can be offset to the rigidity adjustment of flexible coupling 414 do not mate and resist unwanted movement.Such as, in one embodiment, flexible coupling 414 has crossbeam coupling as above, namely there is the separating part 418 between radial slot 416, the torsional rigidity of flexible coupling 414 can be high enough to prevent from rotating around z-axis 420, thus limits overturning and the motion of tilting around trip shaft 422 and sloping shaft 424 of distribution grid 240 completely.

In one embodiment, flexible coupling 414 can stretch under the tension load applied by actuator 220 in length, but the power put on flexible coupling 414 can produce the potential energy of storage to produce restorative load after making actuator 220 deexcitation.In other words, after the offset load removing actuator 220, flexible coupling 414 can serve as extension spring to pull distribution grid 240, and the miniature pickup array bearing 250 coupled with distribution grid 240.When clamping attachment is to the microdevice array of carrier substrate statically for electrostatic transfer head array 703, the restorative load produced by flexible coupling 414 can be greater than from the load needed for carrier substrate pickup microdevice array, i.e. breakdown pressure.Such as, in one embodiment, can expect that breakdown pressure is about two atmospheric pressure, thus can adjust to produce the restorative load be equivalent to higher than two atmospheric pressure when extending to flexible coupling 414.Therefore, after making electrostatic transfer head array clamping microdevice array, actuator 220 deexcitation can be made and pickup pressure can be provided by the restorative load from flexible coupling 414.

In one embodiment, miniature pickup array bearing 250 comprises the transducer being provided feedback signal by one or more electrical connector such as flexible circuit 318 to location sensing modules 316 and/or computer system 108.As described below, feedback can comprise analog signal from the displacement transducer for control loop to adjust the actuating of actuator 310, therefore adjusts the spatial orientation of miniature pickup array bearing 250.Location sensing modules 316 can be positioned near miniature pickup array bearing 250 and reduce Signal Degrade with the distance that must march to location sensing modules 316 from displacement transducer by restriction analog signal.The opposite side that location sensing modules 316 also can be positioned at insulation board 260 is to reduce the transfer of heat from miniature pickup array bearing 250 to location sensing modules 316 and actuator 310.Thermal insulation between holding position sensing module 316 and miniature pickup array bearing 250 can reduce by the signal distortion caused the thermal effect of location sensing modules 316.Keep the thermal insulation of actuator 310 such as between piezo-activator and miniature pickup array bearing 250 can avoid actuator 310 and therefore avoid the thermal drift of the ability of mass transfer tool manipulator assembly 102 accurately to adjust the spatial orientation of the miniature pickup array bearing 250 supporting microdevice array.

Fig. 5 A-Fig. 6 and Fig. 8-Figure 12 illustrates the alternative embodiment of miniature pickup array bearing 250, and it can couple to allow when actuator 220 adjusts distribution grid 240 to adjust the spatial orientation of miniature pickup array bearing 250 with distribution grid 240.Each embodiment allows to be adjusted by the spatial orientation of joint motions to electrostatic transfer head of miniature pickup array bearing 250 or miniature pickup array 290.In one embodiment, miniature pickup array bearing 250 can be included in relevant U.S. Patent Application No. 13/715,557 and 13/715, any one self-alignment structure shown in 591 and in described self-alignment structure, these patent applications are incorporated to way of reference accordingly.

See Fig. 5 A, it illustrates the perspective view of the miniature pickup array bearing according to an embodiment of the invention with the displacement transducer integrated with compliance element.For reference purpose, shown view can be called as " front side " or " front " of miniature pickup array bearing 250.In one embodiment, miniature pickup array bearing 250 comprises base portion 502 and pivotable platform 504.In one embodiment, base portion 502 is around all or part of of pivotable platform 504.Such as, base portion 502 laterally can extend around pivotable platform 504.In alternative embodiment, base portion 502 is not around pivotable platform 504.Base portion 502 and pivotable platform 504 can by one or more compliance element interconnections.Such as, in the illustrated embodiment, compliance element can be represented by crossbeam 506.Crossbeam 506 can one or more pivot location such as in pivot 508,514 and outer pivot 510,516 place be connected with base portion 502 and pivotable platform 504.In one embodiment, interior pivot 508,514 and outer pivot 510,516 can be positioned on the edge of orthogonal base portion 502 and pivotable platform 504.

According to embodiments of the invention, miniature pickup array bearing 250 can be formed by one or more part or parts.Such as, in one embodiment, base portion 502, pivotable platform 504 and one or more compliance element (such as, crossbeam 506) can be formed to produce zones of different by Silicon Wafer.More specifically, such as etching, laser cutting etc. form passage 522 deeply can to use already known processes.In at least one embodiment, passage 522 by such as base portion 502, provide interval to limit the structure of miniature pickup array bearing 250 between crossbeam 506 and pivotable platform 504 region.Such as, passage 522 can form the interval of about 100 microns between base portion 502 and crossbeam 506 and between crossbeam 506 and pivotable platform 504.The ability that material outside silica removal deflects under can executing load, thermal stability and minimum spring-mass outside based on material is come for miniature pickup array bearing 250.Such as, outside silica removal, for the suitable material formed selected by miniature pickup array bearing 250 can include but not limited to carborundum, aluminium nitride, stainless steel and aluminium.

Crossbeam 506 can extend laterally to outer pivot 510 around pivotable platform 504 from interior pivot 508.More specifically, crossbeam 506 conforms to these parts by carrying out adaptation and fill the hole between these parts at least in part between base portion 502 and pivotable platform 504.In one embodiment, the lateral extension portion of crossbeam 506 provides lever arm, when power being put on pivotable platform 504 or put on the miniature pickup array 290 be arranged on pivotable platform 504, this lever arm allows the bending and torsion of crossbeam 506, interior pivot 508,514 and outer pivot 510,516.More specifically, when power being put on pivotable platform 504, such as when being positioned at the electrostatic transfer head contact on mounted miniature pickup array 290 and being positioned at the microdevice on carrier substrate, pivotable platform 504 can deflect relative to base portion 502.This deflection can supervene one or more Large strain region and occur, as represented by the dashed region details X near outer pivot 510.Similar strain region can produce according to position power being put on pivotable platform 504 close in pivot 508,514 and outer pivot 516.

In one embodiment, crossbeam 506 rigidity can be selected to contribute to from carrier substrate pickup microdevice and to be placed into reception substrate.Such as, can the electrostatic transfer head that crossbeam 506 rigidity adjustment is guaranteed on pivotable platform 504 be damaged after contacting the microdevice on carrier substrate or after the microdevice contact clamped by electrostatic transfer head receives substrate.That is, crossbeam 506 rigidity can allow beam deformation, and this distortion is enough to allow pivotable platform 504 to be deflected by contact range.Such as, in one embodiment, when electrostatic transfer head is to be less than the load contact microdevice array damaging load needed for electrostatic transfer head, can expect that pivotable platform 504 upward deflects at least three ten microns.

In addition, can adjust to avoid the plastic deformation of beam 506 during carrier substrate pickup microdevice to crossbeam 506 rigidity.Such as, when electrostatic transfer head clamps the microdevice on carrier substrate, retraction mass transfer tool manipulator assembly 102 can make base portion 502 move up relative to the pivotable platform 504 be associated with electrostatic transfer head.In essence, miniature pickup array bearing 250 is as extension spring, and it pulls the microdevice array clamped by electrostatic transfer head array.In one embodiment, crossbeam 506 rigidity allows this type of to move when not causing the plastic deformation of crossbeam 506.Such as, come needing about two atmospheric desired values to promote the embodiment of microdevice from carrier substrate, crossbeam 506 resists at least two atmospheric pressure putting on pivotable platform 504 before plastic deformation.

In one embodiment, Large strain region place or near, one or more displacement transducer 418 can be integrated with crossbeam 506.Displacement transducer 418 can sense crossbeam 506 displacement caused by the load of a part such as pivotable platform 504 putting on miniature pickup array bearing 250.Such as, displacement transducer 418 can the movement of direct-detection crossbeam 506, or it can detect internal modification to infer the movement of crossbeam 506.

See Fig. 5 B, it illustrates the plane graph of the displacement transducer integrated with the compliance element of miniature pickup array bearing of the details X taking from Fig. 5 A according to an embodiment of the invention.In one embodiment, displacement transducer 518 can be the straingauge of the distortion of measuring crossbeam 506.Straingauge can show the resistance changed with material deformation.More specifically, straingauge can be configured to be out of shape when crossbeam 506 is out of shape.That is, can based on shift environment that microdevice is associated from carrier substrate and operating condition selects straingauge design, to realize necessary accuracy, stability, cyclic durability etc.Therefore, straingauge can be formed by various material and integrated to realize this target with crossbeam 506 in many ways.Described below is several this type of embodiments.

Straingauge can be formed independent of crossbeam 506 and attach to this.In one embodiment, straingauge comprises insulation flexible backing, the paper tinsel that this insulation flexible backing support is formed by polysilicon and make this paper tinsel and crossbeam 506 electric insulation.Such as, paper tinsel can be arranged by scroll pattern.The example of the straingauge that can be attached for be located at Malvern by general headquarters, the general straingauge of Series015DJ that the VishayPrecisionGroup of PA manufactures.The straingauge formed independent of crossbeam 506 can use kinds of processes to be attached to crossbeam 506.Such as, straingauge backing is directly attached to crossbeam 506 by bonding or other bonding operation.More specifically, straingauge backing can use the combination of solder, epoxy resin or solder and High temp. epoxy resins to be fixed to the surface of crossbeam 506.

In another embodiment, straingauge can be formed on crossbeam 506 by desired pattern such as scroll pattern.In one embodiment, straingauge can use depositing operation to be formed directly on crossbeam 506.Such as, constantan (constantan) copper nickel trace can directly sputter on crossbeam 506 by scroll pattern.The twisted wire size with scroll pattern through sputtering straingauge can be about 8 microns wide, and the distance wherein between twisted wire length is 8 microns, and can be deposited into the thickness of about 105 nanometers.

In another embodiment, the material of crossbeam 506 can be revised to form integrated straingauge.More specifically, crossbeam 506 can doped with pressure drag material to form straingauge in crossbeam 506.Such as, the surface of crossbeam 506 can doped with silicon.Dopant material can be the scroll pattern with the size changed with applied strain.Therefore, straingauge can be fully integrated in and physically be mixed in the remainder of crossbeam 506.

In one embodiment, displacement transducer 518 can be the straingauge with the pattern (such as, scroll) of the lengthwise twisted wire aimed on the direction of expection strain be positioned on crossbeam 506.Such as, crossbeam 506 can be desirably in Large strain region the compressive load or tension load that observe and aim at passage 522, and therefore the lengthwise twisted wire of displacement transducer 518 can be parallel to passage 522.But that sees principal strain plane in the other direction has in the embodiment of miniature pickup array bearing 250 of compliance element, orientation can be carried out to detect this type of strain to displacement transducer 518.

During carrier substrate transfer microdevice, crossbeam 506 and displacement transducer 518 can stand the temperature raised, and therefore temperature-compensating can be necessary.In one embodiment, temperature self-compensation can be carried out to displacement transducer.More specifically, may correspond to change instrument material to carry out selecting under the operating condition of shifting process, limit the apparent strain caused by temperature.But, in the embodiment of alternative, other modes for temperature-compensating can be used.Such as, temperature-compensating can use virtual measurement technique to realize.

Still see Fig. 5 B, in one embodiment, virtual measurement technique utilizes and carrys out compensate for displacement transducer 518 with reference to straingauge 520.More specifically, can be positioned near the displacement transducer 518 in same strain region with reference to straingauge 520.Although the twisted wire of displacement transducer 518 can be aimed at the direction of applied strain, the twisted wire with reference to straingauge 520 can be orthogonal to the twisted wire of displacement transducer 518 and is orthogonal to the direction of applied strain and extends.Alternatively, can be arranged in the unstrained region of miniature pickup array bearing 250 with reference to straingauge 520, this reference straingauge is away from the displacement transducer 518 in Large strain region being arranged in crossbeam 506.Such as, can be positioned on base portion 502 or pivotable platform 504 with reference to straingauge 520.Therefore, displacement transducer 518 can be configured to detect the strain putting on crossbeam 506, and can be configured to reference to straingauge detect the strain produced miniature pickup array bearing 250 by thermal effect.Therefore, can be used for determining to the comparison of the strain of two kinds of straingauges and compensate the strain relevant to the thermal expansion of crossbeam 506.

Refer again to Fig. 5 A, in one embodiment, the adjacent brachium pontis of Hui Sitong half-bridge can be connected to through a cable with reference to straingauge 520 and displacement transducer 518 to offset displacement transducer 518 and to affect with reference to the temperature between straingauge 520.Each displacement transducer 518 and reference straingauge 520 can form Hui Sitong half-bridge to sense interior pivot 508,514 or outer pivot 510, the strain in the Large strain region near 516.But each interior pivot 508,514 and outer pivot 510,516 can comprise the second Large strain region, this second Large strain region is relative with the first Large strain region and be positioned at the second adjacent lateral edges of the pivot limited by passage 522.Another one displacement sensor 518 or a pair displacement transducer 518 and this second Large strain region can be arranged in sense distortion with reference to straingauge 520.In addition, this pair displacement transducer 518 and can the mode of Hui Sitong full-bridge linking together through a cable with reference to both straingauges 520, can monitor to determine interior pivot 508,514 and outer pivot 510, the material strain near 516 to them.As described below, monitor these strain signals and can be used for inferring the pressure putting on pivotable platform 504.In addition, control algolithm can use strain signal to determine that on pivotable platform 504, to be uniformly distributed upset needed for pressure, inclination and z (being orthogonal to pivotable platform surface) mobile.

The transducer of other types can be used for distortion or the displacement of the compliance element sensing miniature pickup array bearing 250.Such as, the different straingauge type comprising capacitance-type strain ga(u)ge and the straingauge that utilizes optical fiber sense can be used for sensing crossbeam 506 and is out of shape.Alternatively, the compliance element of miniature pickup array bearing 250 or the displacement of miscellaneous part such as pivotable platform 504 can directly be measured.In one embodiment, laser interferometer can be used for the displacement sensing compliance element or pivotable platform 504.In another embodiment, capacitive displacement transducer can be used for the displacement sensing compliance element or pivotable platform 504.Therefore, choosing multiple mode is measured and is provided the feedback relevant to the displacement of pivotable platform 504 or compliance element.In one embodiment, select to guide by weighing such as cost, required precision and environmental consideration.Such as, compensate a choice criteria be can be to the ability of the thermal effect of displacement transducer 518.

In one embodiment, miniature pickup array bearing 250 comprises the one or more pivotable platform operations voltage contact element 530 be positioned on pivotable platform 504.When being operably connected with miniature pickup array bearing 250, pivotable platform operations voltage contact element 530 can be used for operating voltage being transferred to the electrostatic transfer head array on miniature pickup array 290.In one embodiment, pivotable platform operations voltage contact element 530 can use appropriate technology to be formed, this appropriate technology such as, but not limited to by electric conducting material (such as, metal) sputtering or electron beam evaporation on the surface of pivotable platform 504.

In one embodiment, miniature pickup array bearing 250 can comprise the one or more bonding positions for installing miniature pickup array 290.In one embodiment, bonding position comprises the one or more clamper electrodes 540 be positioned on pivotable platform 504.More specifically, clamper electrode 540 can be positioned on the surface of the pivotable platform 504 identical with pivotable platform operations voltage contact element 530.Clamper electrode 540 can be configured to use electrostatic principle to fix or clamp miniature pickup array 290.Such as, clamper electrode 540 can comprise the one or more conductive pads covered by dielectric layer.According to the principle of electrostatic chuck, when conductive pad maintains certain voltage place and places adjacent to the metal on miniature pickup array 290 or semiconductor film clamped region, miniature pickup array 290 is clamped to miniature pickup array bearing 250 by electrostatic force.Here, the adjacent conductive pad that refers to of term separates by means of only thin dielectric layer and clamped region.

The parts be positioned on the front of miniature pickup array bearing 250 can be made to be electrically connected by the miscellaneous part of various lead-in wire with mass transfer instrument 100 and mass transfer tool manipulator assembly 102.Such as, front flexible circuit 550 can from the external component of mass transfer instrument 100 and mass transfer tool manipulator assembly 102 extend be positioned at flexible circuit connector 552 before the face of base portion 502 or edge and be electrically connected.Front flexible circuit 550 can be such as many conductor belts cable and front flexible circuit connector 552 can be butt connector.In addition, front flexible circuit connector 552 can comprise terminal contact element, and various trace is initial and parts extended to the front being positioned at miniature pickup array bearing 250 from this terminal contact element.

Such as, displacement transducer 518 is electrically connected with front flexible circuit connector 552 by one or more displacement transducer trace 554.More specifically, displacement transducer 518 can be electrically connected with two traces, the input trace be namely connected with the independent terminal contact element of butt connector and export trace (Fig. 5 B).To graphically one or more trace is depicted as single line in fig. 5, and illustrates for simplicity, omission or trace shown in broken lines schematically depict the quantity of actual leads with instruction.

Similarly, be electrically connected with front flexible circuit connector 552 with reference to straingauge trace 556 by one or more with reference to straingauge 520.Pivotable platform operations voltage contact element 530 is electrically connected with front flexible circuit connector 552 by one or more operating voltage trace 558.Clamper electrode 540 is electrically connected with front flexible circuit connector 552 by one or more clamper electrode trace 560.In one embodiment, appropriate technology can be used such as to sputter or trace is formed directly on miniature pickup array bearing 250 by electron beam evaporation.In the embodiment of alternative, trace can be independent of miniature pickup array bearing 250 surface or be bonded to the electric wire on surface of miniature pickup array bearing 250.

See Fig. 6, it illustrates the perspective view of the miniature pickup array bearing according to an embodiment of the invention with the heating element be positioned on pivotable platform.For reference purpose, shown view can be called as " rear side " or " back side " of miniature pickup array bearing 250.Miniature pickup array bearing 250 can comprise the one or more heating elements 602 on the rear side of the pivotable platform 504 being positioned at miniature pickup array bearing 250.In one embodiment, heating element 602 can be formed by electric resistance alloy, such as sputters at the nichrome on miniature pickup array bearing 250.Therefore, heating element 602 can stand Joule heating at electric current through during this heating element.Therefore, the heat miniature pickup array 290 that can be transferred to miniature pickup array bearing 250 from heating element 602 and/or engage.In the embodiment of alternative, heating element 602 can be the resistor that the surface based on the surface mounting technology dispelled the heat with the speed depending on the electric current putting on resistor is installed.In one embodiment, miniature pickup array bearing such as can be heated towards the infrared heating source of pivotable platform 504 by external heat parts.

In one embodiment, miniature pickup array bearing 250 comprises one or more temperature sensor 610 to sense miniature pickup array bearing 250 or neighbouring structure example as the temperature of miniature pickup array 290.Such as, temperature sensor 610 can be positioned at the rear side of pivotable platform 504 to measure the temperature of pivotable platform 504.Such as, temperature sensor 610 can be positioned at the center of pivotable platform 504, the turning of pivotable platform 504, or is positioned on base portion 502 or crossbeam 506.Temperature sensor 610 can be the temperature sensor of thermistor, thermoelectricity occasionally other types.In addition, temperature sensor 610 can encapsulate or otherwise be attached to or be mechanically secured to pivotable platform 504.

According to embodiments of the invention, heating element 602 and/or temperature sensor 610 can be positioned at front side or the rear side of miniature pickup array bearing 250.Position is selected can by considering whether such as free space and heating element 602 and temperature sensor 610 will hinder other functions to drive.Such as, parts can be placed to avoid destroying the electric charge in the clamper electrode 540 of miniature pickup array bearing 250 or the electrostatic transfer head of miniature pickup array 290.In addition, parts can be placed to avoid interference miniature pickup array 290 and be bonded to miniature pickup array bearing 250.Temperature sensor 610 can be placed with the peak temperature of the miniature pickup array 290 of close proximity.Temperature offset can be adopted if desired to realize this degree of closeness.

Be be electrically connected the parts on the back side of miniature pickup array bearing 250 with the miscellaneous part of mass transfer instrument 100 and mass transfer tool manipulator assembly 102 by various lead placement.Such as, rear flexible circuit 620 can extend to be electrically connected with the rear flexible circuit connector 630 be arranged on the face of base portion 502 or edge from the external component of mass transfer instrument 100 and mass transfer tool manipulator assembly 102.Rear flexible circuit 620 can be such as many conductor belts cable and rear flexible circuit connector 630 can be butt connector.In addition, rear flexible circuit connector 630 can comprise terminal contact element, and various trace is initial and parts extended to the back side being positioned at miniature pickup array bearing 250 from this terminal contact element.Like this, heating element 602 is electrically connected with rear flexible circuit connector 630 by one or more heating track 640.Temperature sensor 610 is electrically connected with rear flexible circuit connector 630 by one or more temperature sensor trace 642.In one embodiment, the such as sputtering or electron beam evaporation of appropriate technology can be used to be formed directly into by trace on miniature pickup array bearing 250.In the embodiment of alternative, trace can be independent of miniature pickup array bearing 250 surface or be bonded to the electric wire on surface of miniature pickup array bearing 250.

See Fig. 7, it illustrates the miniature pickup array according to an embodiment of the invention with the substrate supporting electrostatic transfer head array.Miniature pickup array 290 can comprise the base portion substrate 702 of support electrostatic transfer head 703 array formed by one or more in silicon, pottery and polymer.Each electrostatic transfer head 703 can comprise the mesa structure 704 with top surface 708, and this top surface can support electrode 712.But electrode 712 is exemplary, and in another embodiment, mesa structure 704 can be and conducts electricity wholly or in part, electrode 712 be can be unnecessary.Dielectric layer 716 covers top surface 708 and the electrode 712 (in case of presence) of each mesa structure 704.The top contact surface 718 of each electrostatic transfer head 703 has full-size, and the length of such as 1 μm to 100 μm or width, it may correspond to the size in microdevice to be picked up.

Mesa structure 704 is given prominence to away from bottom substrate 702 to provide the localized contact point on top contact surface 718 to pick up particular microchannel device during pick-up operation.In one embodiment, mesa structure 704 has about 1 μm to 5 μm or the more specifically height of about 2 μm.In one embodiment, mesa structure 704 can have top surface 708, and this top surface has between 1 square micron to 10, the surface area of 000 square micron.Mesa structure 704 can multiple geometry such as such as square, rectangle, circle, ellipse etc. be formed, and keeps this general purpose table areal extent simultaneously.The height of mesa structure array on base portion substrate 702, width and flatness are selected, each electrostatic transfer head 703 can be contacted with corresponding microdevice during pick-up operation, and electrostatic transfer head 703 by mistake can not be contacted with the microdevice adjacent to the corresponding microdevice of expecting during pick-up operation.

Still see Fig. 7, contact conductor 714 can make electrode 712 or mesa structure 704 with the terminal of operating voltage path 720 and be electrically connected with the substrate of operating voltage contact element 722.Therefore, operating voltage transfers to electrostatic transfer head 703 array by operating voltage path 720 from the substrate-operations voltage contact element 722 of miniature pickup array 290.Operating voltage path 720 can be formed in many ways.Such as, operating voltage path 720 is formed by following steps: get out or etch-hole through base portion base portion substrate 702, insulator is utilized to carry out passivation to hole, and use that suitable technology such as sputters, electric conducting material (such as, metal) is formed as passivation hole to form operating voltage path 720 by electron beam evaporation, plating or electroless deposition.

Miniature pickup array 290 can comprise be formed in miniature pickup array 290 rear side on one or more substrate clamper contact element 724.In one embodiment, substrate clamper contact element 724 comprises conductive pad, such as metal or semiconductor film.Conductive pad can with other active region electric isolution of miniature pickup array 290.Such as, can below conductive pad, above and around form insulating barrier.In another embodiment, substrate clamper contact element 724 can integratedly with miniature pickup array 290 be formed, such as by being formed miniature pickup array 290 and substrate clamper contact element 724 by bulk silicon, and make other active region electric isolution of substrate clamper contact element 724 and miniature pickup array 290.

See Fig. 8, it illustrates that the cross-sectional side view of the miniature pickup array bearing engaged with miniature pickup array according to an embodiment of the invention illustrates.Miniature pickup array 290 and miniature pickup array bearing 250 can physically and operationally engage.As mentioned above, use the charges of different polarity attracting according to electrostatic chuck principle, the substrate clamper contact element 724 of miniature pickup array 290 can aim at the clamper electrode 540 on miniature pickup array bearing 250 and be kept by its electrostatic.More specifically, when by clamper electrode trace 560 electrostatic potential being put on clamper electrode 540, electrostatic clamp pressure will put on substrate clamper electrode 540, and miniature pickup array 290 is physically engaged with miniature pickup array bearing 250.In addition, one or more substrate-operations voltage contact element 722 of miniature pickup array 290 can be aimed at pivotable platform operations voltage contact element 530 and place adjacent to it.Therefore, the voltage putting on pivotable platform operations voltage contact element 530 by operating voltage trace 558 is transferred to one or more electrostatic transfer head 703 by substrate-operations voltage contact element 722 and operating voltage path 720.Therefore, miniature pickup array bearing 250 and miniature pickup array 290 can be electrically connected to make miniature pickup array 290 can produce electrostatic clamp power to microdevice array.

When these component physicals engage time, the microdevice array that heat can be sent to miniature pickup array 290 from miniature pickup array bearing 250 and/or be clamped by miniature pickup array 290.More specifically, the heating element 602 on miniature pickup array bearing 250 is heated by resistance-type by transmitting electric current via heating track 640.Therefore, heat can be transferred to miniature pickup array 290 from heating element 602 by pivotable platform 504.In addition, the heat being delivered to miniature pickup array 290 is dissipated to by an electrostatic transfer microdevice array that 703 arrays clamp by electrostatic transfer 703 array.

So far the embodiment described see Fig. 5 A-Fig. 8 has above depicted the configuration of the miniature pickup array bearing 250 that reversibly can match with miniature pickup array 290.But this type of configuration is intended to exemplary and non-exhaustive.Such as, the alternative embodiment of miniature pickup array bearing 250 can comprise the different mode with the electrical connection of the parts of mass transfer instrument 100 or mass transfer tool manipulator assembly 102.In addition, electrostatic transfer head 703 and/or miniature pickup array 290 can alternatively engage with miniature pickup array bearing 250 by different way.In addition, the design of compliance element in miniature pickup array bearing 250 can be changed within the scope of the present invention.Following Fig. 9-Figure 12 illustrates the embodiment of the some alternatives according to this type of variations.

See Fig. 9, it illustrates the perspective view of the miniature pickup array bearing having the displacement transducer integrated with compliance element according to an embodiment of the invention and be positioned at the electrostatic transfer head array on pivotable platform.Most of parts of the embodiment of the miniature pickup array bearing 250 shown in Fig. 9 are identical or similar with the parts shown in Fig. 5 A.But at least two essential distinctions are as described below.The first, the electrical connection between the parts on the front of miniature pickup array bearing 250 differently realizes.The second, electrostatic transfer head 703 array and miniature pickup array bearing 250 directly integrate, instead of utilize independent miniature pickup array 290.

In one embodiment, parts trace can end at voltage bumping pad on base portion 502 to form electrical connection.Such as, displacement transducer 518 and displacement transducer bumping pad 902 can interconnect by displacement transducer trace 554.Similarly, can interconnect with reference to straingauge bumping pad 904 with reference to straingauge 520 with reference to straingauge trace 556.In addition, the electrostatic transfer head 703 be formed on pivotable platform 504 can interconnect with base portion operating voltage bumping pad 906 by operating voltage trace 558.Bumping pad can be positioned at and pass base portion 502 to the access structure of rear side from the front side of miniature pickup array bearing 250.Bumping pad can use the technique be similar to for the formation of trace such as use sputtering technology and formed.

In one embodiment, electrostatic transfer head array is directly supported by pivotable platform 504.The structure of electrostatic transfer 703 array and formation can with above see the structure described by Fig. 7 with formed identical or similar.Such as, each electrostatic transfer 703 can comprise the mesa structure 704 with top surface 708, and this top surface is covered by dielectric layer 716 and support electrode 712 alternatively.But electrostatic transfer head array is positioned on the surface of pivotable platform 504, instead of miniature pickup array 290 on the surface.In addition, operating voltage trace 458 can replace contact conductor 714.

See Figure 10, it illustrates the perspective view of the miniature pickup array bearing according to an embodiment of the invention with the heating element be positioned on pivotable platform.In one embodiment, one or more contact element can be positioned on base portion 502 and to be electrically connected with the parts of miniature pickup array bearing 250.Some that can make in base portion 502 contact element are electrically connected with the parts on the front side being positioned at miniature pickup array bearing 250.Such as, displacement transducer contact element 1002 can be positioned at the terminal place of the displacement transducer path (Figure 11) be electrically connected with displacement transducer bumping pad 902.Similarly, the terminal place of the path (not shown) be electrically connected with reference to straingauge bumping pad 904 can be positioned at reference to straingauge contact element 1004.In addition, base portion operating voltage contact element 1006 can be positioned at the terminal place of the base portion operating voltage path (Figure 11) be electrically connected with base portion operating voltage bumping pad 906.Other contact element in base portion 502 contact element can be made to be electrically connected with the parts on the rear side being positioned at miniature pickup array bearing 250.Such as, heating contact element 1008 can be made to be electrically connected with heating element 602 by heating track 640.Similarly, temperature sensor contact element 1010 can be made to be electrically connected with temperature sensor 610 by temperature sensor trace 642.

See Figure 11, it illustrates that the cross-sectional side view of the miniature pickup array bearing be electrically connected with spring contact obtained relative to the hatching of Fig. 9 according to an embodiment of the invention illustrates.One or more contact element, such as displacement transducer contact element 1002 or base portion operating voltage contact element 1006, can holddown spring contact element 1106.Spring contact 1106 is also connected with the parts of mass transfer instrument 100 or mass transfer tool manipulator assembly 102 by electrical connector such as electrical lead and/or touch panel (not shown).Therefore, available various ways incoming call connects the parts be positioned on miniature pickup array bearing 250 and the parts be positioned on mass transfer instrument 100 or mass transfer tool manipulator assembly 102.

See Figure 12, it illustrates the perspective view diagram of the miniature pickup array bearing according to an embodiment of the invention with flexible region.Most of parts of the embodiment of the miniature pickup array bearing 250 shown in Figure 12 are identical or similar with the parts shown in Fig. 5 A.But at least two differences are as described below.The first, in one embodiment, the miniature pickup array bearing 250 shown in Figure 12 can permanently engage with miniature pickup array 290.The second, in one embodiment, the miniature pickup array bearing 250 shown in Figure 12 comprises the compliance element without crossbeam 506.

In one embodiment, miniature pickup array bearing 250 and miniature pickup array 290 can use one or more pad 1202 to engage to replace clamper electrode 540.Pad 1202 can be formed to contribute to being formed the permanent bonding with another structure by the multiple material comprising polymer, solder, metal and other adhesives.In one embodiment, pad 1202 can comprise gold, copper or aluminium to contribute to the thermocompression bonding with adjacent structure.But, thermocompression bonding represents the only a kind of mode for the formation of interstructural permanent bonding, and pad 1202 can comprise other materials, this material contributes to the bonding between another parts of forming miniature pickup array bearing 250 and having other bonding mechanisms or structure.Such as, Direct Bonding, bonding bonding, reactive bonding, welding etc. can be used at multiple bonding position place with various shape and size.

In order to facilitate the permanent bonding between miniature pickup array 290 and miniature pickup array bearing 250, the substrate clamper contact element 724 be positioned on miniature pickup array 290 can be formed by the metal material contributed to pad 1202 thermocompression bonding, such as, both pad 1202 and substrate clamper contact element 724 all can be formed by gold.Carrying out miniature pickup array bearing 250 and miniature pickup array 290 permanently before bonding, pivotable platform operations voltage contact element 530 and substrate-operations voltage contact element 722 can aim to engage with allowing these member being operable.After aligning parts, permanent thermocompression bonding can be formed permanently to be engaged with miniature pickup array 290 by miniature pickup array bearing 250.

In one embodiment, the compliance element of miniature pickup array bearing 250 comprises the single surface without crossbeam 506.More specifically, compliance element can between the pivotable platform 504 do not separated by passage 522 and base portion 502.Such as, compliance element can comprise the flexible region 1204 be illustrated by the broken lines be present between pivotable platform 504 and base portion 502.Flexible region 1204 can integratedly with pivotable platform 504 and base portion 502 be formed, but can have the rigidity being different from these parts.Alternatively, the difference in rigidity may be caused by different architectural features, is such as had the flexible region 1204 of thinner cross section or flexible form (such as when bellows) by formation.The reduction of flexible region 1204 rigidity can allow flexible region 1204 to bend and allow the relative movement between pivotable platform 504 and base portion 502.Therefore, one or more displacement transducer 518 can be integrated with the distortion sensing flexible region 1204 with flexible region 1204.In one embodiment, electrical lead can on the flexible region 1204 of miniature pickup array bearing 250 direct routing.In addition, operating voltage trace 558 directly can pass flexible region 1204, is different from the passage 522 shown in the embodiment walking around Fig. 5 A.

The some single parts of mass transfer tool manipulator assembly 102 are described, existing allomeric function and control attentiveness being turned to mass transfer tool manipulator assembly 102.See Figure 13, it illustrates and keeps miniature pickup array according to an embodiment of the invention and the end view of the mass transfer tool manipulator assembly interconnected with control system illustrates.The system illustrated can be used for performing comprising transfers to microdevice the method receiving substrate from carrier substrate.More specifically, this system can be used for electrostatic transfer head 703 array that ACTIVE CONTROL and miniature pickup array bearing 250 couple and at carrier substrate or receive on substrate between microdevice array spatial relationship.In addition, system can be used for controlling the electrostatic clamp power between electrostatic transfer head 703 array and microdevice array.In addition, system can be used for the heat that controls such as to be sent to electrostatic transfer head 703 array when electrostatic transfer head 703 array contact microdevice array.In addition, system can be used for control and makes the row maintenance of electrostatic transfer portion be close to miniature pickup array bearing 250.

In one embodiment, under the control of computer system 108, the motion activating the miniature pickup array 290 of impact is carried out on actuator 220.Such as, computer system 108 can directly be connected with actuator power source 1302 or be connected to provide control signal with actuator power source 1302 by middle controller, this control signal causes actuator power source 1302 to regulate the movement of one or more actuators 310 such as piezo-activator, so that the mobile distribution grid 240 coupled with miniature pickup array bearing 250.Miniature pickup array bearing 250 can keep miniature pickup array 290.This type of adjustment can based on the signal being delivered to actuator 220 from actuator power source 1302 by actuator leads 404.

In one embodiment, activation electrostatic transfer head array provides the electrostatic clamp to microdevice array.Such as, computer system 108 can directly be connected with operating voltage source 1304 or be connected to provide control signal with operating voltage source 1304 by middle controller, and this control signal causes operating voltage source 1304 that electrostatic potential is sent to electrostatic transfer head by operating voltage lead-in wire 1306.Operating voltage goes between 1306 accessible site before such as in flexible circuit 550 or rear flexible circuit 620, to send operating voltage as above.

In one embodiment, electrostatic transfer head array is heated by sending electric power to control to heating element 602.Such as, computer system 108 can directly be connected with heating voltage source 1308 or be connected to provide control signal with heating voltage source 1308 by middle controller, and this control signal causes heating voltage source 1308 that electric power is delivered to heating element 602 by heating voltage lead-in wire 1310.Heating voltage goes between 1310 accessible site before such as in flexible circuit 550 or rear flexible circuit 620, to transmit heating power as above.

In one embodiment, the miniature pickup array 290 with electrostatic transfer head array is close to miniature pickup array bearing 250 by sending electrostatic potential to keep to clamper electrode 540.Such as, computer system 108 can directly be connected with clamp voltage source 1312 or be connected to provide control signal with clamp voltage source 1312 by middle controller, and this control signal causes clamp voltage source 1312 that electrostatic potential is delivered to clamper electrode 540 by clamp voltage lead-in wire 1314.Clamp voltage goes between 1314 accessible site before such as in flexible circuit 550 or rear flexible circuit 620, to transmit clamp voltage as above.

The control of the movement of mass transfer tool manipulator assembly 102, electrostatic clamp and heating function can based on the feedback of sending from the transducer be associated with miniature pickup array bearing.Such as, temperature data is provided to computer system 108 by such as rear flexible circuit 620 from temperature sensor 610.Similarly, location dependent data can be delivered to computer system 108 from one or more displacement transducer 518 by such as front flexible circuit 550.

In one embodiment, the location dependent data from displacement transducer 518 can input to location sensing modules 316 and be changed by it before being sent to computer system 108.Such as, location sensing modules 316 or another parts can apply exciting voltage to one or more displacement transducer 518, such as straingauge, and can be monitored by location sensing modules 316 from the analog output voltage of displacement transducer 518.Analog output voltage from one or more displacement transducer can stand the modulus process of location sensing modules 316 then, and the digital signal of gained can be inputed to computer system 108 or be processed further by logical operation, to facilitate the control algolithm performed for the motion of Mass Control transfer tool manipulator assemblies 102.

See Figure 14, it illustrates according to an embodiment of the invention for the schematic diagram of the control loop of quality of regulation transfer tool manipulator assemblies.In one embodiment, control loop can be the target to realize being uniformly distributed pressure on miniature pickup array bearing 250 of closed loop.In other words, control loop adjustable mass transfer tool manipulator assembly 102 is to change to desired locations by the center of pressure on miniature pickup array bearing 250, and the pressure such as making to put on pivotable platform 504 is placed in the middle and be uniformly distributed pressure on one or more compliance components integers of pivotable platform 504.Therefore, set point 1402 can limit the one group reference signal corresponding with sensing each displacement transducer 518 of identical distortion in respective girders 506.Displacement measurement from each displacement transducer 518 can be used as the feed back input relevant to the current state of the pressure distribution on miniature pickup array bearing 250 to location sensing modules 316.Location sensing modules 316 can perform modulus signal process and calculate or transmit treated signal to computer system 108 for calculated example as error signal.Based on error signal, computer system 108 can use control algolithm to determine that suitable control signal activates to realize making pressure uniform be distributed on miniature pickup array bearing 250 to actuator 220.These control signals directly can be sent to actuator 220, or can such as modify to these control signals by utilizing amplifier 1404 to improve control signal power.In addition, control signal directly can be fed to actuator 220 or be used for the actuator power source 1302 of drive actuator assembly 220.The displacement measurement of monitoring from each displacement transducer 518 can be continued and to be fed in control algolithm to continue control actuator assembly 20 until output 1406 equals set point 1402, namely until pressure uniform is distributed on miniature pickup array bearing 250.Hereafter further describe this basic controlling loop model by relative to being used for the embodiment that service quality transfer tool manipulator assemblies 102 picked up and placed the method for microdevice array.

In the following description, when describing operational quality transfer tool manipulator assemblies according to an embodiment of the invention to shift the mode of microdevice array, reference is carried out to Figure 15-24.Should be understood that and the schematic diagram provided in Figure 16-Figure 19 and Figure 21-Figure 24 is reduced to two-dimensional representation.Such as, illustrate with two dimensions and describe compliance element such as schematically crossbeam 1606,1608 flexure and there is the actuating of mass transfer tool manipulator assembly 102 of a pair example actuator 1602,1604.However, it should be understood that flexure and the actuating of mass transfer tool manipulator assembly 102 are according to an embodiment of the invention not limited to this.Such as, as mentioned above, various actuator can be used to provide additional degree, and these degrees of freedom may not exclusively be represented by the two-dimensional representation of Figure 16-19 and Figure 21-24.More specifically, as shown in Figure 4 A, actuator 220 can comprise plural actuator, such as three actuators 310.In such cases, the axis that pivotable platform 504 can be made to be centered around the page extends is in third dimension upset or tilt, and it does not present in Figure 16-Figure 19 and Figure 21-Figure 24.

See Figure 15, it illustrates the flow chart illustrated according to an embodiment of the invention for the method from carrier substrate pickup microdevice.In order to schematically illustrate, the following description of Figure 15 is see the embodiment shown in Figure 16-Figure 19.In operation 1501, mass transfer tool manipulator assembly 102 moves towards carrier substrate.See Figure 16, it illustrates according to an embodiment of the invention towards the schematic diagram of the mass transfer tool manipulator assembly of carrier substrate 1601 movement.The movement of manipulator assemblies and more specifically, the movement of pivotable platform 504 is by activating the various actuators of quality transfer tool 100 or realizing to extend in length by activating the first schematic actuator 1602 and second schematic both actuators 1604.Although being schematically illustrated as by electrostatic transfer head 703 is arranged on pivotable platform 504, also electrostatic transfer head 703 can be arranged on and keeps being close on the miniature pickup array 290 of pivotable platform 504.As shown in the figure, pivotable platform 504 can not deflect relative to base portion 502, and therefore, the first schematic crossbeam 1606 and the second schematic crossbeam 1608 can not be shifted or not be out of shape.In the initial condition, can there is gap between electrostatic transfer head array 703 and the microdevice array 1610 on carrier substrate 1601, such as this snapshot can be before microdevice array 1610 contacts with electrostatic transfer head array 703.Here, the gap illustrated is exaggerated and is indicated pivotable platform 504 and carrier substrate 1601 can misalignment each other.

Refer again to Figure 15, in operation 1505, the microdevice array 1610 be positioned on carrier substrate 1601 can contact with the electrostatic transfer head array 703 of following the pivotable platform 504 of mass transfer tool manipulator assembly 102 couple.See Figure 17, it illustrates the schematic diagram of the electrostatic transfer head coupled with the mass transfer tool manipulator assembly of the microdevice array be contacted with on carrier substrate according to an embodiment of the invention.In one embodiment, due to pivotable platform 504 misalignment close to carrier substrate 1601, therefore, before microdevice 1610 contacts with the electrostatic transfer 703 closest to the second schematic crossbeam 1608, the electrostatic transfer 703 closest to the first schematic crossbeam 1606 can contact microdevice 1610.Therefore, the first schematic crossbeam 1606 may be out of shape, and the second schematic crossbeam 1608 may be indeformable.

Refer again to Figure 15, in operation 1510, the distortion of the compliance element coupled with pivotable platform 504 can be sensed.Refer again to Figure 17, in one embodiment, when the first schematic crossbeam 1606 is out of shape, displacement transducer 518 (see Fig. 5 A) generates the displacement signal be associated with the first schematic crossbeam 1606.Displacement signal can such as be monitored by location sensing modules 316 and/or be measured.Such as, displacement signal can be fed to back location sensing modules 316 to determine to occur the distortion of the first schematic crossbeam 1606 and to calculate the error signal that instruction exists uneven distribution on pivotable platform 504.

See Figure 18, it illustrates the schematic diagram of the mass transfer tool manipulator assembly of the position adjusting miniature pickup array bearing according to an embodiment of the invention.Sensing first schematically crossbeam 1606 distortion and according to measurement data error signal after, control signal can be delivered to actuator 220 from computer system 108, cause the second schematic actuator 1604 extend and keep the length of the first schematic actuator 1602 simultaneously.More specifically, can extend to adjust the spatial orientation of pivotable platform 504 until contiguous electrostatic transfer head 703 contacts microdevice 1610 to the second schematic actuator 1604, such as at pivotable platform 504 with carrier substrate 1601 on time.In addition, adjustment can based on the feedback signal continued from the displacement transducer be associated with the first schematic crossbeam 1606 and the second schematic crossbeam 1608.That is, adjustment can continue until the first measured schematic crossbeam 1606 and the distortion approximately equal of the second schematic crossbeam 1608.Now, the pressure distribution in shown plane on pivotable platform 504 can be uniformly.

Refer again to Figure 15, in operation 1515, the relative movement between mass transfer tool manipulator assembly 102 and carrier substrate 1601 stops.Refer again to Figure 17, once pressure uniform is distributed on pivotable platform 504, just can stop according to the actuating of control signal to actuator 220.Now, the output 1406 of control loop can equal set point 1402.That is, error signal can be zero or within the scope of predefine, this indicates the distortion approximately equal that each displacement transducer 518 senses.This deformation values is further limited to realize the desired pressure between electrostatic transfer head array 703 and microdevice array 1610 by control loop.Such as, enough pressure can be applied to guarantee stable contact and to avoid excess pressure to apply to cause damage to electrostatic transfer 703 and microdevice 1610 simultaneously.

Refer again to Figure 15, in operation 1520, voltage can be put on electrostatic transfer head array to produce clamp pressure on microdevice array.As shown in figure 18, when making electrostatic transfer head array 703 contact with microdevice array 1610, electrostatic potential is by various contact element and connector, and the operating voltage of such as mass transfer tool manipulator assembly 102 lead-in wire 1306, the operating voltage trace 558 of miniature pickup array bearing 250 and the operating voltage through hole 720 etc. of miniature pickup array 290 put on electrostatic transfer head 703.More specifically, based on the control signal from computer system 108, voltage can be transferred to electrostatic transfer head array 703 from operating voltage source 1304.Such as, control signal can based on control algolithm, and this control algolithm indicates: during pick process, if each displacement transducer 518 senses predefine distortion simultaneously, then electrostatic transfer head is activated.Therefore, electrostatic transfer head array applies clamp pressure to microdevice array 1610.

Refer again to Figure 15, in operation 1525, microdevice array 1610 can be picked up from carrier substrate 1601.See Figure 19, it illustrates according to an embodiment of the invention from the schematic diagram of the mass transfer tool manipulator assembly of carrier substrate pickup microdevice.First schematic actuator 1602 and the second schematic actuator 1604 can be controlled by computer system 108 with the pivotable platform 504 that bounces back from carrier substrate 1601.During bouncing back, in crossbeam release stored energy when recoiling to initial configuration, the first schematic crossbeam 1606 and the second schematic crossbeam 1608 can turn back to non-deformation state.Meanwhile, the displacement transducer be associated with crossbeam can will indicate the undeformed Signal transmissions of crossbeam to location sensing modules 316.But in this stage, control algolithm can indicate pivotable platform 504 to bounce back to remove microdevice array 1610 to be transferred to reception substrate further.This retraction is by activating actuator 220 or realizing by activating the various actuators of quality transfer tool 100 in another embodiment.In addition, in one embodiment, bounce back by deexcitation actuator 220 and allow the self-stiffness of the flex link 414 overturning-tilt-z deflection division 230 to make upset-inclination-z deflection division 230 return to initial condition to realize, this causes miniature pickup array bearing 250 to bounce back.During picking up, the electrostatic potential being supplied to electrostatic transfer head array is sustainable, and therefore microdevice array 1610 can to remain on electrostatic transfer head 703 and to remove from carrier substrate 1601.

During relative to the pick-up operation described in Figure 15, can the heating element 602 on miniature pickup array bearing 250 be heated.Such as, can to heating element 602 carry out resistance-type heating with by transfer of heat to miniature pickup array 290 and and the microdevice of electrostatic transfer head contact.Transfer of heat can occur before and after, during picking up microdevice array 1610 from carrier substrate 1601.

See Figure 20, it illustrates the flow chart illustrated according to an embodiment of the invention for microdevice being placed in the method received on substrate.In order to schematically illustrate, the following description of Figure 20 is see the embodiment shown in Figure 21-24.In operation 2001, mass transfer tool manipulator assembly 102 moves towards reception substrate.See Figure 21, it illustrates according to an embodiment of the invention towards the schematic diagram of the mass transfer tool manipulator assembly of reception substrate movement.The movement of manipulator assemblies and more specifically, the movement of pivotable platform 504 is by activating the various actuators of quality transfer tool 100 or realizing to extend in length by activating the first schematic actuator 1602 and second schematic both actuators 1604.As shown in the figure, pivotable platform 504 can not deflect relative to base portion 502, and therefore, the first schematic crossbeam 1606 and the second schematic crossbeam 1608 can not be shifted or not be out of shape.In the initial condition, may there is gap between the microdevice array 1610 clamped by electrostatic transfer head array 703 and reception substrate 2101, such as this snapshot can be before reception substrate 2101 contacts with microdevice array 1610.Here, the gap illustrated exaggerates that indicate pivotable platform 504 and receive substrate 2101 can misalignment each other.

Refer again to Figure 20, in operation 2005, receive substrate 2101 and contact with the microdevice array that the electrostatic transfer head array coupled with the pivotable platform between mass transfer tool manipulator carries.See Figure 22, it illustrates the schematic diagram of the microdevice carried by electrostatic transfer head according to an embodiment of the invention, this electrostatic transfer head be contacted with the mass transfer tool manipulator assembly receiving substrate and couple.In one embodiment, due to pivotable platform 504 misalignment close to receive substrate 2101, therefore, before reception substrate 2101 contacts the microdevice clamped by the electrostatic transfer head closest to the second schematic crossbeam 1608, the microdevice 1610 clamped by the electrostatic transfer head 703 closest to the first schematic crossbeam 1606 can contact and receive substrate 2101.Therefore, the first schematic crossbeam 1606 may be out of shape, and the second schematic crossbeam 1608 may be indeformable.

Refer again to Figure 20, in operation 2010, the distortion of the compliance element coupled with pivotable platform 504 can be sensed.Refer again to Figure 22, in one embodiment, when the first schematic crossbeam 1606 is out of shape, the displacement transducer 518 be associated with the first schematic crossbeam 1606 generates displacement signal.Displacement signal can such as be monitored by location sensing modules 316 and/or be measured.Such as, displacement signal can be fed to back location sensing modules 316 to determine to occur the distortion of the first schematic crossbeam 1606 and to calculate the error signal that instruction exists uneven distribution on pivotable platform 504.

See Figure 23, it illustrates the schematic diagram of the mass transfer tool manipulator assembly of the position adjusting miniature pickup array bearing according to an embodiment of the invention.Sensing first schematically crossbeam 1606 distortion and according to measurement data error signal after, control signal can be sent to actuator 220 from computer system 108, cause the second schematic actuator 1604 extend and keep the length of the first schematic actuator 1602 simultaneously.More specifically, can extend to adjust the spatial orientation of pivotable platform 504 until contiguous electrostatic transfer head 703 contacts microdevice 1610 to the second schematic actuator 1604, such as pivotable platform 504 with receive substrate 2101 on time.In addition, adjustment can based on the feedback signal continued from the displacement transducer be associated with the first schematic crossbeam 1606 and the second schematic crossbeam 1608.That is, adjustment can continue until the first measured schematic crossbeam 1606 and the distortion approximately equal of the second schematic crossbeam 1608.Now, the pressure distribution in shown plane on pivotable platform 504 can be uniformly.

Refer again to Figure 20, in operation 2015, the relative movement that can stop mass transfer tool manipulator assembly 102 and receive between substrate 2101.Refer again to Figure 23, once pressure uniform is distributed on pivotable platform 504, just can stop according to the actuating of control signal to actuator 220.Now, the output 1406 of control loop can equal set point 1402.That is, error signal can be zero or within the scope of predefine, and this indicates the distortion that each displacement transducer 518 senses and is similar to identical.This deformation values is further limited the desired pressure realizing microdevice array 1610 and receive between substrate 2101 by control loop.Such as, enough pressure can be applied to guarantee stable contact and to avoid excess pressure to apply to cause damage to microdevice simultaneously.

Refer again to Figure 20, in operation 2020, remove voltage from electrostatic transfer head array.As shown in figure 23, when making microdevice array 1610 contact with reception substrate 2101, electrostatic potential can remove from electrostatic transfer head array 703.More specifically, based on the control signal from computer system 108, the operating voltage being transferred to electrostatic transfer head array 703 from operating voltage source 1304 can be stopped.Such as, control signal can based on control algolithm, and this control algolithm indicates: during placement operation, if each displacement transducer 518 senses predefine distortion simultaneously, then electrostatic transfer head 703 is deactivated.Therefore, microdevice array 1610 is discharged from electrostatic transfer head array 703.

Refer again to Figure 20, in operation 2025, microdevice array 1610 can be discharged into and receive on substrate 2101.See Figure 24, it illustrates the schematic diagram according to an embodiment of the invention microdevice being discharged into the mass transfer tool manipulator assembly receiving substrate.First schematic actuator 1602 and the second schematic actuator 1604 can control with from reception substrate 2101 to the pivotable platform 504 that bounces back by computer system 108.During bouncing back, in crossbeam release stored energy when recoiling to initial configuration, the first schematic crossbeam 1606 and the second schematic crossbeam 1608 can turn back to non-deformation state.Meanwhile, the displacement transducer be associated with crossbeam can will indicate the undeformed Signal transmissions of crossbeam to location sensing modules 316.But in this stage, control algolithm can indicate pivotable platform 504 bounced back further to remove pivotable platform 504 and start another pick-up operation.This retraction is by activating actuator 220 or realizing by activating the various actuators of quality transfer tool 100 in another embodiment.In addition, in one embodiment, bounce back by inactive actuator 220 and allow the self-stiffness of the flex link 414 overturning-tilt-z deflection division 230 to make upset-inclination-z deflection division 230 return to initial condition to realize, this causes miniature pickup array bearing 250 to bounce back.

During relative to the placement operation described in Figure 20, heat can be put on microdevice array 1610.Such as, as mentioned above, can to heating element 602 carry out resistance-type heating with by miniature pickup array bearing 250 by transfer of heat to clamping microdevice 1610 electrostatic transfer head array in.Keep the temperature of the rising of miniature pickup array bearing 250 can avoid some problems caused by the variations in temperature of operating environment by this way.In whole placement operation, continuous heating can be carried out to microdevice 1610.But, more specifically, after the flexure sensing microdevice and/or after microdevice 1610 contacts with reception substrate 2101, microdevice 1610 can be heated.In one embodiment, each electrostatic transfer head 703 in pair array heats equably, such as, be heated to 50 degrees Celsius, 180 degrees Celsius, 200 degrees Celsius and even temperature up to 350 degrees Celsius.These temperature can cause microdevice 1610 and the melting received between substrate 2101 or diffusion to make microdevice be bonded to reception substrate.

See Figure 25, it illustrates the schematic diagram of the computer system that can use according to embodiments of the invention.A part for embodiments of the invention comprises non-transient state machine readable and the machine-executable instruction of the machine usable mediums being arranged in such as computer system 108 or controlled by these instructions.Computer system 108 is exemplary, and embodiments of the invention can operate in multiple different computer system or in multiple different computer system, or being controlled by multiple different computer system, the plurality of different computer system comprises general purpose networked computer system, embedded computer system, router, switch, server apparatus, client device, various intermediate equipment/node, freestanding computer system etc.In addition, although split some parts such as amplifier 1404 and location sensing modules 316 of control system to discuss respectively above, computer system 108 can direct these parts integrated or comprise the optional feature realizing similar functions.

The computer system 108 of Figure 25 comprises the address/data bus 2502 for transmitting information, and is coupled to bus 2502, central processing unit 2504 unit for the treatment of information and instruction.Computer system 108 also comprises data storage features portion, such as be coupled to the computer usable volatile memory 2506 such as random access memory (RAM) for the information and instruction that store central processing unit 2504 unit of bus 2502, be coupled to the computer usable non-volatile memory 2508 such as read-only memory (ROM) for the static information and instruction that store central processing unit 2504 unit of bus 2502, and be coupled to bus 2502 for storing the data storage device 2510 of information and instruction (such as, disk or CD and disc driver).The computer system 108 of the present embodiment also comprise be coupled to bus 2502, for transmitting the optional digital alphabet Mixed design equipment 2512 of information and command selection to central processing unit 2504 unit, this digital alphabet Mixed design equipment comprises digital alphabet and function key.Computer system 108 also comprises alternatively and is coupled to bus 2502, for transmitting the optional cursor control device 2514 of user's input information and command selection to central processing unit 2504 unit.The computer system 108 of the present embodiment also comprises and is coupled to bus 2502, for showing the optional display device 2516 of information.

Data storage device 2510 can comprise non-transient state machinable medium 2518, it stores one or more instruction set (such as, software 2520) of any one or the many persons embodied in methods described herein or operation.Software 2520 also can its by computer system 108 the term of execution fully or be at least in part positioned at volatile memory 2506, nonvolatile memory 2508 and/or processor 2504, volatile memory 2506, nonvolatile memory 2508 and processor 2504 also form non-transient state machinable medium.

As above used, parts be close to another parts or " couple " with another parts, " fastening ", " joint ", " maintenance " etc. can use that such as bolt is connected, nail joint, clamping, thermal bonding or bond the various known methods such as bonding and realize.The use of this type of term not intended to be limiting, and in fact, these class methods within the scope of the invention should be susceptible to and can be interchangeable in the embodiment of alternative.

In above specification, describe the present invention with reference to certain exemplary embodiments of the present invention.It is evident that, various amendment can be made when not departing from the essence widely of the present invention shown in following claim and scope to embodiment.Therefore, specification and accompanying drawing should be considered to the unrestricted object for purpose of illustration.

Claims

1. a mass transfer tool manipulator assembly, comprising:

Shell;

Upset-tilt-z deflection division, described upset-inclination-z deflection division comprises top deflection member, bottom deflection member and the flexible coupling described top deflection member be connected with described bottom deflection member, and wherein said top deflection member engages with described shell;

Actuator, described actuator and described bottom deflection member operationally couple, and the actuating of wherein said actuator makes described bottom deflection member move relative to described top deflection member; With

Miniature pickup array bearing, described miniature pickup array bearing has the pivotable platform and the displacement transducer integrated with described compliance element that couple with compliance element, and wherein said miniature pickup array bearing and described bottom deflection member couple.

2. mass transfer tool manipulator assembly according to claim 1, wherein said top deflection member and described bottom deflection member comprise flange separately.

3. mass transfer tool manipulator assembly according to claim 1, also comprises the distribution grid described actuator and described bottom deflection member coupled.

4. mass transfer tool manipulator assembly according to claim 1, also comprise laterally around the base portion of described pivotable platform, wherein said compliance element is between described pivotable platform and described base portion, and wherein said compliance element couples at interior pivot place and described pivotable platform and pivot place and described base portion couple outside.

5. mass transfer tool manipulator assembly according to claim 4, wherein said compliance element comprises crossbeam, and wherein said displacement transducer comprises straingauge, and wherein said straingauge is attached to described crossbeam.

6. mass transfer tool manipulator assembly according to claim 5, also comprises the reference straingauge adjacent with the described straingauge be positioned on described crossbeam, wherein said straingauge and the described adjacent brachium pontis provided with reference to straingauge in Hui Sitong half-bridge.

7. mass transfer tool manipulator assembly according to claim 3, also comprises the temperature sensor be positioned on described pivotable platform.

8. mass transfer tool manipulator assembly according to claim 7, also comprises the heating element be positioned at above described pivotable platform.

9. mass transfer tool manipulator assembly according to claim 4, also comprises the base portion operating voltage contact element be positioned on described base portion, and described base portion operating voltage contact element is electrically connected with the pivotable platform operations voltage contact element be positioned on described pivotable platform.

10. mass transfer tool manipulator assembly according to claim 4, also comprises the base portion clamper contact element be positioned on described base portion, and described base portion clamper contact element is electrically connected with the clamper electrode at the bonding position place be positioned on described pivotable platform.

11. mass transfer tool manipulator assemblies according to claim 4, also comprise the bonding position be positioned on described pivotable platform, and wherein said bonding position comprises and is selected from following metal: gold, copper and aluminium.

12. mass transfer tool manipulator assemblies according to claim 8, also comprise the displacement transducer contact element be electrically connected with institute displacement sensors be positioned on described base portion.

13. mass transfer tool manipulator assemblies according to claim 12, also comprise the location sensing modules be electrically connected with institute displacement sensors by institute's displacement sensors contact element.

14. mass transfer tool manipulator assemblies according to claim 13, wherein said displacement transducer contact element is electrically connected with described location sensing modules by flexible circuit.

15. mass transfer tool manipulator assemblies according to claim 13, wherein said displacement transducer contact element is electrically connected with described location sensing modules by spring contact.

16. mass transfer tool manipulator assemblies according to claim 13, also comprise the insulation board between described heating element and described location sensing modules, wherein said base portion and described insulation board couple, and described miniature pickup array bearing and described distribution grid couple by wherein said insulation board.

17. mass transfer tool manipulator assemblies according to claim 1, also comprise the miniature pickup array with the substrate supporting electrostatic transfer head, described miniature pickup array can engage with described pivotable platform.

18. 1 kinds of methods, comprising:

Towards carrier substrate moving mass transfer tool manipulator assemblies;

The microdevice array be positioned on described carrier substrate is contacted with electrostatic transfer head array, and the pivotable platform of described electrostatic transfer head array and described mass transfer tool manipulator assembly couples;

The distortion of the compliance element that sensing and described pivotable platform couple;

Stop the relative movement between described mass transfer tool manipulator assembly and described carrier substrate;

Voltage is applied to produce clamp pressure on described microdevice array to electrostatic transfer head array; And

Described microdevice array is picked up from described carrier substrate.

19. methods according to claim 18, wherein sensing distortion comprises the strain in the sensing displacement transducer integrated with described compliance element.

20. methods according to claim 18, after being also included in sensing distortion and before stopping relative movement, the position of the base portion that adjustment couples with described compliance element.

21. methods according to claim 18, wherein adjust described position to comprise and activating the actuator of described mass transfer tool manipulator assembly, described actuator is coupled to described base portion, with after sensing distortion by overturn or the described base portion that tilts makes the planar alignment of described base portion and described carrier substrate further.

22. methods according to claim 18, apply heat to described electrostatic transfer head array when being also included in the described microdevice array of pickup.

23. 1 kinds of methods, comprising:

Towards reception substrate motion quality transfer tool manipulator assemblies;

Make described reception substrate and the microdevice array contact carried by electrostatic transfer head array, the pivotable platform of described electrostatic transfer head array and described mass transfer tool manipulator assembly couples;

Stop the relative movement between described mass transfer tool manipulator assembly and described reception substrate;

Voltage is removed from described electrostatic transfer head array; And

Described microdevice array is discharged on described reception substrate.

24. methods according to claim 23, wherein sensing distortion comprises the strain in the sensing displacement transducer integrated with described compliance element.

25. methods according to claim 23, after being also included in sensing distortion and before stopping relative movement, the position of the base portion that adjustment couples with described compliance element.

26. methods according to claim 25, wherein adjust described position to comprise and activating the actuator of described mass transfer tool manipulator assembly, described actuator is coupled to described base portion, with after sensing distortion by overturn or the described base portion that tilts makes the planar alignment of described base portion and described reception substrate further.

27. methods according to claim 23, be also included in remove described voltage forward direction described in electrostatic transfer head array apply heat.

28. 1 kinds of miniature pickup array bearings, comprising:

Pivotable platform;

Base portion, described base portion is laterally around described pivotable platform;

Compliance element, described compliance element is between described pivotable platform and described base portion, and wherein said compliance element couples at interior pivot place and described pivotable platform and pivot place and described base portion couple outside; With

Displacement transducer, institute's displacement sensors and described compliance element integrated.

29. miniature pickup array bearings according to claim 28, wherein said outer pivot is positioned in base edge and described pivot is positioned on pivotable platform edges, and wherein said base edge is orthogonal to described pivotable platform edges.

30. miniature pickup array bearings according to claim 29, also comprise:

Second compliance element, described second compliance element is by being positioned at the second outer pivot in the second base edge and described base portion and coupling and by being positioned at the second pivot on the second pivotable platform edges and described pivotable platform couples; With

Second displacement sensor, described second displacement sensor and described second compliance element integrated.

31. miniature pickup array bearings according to claim 29, wherein said compliance element pivot place and described pivotable platform in second couple and couple at the second outer pivot place and described base portion.

32. miniature pickup array bearings according to claim 31, wherein said interior pivot from pivot in described second across described pivotable platform, and wherein said outer pivot from described second pivot across described pivotable platform.

33. miniature pickup array bearings according to claim 28, wherein said compliance element comprises crossbeam, wherein said displacement transducer comprises straingauge, and wherein said straingauge and described crossbeam are integrated in the Large strain region close to described interior pivot or described outer pivot.

34. miniature pickup array bearings according to claim 33, wherein said straingauge is bonded to described Large strain region.

35. miniature pickup array bearings according to claim 33, wherein said straingauge is deposited on described Large strain region.

36. miniature pickup array bearings according to claim 33, wherein said Large strain region is doped to form described straingauge.

37. miniature pickup array bearings according to claim 33, also comprise the reference straingauge adjacent with the described straingauge be positioned on described crossbeam, wherein said straingauge and the described adjacent brachium pontis provided with reference to straingauge in Hui Sitong half-bridge.

38. miniature pickup array bearings according to claim 28, also comprise the temperature sensor be positioned on described pivotable platform.

39. miniature pickup array bearings according to claim 28, also comprise the heating contact element be positioned on described base portion, described heating contact element is electrically connected with the heating element be positioned at above described pivotable platform.

40. according to miniature pickup array bearing according to claim 39, and wherein said heating element comprises electric resistance alloy.

41. according to miniature pickup array bearing according to claim 39, and wherein said heating element comprises surface mounting technology resistor.

42. miniature pickup array bearings according to claim 28, also comprise the displacement transducer contact element be electrically connected with institute displacement sensors be positioned on described base portion.

43. miniature pickup array bearings according to claim 28, also comprise the base portion operating voltage contact element be positioned on described base portion, and described base portion operating voltage contact element is electrically connected with the pivotable platform operations voltage contact element be positioned on described pivotable platform.

44. miniature pickup array bearings according to claim 28, also comprise the base portion clamper contact element be positioned on described base portion, described base portion clamper contact element is electrically connected with the clamper electrode at the bonding position place be positioned on described pivotable platform.

45. miniature pickup array bearings according to claim 28, also comprise the bonding position be positioned on described pivotable platform, and wherein said bonding position comprises and is selected from following metal: gold, copper and aluminium.