CN114709011B - Insulated wire - Google Patents
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- CN114709011B CN114709011B CN202210435023.XA CN202210435023A CN114709011B CN 114709011 B CN114709011 B CN 114709011B CN 202210435023 A CN202210435023 A CN 202210435023A CN 114709011 B CN114709011 B CN 114709011B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
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Abstract
The invention discloses an insulated wire. The insulated wire includes a conductor and a layered insulating film laminated on an outer peripheral surface of the conductor, the layered insulating film having an air hole layer and a skin layer layered in the film, arranged alternately and substantially parallel to each other.
Description
Technical Field
The invention belongs to the field of motors, and particularly relates to an insulated wire.
Background
In order to ensure film toughness and insulation (dielectric breakdown voltage) of a conventional insulated wire, an insulating film containing pores, an insulating film containing no pores, an insulating film containing pores, and an insulating film … … containing no pores are sequentially coated on a conductor. However, this has the following problems: (1) coating very thin, pore-free insulating films is very difficult in the manufacturing process. The insulated wire is coated with an insulating film using a jig called a die. The mold has a gap of several tens micrometers with respect to the incoming line diameter, so that the varnish is smoothed out to be coated with a certain thickness, and then an insulating film is formed by baking. Coating the film means that this gap is narrowed. If the gap is too narrow, it is very difficult if the wire diameter is slightly thickened or the wire angle is deviated, the wire is easily caught by the mold to damage the lower layer, or in the worst case, breakage occurs. (2) The inter-film staggering causes the insulating film containing air holes and the insulating film containing no air holes to be separated significantly, and the bonding between the films is very weak, which leads to peeling of the film due to weak adhesion between layers and further causes performance degradation of the insulated wire in the motor processing environment.
Disclosure of Invention
In view of the above, the present invention provides an insulated wire. The insulated wire includes a conductor and a layered insulating film laminated on an outer peripheral surface of the conductor, the layered insulating film having an air hole layer and a skin layer layered in the film, arranged alternately and substantially parallel to each other.
Preferably, the pore size of the pore layer is 0.1 to 10 μm.
Preferably, the insulated wire further includes a first dense insulating film provided between the conductor and the layered insulating film; more preferably, the insulated wire further includes a second dense insulating film located on an outer surface of the layered insulating film in a direction away from the first dense insulating film.
Preferably, the average thickness of the layered insulating film is 50 to 300 μm.
Preferably, the thickness ratio of the air hole layer and the skin layer of the layered insulating film is 300: 1-2: 1.
preferably, the porosity of the insulated wire is 10 to 60%. The porosity refers to the volume porosity.
Preferably, the insulating varnish forming the layered insulating film includes a base varnish and an ester compound represented by formula I as a phase separating agent;
wherein R is 1 And R is 2 Selected from CmHn, m is selected from any natural number from 1 to 9, and n is selected from any natural number from 3 to 19; r is R 3 Selected from H, R 1 OCO、R 2 One of the OCOs; r is R 1 And R is 2 May be the same or different.
Preferably, n=2m+1 or n=2m_1.
Preferably, the ester compound accounts for 1 to 50wt% of the base varnish.
Preferably, the dielectric breakdown voltage per film thickness of the insulated wire is 200V/μm or more.
Drawings
Fig. 1 is a schematic view of an exemplary structure of an insulated wire of the present invention.
Fig. 2 is a topography of a layered insulating film of an insulated wire of the present invention.
Fig. 3 is an SEM image of a layered insulating film of an insulated wire of the present invention.
Fig. 4 is another SEM image of the layered insulating film of the insulated wire of the present invention.
Fig. 5 is a topography showing the absence of interfaces between the air hole layer and the skin layer of the layered insulating film of the insulated wire of the present invention.
Fig. 6 is a topography of the insulated wire of comparative example 7.
Detailed Description
The invention is further illustrated by the following embodiments, which are to be understood as merely illustrative of the invention and not limiting thereof. Unless otherwise specified, each percentage refers to a mass percent.
The insulated wire shown in the present disclosure includes a conductor and a layered insulating film laminated on an outer peripheral surface of the conductor, the layered insulating film having an air hole layer and a skin layer layered in the film, arranged alternately and substantially parallel to each other. The skin layer (skin layer) is characterized by being free of pores and having a (substantially) parallel character to the pore layer. And the skin layer and the air hole layer have no obvious interface, namely, an uninterrupted integrated insulating film structure is formed. The air hole layer has honeycomb-shaped hole appearance characteristics. In some embodiments, the pore layer has a pore size of 0.1 to 10 μm. The thickness of the air hole layer is obviously higher than that of the skin layer. As an example, the thickness ratio of the air hole layer and the skin layer of the layered insulating film is 300: 1-2: 1.
unlike conventional inter-film staggered coating, which results in a significant separation between an insulating film containing pores and an insulating film containing no pores, the present invention integrates a pore layer and a skin layer inside the same insulating film without an interface therebetween. From the SEM of fig. 5 it can be seen that the air pore layer and the skin layer are integrated where no interface exists. Therefore, under the use environment of the insulated wire, the electric current can be prevented from flowing without stopping, so that a high dielectric breakdown voltage is obtained, and the skin layer can play a role of reinforcing the air hole layer, so that the flexibility is greatly improved.
The insulated wire shown in the present disclosure forms the above-described special intra-film layered structure by using a phase separating agent. In some embodiments, the polyimide on the surface of the film is imidized and fixed before the phase separation of the ester compound added as the phase separating agent occurs. After the skin layer is formed without phase separation on the surface, pores are formed by phase separation inside the film, whereby a film having such a structure can be produced.
The insulating varnish used for the layered insulating film comprises a base varnish and a phase separating agentEster compounds of formula I. R is R 1 And R is 2 Selected from CmHn, m is selected from any natural number from 1 to 9, and n is selected from any natural number from 3 to 19; r is R 3 Selected from H, R 1 OCO、R 2 One of the OCOs; r is R 1 And R is 2 May be the same or different.
In some examples, R 1 And R is 2 Selected from saturated hydrocarbons (alkanes), R 3 Selected from H. The ester compound having an alkane functional end group which is easy to use can be freely selected according to the baking conditions. For example, R 1 And R is 2 One selected from methyl, ethyl, butyl, allyl, isobutyl, n-hexyl, 2-ethylhexyl, n-octyl, isononyl, nonyl, isodecyl and butylbenzyl. In some embodiments, R 1 And R is 2 Is methyl, R 3 H.
At this time, the ester compound may use at least one of dimethyl phthalate (DMP, dimethyl phthalate), diethyl phthalate (DEP, diethyl phthalate), dibutyl phthalate (DBP, dibutyl phthalate), diisononyl phthalate (DINP, diisononyl Phthalate), and dioctyl phthalate (DOP, di-n-octylphthalate).
In some examples, R 1 And R is 2 Selected from unsaturated hydrocarbons, R 3 Selected from H. The unsaturated hydrocarbon may be a linear olefin or a cycloalkane. As an example, the ester compound may use at least one of dicyclohexyl phthalate (DCHP, dicyclohexyl Phthalate), diallyl phthalate (DAP, diallyl Phthalate).
In some examples, R 1 And R is 2 Selected from CmHn, m is selected from any natural number from 1 to 9, and n is selected from any natural number from 3 to 19; r is R 3 Selected from R 1 OCO、R 2 One of the OCOs. Preferably, R 1 And R is 2 The same applies. As an example, the ester compound may use tri-n-butyl trimellitate (TBT, tr)ibutyl TriMellitate), trioctyl trimellitate (TOTM, trioctyl trimellitate).
The prior art mentions the use of polypropylene glycol as a phase separating agent, which has a completely different chemical structure than the phase separating agent used in the present invention. The polypropylene glycol tends to increase the pore diameter of the insulating film and lower the dielectric breakdown voltage. The reason is that: the polypropylene glycol has a hydroxyl group at the end, and the hydroxyl group has high molecular compatibility with an insulating resin such as polyimide, and thus has low phase separation ability. As a result, the following disadvantages exist: a dense phase separation structure cannot be produced, and as a result, the pore diameter becomes large, for example, the average pore diameter of bubbles is 4 to 5 μm or more. In addition, the following complex operations are required to be introduced for hole making: the solvent of the polyetherimide to which the polypropylene glycol is added is dried, and then carbon dioxide is injected under pressure to extract the polypropylene glycol. This is presumably because polypropylene glycol cannot be removed by thermal decomposition by heating. The use of the ester compound of the present invention can realize low-temperature pyrolysis, and is advantageous in that it can be easily made porous. Therefore, the invention optimizes the type of phase separating agent, pore diameter and process complexity based on the prior art.
The phase separating agent with different carbon atoms and the structure has no great influence on the porosity of the insulating film prepared by the insulating varnish. However, when the number of carbon atoms is increased, for example, to 10 or more, the thermal decomposition temperature and boiling point of the ester compound become high, and the time for which the ester compound remains in the insulating resin becomes long, resulting in an increase in the pore size and a corresponding decrease in the dielectric breakdown voltage.
In the insulating varnish, when the concentration of the insulating resin increases due to the initial volatilization of the solvent by heat under a heating environment, the resin and the ester compound undergo phase separation, and the micronized ester compound is dispersed in the resin. Thereafter, the resin is cured to fix the fine ester compound, and then the fine ester compound is thermally decomposed to be discharged outside the resin, thereby forming bubbles.
The ester compound accounts for 1 to 50wt% of the base varnish. If the content of the ester compound is too small, the porosity of the insulating film formed by the insulating varnish is reduced, and the effect of lowering the dielectric constant cannot be obtained. In contrast, if the content of the ester compound is too large, it is difficult to mix well with the insulating resin, the insulating varnish itself becomes cloudy to lose fluidity, or the produced film (film) becomes fragile easily. Preferably, the ester compound accounts for 5 to 20wt% of the base varnish.
Thermoplastic resins (super engineering plastics) which are highly resistant to heat are generally poorly soluble in solvents to form base varnishes. If it is not a resin material which is easily dissolved in a solvent, it cannot be well mixed with the above ester compound, and good compatibility is achieved. In view of this, the insulating resin in the base varnish is preferably a thermosetting resin. The kind of the thermosetting resin is not limited, and a thermosetting resin commonly used in the art may be used. In some embodiments, the thermosetting resin includes, but is not limited to, at least one of a polyester imide, a polyamide imide, a polyimide, a polybenzoxazole, and a polybenzimidazole. Polyamide imide (PAI) or Polyimide (PI) may be used in the examples.
Taking a polyimide substrate varnish as an example, the polyimide substrate varnish includes a polyimide precursor and a solvent. The solvent is not particularly limited, and may be an organic solvent, and may be at least one selected from the group consisting of N, N-dimethylacetamide, N-dimethylformamide, N-methylpyrrolidone, and xylene, for example.
Polyimide precursors include any polyimide precursor material derived from diamine and dianhydride monomers and capable of being converted to a polyimide, such as polyamic acids and the like.
The diamine is preferably an aromatic diamine and, examples thereof include phenylenediamine (PPD), diaminodiphenyl ether (ODA), 4' -diamino-2, 2' -dimethylbiphenyl, 4' -diamino-3, 3' -dimethylbiphenyl, bis (4-aminophenyl) sulfide, 3' -diaminodiphenyl sulfone, 1, 4-bis (4-aminophenoxy) benzene, 1, 3-bis (3-aminophenoxy) benzene, and 2, 2-bis [4- (4-aminophenoxy) ] phenyl ] hexafluoropropane, 2-bis (4-aminophenyl) hexafluoropropane, 9-bis (4-aminophenyl) fluorene, 2-bis [4- (4-aminophenoxy) phenyl ] propane, 4' -bis (4-aminophenoxy) biphenyl, 1, 3-bis (4-aminophenoxy) benzene, 2' -bis (trifluoromethyl) benzidine, and the like. These diamines may be used singly or in combination of two or more.
The dianhydride is preferably an aromatic dianhydride, and examples thereof include pyromellitic dianhydride (PMDA), biphenyl tetracarboxylic dianhydride (BPDA), 3', 4' -benzophenone tetracarboxylic dianhydride, bicyclo [2.2.2] oct-7-ene-2, 3,5, 6-tetracarboxylic dianhydride, 1,2,3, 4-cyclopentane tetracarboxylic dianhydride, 1,2,3, 4-cyclobutane tetracarboxylic dianhydride, 1,2,4, 5-cyclohexane tetracarboxylic dianhydride, 3',4,4' -diphenylsulfone tetracarboxylic dianhydride, 4'- (hexafluoroisopropylidene) diphthalic anhydride, 4' - (4, 4 '-isopropylidene diphenoxy) diphthalic anhydride, 4' -oxydiphthalic anhydride, bis (1, 3-dioxo-1, 3-dihydroisobenzofuran) 5-carboxylic acid) -1, 4-phenylene ester, and the like. These dianhydrides may be used singly or in combination of two or more.
In preparing the insulating varnish, the phase separating agent may be uniformly dispersed in the base varnish. The method of uniformly mixing the base varnish with the phase separating agent may be a general stirring method, for example, mechanical stirring. The stirring temperature and stirring time can be selected according to actual requirements. For example, the stirring temperature may be 20 to 40℃and the stirring time may be 1 to 2 hours. In some technical schemes, inorganic fillers such as silicon dioxide can be added into the insulating varnish to enhance the surge resistance.
The conventional electric insulating resin sheet for a motor uses a separating agent such as polyethylene glycol or polypropylene glycol, and a porous resin layer is produced by the following steps: a step of applying a thermoplastic resin composition comprising a thermoplastic resin and a phase separating agent that phase separates from a curing agent of the thermoplastic resin onto a substrate, and drying or curing the composition to produce a thermoplastic resin sheet having a microphase-separated structure; and a step of removing the phase separating agent from the thermoplastic resin sheet. The phase separating agent is usually removed by solvent extraction or the like. For example, one of liquid carbon dioxide, subcritical carbon dioxide or supercritical carbon dioxide is used. The present invention can be thermally decomposed at a low temperature by selecting a phase separating agent having an appropriate structure, for example, phthalate, and therefore, the present invention can be easily made porous by heating alone without the "troublesome operation of injecting carbon dioxide under pressure to extract the phase separating agent". The invention can obtain the insulated wire with low dielectric constant (permittivity), high insulation breakdown voltage and excellent toughness by a very simple method of adding a phase separating agent to varnish and then sintering.
As a preferable embodiment, the insulated wire may further include a first dense insulating film provided between the conductor and the layered insulating film. The first dense insulating film is preferably a void-free layer containing no voids. As a more preferable embodiment, the insulated wire further includes a second dense insulating film provided on an outer surface of the layered insulating film in a direction away from the first dense insulating film. The second dense insulating film is preferably a surge-resistant layer. The varnish used to prepare the surge layer may be a surge resistant varnish commonly used in the art.
In the production of the electric wire, varnish is coated on the surface of the conductor by using a mold functioning as a jig, and then baked in a baking oven. When the multilayer insulating film is required to be prepared, the operation of coating the insulating varnish is repeated for a plurality of times.
The insulated wire of the embodiment of the present invention may be wound into a coil. For example, it may be wound on the outside of a core (e.g., a core made of a magnetic material) to form a coil. The coil can be used to manufacture electric motors, such as electric motors for EVs, HEVs, and the like.
The present invention will be further illustrated by the following examples. It is also to be understood that the following examples are given solely for the purpose of illustration and are not to be construed as limitations upon the scope of the invention, since numerous insubstantial modifications and variations will now occur to those skilled in the art in light of the foregoing disclosure. The specific process parameters and the like described below are also merely examples of suitable ranges, i.e., one skilled in the art can make a suitable selection from the description herein and are not intended to be limited to the specific values described below.
Ulmide-D28 is polyimide varnish prepared by well-holding industry, has a weight average molecular weight of 36000 and a solid content of 26-28 wt%. SSX-101, SSX-102 and SSX-103 are water-logging chemically prepared PMMA particles, differing only in the particle size of the PMMA particles, which affects the pore diameter formed by the PMMA particles. The varnish SURGETECT-D25 is a surge-resistant polyimide varnish manufactured by well industry, has a weight average molecular weight of 36000 and a solid content of 24 to 26 weight percent, and contains 20phr of silicon dioxide.
Preparation of insulating varnish for layered insulating films of examples 1 to 12. Various phase separating agents were added to Ulmide-D28, and after stirring for 1 hour, NMP was added thereto and stirred for 1 hour to prepare an insulating varnish. The composition of the insulating varnish is shown in table 1.
TABLE 1
| Examples 1 and 7 | Examples 2 and 8 | Examples 3 and 9 | Examples 4 and 10 | Examples 5 and 11 | Examples 6 and 12 | |
| Base varnish | Ulmide D28 | Ulmide D28 | Ulmide D28 | Ulmide D28 | Ulmide D28 | Ulmide D28 |
| Parts by weight of | 100 | 100 | 100 | 100 | 100 | 100 |
| Phase separating agent | DBP | DBP | DINP | DINP | DOP | DOP |
| Parts by weight of | 5 | 20 | 5 | 20 | 5 | 20 |
| Solvent(s) | NMP | NMP | NMP | NMP | NMP | NMP |
| Parts by weight of | 12.9 | 51.4 | 12.9 | 51.4 | 12.9 | 51.4 |
The structure of the phase separating agent used in examples 1 to 12 is shown in Table 2.
TABLE 2
Preparation of the comparative varnishes of comparative examples 1 to 12. Various phase separating agents were added to Ulmide-D28, and after stirring for 1 hour, NMP was added and stirred for 1 hour to prepare a comparative varnish. The composition of the comparative varnishes is shown in Table 3.
TABLE 3 Table 3
| Comparative examples 1 and 7 | Comparative examples 2 and 8 | Comparative examples 3 and 9 | Comparative examples 4 and 10 | Comparative examples 5 and 11 | Comparative examples 6 and 12 | |
| Base varnish | Ulmide D28 | Ulmide D28 | Ulmide D28 | Ulmide D28 | Ulmide D28 | Ulmide D28 |
| Parts by weight of | 100 | 100 | 100 | 100 | 100 | 100 |
| Phase separating agent | SSX-101 | SSX-101 | SSX-102 | SSX-102 | SSX-103 | SSX-103 |
| Parts by weight of | 2.8 | 11.2 | 2.8 | 11.2 | 2.8 | 11.2 |
| Solvent(s) | NMP | NMP | NMP | NMP | NMP | NMP |
| Parts by weight of | 7.2 | 28.8 | 7.2 | 28.8 | 7.2 | 28.8 |
Insulated wires of comparative examples 1 to 12 were prepared. Specifically, copper was cast, drawn, and softened to obtain a conductor having a circular cross section and an average diameter of 1 mm. And coating varnish Ulmide-D28 on the outer peripheral surface of the conductor, continuously coating contrast varnish on the outer surface coated with varnish Ulmide-D28 after the conductor is to be shaped, continuously coating varnish SURGETECT-D25 on the outer surface according to requirements after the contrast varnish is shaped, and baking under the condition that the inlet temperature of a heating furnace is 350 ℃ and the outlet temperature of the heating furnace is 450 ℃ to obtain the insulated wire.
Insulated wires of examples 1-12 were prepared. Specifically, copper was cast, drawn, and softened to obtain a conductor having a circular cross section and an average diameter of 1 mm. And coating varnish Ulmide-D28 on the outer peripheral surface of the conductor, continuously coating insulating varnish for the layered insulating film on the outer surface coated with the varnish Ulmide-D28 after the conductor is to be shaped, continuously coating varnish SURGETECT-D25 on the outer surface according to requirements after the insulating varnish for the layered insulating film is shaped, and baking under the condition that the inlet temperature of a heating furnace is 350 ℃ and the outlet temperature of the heating furnace is 450 ℃ to obtain the insulated wire.
The performance parameters of comparative examples 1-6 are shown in Table 4.
TABLE 4 Table 4
The performance parameters of comparative examples 7-12 are shown in Table 5.
TABLE 5
The performance parameters for examples 1-6 are shown in Table 6.
TABLE 6
The performance parameters for examples 7-12 are shown in Table 7.
TABLE 7
Average pore size of bubbles: SEM of the membrane cross section was observed, and representative 10 pore diameters were measured and averaged.
Porosity the density (specific gravity, ρf) of the insulated wire and the density (specific gravity, ρs) of the wire before the hole making were measured by the in-water substitution method according to archimedes' principle, and the porosity was calculated from ρf/ρs. Porosity (%) = [1- (ρf/ρs) ]. Times.100.
The insulation breakdown voltage (GBDV) was tested according to IS C3216-5.4. The dielectric breakdown voltage in glycerol was measured.
Insulation breakdown voltage per film thickness (BDV) =insulation breakdown voltage (GBDV) divided by the full film thickness of the insulated wire. The dielectric breakdown voltage per film thickness is 200V/μm or more, and is considered to be satisfactory.
The PDIV test was carried out using a DAC-6021 tester manufactured by Zodiac Co. The test conditions were: the discharge charge amount is 100pq, the discharge frequency is 50pps, and discharge exceeding it is regarded as discharge when the discharge lasts for 5 seconds or more. PDIV above 1800Vp is considered to be satisfactory.
The V-t test was performed using a sine wave generator (CHANGZHOU WELLYUE ELECTRICAL., LTD.) from Weiersi electric Co., ltd. The test conditions were a temperature of 25 ℃, a frequency of 100kHz, a voltage of 2200Vp, and a voltage type of sine wave. The time when no damage occurs at Vt 2200Vp_25deg.C is more than 100hrs, which is considered to be satisfactory.
The flexibility was an index indicating the toughness of the coating film, and the flexibility test was evaluated based on JIS C3216-3 2011.5.1.1. A wire having a length of 400mm or more was cut from a bobbin (bobbin) and stretched by 10%. A center portion of the cut wire 400mm was edgewise bent at an angle of 180℃with R2.0 mm. The 20% elongation R2 was good when bent without breaking, and on the contrary, was bad when bent.
In comparative examples 1 to 6, the PDIV of the insulated wire was as high as 1800Vp or more, and the requirement as the partial discharge start voltage was satisfied, but the insulation breakdown voltage per unit film thickness was low and did not satisfy the requirement. In addition, the Vt test is short-circuited in a very short time due to the absence of the surge-resistant layer, and has very poor flexibility and is not resistant to processing. In comparative examples 7 to 12, the insulated wire had a PDIV of 1800Vp or more, and thus had a surge-resistant layer, and a long Vt life. However, the dielectric breakdown voltage per film thickness is low and the flexibility is poor, so that the requirements are not satisfied. Fig. 6 is a topography of the insulated wire of comparative example 7. The figure shows an electric wire which is fired by adding a thermally decomposable resin (for example, PMMA particles) to an insulating varnish. The wire manufactured in this way cannot be provided with a skin layer.
In examples 1 to 6, since no surge-resistant layer was provided, the Vt life was not satisfied, but PDIV, BDV per unit film thickness, and flexibility were all satisfied. On the other hand, in examples 7 and 2, all requirements of Vt life, PDIV, BDV per unit film thickness and flexibility were satisfied. Among these, comparative examples 2 and 8 and examples 4 and 10 have substantially the same pore diameter, but have significantly different BDV per film thickness and flexibility. This is because the layered insulating film of the embodiment has an air hole layer and a skin layer layered in the film, arranged alternately and substantially parallel to each other. The air hole layer causes discharge in the air holes when a voltage is applied, so that a short circuit occurs. The present invention can prevent electric current from flowing without stopping by disposing the air hole layer and the skin layer in the same insulating film, thereby obtaining higher dielectric breakdown voltage. In addition, the air hole layer causes the toughness of the coating to be reduced, while the air hole layer and the skin layer are arranged in the same coating, the layers are approximately parallel and closely adhered to each other, and the skin layer fully plays a role of enhancing the air hole layer so as to greatly improve the flexibility.
Claims (11)
1. The insulated wire is characterized by comprising a conductor and a layered insulating film laminated on the outer peripheral surface of the conductor, wherein the layered insulating film is provided with air hole layers and skin layers which are layered in the film, are mutually staggered and laminated and are approximately parallel to each other, and the skin layers and the air hole layers have no obvious interface to form an uninterrupted integrated insulating film structure.
2. The insulated wire of claim 1, wherein the pore layer has a pore size of 0.1 to 10 μm.
3. The insulated wire of claim 2, further comprising a first dense insulating film disposed between the conductor and the layered insulating film.
4. The insulated wire of claim 3, further comprising a second dense insulating film disposed on an outer surface of the layered insulating film in a direction away from the first dense insulating film.
5. The insulated wire according to claim 1, wherein the layered insulating film has an average thickness of 50 to 300 μm.
6. The insulated wire according to claim 1, wherein a thickness ratio of the air hole layer and the skin layer of the layered insulating film is 300: 1-2: 1.
7. the insulated wire of claim 1, wherein the insulated wire has a porosity of 10 to 60%.
8. The insulated wire according to claim 1, wherein the insulating varnish forming the layered insulating film comprises a base varnish and an ester compound of formula I as a phase separating agent;
wherein R is 1 And R is 2 Selected from CmHn, m is selected from any natural number from 1 to 9, and n is selected from any natural number from 3 to 19; r is R 3 Selected from H, R 1 OCO、R 2 One of the OCOs; r is R 1 And R is 2 May be the same or different.
9. The insulated wire of claim 8, wherein n = 2m+1 or n = 2m "1.
10. The insulated wire according to claim 8, wherein the ester compound is 1 to 50wt% of the base varnish.
11. The insulated wire according to claim 1, wherein the dielectric breakdown voltage per unit film thickness of the insulated wire is 200V/μm or more.
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| PCT/CN2022/100652 WO2023206761A1 (en) | 2022-04-24 | 2022-06-23 | Insulated wire |
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| JP2016110847A (en) * | 2014-12-05 | 2016-06-20 | 住友電気工業株式会社 | Insulated electric wire and method for producing insulated electric wire |
| JP2017016840A (en) * | 2015-06-30 | 2017-01-19 | 住友電気工業株式会社 | Insulation wire and wound wire bundle |
| CN107112084B (en) * | 2015-10-28 | 2019-11-15 | 住友电气工业株式会社 | Insulated electric conductor and the varnish for being used to form insulating layer |
| JP7214628B2 (en) * | 2017-04-28 | 2023-01-30 | 住友電気工業株式会社 | insulated wire |
| US20200135360A1 (en) * | 2017-06-16 | 2020-04-30 | Sumitomo Electric Industries, Ltd. | Insulated electric wire |
| CN110256717A (en) * | 2019-07-03 | 2019-09-20 | 西安交通大学 | A kind of porous polyimide film and its preparation method and application |
-
2022
- 2022-04-24 CN CN202210435023.XA patent/CN114709011B/en active Active
- 2022-06-23 WO PCT/CN2022/100652 patent/WO2023206761A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023206761A1 (en) | 2023-11-02 |
| CN114709011A (en) | 2022-07-05 |
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