CN114697472A

CN114697472A - Camera module and electronic equipment with camera module

Info

Publication number: CN114697472A
Application number: CN202011562239.XA
Authority: CN
Inventors: 袁栋立; 魏罕钢; 刘佳; 卞强龙; 李剑虹; 吴湖
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2022-07-01

Abstract

The invention provides a camera module and electronic equipment with the camera module, wherein the camera module comprises a lens, a photosensitive assembly, a driving device and a fixing device. The camera lens along an optical axis direction set up in photosensitive assembly's top, wherein drive arrangement with the camera lens is connected with transmitting mutually, by the drive arrangement drive the camera lens is followed the optical axis direction removes, wherein fixing device has one and holds the chamber, the camera lens photosensitive assembly and drive arrangement is arranged in fixing device hold the chamber, for the top of the module of making a video recording is located the apron is inboard, wherein the module of making a video recording has a operating condition and a shrink state.

Description

Camera module and electronic equipment with camera module

Technical Field

The invention relates to the field of imaging, in particular to a camera module and electronic equipment with the camera module.

Background

With the rapid development of mobile smart devices, mobile smart devices such as mobile phones, ipads or smart watches are becoming daily necessities for almost everyone to carry at any time. The lightness, thinness and miniaturization of electronic equipment become an important index for people to choose to purchase and use the electronic equipment conveniently in daily life. Particularly, with the high-end requirements of people on the shooting function of the mobile phone, such as the double-shooting module of the mobile phone, the pixel size or the iris diaphragm, people tend to select or use the mobile phone with better and thinner shooting function, so as to meet the requirements of convenience, clearness, rich functions and the like of daily shooting.

In the mobile terminal device of the prior art, the height of the camera module is higher and higher in order to pursue high-quality shooting quality, and therefore, the camera module protrudes from the rear cover to form a boss at the back, which is caused by the trend of the thinning of the mobile phone and the trend of the quality and function improvement of the camera module. The thinner the cell-phone is the better that the handheld experience of user is, present frivolous cell-phone can accomplish to be less than 9mm basically, is less than 8mm even, and the user also expects the quality of module of making a video recording to promote simultaneously, if improve the pixel, improve long burnt shooting ability, big light ring camera lens, add anti-shake function etc. this all leads to the module size of making a video recording great, and especially the module of making a video recording highly great. However, the camera module protrudes out of the rear cover of the mobile phone, so that the appearance of the mobile phone is greatly influenced, and when a user flatly places the mobile phone on a desktop, the mobile phone is in an inclined and unstable posture, so that the operation of the user is influenced. More importantly, the camera module protrudes out of the rear cover of the mobile phone, so that the camera module or the protective cover plate outside the camera module has a great scratch risk, the camera module is collided or dropped to easily cause scratches or cracks, and imaging of the camera module is influenced.

In order to avoid the impact between the camera module and the rear cover in the mobile phone of the prior art, a gap is usually required to be arranged between the camera module and the glass rear cover, which is another reason why the camera module protrudes from the rear cover after the mobile phone. In short, the camera module in the prior art cannot meet the requirement of the mobile terminal device for lightness and thinness while pursuing high-quality shooting quality.

Disclosure of Invention

One of the main advantages of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module can be integrally received in a cover plate of the electronic device, so as to prevent the camera module from being exposed, and to protect the camera module.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module is completely received in a cover plate of the electronic device in a retracted state, which is beneficial to making the electronic device light and thin.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the top of the camera module is directly attached to the glass cover plate, and by reducing the height of the camera module, the gap between the bottom of the camera module and the cover plate of the electronic device is further reduced.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module cancels a filter, so that the lens can move down to a greater extent when the lens is retracted, and the rear long-focus camera module of the mobile terminal does not protrude from the rear cover.

Another advantage of the present invention is to provide a camera module and an electronic device having the same, wherein the photosensitive assembly of the camera module moves to realize optical anti-shake and multi-degree-of-freedom motion, and the motor structure is simpler and the anti-shake stroke of the camera module is increased, so as to compensate for large shake of the camera module.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module uses a blue glass cover or a filter film to replace the function of the optical filter after the optical filter is removed, so as to avoid stray light.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module further increases the distance between the lens and the photosensitive chip by using a chip sinking or chip reverse attaching manner, so as to more fully utilize the height space of the long-focus camera module and reduce the height of the camera module.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module includes a dust-proof structure to prevent the photosensitive element of the camera module from entering dust and affecting the shooting quality.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the top of the camera module is directly attached to the glass cover plate, thereby further reducing the gap between the bottom of the camera module and the glass cover plate.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module is covered on an inner side of a cover plate of the electronic device, and the cover plate protects the camera module, which is beneficial to simplifying the structure of the camera module and reducing the height and volume of the camera module.

Another advantage of the present invention is to provide a camera module and an electronic device having the camera module, wherein the camera module is suitable for being used as a rear zoom camera module, when the camera module is in a non-operating state, the height of the camera module is substantially the same as the thickness of the camera module, and when the camera module is in an operating state, the lens of the camera module extends, so that the distance from the lens to the photosensitive chip meets the requirement of zoom shooting for the back focal length, and the shooting quality is ensured.

Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein when the camera module is in operation, a lens of the camera module extends to enable a distance between the lens and a photosensitive chip to meet a requirement of multiple times of zoom shooting, and when the camera module is not in operation, the lens of the camera module contracts to enable the camera module to be completely accommodated in a terminal, thereby improving an aesthetic appearance of the terminal.

Additional advantages and features of the invention will be set forth in the detailed description which follows and in part will be apparent from the description, or may be learned by practice of the invention as set forth hereinafter.

In accordance with one aspect of the present invention, the foregoing and other objects and advantages are achieved in the present invention by a camera module for an electronic device, wherein the electronic device includes a cover plate, comprising:

a lens;

the lens is arranged above the photosensitive assembly along an optical axis direction;

and the driving device is in transmission connection with the lens, the driving device drives the lens to move along the direction of the optical axis, so that the camera module is switched between a working state and a contraction state, and when the camera module is in the contraction state, the focal plane of the lens is positioned behind the photosensitive assembly. According to one embodiment of the present invention, the driving device is in transmission connection with the photosensitive assembly, and the driving device drives the photosensitive assembly to move along a direction perpendicular to the optical axis and/or rotate around the optical axis.

According to an embodiment of the present invention, the photosensitive assembly includes a filter assembly and a circuit board assembly, wherein the filter assembly is located above the circuit board assembly, and the filter assembly filters the stray light, and the filter assembly includes a filter support and a filter mounted on the filter support.

According to an embodiment of the present invention, the apparatus further comprises a transmission device, wherein the transmission device is disposed between the driving device and the photosensitive assembly, wherein the driving device is drivingly connected to the photosensitive assembly through the transmission device.

According to one embodiment of the present invention, the photosensitive assembly comprises a circuit board assembly, wherein the circuit board assembly is drivingly connected to the driving device, and the circuit board assembly is driven by the driving device to move in a specific direction and/or angle.

According to an embodiment of the present invention, the circuit board assembly further includes a circuit board and a photosensitive chip, wherein the photosensitive chip is disposed on an upper surface of the circuit board.

According to an embodiment of the present invention, the apparatus further comprises a transmission device, wherein the transmission device is disposed between the driving device and the photosensitive assembly, wherein the driving device is drivingly connected to the circuit board of the photosensitive assembly through the transmission device.

According to an embodiment of the present invention, the photosensitive assembly further includes a base, wherein the base is disposed above the circuit board assembly, and the transmission device is drivingly connected to the base of the photosensitive assembly.

According to an embodiment of the present invention, the base includes a connection end and an anti-collision end extending from the connection end to the inside, wherein the connection end is fixedly connected to the transmission device, the anti-collision end is formed above the photosensitive chip, and the anti-collision end corresponds to a lower end of the lens.

According to an embodiment of the present invention, the photosensitive assembly further includes at least one buffer unit, wherein the buffer unit is disposed on the upper surface of the base.

According to an embodiment of the present invention, the photosensitive assembly further includes a base disposed above the circuit board assembly, wherein the driving device is located outside the base, and the driving device is drivingly connected to the circuit board.

According to an embodiment of the present invention, the driving device includes an optical zoom motor and an anti-shake motor, wherein the optical zoom motor is coupled to the lens, and the anti-shake motor is coupled to the circuit board assembly.

According to one embodiment of the invention, the circuit board is provided with a groove, wherein the groove is formed on the upper surface of the circuit board, and the photosensitive chip is arranged in the groove of the circuit board.

According to one embodiment of the invention, the circuit board is provided with a mounting hole, wherein the photosensitive chip is arranged in the mounting hole of the circuit board.

According to an embodiment of the present invention, the circuit board assembly further includes a reinforcing plate, wherein the reinforcing plate is attached to the back surfaces of the circuit board and the photosensitive chip.

According to an embodiment of the present invention, the circuit board includes a circuit board main body and a supporting arm extending from an upper end of the circuit board main body to an inner side, the circuit board is further provided with a mounting groove, wherein the mounting groove is formed at an inner side of the circuit board main body and the supporting arm of the circuit board, wherein the photosensitive chip is attached to a lower side of the supporting arm, and the photosensitive chip is supported by the supporting arm to the mounting groove of the circuit board.

According to an embodiment of the invention, the circuit board assembly further includes at least one anti-collision structure, wherein the anti-collision structure is disposed on the circuit board of the circuit board assembly and located outside the photosensitive chip, and the height of the anti-collision structure is greater than the height of the photosensitive chip.

According to an embodiment of the present invention, the base further includes a base body, a crash platform disposed at an upper end of the base body, and a dust-catching platform, wherein the crash platform is located at an inner side of the dust-catching platform, and the crash platform faces the lens.

According to one embodiment of the invention the height of the dust collection platform is lower than the height of the crash platform.

According to an embodiment of the present invention, a surface of at least one optical lens of the lens is coated with a filter material, wherein the filter material may be a filter film.

According to an embodiment of the invention, the circuit board assembly further includes a dust-catching mechanism, and the dust-catching mechanism is disposed in the non-photosensitive area of the photosensitive chip.

According to another aspect of the present invention, the present invention further provides an electronic device comprising:

an electronic device body and a cover plate; and

at least one camera module as described above, wherein the at least one camera module is disposed on the electronic device main body and covered on the inner side of the cover plate.

According to an embodiment of the present invention, the cover plate comprises a cover plate support and at least one filter glass, wherein the filter glass is opposite to the lens of the camera module, and the filter glass is a blue glass.

According to an embodiment of the present invention, the cover plate further includes an elastic connection member, wherein the elastic connection member connects the cover plate support member to the filter glass.

According to an embodiment of the present invention, the cover plate is an openable structure, and when the camera module is in an operating state, the cover plate can be driven to lift or open.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1 is an overall schematic view of a camera module according to a preferred embodiment of the invention.

Fig. 2 is an overall schematic view of a camera module according to another preferred embodiment of the invention.

Fig. 3 is an overall schematic view of a camera module according to another preferred embodiment of the invention.

Fig. 4 is a partial structural diagram of a camera module according to another preferred embodiment of the invention, which shows the structure of a buffer portion of the camera module.

Fig. 5 is an overall view of a camera module according to another preferred embodiment of the invention, which shows a motor structure of the camera module.

Fig. 6 is an overall schematic view of a camera module according to another preferred embodiment of the invention, which shows a structure of a circuit board of the camera module.

Fig. 7 is an overall view of a camera module according to another preferred embodiment of the invention, which shows a structure of a circuit board of the camera module.

Fig. 8 is an overall view of a camera module according to another preferred embodiment of the invention, which shows a circuit board structure of the camera module.

Fig. 9 is an overall schematic view of a camera module according to another preferred embodiment of the invention, which shows a collision avoidance structure of the camera module.

Fig. 10 is a schematic view of the optical components of the camera module according to the above preferred embodiment of the invention.

Fig. 11 is an overall view of a camera module according to another preferred embodiment of the invention, which shows another anti-collision structure of the camera module.

Fig. 12 is an overall view of a camera module according to another preferred embodiment of the invention, which shows the structure of a cover plate.

Fig. 13 is an overall view of a camera module according to another preferred embodiment of the present invention, which shows a dust-catching structure.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The underlying principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1 of the drawings accompanying the present specification, a camera module 100 and an electronic apparatus having the camera module 100 according to a preferred embodiment of the present invention are explained in the following description. The camera module 100 is disposed in an electronic device main body of the electronic device and electrically connected to the electronic device main body. The electronic device further includes a cover plate 200, wherein the cover plate 200 has an inner side and an outer side opposite to the inner side, and the camera module 100 is located on the inner side of the cover plate 200. The camera module 100 is held by the cover 200 to the electronic apparatus main body. It should be noted that, in the preferred embodiment of the present invention, the cover plate 200 may be, but not limited to, a glass cover plate, that is, the cover plate 200 is made of glass, and external light can enter the camera module 100 through the cover plate 200, that is, the camera module 100 can shoot through the cover plate 200.

It is worth mentioning that in the preferred embodiment of the present invention, the electronic device may be, but is not limited to, a mobile phone, a tablet computer, a smart wearable device, such as a watch, a bracelet, and electronic glasses, etc. By way of example, in the preferred embodiment of the present invention, the electronic device is a mobile phone. The camera module 100 is a rear camera in the preferred embodiment of the present invention, that is, the camera module 100 is disposed on the back of the electronic device, and the camera module 100 is covered by the cover plate 200 and disposed on the inner side of the cover plate 200. It should be noted that, in the preferred embodiment of the present invention, the application scenario of the camera module 100 is only used as an example and is not limited.

It should be noted that, in the preferred embodiment of the present invention, the number of the camera modules 100 of the electronic apparatus is at least one, that is, the electronic apparatus includes at least one camera module 100, and the at least one camera module 100 is disposed on the back of the electronic apparatus body with a specific location feature, and the at least one camera module 100 can be accommodated inside the cover plate 200. The camera module 100 can achieve multiple zooming, for example, 4 times zooming, 5 times zooming, or 5-10 times zooming, or even more than 10 times zooming.

In detail, the camera module 100 includes a lens 10, a driving device 20, a photosensitive element 30 and a fixing device 40, wherein the fixing device 40 has an accommodating cavity 401, the lens 10, the driving device 20 and the photosensitive element 30 can be accommodated in the accommodating cavity 401 by the fixing device 40, and the fixing device 40 protects the lens 10, the driving device 20 and the photosensitive element 30 inside. In the preferred embodiment of the present invention, the lens 10 is drivingly connected to the driving device 20, and the driving device 20 drives the lens 10 to move up and down along an optical axis of the camera module 100, so as to realize optical zooming of the camera module 100.

The photosensitive assembly 30 includes a filter assembly 31 and a circuit board assembly 32, wherein the filter assembly 31 is located above the circuit board assembly 32, and the filter assembly 31 filters stray light. The filter assembly 31 includes a filter holder 311 and a filter 312 mounted on the filter holder 311. The circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 mounted on a surface of the circuit board 321, and at least one electronic component 323, wherein the electronic component 323 is located outside the photosensitive chip 322. The filter holder 311 further includes a mirror base 3111 and a supporting portion 3112 integrally extending from the mirror base 3111, wherein the supporting portion 3112 is formed by extending inward from the mirror base 3111, and the filter 312 is attached to the supporting portion 3112 of the filter holder 311. Preferably, in the preferred embodiment of the present invention, the driving means 20 is mounted to the top surface of the mirror base 3111.

The circuit board assembly 32 further includes a connector 325 and a flexible board 324, wherein the connector 325 is electrically connected to the circuit board 324 by the flexible board 324.

The photosensitive element 30 is connected to the driving device 20 in a driving manner, and the driving device 20 drives the photosensitive element 30 to move along a specific direction or a specific angle, that is, the photosensitive element 30 can be driven by the driving device 20, so as to achieve optical anti-shake of the camera module 100. The camera module 100 further includes a transmission device 50, wherein the transmission device 50 is disposed between the driving device 20 and the photosensitive assembly 30, and the driving device 20 is drivingly connected to the photosensitive assembly 30 through the transmission device 50. In other words, the driving device 20 drives the photosensitive assembly 30 to move in a specific direction and/or angle through the transmission device 50. The transmission device 50 is located below the driving device 20 and above the photosensitive assembly, and the driving device 20 drives the transmission device 50 to move, so that the transmission device 50 drives the photosensitive assembly 30 to move, thereby achieving optical anti-shake. Specifically, the bottom of the transmission device 50 is fixed on the top surface of the mirror base 3111, wherein the top of the transmission device 50 is drivingly connected to the driving device 20, wherein the transmission device 50 is used for connecting the driving device 20 and the photosensitive assembly 30.

Optionally, in other embodiments of the present invention, the transmission device 50 is fixed to the circuit board assembly 32 of the photosensitive assembly 30, that is, the transmission device 50 drives the photosensitive chip 322 of the circuit board assembly 32 to move, so as to increase the reliability of optical anti-shake of the camera module 100.

It is worth mentioning that the driving device 20 in the preferred embodiment of the present invention may be, but is not limited to, a driving motor.

Optionally, in another embodiment of the present invention, the lens holder 3111 is a package, the lens holder 3111 is integrally packaged and molded on the circuit board 321, and the electronic component 323 and the gold wire electrically connected to the photosensitive chip 322 are covered by the lens holder 3111, so as to avoid the electronic component from being damaged. A support portion 3112 extends inward from the top of the package to support the optical filter.

It should be noted that, in the preferred embodiment of the present invention, the camera module 100 is a retractable camera module, that is, the lens 10 of the camera module 100 is driven by the driving device 20 to move up and down along the optical axis direction, so as to realize the optical zooming of the camera module 100. The camera module 100 has an operating state and a retracted state, and the camera module 100 is switchable between the operating state and the retracted state. When the camera module 100 is in the working state, the lens 10 of the camera module 100 is driven by the driving device 20 to be in an extended state, and at this time, the distance from the lens 10 to the photosensitive chip 322 meets the shooting requirement (TTL meets the requirement). When the camera module 100 is in the retracted state, and at this time, the height of the camera module 100 is low, so that the camera module 100 can be accommodated inside the cover plate 200 of the electronic device.

In detail, the camera module 100 is used as a rear camera module of the electronic device, and is mounted on the back of the electronic device, and when the camera module 100 is in a retracted state, the height and the thickness of the camera module 100 are substantially the same. It can be understood that, after the camera module 100 is assembled in the electronic device main body of the electronic device, the upper end surface of the camera module 100 is flush with the back surface of the cover 200 of the electronic device, or is slightly lower than the back surface of the cover 200. When the camera module 100 is in an operating state, the lens 10 of the camera module 100 can be driven by the driving device 20 to extend, so that the distance from the lens 10 to the photosensitive chip 322 can be adjusted according to the camera shooting requirement, the requirement of zooming shooting on the back focal length is met, and the shooting quality is ensured. It is understood that the height of the camera module 100 may be significantly greater than the thickness of the electronic device. In other words, when the camera module 100 is in the working state, the lens 10 of the camera module 100 can be driven by the driving device 20, and the distance between the lens 10 and the photosensitive chip 322 is adjusted based on the shooting requirement of the camera module 100, wherein the lens 10 extends outward along the optical axis direction to the outer side of the cover plate 200, or the cover plate 200 moves outward along with the lens 10 along the optical axis direction synchronously, so as to meet the optical zooming requirement of the camera module 100.

When the camera module 100 is in the retracted state, the lens 10 of the camera module 100 is driven by the driving device 20 or driven by the cover plate 200 to retract along the optical axis direction, so as to reduce the height or thickness of the camera module 100 in the retracted state. In short, when the camera module 100 is in the retracted state, the lens 10 of the camera module 100 is driven to retract, so as to facilitate the storage of the camera module 100.

In short, the camera module 100 has two working states, when the camera module 100 is in operation, the lens 10 of the camera module 100 is driven to extend outward along the optical axis direction, so that the distance between the lens 10 and the photosensitive chip 322 meets the requirement of multiple times of zooming shooting. When the camera module 100 is in the retracted state, the lens of the camera module 100 is retracted, so that the camera module 100 is completely accommodated inside the cover plate 200 of the electronic device, thereby improving the terminal appearance (the back surface is flat and unobtrusive). In the retracted state, the focal plane of the lens 10 is behind the photosensitive element 30. Specifically, in the retracted state, the focal plane of the lens 10 is located behind the photosensitive chip 322, i.e. the photosensitive chip 322 faces away from the lens. Or, in a retracted state, the focal plane of the lens 10 is located behind the photosensitive surface of the photosensitive chip 322, the photosensitive surface of the photosensitive chip 322 is an area where the photosensitive chip 322 is used for receiving lens light to perform imaging, and the photosensitive surface is located on a surface of the photosensitive chip 322 close to the lens 10.

It should be noted that, in the preferred embodiment of the present invention, when the camera module 100 is in the retracted state, the rear long-focus camera module (the camera module 100) of the electronic device does not protrude from the rear cover, and the top of the camera module 100 of the preferred embodiment of the present invention is directly attached to the cover plate 200 of the electronic device, so as to reduce the height of the rear long-focus camera module, which is beneficial to further reduce the gap between the top of the camera module 100 and the cover plate 200.

It should be noted that the cover plate 200 of the electronic device can also be selectively opened or closed, that is, when the camera module 100 is in the working state, the cover plate 200 is driven by another driving mechanism to be lifted, or is driven by the lens 10 of the camera module 100 to move along the moving direction of the lens 10. The camera module 100 drives the lens 10 through a driving device 20 to realize optical zooming, and at this time, the lens 10 is in an extended state. When the camera module 100 is in a non-operating state, the cover plate 20 is driven by another driving mechanism to press down, and since the top of the camera module 100 is directly attached to the cover plate 200, the lens 10 can be directly driven to move to the bottommost position by the pressing down process of the cover plate 200. When the camera module 100 changes from the retracted state to the operating state, the cover plate 200 is driven by another driving mechanism to be lifted, and at this time, the lens 10 returns to the middle position of the camera module 100 and operates under the driving of the driving device 20. The lowermost position refers to the lowest position to which the lens can move down after being retracted.

As will be understood by those skilled in the art, when performing optical zooming, the driving device 20 drives the lens 10 of the camera module 100 to extend outward along the optical axis, so that the distance between the lens 10 and the photosensitive assembly 30 meets the requirement of multiple-time zooming shooting. When the camera module is not in operation, the lens 10 of the camera module is retracted, so that the camera module 100 is completely accommodated in the cover plate 200 of the electronic device.

Referring to fig. 2 of the drawings accompanying the present specification, a camera module 100 and an electronic device with the camera module 100 according to another preferred embodiment of the present invention are explained in the following description. The difference between the above-mentioned first preferred embodiment is the structure of the camera module 100.

The camera module 100 includes a lens 10, a driving device 20, a photosensitive assembly 30 and a fixing device 40, wherein the fixing device 40 has a containing cavity 401, the lens 10, the driving device 20 and the photosensitive assembly 30 can be contained in the containing cavity 401 by the fixing device 40, and the fixing device 40 protects the inside of the lens 10, the driving device 20 and the photosensitive assembly 30.

As in the above preferred embodiment, the driving device 20 can drive the lens 10 and/or the photosensitive assembly 30 to move for optical anti-shake and optical zooming, the driving device 20 can be various motors, such as an SMA motor, a piezoelectric motor, a MEMS motor, a stepping motor, or a voice coil motor, the driving device 20 drives the lens 10 to extend and retract for optical zooming, and the driving device 20 drives the circuit board assembly 30 to move for optical anti-shake.

When optical zooming is performed, the driving device 20 drives the lens 10 of the camera module 100 to extend, so that the distance between the lens 10 and the photosensitive component 30 meets the requirement of multiple-time zooming shooting. When the camera module 100 is not in operation, the lens of the camera module shrinks, so that the camera module 100 is completely accommodated inside the cover plate 200 of the electronic device. It should be noted that, different from the first preferred embodiment, in the preferred embodiment of the present invention, the photosensitive element 30 of the camera module 100 is not provided with a filter, that is, a larger space is not required between the lens 10 and the photosensitive element 30 to accommodate the filter. In a retracted state, the distance between the lens 10 of the camera module 100 and the photosensitive element 30 may be closer, so that the lens 10 may move downward to a greater extent when retracted, so that the camera module 100 behind the electronic device does not protrude from the rear cover, and after the lens 10 retracts, the total height of the camera module 100 further decreases. Further, in this embodiment, in a retracted state, the lens 10 does not need to reserve a distance from the cover plate 200 of the electronic device after being retracted, that is, the group top of the camera module 100 is directly attached to the inner side of the cover plate 200, so that a gap between the top of the camera module 100 and the cover plate 200 is further reduced, which is beneficial to further reducing the height of the camera module 100.

Accordingly, the photosensitive assembly 30 includes a circuit board assembly 32, wherein the circuit board assembly 32 is drivingly connected to the driving device 20, and the circuit board assembly 32 is driven by the driving device 20 to move in a specific direction and/or angle. The circuit board assembly 32 further includes a circuit board 321, a photosensitive chip 322, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the photosensitive chip 322 is disposed on an upper surface of the circuit board 321. Preferably, the photosensitive chip 322 can be electrically connected to the circuit board 321 by gold wire bonding. The electronic component 323 is disposed on the circuit board 321 and around the photosensitive chip 322. The flexible board 324 is electrically connected to the circuit board 321 at one end thereof, electrically connected to the connector 325 at the other end thereof, and connected to an external main board of the electronic device through the connector 321. The flexible board 324 is a flexible FPC, which can prevent the circuit board 321 from being broken due to bending.

When performing optical anti-shake, the driving device 20 may drive the photosensitive assembly 30 to move in a direction perpendicular to the optical axis and/or rotate around the optical axis to implement optical anti-shake, so as to implement a motion with multiple degrees of freedom. Therefore, the structure of the driving device is simpler and the anti-shake stroke of the camera module 100 is improved, so that the large shake of the camera module 100 can be compensated. The camera module 100 further includes a transmission device 50, wherein the transmission device 50 is disposed between the driving device 20 and the photosensitive assembly 30, and the driving device 20 is drivingly connected to the photosensitive assembly 30 through the transmission device 50. In other words, the driving device 20 drives the photosensitive assembly 30 to move in a specific direction and/or angle through the transmission device 50. The transmission device 50 is fixed on the circuit board 321 of the circuit board assembly 32, that is, the transmission device 50 drives the circuit board 321 and the photosensitive chip 322 to move, so as to increase the reliability of optical anti-shake of the camera module 100.

In another alternative embodiment of the present invention, as shown in fig. 3, the photosensitive element 30 of the camera module 100 further includes a base 33, wherein the base 33 is disposed above the circuit board element 32. The transmission device 50 is connected with the base 33 of the photosensitive assembly 30 in a transmission manner, and the transmission device 50 drives the base 33 to move. Preferably, in the preferred embodiment of the present invention, the base 33 is a package and is formed on the upper surface of the circuit board assembly 32, and the base 33 can cover the electronic component and the gold wires, so as to prevent the electronic component or the gold wires from being damaged. The base 33 can also provide a more flat upper surface, which improves the flatness of the entire camera module. Preferably, the lower end of the base 33 covers the non-photosensitive region of the photosensitive chip 322. The base 33 includes a connection end 331 and an anti-collision end 332 extending from the connection end 331 to the inside, wherein the connection end 331 is fixedly connected to the transmission device 50, the anti-collision end 332 is formed above the photosensitive chip 322, and the anti-collision end 332 corresponds to a lower end of the lens 10, and when the lens 10 moves downward, the anti-collision end 332 prevents the lens 10 from colliding with the photosensitive chip 322. In other words, the base 33 can serve as an anti-collision structure to prevent the lens 10 from directly impacting the photo sensor chip 322 during the downward movement process, which may damage the photo sensor chip 322.

It should be noted that the base 33 of the preferred embodiment of the present invention can also be applied to the camera module of the preferred embodiment of fig. 1. In other words, the base 33 may be provided to the circuit board assembly 30 with the filter assembly 31.

As shown in fig. 4, the photosensitive assembly 30 of the camera module 100 further includes at least one buffer unit 34, wherein the buffer unit 34 is disposed on the upper surface of the base 33, and the buffer unit 34 is opposite to the lower end of the lens holder 10, and when the lens 10 moves in a downward retracting manner, the buffer unit 34 buffers the impact of the lens 10 on the base 33. Preferably, in the preferred embodiment of the present invention, the buffer unit 34 is implemented as a soft gel, an elastic substance, or a flexible substance, and the lens 10 may hit the base 33 when in the retracted state, so as to avoid generating debris when hitting or rubbing. The buffer unit 34 and the base 33 of the preferred embodiment of the present invention can also be applied to the camera module of the preferred embodiment of fig. 2, so as to prevent debris from falling onto the surface of the chip and affecting the image formation.

Preferably, when the lens 10 is in the retracted state, the lower surface of the lens 10 contacts the upper surface of the base 33, that is, the lens 10 retracts to the bottom-most position, which further reduces the height between the base of the camera module 100 and the cover 200 of the electronic device.

Moreover, when the buffer unit 34 and the base 33 in this embodiment are applied to the camera module of the preferred embodiment shown in fig. 2, that is, a larger space is not required between the lens 10 and the photosensitive element 30 to accommodate the optical filter, so that in the retracted state, the distance between the lens 10 and the photosensitive element 30 of the camera module 100 can be closer, and the lens 10 can move downward to a greater extent when retracted, so that the camera module 100 of the electronic device does not protrude from the rear cover.

It should be noted that the buffer unit 34 and the base 33 of the preferred embodiment of the present invention can also be applied to the camera module of the preferred embodiment of fig. 1. In other words, the base 33 and the buffer unit 34 may be provided to the circuit board assembly 30 with the filter assembly 31.

Referring to fig. 5 of the drawings in the specification of the present invention, another alternative embodiment of the camera module 100 is shown, different from the above preferred embodiment, in the preferred embodiment of the present invention, the driving device 20 of the camera module is drivingly connected to the circuit board assembly 32, and the driving device 20 drives the circuit board assembly 32 to move, so as to achieve optical anti-shake. The driving device 20 is located outside the base 33, or the driving device 20 and the base 33 are spaced from each other. Briefly, in the preferred embodiment of the present invention, the driving device 20 drives the circuit board assembly 32 to move based on a control command. It should be noted that, in the preferred embodiment of the present invention, the base 33 may only wrap the gold wires and the electronic components, that is, the edge portion of the circuit board 321 is not wrapped by the base 33, wherein the driving device 20 is disposed at the edge of the circuit board 321, and the base 33 is located inside the edge of the circuit board 321.

The driving device 20 includes an optical zoom motor 21 and an anti-shake motor 22, wherein the optical zoom motor 21 is transmitted to the lens 10, the optical zoom motor 21 drives the lens 10 to move, so as to achieve the optical zoom of the camera module 100, the anti-shake motor 22 is transmitted to the circuit board assembly 32, and the anti-shake motor 22 drives the circuit board assembly 32 to move, so as to achieve the optical anti-shake of the camera module 100.

In detail, in the preferred embodiment of the present invention, the optical zoom motor 21 is located above the anti-shake motor 22, wherein the anti-shake motor 22 is drivingly connected to the circuit board assembly 32 through a transmission device 50, and the anti-shake motor 22 drives the transmission device 50 to move, so that the transmission device 50 drives the circuit board assembly 32 to move in a specific direction and angle.

The driving device 20 further includes a circuit connecting unit 23, wherein the circuit connecting unit 23 electrically connects the optical zoom motor 21 to the circuit board 321 of the circuit board assembly 32 and/or electrically connects the anti-shake motor 22 to the circuit board 321 of the circuit board assembly 32. Preferably, in the preferred embodiment of the present invention, the circuit connection unit 23 is implemented as a flexible circuit board, wherein the circuit connection unit 23 is disposed at the actuator 50. It should be noted that the optical zoom motor 21 and the anti-shake motor 22 can be electrically connected through a motor pin.

It should be noted that the optical zoom motor 21 and the anti-shake motor 22 of the preferred embodiment of the present invention can also be applied to the camera module of the preferred embodiment shown in fig. 2, so that the lens 10 can be retracted and moved down in the retracted state by eliminating the optical filter, the length space of the camera module 100 is fully utilized, and the camera module 100 of the electronic device can not protrude out of the cover plate 200 after the distance between the lens 10 and the photosensitive element 30 is reduced.

It should be noted that the optical zoom motor 21 and the anti-shake motor 22 of the preferred embodiment of the present invention can also be applied to the camera module of the preferred embodiment of fig. 1.

As shown in fig. 6, the present invention further provides an alternative embodiment of a circuit board assembly 32, in accordance with another aspect of the present invention. The circuit board assembly 32 further reduces the distance between the lens 10 and the photosensitive assembly 30 by adopting a photosensitive chip sinking or chip reverse pasting mode, and enables the lens 10 to shrink and move downwards in a shrinking state as much as possible.

In detail, the circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 disposed on the circuit board 321, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the flexible board 324 is electrically connected to the circuit board 321 and the connector 325. The circuit board 321 is provided with a groove 3210, wherein the groove 3210 is formed on the upper surface of the circuit board 321, and the photosensitive chip 322 is disposed in the groove 3210 of the circuit board 321. Because the photosensitive chip 322 sinks into the circuit board, the length and space for the lens 10 to shrink and move downwards can be further increased, and the lens 10 can be prevented from directly contacting the photosensitive chip 322 to cause the damage of the photosensitive chip 322.

The circuit board 321 has a circuit board upper surface 3212 and a circuit board lower surface 3213, wherein the groove 3210 is formed in the circuit board upper surface 3212 of the circuit board 321. Preferably, the thickness of the photosensitive chip 322 is not higher than the depth of the groove 3210 of the circuit board 321. In other words, in the preferred embodiment of the present invention, the upper end surface of the photosensitive chip 322 does not exceed the circuit board upper surface 3212 of the circuit board 321.

It should be noted that the structure of the circuit board assembly 32 according to the preferred embodiment of the present invention can also be applied to the camera module according to the preferred embodiment of fig. 1.

As shown in fig. 7, the present invention further provides an alternative embodiment of a circuit board assembly 32, in accordance with another aspect of the present invention. The circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 disposed on the circuit board 321, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the flexible board 324 is electrically connected to the circuit board 321 and the connector 325. The circuit board 321 has a mounting hole 3211, wherein the mounting hole 3211 penetrates the circuit board upper surface 3212 and the circuit board lower surface 3213 of the circuit board 321, and the photosensitive chip 322 is disposed in the mounting hole 3211 of the circuit board 321.

The circuit board assembly 32 further includes a reinforcing plate 326, wherein the reinforcing plate 326 is disposed on the lower side of the circuit board 321, and the photosensitive chip 322 is supported by the reinforcing plate 321. Preferably, the reinforcing plate 326 is attached to the back surfaces of the circuit board 321 and the photosensitive chip 322, and the reinforcing plate 326 is used for reinforcing the strength of the circuit board 321 and supporting the photosensitive chip 322. The reinforcing plate 326 may be, but not limited to, a metal material such as a steel plate, a copper plate, or an aluminum plate, or a non-metal material such as graphene. It should be noted that in the preferred embodiment of the present invention, the reinforcing plate 326 also has a heat dissipation function, so that heat generated by the operation of the photo sensor chip 322 can be conducted through the reinforcing plate 326, thereby preventing the damage of the module structure caused by the heat generated by the operation of the camera module 100.

As shown in fig. 8, the present invention further provides an alternative embodiment of a circuit board assembly 32, in accordance with another aspect of the present invention. The circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 disposed on the circuit board 321, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the flexible board 324 is electrically connected to the circuit board 321 and the connector 325. Unlike the preferred embodiment, in the preferred embodiment of the present invention, the photosensitive chip 322 is attached to the circuit board 321 upside down.

In detail, the circuit board 321 includes a circuit board main body 3214 and a supporting arm 3215 extending inward from an upper end of the circuit board main body 3214, wherein the photosensitive chip 322 is supported below the supporting arm 3215. The circuit board 321 is further provided with a mounting groove 3216, wherein the mounting groove 3216 is formed inside the circuit board main body 3214 and the supporting arm 3215 of the circuit board 321, and the mounting groove 3216 penetrates the circuit board upper surface 3212 and the circuit board lower surface 3213 of the circuit board 321, wherein the photosensitive chip 322 is attached to the lower side of the supporting arm 3215, and the photosensitive chip 322 is supported by the supporting arm 3215 in the mounting groove 3216 of the circuit board 321. It can be understood that the photosensitive chip 322 is attached to the circuit board 321 upside down in this way. The height space of the camera module 100 can be more fully utilized.

It should be noted that the structure of the circuit board assembly 32 according to the preferred embodiment of the present invention can also be applied to the camera module according to the preferred embodiment of fig. 2, so that the lens 10 can be retracted and moved downward in a retracted state by eliminating the optical filter, the length space of the camera module 100 is fully utilized, and the camera module 100 of the electronic device does not protrude from the cover plate 200 after the distance between the lens 10 and the photosensitive assembly 30 is reduced.

As shown in fig. 9 and 10, the present invention further provides another alternative embodiment of a circuit board assembly 32 according to another aspect of the present invention. The circuit board assembly 32 further includes at least one anti-collision structure 327, wherein the anti-collision structure 327 is disposed on the circuit board 321 of the circuit board assembly 32, which is located outside the photosensitive chip 322. The anti-collision structure 327 protrudes upward from the circuit board 321, wherein the height of the anti-collision structure 327 is greater than the height of the photosensitive chip 322, and the anti-collision structure 327 is opposite to the lens 10, and when the lens 10 moves downward, the anti-collision structure 327 blocks the lens 10, so as to prevent the lens 10 from colliding with the photosensitive chip 322.

It should be noted that, since the camera module 100 according to the preferred embodiment of the present invention eliminates the optical filter, the camera lens 10 may collide with the photosensitive chip 30 during the process of shrinking and moving down in the shrinking state, so as to cause the photosensitive chip 30. The anti-collision structure 327 may be an elastic protruding structure, and the height of the anti-collision structure 327 is greater than the height of the photosensitive chip 322, so as to avoid the impact on the photosensitive chip. It should be noted that the anti-collision structure 327 may be disposed on the upper surface of the circuit board 321, or may be disposed in a non-photosensitive area of the photosensitive chip 322.

As shown in fig. 10, the anti-collision structures 327 are disposed at four corners of the circuit board 321, or disposed at two opposite sides of the circuit board 321, or the anti-collision structures 327 form a ring structure, wherein the photosensitive chips 322 are disposed inside the anti-collision structures 327. Accordingly, the particular type and shape of the crush structure 327 in the preferred embodiment of the present invention is not limited in this application.

As shown in fig. 11, the present invention further provides another alternative embodiment of a base 33 in accordance with another aspect of the present invention. In the preferred embodiment of the present invention, the base 33 can serve as a bump-proof structure, that is, the lens 10 reaches the top surface of the base 33 after being retracted, and is blocked by the base 33, so as to prevent the lower end of the lens 10 from contacting the photosensitive chip 322.

The base 33 further includes a base body 331, a crash platform 332 disposed on an upper end of the base body 331, and a dust-catching platform 333, wherein the crash platform 332 is located inside the dust-catching platform 333, and the crash platform 332 faces the lens 10. When in the retracted state, the lens 10 is retracted downward, wherein the anti-collision platform 332 of the base 33 blocks the lens 10 from moving downward, so as to protect the photo sensor chip 322. The dust catching platform 333 is located at the periphery of the anti-collision platform 332, and the dust catching platform 333 catches dust to avoid influencing the imaging of the photosensitive chip 322. It should be noted that the plane of the dust catching platform 333 is lower than the plane of the anti-collision platform 332, wherein a dust catching glue is disposed in the dust catching platform 333, so that the dust catching glue adsorbs dust entering the camera module and debris generated by friction of the motor, or enters external dust inside the module through a gap of the motor.

Preferably, the height of the dust catching platform 333 is lower than that of the anti-collision platform 332, so as to prevent the lens 10 from contacting the dust catching glue in the dust catching platform 333. Alternatively, in another alternative embodiment of the present invention, the height of the dust-catching platform 333 is a height equivalent to that of the anti-collision platform 332, wherein the dust-catching platform 333 is located outside the projection of the lens 10 in the vertical direction, that is, the lens 10 does not collide with the dust-catching platform 333 when moving along the optical axis direction. Preferably, the cross section of the dust catching platform 333 may be a trapezoid structure, that is, the side wall of the dust catching platform 333 is an inclined side wall, that is, the opening of the dust catching platform 333 increases from bottom to top, so that the dust catching platform 333 has a larger contact area with the debris or the external dust, and the dust catching effect is better. In other alternative embodiments of the present invention, the dust catching platform 333 is configured with an upper opening and a lower opening that are the same, that is, the side wall of the dust catching platform 333 is a vertical or nearly vertical side wall, which is not limited in this application.

It should be noted that the structure of the base 33 according to the preferred embodiment of the present invention can also be applied to the camera module according to the preferred embodiment of fig. 1.

As shown in fig. 12, another electronic device of the present invention is set forth in the description that follows, in accordance with another aspect of the present invention. The camera module 100 is disposed on the electronic device, and in the preferred embodiment of the present invention, the camera module 100 is not provided with a filter, so that when the camera module 100 does not operate, the lens 10 retracts, and when the lens 10 retracts, the camera module 100 of the electronic device does not protrude from the cover plate 200.

In the preferred embodiment of the present invention, the cover plate 200 includes a cover plate support 210 and at least one filter glass 220, wherein the filter glass 220 is opposite to the lens 10 of the camera module 100, and when external light passes through the filter glass 220, a part of the light in the wavelength band is filtered out, and another part of the light in the wavelength band passes through. In short, in the preferred embodiment of the present invention, the filter glass 220 has a function of filtering external stray light, so as to reduce an image formed by the external stray light on the camera module 100. Preferably, in the preferred embodiment of the present invention, the filter glass 220 is implemented as a blue glass, and stray light is prevented from entering the lens by the filter function of the blue glass.

The cover plate 200 further includes an elastic connection member 230, wherein the elastic connection member 230 connects the cover plate support 210 to the filter glass 220. It should be noted that the elastic connection member 230 of the cover plate 200 has an elastic supporting function, and can support the filter glass and allow the filter glass 220 to protrude from the cover plate support 210 of the cover plate 200.

When the camera module 100 works, the lens 10 drives the filter glass 220 of the cover plate 200 to move and extend together, at this time, the elastic structure 230 is in a stretched state, and the filter glass 220 of the cover plate 200 moves together with the lens 10 and can protrude out of the cover plate supporting member 210 of the electronic device. When the camera module 100 does not work, the lens 10 retracts, the cover plate 200 returns to the initial state under the pulling force of the elastic structure 230, at this time, the cover plate 200 retracts together with the lens 10, and the camera module 100 of the electronic device does not protrude out of the cover plate support 210. The elastic structure 230 may be rubber, glass cement, hot melt adhesive, or the like, which is not limited in this application.

Optionally, in another optional embodiment of the present invention, a surface of at least one optical lens of the lens 10 is coated with a material capable of absorbing stray light, and after light enters the lens, the unwanted stray light is filtered by the lens coated with the filter material, so as to achieve the effect of filtering the stray light. The filter material can be a filter film, and the filter film is a film layer for attenuating light intensity or changing spectral components, and is mainly used for reducing or increasing color temperature, changing wavelength, shielding unwanted light, changing color and the like.

Optionally, the surface of the photosensitive chip 322 is coated with a material having a function of absorbing stray light, so as to achieve the effect of filtering stray light. Specifically, the surface of the photosensitive chip 322 is coated with a layer of material having a function of absorbing stray light, so that the stray light can be absorbed by the light absorbing material on the surface of the photosensitive chip 322 when entering the photosensitive chip 322 through a lens, and the unwanted stray light is filtered, so as to achieve the effect of filtering the stray light.

Preferably, the lens end face of the camera module 100 is attached to the inner side face of the cover plate 200, and the lens 10 is bonded to the inner side face of the cover plate 200 by glue, so as to prevent the end face of the lens 10 from rubbing against the cover plate 200 to generate debris.

Optionally, in another optional embodiment of the present invention, the cover plate 200 is of an openable and closable structure, that is, when the camera module 100 is in an operating state, the cover plate 200 is driven by another driving mechanism to lift or open. Optionally, the cover plate 200 can be driven in the horizontal direction to open and close, so as to reduce the driving force required by the camera module 100 to drive the lens 10. Specifically, when the camera module 100 works, the cover plate 200 is driven by another driving mechanism to lift, and the lens 10 protrudes from the glass cover plate 200. When the camera module 100 is not in operation, the cover plate 200 is pressed down by another driving mechanism, and the lens 10 is pressed by the cover plate 200 to move to the bottommost position because the lens 10 is in contact with the cover plate 200. Referring to another aspect of the invention, as shown in fig. 13, the invention further provides an alternative embodiment of a circuit board assembly 32. The circuit board assembly 32 further includes a dust catching mechanism 328, wherein the dust catching mechanism 328 is used for catching movable particles such as dust, debris, etc. so as to prevent the particles such as dust, debris, etc. from being spotted and imaged on the tele camera module.

Catch dirt structure 328 and be set up in the non-photosensitive area of sensitization chip 322 is avoiding influencing when the photosensitive area of sensitization chip 322 images, can adsorb particulate matter such as dust, piece, avoid particulate matter such as dust, piece to fall the photosensitive area of sensitization chip 322 avoids producing the stain when making a video recording module 100 formation of image. Preferably, the dust-catching structure 328 is configured as a sticky ring structure, wherein the photosensitive area of the photosensitive chip is surrounded by the dust-catching structure 328.

Optionally, the dust catching structure 328 is disposed on the surface of the electronic component 323, or on the inner side of the transmission device 50, i.e. the side facing the photosensitive chip 322, which is not limited in this application. It should be noted that the structure of the dust-catching structure 328 according to the preferred embodiment of the present invention can also be applied to the camera module according to the preferred embodiment of fig. 1.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. The utility model provides a module of making a video recording suitable for electronic equipment which characterized in that includes:

a lens;

and the driving device is in transmission connection with the lens, the driving device drives the lens to move along the direction of the optical axis, so that the camera module is switched between a working state and a contraction state, and when the camera module is in the contraction state, the focal plane of the lens is positioned behind the light sensing surface of the light sensing component.

2. The camera module according to claim 1, wherein the driving device is in transmission connection with the photosensitive assembly, and the photosensitive assembly is driven by the driving device to move along a direction perpendicular to the optical axis and/or rotate around the optical axis.

3. The camera module of claim 2, wherein the photosensitive element comprises a filter element and a circuit board element, wherein the filter element is disposed above the circuit board element, and the filter element filters stray light, and the filter element comprises a filter holder and a filter mounted on the filter holder.

4. The camera module of claim 2, further comprising a transmission, wherein the transmission is disposed between the driving device and the photosensitive assembly, wherein the driving device is drivingly connected to the photosensitive assembly through the transmission.

5. The camera module according to claim 2, wherein the photosensitive assembly comprises a circuit board assembly, wherein the circuit board assembly is drivingly connected to the driving device, and the circuit board assembly is driven by the driving device to move in a specific direction and/or angle.

6. The camera module of claim 5, wherein the circuit board assembly further comprises a circuit board and a photo sensor chip, wherein the photo sensor chip is disposed on an upper surface of the circuit board.

7. The camera module of claim 6, further comprising a transmission device, wherein the transmission device is disposed between the driving device and the photosensitive assembly, wherein the driving device is drivingly connected to the circuit board of the photosensitive assembly through the transmission device.

8. The camera module of claim 2, 3 or 7, wherein the photosensitive assembly further comprises a base, wherein the base is disposed above the circuit board assembly, and the transmission device is drivingly connected to the base of the photosensitive assembly.

9. The camera module according to claim 8, wherein the base comprises a connecting end and an anti-collision end extending from the connecting end to the inside, wherein the connecting end is fixedly connected to the actuator, the anti-collision end is formed above the photosensitive chip, and the anti-collision end corresponds to a lower end of the lens.

10. The camera module of claim 2, 3 or 8, wherein the photosensitive element further comprises at least one buffer unit, wherein the buffer unit is disposed on the upper surface of the base.

11. The camera module according to claim 2, 3 or 6, wherein the photosensitive assembly further comprises a base disposed above the circuit board assembly, wherein the driving device is disposed outside the base, and the driving device is drivingly connected to the circuit board.

12. The camera module of claim 11, wherein the driving mechanism includes an optical zoom motor and an anti-shake motor, wherein the optical zoom motor drives the lens and the anti-shake motor drives the circuit board assembly.

13. The camera module according to claim 2, 3 or 6, wherein the circuit board is provided with a groove, wherein the groove is formed on an upper surface of the circuit board, and the photosensitive chip is disposed in the groove of the circuit board.

14. The camera module according to claim 2, 3 or 6, wherein the circuit board has a mounting hole, and wherein the photosensitive chip is disposed in the mounting hole of the circuit board.

15. The camera module of claim 14, wherein the circuit board assembly further comprises a stiffener, wherein the stiffener is attached to the backside of the circuit board and the photo-sensing die.

16. The camera module according to claim 2, 3 or 6, wherein the circuit board includes a circuit board main body and a support arm extending from an upper end of the circuit board main body to an inner side, the circuit board is further provided with a mounting groove, wherein the mounting groove is formed at the circuit board main body of the circuit board and the inner side of the support arm, wherein the photosensitive chip is attached to a lower side of the support arm, and the photosensitive chip is supported by the support arm to the mounting groove of the circuit board.

17. The camera module according to claim 5, wherein the circuit board assembly further comprises at least one anti-collision structure, wherein the anti-collision structure is disposed on the circuit board of the circuit board assembly and located outside the photosensitive chip, and the height of the anti-collision structure is greater than the height of the photosensitive chip.

18. The camera module of claim 8, wherein the base further comprises a base body, a bumper and a dust capture platform disposed on an upper end of the base body, wherein the bumper is located inside the dust capture platform and the bumper is opposite the lens.

19. The camera module of claim 18, wherein the dust collection platform is at a lower elevation than the crash platform.

20. The camera module according to any one of claims 3 to 7 and 17, wherein a surface of at least one optical lens of the lens is coated with a filter material, wherein the filter material may be a filter film.

21. The camera module of claim 2, 3 or 5, wherein the circuit board assembly further comprises a dust-catching mechanism, and the dust-catching mechanism is disposed in the non-photosensitive region of the photosensitive chip.

22. An electronic device, comprising:

an electronic device body and a cover plate; and

the camera module according to at least one of claims 1 to 21, wherein the camera module is disposed on the electronic device main body and covered on an inner side of the cover plate.

23. The electronic device of claim 22, wherein the cover comprises a cover support and at least one filter glass, wherein the filter glass is directly opposite the lens of the camera module, wherein the filter glass is a blue glass.

24. The electronic device of claim 23, wherein the cover further comprises a resilient connector, wherein the resilient connector connects the cover support to the filter glass.

25. The electronic device according to claim 22, wherein the cover is an openable and closable structure, and the cover is driven to be lifted or opened when the camera module is in the operating state.