CN215268448U - Camera module and terminal equipment - Google Patents

Abstract

The utility model relates to a camera module and terminal equipment, wherein, the camera module includes: a bracket including a first side and a second side opposite the first side; a camera assembly disposed on the first side of the bracket; a printed circuit board disposed on the second side of the bracket; the photosensitive chip is fixed on the printed circuit board and is circular. By adopting the circular photosensitive chip, when the photosensitive chip is installed on the printed circuit board, the principle that the long side and the short side of the photosensitive chip respectively correspond to the long side and the short side of the terminal equipment is not limited, and the installation is convenient and fast and is not easy to make mistakes; the circular photosensitive chip improves the repeated utilization rate of the camera module, and saves the design cost caused by the fact that photosensitive chips with different proportions are needed due to different length-width proportions of the terminal equipment; the camera shooting method can shoot photos or videos with any proportion even circular, and enriches the camera shooting experience of the terminal equipment.

Description

Camera module and terminal equipment

Technical Field

The utility model relates to a camera field especially relates to a camera module and terminal equipment.

Background

In a camera module in traditional terminal equipment, a photosensitive area of a photosensitive chip used by a camera is a rectangle with a ratio of 4:3, the camera is limited to be installed in a mobile phone and must be placed in a way of rotating by 90 degrees according to the principle that a long edge is opposite to a long edge and a short edge is opposite to a short edge, and the proportion of pictures shot is limited.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems in the related art, the present disclosure provides a camera module and a terminal device.

According to a first aspect of the embodiments of the present disclosure, a camera module is provided, including: a bracket including a first side and a second side opposite the first side; a camera assembly disposed on the first side of the bracket; a printed circuit board disposed on the second side of the bracket; the photosensitive chip is fixed on the printed circuit board and is circular.

In some embodiments, the camera module comprises: the near infrared filter, the near infrared filter set up in the sensitization chip with between the camera subassembly, the near infrared filter is circular.

In some embodiments, the photosensitive area of the photosensitive chip corresponds to a lens of the camera assembly, and the lens of the camera assembly is circular.

In some embodiments, the bracket is provided with a first through hole having a circular shape.

In some embodiments, the near-infrared filter is disposed on the bracket.

In some embodiments, the camera assembly comprises: a lens through which incident light is transmitted to the photo-sensing chip; and the motor drives the lens to displace so as to focus the lens.

In some embodiments, the motor is a voice coil motor.

In some embodiments, the light sensing chip is electrically connected to the printed circuit board by conductive wires or pads.

In some embodiments, the printed circuit board is any one of a hard board, a soft board, or a rigid-flex board.

According to a second aspect of the embodiments of the present disclosure, a terminal device is provided, which includes the camera module according to the first aspect.

In some embodiments, the terminal device has a display panel having a circular shape.

In some embodiments, the terminal device includes an image cropping module that crops the size of the image imaged by the photosensitive chip, so that the cropped image size is adapted to the size of the display panel of the terminal device.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: by adopting the circular photosensitive chip, firstly, when the photosensitive chip is installed on the printed circuit board, the principle that the long side of the photosensitive chip corresponds to the long side of the terminal equipment and the short side of the photosensitive chip corresponds to the short side of the terminal equipment is avoided, and the installation is convenient and fast and is not easy to make mistakes; secondly, the circular photosensitive chip improves the repeated utilization rate of the camera module, and saves the design cost caused by the fact that photosensitive chips with different proportions are needed due to different length-width proportions of the terminal equipment; finally, a photo or a video with any proportion even a circular shape can be shot, and the shooting experience of the terminal equipment is enriched.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic perspective view of a camera module according to an exemplary embodiment.

FIG. 2 is a schematic diagram illustrating a structure of a photosensitive chip and a printed circuit board according to an exemplary embodiment.

FIG. 3 is a schematic diagram of a structure of a photo-sensing chip according to an exemplary embodiment.

Fig. 4 is a schematic structural diagram illustrating a bracket in a camera module according to an exemplary embodiment.

FIG. 5 is a cross-sectional view of a stent shown according to an exemplary embodiment.

Fig. 6 is a schematic structural diagram illustrating a near-infrared filter segment according to an exemplary embodiment.

FIG. 7 is a schematic diagram illustrating a structure of a holder having a spot-faced hole according to an exemplary embodiment.

Fig. 8 is a schematic structural view illustrating a near-infrared filter at a second face of a support plate according to an exemplary embodiment.

Fig. 9 is a schematic structural view illustrating a combination of a near-infrared filter, a bracket, and a printed circuit board according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

Mobile phone photography is the field of the development of mobile phone manufacturers, and technologies such as a larger camera chip, a higher zoom factor, a faster and more accurate focusing technology, continuous zooming, a novel camera motor and the like are all the directions in which manufacturers of various mobile phones develop vigorously.

According to the embodiment of the present disclosure, a camera module is provided, and the camera module should be used for a terminal device. The terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, a watch, a bracelet and other wearable devices.

In this embodiment, the terminal device is a mobile phone. The following description will be made in detail by taking a mobile phone as an example. The camera of the mobile phone is small in structural size, high in photographing effect and capable of adapting to most severe environments in our lives.

Specifically, a camera module in a mobile phone, as shown in fig. 1, includes: camera head assembly 10, support 20, photo-sensing chip 30 (not shown in fig. 1), and printed circuit board 40.

Wherein, the theory of operation of camera module mainly is: light reflected by an object penetrates through the lens 11 of the camera assembly 10 and is projected onto the photosensitive chip 30 to form an optical image, the photosensitive chip 30 converts the optical image into an electric signal, the electric signal is converted into a digital image signal through an analog-to-digital (A/D) converter, and the digital image signal is finally converted into a complete image after being processed by a Digital Signal Processor (DSP) and a processor (CPU) in the mobile phone in sequence and is displayed through a display panel of the mobile phone.

The photosensitive chip 30 is one of the core structures of the camera module. The photo-sensing chip 30 receives light from the lens 11 and converts these light signals into electrical signals. The photosensitive chips 30 of the camera module mainly include two types, one is a CCD chip, and the other is a CMOS chip.

In one embodiment, as shown in FIG. 2, the photosensitive chip 30 may be secured to a printed circuit board 40. The photosensitive chip 30 is fixed on the printed circuit board 40, so that the photosensitive chip 30 can be prevented from shaking. When the photosensitive chip 30 is fixed on the printed circuit board 40, the photosensitive area of the photosensitive chip 30 is disposed toward the camera module 10.

In one embodiment, the printed circuit board 40 may be any one of a hard board, a soft board, or a rigid-flex board.

In one embodiment, the photosensitive chip 30 may be electrically connected to the printed circuit board 40 by a conductive wire.

In another embodiment, the photosensitive chip 30 may be soldered to the printed circuit board 40 by a pad or a metal bump. The bonding pads or metal bumps are made of composite metal by electroplating at the aluminum bonding points on the front surface of the photosensitive chip 30. The bonding pad or the metal bump may be made of copper-tin material, copper-silver, copper-tin-silver, copper-nickel-tin, copper-nickel-silver, copper-nickel-tin-silver, or the like. The specific operation and process of fixing the photosensitive chip on the printed circuit board 40 belong to the prior art, and are not described herein.

In one embodiment, a side of the photo sensor chip 30 facing the lens 11 is provided with a photo sensing area. The larger the photosensitive area of the photosensitive chip 30 is, the more light is captured, the better the photosensitive performance is, the lower the signal-to-noise ratio is, the more color is naturally generated in the imaging effect, however, the larger the photosensitive chip 30 can cause the increase of the volume, weight and cost of the mobile phone.

In one embodiment, as shown in FIG. 3, the photo sensor chip 30 may be circular in shape. When the photosensitive chip 30 has a circular shape, the photosensitive area may have a square shape or a circular shape. In one embodiment, the photo-sensing chip 30 has a circular shape and the photo-sensing area has a circular shape. The circular photosensitive chip 30 can make the final image or video to be circular, so as to maximize the imaging area.

In one embodiment, as shown in fig. 4, the bracket 20 is provided with a first through hole 21. The first through hole 21 is used for transmitting light, and light reflected by an external object can be projected onto the photosensitive chip 30 (specifically, the photosensitive area of the photosensitive chip 30) after passing through the camera assembly 10 and the first through hole 21 of the bracket 20 due to the first through hole 21. Thus, the first through hole 21 corresponds to a photosensitive region of the photosensitive chip 30.

In one embodiment, the first through hole 21 covers the light sensing area of the light sensing chip 30, so that the light entering through the camera assembly 10 can be prevented from being blocked by the first through hole 21.

In one embodiment, the first through hole 21 may have a circular shape. The circular first through hole 21 may maximize the light transmitted through the lens 11 to be projected to the photosensitive area of the photosensitive chip 30.

As shown in fig. 5, the bracket 20 includes a first side 22 and a second side 23 opposite the first side 22. The camera head assembly 10 may be disposed on a first side 22 of the frame 20. The printed circuit board 40 may be disposed on the second side 23 of the bracket 20. The bracket 20 is used to fix and support the camera assembly 10 and to separate the camera assembly 10 from the printed circuit board 40.

On one hand, the camera module 10 is prevented from directly touching the photosensitive chip 30 on the printed circuit board 40, so as to prevent the camera module from damaging the photosensitive chip 30 or the photosensitive chip 30 from scratching the lens of the lens 11. On the other hand, the first through hole 21 is formed in the bracket 20, and light reflected by the external object can be projected onto the photosensitive chip 30 after passing through the camera assembly 10 and the first through hole 21, and can be finally imaged.

As further shown in fig. 5, the support frame 20 includes a support plate 24 and a support sidewall 25, and the support sidewall 25 is connected to and perpendicular to the support plate 24. The support plate 24 includes opposing first and second faces 241, 242, the support sidewall 25 includes opposing first and second ends 251, 252, and the first end 251 of the support sidewall 25 is secured to the second face 242 of the support plate 24. The receiving space 26 is formed between the inner wall of the supporting sidewall 25 and the second face 242 of the supporting plate 24.

The support plate 24 and the support sidewall 25 of the bracket 20 may be formed as an integral structure or may be formed by assembling, and are not limited herein.

In one embodiment, the printed circuit board 40 abuts the second end 252 of the support sidewall 25 of the cradle 20. As can be seen from the above, the photosensitive chip 30 is fixed on the printed circuit board 40, and the photosensitive area of the photosensitive chip 30 is disposed close to the camera module 10. Therefore, the photosensitive chip 30 is located in the accommodating space 26. The photosensitive chip 30 is located in the accommodating space 26, and when the photosensitive chip 30 falls off the printed circuit board 40, the photosensitive chip 30 can be prevented from moving in the terminal device space.

In addition, the holder 20 has an accommodating space 26, so that a predetermined imaging distance is formed between the lens 11 and the photosensitive chip 30 in the camera module 10. The accommodating space 26 has a certain height, which can increase the distance between the camera assembly 10 and the photosensitive chip 30, and prevent the camera assembly 10 from damaging the photosensitive chip 30 or the photosensitive chip 30 from scratching the lens of the lens 11 in the camera assembly 10 when the camera module is deformed under pressure.

In the above embodiment, when the support 20 includes the support plate 24 and the support sidewall 25, the first through hole 21 is disposed on the support plate 24 of the support 20, the first through hole 21 penetrates through the support plate 24 of the support 20, the optical image formed on the photosensitive chip 30 is converted into an electrical signal by the photosensitive chip 30, the electrical signal is converted into a digital image signal by an a/D (analog to digital converter), and the digital image signal is processed by a DSP (digital signal processing chip) and a processor (CPU) in the mobile phone, and finally converted into a complete image and displayed on the display panel of the mobile phone.

It should be noted that the structure of the support frame 20 in the above embodiments relates to the support plate 24 and the support sidewall 25, which are only exemplary structures and are not intended to limit the specific structure of the support frame 20. In some embodiments, the stand 20 may also function to protect the camera assembly 10 in addition to supporting the camera assembly 10. Thus, the structure of the bracket 20 can be modified according to design requirements and accordingly changed.

Further, the first through hole 21 of the holder 20 in the above-described embodiment may be provided coaxially with the lens 11 of the camera head assembly 10, or may be provided non-coaxially. That is, a mirror is disposed between the lens 11 and an optical path of the photo chip 30, and reflects light incident from the lens 11, and changes an angle of incident light so that the light can be presented onto the photo chip 30. The reflective mirror may be disposed on the bracket 20, or may be disposed at another position inside the bracket 20, which is not limited herein.

In one embodiment, the light sensing area of the light sensing chip 30 corresponds to the lens 11 of the camera head assembly 10, which means that the positions of the two correspond. Specifically, the axis of the lens 11 of the camera assembly 10 is perpendicular to the photosensitive chip 30 and passes through the center of the photosensitive area of the photosensitive chip 30.

In one embodiment, the lens 11 of the camera assembly 10 is circular. Since the lens 11 is circular, the first through hole 21 is circular, and the photosensitive chip 30 is circular, the reflected light of the external object can be maximally presented in the photosensitive area of the circular photosensitive chip 30 after the reflected light of the external object sequentially passes through the lens 11 and the first through hole 21 of the camera assembly 10.

In the above, the more light that can be captured by the circular photosensitive chip 30 without increasing the area of the photosensitive chip 30, the better the photosensitive performance, and the lower the signal-to-noise ratio, the more natural and excellent imaging effect is exhibited.

As can be seen from the above, the photosensitive chip 30 at the center of the circle can make the final image or video to be a circle. The terminal device may include an image cropping module, and the image cropping module may be controlled by a processor (CPU) of the terminal device according to the size of the display panel of the terminal device or the shooting requirement, so as to crop the size of the image or video imaged by the circular photosensitive chip 30 into a photo or video with any proportion.

Further, taking the imaged circular image as an example, the imaged circular image is inscribed, and a square image with any proportion, such as 1:1, 3:2, 16:9 or 4:3, can be formed. The imaged circular image is cut into a circular image with any size by concentric circle cutting.

Although the square photosensitive chip 30 can also generate a round or other proportion photo by clipping, the round chip and the square chip are placed at the same position, the area of the round chip is larger than that of the square chip, and after an image is generated, the imaging effect of the round chip is clearer than that of the square chip. Thus, the round imaging cropping has a greater imaging sharpness for the square image than the square imaging cropping.

In addition, when the circular photosensitive chip 30 is mounted on the printed circuit board 40, the principle that the long side of the photosensitive chip 30 corresponds to the long side of the terminal device and the short side of the photosensitive chip 30 corresponds to the short side of the terminal device is not limited, so that the mounting is convenient and the error is not easy to occur.

In addition, the circular photosensitive chip 30 can be applied to terminal devices with any proportion, and is not limited by the length-width proportion of the terminal devices and the shape structure of the terminal devices, so that the application range and the reuse rate of the photosensitive chip 30 are improved, and the design cost of designing different photosensitive chips 30 corresponding to different terminal devices is saved.

In summary, the present disclosure adopts the circular photosensitive chip 30, and firstly, when the photosensitive chip 30 is installed on the printed circuit board 40, the long side of the photosensitive chip 30 is no longer limited to correspond to the long side of the terminal device, and the short side of the photosensitive chip 30 corresponds to the short side of the terminal device, so that the installation is convenient and the error is not easy to occur.

Secondly, circular shape sensitization chip 30 has improved the reuse rate of camera module, has practiced thrift because of terminal equipment length and width ratio difference and need the not produced design cost of proportion sensitization chip 30.

Finally, a photo or a video with any proportion even a circular shape can be shot, and the shooting experience of the terminal equipment is enriched.

In one embodiment, as shown in fig. 1, the outer contour of the camera head assembly 10 is square, the outer contour of the bracket 20 is square (i.e. the outer contour of the support plate 24 of the bracket 20 is square), and the outer contour of the portion of the printed circuit board 40 corresponding to the bracket 20 and the camera head assembly 10 is also square.

The outer dimensions of the camera assembly 10, the bracket 20 and the printed circuit board 40 are aligned up and down. The square camera module structure of aligning from top to bottom makes the overall structure of camera module regular, avoids the protrusion of unnecessary structure and part to cause that the size in the inside horizontal space of cell-phone occupies and the size in vertical space piles up.

In some embodiments, as further shown in FIG. 1, camera head assembly 10 includes: a lens 11 and a motor 12. The incident light is transmitted to the photosensitive chip 30 through the lens 11. The light reflected by the object can be finally imaged to the photosensitive area of the photosensitive chip 30 through the lens 11.

The lens 11 is used to support the transmission of the light reflected by the object of interest, so that the transmitted light is projected onto the photosensitive chip 30. The lens 11 is similar to the lens of the eye, and the lens 11 usually consists of several lenses, and when the optical signal passes through, the lenses can filter stray light (infrared rays and the like) layer by layer, so that the imaging is more real as the number of the lenses 11 is larger.

In addition, the lens 11 has two more important parameters: aperture and focal length. The aperture is a device which is arranged on the lens 11 and controls the light quantity reaching the sensor through the lens 11, the aperture has the function of controlling the depth of field besides controlling the light flux, the aperture is larger, the depth of field is smaller, and the background obscuration effect is embodied as small depth of field when people take a portrait at ordinary times. The depth of field is a range of the front-rear distance of the subject measured by imaging of a clear image that the camera lens 11 can go.

The focal length is the distance from the center point of the lens 11 to the sharp image formed on the plane of the photosensitive chip 30. According to the imaging principle, the focal length of the lens 11 determines the size of the image formed on the sensor by the object photographed by the lens 11. For example, when shooting the same object, the longer the focal length is, the larger the image or video of the object can be shot, and the longer the focal length is similar to a telescope.

The motor 12 drives the lens 11 to displace so that the lens 11 is focused. In one embodiment, the motor 12 may have a second through hole in which the lens 11 is located. The motor 12 drives the position of the lens 11 in the second through hole, and is used for adjusting the position of the lens 11 and focusing.

In some embodiments, the Motor 12 is a Voice Coil Motor (VCM) 12. The voice coil motor 12 is used for focusing, the mobile phone camera widely uses the VCM to realize a focusing function (automatic focusing or manual focusing), the position of the lens 11 can be adjusted by the VCM, and the lens 11 can be easily moved to obtain a clear picture, so as to present a clear image.

The main principles of the voice coil motor 12 are: in a magnetic field, the extension position of the spring plate is controlled by changing the DC current of the coil in the motor 12, so as to drive the lens 11 to move in the second through hole. In addition, when the terminal device is a full-screen, the camera assembly 10 is hidden in the terminal device, and when a user needs to take a picture, the voice coil motor 12 can also be used for driving the lens 11 to pop out of a display panel of the terminal device.

In some embodiments, the camera module includes a near-infrared filter 50 (IR sheet).

Further, the near infrared filter 50 is used for filtering out redundant infrared light and ultraviolet light, so that the color of the photographed picture is closer to the color seen by human eyes. Natural light is mainly sunlight, and light has particle properties and wave properties, and is classified into rays, ultraviolet rays, visible rays, infrared rays, microwaves, and industrial waves according to the wavelength of light.

The near infrared filter 50 is also a color separation filter, and there are two color separation methods, one is an RGB primary color separation method, and the other is a CMYK complementary color separation method.

When the camera module is colored, the photosensitive chip 30 of the color camera module can sense infrared rays, but the infrared rays are no longer in the visible light range, which can cause the DSP (digital signal processing chip) to be unable to calculate the correct color. Therefore, it is necessary to add a near infrared filter 50 to filter out the infrared part of the light. When the camera module is black and white, the near infrared filter 50 is not needed.

In one embodiment, the near-infrared filter 50 is disposed between the photo-sensing chip 30 and the camera assembly 10. Further, as shown in fig. 6, the near-infrared filter 50 has a circular shape. The circular near-infrared filter 50 is used to ensure that light enters the photosensitive area of the photosensitive chip 30 efficiently and maximally.

In one embodiment, the near-infrared filter 50 is provided on the bracket 20. In the above embodiment, the bracket 20 has the support plate 24 and the support side wall 25. The near-infrared filter 50 may be provided on the first face 241 of the support plate 24 of the holder 20, and may also be provided on the second face 242 of the support plate 24.

When the circular near-infrared filter 50 is mounted on the support plate 24 of the bracket 20, the side length of the near-infrared filter 50 does not need to be aligned according to the principle that a long side is aligned with a long side, and a short side is aligned with a short side.

When the light sensing area of the light sensing chip 30 corresponds to the lens of the camera assembly 10, and when the near infrared filter 50 is disposed on the first face 241 of the support plate 24. The near-infrared filter 50 is disposed near the camera assembly 10, and at this time, the near-infrared filter 50 is located at the lowermost end in the lens 11.

Specifically, as shown in fig. 7, the first surface 241 of the support plate 24 is provided with a spot-faced hole 243. The spot-facing hole 243 and the first through hole 21 are coaxial, and a stepped hole is formed between the spot-facing hole 243 and the first through hole 21. The near-infrared filter 50 is located in the spot-facing hole 243, thereby avoiding the influence of the near-infrared filter 50 on the movement of the lens 11 in the second through hole.

When the light sensing area of the light sensing chip 30 corresponds to the lens of the camera assembly 10, and when the near-infrared filter 50 is disposed on the second face 242 of the support plate 24. The near-infrared filter 50 is disposed near the photosensitive chip 30, and at this time, the near-infrared filter 50 is located in the accommodating space 26. When the near-infrared filter 50 is located in the accommodating space 26, a counter-sunk hole 243 may be formed in the second surface 242 of the support plate 24, so that the near-infrared filter 50 is located in the counter-sunk hole 243.

In one embodiment, the spot-facing hole 243 on the first surface 241 or the second surface 242 may be square, circular, or any other shape. Since the near-infrared filter 50 has a circular shape, the counter-bored hole 243 may have a circular shape. The process for machining the circular counter-boring hole 243 is simpler; thereby reducing the process costs of production and installation.

In some embodiments, near-infrared filter 50 may be attached to bracket 20. Specifically, as shown in fig. 8, the edge of the near-infrared filter 50 is attached to the second face 242 of the support plate 24 by glue. The near-infrared filter 50 is attached to the second surface 242 of the support plate 24 in an attaching manner, so that the operation and the process are simple and easy to realize.

Further, the near-infrared filter 50 may cover the first through hole 21. Inside if getting into the dust of accommodation space 26 of camera module can directly influence the last formation of image, form the shadow on the image of last formation of image, along with the gradual reduction of sensitization chip 30 size, the influence in the shadow area that the dust formed can enlarge gradually, seriously influences the production yield of camera module.

After the near-infrared filter 50 covers the first through hole 21, as shown in fig. 9, the accommodating space 26 is formed by the near-infrared filter 50 and the printed circuit board 40 to form a relatively sealed space. Dust in the peripheral circuit components and the like cannot enter the photosensitive area of the photosensitive chip 30, thereby protecting the photosensitive chip 30 located in the accommodating space 26.

In addition, the sealed accommodating space 26 can prevent dust generated during the relative movement of the lens 11 and the motor 12 from falling into the photosensitive area of the photosensitive chip 30. In a word, the sealed accommodating space 26 can allow dust to enter the accommodating space 26 and form a dark image area in the photosensitive area of the photosensitive chip 30, so that the production yield of the mobile phone camera module is improved.

It should be noted that the above embodiment is described with respect to an embodiment in which the support has a structure with the support plate 24 and the support sidewall 25, and the light sensing area of the light sensing chip 30 corresponds to the lens of the camera head assembly 10 (i.e. the axis of the lens 11 of the camera head assembly 10 is perpendicular to the light sensing chip 30).

In some embodiments, the first through hole 21 of the bracket 20 may be disposed non-coaxially with the lens 11 of the camera head assembly 10. That is, a mirror is disposed between the lens 11 and an optical path of the photo chip 30, and reflects light incident from the lens 11, and changes an angle of incident light so that the light can be presented onto the photo chip 30.

It can be seen that the optical path from the lens 11 of the camera assembly 10 to the photo-sensing chip 30 may not be straight. Therefore, the fact that the near-infrared filter 50 is provided between the photosensitive chip 30 and the camera module 10 means that the near-infrared filter 50 is positioned between the photosensitive chip 30 and the camera module 10 on the optical path.

Based on the same conception, the embodiment of the disclosure also provides a terminal device, and the terminal device comprises the camera module. As can be seen from the above, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, a translator, a watch, a bracelet, or other wearable device. In this embodiment, the terminal device is a mobile phone. The cell phone may be square, circular or oval.

In some embodiments, the terminal device has a display panel in a circular shape. Further, the terminal device is circular. When the terminal device is a mobile phone, the outline of the mobile phone and the display panel of the mobile phone can be circular. The circular mobile phone is provided with a circular display panel, a circular middle frame, a circular back shell and the like.

The circular mobile phone corresponds to the circular photosensitive chip 30, and after the photosensitive chip 30 is imaged, a photo or a video is directly displayed on the circular display panel without being cut, so that the photo or the video shot by the camera module is maximally displayed in the circular mobile phone. In addition, the camera module is not limited to the field of mobile phones and can be expanded to the fields of monitoring, vehicle-mounted and the like.

It is understood that the terminal device provided by the embodiments of the present disclosure includes a hardware structure and/or a software module for performing the above functions. The disclosed embodiments can be implemented in hardware or a combination of hardware and computer software, in combination with the exemplary elements and algorithm steps disclosed in the disclosed embodiments. Whether a function is performed as hardware or computer software drives hardware depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

With regard to the apparatus in the above embodiments, the specific manner in which each module performs operations has been described in detail in the embodiments related to the camera module, and will not be described in detail here.

It is understood that "a plurality" in this disclosure means two or more, and other words are analogous. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms "first," "second," and the like are used to describe various information and that such information should not be limited by these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the terms "first," "second," and the like are fully interchangeable. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "central," "longitudinal," "lateral," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present embodiment and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation.

It will be further understood that, unless otherwise specified, "connected" includes direct connections between the two without the presence of other elements, as well as indirect connections between the two with the presence of other elements.

It is further to be understood that while operations are depicted in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order shown or in serial order, or that all illustrated operations be performed, to achieve desirable results. In certain environments, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is to be limited only by the scope of the appended claims.

Claims (12)

1. The utility model provides a camera module which characterized in that includes:

a bracket including a first side and a second side opposite the first side;

a camera assembly disposed on the first side of the bracket;

a printed circuit board disposed on the second side of the bracket;

the photosensitive chip is fixed on the printed circuit board and is circular.

2. The camera module of claim 1, wherein the camera module comprises: the near infrared filter, the near infrared filter set up in the sensitization chip with between the camera subassembly, the near infrared filter is circular.

3. The camera module as claimed in claim 1, wherein the light-sensing area of the light-sensing chip corresponds to the lens of the camera assembly, and the lens of the camera assembly is circular.

4. The camera module according to claim 1, wherein the bracket is provided with a first through hole having a circular shape.

5. The camera module of claim 2, wherein the near infrared filter is disposed on the bracket.

6. The camera module of claim 1, wherein the camera assembly comprises:

a lens through which incident light is transmitted to the photo-sensing chip;

and the motor drives the lens to displace so as to focus the lens.

7. The camera module of claim 6, wherein the motor is a voice coil motor.

8. The camera module of claim 1, wherein the photo sensor chip is electrically connected to the printed circuit board through a conductive wire or a bonding pad.

9. The camera module according to any one of claims 1 to 8, wherein the printed circuit board is any one of a hard board, a soft board, or a rigid-flex board.

10. A terminal device, characterized in that it comprises a camera module according to any one of claims 1-9.

11. A terminal device according to claim 10, characterized in that the terminal device has a display panel with a circular shape.

12. The terminal device according to claim 10, wherein the terminal device comprises an image cropping module that crops the size of the image imaged by the photosensitive chip so that the size of the cropped image is adapted to the size of the display panel of the terminal device.

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