CN114696861A - Circuit board impedance adjusting method and device - Google Patents

Circuit board impedance adjusting method and device Download PDF

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Publication number
CN114696861A
CN114696861A CN202011583071.0A CN202011583071A CN114696861A CN 114696861 A CN114696861 A CN 114696861A CN 202011583071 A CN202011583071 A CN 202011583071A CN 114696861 A CN114696861 A CN 114696861A
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impedance
value
line
line width
preset
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Inventor
刘振波
林淡填
杨中瑞
李智
韩雪川
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
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Priority to CN202011583071.0A priority Critical patent/CN114696861A/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The application discloses a method and a device for adjusting impedance of a circuit board. According to the impedance value, the thickness and the line width of the impedance line on the circuit board are obtained, the preset line width value of the impedance line when the impedance value is preset is obtained under the condition that the thickness of the impedance line is kept unchanged according to the impedance value formula, the line width of the impedance line is adjusted according to the preset line width value and the line width value, the impedance of the circuit board is adjusted to be matched with the preset impedance value, the occurrence frequency that the impedance line on the circuit board cannot normally realize the function of the impedance line due to impedance mismatching is effectively reduced, and the condition that a user signal is distorted in a high-frequency and high-speed signal transmission circuit is avoided. In addition, the impedance of the circuit board is adjusted by adjusting the line width of the impedance line according to the line width value of the impedance line and the preset line width value, and the circuit board is simple and accurate to operate.

Description

Circuit board impedance adjusting method and device
Technical Field
The present disclosure relates to the field of circuit board processing, and more particularly, to a method and an apparatus for adjusting impedance of a circuit board.
Background
In daily life, a mobile phone, a tablet, a computer and the like are contacted every day, the core of the mobile phone, the tablet, the computer and the like is a circuit board, and impedance matching cannot be achieved in the production of the circuit board.
With the development of high speed and high frequency of communication products, the application scene of high frequency and high speed data transmission is more and more common. In the application scenario of such high-frequency and high-speed data transmission, the indexes related to data transmission loss, such as the impedance of the circuit board, must be controlled. Meanwhile, the circuit board is also miniaturized and highly integrated, and the requirements for indexes related to signal loss, such as circuit board impedance, are also higher and higher.
However, with the improvement of functional requirements of markets and consumers, the structure of the current product is more and more complex, and the outer layer copper foil of the circuit board needs to be electroplated for multiple times, so that the line width and the line thickness precision of the outer layer are difficult to control, and the impedance of the circuit board, particularly the impedance of the outer layer, is more and more difficult to control. Moreover, once the impedance of the outer layer of the circuit board is not satisfactory, high-frequency and high-speed signals are distorted and loss caused by reflection is caused.
Disclosure of Invention
The application provides a method and a device for adjusting impedance of a circuit board, which aim to solve the problem that the impedance of the circuit board is difficult to control in a required range.
In order to solve the technical problem, the application adopts a technical scheme that: a circuit board impedance adjusting method is provided, and the adjusting method comprises the following steps: obtaining a measured impedance value, a thickness value and a line width value of an impedance line of a circuit board; calculating to obtain an impedance coefficient according to an impedance value formula, the measured impedance value, the thickness value and the line width value; calculating to obtain a preset line width value of the impedance line at the preset impedance value according to the preset impedance value of the impedance line and by combining the thickness value and the impedance coefficient; and adjusting the line width of the impedance line according to the preset line width value so as to adjust the impedance of the impedance line.
Further, adjusting the line width of the impedance line according to the preset line width value to adjust the impedance of the impedance line, including: calculating to obtain an absolute value of a difference value between the preset line width value and the line width value; and adjusting the line width of the impedance line by using a 3D technology, wherein the adjustment value is equal to the absolute value.
Further, adjusting the line width of the impedance line by using a 3D technique, where the adjustment value is equal to the absolute value, includes: determining that the difference value between the preset line width value and the line width value is a positive value; and increasing and adjusting the line width of the impedance line through 3D printing.
Further, adjusting the line width of the impedance line by using a 3D technique, where the adjustment value is equal to the absolute value, includes: determining that the difference value between the preset line width value and the measured line width is a negative value; and performing reduction adjustment on the line width of the impedance line by using 3D etching.
Further, the line width of the impedance line is subjected to reduction adjustment using 3D etching, including: and 3D etching the resistance line by using an etching solution containing copper chloride to reduce the line width.
Further, after performing line width reduction adjustment on the impedance line using 3D etching, the method further includes: and cleaning the circuit board to wash away the etching solution.
Further, adjusting the line width of the impedance line according to the preset line width value to adjust the impedance of the impedance line, including: calculating to obtain an adjustment value according to the difference between the preset line width value and the line width value; if the adjustment value is a positive value, performing line width increasing processing on the impedance line; if the adjustment value is negative, the line width of the impedance line is reduced.
Further, the impedance value formula is:
Figure BDA0002866334380000021
wherein Z is0Is an impedance value, εrIs the relative dielectric constant of the material, b is the dielectric thickness, t is the thickness of the impedance line, W is the line width, and c is the impedance coefficient.
Further, obtaining the measured impedance value, the thickness value and the line width value of the impedance line of the circuit board includes: obtaining a measured impedance value of an impedance line of the circuit board; judging whether the measured impedance value of the impedance line is within a preset range or not; if the measured impedance value is not within the preset range, continuously obtaining the thickness value and the line width value of the impedance line so as to calculate and obtain a preset line width value of the impedance line at the preset impedance value, and adjusting the line width of the impedance line according to the preset line width value and the line width value.
Further, the preset impedance value is a specific value; judging whether the measured impedance value of the impedance line is within a preset range or not, including: calculating a difference value between the measured impedance value of the impedance line and a preset impedance value of the impedance line; and judging whether the difference value is within a preset range.
Further, the preset impedance value is a range of values; the preset range is the numerical range.
In order to solve the above technical problem, another technical solution adopted by the present application is: a circuit board impedance adjusting device is provided. This circuit board impedance adjustment device includes: a detection unit for obtaining parameters of the impedance line; the processing unit is connected with the detection unit, receives the parameters detected and obtained by the detection unit, and processes the parameters to obtain a preset line width value of the impedance line; and the execution unit is connected with the processing unit and adjusts the line width of the impedance line according to the preset line width value of the impedance line.
The beneficial effect of this application is: different from the situation of the prior art, the present application provides a method for adjusting impedance of a circuit board, which obtains an impedance value, a thickness value, and a line width value of an impedance line on the circuit board, calculates a related coefficient according to an impedance value formula, calculates a preset line width value of the impedance line at the preset impedance value according to a preset impedance value and the coefficient of the impedance line under the condition of keeping the thickness of the impedance line unchanged, and adjusts the line width of the impedance line according to the preset line width value and the line width value to match the impedance of the circuit board with the preset impedance value, thereby effectively reducing the occurrence of a phenomenon that the impedance line on the circuit board cannot normally realize the function due to impedance mismatching, such as: the condition that the transmission signal distortion or reflection of the user signal in the high-frequency and high-speed signal transmission circuit causes loss is avoided. In addition, the impedance of the circuit board is adjusted by adjusting the line width of the impedance line according to the line width value of the impedance line and the preset line width value, and the circuit board is simple and accurate to operate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the embodiments and the drawings used in the description of the prior art, and obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts.
Fig. 1 is a schematic flow chart of a first embodiment of a method for adjusting impedance of a circuit board provided in the present application;
FIG. 2 is a schematic cross-sectional view of an impedance line on a circuit board provided by the present application;
FIG. 3 is a schematic cross-sectional view of another impedance line on a circuit board provided herein;
fig. 4 is a schematic flowchart of a second embodiment of a method for adjusting impedance of a circuit board provided in the present application;
FIG. 5 is a schematic process diagram of an embodiment of line width increase adjustment in the present embodiment;
FIG. 6 is a schematic process diagram of an embodiment of adjusting the line width reduction in the present embodiment;
fig. 7 is a schematic flowchart of a third embodiment of a method for adjusting impedance of a circuit board according to the present application;
fig. 8 is a schematic structural diagram of an embodiment of a device for adjusting impedance of a circuit board according to the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments without conflict. The following are detailed descriptions of the respective embodiments.
The circuit board in the present application may also be referred to as a circuit board or a printed circuit board, a PCB, an FPC, or the like, and refers to a circuit board including a circuit having a requirement for impedance, such as a radio frequency line, a signal line, or the like. A plurality of impedance lines, including impedance lines of various specifications, are generally designed on the same circuit board, and the impedance lines are distributed in various areas on the circuit board. The impedance of the circuit board has a great influence on the transmission of signal data. Therefore, the impedance line on the circuit board is set with a preset impedance value according to the requirement. According to the preset impedance value, parameters such as corresponding line width, line thickness and the like are designed in advance. However, in the actual processing process, due to the influence of the actual processing technology, the parameters of the impedance line, such as the line width, the line thickness, and the like, cannot be precisely matched with those designed in advance, so that the impedance of the impedance line obtained by influencing the processing may not be matched with the preset impedance value. If the impedance of the impedance line is not adjusted and used directly, distortion and reflection loss of high-frequency and high-speed signals of the circuit board may be caused. The application provides a circuit board impedance adjusting method and device, so as to adjust the impedance of the impedance line. It is understood that the present application uses impedance to collectively refer to various impedances, including characteristic impedances, of the wiring board.
Referring to fig. 1, fig. 1 is a schematic flow chart of a first embodiment of a method for adjusting impedance of a circuit board provided in the present application, which specifically includes:
s101: and obtaining the measured impedance value, the thickness value and the line width value of the impedance line of the circuit board.
In this embodiment, the impedance of the circuit board is measured, and the measured impedance value of the impedance line on the circuit board is obtained. Specifically, a conductive layer on the circuit board is etched to form a conductive circuit, wherein the conductive layer may be a copper layer. The conductive line needs to control its impedance, called an impedance line, such as a signal line or an rf line. The same circuit board can contain impedance lines with various specifications, and it can be understood that each impedance line with various specifications on the circuit board needs to test the impedance and adjust the impedance; the impedance adjusting method of the impedance line with each specification is the same.
When impedance measurement is performed, if there are a plurality of impedance lines of the same specification, to avoid a test error, a plurality of test areas on the circuit board may be selected for performing impedance test, where the test areas may be a plurality of areas evenly distributed on the circuit board, for example, areas in the middle and four corners of the circuit board are selected.
In addition, the thickness and the line width of the circuit board are measured to obtain the thickness value and the line width value of the impedance line on the circuit board. For the cross section of the impedance line, the thickness is a length value perpendicular to the plane direction of the circuit board, and the line width is a length value parallel to the plane of the circuit board.
For example, referring to fig. 2, fig. 2 is a schematic cross-sectional view of an impedance line on the circuit board provided by the present application, where the thickness value is t and the line width value is W. In the processing process, the cross section of the impedance line formed by etching may not be a regular rectangle, and the line width at each position may not be completely the same in the direction from the upper surface to the lower surface of the cross section, and there is a certain fluctuation. Referring to fig. 3, fig. 3 is a schematic cross-sectional view of another impedance line on the circuit board provided by the present application. The impedance line may be approximately trapezoidal in cross-section, including an upper surface L1 and a lower surface L2. The line width value W1 of the upper surface L1 and the line width value W2 corresponding to the lower surface L2 are obtained, and at this time, the line width value of the impedance line is an average value of the line width value W1 and the line width value W2, that is, (W1+ W2)/2. When the cross section of the impedance line is in a regular shape, the line width W can be obtained by measurement and corresponding calculation according to the specific shape. And when the cross section of the impedance line is in an irregular shape, a corresponding width model can be established according to the etching processing capacity, and the width model comprises a line width uniformity coefficient. And measuring the line width of the upper surface or the lower surface of the cross section of the impedance line, and calculating the line width and the uniformity coefficient of the upper surface or the lower surface to obtain the line width W of the impedance line. The line width value calculation method for establishing the corresponding width model and increasing the line width uniformity coefficient is also suitable for obtaining the line width value of the impedance line with the section in the regular shape.
S102: and calculating to obtain the impedance coefficient according to the impedance value formula, the measured impedance value, the thickness value and the line width value.
Specifically, in some embodiments, the impedance value is formulated as:
Figure BDA0002866334380000071
wherein Z is0Is an impedance value, εrThe relative dielectric constant, b is the dielectric thickness, t is the thickness value of the impedance line, W is the line width value, and c is the impedance coefficient.
And substituting the obtained measured impedance value, thickness value and line width value of the impedance line into a formula, and calculating the impedance coefficient c. The impedance coefficient c is related to impedance, and also related to the actual processing technology and the processing field. The impedance coefficient c is used for the correlation calculation in the impedance adjustment and is used for adjusting the impedance of the impedance line by the line width, and therefore, may be referred to as a line width adjustment coefficient. Relative dielectric constant epsilon in impedance value formularThe dielectric material is related to the dielectric material on the circuit board, is a physical parameter for representing the dielectric property of the dielectric material, is a design theoretical value and cannot change along with the processing process. The dielectric thickness b is also related to the dielectric layer, is the dielectric thickness between the circuit layer where the impedance line is located and the grounding layer or the outer layer, and is a design theoretical value; of course, the measurement can be obtained after the production of the circuit board is finished. Therefore, in general, for an impedance line, the relative dielectric constant and the dielectric thickness are both medium-related parameters and are designed to be theoretical fixed values.
The impedance value formula in this embodiment is suitable for a specific processing site, and is not limited to be calculated according to the impedance formula. The processing capability can correspondingly adjust the impedance formula according to different processing sites.
It will be appreciated that the impedance lines may be of different types in practice, for example, the signal lines (collectively referred to as impedance lines in this application where signal line to impedance is required) include microstrip lines (microstrips) and striplines (stripelines). Different types of impedance lines may have different impedance formulas and therefore, in other embodiments, other impedance formulas may be used for calculation, knowing that the impedance value is related to the line width and the thickness of the line.
S103: and calculating to obtain a preset line width value of the impedance line at the preset impedance value according to the preset impedance value of the impedance line and by combining the thickness value and the impedance coefficient.
Generally, before the impedance line is processed, the impedance line is designed according to the use scenario and requirements of the impedance line, including the shape, length, and position of the impedance line, and parameters of the impedance value, line width, and thickness of the impedance line. The designed impedance value is the preset impedance value. When the impedance value of the impedance line reaches a preset impedance value, the function of the impedance line can be normally realized. If the impedance value of the impedance line does not reach the predetermined impedance value, a specific high-frequency or high-speed signal may not be transmitted, or signal distortion may be caused although the signal is transmitted. However, in actual production and processing, due to process and processing errors, the processed impedance line cannot strictly meet the requirements of parameters such as designed line width and thickness, and the impedance value of the impedance line is affected.
Therefore, in this embodiment, the impedance coefficient c and the preset impedance value when the impedance value is designed as needed are calculated according to the impedance value formula, and the preset line width value of the impedance line when the impedance value is preset can be calculated without changing the thickness of the impedance line. And adjusting the line width of the impedance line according to the preset line width value so as to adjust the impedance of the impedance line. It will be appreciated that once the circuit board is successfully processed, the thickness adjustment is complicated. Therefore, in the present embodiment, the thickness of the resistance line is kept constant.
It is understood that in other embodiments, the impedance value of the impedance line may be adjusted by changing the thickness t of the impedance line. That is, the line width of the resistance line is kept constant, and the resistance of the resistance line is changed by changing the thickness of the resistance line. Alternatively, the impedance value of the impedance line may be adjusted by changing the thickness and the line width of the impedance line, that is, by adjusting both of these parameters. Of course, the process of adjusting both parameters is more complicated than changing only one of the line width or the line thickness.
S104: and adjusting the line width of the impedance line according to the preset line width value so as to adjust the impedance of the impedance line.
On the basis of the existing processed impedance line, under the condition of keeping the line thickness unchanged, after a preset line width value corresponding to the preset impedance value is calculated, according to the preset line width value and the measured and obtained line width value of the current impedance line, on the basis of not changing the line width of the current impedance line, the impedance of the impedance line is adjusted by changing the line width, so that the impedance value is in accordance with the preset impedance value.
In a specific embodiment, the adjusting the line width of the impedance line according to the preset line width value and the line width value may specifically be: analyzing and calculating a preset line width value and a line width value to obtain a line width adjusting value; if the line width adjusting value is a positive value, performing line width increasing processing on the impedance line; if the line width adjusting value is a negative value, the line width of the impedance line is reduced, so that the line width is correspondingly adjusted according to different conditions. For example, when the preset line width value is a specific value, the line width adjustment value is calculated by the difference between the preset line width value and the line width value. And when the preset line width value is a numerical range, directly judging the numerical norm of the measured impedance value of the impedance line and the preset impedance value of the impedance line for analysis. Specifically, the analysis compares whether the measured impedance value exceeds the numerical range of the preset impedance value or is less than the numerical range of the preset impedance value. If the measured impedance value is a numerical range smaller than the preset impedance value, analyzing and calculating to obtain a line width adjustment value which is a positive value, and performing line width increasing processing on the impedance line; if the measured impedance value exceeds the numerical range of the preset impedance value, the line width adjustment value obtained by analysis and calculation is a negative value, and the impedance line is subjected to line width reduction processing so as to perform corresponding adjustment processing on the line width according to different conditions.
According to the method for adjusting the impedance of the circuit board, the impedance value, the thickness value and the line width value of the impedance line on the circuit board are obtained, the related coefficient is obtained through calculation according to the impedance value formula, under the condition that the thickness of the impedance line is kept unchanged, the preset line width value of the impedance line at the preset impedance value is obtained through calculation according to the preset impedance value and the coefficient of the impedance line, the line width of the impedance line is adjusted according to the preset line width value and the line width value, so that the impedance of the circuit board is adjusted to be matched with the preset impedance value, and the phenomenon that the impedance line on the circuit board cannot normally realize the function due to impedance mismatching is effectively reduced, for example: the condition that the transmission signal distortion or reflection of the user signal in the high-frequency and high-speed signal transmission circuit causes loss is avoided. In addition, the impedance of the circuit board is adjusted by adjusting the line width of the impedance line according to the line width value of the impedance line and the preset line width value, and the circuit board is simple and accurate to operate.
Referring to fig. 4, fig. 4 is a schematic flow chart of a second embodiment of the impedance adjusting method for a circuit board provided in the present application, which specifically includes:
s401: and obtaining the measured impedance value, the thickness value and the line width value of the impedance line of the circuit board.
This step is the same as step S101, and please refer to fig. 1 and the related text description of step S101, which are not repeated herein.
S402: and calculating to obtain an impedance coefficient according to an impedance value formula, the measured impedance value, the thickness value and the line width value.
This step is the same as step S102, and please refer to fig. 1 and the related text description of step S102, which are not repeated herein.
S403: and calculating to obtain a preset line width value of the impedance line at the preset impedance value according to the preset impedance value of the impedance line and by combining the thickness value and the impedance coefficient.
This step is the same as step S103, and please refer to fig. 1 and the related text description of step S103, which are not repeated herein.
S404: and calculating to obtain the absolute value of the difference value between the preset line width value and the line width value.
And calculating the difference between the preset line width value and the line width value, wherein the difference can be a positive value or a negative value, and calculating the absolute value of the difference.
S405: and adjusting the line width of the impedance line by using a 3D technology, wherein the adjustment value is equal to an absolute value.
The adjustment amount of the line width is determined according to the preset line width value and the absolute value of the line width difference value, and the line width of the impedance line is adjusted by using a 3D technology to realize the adjustment of the impedance. With reference to fig. 3, the line width adjustment can be performed on a single side of the impedance line, such as on either the a-side or the B-side. The line width adjustment can also be performed on two sides of the impedance line, namely, the side A and the side B are both adjusted, and the total adjustment amount on the two sides is equal to the absolute value of the preset line width value and the line width difference value. Specifically, in a specific embodiment, if it is determined that the preset line width value and the line width difference value are positive values, it indicates that the line width of the current impedance line is smaller than the preset line width value, the width of the line body of the impedance line needs to be increased, and the line width of the impedance line can be increased and adjusted through 3D printing. If the preset line width value and the line width difference value are determined to be negative values, the fact that the line width of the existing impedance line is larger than the preset line width value and the line width needs to be reduced, namely the line body of the impedance line needs to be narrowed, and 3D etching is used for conducting line width reduction adjustment on the impedance line.
In one embodiment, the 3D etching of the impedance lines is performed using an etching solution including copper chloride to reduce line widths. More specifically, after 3D etching, the circuit board is cleaned to wash away the etching solution.
For example, in an embodiment, the line width is adjusted on two sides of the impedance line to adjust the line width, referring to fig. 5 and 6, fig. 5 is a schematic view of a process of adjusting the line width increase in the embodiment, and fig. 6 is a schematic view of a process of adjusting the line width decrease in the embodiment. When the line width of the impedance line is smaller than a preset line width value, namely the line body of the impedance line is too narrow, and the width of the line body needs to be increased, the line width of two sides of the too narrow line body is increased and adjusted by using the 3D printing conductive material, so that the line width is increased to the preset line width value. The conductive material may be conductive ink, etc. When the line width of the impedance line is larger than a preset line width value, namely the line body of the impedance line is too wide, and the width of the line body needs to be reduced, 3D etching is carried out on two sides of the impedance line by using etching liquid, for example, small-range spraying or wiping is carried out, so that the line width is reduced. A cleaning process is added after the 3D etch to remove the etchant and etched conductor material. Specifically, the etching solution may be an acidic or alkaline type chemical solution containing copper chloride.
According to the method for adjusting the impedance of the circuit board, the impedance value, the thickness value and the line width value of the impedance line on the circuit board are obtained, the related coefficient is obtained through calculation according to the impedance value formula, under the condition that the thickness of the impedance line is kept unchanged, the preset line width value of the impedance line at the preset impedance value is obtained through calculation according to the preset impedance value and the coefficient of the impedance line, the line width of the impedance line is adjusted according to the preset line width value and the line width value, so that the impedance of the circuit board is adjusted to be matched with the preset impedance value, and the phenomenon that the impedance line on the circuit board cannot normally realize the function due to impedance mismatching is effectively reduced, for example: the condition that the transmission signal distortion or reflection of the user signal in the high-frequency and high-speed signal transmission circuit causes loss is avoided. In addition, the impedance of the circuit board is adjusted by adjusting the line width of the impedance line according to the line width value of the impedance line and the preset line width value, and the circuit board is simple and accurate to operate.
The method comprises the steps of obtaining the impedance value, the thickness and the line width of an impedance line on a circuit board, calculating to obtain a related coefficient according to an impedance value formula when the impedance values are not matched, calculating to obtain a preset line width value of the impedance line at the preset impedance value according to the preset impedance value and the coefficient of the impedance line under the condition that the thickness of the impedance line is kept unchanged, calculating to obtain a preset line width value and a line width difference value, and determining an adjustment amount according to the absolute value of the difference value. The 3D technology is correspondingly used according to the positive or negative difference value to perform line width increasing adjustment or line width reducing adjustment on the impedance line through the 3D technology and according to the adjustment amount, so that the line width is more accurately adjusted, the impedance of the impedance line with inconsistent impedance on the circuit board is further adjusted, the impedance of the impedance line on the circuit board meets the requirement, the operation is simple, the frequency of impedance mismatching caused by the mismatching of the line width of the impedance line can be effectively reduced, and the condition that the transmission signal of a user signal in a high-frequency and high-speed signal transmission circuit is distorted is further avoided.
Referring to fig. 7, fig. 7 is a schematic flow chart of a third embodiment of the method for adjusting impedance of a circuit board provided in the present application, which specifically includes:
s701: and obtaining the measured impedance value of the impedance line of the circuit board.
And carrying out impedance test on the impedance line on the etched circuit board to obtain a measured impedance value of the impedance line. Specifically, the wiring board includes a plurality of impedance lines, which include a plurality of specifications, and sometimes, each specification includes a plurality of impedance lines. In actual operation, each impedance line on the circuit board can be subjected to impedance test to determine whether the impedance of each impedance line meets the requirement; one or more impedance lines of each specification on the circuit board can be selected for impedance testing. Because the processing parameters of the impedance lines with the same specification are the same, the processing environments such as processing equipment and processes are the same, and the line width and the line thickness of the processed impedance lines are the same, the impedance situation is also the same. Therefore, the impedance test condition of one or more impedance lines of the same specification on the same circuit board can represent the impedance condition of all the impedance lines of the specification on the same circuit board. If the impedance value obtained by the impedance test of the impedance line which is used as a representative for testing does not meet the requirement, the impedance of all the impedance lines with the specification processed on the circuit board does not meet the requirement. Compared with the impedance value obtained by performing impedance test on all the impedance lines on the circuit board, the impedance test method has the advantages that the number of test times is obviously reduced, the test time is shortened, and the impedance adjustment efficiency on the whole circuit board is improved.
S702: and judging whether the measured impedance value of the impedance line is in a preset range.
The preset range needs to be set correspondingly according to the processing and design requirements of the circuit board and the corresponding processing and design requirements of the impedance line on the circuit board. If the impedance value needs to be strictly controlled, the preset range is set to be smaller, and an impedance line with an impedance value close to the preset impedance value can be processed, so that the function of the impedance line can be more accurately realized, for example, the impedance value of the processed impedance line is equal to the preset impedance value. If the impedance value does not need to be controlled strictly, considering that the impedance adjustment processing step is complex, the preset range can be controlled relatively greatly on the premise of meeting the performance requirement of the impedance line in order to reduce the processing difficulty and shorten the processing time.
In some embodiments, the predetermined range may be a percentage value associated with a predetermined impedance value, such as ± 5%, ± 6%, ± 7%, ± 8%, ± 9%, ± 10%; but may also be a specific impedance value such as 1 Ω, 2 Ω, 5 Ω, etc. Whether the preset range is a percentage value or a specific impedance value, whether the measured impedance value is consistent with the preset impedance value of the impedance line or not can be judged. It is understood that the predetermined range of + -5% is a range of-5% to + 5%, inclusive of-5% and + 5% and 0. That is, if the measured impedance value is equal to the end of the range (-5% or + 5%), then the measured impedance value is within the preset range. Wherein 0 means that the measured impedance value is equal to the preset impedance value. Similarly, the predetermined range of the specific impedance value also includes the end of the range and 0.
In one embodiment, the preset impedance value is a specific value, a difference between the measured impedance value of the impedance line and the preset impedance value of the impedance line is calculated, and whether the difference is within a preset range is determined. For example, the preset impedance value may be 50 Ω, 65 Ω, 75 Ω, 85 Ω, 95 Ω or 100 Ω. For example, the preset impedance value of one impedance line on the circuit board is 50 Ω, and the preset range of the impedance difference is ± 10%. When the impedance of the impedance line is tested to obtain an actual impedance value of 53 Ω, that is, the measured impedance value is 53 Ω, the difference between the measured impedance value and the preset impedance value is 3 Ω, the percentage of the difference with respect to the preset impedance value is 6% (3/50 ═ 6%), and the 6% is within a preset range of ± 10%, so that the impedance value of the impedance line matches the preset impedance value of the impedance line. If the impedance value is 41 Ω, the difference between the impedance value and the preset impedance value of the impedance line is-9 Ω, the percentage of the value to the preset impedance value is-18% (-9)/50 ═ 18%), and-18% is not within the preset range of ± 10%, then the measured impedance value of the impedance line does not correspond to the preset impedance value of the impedance line.
In another embodiment, the predetermined impedance value is 50 Ω, the predetermined range is ± 5 Ω, when the impedance value is 53 Ω, the difference between the impedance value and the predetermined impedance value of the impedance line is 3 Ω, and when the impedance value is within the predetermined range of ± 5 Ω, the impedance value of the impedance line is consistent with the predetermined impedance value of the impedance line. If the impedance value is 41 Ω, the difference between the impedance value and the preset impedance value of the impedance line is-9 Ω, and is not within the preset range of ± 5 Ω, then the measured impedance value of the impedance line does not conform to the preset impedance value of the impedance line.
It will be appreciated that in other embodiments, the preset impedance value is a range of values. In this embodiment, the difference between the measured impedance value of the impedance line and the preset impedance value of the impedance line may not be calculated, and whether the measured impedance value of the impedance line is within the out-of-range of the preset impedance value of the impedance line may be directly determined. For example, an exceedable range is set relative to the preset impedance value, and if the impedance value is within the exceedable range of the preset impedance value, the impedance value of the impedance line conforms to the preset impedance value of the impedance line; if the impedance value is not within the out-of-range of the preset impedance value, the impedance value of the impedance line is not in accordance with the preset impedance value of the impedance line. For example, the out-of-range may be a tolerance of the impedance values, such as ± 5%, ± 6%, ± 7%, ± 8%, ± 9%, ± 10%. In one embodiment, the preset impedance value is 100 Ω, the tolerance is ± 10%, and then whether the impedance value is within 90-110 Ω is determined according to 100 × 1 ± 10% Ω, including 90 Ω and 110 Ω, if the impedance value can exceed the range, the impedance value of the impedance line is consistent with the preset impedance value of the impedance line; if the impedance value exceeds the out-of-range, the impedance value of the impedance line does not accord with the preset impedance value of the impedance line.
Wherein the tolerance is determined according to the control requirement of the impedance, and if the control requirement of the impedance is very strict, the tolerance can be set to be smaller. The smaller tolerance represents that the impedance value of the impedance line is consistent with the preset impedance value of the impedance line, otherwise, the impedance adjustment is needed, the impedance can be controlled at a more accurate level and is closer to the preset impedance value, and the corresponding function of the impedance line, such as the transmission of a specific high-frequency high-speed signal, can be realized more accurately. The tolerance can be set according to the magnitude of the preset impedance value, the degree of exceeding the impedance range caused by the same tolerance value to different preset impedance values can be greatly different, for example, when the tolerance is +/-10%, the same tolerance can be obtained, if the preset impedance value is 50 omega, the exceeding range can be +/-5 omega, namely, the impedance is in the range of 45-55 omega, and the requirement is met; for the preset impedance value of 100 Ω, the out-of-range is ± 10 Ω, i.e. the impedance is in the range of 90-110 Ω. Therefore, the tolerance may be adjusted or may be out of range according to different preset impedance values.
S703: if the measured impedance value is not within the preset range, the thickness value and the line width value of the impedance line are continuously obtained so as to calculate the preset line width value of the impedance line when the impedance value is preset, and the line width of the impedance line is adjusted according to the preset line width value and the line width value.
And when the measured impedance value is in the preset range, the impedance of the impedance line is close to or even equal to the preset impedance, and the condition that the signal is transmitted in the high-frequency and high-speed signal transmission circuit and is distorted or reflected to cause loss due to mismatching with the preset impedance can not occur. Therefore, the impedance adjustment of the impedance line is not needed, and the thickness, the line width, the adjustment line width and the like of the impedance line are not needed to be measured.
It can be understood that, in the third embodiment of the present application, in the above-mentioned S703, the adjustment processing of the line width of the impedance line according to the preset line width value and the preset line width value is the same as the specific steps in the above-mentioned first embodiment and/or second embodiment of the present application, and details are not described here again. Similarly, in the third embodiment of the present application, the specific method for calculating the preset line width value is the same as the specific steps in the first embodiment and/or the second embodiment of the present application, and is not described herein again.
It can be understood that, in other embodiments, after the line width of the impedance line is adjusted, the impedance of the impedance line needs to be retested to confirm that the impedance of the impedance line after the line width adjustment meets the requirement, and further detection is performed, so that the frequency of the impedance mismatching phenomenon caused by the line width mismatching of the impedance line is effectively reduced, and the occurrence of the condition that the transmission signal of the user signal is distorted in the high-frequency and high-speed signal transmission circuit is further avoided.
The third embodiment of the application only carries out thickness and line width measurement to the impedance line that impedance value is inconsistent in order to carry out follow-up line width adjustment, and then needn't carry out thickness and line width measurement to the impedance line that impedance value satisfies the requirement, can the simplification operation, saves time, improves machining efficiency. And the line width of the impedance line is adjusted according to the preset line width value and the line width value so as to adjust the impedance of the circuit board to be matched with the preset impedance value, thereby effectively reducing the phenomenon that the impedance line on the circuit board cannot normally realize the function due to impedance mismatching, such as: the condition that the transmission signal distortion or reflection of the user signal in the high-frequency and high-speed signal transmission circuit causes loss is avoided. Moreover, the impedance of the circuit board is adjusted by adjusting the line width of the impedance line according to the line width value of the impedance line and the preset line width value, and the circuit board is simple and accurate to operate.
Referring to fig. 8, fig. 8 is a schematic structural diagram of an embodiment of the impedance adjustment apparatus for a circuit board provided in the present application. The circuit board impedance adjusting apparatus 800 includes a detecting unit 801, a processing unit 802, and an executing unit 803. The circuit board impedance adjusting device of the present embodiment is used to implement the circuit board impedance adjusting methods of the above embodiments.
The detection unit 801 obtains parameters of the impedance line. The processing unit 802 is connected to the detecting unit 801, receives the parameters detected by the detecting unit 801, and processes the parameters to obtain a preset line width value of the impedance line. The execution unit 803 is connected to the processing unit 802, and the execution unit 803 adjusts the line width of the impedance line according to the preset line width value of the impedance line, so as to adjust the impedance of the impedance line on the circuit board.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims (11)

1. A circuit board impedance adjusting method is characterized by comprising the following steps:
obtaining a measured impedance value, a thickness value and a line width value of an impedance line of a circuit board;
calculating to obtain an impedance coefficient according to an impedance value formula, the measured impedance value, the thickness value and the line width value;
calculating to obtain a preset line width value of the impedance line at the preset impedance value according to the preset impedance value of the impedance line and by combining the thickness value and the impedance coefficient;
and adjusting the line width of the impedance line according to the preset line width value so as to adjust the impedance of the impedance line.
2. The method for adjusting impedance of a circuit board according to claim 1, wherein the adjusting the line width of the impedance line according to the preset line width value to adjust the impedance of the impedance line comprises:
calculating to obtain an absolute value of a difference value between the preset line width value and the line width value;
and adjusting the line width of the impedance line by using a 3D technology, wherein the adjustment value is equal to the absolute value.
3. The method for adjusting impedance of a circuit board according to claim 2, wherein the adjusting the line width of the impedance line by using a 3D technique, the adjustment value being equal to the absolute value, comprises:
determining that the difference value between the preset line width value and the line width value is a positive value;
and increasing and adjusting the line width of the impedance line through 3D printing.
4. The method for adjusting impedance of a circuit board according to claim 2, wherein the adjusting the line width of the impedance line by using a 3D technique, the adjustment value being equal to the absolute value, comprises:
determining that the difference value between the preset line width value and the measured line width is a negative value;
and performing reduction adjustment on the line width of the impedance line by using 3D etching.
5. The impedance adjusting method for the circuit board according to claim 4, wherein the performing of the reduction adjustment on the line width of the impedance line by using the 3D etching comprises:
and 3D etching the resistance line by using an etching solution comprising copper chloride to reduce the line width.
6. The method for adjusting impedance of a circuit board according to claim 5, further comprising, after performing line width reduction adjustment on the impedance line by using 3D etching: and cleaning the circuit board to wash away the etching solution.
7. The method for adjusting impedance of a circuit board according to claim 1, wherein the adjusting the line width of the impedance line according to the preset line width value to adjust the impedance of the impedance line comprises:
analyzing and calculating according to the preset line width value and the line width value to obtain an adjustment value;
if the adjustment value is a positive value, performing line width increasing processing on the impedance line;
and if the adjusting value is a negative value, performing line width reduction processing on the impedance line.
8. The method for adjusting impedance of a circuit board according to any one of claims 1 to 7, wherein the obtaining of the measured impedance value, the thickness value and the line width value of the impedance line of the circuit board comprises:
obtaining a measured impedance value of an impedance line of the circuit board;
judging whether the measured impedance value of the impedance line is within a preset range;
if the measured impedance value is not within the preset range, continuously obtaining the thickness value and the line width value of the impedance line so as to calculate and obtain a preset line width value of the impedance line at the preset impedance value, and adjusting the line width of the impedance line according to the preset line width value and the line width value.
9. The method of claim 8, wherein the predetermined impedance value is a specific value;
the judging whether the measured impedance value of the impedance line is within a preset range includes:
calculating a difference value between the measured impedance value of the impedance line and a preset impedance value of the impedance line;
and judging whether the difference value is within a preset range.
10. The method of claim 8, wherein the predetermined impedance value is a range of values;
the preset range is the numerical range.
11. A circuit board impedance adjustment device, comprising:
a detection unit for obtaining parameters of the impedance line;
the processing unit is connected with the detection unit, receives the parameters detected and obtained by the detection unit, and processes the parameters to obtain a preset line width value of the impedance line;
and the execution unit is connected with the processing unit and adjusts the line width of the impedance line according to the preset line width value of the impedance line.
CN202011583071.0A 2020-12-28 2020-12-28 Circuit board impedance adjusting method and device Pending CN114696861A (en)

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