CN114695245A - Lifting shaft and wafer carrying platform - Google Patents

Lifting shaft and wafer carrying platform Download PDF

Info

Publication number
CN114695245A
CN114695245A CN202210318970.0A CN202210318970A CN114695245A CN 114695245 A CN114695245 A CN 114695245A CN 202210318970 A CN202210318970 A CN 202210318970A CN 114695245 A CN114695245 A CN 114695245A
Authority
CN
China
Prior art keywords
shaft
carrier
lifting
support frame
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210318970.0A
Other languages
Chinese (zh)
Other versions
CN114695245B (en
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Sihang Semiconductor Technology Co ltd
Original Assignee
Suzhou Sihang Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Sihang Semiconductor Technology Co ltd filed Critical Suzhou Sihang Semiconductor Technology Co ltd
Priority to CN202210318970.0A priority Critical patent/CN114695245B/en
Publication of CN114695245A publication Critical patent/CN114695245A/en
Application granted granted Critical
Publication of CN114695245B publication Critical patent/CN114695245B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25HWORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H1/00Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
    • B25H1/14Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top
    • B25H1/16Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top in height

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a lifting shaft and a wafer carrying platform, belonging to the field of high-precision machines, wherein the lifting shaft comprises a hollow shaft body, a step shaft sleeve, an upper gas sealing ring, a lower gas sealing ring, a lifting motor, a supporting frame, an upper end cover and a lower end cover; the lifting shaft drives the hollow shaft body to move up and down in the step shaft sleeve through the lifting motor, so that the driving piece is driven to lift up and down; the wafer carrying platform comprises a carrying platform main shaft, a carrying disk, a carrying platform base, a carrying platform air floatation anchor, a carrying disk brake assembly, a main shaft elastic support assembly and a centering fork assembly; by the lifting shaft and the wafer carrying platform, wafers and silicon wafers can be flexibly supported in a suspended manner to wait for detection or to-be-processed workpieces, so that a high-precision suspension supporting effect is achieved, the precision and the stability of the carrying platform are ensured, and the lifting shaft and the wafer carrying platform are convenient to popularize and apply in the fields of semiconductor quantity detection and high-precision processing with moving platforms.

Description

Lifting shaft and wafer carrying platform
Technical Field
The invention belongs to the field of high-precision machines, and particularly relates to a lifting shaft and a wafer carrying platform.
Background
In inspection and processing techniques, a stable table is generally required, and the table is generally supported on a bottom surface by a frame or a foot. However, in the detection system with a high-precision motion table, the stage is a main bearing mechanism, the main shaft mainly supports the carrier plate, the existing main shaft mainly is a rotating motor, and the existing stage has a complex structure and poor damping and shock absorbing effects, so that for the conventional workbench, besides the feet, the damping springs and the like, the performance of the stage needs to be improved, and the lifting function needs to be added to adapt to the stage system for high-precision detection or processing.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a lifting shaft and a wafer carrier, which can solve the problems.
A lifting shaft comprises a hollow shaft body, a step shaft sleeve, an upper air sealing ring, a lower air sealing ring, a lifting motor, a support frame, an upper end cover and a lower end cover;
the hollow shaft body and the lifting motor are sleeved in the step shaft sleeve, and the support frame is sleeved in hollow inner cavities of the hollow shaft body and the lifting motor; the upper air sealing ring and the lower air sealing ring are sleeved at an upper mounting step and a lower mounting step which are arranged on the step shaft sleeve and used for supporting and mounting the lifting shaft; the upper end cover is arranged at the upper end of the hollow shaft body, and the lower end cover is arranged at the lower end of the step shaft sleeve;
the lifting shaft drives the hollow shaft body to move up and down in the step shaft sleeve through the lifting motor, so that the driving piece is driven to lift.
Furthermore, the lifting shaft also comprises a motor adapter plate, and the lower end of the hollow shaft body is connected to the upper end of the lifting motor through the motor adapter plate.
Furthermore, the lifting shaft also comprises a sensor, the sensor is sleeved in the hollow cavity of the support frame, and a sensor connecting plate for supporting is arranged at the upper end of the sensor.
Furthermore, the lifting shaft further comprises a group of elastic cushion groups arranged at the upper end of the supporting frame and used for elastically supporting the upper end of the supporting frame below the sensor connecting plate.
Furthermore, the lifting shaft also comprises a throttle which is arranged on the step shaft sleeve and corresponds to the throttle hole at the upper air sealing ring.
The invention also provides a wafer carrier, which comprises a carrier main shaft, a carrier disc, a carrier base, a carrier air floatation foot margin, a carrier disc brake component, a main shaft elastic support component and a centering fork component; the main shaft of the carrier adopts the lifting shaft; the carrier spindle is vertically arranged in a bearing hole formed in the carrier base; the carrier base is supported on the frame in a floating or sliding manner through a plurality of carrier air floatation feet; the middle part of the bottom surface of the carrier disc is fixed to the top surface of the carrier table main shaft, and the carrier disc is driven to move up and down through the carrier table main shaft; the plurality of carrying disc brake assemblies are arranged between the carrying platform base and the carrying disc and used for braking the carrying disc; the main shaft elastic support assembly is used for elastically connecting the carrier main shaft with the carrier base so as to enhance the stability of the carrier main shaft; the alignment fork assembly is arranged between the carrier base and the carrier disc and used for passive alignment resetting of the carrier disc.
Compared with the prior art, the invention has the beneficial effects that: by the lifting shaft and the wafer carrying platform, wafers and silicon wafers can be flexibly supported in a suspended manner to wait for detection or to-be-processed workpieces, so that a high-precision suspension supporting effect is achieved, the precision and the stability of the carrying platform are ensured, and the lifting shaft and the wafer carrying platform are convenient to popularize and apply in the fields of semiconductor quantity detection and high-precision processing with moving platforms.
Drawings
FIG. 1 is a schematic view of the assembly of a lift shaft;
FIG. 2 is a cross-sectional view of the lift shaft;
FIG. 3 is an exploded view of the lift shaft;
FIG. 4 is a schematic view of one embodiment of a wafer carrier;
FIG. 5 is a schematic view of another embodiment of a wafer carrier;
in the figure:
100. a lifting shaft;
1. a hollow shaft body; 2. a step shaft sleeve;
3. an upper air sealing ring;
4. a lower gas sealing ring;
5. a lifting motor; 51. a motor stator; 52. a motor rotor;
6. a support frame; 61. a lower support frame; 62. an upper support frame;
7. an upper end cover;
8. a lower end cover;
9. a motor adapter plate;
10. a sensor;
11. an elastic cushion group; 1101. a lower stop collar cap; 1102. an elastic adjustment pad; 1103. an upper stop cap;
12. a restrictor;
13. a sensor connecting plate;
10000. a wafer carrier;
1000. a stage main shaft;
2000. a carrying tray;
3000. a carrier base;
4000. carrying platform air flotation ground feet;
5000. a carrier disc brake assembly;
6000. a main shaft elastic support component; 6010. an upper support member; 6020. an elastic lower support; 6021. a base transfer block; 6022. a clip of the elastic sheet; 6023. a spring plate;
7000. a return fork assembly;
8000. a bearing platform outer end component;
9000. the carrier closing plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Lifting shaft
A lifting shaft 100, see fig. 1-3, comprises a hollow shaft body 1, a step shaft sleeve 2, an upper air sealing ring 3, a lower air sealing ring 4, a lifting motor 5, a support frame 6, an upper end cover 7 and a lower end cover 8.
Connection relation: the hollow shaft body 1 and the lifting motor 5 are sleeved in the step shaft sleeve 2, and the support frame 6 is sleeved in hollow inner cavities of the hollow shaft body 1 and the lifting motor 5; the upper air sealing ring 3 and the lower air sealing ring 4 are sleeved at an upper mounting step and a lower mounting step which are arranged on the step shaft sleeve 2 and used for supporting and mounting the lifting shaft 100; the upper end cover 7 is arranged at the upper end of the hollow shaft body 1, and the lower end cover 8 is arranged at the lower end of the step shaft sleeve 2.
Lifting principle: the lifting shaft 100 drives the hollow shaft body 1 to move up and down in the step shaft sleeve 2 through the lifting motor 5, so that the driving piece is driven to lift up and down.
Further, the lifting shaft 100 further comprises a motor adapter plate 9, and the lower end of the hollow shaft body 1 is connected to the upper end of the lifting motor 5 through the motor adapter plate 9.
Further, the lifting shaft 100 further comprises a sensor 10, the sensor 10 is sleeved in the hollow cavity of the support frame 6, and a sensor connecting plate 13 for supporting is arranged at the upper end of the sensor 10. In one example, the sensor 10 is an LVDT, non-contact measurement is adopted, friction is avoided, and error sources are reduced.
Further, the lifting shaft 100 further comprises a group of elastic cushion groups 11 arranged at the upper end of the support frame 6, and the elastic cushion groups are used for elastically supporting the upper end of the support frame 6 below the sensor connecting plate 13.
The support frame 6 comprises a hollow lower support frame 61 and an upper support frame 62, wherein the upper end of the lower support frame 61 is screwed into a threaded hole at the lower end of the upper support frame 62; the lower part of the lower support frame 61 is sleeved in a hollow cavity of the lifting motor 5; the upper end of the upper support frame 62 is in threaded connection with the elastic cushion group 11.
Wherein, the elastic cushion set 11 comprises a lower stop ring cap 1101, an elastic adjusting cushion 1102 and an upper stop cap 1103; the elastic adjusting pad 1102 is screwed to the upper end of the upper support frame 62; the lower stop ring cap 1101 is sleeved to the inner cavity of the upper stop cap 1103, and covers the elastic adjusting pad 1102; the top surface of the upper stop cap 1103 abuts against the bottom surface of the sensor connecting plate 13, and a hole is formed in the middle of the upper stop cap 1103 for the sensor 10 to pass through.
The lifting motor 5 comprises a hollow motor stator 51 and a motor rotor 52, wherein the outer peripheral surface of the motor stator 51 is sleeved in a rotor ring groove of the motor rotor 52; the upper end surface of the motor rotor 52 is connected with the motor adapter plate 9. The whole lifting motor 5 adopts a voice coil motor.
Further, the lifting shaft 100 further comprises a throttle 12, and the throttle 12 is arranged on the stepped shaft sleeve 2 and corresponds to the throttle hole at the upper air sealing ring 3.
Wafer carrying platform
A wafer carrier 10000, see FIG. 4, includes a carrier spindle 1000, a carrier disk 2000, a carrier base 3000, a carrier air float foot 4000, a carrier disk brake assembly 5000, a spindle elastic support assembly 6000, and a return fork assembly 7000.
Arrangement relation: the stage main shaft 1000 adopts the lifting shaft 100; the carrier spindle 1000 is vertically disposed in a bearing hole formed in the carrier base 3000. The stage base 3000 is supported on the frame by a plurality of stage air floatation anchors 4000 so as to be floating or sliding. The middle of the bottom surface of the carrier plate 2000 is fixed to the top surface of the stage spindle 1000, and the carrier plate 2000 is driven to move up and down by the stage spindle 1000. A plurality of the carrier disc brake assemblies 5000 are disposed between the carrier base 3000 and the carrier disc 2000, and are used for braking the carrier disc 2000. Spindle spring support assembly 6000 is used to resiliently couple stage spindle 1000 to stage base 3000 to enhance the stability of stage spindle 1000. The aligning fork assembly 7000 is disposed between the stage base 3000 and the boat 2000, and is used for passive aligning and resetting of the boat 2000.
The spindle elastic support assembly 6000 comprises an upper support 6010 and an elastic lower support 6020; the upper support 6010 is connected to the extension portion of the step shaft sleeve 2, and the upper support 6010 is connected to the stage base 3000 at the same time; the elastic lower supporting part 6020 is arranged between the bottom surface of the lower end of the lifting shaft 100 and the bottom surface of the platform deck base 3000; elastic support of stage spindle 1000 is achieved by upper support 6010 and elastic lower support 6020.
Further, the elastic lower support 6020 comprises a base adapter 6021, a spring plate clamp 6022 and a spring plate 6023; wherein, the elastic piece 6023 is horizontally arranged, the inner end thereof is connected to the lower end surface of the carrier spindle 1000, and the outer end thereof is clamped and fixed by the elastic piece clamp 6022; the upper end of the spring plate clamp 6022 is connected and fixed with the base adapter block 6021, and the upper part of the base adapter block 6021 is fixed on the stage base 3000.
Wherein the spindle elastic support assembly 6000 includes a plurality of the elastic lower supports 6020, such as two or three.
Further, the wafer carrier 10000 further includes two horizontal limiting members, and the two horizontal limiting members are disposed at two horizontal ends of the carrier base.
In another embodiment, referring to fig. 5, wafer carrier 10000 further comprises a carrier outer end component 8000 and a carrier closure plate 9000.
The stage closing plate 9000 is connected to the stage base 3000 and the stage outer end component 8000 in a straddling manner from the top, and the lower space is used for arranging an X-axis beam.
Other functional structures, not shown, such as brake band assemblies, may be mounted on the stage closure plate 9000 in this embodiment.
Further, two sets of beam stop air-floating pads are arranged on two opposite surfaces of the stage base 3000 and the stage outer end assembly 8000, and are used for supporting beams and the like arranged below the stage closing plate 9000.
The main material of the stage base 3000 is aluminum-based silicon carbide. The advantages of metal and ceramic are combined, the rigidity is high, the density is small, the thermal expansion coefficient is small, the stability of the carrier is good, and the supporting precision is guaranteed.
The carrier can be used for not only wafers but also high-precision support of other similar plate products, and can be applied to high-precision detection and processing machines, such as machines of quantity detection machines of semiconductor wafers and photovoltaic wafers, high-precision measuring mechanisms, three-coordinate measuring machines and the like, so that stable supporting, vibration absorption and positioning effects are improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A lifting shaft is characterized in that: the lifting shaft (100) comprises a hollow shaft body (1), a step shaft sleeve (2), an upper air sealing ring (3), a lower air sealing ring (4), a lifting motor (5), a support frame (6), an upper end cover (7) and a lower end cover (8);
the hollow shaft body (1) and the lifting motor (5) are sleeved in the step shaft sleeve (2), and the support frame (6) is sleeved in hollow inner cavities of the hollow shaft body (1) and the lifting motor (5); the upper air sealing ring (3) and the lower air sealing ring (4) are sleeved at an upper mounting step and a lower mounting step which are arranged on the step shaft sleeve (2) and are used for supporting and mounting the lifting shaft (100); the upper end cover (7) is arranged at the upper end of the hollow shaft body (1), and the lower end cover (8) is arranged at the lower end of the step shaft sleeve (2);
the lifting shaft (100) drives the hollow shaft body (1) to move up and down in the step shaft sleeve (2) through the lifting motor (5), so that the driving piece is driven to lift up and down.
2. The lift shaft of claim 1, wherein: the lifting shaft (100) further comprises a motor adapter plate (9), and the lower end of the hollow shaft body (1) is connected to the upper end of the lifting motor (5) through the motor adapter plate (9).
3. The lift shaft of claim 1, wherein: the lifting shaft (100) further comprises a sensor (10), the sensor (10) is sleeved in the hollow cavity of the support frame (6), and a sensor connecting plate (13) for supporting is arranged at the upper end of the sensor (10).
4. The lift shaft of claim 3, wherein: the lifting shaft (100) further comprises a group of elastic cushion groups (11) arranged at the upper end of the support frame (6) and used for elastically supporting the upper end of the support frame (6) below the sensor connecting plate (13).
5. The lift shaft of claim 4, wherein: the support frame (6) comprises a hollow lower support frame (61) and an upper support frame (62), and the upper end of the lower support frame (61) is connected to a threaded hole in the lower end of the upper support frame (62) in a threaded manner; the lower part of the lower support frame (61) is sleeved in a hollow cavity of the lifting motor (5); the upper end of the upper supporting frame (62) is in threaded connection with the elastic cushion group (11).
6. The lift shaft of claim 5, wherein: the elastic cushion group (11) comprises a lower stop ring cap (1101), an elastic adjusting cushion (1102) and an upper stop cap (1103); the elastic adjusting pad (1102) is connected to the upper end of the upper support frame (62) in a threaded mode; the lower stop ring cap (1101) is sleeved to the inner cavity of the upper stop cap (1103) and covers the elastic adjusting pad (1102); the top surface of the upper stop cap (1103) is abutted to the bottom surface of the sensor connecting plate (13), and a hole is formed in the middle of the upper stop cap (1103) for the sensor (10) to pass through.
7. The lift shaft of claim 2, wherein: the lifting motor (5) comprises a hollow motor stator (51) and a motor rotor (52), wherein the peripheral surface of the motor stator (51) is sleeved in a rotor ring groove of the motor rotor (52); the upper end face of the motor rotor (52) is connected with the motor adapter plate (9).
8. The lift shaft of claim 1, wherein: the lifting shaft (100) further comprises a throttle (12), and the throttle (12) is arranged on the step shaft sleeve (2) and corresponds to the throttle hole at the upper air sealing ring (3).
9. A wafer carrier is characterized in that: the wafer carrier (10000) comprises a carrier spindle (1000), a carrying disc (2000), a carrier base (3000), carrier air floatation feet (4000), a carrying disc brake assembly (5000), a spindle elastic support assembly (6000) and a return fork assembly (7000);
wherein the stage main shaft (1000) adopts the lifting shaft (100) of any one of claims 1 to 8; the carrier spindle (1000) is vertically arranged in a bearing hole formed in the carrier base (3000);
the stage base (3000) is supported on the frame in a floating or sliding manner through a plurality of stage air-floating feet (4000);
the middle part of the bottom surface of the carrier disc (2000) is fixed to the top surface of the carrier spindle (1000), and the carrier disc (2000) is driven to move up and down through the carrier spindle (1000);
the carrier disc brake assemblies (5000) are arranged between the carrier table base (3000) and the carrier disc (2000) and used for braking the carrier disc (2000);
the main shaft elastic support assembly (6000) is used for elastically connecting the carrier main shaft (1000) with the carrier base (3000) so as to enhance the stability of the carrier main shaft (1000);
the aligning fork assembly (7000) is arranged between the carrier base (3000) and the carrier disc (2000) and is used for passive aligning and resetting of the carrier disc (2000).
10. The wafer carrier of claim 9, wherein: the main shaft elastic supporting component (6000) comprises an upper supporting piece (6010) and an elastic lower supporting piece (6020); the upper supporting piece (6010) is connected to the outer extension part of the step shaft sleeve (2), and the upper supporting piece (6010) is connected with the carrier base (3000) at the same time; the elastic lower supporting piece (6020) is arranged between the bottom surface of the lower end of the lifting shaft (100) and the bottom surface of the carrier base (3000); elastic support of the stage spindle (1000) is achieved by an upper support (6010) and an elastic lower support (6020).
CN202210318970.0A 2022-03-29 2022-03-29 Lifting shaft and wafer carrying platform Active CN114695245B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210318970.0A CN114695245B (en) 2022-03-29 2022-03-29 Lifting shaft and wafer carrying platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210318970.0A CN114695245B (en) 2022-03-29 2022-03-29 Lifting shaft and wafer carrying platform

Publications (2)

Publication Number Publication Date
CN114695245A true CN114695245A (en) 2022-07-01
CN114695245B CN114695245B (en) 2023-02-07

Family

ID=82141062

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210318970.0A Active CN114695245B (en) 2022-03-29 2022-03-29 Lifting shaft and wafer carrying platform

Country Status (1)

Country Link
CN (1) CN114695245B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501289B1 (en) * 1999-03-11 2002-12-31 Tokyo Electron Limited Inspection stage including a plurality of Z shafts, and inspection apparatus
CN101194040A (en) * 2005-06-08 2008-06-04 应用材料股份有限公司 Rotating substrate support and methods of use
CN203709384U (en) * 2013-12-19 2014-07-16 汕头市胜大自动化科技有限公司 Height adjustment mechanism
CN205555963U (en) * 2016-01-26 2016-09-07 陈洪波 Elevating platform of function is prevented pressing from both sides in area
CN205634741U (en) * 2016-05-06 2016-10-12 中山市颂力电子科技有限公司 Built -in integrative lifter
CN110047790A (en) * 2018-01-15 2019-07-23 北京北方华创微电子装备有限公司 Double-shaft mechanism and semiconductor processing equipment
CN114156196A (en) * 2020-09-07 2022-03-08 江苏鲁汶仪器有限公司 Ion beam etching machine and lifting rotating platform device thereof
CN216084845U (en) * 2021-09-08 2022-03-18 长园半导体设备(珠海)有限公司 Ejector pin mechanism for chip sorting

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501289B1 (en) * 1999-03-11 2002-12-31 Tokyo Electron Limited Inspection stage including a plurality of Z shafts, and inspection apparatus
CN101194040A (en) * 2005-06-08 2008-06-04 应用材料股份有限公司 Rotating substrate support and methods of use
CN203709384U (en) * 2013-12-19 2014-07-16 汕头市胜大自动化科技有限公司 Height adjustment mechanism
CN205555963U (en) * 2016-01-26 2016-09-07 陈洪波 Elevating platform of function is prevented pressing from both sides in area
CN205634741U (en) * 2016-05-06 2016-10-12 中山市颂力电子科技有限公司 Built -in integrative lifter
CN110047790A (en) * 2018-01-15 2019-07-23 北京北方华创微电子装备有限公司 Double-shaft mechanism and semiconductor processing equipment
CN114156196A (en) * 2020-09-07 2022-03-08 江苏鲁汶仪器有限公司 Ion beam etching machine and lifting rotating platform device thereof
CN216084845U (en) * 2021-09-08 2022-03-18 长园半导体设备(珠海)有限公司 Ejector pin mechanism for chip sorting

Also Published As

Publication number Publication date
CN114695245B (en) 2023-02-07

Similar Documents

Publication Publication Date Title
CN114683223B (en) Wafer carrying platform
CN100535765C (en) 6-freedom micro-motion platform capable of isolating exterior vibration
US7765905B2 (en) Magnetic micropositioner and method of providing the same
CN100461365C (en) High precision silicon slice bench and uses thereof
CN112276384B (en) Air floating platform for semiconductor wafer laser cutting
US10580677B2 (en) Positioning arrangement
CN114695227B (en) Stage system and wafer driving method adopting stage system
CN114695245B (en) Lifting shaft and wafer carrying platform
CN103790963A (en) Split air foot and plane guide device
CN114683227B (en) Wafer carrying platform
CN219574594U (en) One-dimensional movement device
CN106958590A (en) The high-precision linear movement reference device of gas/solid combined type of multiple degrees of freedom decoupling driving
CN108572076B (en) Application method of static pressure air floatation spindle performance detection device
CN111230689A (en) Double-gantry dicing saw with symmetrical YZ plane
CN114619411A (en) Flexible motion platform and carrying platform system
CN114683226B (en) Disc brake mechanism and wafer carrying platform
CN101408456A (en) Resonance measuring chucking appliance of hard disk drive rack
JP2006083964A (en) Stage slider mechanism
JP4215899B2 (en) Static pressure linear guide device
CN217881447U (en) Bearing device
CN114884301B (en) Platform deck system adopting voice coil motor
CN117075448B (en) Nanometer precision photoetching air-floating moving table
CN116067309A (en) Wafer flatness detector
CN213575176U (en) Air bearing disc spring mechanism for three-coordinate measuring machine
US20060232880A1 (en) Mounting system for a storage media disc

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant