CN114695182A - Substrate processing apparatus - Google Patents

Abstract

The invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing container capable of accommodating the substrate therein; a holding section for holding the substrate at a holding position inside the processing container; a fluid supply unit having a supply opening for discharging a processing fluid to the inside of the processing container; and a supply guide member facing the supply opening portion between the supply opening portion and the holding position, and guiding the processing fluid from the supply opening portion to expand to a range of an area larger than an opening area of the supply opening portion. According to the present invention, the drying process of the substrate can be advantageously performed stably.

Description

Substrate processing apparatus

Technical Field

The present invention relates to a substrate processing apparatus.

Background

A technique of drying a substrate such as a semiconductor wafer to which a processing liquid has adhered by using a processing fluid in a supercritical state is known (see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2013-251550.

Disclosure of Invention

Problems to be solved by the invention

When the supercritical processing fluid is vigorously ejected from the small-diameter opening, a vortex of the processing fluid may be generated or the processing fluid may be accumulated. In such a case, the processing fluid may not be efficiently guided to the periphery of the substrate (particularly, the surface to be dried), and as a result, the drying process of the substrate may take a long time. Further, since the processing fluid vigorously ejected from the opening is blown toward the substrate, the liquid may be unintentionally scattered from the substrate.

Therefore, the drying treatment of the entire substrate surface cannot be stably performed.

The present invention provides a technique advantageous for stably performing a drying process of a substrate.

Means for solving the problems

One embodiment of the present invention relates to a substrate processing apparatus for drying a substrate to which a liquid adheres by using a processing fluid in a supercritical state, the substrate processing apparatus including: a processing container capable of accommodating a substrate inside; a holding section for holding a substrate at a holding position inside the processing container; a fluid supply unit having a supply opening for discharging a processing fluid to the inside of the processing container; and a supply guide member facing the supply opening portion between the supply opening portion and the holding position, and guiding the processing fluid from the supply opening portion to expand to a range of an area larger than an opening area of the supply opening portion.

Effects of the invention

According to the present invention, the drying process of the substrate can be advantageously performed stably.

Drawings

Fig. 1 is a plan view showing an example of a substrate processing apparatus.

Fig. 2 is a diagram showing a specific configuration example of the drying unit and the supply unit.

Fig. 3 is a side view showing an example of the drying unit according to embodiment 1.

Fig. 4 is a side view showing an example of the drying unit according to embodiment 1.

Fig. 5 is a side view showing an example of the drying unit according to embodiment 1.

Fig. 6 is a front view showing an example of the drying unit according to embodiment 1.

Fig. 7 is a front view showing an example of the drying unit according to embodiment 1.

Fig. 8 is a cross-sectional view of an example of the drying unit according to embodiment 1, as viewed from above.

Fig. 9 is an enlarged sectional view showing a 1 st configuration example of the supply guide member.

Fig. 10 is an enlarged sectional view showing a 2 nd configuration example of the supply guide member.

Fig. 11 is an enlarged sectional view showing a 3 rd configuration example of the supply guide member.

Fig. 12 is an enlarged sectional view showing a 4 th configuration example of the supply guide member.

Fig. 13 is an enlarged sectional view showing a 5 th configuration example of the supply guide member.

Fig. 14 is an enlarged sectional view showing a 6 th configuration example of the supply guide member.

Fig. 15 is an enlarged sectional view showing a 7 th configuration example of the supply guide member.

Fig. 16 is a cross-sectional view of an example of the drying unit according to embodiment 3, as viewed from above.

Fig. 17 is a side view of a cross section of an example of the drying means according to embodiment 3.

Fig. 18 is a cross-sectional view of an example of the drying means of modification 1 as viewed from the side.

Description of the reference numerals

32b drying unit

60 pressure vessel

61 supply head

65 holding part

67 supply opening part

80 supply guide member

F treatment fluid

L liquid film

S processing space

W substrate

Detailed Description

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below and shown in the drawings.

Elements are shown in simplified, illustrative form in the drawings. Therefore, the form (for example, shape and size) of each element and the size ratio between elements are not always the same between drawings.

Fig. 1 is a plan view showing an example of a substrate processing apparatus 1. The X-axis direction, the Y-axis direction, and the Z-axis direction shown in the drawings are mutually perpendicular directions. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a height direction along a vertical direction in which gravity acts.

The substrate processing apparatus 1 shown in fig. 1 includes a carry-in-and-out station 2 and a processing station 3 arranged in an X-axis direction.

The loading/unloading station 2 includes a mounting table 21, a conveying unit 22, and a delivery unit 23 arranged in an X-axis direction.

The mounting table 21 is provided with a plurality of carriers C. Each carrier C accommodates a plurality of substrates W. The transport unit 22 is provided with a movable 1 st transport device 22a capable of transporting 1 or more substrates W. A transition device 23a for temporarily holding 1 or more substrates W is provided at the interface 23. The conveyance of the substrate W between each carrier C and the transition device 23a is performed by the 1 st conveyance device 22 a.

The substrate W is not limited, and is typically a semiconductor substrate (e.g., a silicon wafer or a compound semiconductor wafer) or a glass substrate. The substrate W may have a device such as an electronic circuit on the surface thereof, or may have a fine uneven pattern formed thereon.

The processing station 3 has a transport block 31 and a processing block 32.

The conveying block 31 is provided adjacent to the interface portion 23 in the X-axis direction. The transfer block 31 is provided with a movable 2 nd transfer device 31a capable of transferring the substrate W. The 2 nd conveyance device 31a conveys the substrate W between the transition device 23a and each unit of the process block 32 and between each unit of the process block 32.

The processing block 32 is disposed adjacent to the transport block 31 in the Y-axis direction. The number of processing blocks 32 is not limited. In the example shown in fig. 1, 2 processing blocks 32 are provided so as to sandwich the conveyance block 31 in the Y-axis direction. Further, the plurality of processing blocks 32 may be arranged in the Z-axis direction.

Each processing block 32 has a liquid film forming unit 32a, a drying unit 32b, and a supply unit 32 c. The number of the liquid film forming units 32a, the drying units 32b, and the supply units 32c is not limited. In the example shown in fig. 1, in each processing block 32, 2 liquid film forming units 32a, 2 drying units 32b, and 2 supply units 32c are provided.

The liquid film forming unit 32a applies a liquid to the substrate W to form a liquid film on the upper surface of the substrate W. The specific structure of the liquid film forming unit 32a is not limited. For example, the liquid film forming unit 32a includes a spin chuck for rotatably holding the substrate W and a nozzle for discharging the liquid onto the upper surface of the substrate W. The liquid supplied to the substrate W is not limited. As an example, a chemical liquid (SC1 (an aqueous solution of ammonia and hydrogen peroxide), DHF (dilute hydrofluoric acid), etc.), a rinse liquid (deionized water, etc.), and a drying liquid (organic solvent such as IPA (isopropyl alcohol), etc.) may be discharged from a nozzle in this order and supplied to the substrate W.

The drying unit 32b dries the substrate W by replacing the liquid film formed on the substrate W by the liquid film forming unit 32a with the processing fluid in a supercritical state. The processing fluid in a supercritical state has a temperature of not less than a critical temperature and a pressure of not less than a critical pressure. By using the processing fluid in a supercritical state, it is possible to dry the substrate W while suppressing collapse of the uneven pattern of the substrate W caused by the surface tension of the liquid on the substrate W. The treatment fluid is not limited, and for example, carbon dioxide (CO) may be used₂) As a treatment fluid.

The supply unit 32c supplies fluid to the drying unit 32 b. The specific structure of the supply unit 32c is not limited. Specific configuration examples of the drying unit 32b and the supply unit 32c will be described later (see fig. 2 and the like).

The substrate processing apparatus 1 further includes a control device 4 for controlling each component of the substrate processing apparatus 1. The control device 4 shown in fig. 1 is constituted by a computer, for example, and includes an arithmetic processing unit 41 and a storage unit 42.

The arithmetic processing unit 41 controls each component of the substrate processing apparatus 1 by appropriately reading and executing the program stored in the storage unit 42, thereby performing various processes. The storage unit 42 stores programs and data for various processes performed in the substrate processing apparatus 1. The program and data stored in the storage unit of the control unit 93 may be recorded in a computer-readable storage medium, or may be installed in the storage unit from the storage medium. Examples of the computer-readable storage medium include a Hard Disk (HD), a Flexible Disk (FD), an optical disk (CD), a magneto-optical disk (MO), and a memory card.

Fig. 2 is a diagram showing a specific configuration example of the drying unit 32b and the supply unit 32 c.

In the example shown in fig. 2, the supply line of the process fluid includes an upstream side supply line 50, a 1 st supply line 51, and a 2 nd supply line 52.

The upstream-side supply line 50 is connected to the 1 st fluid supply source 55, the 1 st supply line 51, and the 2 nd supply line 52. The 1 st fluid supply source 55 is a supply source of a processing fluid, and is, for example, a tank for storing the processing fluid. The process fluid is supplied from the 1 st fluid supply source 55 to the 1 st supply line 51 and the 2 nd supply line 52 through the upstream side supply line 50.

The upstream-side supply line 50 is provided with a valve 101, a heater 102, a pressure sensor 103, an orifice 104, a temperature sensor 105, and a filter 106 in this order from upstream to downstream. The terms upstream and downstream are used herein with reference to the normal flow direction of the process fluid in the drying process of the substrate W.

The valve 101 opens and closes the supply of the process fluid from the 1 st fluid supply source 55, allows the process fluid to flow into the supply line on the downstream side (i.e., the upstream supply line 50) in the open state, and does not allow the process fluid to flow into the supply line on the downstream side in the closed state. The heater 102 heats the process fluid flowing through the upstream supply line 50. The pressure sensor 103 detects the pressure of the processing fluid flowing through the upstream-side supply line 50 between the heater 102 and the orifice 104. The orifice 104 adjusts the pressure of the treatment fluid sent downstream to a desired pressure (for example, about 16 MPa). The temperature sensor 105 detects the temperature of the processing fluid flowing through the upstream-side supply line 50 between the orifice 104 and the filter 106. The filter 106 removes impurities from the processing fluid flowing in the upstream-side supply line 50.

The upstream supply line 50 shown in fig. 2 is connected not only to the 1 st fluid supply source 55 but also to the 2 nd fluid supply source 56 and the 3 rd fluid supply source 57. The 2 nd fluid supply source 56 is an IPA supply source, and is connected to a portion between the valve 101 and the heater 102 in the upstream side supply line 50 via a valve 107. The 3 rd fluid supply 57 is an inert gas (e.g., N)₂) The supply source of (2) is connected to a portion between the valve 101 and the heater 102 in the upstream side supply line 50 via a valve 108.

The 1 st supply line 51 is provided with a valve 111, an orifice 112, a pressure sensor 113, and a temperature sensor 114 in this order from upstream to downstream.

Valve 111 opens and closes the flow of process fluid in supply line 1. The orifice 112 regulates the pressure of the treatment fluid sent downstream to a desired pressure. The pressure sensor 113 detects the pressure of the process fluid flowing in the 1 st supply line 51. The temperature sensor 114 detects the temperature of the process fluid flowing in the 1 st supply line 51.

A purge line 54 is connected to a portion of the 1 st supply line 51 on the downstream side of the temperature sensor 114. The purge line 54 is connected to the 1 st supply line 51, and is connected to the purge gas supply source 121. The purge gas supply source 121 is a purge gas (e.g., N)₂Etc.) is a tank storing a purge gas, for example. A check valve 122 and a valve 123 are provided in the purge line 54 in this order from the purge gas supply source 121 to the 1 st supply line 51. Valve 123 opens and closes the flow of purge gas in purge line 54. While the supply of the process fluid to the process space of the drying unit 32b is stopped, for example, the purge gas is supplied from the purge gas supply source 121 to the process space of the drying unit 32b via the purge line 54 and the 1 st supply line 51.

The 2 nd supply line 52 includes a 1 st branch supply line 52a and a 2 nd branch supply line 52 b. The 1 st branch supply line 52a and the 2 nd branch supply line 52b extend in different directions from a portion connected to the upstream side supply line 50, but are connected to a supply head (particularly, a supply guide path (see, for example, reference numeral "66" in fig. 8)) of the drying unit 32 b. A valve 131 is provided in the 1 st branch supply line 52a, and a valve 132 is provided in the 2 nd branch supply line 52 b. Valves 131 and 132 are valves that open and close the supply of process fluid to the supply head.

The drying unit 32b is provided with a temperature sensor 141. The temperature sensor 141 detects the temperature of the processing space in the drying unit 32 b.

The discharge line 53 has a 1 st branch discharge line 53a, a 2 nd branch discharge line 53b, and a downstream side discharge line 53 c. The 1 st branch discharge line 53a and the 2 nd branch discharge line 53b are connected to a discharge path (for example, refer to reference numeral "70" of fig. 8) of the gas (including the processing fluid) from the processing space of the drying unit 32b, and are connected to the downstream side discharge line 53 c.

A temperature sensor 151, a pressure sensor 152, and a valve 153 are provided in this order from upstream to downstream in the 1 st branch discharge line 53 a. The temperature sensor 151 detects the temperature of the processing fluid flowing in the 1 st branch discharge line 53 a. The pressure sensor 152 detects the pressure of the treatment fluid flowing in the 1 st branch discharge line 53 a. Valve 153 is a valve that opens and closes the flow of the treatment fluid in 1 st branch discharge line 53 a. A valve 154 is provided in the 2 nd branch discharge line 53b, and the valve 154 opens and closes the flow of the processing fluid in the 2 nd branch discharge line 53 b.

A pressure regulating valve 155, a pressure sensor 156, a temperature sensor 157, and a valve 158 are provided in this order from upstream to downstream in the downstream discharge line 53 c. The pressure regulating valve 155 is a valve that regulates the pressure of the process fluid flowing in the downstream side discharge line 53 c. The opening degree of the pressure regulating valve 155 is adaptively regulated under the control of the control device 4 according to the pressure of the processing space of the drying unit 32 b. The pressure sensor 156 detects the pressure of the process fluid flowing in the downstream side discharge line 53 c. The temperature sensor 157 detects the temperature of the process fluid flowing in the downstream side discharge line 53 c. The valve 158 opens and closes the circulation of the process fluid in the downstream side discharge line 53 c. The valve 158 is opened when the treatment fluid is to be discharged to the outside, and the valve 158 is closed when the treatment fluid is not to be discharged to the outside.

The measurement results of the pressure sensors and the temperature sensors are transmitted to the control device 4, and used as necessary in the process for controlling the components of the substrate processing apparatus 1 (i.e., the valves, the heater 102, the pressure regulating valve 155, and other devices).

The above-described configurations of the drying unit 32b and the supply unit 32c shown in fig. 2 are merely examples, and the drying unit 32b and/or the supply unit 32c may have other configurations. For example, as a line for supplying the treatment fluid to the treatment space of the drying unit 32b, only one of the 1 st supply line 51 and the 2 nd supply line 52 may be provided. The 2 nd supply line 52 may include 3 or more branch supply lines connected to the processing space of the drying unit 32b, or may be a single line. Similarly, the discharge line 53 may include 3 or more branch discharge lines connected to the processing space of the drying unit 32b, or may be a single line. In addition, the 2 nd fluid supply source 56 and the 3 rd fluid supply source 57 may not be provided.

Next, a typical example of the drying process of the substrate W in the drying unit 32b will be described. The respective steps included in the substrate drying process (substrate processing method) described below are not described in detail, but are performed by appropriately driving the components (for example, the valves) of the substrate processing apparatus 1 under the control of the control apparatus 4.

First, the substrate W is arranged in the processing space of the drying unit 32b via the 2 nd transfer device 31a (see fig. 1), and the processing space is sealed (carried into the processing step). The term "sealed" as used herein means a state in which the processing space is hermetically sealed from the outside, but does not necessarily mean a strictly airtight state (i.e., a completely airtight state). The processing space is connected to a flow path (a supply path and a discharge path) of the processing fluid F even in a closed state, and is connected to a pipeline and equipment provided outside the drying unit 32b via the flow path. Thereafter, the processing fluid from the 1 st fluid supply source 55 is supplied to the processing space of the drying unit 32b, so that the pressure in the processing space is increased, and as a result, the processing fluid in a supercritical state is supplied to the processing space (pressure raising processing step).

Thereafter, while the pressure in the processing space of the drying unit 32b is maintained at the pressure at which the supercritical state of the processing fluid is maintained, a laminar flow of the processing fluid flowing along the surface of the substrate W is formed in the processing space (flow-through processing step). Thereby, the liquid adhering to the substrate W (for example, IPA liquid between the concave and convex patterns) is gradually replaced with the processing fluid in a supercritical state, and the liquid is gradually removed from the substrate W.

After the liquid is sufficiently removed from the substrate W, the processing fluid is discharged from the processing space of the drying unit 32b while the supply of the processing fluid to the processing space is stopped, and the pressure in the processing space is gradually decreased to a desired pressure (for example, atmospheric pressure) (pressure reducing process).

Thereafter, the substrate W is taken out from the processing space of the drying unit 32b via the 2 nd transport device 31a (see fig. 1) (carry-out processing step).

The substrate W is dried through the above-described series of steps.

Next, a specific example of the drying unit 32b will be described.

[ embodiment 1 ]

Fig. 3 to 5 are side views showing an example of the drying unit 32b of embodiment 1. Fig. 6 and 7 are front views showing an example of the drying unit 32b according to embodiment 1. Fig. 8 is a cross-sectional view of an example of the drying unit 32b according to embodiment 1, as viewed from above.

In the examples shown in fig. 3 to 8, the 1 st supply line 51 (see fig. 2) is not provided. That is, the 1 st supply line 51 is not connected to the processing space S of the drying unit 32b, and the processing fluid F is supplied only from the 2 nd supply line 52 (the 1 st branch supply line 52a and the 2 nd branch supply line 52 b). However, the technique described below can also be applied to an apparatus and a method in which the 1 st supply line 51 is connected to the drying unit 32b and the process fluid F is supplied to the process space S from both the 1 st supply line 51 and the 2 nd supply line 52.

As described above, the drying unit 32b functions as a substrate processing apparatus that dries the substrate W to which the liquid has adhered by using the processing fluid F in a supercritical state. The drying unit 32b shown in fig. 3 to 8 includes: a pressure vessel (process vessel) 60 having a process space S; a supply head 61 for supplying a process fluid F to the process space S; and a discharge head 62 for discharging the processing fluid F from the processing space S.

The pressure vessel 60 has a hollow structure and has a processing space S inside. The processing space S is defined by the pressure vessel 60 covering the space from the outside, but both ends of the processing space S in the horizontal direction (Y-axis direction) are open without being covered by the pressure vessel 60. The openings at both ends of the processing space S face each other, and are positioned in the processing space S so as to sandwich the substrate W placed at the holding position.

As shown in fig. 8, the pressure vessel 60 of the present example has 2 vessel discharge paths 70 formed therethrough. These tank discharge paths 70 are connected to the 1 st branch discharge line 53a and the 2 nd branch discharge line 53b, respectively, and constitute a part of a discharge path of the process fluid F as described later.

The pressure vessel 60 accommodates the substrate W to be dried inside by introducing the substrate W into the processing space S and disposing the substrate W in the processing space S. The substrate W is held at a holding position inside the pressure vessel 60 by a holding portion 65 (see fig. 7).

The specific structure of the holding portion 65 is not limited. The holding portion 65 of this example is constituted by a plurality of pins extending upward in the processing space S. Each pin may be fixedly provided with respect to the pressure vessel 60, may be provided movably with respect to the pressure vessel 60, and may be provided so as to be capable of advancing and retreating in the height direction, for example. By placing the substrate W on these pins, the substrate W is supported from below by the plurality of pins.

The supply head 61 is provided so as to cover an opening on one side of the processing space S. The supply head 61 has a plurality of supply opening portions 67 for discharging the processing fluid F into the processing space S inside the pressure vessel 60, and functions as a fluid supply portion for supplying the processing fluid F into the processing space S.

A sealing member (not shown) is provided between the supply head 61 and the pressure vessel 60, and the airtightness of the processing space S between the supply head 61 and the pressure vessel 60 is ensured by the sealing member.

The specific structure of the supply head 61 is not limited. As shown in fig. 8, the supply head 61 of the present example includes a supply body 61a, a supply guide path 66 formed of a space formed in the supply body 61a, a plurality of supply openings 67, and a supply recess 63.

The supply guide path 66 extends in the horizontal direction (in this example, the X-axis direction). The 1 st branch supply line 52a and the 2 nd branch supply line 52b are connected to openings at both ends of the supply guide path 66, respectively. The processing fluid F is supplied to the supply guide path 66 via the 1 st branch supply line 52a and the 2 nd branch supply line 52 b.

The plurality of supply openings 67 are arranged in a horizontal direction (in this example, the X-axis direction) along the supply guide path 66, and are connected to the supply guide path 66 and the supply recess 63, respectively. In the example shown in fig. 8, a plurality of supply openings 67 are distributed in the X-axis direction in a range covering the entire range of the substrate W disposed at the holding position.

The specific arrangement of the plurality of supply openings 67 is not limited. For example, the plurality of supply openings 67 may be provided in a line at different positions in the horizontal direction (particularly, in the X-axis direction). Further, the supply opening row composed of 2 or more supply openings 67 arranged in the horizontal direction (X-axis direction) may be arranged in the height direction (Z-axis direction) by 2 or more.

In the case of the configuration shown in fig. 8, the ejection state of the processing fluid F from each supply opening 67 can be changed according to the distance from the 1 st branch supply line 52a and the 2 nd branch supply line 52 b. For example, the treatment fluid F tends to be ejected more strongly from the supply opening 67 facing the central portion of the supply guide path 66 where the treatment fluid F from the 1 st branch supply line 52a and the treatment fluid F from the 2 nd branch supply line 52b merge.

Therefore, the number density, the pore diameter, and/or the pore shape of each supply opening portion 67 may also be changed in accordance with the distance from the 1 st branch supply line 52a and the 2 nd branch supply line 52 b. This makes it possible to uniformize the discharge state (for example, discharge speed, discharge amount, and the like) of the processing fluid F from the plurality of supply openings 67.

Alternatively, the number density, the pore diameter, and/or the pore shape of each supply opening 67 may be determined regardless of the distance from the 1 st branch supply line 52a and the 2 nd branch supply line 52 b. For example, the number density, the pore diameter, and/or the pore shape of each supply opening portion 67 may be made uniform regardless of the distance from the 1 st branch supply line 52a and the 2 nd branch supply line 52 b. In this case, the flow of the processing fluid F in the processing space S can be intentionally made non-uniform. If necessary, a part of the plurality of supply openings 67 may be sealed, and the processing fluid F may be discharged from the supply head 61 only to a part of the processing space S.

The supply recess 63 constitutes a lateral fluid relief portion 71 that opens into the processing space S. The processing fluid F is discharged from the lateral fluid discharging portion 71 to the processing space S, passes around the substrate W disposed at the holding position, and reaches the discharge head 62.

As described above, in this example, the supply head 61 (the supply guide path 66, the supply openings 67, and the supply recess 63) located at a position horizontally offset from the substrate W placed at the holding position constitutes a supply path for guiding the processing fluid F to the processing space S.

At least a part of the supply guide member (1 st supply guide member) 80 is positioned in the supply recess 63.

The supply guide member 80 is located between the plurality of supply openings 67 and a holding position where the substrate W is positioned in the processing space S, and is opposed to each supply opening 67. The supply guide member 80 guides the processing fluid F that has flowed into the supply recess 63 from each supply opening 67, and causes the processing fluid F to flow out from the lateral fluid discharge portion 71 into the processing space S.

Specifically, the supply guide member 80 guides the processing fluid F from each supply opening 67 to the processing space S (particularly, the substrate W disposed at the holding position) while spreading the processing fluid over a range having an area larger than the opening area of each supply opening 67. This makes it possible to send the processing fluid F having a uniform flow to the periphery of the substrate W (particularly, the upper surface of the substrate W), and to stabilize the drying process of the substrate W.

The "area" referred to herein can be based on, for example, a plane (X-Z plane) perpendicular to the Y-axis direction (horizontal direction). The specific direction in which the range of the processing fluid F is expanded by the supply guide member 80 is not limited. The range of the treatment fluid F may be expanded in 1 or more radial directions with respect to the Y axis by the supply guide member 80. For example, the range of the treatment fluid F may be expanded in the X-axis direction, may be expanded in the Z-axis direction, or may be expanded in a direction inclined with respect to both the X-axis direction and the Z-axis direction.

Thus, the supply guide member 80 shown in fig. 8 is located at a position horizontally shifted from the substrate W placed at the holding position between each supply opening 67 and the holding position.

The specific configuration of the supply guide member 80 is not limited, and specific configuration examples of the supply guide member 80 will be described later (see fig. 9 to 12).

The discharge head 62 is provided so as to cover the opening on the other side of the processing space S. The discharge head 62 has a plurality of discharge openings 68 into which the processing fluid F flows from the processing space S inside the pressure vessel 60, and functions as a fluid discharge portion that facilitates discharge of the processing fluid F from the processing space S.

The specific structure of the discharge head 62 is not limited. The discharge head 62 of this example includes a discharge body 62a, a discharge rotation shaft 62b attached to the discharge body 62a, and a discharge path forming portion 62 c. The discharge body 62a, the discharge rotation shaft 62b, and the discharge path forming portion 62c shown in fig. 3 to 8 are integrally formed of the same member.

The discharge head 62 is provided movably and can be disposed at a closing position for covering the other opening of the processing space S and at an opening position for not covering the other opening of the processing space S. Specifically, under the control of the control device 4 (see fig. 1), the power from an opening/closing drive device (not shown) is transmitted to the discharge rotation shaft 62b, whereby the entire discharge head 62 performs horizontal movement and rotational movement.

For example, the discharge head 62 moves in the horizontal direction (Y-axis direction in this example) from the closed position (see fig. 3 and 6) and is separated from the pressure vessel 60 (see fig. 4). The discharge head 62 is disposed at the open position by rotating about the discharge rotation shaft 62b so as not to contact or collide with the pressure vessel 60 (see fig. 5 and 7).

On the other hand, when the discharge head 62 is moved from the open position to the closed position, a series of operations are performed in the reverse order of the above-described "series of operations for moving from the closed position to the open position".

In a state where the discharge head 62 is disposed at the closed position, a seal member (not shown) is positioned between the discharge head 62 and the pressure vessel 60. By this sealing member, the airtightness of the processing space S between the discharge head 62 and the pressure vessel 60 is ensured.

When the discharge head 62 is disposed at the open position, the processing space S is opened in the horizontal direction as shown in fig. 7. The discharge path forming portion 62c of this example has an コ -shaped cross section. Thus, in a state where the discharge head 62 is disposed at the open position, the discharge path forming portion 62c does not cover a part or the whole of the processing space S from the horizontal direction.

The process of feeding the substrate W into the processing space S and the process of feeding the substrate W out of the processing space S are performed in a state where the discharge head 62 is disposed at the open position. That is, the 2 nd transport device 31a (see fig. 1) moves in the horizontal direction together with the substrate W, enters the processing space S through the horizontally opened opening of the processing space S, and hands the substrate W to the holding portion 65. The 2 nd transport device 31a enters the processing space S through the horizontally opened opening of the processing space S, receives the substrate W from the holding portion 65, and moves in the horizontal direction together with the substrate W to retract from the processing space S.

By providing the discharge head 62 movably in this manner, an appropriate gap for carrying in and out the substrate W to and from the processing space S can be secured. Further, the supply head 61 may be provided movably in addition to the discharge head 62 or instead of the discharge head 62. In these cases, too, an appropriate gap for conveying the substrate W to the processing space S can be ensured.

As shown in fig. 8, the discharge path forming portion 62c has a plurality of discharge openings 68 and discharge guide paths 69.

The plurality of discharge openings 68 are arranged in a horizontal direction (in this example, the X-axis direction) along the discharge guide path 69, and are connected to the discharge guide path 69. In the example shown in fig. 8, a plurality of discharge openings 68 are arranged in a distributed manner in the X-axis direction within a range covering the entire range of the substrate W arranged at the holding position. The discharge guide path 69 extends in the horizontal direction (in this example, the X-axis direction).

In a state where the discharge head 62 is disposed at the closed position, the discharge path forming portion 62c is located inside the pressure vessel 60 (i.e., the processing space S). In this state, the plurality of discharge openings 68 are connected to the processing space S and the discharge guide path 69, and the openings at both ends of the discharge guide path 69 are connected to the container discharge path 70. As a result, the discharge opening portions 68, the discharge guide path 69, and the container discharge paths 70 are connected to each other.

Therefore, the processing fluid F can flow into the discharge guide path 69 from the processing space S through the discharge openings 68, and then flow out from the discharge guide path 69 to the 1 st branch discharge line 53a and the 2 nd branch discharge line 53b through the container discharge path 70.

As described above, in this example, the discharge head 62 (the discharge opening 68 and the discharge guide path 69) and the pressure vessel 60 (the vessel discharge paths 70) constitute a discharge path for guiding the processing fluid F from the processing space S in the pressure vessel 60 to the outside of the pressure vessel 60.

The drying process of the substrate W in the drying unit 32b having the above-described configuration is performed, for example, as follows.

First, in a state where the discharge head 62 is disposed at the open position, the substrate W is carried into the processing space S and held by the holding portion 65 at the holding position (carrying-in processing step).

After that, the discharge head 62 is disposed at the closing position. Thereby, the processing space S is closed by the pressure vessel 60, the supply head 61, and the discharge head 62. However, the processing space S is connected to the 1 st branch supply line 52a and the 2 nd branch supply line 52b via supply paths (the supply concave portion 63, the supply opening portions 67, and the supply guide path 66). The processing space S is connected to the 1 st branch discharge line 53a and the 2 nd branch discharge line 53b via discharge paths (the discharge openings 68, the discharge guide path 69, and the container discharge paths 70).

Then, the processing fluid F sent through the 1 st branch supply line 52a and the 2 nd branch supply line 52b flows into the supply guide path 66, the supply openings 67, and the supply recess 63 (pressure increasing process step and flow processing step). The processing fluid F is discharged from the lateral fluid discharge portion 71 to the processing space S after being rectified by the supply opening portion 67, passes around the substrate W in a laminar flow state, and then is discharged to the discharge head 62. Then, the processing fluid F passes through the discharge openings 68, the discharge guide path 69, and the tank discharge paths 70, and flows out to the 1 st branch discharge line 53a and the 2 nd branch discharge line 53 b.

The substrate W is dried by the processing fluid F continuously flowing around the substrate W in this way. In particular, since the processing fluid F flows around the substrate W while being prevented from being swirled or retained by the supply guide member 80, the drying process of the substrate W can be stably performed. As a result, collapse of the uneven pattern of the substrate W and generation of particles can be suppressed.

After the substrate W is sufficiently dried, the pressure in the processing space S is reduced (pressure reduction processing step).

Then, the discharge head 62 is disposed at the open position, and the substrate W is discharged from the processing space S (discharge processing step).

Next, a specific configuration example of the supply guide member 80 according to embodiment 1 will be described.

[ 1 st configuration example of supply guide Member ]

Fig. 9 is an enlarged sectional view showing a 1 st configuration example of the supply guide member 80.

In this example, the plurality of supply openings 67 are provided in a line at mutually different positions in the horizontal direction (particularly, in the X-axis direction).

The supply guide member 80 has an integral structure extending in the horizontal direction (particularly, the X-axis direction), and faces the supply opening 67. The supply guide member 80 is fixed to the supply main body portion 61a by a fixing member (not shown) such as a screw, a bolt, or a bolt.

The supply guide member 80 may have any shape that can adjust the diffusion and flow velocity of the processing fluid F ejected from each supply opening 67 and contribute to the homogenization of the flow of the processing fluid F. The shape of the supply guide member 80 is preferably determined according to actual design conditions and applications.

The supply guide member 80 shown in fig. 9 has a blade shape (airfoil shape), and guides the processing fluid F from the supply opening portion 67 so as to spread in the height direction (Z-axis direction). The supply guide member 80 is disposed so that the leading edge of the blade faces the supply opening 67 and the trailing edge of the blade faces the processing space S (the substrate W disposed at the holding position). The upper and lower surfaces of the supply guide member 80 have a smooth surface shape, and do not obstruct the flow of the processing fluid F from the supply opening 67 to the processing space S (particularly, the substrate W disposed at the holding position).

The flow path of the processing fluid F in the supply recess 63 is divided by the supply main body 61a and the supply guide member 80. The supply guide member 80 shown in fig. 9 is gradually increased in height and then gradually decreased in height in a direction (Y-axis direction) from the supply opening 67 toward the processing space S. Therefore, the flow path of the processing fluid F in the supply recess 63 gradually narrows in the height direction and then gradually widens in the height direction in the direction (Y-axis direction) from the supply opening 67 to the processing space S.

The supply guide member 80 having such a blade shape is effective for ensuring the flow of the processing fluid F in the direction (Y-axis direction) from each supply opening 67 toward the substrate W (holding position) and guiding the processing fluid F to spread in the direction perpendicular to the Y-axis direction. However, the specific blade shape (e.g., blade chord, center line, maximum blade thickness, and maximum camber) of the supply guide member 80 is not limited.

The processing fluid F is guided by the supply guide member 80, and is gradually peeled off from the supply guide member 80 as it advances toward the rear of the supply guide member 80 (i.e., toward the substrate W disposed at the holding position). The processing fluid F peeled off from the supply guide member 80 at an early stage has a strong tendency to travel toward the end portions (upper and lower end portions) in the height direction of the lateral fluid releasing portion 71. The processing fluid F peeled off from the supply guide member 80 at a relatively slow stage tends to travel toward the height direction center portion of the lateral fluid discharge portion 71.

By using the supply guide member 80 having an optimal blade cross section (air foil) to discharge the processing fluid F into the processing space S, the flow velocity distribution of the processing fluid F in the processing space S can be improved, and scattering of liquid from the substrate W and local drying at the time of initial pressure increase can be suppressed.

The supply recess 63 has an opening area that gradually increases as it is farther from each supply opening 67 (i.e., as it approaches the processing space S (particularly, the substrate W disposed at the holding position)). Immediately after the treatment fluid F is discharged from each supply opening 67, the treatment fluid F collides with the supply guide member 80 and spreads, and the flow velocity distribution of the treatment fluid F is smoothed.

Specifically, the processing fluid F is diffused in the X-axis direction (horizontal direction) through the supply guide path 66, and then is ejected from each supply opening 67 to collide with the supply guide member 80, thereby being diffused in the Z-axis direction. Thereafter, the flow velocity of the processing fluid F in the Y-axis direction (horizontal direction) is uniformized at a portion of the supply recess 63 which is locally narrowed between the supply main body portion 61a and the supply guide member 80. Thereafter, the processing fluid F is gradually peeled off from the surface of the supply guide member 80, and the processing fluid F is diffused again in the Z-axis direction.

The processing fluid F is subjected to these multi-stage diffusion processes to make the flow uniform in the X-axis direction, the Y-axis direction, and the Z-axis direction, and then flows into the processing space S from the lateral fluid discharging portion 71.

As described above, according to the supply guide member 80 of the present configuration example, the flow velocity of the processing fluid F is reduced and the momentum is suppressed immediately after the processing fluid F is discharged from each supply opening 67, and the processing fluid F is discharged from the lateral fluid discharging portion 71 to the processing space S in a state where the flow state is made uniform. Therefore, the processing fluid F in the supercritical state is guided in a uniform state over the entire substrate W (particularly, the upper surface), and local drying of the substrate W can be suppressed, so that the entire drying process of the substrate W can be stably performed.

The supply guide member 80 of the present configuration example is disposed at least partially inside the supply head 61 (i.e., the supply recess 63). This makes it possible to unitize the supply head 61 and the supply guide member 80, and to simplify the structure of the pressure vessel 60. In addition, the supply head 61 and the supply guide member 80 having a space-saving structure can be used.

[ simulation results ]

The present inventors actually performed a simulation using a computer and examined the simulation result of the flow state of the process fluid F in the case of using the supply head 61 and the supply guide member 80 of the 1 st configuration example shown in fig. 9.

At this time, a simulation was also performed under substantially the same conditions for the drying unit 32b that includes the supply head 61 shown in fig. 9 but does not include the supply guide member 80.

In the case where the drying unit 32b does not include the supply guide member 80, the difference in flow speed of the treatment fluid F between the portion facing the supply opening 67 and the portion not facing the supply opening 67 is large. Therefore, it was confirmed that the vortex flow and the stagnation of the treatment fluid F are likely to occur at the portion corresponding to the portion between the adjacent supply openings 67 (i.e., the portion not facing the supply openings 67).

Further, it is understood that even when the supply guide member 80 is not provided, the generation of the vortex flow and the stagnation of the processing fluid F in the supply recess 63 can be reduced by reducing the cross-sectional area (particularly, the height-direction dimension) of the lateral fluid discharging portion 71. However, in this case, since the treatment fluid F is strongly discharged from the lateral fluid discharging portion 71, it is confirmed that a vortex and a stagnation of the treatment fluid F are likely to occur in a portion of the treatment space S not facing the lateral fluid discharging portion 71.

As described above, in the case where the drying unit 32b does not include the supply guide member 80, a vortex or stagnation of the treatment fluid F occurs, and it is found that it is difficult to uniformize and stabilize the flow of the treatment fluid F.

On the other hand, in the case where the drying unit 32b includes the supply guide member 80, it is found that the generation of the eddy and the stagnation of the treatment fluid F is effectively reduced, the treatment fluid F smoothly flows around the substrate W without stagnation, and the homogenization and the stabilization of the flow of the treatment fluid F are promoted.

[ 2 nd configuration example of supply guide Member ]

In this configuration example, the same matters as in the above-described configuration example 1 will not be described in detail.

Fig. 10 is an enlarged sectional view showing a configuration example 2 of the supply guide member 80.

A plurality of supply guide members 80 are provided in the supply recess 63. Each supply guide member 80 has a blade shape, extends entirely in the X-axis direction of the supply recess 63, and is fixed to the supply main body portion 61 a.

These supply guide members 80 are provided in multiple stages in the direction (Y-axis direction) from the supply openings 67 to the holding position. That is, 1 or more supply guide members 80 are provided at the 1 st arrangement position in the Y axis direction, and 1 or more supply guide members 80 are provided at the 2 nd arrangement position different from the 1 st arrangement position in the Y axis direction.

In the example shown in fig. 10, the other supply guide member 80 is positioned above and below the supply guide member 80 positioned at the front stage (i.e., on the supply opening 67 side) in the Y-axis direction, respectively. Thus, the processing fluid F diffused in the vertical direction by the supply guide member 80 of the preceding stage is further diffused in the vertical direction by the supply guide member 80 of the subsequent stage (i.e., the holding position side). As a result, the flow of the processing fluid F in the direction (Y-axis direction) from each supply opening 67 toward the substrate W (holding position) can be ensured, and the diffusion of the processing fluid F in the height direction can be more effectively promoted.

Note that fig. 10 shows a plurality of supply guide members 80 in a simplified manner, and the number, shape, and arrangement position of the supply guide members 80 are not limited.

As described above, according to the plurality of supply guide members 80 of the present configuration example, the processing fluid F can be diffused in the height direction in a plurality of stages and can be discharged from the lateral fluid discharging portion 71 in a more uniform flowing state.

[ 3 rd configuration example of supply guide Member ]

In this configuration example, the same matters as in the above-described configuration example 1 will not be described in detail.

Fig. 11 is an enlarged sectional view showing a configuration example 3 of the supply guide member 80.

The supply guide member 80 is provided movably so that the state of the guide of the processing fluid F from each supply opening portion 67 can be changed. The blade-shaped supply guide member 80 shown in fig. 11 is rotationally moved (swung) in the supply recess 63 as shown by the solid line and the two-dot chain line.

The supply guide member 80 may be moved by a driving device not shown under the control of the control device 4, or the direction of the supply guide member 80 may be adjusted by manually rotating the supply guide member 80 by an operator.

According to the supply guide member 80 of the present configuration example, the balance of the flow velocity (flow rate) of the treatment fluid F can be appropriately changed in the height direction.

[ 4 th configuration example of supply guide Member ]

In this configuration example, the same matters as in the above-described configuration example 1 will not be described in detail.

Fig. 12 is an enlarged sectional view showing a 4 th configuration example of the supply guide member 80.

The plurality of supply openings 67 may include 2 or more supply openings 67 provided at different positions in the height direction. The supply guide member 80 may have an integral structure facing the plurality of supply openings 67 provided at different positions in the height direction.

In the example shown in fig. 12, 3 supply opening portions 67 are arranged in the height direction, and the blade-shaped supply guide member 80 is opposed to the 3 supply opening portions 67 in the supply recess 63.

The combining passage 72 is provided between the supply opening portions 67 and the supply guide member 80, which are provided at mutually different positions in the height direction. The merging channel 72 is at least partially formed by the supply recess 63. The processing fluid F discharged from the plurality of supply openings 67 at least partially merges in the merging channel 72, and then collides with the supply guide member 80 and is guided by the supply guide member 80.

According to the present configuration example, the processing fluid F is diffused in the height direction before reaching the supply guide member 80 by the plurality of supply opening portions 67 provided at different positions in the height direction.

Further, the processing fluids F discharged from the plurality of supply openings 67 provided at different positions in the height direction merge together in the merging passage 72, and thus the homogenization of the flow can be promoted before reaching the supply guide member 80.

[ 2 nd embodiment ]

In the drying unit 32b of the present embodiment, the same reference numerals are given to the same or corresponding elements as those in the drying unit 32b of the above-described embodiment 1, and detailed description thereof will be omitted.

Fig. 13 to 15 are cross-sectional views of an example of the drying unit 32b according to embodiment 2 as viewed from above, and show the supply guide member 80 according to the 5 th to 7 th configuration examples, respectively.

The supply main body 61a of the supply head 61 of the present embodiment has the supply guide path 66 and the plurality of supply openings 67, but does not have the supply recess 63. Therefore, the processing fluid F enters the processing space S immediately after being discharged from each supply opening 67.

The supply guide member 80 is provided in the processing space S, faces each supply opening 67 between each supply opening 67 and the substrate W (holding position), and partially surrounds the substrate W placed at the holding position from the outside in the horizontal direction. The fixing method of the supply guide member 80 is not limited, but typically, the supply guide member 80 is directly or indirectly fixed by the pressure vessel 60.

In the drying unit 32b of the present embodiment, the processing fluid F is also diffused by the supply guide member 80 after being discharged from each supply opening 67, thereby promoting the homogenization of the flow of the processing fluid F. Therefore, the generation of the vortex and the stagnation of the treatment fluid F in the treatment space S can be suppressed.

Further, by providing the supply guide member 80 so as to partially surround the substrate W from the outside in the horizontal direction, the processing fluid F generated immediately after the flow rectification by the supply guide member 80 can be made to flow around the substrate W.

The supply guide member 80 is provided between the holding position (substrate W) and the supply head 61 (each supply opening 67) because it is necessary to diffuse and rectify the processing fluid F before the processing fluid F reaches the substrate W placed at the holding position. Therefore, from the viewpoint of carrying in and out the substrate W smoothly with respect to the processing space S, it is preferable that the substrate W is carried in and out to the processing space S through the opening on the discharge head 62 side.

The supply guide member 80 is preferably provided in a range that does not hinder the feeding and discharging of the substrate W into and out of the processing space S. Therefore, in order to secure a path for the carry-in and the carry-out of the substrate W in the processing space S, it is preferable that the supply guide member 80 is not provided between the holding position (substrate W) and the discharge head 62.

Next, a specific configuration example of the supply guide member 80 according to embodiment 2 will be described.

[ 5 th configuration example of supply guide Member ]

In this configuration example, the same matters as in the above-described configuration example 1 will not be described in detail.

Fig. 13 is an enlarged sectional view showing a configuration example 5 of the supply guide member 80.

The supply guide member 80 provided in the processing space S has an integral structure and has a shape along the outer periphery of the substrate W disposed at the holding position.

In this case, the supply guide member 80 may have a blade shape, and the leading edge portion of the supply guide member 80 may be positioned on the supply head 61 side and the trailing edge portion of the supply guide member 80 may be positioned on the substrate W side arranged at the holding position.

According to the supply guide member 80 of the present configuration example, the processing fluid F that has been diffused and rectified in the height direction by the supply guide member 80 can be made to flow around the substrate W.

[ 6 th configuration example of supply guide Member ]

In this configuration example, the same matters as those in the above-described configuration example 5 will not be described in detail.

Fig. 14 is an enlarged sectional view showing a 6 th configuration example of the supply guide member 80.

In the present configuration example, the plurality of supply guide members 80 are arranged in the arrangement direction (X-axis direction in the example shown in fig. 14) of the plurality of supply openings 67.

That is, the substrate W disposed at the holding position in the processing space S is spaced apart from each supply opening 67 in the 1 st horizontal direction (Y-axis direction in the example shown in fig. 14). The plurality of supply guides 80 are arranged in a 2 nd horizontal direction (X-axis direction in the example shown in fig. 14) perpendicular to the 1 st horizontal direction.

In this way, one end of the plurality of supply guide members 80 arranged in the 2 nd horizontal direction faces each supply opening 67 at a position close to each supply opening 67, and the other end partially surrounds the substrate W arranged at the holding position from the outside in the horizontal direction at a position close to the substrate W.

In the example shown in fig. 14, the Y-axis direction position of the end portion of each supply guide member 80 on the supply head 61 side is the same between the supply guide members 80. On the other hand, the Y-axis direction position of the end portion of each supply guide member 80 on the substrate W side (i.e., the discharge head 62 side) is determined based on the X-axis direction position, and the supply guide members 80 are not necessarily the same. Therefore, the length of each supply guide member 80 in the Y axis direction changes depending on the position in the X axis direction.

According to the supply guide member 80 of the present configuration example, the processing fluid F is guided by the plurality of supply guide members 80 immediately after being discharged from the supply openings 67, and the processing fluid F immediately after being diffused and rectified by the supply guide members 80 can be made to flow around the substrate W.

In the example shown in fig. 14, each of the supply guide members 80 has a blade shape that guides the processing fluid F from each of the supply openings 67 so as to spread in the horizontal direction (the X-axis direction in the example shown in fig. 14). That is, the streamline-shaped surface of each supply guide member 80 faces the X-axis direction, and the processing fluid F guided by each supply guide member 80 peels off from the supply guide member 80 so as to spread in the X-axis direction. Therefore, the processing fluid F uniformly diffused in the X-axis direction can be made to flow around the substrate W disposed at the holding position.

[ 7 th configuration example of supply guide Member ]

In this configuration example, the same matters as in the above-described configuration example 5 will not be described in detail.

Fig. 15 is an enlarged sectional view showing a 7 th configuration example of the supply guide member 80.

In the present configuration example, the plurality of supply guide members 80 are arranged in the processing space S in both the arrangement direction (X-axis direction) of the plurality of supply openings 67 and the horizontal direction (Y-axis direction) perpendicular to the arrangement direction of the plurality of supply openings 67.

That is, the substrate W placed at the holding position is spaced apart from each supply opening 67 in the 1 st horizontal direction (Y-axis direction in the example shown in fig. 15). The plurality of supply guide members 80 include 2 or more supply guide members 80 arranged in the 1 st horizontal direction (Y-axis direction) and 2 or more supply guide members 80 arranged in the 2 nd horizontal direction (X-axis direction) perpendicular to the 1 st horizontal direction.

The substrate W placed at the holding position is partially surrounded from the outside in the horizontal direction by 2 or more supply guide members 80 placed at positions different from each other in both the 1 st horizontal direction (Y-axis direction) and the 2 nd horizontal direction (X-axis direction).

Specifically, not only the plurality of supply guide members 80 facing the supply openings 67 at positions close to the supply openings 67, but also the plurality of supply guide members 80 partially surrounding the substrate W placed at the holding position from the outside in the horizontal direction at positions close to the substrate W are provided.

Note that fig. 15 shows a plurality of supply guide members 80 in a simplified manner, and the number, shape, and arrangement position of the supply guide members 80 are not limited.

According to the supply guide member 80 of the present configuration example, the processing fluid F is guided by the plurality of supply guide members 80 immediately after being discharged from the supply openings 67, and the processing fluid F immediately after being diffused and rectified by the supply guide members 80 can be made to flow around the substrate W.

The supply guide members 80 shown in fig. 15 each have a blade shape that guides the processing fluid F from the supply opening portions 67 so as to spread in the horizontal direction (the X-axis direction in the example shown in fig. 14). Therefore, the processing fluid F uniformly diffused in the X-axis direction can be made to flow around the substrate W disposed at the holding position.

In the example shown in fig. 15, the other supply guide members 80 are positioned on one side and the other side in the X-axis direction with respect to the supply guide member 80 positioned on the front stage in the Y-axis direction. Thus, the processing fluid F diffused in the X-axis direction by the supply guide member 80 of the preceding stage is further diffused in the X-axis direction by the supply guide member 80 of the subsequent stage. As a result, the flow of the processing fluid F in the direction (Y-axis direction) from each supply opening 67 toward the substrate W (holding position) can be ensured, and the diffusion of the processing fluid F in the X-axis direction can be more effectively promoted.

[ embodiment 3 ]

In the drying unit 32b of the present embodiment, the same or corresponding elements as those in the drying unit 32b of embodiment 1 described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

Fig. 16 is a cross-sectional view of an example of the drying unit 32b according to embodiment 3, as viewed from above. Fig. 17 is a side view of a cross section of an example of the drying unit 32b according to embodiment 3.

As a fluid supply unit for supplying the processing fluid F to the processing space S, a pressure vessel 60 (2 nd fluid supply unit) having a plurality of lower branch passages (2 nd supply opening portions) 76 is provided in addition to a supply head 61 (1 st fluid supply unit) having a plurality of supply opening portions 67 (1 st supply opening portion).

A lower guide path 75, a plurality of lower branch paths 76, and a plurality of lower supply concave portions 77 are formed in a portion of the pressure vessel 60 located on the lower side. The lower guide path 75, the plurality of lower branch paths 76, and the plurality of lower supply recesses 77 are located at positions shifted downward from the substrate W placed at the holding position.

The lower guide path 75 includes a portion extending in the height direction and a portion extending in the horizontal direction connected in the height direction. The 1 st supply line 51 (see fig. 2) is connected to a portion of the lower guide path 75 extending in the height direction. The processing fluid F supplied from the 1 st supply line 51 flows into a portion extending in the horizontal direction via a portion extending in the height direction of the lower guide path 75.

The plurality of lower branch paths 76 are connected to the horizontally extending portion of the lower guide path 75, and are provided along a plurality of concentric circles having different radii.

The plurality of lower supply concave portions 77 are connected to the plurality of lower branch paths 76, respectively, and are provided along a plurality of concentric circles having different radii from each other. Each of the lower supply recesses 77 constitutes a lower fluid discharge portion 73 that opens into the processing space S.

In the present embodiment, as the guide member, in addition to the 1 st supply guide member 80a positioned between each supply opening 67 and the holding position in the horizontal direction, a plurality of 2 nd supply guide members 80b positioned between each lower branch passage 76 and the holding position in the height direction are provided.

The plurality of 2 nd supply guide members 80b shown in fig. 16 and 17 are disposed in the plurality of lower supply recesses 77, respectively, and are provided along a plurality of concentric circles having different radii. Each of the 2 nd supply guide members 80b guides the processing fluid F from the opposing lower branch passage 76 so as to extend over a range of area larger than the opening area of the lower branch passage 76.

In the example shown in fig. 16 and 17, the 1 st supply guide member 80a has the same configuration as the supply guide member 80 (see fig. 9) of the 1 st configuration example described above, and the 2 nd supply guide member 80b has the same blade shape as the supply guide member 80 of the 1 st configuration example.

In order to rapidly increase the pressure in the processing space S in the pressure increasing process, it is required to feed a large amount of the processing fluid F into the processing space S in a short time. In this case, in order to prevent the scattering of the liquid on the upper surface of the substrate W and the local drying of the upper surface of the substrate W, the supply of the processing fluid F from below the substrate W may be started before the supply of the processing fluid F from the lateral direction of the substrate W is started.

In the present embodiment, the processing fluid F supplied from below the substrate W to the processing space S is also diffused and rectified by the guide member (i.e., the 2 nd supply guide member 80 b). In this way, the 2 nd supply guide members 80b suppress the momentum of the processing fluid F supplied from below the substrate W to the processing space S, and the processing fluid F flowing uniformly is sent out from below the substrate W to the processing space S, whereby scattering of liquid from the substrate W and local drying of the substrate W can be suppressed.

[ 1 st modification ]

Fig. 18 is a cross-sectional view of an example of the drying unit 32b of modification 1 as viewed from the side.

In the present modification, a plurality of substrates W (2 substrates W in the example shown in fig. 18) are aligned and held in the height direction at holding positions by holding portions (not shown) in the processing space S. Further, a plurality of supply guide members 80 corresponding to the respective substrates W are arranged in the height direction. Further, a plurality of discharge guide members 83 corresponding to the respective substrates W are arranged in a row in the height direction.

The holding portion (not shown) for holding the substrate W may have any configuration. For example, a plurality of mounting portions fixed to the pressure vessel 60, that is, a plurality of mounting portions supporting the corresponding substrates W from below may be provided as the holding portion.

Each supply guide member 80 is provided at a height direction position corresponding to the height direction position of the corresponding substrate W. Each supply guide member 80 is positioned so as to face the corresponding supply opening 67.

In the example shown in fig. 18, 1 supply opening 67 corresponds to 1 supply guide member 80, and 2 supply openings 67 are arranged in the height direction, as in the example shown in fig. 9 described above. Each supply opening 67 is connected to the supply guide path 66 of the supply main body 61a and the corresponding supply recess 63. In the example shown in fig. 18, the common supply guide path 66 is connected to the plurality of supply openings 67, but the plurality of supply openings 67 may be connected to the supply guide paths 66 provided separately.

A part or the whole of each supply guide member 80 is positioned in the corresponding supply recess 63.

Each of the supply guide members 80 shown in fig. 18 has the same blade shape as the supply guide member 80 shown in fig. 9, but may have another shape (for example, see fig. 10 to 12).

Each of the discharge guide members 83 is provided at a height direction position corresponding to the height direction position of the corresponding substrate W, and is positioned so as to face the corresponding discharge opening 68.

In the example shown in fig. 18, 1 discharge opening 68 corresponds to 1 discharge guide member 83, and 2 discharge openings 68 are arranged in the height direction. Each discharge opening 68 is connected to the discharge guide path 69 of the discharge main body 62a and the corresponding discharge recess 84. In the example shown in fig. 18, the common discharge guide path 69 is connected to the plurality of discharge openings 68, but the plurality of discharge openings 68 may be connected to the discharge guide paths 69 provided separately.

A part or the whole of each discharge guide member 83 is positioned in each corresponding discharge recess 84. Each of the discharge recesses 84 constitutes a fluid outflow portion 85 opening into the processing space S. Each of the discharge guide members 83 shown in fig. 18 has the same blade shape as the supply guide member 80, but may have another shape (see, for example, fig. 10 to 12).

According to the drying unit 32b of the present modification, the processing fluid F is guided from the processing space S to the discharge opening portion 68 by the discharge guide member 83 facing the discharge opening portion 68 between the discharge opening portion 68 into which the processing fluid F flows from the processing space S inside the pressure vessel 60 and the holding position (substrate W). Therefore, the flow of the processing fluid F from the substrate W placed at the holding position to each discharge opening 68 can be adjusted by the discharge guide member 83, and the generation of the vortex flow and the stagnation of the processing fluid F can be suppressed.

Further, by providing the plurality of supply guide members 80 in the height direction, even when the dimension of the processing space S in the height direction is large, the flow of the processing fluid F in the entire processing space S can be adjusted, and the generation of the vortex flow and the stagnation of the processing fluid F can be suppressed.

When a plurality of substrates W are disposed in the processing space S, the plurality of supply guide members 80 for guiding the processing fluid F to the respective substrates W can be provided, whereby the processing fluid F having a uniform flow can be sent to the periphery of the respective substrates W.

The above-described apparatus configuration in which a plurality of substrates W are disposed in the processing space S and the above-described apparatus configuration in which the discharge guide 83 is provided can be applied to various apparatuses and methods, and for example, can also be applied to the above-described embodiments and configuration examples.

[ other modifications ]

The substrate W may be carried into and out of the processing space S together with a holding portion (not shown) such as a tray while being held by the holding portion. Such a holding portion may be attached to a movable header of the supply head 61 and the discharge head 62, for example.

For example, when the discharge head 62 is provided movably, the substrate W may be placed on a tray (not shown) attached to the discharge head 62 by the 2 nd transport device 31a (see fig. 1) in a state where the discharge head 62 is disposed at the open position. In this case, the discharge head 62 moves from the open position to the closed position, and the substrate W is fed into the processing space S together with the tray. Further, when the discharge head 62 moves from the closed position to the open position, the substrate W is discharged from the processing space S together with the tray.

When the liquid film L is formed on the upper surface of the substrate W, the substrate W is placed on the tray with the upper surface of the substrate W facing upward. Then, the discharge head 62 is moved between the closed position and the open position while maintaining the state in which the upper surface of the substrate W faces upward.

It should be noted that the embodiments and modifications disclosed in the present specification are merely illustrative in all aspects and are not to be construed restrictively. The above-described embodiments and modifications can be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the above-described embodiment and modification may be combined, and other embodiments may be combined with the above-described embodiment or modification.

The technical type of embodying the technical idea is not limited. For example, the above-described substrate processing apparatus can be applied to other apparatuses. In addition, the technical idea described above may be embodied by a computer program for causing a computer to execute 1 or more steps (step) included in the substrate processing method described above. The technical idea described above may be embodied by a non-transitory (non-transitory) recording medium in which such a computer program is recorded.

Claims (16)

1. A substrate processing apparatus for drying a substrate to which a liquid is attached by using a processing fluid in a supercritical state, comprising:

a processing container capable of accommodating the substrate inside;

a holding unit for holding the substrate at a holding position inside the processing container;

a fluid supply unit having a supply opening for discharging the processing fluid to the inside of the processing container; and

and a supply guide member facing the supply opening portion between the supply opening portion and the holding position, and guiding the processing fluid from the supply opening portion to expand to a range of an area larger than an opening area of the supply opening portion.

2. The substrate processing apparatus according to claim 1, wherein:

the supply guide member has a blade shape.

3. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member guides the processing fluid from the supply opening portion to expand in a height direction.

4. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member guides the processing fluid from the supply opening portion to expand in a horizontal direction.

5. The substrate processing apparatus according to claim 1 or 2, wherein:

the fluid supply part has a supply recess connected to the supply opening part, an opening area of the supply recess gradually increases as the supply recess is separated from the supply opening part,

at least a portion of the feed guide member is located in the feed recess.

6. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member is provided movably so as to be able to change a state of guiding the processing fluid from the supply opening portion.

7. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member partially surrounds the substrate placed at the holding position from the outside in the horizontal direction.

8. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply opening part is provided with a plurality of openings,

the plurality of supply openings include 2 or more supply openings provided at different positions from each other in the horizontal direction,

the supply guide member has an integral structure facing 2 or more supply opening portions provided at different positions from each other in the horizontal direction.

9. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply opening part is provided with a plurality of openings,

the plurality of supply openings include at least 2 supply openings provided at different positions in the height direction,

the supply guide member has an integral structure facing 2 or more supply opening portions provided at mutually different positions in the height direction.

10. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member is provided in plurality,

the plurality of supply guide members include:

1 or more supply guide members provided at a 1 st arrangement position in a direction from the supply opening portion to the holding position; and

and 1 or more supply guide members provided at a 2 nd arrangement position in a direction from the supply opening portion to the holding position, wherein the 2 nd arrangement position is a position different from the 1 st arrangement position.

11. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member is provided in plurality,

the substrate arranged at the holding position is spaced apart from the supply opening portion in a 1 st horizontal direction,

the plurality of supply guide members include 2 or more supply guide members arranged in a 2 nd horizontal direction perpendicular to the 1 st horizontal direction,

and 2 or more supply guide members arranged in the 2 nd horizontal direction, for partially surrounding the substrate placed at the holding position from the outside in the horizontal direction.

12. The substrate processing apparatus according to claim 1 or 2, wherein:

the supply guide member is provided in plurality,

the substrate arranged at the holding position is spaced apart from the supply opening portion in a 1 st horizontal direction,

the plurality of supply guide members include: 2 or more supply guide members arranged in the 1 st horizontal direction; and more than 2 supply guide components arranged in the 2 nd horizontal direction which is at right angle with the 1 st horizontal direction,

and at least 2 supply guide members disposed at different positions in both the 1 st horizontal direction and the 2 nd horizontal direction, and partially surrounding the substrate disposed at the holding position from the outside in the horizontal direction.

13. The substrate processing apparatus according to claim 1 or 2, wherein:

the fluid supply unit is provided with a 1 st fluid supply unit having a 1 st supply opening,

the 1 st supply opening is located at a position shifted in the horizontal direction from the substrate placed at the holding position,

a 1 st supply guide member positioned between the 1 st supply opening and the holding position is provided as the supply guide member,

the 1 st supply guide member guides the processing fluid from the 1 st supply opening so as to extend over a range of an area larger than an opening area of the 1 st supply opening.

14. The substrate processing apparatus according to claim 1 or 2, wherein:

the fluid supply unit is provided with a 2 nd fluid supply unit having a 2 nd supply opening,

the 2 nd supply opening is located at a position deviated downward from the substrate placed at the holding position,

a 2 nd supply guide member positioned between the 2 nd supply opening portion and the holding position is provided as the supply guide member,

the 2 nd supply guide member guides the processing fluid from the 2 nd supply opening portion so as to extend over a range of an area larger than an opening area of the 2 nd supply opening portion.

15. The substrate processing apparatus according to claim 14, wherein:

the 2 nd supply guide member is provided in plurality,

the plurality of 2 nd supply guide members are provided along a plurality of concentric circles having different radii from each other.

16. The substrate processing apparatus according to claim 1 or 2, comprising:

a fluid discharge portion having a discharge opening portion into which the processing fluid flows from the inside of the processing container; and

and a discharge guide member facing the discharge opening between the holding position and the discharge opening, the discharge guide member guiding the processing fluid from the inside of the processing container to the discharge opening.

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