CN114689184A - Thermal imaging module and electronic equipment - Google Patents
Thermal imaging module and electronic equipment Download PDFInfo
- Publication number
- CN114689184A CN114689184A CN202210311010.1A CN202210311010A CN114689184A CN 114689184 A CN114689184 A CN 114689184A CN 202210311010 A CN202210311010 A CN 202210311010A CN 114689184 A CN114689184 A CN 114689184A
- Authority
- CN
- China
- Prior art keywords
- correction
- hole
- lens
- thermal imaging
- imaging module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001931 thermography Methods 0.000 title claims abstract description 96
- 238000012937 correction Methods 0.000 claims abstract description 134
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000009434 installation Methods 0.000 claims abstract description 23
- 230000004888 barrier function Effects 0.000 claims description 32
- 230000000903 blocking effect Effects 0.000 abstract description 27
- 238000003384 imaging method Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 22
- 230000005855 radiation Effects 0.000 description 14
- 230000000670 limiting effect Effects 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B9/00—Exposure-making shutters; Diaphragms
- G03B9/08—Shutters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/73—Circuitry for compensating brightness variation in the scene by influencing the exposure time
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses a thermal imaging module and electronic equipment, wherein the thermal imaging module comprises a lens component, the lens component comprises a lens barrel and a lens, and the lens is arranged in the lens barrel; the correction shutter assembly comprises a correction blocking sheet, a correction blocking sheet moving mechanism and a correction shutter shell, the correction blocking sheet moving mechanism is installed on the correction shutter shell, the correction shutter shell comprises an installation part and an extension part, the extension part is connected to one side of the installation part, the lens assembly is installed on the installation part, the installation part is provided with a light through hole, the lens covers the light through hole in the axial direction of the light through hole, and the correction blocking sheet moving mechanism is configured to drive the correction blocking sheet to avoid or block the light through hole; the base plate is connected to one side of the extending part, which is far away from the mounting part, and the base plate and the extending part enclose an accommodating cavity; and the infrared detector is positioned in the accommodating cavity and is fixed on one side of the substrate facing the lens. The thermal imaging module is relatively small in number of parts, small in accumulated tolerance and high in precision.
Description
Technical Field
The invention relates to the technical field of imaging equipment, in particular to a thermal imaging module and electronic equipment.
Background
With the progress of science and technology, more and more high-tech products are commonly used by the majority of users. Taking a thermal imaging apparatus as an example, many monitoring apparatuses are provided with a thermal imaging apparatus. Thermal imaging devices typically include a housing, a lens assembly, which typically includes an interconnected lens mount and lens, a correction shutter assembly, which typically includes an interconnected correction blade and shutter mount, and a mount assembly, which typically includes an infrared detector and a base plate. In the process of assembling the imaging device, the lens assembly, the correction shutter assembly and the substrate assembly are assembled together by using the shell to form the complete thermal imaging device. Since the number of parts in such a thermal image forming apparatus is large, there is a case where the accumulated tolerance is large during the assembly, which has a large adverse effect on the accuracy of the thermal image forming apparatus.
Disclosure of Invention
The invention discloses a thermal imaging module and electronic equipment.
In order to solve the problems, the invention adopts the following technical scheme:
in a first aspect, an embodiment of the present application discloses a thermal imaging module, which includes:
the lens assembly comprises a lens barrel and a lens, and the lens is arranged in the lens barrel;
the correction shutter assembly comprises a correction blocking sheet, a correction blocking sheet moving mechanism and a correction shutter shell, the correction blocking sheet moving mechanism is installed on the correction shutter shell, the correction shutter shell comprises an installation part and an extension part, the extension part is connected to one side of the installation part, the lens assembly is installed on the installation part, the installation part is provided with a light through hole, the lens covers the light through hole in the axial direction of the light through hole, and the correction blocking sheet moving mechanism is configured to drive the correction blocking sheet to avoid or block the light through hole;
the base plate is connected to one side, away from the mounting part, of the extending part, and an accommodating cavity is defined by the base plate and the extending part;
and the infrared detector is positioned in the accommodating cavity and is fixed on one side of the substrate, which faces the lens.
In a second aspect, an embodiment of the present application discloses an electronic device, which includes the thermal imaging module.
The technical scheme adopted by the invention can achieve the following beneficial effects:
the embodiment of the application discloses thermal imaging module, it includes the lens subassembly, rectify the shutter subassembly, base plate and infrared detector, wherein, the lens subassembly includes the lens cone and installs the lens in the lens cone, rectify the shutter shell in the shutter subassembly and include installation department and extension, the lens unit mount is on the installation department, the one side at the installation department is connected to the extension, and the substrate coupling deviates from one side of installation department at the extension, make extension and base plate enclose to become the chamber that holds that is used for holding infrared detector, and infrared detector fixes the one side at the base plate towards the lens, make infrared detector can provide the imaging.
As described above, in the thermal imaging module disclosed in the embodiment of the present application, the calibration shutter housing of the calibration shutter assembly is directly connected to the substrate, and as a "housing" of the thermal imaging module, the number of components in the thermal imaging module can be reduced, thereby reducing the accumulated error during the production and assembly process of the thermal imaging module and improving the imaging accuracy of the thermal imaging module.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic cross-sectional view of a thermal imaging module according to an embodiment of the disclosure;
FIG. 2 is a schematic structural diagram of a thermal imaging module according to an embodiment of the disclosure;
fig. 3 is a schematic structural diagram of a thermal imaging module according to another embodiment of the disclosure.
Description of reference numerals:
110-lens cone, 120-lens,
200-a substrate,
310-infrared detector, 320-electric connector,
401-accommodating cavity, 410-correcting block, 420-correcting block moving mechanism, 430-correcting shutter shell, 431-mounting part, 431 a-light through hole, 432-extending part, 440-cover plate, 441-through hole, 442-avoiding part and 450-limiting part.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1-3, an embodiment of the invention discloses a thermal imaging module, which can be applied to an electronic device. The thermal imaging module includes a lens assembly, a substrate 200, an infrared detector 310, and a corrective shutter assembly.
The lens assembly includes a lens barrel 110 and a lens 120, the lens barrel 110 is a mounting base of the lens 120, that is, the lens 120 is mounted in the lens barrel 110, so that the lens barrel 110 can also provide a protection function for the lens 120, and the service life of the lens 120 is prolonged. Specifically, the lens barrel 110 may be made of a material such as plastic, and the lens 120 may be formed of a light-transmitting material such as plastic or glass; moreover, the material of the lens 120 is preferably a material with poor heat absorption and release properties, so as to improve the imaging precision of the thermal imaging module. The lens 120 may be a single lens, or the number of the lenses 120 may also be multiple, forming a lens group, so as to improve the shooting performance of the thermal imaging module.
In order to ensure that the thermal imaging module has higher imaging accuracy, as shown in fig. 1 to 3, the thermal imaging module disclosed in the embodiment of the present application includes the above-mentioned correction shutter assembly, and the imaging result of the infrared detector 310 can be calibrated by using the correction shutter assembly, so that the imaging process of the infrared detector 310 can be adaptively corrected when the imaging result of the infrared detector 310 has an error, and the imaging result of the infrared detector 310 is more accurate.
In detail, due to the difference in the material used for manufacturing the semiconductor and the manufacturing process of the infrared detector 310, there may be some errors in the detected values of the thermal radiation for the same output parameter at different positions on the infrared detector 310. Based on this, as described above, the thermal imaging module disclosed in the embodiment of the present application includes the calibration shutter assembly, and parameters of thermal radiation generated at various positions on the calibration barrier 410 in the calibration shutter assembly are substantially consistent, so that during the operation of the thermal imaging module, the calibration barrier 410 can be used to anchor the imaging result of the infrared detector 310, and in case that there is a difference in the detection signals received at different positions on the infrared detector 310, the imaging uniformity of the infrared detector 310 can be calibrated according to the aforementioned difference.
In addition, in the using process of the thermal imaging module, the imaging result of the infrared detector 310 can be corrected by using the correction barrier 410 at intervals of preset time; or, a sensor may be further disposed in the thermal imaging module, the sensor may specifically be a sensor such as a temperature sensor, and when the temperature of the infrared detector 310 or the lens 120 in the thermal imaging module satisfies a preset range, the imaging result of the infrared detector 310 is corrected by using the correction barrier 410, so as to ensure that the imaging accuracy of the thermal imaging module is always relatively high.
Of course, as mentioned above, the calibration mask 410 is a component for calibrating the operating parameters of the infrared detector 310, and therefore, it is necessary to ensure that the calibration mask 410 does not interfere with the process of the thermal imaging module capturing objects outside the thermal imaging module. Based on this, in the process of configuring the correction barrier 410, the correction barrier 410 needs to have the ability of avoiding and blocking the optical path of the lens 120, so that in the process of calibrating the imaging parameters of the infrared detector 310, the correction barrier 410 can be located in the optical path of the lens 120, and further the thermal radiation generated by the correction barrier 410 can be acquired by the infrared detector 310; in the working process of the thermal imaging module for shooting objects and the like outside the thermal imaging module, the correction blocking sheet 410 can avoid the light path of the lens 120, so that the thermal radiation outside the thermal imaging module can pass through the lens 120 and be acquired by the infrared detector 310, and the situation that the thermal radiation is blocked by the correction blocking sheet 410 can not occur.
Based on the above, the correction shutter assembly may include the correction flap moving mechanism 420, the correction shutter housing 430, and the above-described correction flap 410. As described above, the calibration barrier 410 is a structural member capable of moving relative to the lens 120, and further the movement of the calibration barrier 410 can be used to achieve the purpose of blocking or avoiding the optical path of the lens 120, so that the calibration barrier 410 can be used as a calibration base for the infrared detector 310, and it can be ensured that the thermal imaging module can work normally. The correcting barrier moving mechanism 420 is a mechanism for driving the correcting barrier 410 to move relative to the lens 120, and the correcting barrier moving mechanism 420 can provide a driving force to enable the correcting barrier 410 to move relative to the lens 120 in a process of blocking or avoiding the optical path of the lens 120. The correction shutter housing 430 is a mounting base for the correction shutter 410 and the correction shutter moving mechanism 420, and further, in the process of providing self-action for the correction shutter assembly, other structural members in the thermal imaging module are not needed, so that the correction shutter moving mechanism 420 can use the correction shutter housing 430 as a support to drive the correction shutter 410 to move. In other words, the correction blade 410, the correction blade movement mechanism 420, and the correction shutter housing 430 form a unitary structure, and the entire correction shutter assembly is a separate assembly from the other structural members of the thermal imaging module. More intuitively, in the present embodiment, the correction shutter assembly may be a separate finished piece.
Specifically, the actual parameters of the correction flap 410 may be determined according to the specific conditions such as the parameters of the infrared detector 310, and the shape and size of the correction flap 410 may be determined according to the specific sizes of the lens 120, the infrared detector 310, and other components, which are not limited herein. The correction barrier moving mechanism 420 may specifically include a linear driving mechanism such as a linear motor, a hydraulic cylinder, or an air cylinder, so as to drive the correction barrier 410 to move linearly relative to the lens 120 along a direction perpendicular to the axial direction of the lens 120; alternatively, the correction flap moving mechanism 420 may include a rotary motor or the like to drive the correction flap 410 to make a rotational movement relative to the lens 120 in a plane perpendicular to the axial direction of the lens 120.
The correction shutter housing 430 may be made of plastic or the like, and the shape of the correction shutter housing 430 may be selected correspondingly according to the respective structures and sizes of the correction flap moving mechanism 420 and the correction flap 410. More specifically, the correction shutter housing 430 may be a cylindrical structural member, and the correction flap moving mechanism 420 is mounted on the correction shutter housing 430, and the correction flap 410 is mounted on one end of the correction shutter housing 430, and the correction shutter housing 430 and the lens barrel 110 are connected to each other, so that the correction flap 410 has the ability to block the lens 120.
In another embodiment of the present application, the correction shutter housing 430 includes a mounting portion 431 and an extension portion 432, as shown in fig. 1, the extension portion 432 is connected to one side of the mounting portion 431, and the extension portion 432 is an annular structural member, and specifically, may be an annular structural member or an annular structural member with a cross section having another shape such as a rectangle, so that the extension portion 432 and the substrate 200 mentioned below can enclose the accommodating cavity 401. In general, the mount 431 and the extension 432 may be regarded as a "housing" of the lens module, and the mount 431 and the extension 432 also serve as a part of the "housing" of the entire thermal imaging module, which provides a receiving space for the infrared detector 310 and other devices by being combined with the above-mentioned substrate 200. Considering that the precision of the entire thermal imaging module is adversely affected by the additional assembling process between the components, the mounting portion 431 and the extending portion 432 may be integrally formed structural members, that is, the mounting portion 431 and the extending portion 432 may be integrally formed. Specifically, the mounting portion 431 and the extending portion 432 can be formed by integrally molding materials such as plastics, so that the overall accuracy of the mounting portion 431 and the extending portion 432 is improved, the processing difficulty of the mounting portion 431 and the extending portion 432 can be reduced, in addition, the number of parts in the whole thermal imaging module can be reduced under the condition that the mounting portion 431 and the extending portion 432 are integrated structural members, the mounting process is reduced, and the processing efficiency is improved.
The mounting portion 431 is provided with a light-passing hole 431a to ensure that opposite sides of the mounting portion 431 can communicate with each other. In assembling the thermal imaging module, the lens assembly is mounted on the mount 431 as shown in fig. 1. Specifically, the lens assembly may be embedded in the light hole 431a of the mounting portion 431, or the lens assembly may be mounted on an end surface of the mounting portion 431 by adhesion or the like, that is, the lens assembly may also be located outside the light hole 431 a. Meanwhile, the lens 120 is disposed to cover the light passing hole 431a in the axial direction of the light passing hole 431a, specifically, the area of the lens 120 is equal to or larger than the area of the light passing hole 431a, and any part of the edge of the lens 120 is located outside the corresponding part of the edge of the light passing hole 431a (or, any part of the edge of the lens 120 coincides with the corresponding part of the edge of the light passing hole 431 a); in other words, the projection of the edge of the lens 120 in the axial direction of the light passing hole 431a covers the light passing hole 431a, so that light, heat radiation, and the like on one side of the light passing hole 431a can be incident to the other side of the light passing hole 431a through the lens 120 in the light passing hole 431 a. Correspondingly, when the correction shutter housing 430 is configured as described above, the correction flap moving mechanism 420 may also cause the correction flap 410 to escape or block the light transmitting hole 431a while driving the correction flap 410 to be located in the optical path of the lens 120.
The substrate 200 is a mounting base of the infrared detector 310, and the substrate 200 is connected to a side of the extension part 432 away from the mounting part 431, so that the substrate 200 and the extension part 432 enclose the accommodating cavity 401. The base 200 has a shape and size corresponding to the shape and size of the extension 432 so that the overall size of the thermal imaging module is relatively small. The substrate 200 may be a flat plate structure, and the substrate 200 may be other structures. The base plate 200 may be embedded inside the extending portion 432, or the base plate 200 may be disposed on a side of the extending portion 432 away from the mounting portion 431.
It should be noted that the extension part 432 and the mounting part 431 have no obvious limitation in physical structure, wherein the mounting part 431 is provided with a light through hole 431a, so that the mounting part 431 is also a ring-shaped structure in practice, and the structure of the mounting part 431 is similar to that of the extension part 432 in structure. Of course, the size of the light passing hole 431a needs to correspond to the size of the lens assembly, and the inner side of the extension portion 432 needs to correspond to the size of the above-mentioned infrared detector 310, so as to ensure that the infrared detector 310 and other structures can be installed in the accommodating cavity 401. Moreover, on the premise of ensuring that the extension part 432 has the accommodation capacity and the structural strength meeting the requirements, the wall thickness of the extension part 432 can be relatively small, so as to reduce the processing cost of the extension part 432 and the thermal imaging module.
As described above, the infrared detector 310 is installed in the accommodating chamber 401; also, an infrared detector 310 is fixed to one side of the substrate 200 facing the lens 120 to receive light, heat radiation, and the like incident from the other side of the lens 120 with the infrared detector 310 and form a corresponding image. Certainly, in the use process of the thermal imaging module, the infrared detector 310 may be connected to a processor or other devices through the electrical connector 320, so that the signal received by the infrared detector 310 can be transmitted to the processor, and the processor processes the signal; alternatively, the processor outputs an image contained in the signal received by the infrared detector 310. In addition, substrate 200 may be formed of a conductive material such as metal, or substrate 200 may include a circuit board, such that infrared detector 310 may be electrically connected to the processor indirectly through substrate 200 via electrical connection 320.
It should be noted that, in the process of laying the components in the thermal imaging module, it needs to be ensured that the lens 120 and the infrared detector 310 are correspondingly arranged, and further, it is ensured that the light or thermal radiation energy and the like incident from the lens 120 can pass through the lens 120 and be incident on the infrared detector 310. More specifically, the center of the lens 120 and the center of the infrared detector 310 may be located on the same straight line, and the straight line may be the axis of the light passing hole 431a, in which case, the imaging quality of the thermal imaging module may be ensured to be higher.
The embodiment of the application discloses a thermal imaging module, it includes the lens subassembly, the correction shutter subassembly, base plate 200 and infrared detector 310, wherein, the lens subassembly includes lens barrel 110 and installs lens 120 in lens barrel 110, correction shutter shell 430 in the correction shutter subassembly includes installation department 431 and extension 432, the lens subassembly is installed on installation department 431, extension 432 is connected in one side of installation department 431, and base plate 200 connects the side that extension 432 deviates from installation department 431, make extension 432 and base plate 200 enclose and become the chamber 401 that holds that is used for holding infrared detector 310, and infrared detector 310 fixes the side that base plate 200 is towards lens 120, make infrared detector 310 can provide the imaging.
As described above, in the thermal imaging module disclosed in the embodiment of the present application, the calibration shutter housing 430 of the calibration shutter assembly is directly connected to the substrate 200, and serves as a "housing" of the thermal imaging module, so that the number of components in the thermal imaging module can be reduced, thereby reducing the accumulated error during the production and assembly process of the thermal imaging module and improving the imaging accuracy of the thermal imaging module.
During deployment of the correction shutter assembly, the correction flap 410 may optionally be disposed within the receiving cavity 401, in which case the correction flap 410 is located on the light exit side of the lens 120. That is, the light and heat radiation, etc. pass through the lens 120 before passing through the location of the correction flap 410. In this case, the calibration shutter housing 430 and the base plate 200 can provide a shielding effect for the calibration blade 410, thereby preventing the calibration blade 410 from being easily contaminated by the external environment and affecting the calibration accuracy of the calibration blade 410.
In another embodiment of the present application, as shown in fig. 1, the correction shutter assembly is mounted on the mounting portion 431, and the correction blocking sheet 410 is disposed on a side of the mounting portion 431 away from the extension portion 432, that is, the correction blocking sheet 410 is located on the light-entering side of the lens 120, so that light, heat radiation and the like pass through the lens 120 before entering the infrared detector 310 from the position of the correction blocking sheet 410. Specifically, the correction flap moving mechanism 420 may be fixed on the mounting portion 431 by bonding or connecting by a connector, and the correction flap 410 may be correspondingly mounted on the correction flap moving mechanism 420, so that the correction flap 410 is correspondingly located outside the lens 120, and it is ensured that the correction flap moving mechanism 420 can drive the correction flap 410 to move relative to the correction shutter housing 430, so as to avoid or block the light passing hole 431 a.
Under the condition of adopting the technical scheme disclosed in the embodiment, the correction blocking piece 410 is located outside the accommodating cavity 401 of the thermal imaging module, in other words, the lens 120 is blocked between the correction blocking piece 410 and the infrared detector 310, so that the situation that particles, dust and other components fall onto the infrared detector 310 in the process of driving the correction blocking piece 410 to act by the correction blocking piece moving mechanism 420 can be prevented from occurring due to no blocking object between the correction blocking piece 410 and the infrared detector 310, and further, the poor image phenomena such as dark spots and circles and the like of the infrared detector 310 can be prevented from occurring, and the failure occurrence rate of the thermal imaging module is greatly reduced. Meanwhile, when the thermal imaging module disclosed in the embodiment of the present application is adopted, since the correction blocking piece 410 is located outside the accommodation cavity 401, under the condition that the size of the correction blocking piece 410 is not changed, compared with the technical scheme that the correction blocking piece 410 is installed in the accommodation cavity 401, by adopting the technical scheme disclosed in the embodiment, the size of the accommodation cavity 401 (and the extension part 432) in the axial direction perpendicular to the light through hole 431a can be further reduced, which can further reduce the overall dimension of the whole thermal imaging module, so that the thermal imaging module can be better developed towards miniaturization.
Based on the above embodiment, optionally, in the thermal imaging module disclosed in this application, the calibration shutter assembly may further include a cover plate 440, the cover plate 440 is located on a side of the calibration barrier 410 away from the substrate 200, and the cover plate 440 is fixed to the mounting portion 431, so that the cover plate 440 and the mounting portion 431 are connected into a whole, so as to provide shielding and protection effects for the calibration barrier 410 by using the cover plate 440, prevent other objects outside the thermal imaging module from interfering with the movement process of the calibration barrier 410, and reduce the probability of impurities entering the thermal imaging module to a certain extent. Specifically, the shape and size of the cover plate 440 may correspond to the shape and size of the mounting portion 431, and the cover plate 440 and the mounting portion 431 may be fixedly connected by means of bonding, screwing, or the like.
Of course, in the case that the thermal imaging module includes the cover plate 440, in order to ensure that the thermal imaging module can still work normally, as shown in fig. 2 and 3, the cover plate 440 is provided with a through hole 441, and along the axial direction of the light through hole 431a, the projection of the hole wall of the light through hole 431a is located within the projection of the hole wall of the through hole 441. That is, the penetrating hole 441 in the cover plate 440 and the light passing hole 431a in the correction shutter case 430 correspond to each other in the axial direction of the light passing hole 431a, and in the case where the penetrating hole 441 and the light passing hole 431a have the same shape, the size of the penetrating hole 441 is at least not smaller than the size of the light passing hole 431a, and there is no large amount of skew between the axes thereof.
For example, the through hole 441 and the light passing hole 431a may be both circular structures, in which case, the axes of the two may be overlapped, and the diameters of the through hole 441 and the light passing hole 431a may be the same, so as to ensure that light, heat radiation and the like outside the thermal imaging module can be incident on the infrared detector 310 through the through hole 441 and the light passing hole 431a to form a corresponding image. When the diameter of the through hole 441 is greater than the diameter of the light-passing hole 431a, the axis of the through hole 441 may have a certain distance from the axis of the light-passing hole 431a, which may also ensure that the projection of the hole wall of the light-passing hole 431a from the axial direction thereof is located within the projection of the hole wall of the through hole 441 in the axial direction.
The through hole 441 and the light-passing hole 431a may have different shapes, for example, the light-passing hole 431a may have a circular structure, and the through hole 441 may have a rectangular structure, and the minimum side length of the through hole 441 is greater than the diameter of the light-passing hole 431a, and the axes of the two are relatively centered, so that the through hole 441 does not adversely affect the imaging range of the light-passing hole 431 a.
In view of the above technical solution, it can be more intuitively said that the thermal imaging module is observed from the side where the through hole 441 is located along the axial direction of the light through hole 431a, and the complete light through hole 431a can be seen from the inside of the through hole 441.
Further, the through-hole 441 and the clear hole 431a may be made to have the same shape, and the projection of the hole wall of the through-hole 441 may be positioned outside the projection of the hole wall of the clear hole 431a in the axial direction of the clear hole 431a, that is, in the case where both the shapes are the same, the dimension between any two points on the hole wall of the through-hole 441 may be larger than the dimension between both ends of the clear hole 431a with respect to the position and direction. Under the condition that adopts the technical scheme that this embodiment is disclosed, can be when guaranteeing that thermal imaging module has great formation of image scope, in the thermal imaging module minimize with the size of external through hole 441 that communicates, and then reduce the volume in external impurity gets into thermal imaging module, promote thermal imaging module's reliability and precision. Specifically, since the lens 120 is generally a circular structure, the through hole 441 and the light passing hole 431a can be both circular structures, so as to take account of the imaging range and the dustproof performance of the thermal imaging module.
In order to ensure that the correction capability of the correction barrier 410 is relatively high, as shown in fig. 1, under the condition that the correction barrier moving mechanism 420 drives the correction barrier 410 to block the light-passing hole 431a, along the axial direction of the light-passing hole 431a, the edge of the projection of the correction barrier 410 can be positioned outside the projection of the hole wall of the through hole 441, which basically can ensure that the correction barrier 410 can completely shield the through hole 441, prevent external heat radiation from entering the thermal imaging module through the edge of the through hole 441, hinder the correction work of the correction barrier 410, improve the correction accuracy of the correction barrier 410, and ensure that the imaging accuracy of the thermal imaging module is relatively high.
Specifically, the shape of the correction blade 410 may be different from the shape of the through hole 441, and the correction blade 410 is ensured to completely block the through hole 441 by enabling the edge of the correction blade 410 to be completely located outside the hole wall of the through hole 441. In another embodiment of the present application, the shape of the correction barrier 410 may be the same as that of the through hole 441, and the size of the correction barrier 410 is slightly larger than that of the through hole 441, which may ensure that the correction barrier 410 has a good shielding effect while the whole area of the correction barrier 410 is relatively small.
Under the condition that including apron 440 in thermal imaging module, in order to prevent that the setting of apron 440 from producing the hindrance to the action process of correcting separation blade 410, can make one side that installation portion 431 deviates from base plate 200 set up the heavy groove, and make and correct separation blade 410 and be located the heavy groove, on this basis, even if apron 440 is installed on installation portion 431, because correcting separation blade 410 is located the heavy groove, the heavy groove can provide the space of motion for correcting separation blade 410, and then guarantees that correcting separation blade 410 can normally move in the space between the tank bottoms of apron 440 and heavy groove.
Based on the above technical solution, in the process of installing the cover plate 440, the installation part 431 may be entirely located at one side of the cover plate 440, that is, the cover plate 440 is disposed at one side of the installation part 431. In another embodiment of the present application, as shown in fig. 1, the cover plate 440 is embedded in and sealed off from the notch of the sinking groove, that is, similar to the calibration baffle 410, the cover plate 440 is also located in the sinking groove, so that the side wall of the sinking groove can provide a limiting effect on the cover plate 440 in a direction perpendicular to the axial direction of the light passing hole 431a, thereby improving the connection reliability between the cover plate 440 and the mounting portion 431.
As described above, the correction flap moving mechanism 420 can drive the correction flap 410 to avoid or block the light-transmitting hole 431a in a rotating manner, and based on this, the correction flap moving mechanism 420 may include a rotation driving device, and the rotation driving device is fixed on the mounting portion 431, and by using the rotation driving device, the correction flap moving mechanism 420 can drive the correction flap 410 to rotate relative to the mounting portion 431, so as to reduce the driving difficulty of the correction flap 410.
In one embodiment of the present application, the calibration flap moving mechanism 420 includes a magnetic valve driving mechanism, which can drive the calibration flap 410 to make reciprocating rotation motion with respect to the mounting portion 431, and the cost and control difficulty of the magnetic valve driving mechanism are relatively low, so that the manufacturing difficulty and the overall cost of the whole thermal imaging module can be reduced.
Under the condition that adopts above-mentioned technical scheme, can be provided with on the apron and dodge portion 442, dodge portion 442 specifically can be for dodging heavy groove, or, in order to reduce the processing degree of difficulty of dodging portion 442, dodge portion 442 still can be the through-hole, under the effect of dodging portion 442, make the rotation axis of rotation drive device can rotate and install in the portion 442 of dodging of apron 440, thereby utilize apron 440 to provide stabilizing action for the rotatory process of rotation drive device, promote the operational reliability of rotation drive device, and, under the condition that adopts above-mentioned technical scheme, can also reduce whole thermal imaging module size in the axial of lens 120, do benefit to the thermal imaging module and develop to miniaturation.
As described above, the lens assembly is mounted on the mounting portion 431, and the lens assembly may be fixedly connected to the mounting portion 431 by means of bonding, connection by a connector, or the like. Further, the lens assembly may be mounted within the light passing hole 431a of the mounting portion 431 to improve the compactness of the thermal imaging module.
In the case that the lens assembly is installed in the light through hole 431a, optionally, a limiting portion 450 is disposed on a side of the light through hole 431a away from the substrate 200, and the lens barrel 110 is limited and disposed on a side of the limiting portion 450 facing the substrate 200 along an axial direction of the light through hole 431a, so that the limiting portion 450 is used for providing a limiting effect for the lens assembly, and the connection reliability between the lens assembly and the installation portion 431 is improved. And, under the condition that adopts above-mentioned technical scheme for the area of intercommunication is littleer outside logical unthreaded hole 431a of installation department 431 and the thermal imaging module, further reduces the probability that impurity such as dust got into the thermal imaging module through passing through unthreaded hole 431a, promotes the transmissivity such as light and the heat radiation of lens 120, and then promotes the imaging accuracy of thermal imaging module.
Specifically, the limiting portion 450 and the mounting portion 431 may be a split structure, and the two may be fixedly connected together by bonding or screwing. In another embodiment of the present application, the limiting portion 450 and the mounting portion 431 (and the extending portion 432) may be formed by integral molding, which can reduce the processing difficulty of the above components and improve the connection reliability between the above components.
In the process of providing the limiting portion 450, the projection of the limiting portion 450 in the axial direction of the lens 120 needs to be located outside the inner sidewall of the lens barrel 110, so as to prevent the limiting portion 450 from interfering with the light transmission range of the lens 120. Taking the circular structure as an example, the light-passing hole 431a, the lens barrel 110 and the limiting part 450 are all circular structures, the diameter of the light-passing hole 431a can be made to be substantially equal to the diameter of the outer side wall of the lens barrel 110, the diameters of the light-passing hole 431a and the light-passing hole can be both made to be larger than the diameter of the inner side wall of the lens barrel 110 and the diameter of the inner side wall of the limiting part 450, and the diameter of the inner side wall of the limiting part 450 is larger than the diameter of the inner side wall of the lens barrel 110.
Based on the thermal imaging module that any embodiment of the foregoing discloses, this application still discloses an electronic equipment, and electronic equipment includes any thermal imaging module of the foregoing. Optionally, including display module assembly and treater in the electronic equipment, infrared detector 310 and display module assembly all can be connected with the treater, and the treater can be handled optical signal and/or heat radiation signal that infrared detector 310 received, and forms corresponding image presentation on display module assembly.
In the above embodiments of the present invention, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A thermal imaging module, comprising:
a lens assembly including a lens barrel (110) and a lens (120), the lens (120) being mounted in the lens barrel (110);
a correction shutter assembly including a correction flap (410), a correction flap moving mechanism (420), and a correction shutter housing (430), the correction flap moving mechanism (420) being mounted to the correction shutter housing (430), the correction shutter housing (430) including a mounting portion (431) and an extension portion (432), the extension portion (432) being connected to one side of the mounting portion (431), the lens assembly being mounted to the mounting portion (431), the mounting portion (431) being provided with a light passing hole (431a), the lens (120) being disposed so as to cover the light passing hole (431a) in an axial direction of the light passing hole (431a), the correction shutter moving mechanism (420) being configured to drive the correction flap (410) to retreat or block the light passing hole (431 a);
the base plate (200) is connected to one side, away from the installation part (431), of the extending part (432), and the base plate (200) and the extending part (432) enclose an accommodating cavity (401);
the infrared detector (310) is located in the accommodating cavity (401) and is fixed on one side, facing the lens (120), of the substrate (200).
2. The thermal imaging module of claim 1 wherein the calibration shutter assembly is mounted to the mounting portion (431) and the calibration flap (410) is located on the light entry side of the lens (120).
3. The thermal imaging module according to claim 2, wherein the calibration shutter assembly further comprises a cover plate (440), the cover plate (440) is located on a side of the calibration flap (410) facing away from the base plate (200), the cover plate (440) is fixed to the mounting portion (431), the cover plate (440) is provided with a through hole (441), and a projection of a hole wall of the through hole (431a) is located within a projection of a hole wall of the through hole (441) along an axial direction of the through hole (431 a).
4. The thermal imaging module according to claim 3, wherein the through hole (441) and the clear hole (431a) are identical in shape, and along the axial direction of the clear hole (431a), the projection of the wall of the through hole (441) is located outside the projection of the wall of the clear hole (431 a).
5. The thermal imaging module according to claim 3, wherein, in a case where the correction flap (410) blocks the light through hole (431a), an edge of a projection of the correction flap (410) is located outside a projection of a hole wall of the through hole (441) in an axial direction of the light through hole (431 a).
6. The thermal imaging module of claim 3, wherein a side of the mounting portion (431) facing away from the substrate (200) is provided with a sunken groove, the calibration barrier (410) is located in the sunken groove, and the cover plate (440) is embedded in and sealed off from a notch of the sunken groove.
7. The thermal imaging module according to claim 6, wherein the correction flap moving mechanism (420) comprises a rotary drive device, the correction flap moving mechanism (420) driving the correction flap (410) into rotational engagement with the correction shutter housing (430);
the cover plate (440) is provided with an avoiding part, and a rotating shaft of the rotary driving device is rotatably arranged in the avoiding part (442) of the cover plate (440).
8. The thermal imaging module of claim 1 wherein the mounting portion (431) and the extension portion (432) are an integrally formed structural member.
9. The thermal imaging module according to claim 1, wherein a position-limiting portion (450) is disposed on a side of the light-passing hole (431a) facing away from the substrate (200), and the lens barrel (110) is position-limited on a side of the position-limiting portion (450) facing the substrate (200) along an axial direction of the light-passing hole (431 a).
10. An electronic device comprising the thermal imaging module of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210311010.1A CN114689184B (en) | 2022-03-28 | 2022-03-28 | Thermal imaging module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210311010.1A CN114689184B (en) | 2022-03-28 | 2022-03-28 | Thermal imaging module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114689184A true CN114689184A (en) | 2022-07-01 |
| CN114689184B CN114689184B (en) | 2024-08-02 |
Family
ID=82140910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210311010.1A Active CN114689184B (en) | 2022-03-28 | 2022-03-28 | Thermal imaging module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114689184B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130141590A1 (en) * | 2011-12-05 | 2013-06-06 | Tamron Co., Ltd. | Infrared Camera |
| CN208313441U (en) * | 2018-06-29 | 2019-01-01 | 深圳市景阳信息技术有限公司 | Closed cavity body device for thermal imaging detection |
| CN210781069U (en) * | 2019-12-12 | 2020-06-16 | 合肥芯福传感器技术有限公司 | Inward infrared thermal imaging machine core module |
| CN111866358A (en) * | 2020-09-02 | 2020-10-30 | 深圳市软筑信息技术有限公司 | Infrared thermal imaging camera protection device |
| CN211927103U (en) * | 2018-11-27 | 2020-11-13 | 深圳市华盛昌科技实业股份有限公司 | Miniaturized magnetic induction infrared thermal imaging module |
| CN213041380U (en) * | 2020-08-24 | 2021-04-23 | 浙江大华技术股份有限公司 | Thermal imaging core and thermal imaging device |
| CN213632412U (en) * | 2020-09-25 | 2021-07-06 | 浙江大华技术股份有限公司 | Thermal imaging engine assembly and thermal imaging equipment with same |
| CN213932840U (en) * | 2020-12-14 | 2021-08-10 | 北京红谱威视图像技术有限公司 | Long-wave uncooled infrared thermal imaging system and external correction device thereof |
-
2022
- 2022-03-28 CN CN202210311010.1A patent/CN114689184B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130141590A1 (en) * | 2011-12-05 | 2013-06-06 | Tamron Co., Ltd. | Infrared Camera |
| CN208313441U (en) * | 2018-06-29 | 2019-01-01 | 深圳市景阳信息技术有限公司 | Closed cavity body device for thermal imaging detection |
| CN211927103U (en) * | 2018-11-27 | 2020-11-13 | 深圳市华盛昌科技实业股份有限公司 | Miniaturized magnetic induction infrared thermal imaging module |
| CN210781069U (en) * | 2019-12-12 | 2020-06-16 | 合肥芯福传感器技术有限公司 | Inward infrared thermal imaging machine core module |
| CN213041380U (en) * | 2020-08-24 | 2021-04-23 | 浙江大华技术股份有限公司 | Thermal imaging core and thermal imaging device |
| CN111866358A (en) * | 2020-09-02 | 2020-10-30 | 深圳市软筑信息技术有限公司 | Infrared thermal imaging camera protection device |
| CN213632412U (en) * | 2020-09-25 | 2021-07-06 | 浙江大华技术股份有限公司 | Thermal imaging engine assembly and thermal imaging equipment with same |
| CN213932840U (en) * | 2020-12-14 | 2021-08-10 | 北京红谱威视图像技术有限公司 | Long-wave uncooled infrared thermal imaging system and external correction device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114689184B (en) | 2024-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109698894B (en) | Photosensitive assembly and camera module based on metal support | |
| US20040223074A1 (en) | Imaging apparatus | |
| US9635225B2 (en) | Imaging device | |
| CN110261981B (en) | Lens, camera module and electronic device | |
| KR102100340B1 (en) | Apparatus body of image pickup apparatus | |
| KR20060034687A (en) | Imaging device, portable terminal using the same, and image device producing method | |
| JP2011100056A (en) | Lens module and imaging unit | |
| US20210223500A1 (en) | Lens unit | |
| CN110095850B (en) | Lens barrel and optical apparatus | |
| CN112839144B (en) | Camera device, terminal equipment and assembling method of camera device | |
| CN112136079B (en) | Shell assembly, shell, shooting equipment, holder structure and mobile platform | |
| CN114697503A (en) | Thermal imaging module and electronic equipment | |
| US20160062071A1 (en) | Lens barrel, optical apparatus, and method of manufacturing the lens barrel | |
| CN115550534A (en) | Video camera | |
| KR20060087272A (en) | A lens unit used for a camera module having an optical filter therein | |
| CN114689184A (en) | Thermal imaging module and electronic equipment | |
| CN111766672A (en) | Lens, camera and terminal | |
| WO2018181888A1 (en) | Imaging device | |
| JP2009042531A (en) | Lens barrel | |
| KR20090037684A (en) | Lens unit of the camera module | |
| WO2011086949A1 (en) | Lens barrel | |
| TWI506351B (en) | Camera module | |
| JP2004272229A (en) | Imaging apparatus | |
| KR102197306B1 (en) | Camera module | |
| CN115412653A (en) | Optical lens and camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |