CN114686123A - Ultraviolet light reaction hot melt adhesive composition and preparation method thereof - Google Patents
Ultraviolet light reaction hot melt adhesive composition and preparation method thereof Download PDFInfo
- Publication number
- CN114686123A CN114686123A CN202210544463.9A CN202210544463A CN114686123A CN 114686123 A CN114686123 A CN 114686123A CN 202210544463 A CN202210544463 A CN 202210544463A CN 114686123 A CN114686123 A CN 114686123A
- Authority
- CN
- China
- Prior art keywords
- hot melt
- melt adhesive
- adhesive composition
- resin
- eva
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 45
- 239000000203 mixture Substances 0.000 title claims abstract description 34
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000011347 resin Substances 0.000 claims abstract description 63
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 57
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims abstract description 52
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 52
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 50
- 239000000178 monomer Substances 0.000 claims abstract description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000013538 functional additive Substances 0.000 claims abstract description 27
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000003254 radicals Chemical class 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 11
- 229920001971 elastomer Polymers 0.000 claims abstract description 10
- 239000000806 elastomer Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 5
- 238000000016 photochemical curing Methods 0.000 claims abstract description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- -1 2-ethylhexyl Chemical group 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 5
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 4
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 claims description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 4
- JHVQWALHXJPODC-ALCCZGGFSA-N (z)-2-[2-(2-methylprop-2-enoyloxy)ethyl]but-2-enedioic acid Chemical compound CC(=C)C(=O)OCC\C(C(O)=O)=C\C(O)=O JHVQWALHXJPODC-ALCCZGGFSA-N 0.000 claims description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 3
- GCGKIXNNTHZMPM-UHFFFAOYSA-N C1(=CC=CC=C1)P(C1=CC=CC=C1)=O.CC1=C(C(=O)C2=CC=CC=C2)C(=CC(=C1)C)C Chemical compound C1(=CC=CC=C1)P(C1=CC=CC=C1)=O.CC1=C(C(=O)C2=CC=CC=C2)C(=CC(=C1)C)C GCGKIXNNTHZMPM-UHFFFAOYSA-N 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 claims description 3
- JRWNODXPDGNUPO-UHFFFAOYSA-N oxolane;prop-2-enoic acid Chemical compound C1CCOC1.OC(=O)C=C JRWNODXPDGNUPO-UHFFFAOYSA-N 0.000 claims description 3
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 claims description 2
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 claims description 2
- JZEXORLUKMQOFA-UHFFFAOYSA-N 2-(1-ethoxyethyl)-2-(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCOC(C)C(CO)(CO)CO JZEXORLUKMQOFA-UHFFFAOYSA-N 0.000 claims description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 claims description 2
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims description 2
- FIQBJLHOPOSODG-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxycarbonyl]benzoic acid Chemical compound CC(=C)C(=O)OCCOC(=O)C1=CC=CC=C1C(O)=O FIQBJLHOPOSODG-UHFFFAOYSA-N 0.000 claims description 2
- LBNDGEZENJUBCO-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethyl]butanedioic acid Chemical compound CC(=C)C(=O)OCCC(C(O)=O)CC(O)=O LBNDGEZENJUBCO-UHFFFAOYSA-N 0.000 claims description 2
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 claims description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 claims description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- CHBVGDXRMCSNPU-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCCOC(C)C(CO)(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCCOC(C)C(CO)(CO)CO CHBVGDXRMCSNPU-UHFFFAOYSA-N 0.000 claims description 2
- RCMNLVFMMOBPGO-UHFFFAOYSA-N OC(C(=O)CC1=CC=C(C=C1)C1=C(C=CC=C1)C(C(C)(C)O)=O)(C)C Chemical compound OC(C(=O)CC1=CC=C(C=C1)C1=C(C=CC=C1)C(C(C)(C)O)=O)(C)C RCMNLVFMMOBPGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- XLXOGJYARRBRPZ-UHFFFAOYSA-N [2,3-di(prop-2-enoyloxy)-3-propoxypropyl] prop-2-enoate Chemical compound CCCOC(OC(=O)C=C)C(OC(=O)C=C)COC(=O)C=C XLXOGJYARRBRPZ-UHFFFAOYSA-N 0.000 claims description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 2
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 claims description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 2
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 claims description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 2
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- 238000006356 dehydrogenation reaction Methods 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 2
- RZFODFPMOHAYIR-UHFFFAOYSA-N oxepan-2-one;prop-2-enoic acid Chemical group OC(=O)C=C.O=C1CCCCCO1 RZFODFPMOHAYIR-UHFFFAOYSA-N 0.000 claims description 2
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 claims description 2
- 229920001610 polycaprolactone Polymers 0.000 claims description 2
- 239000004632 polycaprolactone Substances 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 claims 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims 1
- 239000012957 2-hydroxy-2-methyl-1-phenylpropanone Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- OFSAUHSCHWRZKM-UHFFFAOYSA-N Padimate A Chemical compound CC(C)CCOC(=O)C1=CC=C(N(C)C)C=C1 OFSAUHSCHWRZKM-UHFFFAOYSA-N 0.000 claims 1
- YMCOIFVFCYKISC-UHFFFAOYSA-N ethoxy-[2-(2,4,6-trimethylbenzoyl)phenyl]phosphinic acid Chemical compound CCOP(O)(=O)c1ccccc1C(=O)c1c(C)cc(C)cc1C YMCOIFVFCYKISC-UHFFFAOYSA-N 0.000 claims 1
- 239000012949 free radical photoinitiator Substances 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- 238000001816 cooling Methods 0.000 abstract description 11
- 239000004800 polyvinyl chloride Substances 0.000 abstract description 8
- 238000005187 foaming Methods 0.000 abstract description 5
- 125000000524 functional group Chemical group 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000001723 curing Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 43
- 238000001125 extrusion Methods 0.000 description 12
- 239000008187 granular material Substances 0.000 description 12
- 230000001105 regulatory effect Effects 0.000 description 12
- 238000005266 casting Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000007605 air drying Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 238000005469 granulation Methods 0.000 description 9
- 230000003179 granulation Effects 0.000 description 9
- 238000009775 high-speed stirring Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 229920005749 polyurethane resin Polymers 0.000 description 7
- 229920000915 polyvinyl chloride Polymers 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000008280 blood Substances 0.000 description 3
- 210000004369 blood Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- MLLAPOCBLWUFAP-UHFFFAOYSA-N 3-Methylbutyl benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1 MLLAPOCBLWUFAP-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 230000001914 calming effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 206010012601 diabetes mellitus Diseases 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005906 menstruation Effects 0.000 description 1
- UPXFXAMIFNGJLD-UHFFFAOYSA-N methyl 4-benzoylbenzoate Chemical compound C1=CC(C(=O)OC)=CC=C1C(=O)C1=CC=CC=C1 UPXFXAMIFNGJLD-UHFFFAOYSA-N 0.000 description 1
- 230000027939 micturition Effects 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 238000002464 physical blending Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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Abstract
The invention relates to the field of intermediate adhesives, in particular to an ultraviolet light reaction hot melt adhesive composition and a preparation method thereof, wherein ethylene-vinyl acetate elastomer EVA and thermoplastic polyurethane elastomer TPU are used as main matrix resin, free radical type photoinitiator, photo-initiation accelerator, acrylic acid monomer and functional additive are added, the mixture is fully plasticized by a double-screw extruder, bracing, cooling and drying are carried out, the mixture enters a UV (ultraviolet) tunnel for carrying out photocuring reaction, and finally the mixture is cut into particles to form hot melt adhesive particles; according to the preparation technology of the hot melt adhesive composition provided by the invention, EVA and TPU are subjected to ultraviolet curing reaction for compatibilization, so that the hot melt adhesive composition has the characteristics of both EVA and TPU, and various functional groups can be introduced into a molecular chain of the composition, so that the bonding range of the hot melt adhesive composition is greatly widened, and the hot melt adhesive composition has good bonding property on metal aluminum, PVC plates, EVA cross-linked foaming plates and the like.
Description
Technical Field
The invention relates to the field of medium-sized adhesives, in particular to an ultraviolet light reaction hot melt adhesive composition and a preparation method thereof.
Background
Ethylene-vinyl acetate copolymer (EVA) is an ethylene copolymer commonly used for preparing hot melt adhesive, is obtained by copolymerizing ethylene and vinyl acetate monomers at high temperature and high pressure, has low melting temperature, excellent flexibility and better adhesive force, and has better adhesive adaptability range after being modified.
CN201310089748.9 mentions "an EVA encapsulant film for resisting potential induced degradation of photovoltaic module", which has good adhesion by mixing a peroxide initiator and a silane coupling agent into EVA resin as a latent initiator, and crosslinking occurs during lamination and silane bonds with an adherend, but this method requires a longer reaction time and is suitable for photovoltaic modules, but is not suitable for all application scenarios because of the long pressing time.
CN202210038940.4 mentions "a maleic anhydride graft modified EVA hot melt adhesive for edge sealing and a preparation method thereof", which improves the adhesion with various wood boards by grafting maleic anhydride and blending tackifying resin, and improves the adhesion with particle boards and multilayer boards. In fact, the EVA grafted anhydride is a commonly used modification means, and can improve the adhesion with some materials such as metal, wood boards and the like by introducing an anhydride functional group, but the EVA grafted anhydride also has adaptability, and the effect with PVC and PU materials is not good.
Thermoplastic polyurethane elastomers, abbreviated as TPU, are polymerized from diisocyanates, oligomeric diols and small molecule diol chain extenders, the molecular chain of which generally consists of hard-segment diisocyanates, small molecule diols and soft-segment oligomeric diols. The flexible chain segment is in a high elastic state in the molecular chain structure of the elastomer material, so that the elastomer material is endowed with good elasticity, toughness and low-temperature flexibility, the rigid hard segment is endowed with hardness and strength, the application range is very wide, the molecular chain of the TPU has a large amount of ester groups and carbamate groups and has strong polarity, the TPU can be generally used for manufacturing hot melt adhesive, and the TPU composed of different structures has good adhesion to polyester, polyurethane, polyvinyl chloride and the like, and the TPU has wide adhesion application particularly in the field of clothing, but the type of functional groups is single and is not suitable for adhesion of various materials.
EVA and TPU are used as raw materials with wide sources and large consumption of hot melt adhesive, and have wider use value if the characteristics of the EVA and the TPU can be combined. The blending is a common modification method, but the molecular structures of the EVA and the TPU are not well compatible, strong plasticization is easy to slowly phase separate, the preparation technology of the ultraviolet light reaction hot melt adhesive composition takes reactive compatibilization as a technical means, the problem of the compatibility of the EVA and the TPU is solved, and meanwhile, a special functional group is introduced, so that the application range of the composition is greatly increased.
Disclosure of Invention
The invention aims to integrate all technical data, and invents a compound plant micro powder health care tea with the effects of reducing blood pressure, reducing blood sugar, reducing blood fat, resisting aging, preventing diabetes, relieving swelling, detoxifying, invigorating stomach, promoting urination, purifying blood, regulating menstruation, calming and the like in numerous experiments through continuous exploration, so as to solve the defects in the background technology.
An ultraviolet light reaction hot melt adhesive composition is composed of the following materials in parts by weight: taking an ethylene-vinyl acetate elastomer and a thermoplastic polyurethane elastomer as main matrix resins, and mixing a free radical type photoinitiator and a functional additive according to parts by weight; the ethylene-vinyl acetate elastomer is EVA resin, the thermoplastic polyurethane elastomer is TPU resin, the sum of the parts by weight of the EVA resin and the parts by weight of the TPU resin is 100 parts, and the preferable addition weight parts are as follows:
EVA resin: 10 to 90 portions of
TPU resin: 10 to 90 portions of
Radical photoinitiator: 0.5 to 5 portions
Photo-initiation accelerator: 0 to 2 parts of
Acrylic acid monomer: 0.1 to 6 portions
Functional additives: 0.1-3 parts.
Further, the content of vinyl acetate VA in the EVA resin is 10-41%.
Further, the TPU resin is any one or a combination of more of polyester type, polyether type, polycarbonate type or polycaprolactone type.
Further, the radical type optical emission agent includes 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxycyclohexyl-phenyl ketone, 2-hydroxy-1- (4- (2-hydroxy-2-methylpropanoylphenyl) benzyl) -2-methyl-1-propanone, 1- [4- (2-hydroxyethoxy) phenyl ] -2-hydroxy-2-methyl-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, 2-methyl-1- [ (4-methylthio) phenyl ] -2-morpholino-1-propanone, and mixtures thereof, 2, 2-dimethoxy-2-phenylacetophenone, 2,4, 6-trimethylbenzoyl benzene-diphenyl phosphine oxide, 2,4, 6-trimethylbenzoyl phenyl ethyl phosphonate, bis (2,4, 6-trimethylbenzoyl) -phenyl phosphine oxide, methyl benzoylformate, alpha-hydroxy ketone oligomer, benzophenone, 4-methylbenzophenone, 4-phenylbenzophenone, 1q p-benzoylbenzoic acid methyl ester, 4-benzoyl-4' -methyl diphenyl sulfide, 2-isopropyl thioxanthone and 2, 4-diethyl thioxanthone.
Further, the photoinitiation accelerator is compounded when a hydrogen abstraction type photoinitiator is used and comprises one or more of 4-dimethylamino ethyl benzoate, 4- (methyldiamino) -benzoic acid- (2-ethyl) hexyl ester, p-dimethylamine isoamyl benzoate and tetraethyl ketone.
Further, the acrylic monomer is caprolactone acrylate, cyclic trimethylolpropane formal acrylate, tetrahydrofuran acrylate, 1, 6-hexanediol diacrylate, 2 (propoxylated) neopentyl glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, triethylene glycol diacrylate, tricyclodecane dimethanol diacrylate, tris (2-hydroxyethyl) isocyanurate diacrylate, trimethylolpropane triacrylate, 3 (ethoxy) trimethylolpropane triacrylate, 3 (propoxy) glycerol triacrylate, pentaerythritol triacrylate, 3 (propoxy) trimethylolpropane triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, dipentaerythritol hexaacrylate, pentaerythritol tetraacrylate, ethylene glycol diacrylate, propylene glycol diacrylate, and propylene glycol diacrylate, and propylene glycol diacrylate, and propylene glycol diacrylate, wherein the acrylic acid monomers may also may be used as the acrylic acid monomers other monomers such as acrylic monomers, and the same, and the acrylic acid, and the monomers, and the acrylic acid, in the acrylic monomers, in the acrylic acid, in the acrylic monomers such as the acrylic acid, in the acrylic monomers may be used as the monomers, in the monomers of, One or more of di-trimethylolpropane tetraacrylate and dipentaerythritol pentaacrylate.
Further, the functional additive comprises one or more of methacryloyloxyethyl maleic acid monoester, methacryloyloxyethyl succinic acid monoester, methacryloyloxyethyl trimellitic anhydride, 2-methacryloyloxyethyl phthalate, methacryloyloxyethyl phosphate, ethylene glycol methacrylate phosphate and polyurethane acrylic resin; preferably, the polyurethane acrylic resin is difunctional aliphatic polyurethane acrylic resin.
Furthermore, hot melt adhesive films can be prepared by extrusion and used for bonding in various applications.
A preparation method of an ultraviolet light reaction hot melt adhesive composition comprises the steps of taking an ethylene-vinyl acetate elastomer and a thermoplastic polyurethane elastomer as main matrix resins, adding a free radical type photoinitiator, a photoinitiation accelerator, an acrylic acid monomer and a functional additive, mixing and stirring uniformly, fully plasticizing by a double-screw extruder, bracing, cooling, drying, entering an UV tunnel for photocuring reaction, and finally pelletizing to form hot melt adhesive particles;
in the invention, ultraviolet light reaction is selected for compatibilization, and the ultraviolet light initiator can generate free radicals under ultraviolet light and is stable at a certain temperature, so that the composition is mainly in a physical blending state when plasticized and mixed in a double screw, and the process is very stable and has better consistency; the traditional compatibilization reaction generated by grafting or bridging initiated by peroxide often reacts in a plasticizing process in equipment such as a double screw, an internal mixer or a pressure container, side reactions such as crosslinking are easy to form, the reaction control difficulty is high, and the formula adjustment is limited.
According to the invention, the composition is subjected to full shearing and plasticizing by a double screw, then is pulled into strips and cooled, and is subjected to UV tunnel photocuring, free radicals generated by photoinitiation are easy to quench relative to peroxide free radical initiators, and although the free radicals can capture hydrogen atoms on side chains of EVA molecules to form new polymer free radicals so as to cause crosslinking, the free radicals are relatively easy to preferentially react with monomers or resins containing acrylic acid functional groups, and further react with the EVA molecules, the direct generation of crosslinking is relatively difficult, and a relatively stable reaction can be obtained by further adjusting the formula.
Meanwhile, the other part of the structure of the monomer, the resin or the functional additive containing the acrylic acid functional group has stronger polarity, so that stronger intermolecular force is easily generated with the ester group and the carbamate group of the TPU, thereby achieving the purpose of compatibilization.
The invention has the beneficial effects that:
compared with the prior art, the EVA resin and the TPU resin are compatibilized by utilizing ultraviolet curing reaction, so that the EVA resin and the TPU resin have the characteristics of both EVA and TPU, various functional groups can be introduced into a molecular chain of the composition, the bonding range of the composition is greatly widened, and the composition has good bonding property on metal aluminum, PVC plates, EVA cross-linked foaming plates and the like. Due to the characteristic of ultraviolet light reaction, the production process is stable and controllable, the consistency is good and fewer side reactions are generated through the design of the formula.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the present invention, the following examples and comparative examples relate to materials including:
(1) EVA resin
EV640, purchased from Mitsui, with a VA content of 10%, a DSC melting point of 91 ℃, and a melt index of 75g/10 min;
EV550, purchased from Mitsui, with VA content of 14%, DSC melting point of 89 ℃, and melt index of 15g/10 min;
EV250, purchased from Mitsui, with 25% of VA, 71% of DSC melting point and 15g/10min of index;
EV40W, purchased from Mitsui, with VA content of 41%, DSC melting point of 40 ℃, and melt index of 65g/10 min;
(2) TPU resin
PEARLBOND 1160L, available from Luoboru, has a melting range of 105-110 ℃ and a softening point of 80-85 ℃.
(3) Photoinitiators, all from IGM
Methyl benzoylformate, hereinafter abbreviated as MBF; 2,4, 6-trimethylbenzoylbenzene-diphenylphosphine oxide, hereinafter referred to as TPO; benzophenone, hereinafter abbreviated as BP
(4) Photoinitiation accelerator
4-Dimethylaminobenzoic acid ethyl ester, hereinafter abbreviated to EDB
(5) Acrylic acid monomers, all from sartomer
Tetrahydrofuran acrylate (trade name: SR285), dipropylene glycol diacrylate (trade name: SR508NS), pentaerythritol tetraacrylate (SR295NS)
(6) Functional additive
Methacryloyloxyethyl maleic acid Monoester (MOES) available from Fine Chemicals
Aliphatic urethane acrylate resin (No. CN966J75NS) available from Sadoma
Example 1:
10 parts by mass of EVA resin EV40W, 90 parts by mass of TPU resin 1160L, 0.5 part by mass of photoinitiator TPO, 0.1 part by mass of acrylic monomer SR295NS, 0.5 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS are put into a high-speed stirring kettle and stirred for about 2 hours, and then liquid components are fully absorbed or adhered to the granular resin, so that the premix is completed. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Example 2:
putting 90 parts by mass of EVA resin EV250, 10 parts by mass of TPU resin 1160L, 3 parts by mass of photoinitiator MBF, 2 parts by mass of photoinitiator TPO, 4 parts by mass of acrylic monomer SR285 and 3 parts by mass of functional additive MOES into a high-speed stirring kettle, stirring for about 2 hours, and fully absorbing or adhering liquid components on the granular resin to complete the premix. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated into a hot melt adhesive film with the thickness of 100 micrometers in a single-screw casting machine with the set temperature of 140 ℃.
Example 3:
60 parts by mass of EVA resin EV550, 40 parts by mass of TPU resin 1160L, 1.5 parts by mass of photoinitiator MBF, 1.5 parts by mass of photoinitiator TPO, 2 parts by mass of photoinitiator accelerator EDB, 2 parts by mass of acrylic monomer SR285, 0.5 part by mass of acrylic monomer SR295, 0.8 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS are put into a high-speed stirring kettle and stirred for about 2 hours, and then liquid components are fully absorbed or adhered on the granular resin to complete the premix. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Example 4:
60 parts by mass of EVA resin EV640, 40 parts by mass of TPU resin 1160L, 1.0 part by mass of photoinitiator BP, 1.0 part by mass of photoinitiator TPO, 0.5 part by mass of photoinitiator accelerator EDB, 2 parts by mass of acrylic monomer SR285, 0.5 part by mass of acrylic monomer SR295, 0.8 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS are put into a high-speed stirring kettle and stirred for about 2 hours, and then liquid components are fully absorbed or adhered on the particle resin, so that the premix is finished. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Example 5:
60 parts by mass of EVA resin EV250, 40 parts by mass of TPU resin 1160L, 1.0 part by mass of photoinitiator MBF, 1.0 part by mass of photoinitiator TPO, 2 parts by mass of acrylic monomer SR285, 0.5 part by mass of acrylic monomer SR295, 0.8 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS are put into a high-speed stirring kettle to be stirred for about 2 hours, and then liquid components are fully absorbed or adhered on the particle resin, so that the premix is completed. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Example 6:
60 parts by mass of EVA resin EV250, 40 parts by mass of TPU resin 1160L, 1.0 part by mass of photoinitiator MBF, 1.0 part by mass of photoinitiator TPO, 2 parts by mass of acrylic monomer SR285, 2 parts by mass of acrylic monomer SR508NS, 0.8 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS are put into a high-speed stirring kettle to be stirred for about 2 hours, and then liquid components are fully absorbed or adhered on the particle resin, so that the premix is completed. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated into a hot melt adhesive film with the thickness of 100 micrometers in a single-screw casting machine with the set temperature of 140 ℃.
Example 7:
putting 40 parts by mass of EVA resin EV250, 20 parts by mass of EVA resin 40W, 40 parts by mass of TPU resin 1160L, 1.0 part by mass of photoinitiator MBF, 1.0 part by mass of photoinitiator TPO, 2 parts by mass of acrylic monomer SR285, 0.5 part by mass of acrylic monomer SR295NS, 0.8 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS into a high-speed stirring kettle, stirring for about 2 hours, and fully absorbing or adhering liquid components on the particle resin to complete the premix. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Comparative example 1:
100 parts by mass of EVA resin EV250 is extruded and pulled into strips in a double-screw extruder with the extrusion temperature set at 140 ℃, and the strips are cooled by water and dried by air, enter a 365nm LED ultraviolet tunnel furnace, and are subjected to irradiation of 10000mj/cm2 and then are granulated. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Comparative example 2:
extruding 100 parts by mass of TPU resin 1160L into a double-screw extruder with the extrusion temperature set to be 140 ℃, water-cooling and air-drying the TPU resin, feeding the TPU resin into a 365nm LED ultraviolet tunnel furnace, and performing irradiation at 10000mj/cm2 to granulate. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
Comparative example 3:
60 parts by mass of EVA resin EV250 and 40 parts by mass of TPU resin 1160L are extruded and pulled in a double-screw extruder with the extrusion temperature set at 140 ℃, are cooled by water and dried by air, enter a 365nm LED ultraviolet light tunnel furnace, and are irradiated by 10000mj/cm2 for granulation. Finally, the produced granules are regulated into a hot melt adhesive film with the thickness of 100 micrometers in a single-screw casting machine with the set temperature of 140 ℃.
Comparative example 4:
60 parts by mass of EVA resin EV250, 40 parts by mass of TPU resin 1160L, 2 parts by mass of acrylic monomer SR285, 0.5 part by mass of acrylic monomer SR295, 0.8 part by mass of functional additive MOES and 0.5 part by mass of functional additive aliphatic polyurethane resin CN966J75NS are put into a high-speed stirring kettle and stirred for about 2 hours, and at the moment, liquid components are fully absorbed or adhered on particle resin to complete the premix. Extruding the premix into a double-screw extruder with the extrusion temperature set as 140 ℃, carrying out water cooling and air drying, then feeding into a 365nm LED ultraviolet light tunnel furnace, and carrying out irradiation at 10000mj/cm2 for granulation. Finally, the produced granules are regulated to form a hot melt adhesive film with the thickness of 100 microns in a single screw casting machine with the set temperature of 140 ℃.
The following performance test tests were conducted on the above-described examples 1 to 7 and comparative examples 1 to 4:
testing the adhesive force:
respectively testing the adhesive force of a hot melt adhesive film, an aluminum sheet, a PVC (polyvinyl chloride) plate and a crosslinked foaming EVA (ethylene-vinyl acetate) plate, flatly paving the hot melt adhesive film on an adherend, pressing the other surface of the hot melt adhesive film on a 150-DEG flat vulcanizing machine for 20S (corona treatment), setting the pressure to be 8Kg, placing a sample strip on an electronic tensile machine for 180-DEG peeling, and testing the peeling strength or phenomenon, wherein the peeling speed is 100 mm/min.
Table 1 adhesion test results
The results of the above performance tests are shown in table 1.
And (4) analyzing results: comparative example 2 shows that the selected TPU has better adhesive force to the PVC plate and almost has no adhesive force to the crosslinked foaming EVA plate, while comparative example 1 shows that the pure EVA resin has very small adhesive force to the aluminum plate, almost has no adhesive force with PVC and has very good adhesive force to the EVA foaming plate with the same structure. The results of example 3 show that the EVA and the TPU are simply blended to affect the original adhesive force of the EVA and the TPU, and the effect is particularly poor, and the results of comparative example 4 show that even if the acrylic monomer and the functional additive are simply blended together with the EVA and the TPU, the improvement of the adhesive force is not facilitated.
Examples 1-7 show that the bonding adaptability of the ultraviolet light modified EVA and TPU is improved, a proper auxiliary reaction system is beneficial to enhancing the comprehensive bonding force, meanwhile, the EVA and TPU are matched in proper weight parts to play a better effect, and the performances of examples 3, 5, 6 and 7 are controlled in a balanced manner.
In conclusion, the preparation technology of the ultraviolet light reaction hot melt adhesive composition provided by the invention adopts reactive compatibilization as a technical means, solves the compatibility problem of EVA and TPU, and simultaneously introduces a special functional group, thereby greatly increasing the bonding application range.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the described embodiments may be made by those skilled in the art without departing from the scope and spirit of the invention as defined by the accompanying claims.
Claims (9)
1. The ultraviolet light reaction hot melt adhesive composition is characterized by comprising the following materials in parts by weight: ethylene-vinyl acetate elastomer and thermoplastic polyurethane elastomer are used as main matrix resin, and a free radical type photoinitiator and a functional additive are mixed according to the weight part; the ethylene-vinyl acetate elastomer is EVA resin, the thermoplastic polyurethane elastomer is TPU resin, the sum of the parts by weight of the EVA resin and the TPU resin is 100 parts, and the preferable addition weight parts are as follows:
EVA resin: 10 to 90 portions of
TPU resin: 10 to 90 portions of
Radical photoinitiator: 0.5 to 5 portions
Photo-initiation accelerator: 0 to 2 parts of
Acrylic acid monomer: 0.1 to 6 portions
Functional additives: 0.1-3 parts.
2. The UV-reactive hot melt adhesive composition according to claim 1, wherein the EVA resin contains Vinyl Acetate (VA) in an amount of 10 to 41%.
3. The UV reactive hot melt adhesive composition according to claim 1, wherein the TPU resin is any one or a combination of polyester, polyether, polycarbonate or polycaprolactone.
4. The UV-reactive hot melt adhesive composition of claim 1, wherein the free radical-type photo-initiator comprises 2-hydroxy-2-methyl-1-phenylpropanone, 1-hydroxycyclohexyl-phenylmethanone, 2-hydroxy-1- (4- (2-hydroxy-2-methylpropanoylphenyl) benzyl) -2-methyl-1-propanone, 1- [4- (2-hydroxyethoxy) phenyl ] -2-hydroxy-2-methyl-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, 2-methyl-1- [ (4-methylthio) phenyl ] -2-morpholinophenyl) -1-butanone, and mixtures thereof One or more of acetone, 2-dimethoxy-2-phenylacetophenone, 2,4, 6-trimethylbenzoylbenzene-diphenylphosphine oxide, ethyl 2,4, 6-trimethylbenzoylphenylphosphonate, bis (2,4, 6-trimethylbenzoyl) -phenylphosphine oxide, methyl benzoylformate, alpha-hydroxyketone oligomer, benzophenone, 4-methylbenzophenone, 4-phenylbenzophenone, methyl 1 q-p-benzoylbenzoate, 4-benzoyl-4' -methyldiphenyl sulfide, 2-isopropyl thioxanthone and 2, 4-diethyl thioxanthone.
5. The UV-reactive hot melt adhesive composition of claim 1, wherein the photoinitiator accelerator is formulated using a hydrogen abstraction photoinitiator, and comprises one or more of ethyl 4-dimethylaminobenzoate, 2-ethylhexyl 4- (methyldiamino) -benzoate, isoamyl p-dimethylaminobenzoate, and tetraethyl mike's ketone.
6. The UV-reactive hot melt adhesive composition of claim 1, wherein the acrylic monomer is caprolactone acrylate, cyclic trimethylolpropane formal acrylate, tetrahydrofuran acrylate, 1, 6-hexanediol diacrylate, 2 (propoxylated) neopentyl glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, triethylene glycol diacrylate, tricyclodecane dimethanol diacrylate, tris (2-hydroxyethyl) isocyanurate diacrylate, trimethylolpropane triacrylate, 3 (ethoxy) trimethylolpropane triacrylate, 3 (propoxy) glycerol triacrylate, pentaerythritol triacrylate, 3 (propoxy) trimethylolpropane triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, poly (ethylene glycol) acrylate, and poly (ethylene glycol) acrylate), poly (ethylene glycol) acrylate), and poly (ethylene glycol) acrylate), and poly (ethylene glycol) acrylate), where co (ethylene glycol) acrylate, and poly (ethylene glycol) acrylate, and combinations comprising, One or more of dipentaerythritol hexaacrylate, pentaerythritol tetraacrylate, di-trimethylolpropane tetraacrylate and dipentaerythritol pentaacrylate.
7. The UV-reactive hot melt adhesive composition according to claim 1, wherein the functional additive comprises one or more of methacryloyloxyethyl maleic acid monoester, methacryloyloxyethyl succinic acid monoester, methacryloyloxyethyl trimellitic anhydride, 2-methacryloyloxyethyl phthalate, methacryloyloxyethyl phosphate, ethylene glycol methacrylate phosphate, and urethane acrylic resin; preferably, the polyurethane acrylic resin is difunctional aliphatic polyurethane acrylic resin.
8. The UV-reactive hot melt adhesive composition according to any one of claims 1 to 8, which is extruded to form a hot melt adhesive film for bonding in various applications.
9. A preparation method of an ultraviolet light reaction hot melt adhesive composition is suitable for the ultraviolet light reaction hot melt adhesive composition of any one of the claims 1 to 8, and is characterized in that an ethylene-vinyl acetate elastomer and a thermoplastic polyurethane elastomer are used as main matrix resins, a free radical photoinitiator, a photoinitiation promoter, an acrylic acid monomer and a functional additive are added, after the materials are mixed and stirred uniformly, the materials are fully plasticized by a double-screw extruder, pulled, cooled and dried, enter an UV tunnel for photocuring reaction, and finally cut into particles to form hot melt adhesive particles.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101787250A (en) * | 2010-01-22 | 2010-07-28 | 山东久隆高分子材料有限公司 | EVA hot melt adhesive composition containing linear hydroxyl-terminated polyurethane resin |
CN103254802A (en) * | 2013-03-19 | 2013-08-21 | 江苏鹿山光伏科技有限公司 | EVA packaging adhesive film for resisting potential-induced degradation of photovoltaic module |
CN103820043A (en) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | UV curing-type thermal-melt optical clear adhesive (TOCA) and bonding method |
CN108047998A (en) * | 2017-12-08 | 2018-05-18 | 上海化工研究院有限公司 | EVA hot-melt adhesive for UHMWPE products bonding and preparation method thereof |
CN109355037A (en) * | 2018-10-18 | 2019-02-19 | 杭州福斯特应用材料股份有限公司 | A kind of ultraviolet light solidification packaging adhesive film and solar cell module |
CN110551337A (en) * | 2019-10-14 | 2019-12-10 | 上海联景高分子材料有限公司 | EVA and TPU melt blending to prepare elastomer alloy and composition foaming material thereof |
-
2022
- 2022-05-18 CN CN202210544463.9A patent/CN114686123A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101787250A (en) * | 2010-01-22 | 2010-07-28 | 山东久隆高分子材料有限公司 | EVA hot melt adhesive composition containing linear hydroxyl-terminated polyurethane resin |
CN103254802A (en) * | 2013-03-19 | 2013-08-21 | 江苏鹿山光伏科技有限公司 | EVA packaging adhesive film for resisting potential-induced degradation of photovoltaic module |
CN103820043A (en) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | UV curing-type thermal-melt optical clear adhesive (TOCA) and bonding method |
CN108047998A (en) * | 2017-12-08 | 2018-05-18 | 上海化工研究院有限公司 | EVA hot-melt adhesive for UHMWPE products bonding and preparation method thereof |
CN109355037A (en) * | 2018-10-18 | 2019-02-19 | 杭州福斯特应用材料股份有限公司 | A kind of ultraviolet light solidification packaging adhesive film and solar cell module |
CN110551337A (en) * | 2019-10-14 | 2019-12-10 | 上海联景高分子材料有限公司 | EVA and TPU melt blending to prepare elastomer alloy and composition foaming material thereof |
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