CN114685037A - Curved surface forming method and curved surface forming device for substrate - Google Patents
Curved surface forming method and curved surface forming device for substrate Download PDFInfo
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- CN114685037A CN114685037A CN202011612253.6A CN202011612253A CN114685037A CN 114685037 A CN114685037 A CN 114685037A CN 202011612253 A CN202011612253 A CN 202011612253A CN 114685037 A CN114685037 A CN 114685037A
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- 239000000758 substrate Substances 0.000 title claims abstract description 157
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 238000003825 pressing Methods 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims description 107
- 239000011241 protective layer Substances 0.000 claims description 19
- 229910021332 silicide Inorganic materials 0.000 claims description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 5
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000011521 glass Substances 0.000 description 20
- 230000035882 stress Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000007493 shaping process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 5
- 238000013003 hot bending Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004660 morphological change Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
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- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
- C03B23/0305—Press-bending accelerated by applying mechanical forces, e.g. inertia, weights or local forces
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/03—Re-forming glass sheets by bending by press-bending between shaping moulds
- C03B23/0307—Press-bending involving applying local or additional heating, cooling or insulating means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
A curved surface forming method of a substrate, the substrate comprises a forming area and a non-forming area, the forming method comprises the following steps: heating the substrate to enable the forming area to have a first temperature and the non-forming area to have a second temperature, wherein the first temperature is different from the second temperature; and applying pressure to the substrate to bend the forming area. The curved surface forming method provided by the invention adopts a non-isothermal forming technology, and respectively heats the specific area of the substrate through selective heating, so that the precise control of the temperature and pressure for forming the curved surface of the substrate is realized, the curved surface forming precision and forming efficiency are improved, the residual stress in the formed substrate is favorably reduced, the service life of a die is prolonged, the energy consumption is effectively reduced, and the large-scale forming of the curved surface substrate is favorably realized. In addition, the invention also provides a curved surface forming device.
Description
Technical Field
The invention relates to the technical field of substrate forming, in particular to a curved surface forming method and a curved surface forming device for a substrate.
Background
At present, curved screens are increasingly applied to electronic products, and particularly with the continuous development of 5G and Artificial Intelligence (AI), the demand of large-size curved screens is increasing.
Most of traditional curved screens are curved glass, and the curved glass is usually formed by adopting a direct hot pressing mode. The specific method comprises the steps of putting the glass substrate into a cavity of a forming die, heating the glass substrate, wherein the temperature of each position of the glass substrate is the same in the heating process, and when the heating temperature exceeds the softening point of glass, then, pressing and forming. However, the traditional hot press molding has long molding period and low efficiency, and the curved glass is easy to generate stress after molding; the corner of the glass substrate is easy to break in the hot pressing process, and the upper surface and the lower surface of the glass have the defects of uneven indentation and the like, so that the problems of low yield of curved glass, poor appearance quality and the like are caused.
Disclosure of Invention
In order to solve the technical problems, the invention provides a curved surface forming method of a substrate, which reduces corner fracture of a curved surface substrate in a hot pressing process and improves the forming yield of the curved surface substrate.
In addition, the invention also provides a curved surface forming device.
The invention provides a curved surface forming method of a substrate, wherein the substrate comprises a forming area and a non-forming area, and the forming method comprises the following steps:
the substrate is heated, so that the molding area has a first temperature, the non-molding area has a second temperature, and the first temperature is different from the second temperature.
And applying pressure to the substrate to bend and form the forming area.
In an embodiment of the present application, the curved surface forming method further includes:
forming a protective layer on the surface of the substrate, wherein the protective layer at least covers part of the molding region.
In the embodiment of the application, the protective layer comprises silicide, and the thickness of the protective layer ranges from 20nm to 150 nm.
In the embodiment of the present application, the temperature difference between the first temperature and the second temperature ranges from 100 ℃ to 200 ℃.
In an embodiment of the present application, the step of heating the substrate to make the molding region have a first temperature and the non-molding region have a second temperature includes:
the substrate is heated.
The temperature of the molding zone and the temperature of the non-molding zone are sensed.
And adjusting the heating power according to the temperature of the molding area and the temperature of the non-molding area, so that the temperature of the molding area reaches the first temperature, and the temperature of the non-molding area reaches the second temperature.
In the embodiment of the application, the curved surface forming method is performed in a vacuum environment.
In an embodiment of the present application, the curved surface forming method further includes:
providing a first mold and a second mold, wherein the substrate is positioned on the first mold, and the second mold is arranged opposite to the first mold.
Wherein, this shaping step still includes:
and driving the first mold to move to the second mold so as to enable the substrate to be in contact with the second mold.
And applying pressure to the first die to bend and form the forming area.
In an embodiment of the present application, the step of applying pressure to the substrate to bend and form the forming region includes:
and acquiring a first pressure applied to the substrate, and controlling a pressure driver to output a second pressure according to the first pressure so as to bend and form the forming area.
In the embodiment of the present application, the pressure is 20KN to 80 KN.
In an embodiment of the present application, the method further comprises preheating the substrate.
The invention also provides a curved surface forming device of the substrate, which comprises a heater and a pressure driver, wherein the heater is used for heating the forming area and the non-forming area. The pressure driver is used for applying pressure to the substrate. The controller is coupled to the heater and the pressure driver, and is used for controlling the heating module to heat the substrate so that the molding area has a first temperature and the non-molding area has a second temperature, wherein the first temperature is different from the second temperature, and controlling the pressure driver to apply pressure to the substrate so that the substrate is bent and molded.
In the embodiment of the present application, the curved surface forming apparatus further includes a first mold and a second mold, and the substrate of the first mold is located on the first mold. The second mold is arranged opposite to the mold.
In an embodiment of the present application, the substrate forming apparatus further includes a temperature sensor, the temperature sensor is coupled to the controller, and the temperature sensor is configured to sense a temperature of the forming area and a temperature of the non-forming area on the substrate. The controller is also used for controlling the heater to adjust the heating power according to the temperature of the forming area and the temperature of the non-forming area, so that the temperature of the forming area reaches the first temperature, and the temperature of the non-forming area reaches the second temperature.
In an embodiment of the present application, the curved surface forming apparatus further includes a pressure sensor, the pressure sensor is coupled to the controller, the pressure sensor is configured to sense a pressure applied to the substrate, and the pressure includes a first pressure and a second pressure. The controller is also used for controlling the pressure driver to output the second pressure according to the first pressure so as to bend and form the forming area.
In the embodiment of the application, the substrate forming device further comprises an air exhaust module, and the air exhaust module is connected with the controller and used for vacuumizing the forming space.
In the embodiment of the present application, the heater is an infrared heater.
Compared with the prior art, the curved surface forming method of the substrate provided by the invention adopts a non-isothermal forming technology, and the specific areas of the substrate are respectively heated through selective heating, so that the temperature and the pressure for forming the curved surface of the substrate are accurately controlled, the curved surface forming precision and the forming efficiency are improved, the residual stress in the formed substrate is favorably reduced, the service life of a die is prolonged, the energy consumption is effectively reduced, and the large-scale forming of the curved surface substrate is favorably realized.
Drawings
Fig. 1 is a schematic structural diagram of a curved surface forming apparatus 100 for a substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a substrate 1 according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first mold and a second mold in the curved surface forming apparatus 100 according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of substrate molding according to an embodiment of the present invention.
Fig. 5 is a schematic distribution diagram of a heater according to an embodiment of the present invention.
Fig. 6 is a schematic flow chart illustrating a method for forming a curved surface of a substrate according to an embodiment of the present invention.
Fig. 7 is a temperature profile of a substrate forming process according to an embodiment of the invention.
Description of the main elements
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| Air extraction module | 9 |
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments. It is to be understood that the described embodiments are merely some embodiments of the invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The names of technical means used in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1, with reference to fig. 2 and fig. 3, a curved surface forming apparatus 100 for a substrate 1 is provided according to an embodiment of the present invention, for forming a curved surface on the substrate 1, so that the substrate 1 is changed from a two-dimensional plane structure to a three-dimensional curved surface structure.
As shown in fig. 2, which is a schematic structural diagram of a substrate 1, the substrate 1 includes a forming region 11 and a non-forming region 12, the non-forming region 12 is a region on the substrate 1 that does not undergo a morphological change after a forming process compared to before the forming process, and the forming region 11 is a region on the substrate 1 that undergoes a morphological change after the forming process compared to before the forming process. In other embodiments, the curved surface forming device can also change the three-dimensional curved surface structure into a two-dimensional plane structure. The shaped areas 11 and the non-shaped areas 12 may be defined on the substrate beforehand.
In this embodiment, as shown in fig. 2, the surface of the substrate 1 is coated with a protective layer 13 before the molding process, and the protective layer 13 covers at least a part of the molding region 11. The protective layer 13 on the one hand prevents the substrate 1 from being scratched on its surface during the molding process. On the other hand can play the effect of the stress that produces when absorbing glass hot bending when hot pressing to reduce the curved in-process of glass hot and lead to the fact the probability of damage to glass, and then promote the yields of shaping product, the third aspect, this protective layer 13 can also improve hot bending glass's intensity simultaneously. The protective layer 13 may be formed on the substrate 1 by means of Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), or Physical Vapor Deposition (PVD).
In the present embodiment, the substrate 1 is a glass plate.
In this embodiment, the protection layer 13 includes silicon or silicide, and the silicide may include silicon carbide, silicon oxide, silicon nitride, or the like.
In the present embodiment, the thickness of the protective layer 13 is 20nm to 150 nm. Referring to fig. 3, the curved surface forming apparatus 100 includes a first mold 2 and a second mold 3, the substrate 1 is disposed on the first mold 2, and the second mold 3 is disposed opposite to the first mold 2. The first mold 2 and the second mold 3 are closed to form a molding space, and the molding space is used for performing curved surface molding on the substrate 1. In the present embodiment, the first mold 2 and the second mold 3 are preferably copying molds, that is, the shape of the surface of the first mold 2 contacting the substrate 1 is similar to the shape of the substrate 1 after molding, and the shape of the surface of the second mold 3 contacting the substrate 1 is similar to the shape of the substrate 1 after molding. In other embodiments, the surfaces of the first mold and the second mold contacting the substrate may be configured to adjust the plane curvature, so as to shape the substrate into a curved surface. The direction of the arrow in fig. 3 is the direction of movement of the first mold 2. During the curved surface forming process of the substrate 1, the first mold 2 is controlled to move towards the second mold 3. In another embodiment, the second mould 3 can also be controlled to move in the direction of the first mould 2.
The curved surface forming apparatus 100 further includes a heater 4, a pressure driver 5, and a controller 6. The heater 6 and the pressure driver 5 are respectively coupled to the controller 6, the controller 6 is configured to control the heater 4 to heat the substrate 1, so that the molding region 11 has a first temperature, the non-molding region 12 has a second temperature, and the first temperature is different from the second temperature, and the controller 6 is further configured to control the pressure driver 5 to apply pressure to the substrate 1, so as to bend the substrate 1. The present invention can realize non-isothermal heating molding of the substrate 1 by the curved surface molding apparatus 100 for the substrate.
It should be noted that in the present embodiment, the heater 4 and the pressure driver 5 are controlled by one controller 6, that is, the control portions of the heater 4 and the pressure driver 5 are concentrated on the controller 6. In another embodiment, the controller 6 may include a first controller and a second controller, and the heater 4 may have the first controller alone, and the heater 4 heats the substrate 1 under the control of the first controller; the pressure driver 5 may have the second controller alone, and the pressure driver 5 applies pressure to the substrate 1 under the control of the second controller. And the first controller and the second controller may communicate. I.e. the first control of the heater 4 and the second control of the pressure driver 5 are independent.
The pressure driver 5 is connected to the first mold 2, and the controller 6 controls the pressure driver 5 to apply pressure to the first mold 2, so as to bend the substrate 1. As shown in fig. 4, it is a schematic view of the bending formation of the substrate 1. Since the first mold 2 and the third mold 3 are both copying molds, they contribute to the curved surface molding of the substrate 1.
Referring to fig. 5, the heater 4 includes a first heater 41 and a second heater 42. The first heater 41 is located above the first mold 2 and is used for heating the first mold 2. The second heater 42 is located below the first mold 2 for heating the first mold 2 from below.
In this embodiment, the first heater 41 includes a first heating unit (not shown) for heating the molding zone 11 and a second heating unit (not shown) for heating the non-molding zone 12.
In this embodiment, the second heater 42 is used to assist in heating the first mold 2 from below, and the addition of the second heater 42 can make the heating of the substrate 1 more uniform, improve the heating efficiency, and shorten the molding cycle.
In this embodiment, the first controller is further configured to control the heater 4 to adjust the heating power according to the temperature of the molding area 11 and the temperature of the non-molding area 12, so that the temperature of the molding area 11 reaches the first temperature and the temperature of the non-molding area 12 reaches the second temperature.
In this embodiment, the first temperature is different from the second temperature, specifically, the first temperature is higher than the second temperature, and the temperature difference between the first temperature and the second temperature is 100-200 ℃. The first temperature of the molding region 11 needs to be higher than the softening point of the material, and the second temperature of the non-molding region 12 does not exceed the softening point of the material too much, so that the release of the internal stress of the material can be ensured, particularly, the stress at the joint of the molding region 11 and the non-molding region 12 can be fully released, and the surface defect of secondary molding caused by excessive softening of the material of the non-molding region 12 can be avoided. Therefore, the temperature difference between the first temperature and the second temperature is selected to be within the range of 100-200 ℃, and the quality of the molded product is optimal. In this embodiment, the first temperature of the molding zone ranges from 700 ℃ to 750 ℃, and the second temperature of the non-molding zone 12 ranges from 550 ℃ to 650 ℃. And the duration of the first temperature and the second temperature may range from 1 to 3 minutes. In this embodiment, the heater 4 is an infrared heater, and the substrate 1 is heated by infrared rays, so that the maximum heating temperature can reach 850 ℃, the heating efficiency is high, and the heating is more uniform.
If the substrate 1 adopts the traditional isothermal surface forming method, the temperature of the forming area 11 and the non-forming area 12 is the same, the forming area 11 can be formed only when the temperature is increased to be higher than the softening point of the material, and the temperature of the non-forming area 12 is too high at this time, so that the material is softened and deformed excessively, and the defects of uneven indentation, wrinkles and the like are easy to appear on the upper surface and the lower surface of the product after re-cooling and forming. In order to avoid surface defects of the non-forming area, the forming temperature of the integral forming area 11 and the non-forming area 12 needs to be reduced, but the temperature is too low, the edge of the forming area 11 is easy to soften incompletely, and phenomena such as cracking, incomplete curved surface forming and the like can occur in the process of applying pressure. According to the non-isothermal heating forming method, the first temperature of the forming area 11 and the second temperature of the non-forming area 12 of the substrate 1 are set to different temperatures, so that the forming requirement of the forming area 11 can be met, the problem that the surface quality of a formed product is defective due to overhigh temperature of the non-forming area 12 is solved, the residual stress in the product can be effectively reduced, the strength of the product is improved, and the energy consumption and the aging of a mold are effectively reduced.
Referring to fig. 1 again, the curved surface forming apparatus 100 further includes a temperature sensor 7, the temperature sensor 7 is coupled to the controller 6, and the temperature sensor 7 is used for sensing the temperature of the forming region 11 and the temperature of the non-forming region 12 on the substrate 1. The temperature of the molding zone 11 and the temperature of the non-molding zone 12 are transmitted to the controller 6, and the controller 6 adjusts the power of the heater 4 according to the temperature of the molding zone 11 and the temperature of the non-molding zone 12, so that the temperature of the molding zone 11 reaches the first temperature and the temperature of the non-molding zone 12 reaches the second temperature. The temperature sensor 7 can control the temperature of the molding region 11 and the temperature of the non-molding region 12. The curved surface forming apparatus 100 further includes a pressure sensor 8, the pressure sensor 8 is coupled to the controller 6, and the pressure sensor 8 is configured to sense a pressure applied to the substrate 1, where the pressure includes a first pressure and a second pressure. Specifically, the pressure sensor 8 is coupled to the second controller.
In this embodiment, the controller 6 is further configured to control the pressure driver 5 to output the second pressure according to the first pressure, so as to bend the forming area 11.
Referring to fig. 1 again, the curved surface forming apparatus 100 further includes an air-extracting module 9, and the air-extracting module 9 is connected to the controller 6 for evacuating the forming space. In particular, the air extraction module 9 is connected to the controller 6. The controller controls the pumping module 9 to pump vacuum so as to make the substrate 1 adsorbed on the first mold 2, and simultaneously provide a vacuum environment for the substrate 1 molding. In other embodiments, the suction module 9 may also be controlled by a separate control device, instead of by the controller 6.
The curved surface forming apparatus 100 further includes a pneumatic regulator (not shown) for performing the loading and unloading of the substrate 1. The controller 6 is used for controlling a pneumatic regulator to place the substrate 1 into the first mold 2 or take out the molded product from the first mold 2.
It is understood that the curve forming apparatus 100 further includes a first moving member (not shown), a second moving member (not shown), and a cooling module (not shown). The first moving member and the second moving member can be electrically connected with the controller 6, the first moving member is used for enabling the first mold 2 to ascend or descend under the control of the controller 6, the second moving member is used for enabling the second mold 3 to ascend or descend under the control of the controller 6, and the first mold 2 and the second mold 3 are matched and opened in the ascending and descending process. The cooling module is used for cooling the substrate 1, and the cooling module is electrically connected with the controller 6.
In this embodiment, a pipeline for introducing cold water is provided inside the cooling module, and after the molding is completed, the controller 6 controls the cooling module to cool and mold the molded substrate 1.
Referring to fig. 6, the present invention further provides a method for forming a curved surface of a substrate by using the curved surface forming apparatus for a substrate, where the substrate 1 includes a forming area 11 and a non-forming area 12, and the forming method specifically includes the following steps:
step S101, referring to fig. 5, a first mold 2 and a second mold 3 are provided, the substrate 1 is located on the first mold 2, and the first mold 2 and the second mold 3 are disposed opposite to each other.
Referring to fig. 3 and fig. 4, in the present embodiment, a protective layer 13 is first formed on the surface of the substrate 1, and the protective layer 13 at least covers a portion of the molding region 11.
In the present embodiment, the substrate 1 is a glass plate.
In this embodiment, the protective layer 13 can prevent the surface of the substrate 1 from being scratched during the forming process. On the other hand can play the stress that produces when absorbing glass hot bending when hot pressing, reduces the curved in-process of glass hot and causes the probability of damage to glass, and then promotes the yields of shaping product, and the third aspect, the protective layer can improve hot bending glass's intensity simultaneously.
In this embodiment, the protection layer 13 includes silicide.
In the present embodiment, the thickness of the protective layer 13 is in the range of 20nm to 150 nm.
In the present embodiment, the first mold 2 and the second mold 3 are clamped to form a molding space for molding the curved surface of the substrate 1. In the present embodiment, the first mold 2 and the second mold 3 are preferably copying molds, that is, the shape of the surface of the first mold 2 contacting the substrate 1 is similar to the shape of the substrate 1 after molding, and the shape of the surface of the second mold 3 contacting the substrate 1 is similar to the shape of the substrate 1 after molding.
In this embodiment, referring to fig. 1, the first controller controls a pneumatic regulator to place the substrate 1 on the first mold 2, and controls the pumping module 9 to pump vacuum, so that the substrate 1 is adsorbed on the first mold 2.
Step S102, heat the substrate 1 to make the molding region 11 have a first temperature and the non-molding region 12 have a second temperature, wherein the first temperature is different from the second temperature.
In this embodiment, referring to fig. 1, the first controller controls the heater 4 to heat the substrate 1, the temperature sensor 7 senses the temperature of the molding region 11 and the temperature of the non-molding region 12 of the substrate 1 and transmits the temperature information to the first controller, and the first controller adjusts the heating power of the heater 4 according to the temperature of the molding region 11 and the temperature of the non-molding region 12. Specifically, the heating power of the first heater 41 is adjusted, the molding zone 11 is heated by the first heating unit so that the molding zone 11 has a first temperature, and the non-molding zone 12 is heated by the second heating unit so that the non-molding zone 12 has a second temperature. This application adopts non-isothermal forming technique to carry out the curved surface shaping to this base plate 1, heats the specific area of this base plate 1 respectively through the selective heating, has realized the integrated shaping of curved surface base plate, can effectively reduce the residual stress in the product, improves product strength, effectively reduces the ageing of energy consumption and mould.
In this embodiment, the temperature difference between the first temperature and the second temperature ranges from 100 ℃ to 200 ℃. The first temperature of the molding region 11 needs to be higher than the softening point of the material, and the second temperature of the non-molding region 12 does not exceed the softening point of the material too much, so that the release of the internal stress of the material can be ensured, particularly, the stress at the joint of the molding region 11 and the non-molding region 12 can be fully released, and the surface defect of secondary molding caused by excessive softening of the material of the non-molding region 12 can be avoided. Therefore, the temperature difference between the first temperature and the second temperature is selected to be within the range of 100-200 ℃, and the quality of the molded product is optimal. In step S102, the first temperature of the molding zone ranges from 700 ℃ to 750 ℃, and the second temperature of the non-molding zone 12 ranges from 550 ℃ to 650 ℃. And the duration of the first temperature and the second temperature may range from 1 to 3 minutes.
In the present embodiment, the first heater 41 is an infrared heater, and the substrate 1 is heated by infrared rays, so that the maximum heating temperature can reach 850 ℃.
In this embodiment, the substrate 1 may be preheated before heating the substrate 1, and preheating may be advantageous to obtain the most stable curved surface forming effect.
Please refer to fig. 7, which is a schematic diagram of a temperature curve of the substrate 1 during molding, the substrate is slowly heated and preheated at a certain heating rate, after a certain period of preheating, when the temperature reaches a predetermined value, the substrate enters a molding stage, the temperature is kept unchanged at the stage, the preheating temperature of the molding region 11 is higher than the preheating temperature of the non-molding region 12, and after the molding stage, the first temperature of the molding region 11 is higher than the second temperature of the non-molding region 12.
In this embodiment, the method for forming the curved surface of the substrate 1 is performed in a vacuum environment, and specifically, the substrate 1 is adsorbed on the first mold 2 by a vacuum of-60 kPa.
Step S103, driving the first mold 2 to move to the second mold 3, so that the substrate 1 contacts with the second mold 3.
In this embodiment, the first mold 2 is a movable mold, the substrate 1 is located on the first mold 2, and the second controller controls the first moving member to drive the first mold 2 to move upward, so that the substrate 1 contacts with the second mold 3. In addition, it can be understood that, the second controller can also control the second moving element to drive the second mold 3 to move downwards, so that the substrate 1 is in contact with the second mold 3.
Step S104, applying pressure to the substrate 1 to bend the molding region 11.
In this embodiment, referring to fig. 5, the second controller controls the pressure driver 5 to apply pressure to the first mold 2, so as to bend the molding zone 11.
In the present embodiment, the pressure range is 20KN to 80 KN.
Step S105, the pressure includes a first pressure and a second pressure, the first pressure applied to the substrate 1 is obtained, and the pressure driver is controlled to output the second pressure according to the first pressure, so as to bend and mold the molding region 11.
Specifically, referring to fig. 1, a pressure sensor 8 is used to obtain a first pressure applied to the substrate 1 and transmit the first pressure information to a controller, and obtain a second pressure applied to the substrate 1 and transmit the second pressure information to the controller. The controller will control the pressure driver 5 to adjust the output second pressure applied on the substrate 1 according to the first pressure, so as to bend and shape the shaping area 11.
It can be understood that, after the molding is finished, the first mold 2 and the second mold 3 are opened, and the first controller controls the pneumatic regulator to take out the substrate 1 from the first mold 2 and enter the next molding process.
After step S105, the substrate 1 may be subjected to a cooling and shaping process, as shown in fig. 7, the cooling and shaping process includes slow cooling and rapid cooling.
The curved surface forming device 100 is simple in structure, different areas of the substrate can be heated non-isothermally at the same time, the forming period is shortened, and the forming efficiency is improved; meanwhile, the non-isothermal integrated molding is beneficial to the surface quality of the molded curved surface product and the strength of the curved surface product.
In summary, the curved surface forming method of the substrate provided by the invention adopts a non-isothermal forming technology, and the specific regions of the substrate are respectively heated by selective heating, so that the temperature and pressure for forming the curved surface of the substrate are accurately controlled, the curved surface forming precision and forming efficiency are improved, the residual stress in the formed substrate is favorably reduced, the service life of a mold is prolonged, the energy consumption is effectively reduced, and the large-scale forming of the curved surface substrate is favorably realized.
The above description of the examples and comparative examples is only intended to aid in the understanding of the process of the invention and its core ideas; in addition, it is obvious to those skilled in the art that other various corresponding changes and modifications can be made according to the technical idea of the present invention, and all such changes and modifications should fall within the scope of the claims of the present invention.
Claims (16)
1. A method of forming a curved surface of a substrate, the substrate comprising a forming region and a non-forming region, the forming method comprising:
heating the substrate to make the molding area have a first temperature and the non-molding area have a second temperature, wherein the first temperature is different from the second temperature; and
and applying pressure to the substrate to bend and shape the forming area.
2. The curved surface forming method as claimed in claim 1, wherein the forming method further comprises:
and forming a protective layer on the surface of the substrate, wherein the protective layer at least covers part of the molding area.
3. The curved surface forming method according to claim 2, wherein the protective layer comprises silicide, and the thickness of the protective layer is in a range of 20nm to 150 nm.
4. The curved surface forming method according to claim 1, wherein the difference between the first temperature and the second temperature is in a range of 100 ℃ to 200 ℃.
5. The curved surface forming method as claimed in claim 1, wherein the step of heating the substrate to make the forming region have a first temperature and the non-forming region have a second temperature comprises:
heating the substrate;
sensing the temperature of the molding zone and the temperature of the non-molding zone; and
and adjusting the heating power according to the temperature of the molding area and the temperature of the non-molding area, so that the temperature of the molding area reaches the first temperature, and the temperature of the non-molding area reaches the second temperature.
6. The method of claim 1 wherein said method of forming said curved surface is performed in a vacuum environment.
7. The curved surface forming method as claimed in claim 1, wherein the forming method further comprises:
providing a first die and a second die, wherein the substrate is positioned on the first die, and the second die is arranged opposite to the first die;
wherein the molding step further comprises:
driving the first mold to move to the second mold so that the substrate is in contact with the second mold;
and applying pressure to the first die to bend and shape the forming area.
8. The curved surface forming method as claimed in claim 1, wherein said step of applying pressure to said substrate to bend said forming region includes:
and acquiring a first pressure borne by the substrate, and controlling a pressure driver to output a second pressure according to the first pressure so as to bend and form the forming area.
9. The curved surface forming method according to claim 1, wherein the pressing force is 20KN to 80 KN.
10. The curved surface forming method as claimed in claim 2, wherein the forming method further comprises preheating the substrate.
11. The utility model provides a curved surface forming device, wherein, curved surface forming device includes:
a heater for heating the molding region and the non-molding region of the substrate;
a pressure driver for applying pressure to the substrate; and
and the controller is coupled with the heater and the pressure driver, and is used for controlling the heater to heat the substrate so as to enable the molding area to have a first temperature and the non-molding area to have a second temperature, wherein the first temperature is different from the second temperature, and controlling the pressure driver to apply pressure to the substrate so as to enable the substrate to be bent and molded.
12. The curve forming apparatus as defined in claim 11, wherein the curve forming apparatus further comprises:
a first mold on which the substrate is positioned;
and the second die is arranged opposite to the first die.
13. The curve forming apparatus as defined in claim 11, wherein the curve forming apparatus further comprises:
a temperature sensor coupled to the controller, the temperature sensor configured to sense a temperature of the molding region and a temperature of the non-molding region on the substrate;
the controller is also used for controlling the heater to adjust the heating power according to the temperature of the forming area and the temperature of the non-forming area, so that the temperature of the forming area reaches the first temperature, and the temperature of the non-forming area reaches the second temperature.
14. The curve forming apparatus as defined in claim 11, wherein the curve forming apparatus further comprises:
the pressure sensor is coupled to the controller and used for sensing the pressure applied to the substrate, and the pressure comprises a first pressure and a second pressure;
the controller is also used for controlling the pressure driver to output the second pressure according to the first pressure so as to bend and form the forming area.
15. The curved surface forming apparatus of claim 11, wherein the curved surface forming apparatus further comprises a suction module connected to the controller for evacuating the forming space.
16. The curved surface forming apparatus as claimed in claim 11, wherein said heater is an infrared heater.
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