CN114675606A - Interlock condition detection method and semiconductor process equipment - Google Patents

Interlock condition detection method and semiconductor process equipment Download PDF

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CN114675606A
CN114675606A CN202210257421.7A CN202210257421A CN114675606A CN 114675606 A CN114675606 A CN 114675606A CN 202210257421 A CN202210257421 A CN 202210257421A CN 114675606 A CN114675606 A CN 114675606A
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任娇
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Xi'an North Huachuang Microelectronic Equipment Co ltd
Beijing Naura Microelectronics Equipment Co Ltd
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    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
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Abstract

本发明实施例提供了一种互锁条件检测方法和半导体工艺设备,应用于半导体装备技术领域,该方法包括:在互锁条件的检测过程中,响应于半导体工艺设备的动作器件的启动信号,获取动作器件的多个互锁列表,每个互锁列表分别包括一个类别的互锁条件,以及互锁条件的目标条件值,在互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按互锁条件所属的类别,存储互锁条件的错误信息。动作器件的多个互锁条件划分为多个类别,根据互锁条件的类别存储互锁条件的错误信息时,在故障排查阶段,可以缩小故障排查范围,快速确定故障点,可以提高故障排查效率。

Figure 202210257421

Embodiments of the present invention provide an interlock condition detection method and semiconductor process equipment, which are applied to the technical field of semiconductor equipment. The method includes: during the interlock condition detection process, in response to a start signal of an action device of the semiconductor process equipment, Acquire multiple interlock lists of the action device, each interlock list includes a category of interlock conditions and the target condition value of the interlock condition, where the target condition value of the interlock condition does not match the acquired actual condition value In the case of , the error information of the interlock condition is stored according to the category to which the interlock condition belongs. The multiple interlocking conditions of the action device are divided into multiple categories. When storing the error information of the interlocking condition according to the category of the interlocking condition, in the troubleshooting stage, the scope of troubleshooting can be narrowed, the fault point can be quickly determined, and the efficiency of troubleshooting can be improved. .

Figure 202210257421

Description

互锁条件检测方法和半导体工艺设备Interlock condition detection method and semiconductor process equipment

技术领域technical field

本发明涉及半导体装备技术领域,特别是涉及一种互锁条件检测方法和半导体工艺设备。The invention relates to the technical field of semiconductor equipment, in particular to an interlock condition detection method and semiconductor process equipment.

背景技术Background technique

在半导体工艺设备的控制中,通常会为动作器件设置多个互锁条件。半导体工艺设备中的下位机在控制动作器件动作之前,首先检测各项互锁条件是否满足,若存在不满足的互锁条件,则触发互锁,禁止动作器件动作,以提高半导体工艺设备在运行过程中的安全性和可靠性。In the control of semiconductor process equipment, a plurality of interlock conditions are usually set for the active device. Before controlling the action of the action device, the lower computer in the semiconductor process equipment first detects whether the interlock conditions are satisfied. If there is an unsatisfied interlock condition, the interlock is triggered to prohibit the action of the action device, so as to improve the operation of the semiconductor process equipment. process safety and reliability.

其中,下位机在检测到某个互锁条件不满足时,不仅可以触发互锁,禁止动作器件动作,而且会记录互锁条件不满足的错误信息。在后续的故障排查阶段,用户可以根据记录,查找故障点。由于半导体工艺设备涉及的工艺较为复杂,因此会存在较多种类和数量的互锁条件,现有技术中根据记录查找故障点时,无法快速的确定故障点。Among them, when the lower computer detects that a certain interlock condition is not satisfied, it can not only trigger the interlock, prohibit the action of the action device, but also record the error information that the interlock condition is not satisfied. In the subsequent troubleshooting stage, the user can find the fault point based on the records. Since the processes involved in the semiconductor process equipment are relatively complex, there will be many types and numbers of interlocking conditions. In the prior art, when finding the fault point according to the records, the fault point cannot be quickly determined.

发明内容SUMMARY OF THE INVENTION

本发明实施例所要解决的技术问题是半导体工艺设备在故障排查阶段无法快速确定故障点的问题。The technical problem to be solved by the embodiments of the present invention is the problem that the semiconductor process equipment cannot quickly determine the fault point in the troubleshooting stage.

为了解决上述问题,本发明实施例第一方面公开了一种互锁条件检测方法,应用于半导体工艺设备,包括:In order to solve the above problems, the first aspect of the embodiments of the present invention discloses an interlock condition detection method, which is applied to semiconductor process equipment, including:

响应于所述半导体工艺设备的动作器件的启动信号,获取所述动作器件的多个互锁列表;每个所述互锁列表分别包括一个类别的互锁条件,以及所述互锁条件的目标条件值;In response to an activation signal of an action device of the semiconductor process equipment, a plurality of interlock lists of the action device are obtained; each of the interlock lists respectively includes a class of interlock conditions and a target of the interlock conditions condition value;

在所述互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按所述互锁条件所属的类别,存储所述互锁条件的错误信息。If the target condition value of the interlock condition does not match the acquired actual condition value, the error information of the interlock condition is stored according to the category to which the interlock condition belongs.

可选地,所述在所述互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按所述互锁条件所属的类别,存储所述互锁条件的错误信息,包括:Optionally, in the case that the target condition value of the interlock condition does not match the acquired actual condition value, according to the category to which the interlock condition belongs, the error information of the interlock condition is stored, including: :

同时获取每个所述互锁列表中包括的互锁条件的实际条件值;Simultaneously obtain the actual condition value of each interlock condition included in the interlock list;

在目标互锁条件的目标条件值与实际条件值不匹配的情况下,生成所述目标互锁条件的错误信息;In the case that the target condition value of the target interlock condition does not match the actual condition value, generating an error message of the target interlock condition;

在预先设置的多个存储区域中的目标存储区域存储所述目标互锁条件的错误信息;所述目标存储区域与所述目标互锁条件的类别对应。Error information of the target interlock condition is stored in a target storage area among the preset plurality of storage areas; the target storage area corresponds to the type of the target interlock condition.

可选地,所述在所述互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按所述互锁条件所属的类别,存储所述互锁条件的错误信息,包括:Optionally, in the case that the target condition value of the interlock condition does not match the acquired actual condition value, according to the category to which the interlock condition belongs, the error information of the interlock condition is stored, including: :

依次获取每个所述互锁列表中包括的互锁条件的实际条件值;Acquiring in turn the actual condition values of the interlock conditions included in each of the interlock lists;

在目标互锁条件的目标条件值与实际条件值不匹配的情况下,生成所述目标互锁条件的错误信息;In the case that the target condition value of the target interlock condition does not match the actual condition value, generating an error message of the target interlock condition;

在预先设置的多个存储区域中的目标存储区域存储所述目标互锁条件的错误信息;所述目标存储区域与所述目标互锁条件的类别对应。Error information of the target interlock condition is stored in a target storage area among the preset plurality of storage areas; the target storage area corresponds to the type of the target interlock condition.

可选地,该方法还包括:Optionally, the method further includes:

在所述目标存储区域的标志位设置错误标识,以标识所述目标互锁条件所属类别中的互锁条件不满足。An error flag is set in the flag bit of the target storage area to identify that the interlock condition in the category to which the target interlock condition belongs is not satisfied.

可选地,所述存储区域中包括对应类别的每个互锁条件的存储位置;所述在预先设置的多个存储区域中的目标存储区域存储所述目标互锁条件的错误信息,包括:Optionally, the storage area includes a storage location for each interlock condition of the corresponding category; the target storage area in the preset multiple storage areas stores the error information of the target interlock condition, including:

在所述目标存储区域中确定所述目标互锁条件的目标存储位置,并在所述目标存储位置存储所述目标互锁条件的错误信息。A target storage location of the target interlock condition is determined in the target storage area, and error information of the target interlock condition is stored in the target storage location.

可选地,所述多个互锁列表中包括第一互锁列表、第二互锁列表和第三互锁列表;其中,所述第一互锁列表中的互锁条件为所述半导体工艺设备中与所述动作器件关联的至少一个其它动作器件的器件标识,所述第一互锁列表中的目标条件值为所述其他动作器件的目标开关状态;所述第二互锁列表中的互锁条件为与所述动作器件关联的、所述半导体工艺设备的至少一项工艺参数的参数标识,所述第二互锁列表中的目标条件值为所述工艺参数的目标参数状态;所述第三互锁列表中的互锁条件为与所述动作器件关联的、所述半导体工艺设备中的至少一项系统状态的状态标识,所述第三互锁列表中的目标条件值为所述系统状态的目标系统状态。Optionally, the plurality of interlock lists include a first interlock list, a second interlock list, and a third interlock list; wherein, the interlock condition in the first interlock list is the semiconductor process The device identifier of at least one other action device associated with the action device in the device, the target condition value in the first interlock list is the target switch state of the other action device; the target condition value in the second interlock list The interlock condition is a parameter identifier of at least one process parameter of the semiconductor process equipment associated with the action device, and the target condition value in the second interlock list is the target parameter state of the process parameter; The interlock condition in the third interlock list is a state identifier of at least one system state in the semiconductor process equipment associated with the action device, and the target condition value in the third interlock list is all The target system state that describes the system state.

可选地,所述动作器件包括所述半导体工艺设备中的阀门、腔室门和泵。Optionally, the action device includes a valve, a chamber door and a pump in the semiconductor processing equipment.

本发明实施例第二方面公开了一种半导体工艺设备,所述半导体工艺设备中包括动作器件和下位机,所述下位机用于响应于所述动作器件的启动信号,获取所述动作器件的多个互锁列表;每个所述互锁列表分别包括一个类别的互锁条件,以及所述互锁条件的目标条件值;所述下位机还用于在所述互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按所述互锁条件所属的类别,存储所述互锁条件的错误信息。A second aspect of the embodiments of the present invention discloses a semiconductor process equipment, the semiconductor process equipment includes an action device and a lower computer, and the lower computer is configured to acquire the operation device in response to a start signal of the action device. a plurality of interlock lists; each of the interlock lists respectively includes a category of interlock conditions and a target condition value of the interlock condition; the lower computer is also used for the target condition value of the interlock condition If it does not match the acquired actual condition value, the error information of the interlock condition is stored according to the category to which the interlock condition belongs.

可选地,所述半导体工艺设备中还包括与所述下位机连接的上位机;所述下位机还用于向所述上位机发送所述错误信息,以使所述上位机显示所述错误信息。Optionally, the semiconductor process equipment further includes an upper computer connected to the lower computer; the lower computer is also used to send the error information to the upper computer, so that the upper computer displays the error. information.

可选地,所述动作器件包括所述半导体工艺设备中的阀门、腔室门和泵。Optionally, the action device includes a valve, a chamber door and a pump in the semiconductor processing equipment.

与背景技术相比,在本发明实施例中,在互锁条件的检测过程中,响应于半导体工艺设备的动作器件的启动信号,获取动作器件的多个互锁列表,每个互锁列表分别包括一个类别的互锁条件,以及互锁条件的目标条件值,在互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按互锁条件所属的类别,存储互锁条件的错误信息。动作器件的多个互锁条件划分为多个类别,根据互锁条件的类别存储互锁条件的错误信息时,在故障排查阶段,可以缩小故障排查范围,快速确定故障点,可以提高故障排查效率。Compared with the background art, in the embodiment of the present invention, in the process of detecting the interlock condition, in response to the activation signal of the action device of the semiconductor process equipment, a plurality of interlock lists of the action device are obtained, and each interlock list is respectively It includes the interlock condition of a category and the target condition value of the interlock condition. If the target condition value of the interlock condition does not match the acquired actual condition value, the interlock condition is stored according to the category to which the interlock condition belongs. error message. The multiple interlocking conditions of the action device are divided into multiple categories. When storing the error information of the interlocking condition according to the category of the interlocking condition, in the troubleshooting stage, the scope of troubleshooting can be narrowed, the fault point can be quickly determined, and the efficiency of troubleshooting can be improved. .

附图说明Description of drawings

图1示出了本实施例提供的一种互锁条件检测方法实施例的步骤流程图;FIG. 1 shows a flow chart of steps of an embodiment of an interlock condition detection method provided in this embodiment;

图2示出了本实施例提供的一种互锁条件检测方法的执行示意图;FIG. 2 shows a schematic diagram of the execution of an interlock condition detection method provided by this embodiment;

图3示出了本实施例提供的一种数据存储示意图;FIG. 3 shows a schematic diagram of a data storage provided by this embodiment;

图4示出了本实施例提供的炉管设备的结构示意图;FIG. 4 shows a schematic structural diagram of the furnace tube equipment provided in this embodiment;

图5示出了本实施例提供的一种半导体工艺设备的结构示意图。FIG. 5 shows a schematic structural diagram of a semiconductor process equipment provided in this embodiment.

具体实施方式Detailed ways

为使本发明实施例的上述目的、特征和优点能够更加明显易懂,下面结合附图和具体实施方式对本发明实施例作进一步详细的说明。In order to make the above objects, features and advantages of the embodiments of the present invention more clearly understood, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and specific implementation manners.

参照图1,示出了本实施例提供的一种互锁条件检测方法实施例的步骤流程图,该方法应用于半导体工艺设备,可以包括:Referring to FIG. 1, there is shown a flow chart of steps of an embodiment of an interlock condition detection method provided in this embodiment. The method is applied to a semiconductor process equipment and may include:

步骤101、响应于半导体工艺设备的动作器件的启动信号,获取动作器件的多个互锁列表。Step 101: Acquire a plurality of interlock lists of the active devices in response to the activation signal of the active device of the semiconductor process equipment.

其中,每个互锁列表分别包括一个类别的互锁条件,以及互锁条件的目标条件值。Wherein, each interlock list includes a category of interlock conditions and target condition values of the interlock conditions.

本实施例中,互锁条件检测方法可以由半导体工艺设备中的下位机实施,下位机例如可编程逻辑控制器(Programmable Logic Controller,PLC)。半导体工艺设备中包括工艺腔室,工艺腔室用于对放入工艺腔室内的晶圆进行工艺处理,例如沉积工艺、刻蚀工艺、外延生长工艺和退火工艺。半导体工艺设备中还包括不同类型的器件,例如温度传感器、压力传感器、气体流量传感器,以及阀门、腔室门、抽真空泵和气体成分分析仪等。动作器件为在下位机的控制下可以动作的器件,例如阀门、腔室门、真空泵等器件。动作器件动作时,会改变通入工艺腔室内的工艺气体的气体类型,以及工艺腔室内的各项工艺参数,不同工艺气体的混合可能会产生危险气体,威胁设备安全,而且工艺参数的改变可能会损坏工艺腔室内的晶圆,因此必须为动作器件设置多个互锁条件,使动作器件在安全状态下动作。启动信号可以是下位机在按预定的工艺流程控制半导体工艺设备运行时,在达到预设条件时,自动生成的启动信号,也可以是接收到的外部设备输入的启动信号。启动信号的获取方法可以包括但不限于上述举例。In this embodiment, the interlock condition detection method may be implemented by a lower computer in the semiconductor process equipment, such as a programmable logic controller (Programmable Logic Controller, PLC). The semiconductor process equipment includes a process chamber, and the process chamber is used to process the wafers placed in the process chamber, such as a deposition process, an etching process, an epitaxial growth process and an annealing process. Semiconductor process equipment also includes different types of devices, such as temperature sensors, pressure sensors, gas flow sensors, as well as valves, chamber doors, vacuum pumps, and gas composition analyzers. The action device is a device that can be actuated under the control of the lower computer, such as a valve, a chamber door, a vacuum pump and other devices. When the action device moves, the gas type of the process gas entering the process chamber and various process parameters in the process chamber will be changed. The mixture of different process gases may generate dangerous gases, threatening the safety of equipment, and the change of process parameters may It will damage the wafer in the process chamber, so multiple interlock conditions must be set for the action device to make the action device operate in a safe state. The start-up signal may be a start-up signal automatically generated when the lower computer controls the operation of the semiconductor process equipment according to a predetermined process flow and when a preset condition is reached, or may be a start-up signal input by an external device received. The method for obtaining the start signal may include, but is not limited to, the above examples.

其中,针对半导体工艺设备中的动作器件,用户可以预先为动作器件设置多个互锁条件,并确定每个互锁条件的目标条件值。进一步的,可以根据一定的规则,将多个互锁条件划分为多个类别,每个类别的互锁条件和对应的目标条件值存储在一个互锁列表中,互锁列表可以存储在下位机中的预设位置。Among them, for the action device in the semiconductor process equipment, the user can set multiple interlock conditions for the action device in advance, and determine the target condition value of each interlock condition. Further, multiple interlocking conditions can be divided into multiple categories according to certain rules, the interlocking conditions and corresponding target condition values of each category are stored in an interlocking list, and the interlocking list can be stored in the lower computer. the preset position in .

可选地,多个互锁列表中包括第一互锁列表、第二互锁列表和第三互锁列表;其中,第一互锁列表中的互锁条件为半导体工艺设备中与动作器件关联的至少一个其它动作器件的器件标识,第一互锁列表中的目标条件值为其他动作器件的目标开关状态;第二互锁列表中的互锁条件为与动作器件关联的、半导体工艺设备的至少一项工艺参数的参数标识,第二互锁列表中的目标条件值为工艺参数的目标参数状态;第三互锁列表中的互锁条件为与动作器件关联的、半导体工艺设备中的至少一项系统状态的状态标识,第三互锁列表中的目标条件值为系统状态的目标系统状态。Optionally, the plurality of interlock lists include a first interlock list, a second interlock list, and a third interlock list; wherein, the interlock condition in the first interlock list is that the semiconductor process equipment is associated with an action device. The device identifier of at least one other action device, the target condition value in the first interlock list is the target switch state of the other action device; the interlock condition in the second interlock list is the semiconductor process equipment associated with the action device. The parameter identification of at least one process parameter, the target condition value in the second interlock list is the target parameter state of the process parameter; the interlock condition in the third interlock list is at least one of the semiconductor process equipment associated with the action device. A state identifier of a system state, and the target condition value in the third interlock list is the target system state of the system state.

在一种实施方式中,动作器件可以包括半导体工艺设备中的阀门、腔室门和泵等动作器件。阀门例如用于向工艺腔室内通入特定工艺气体的进气阀门,泵可以是设置在半导体工艺设备中的抽真空泵和排气泵等,动作器件可以包括但不限于上述举例。以半导体工艺设备中的阀门为例,半导体工艺设备中的阀门通常具有多个互锁条件,阀门在开启之前,需要确定每个互锁条件的实际条件值与目标条件值是否匹配。其中,阀门具有的所有互锁条件中,主要包括三个类别,第一类别为阀门与阀门之间的互锁条件,第二类别为阀门与工艺参数之间的互锁条件,第三类别为阀门与系统状态之间的互锁条件。可以针对第一类别的互锁条件设置第一互锁列表,第一互锁列表中存储与动作器件关联的一个或多个其它动作器件的器件标识,以及与器件标识对应的、其他动作器件的目标开关状态,器件标识作为互锁条件,目标开关状态作为目标条件值。针对第二类别的互锁条件设置第二互锁列表,第二互锁列表中存储与阀门关联的、半导体工艺设备的一项或多项工艺参数的参数标识,以及与参数标识对应的、工艺参数的目标参数状态,参数标识作为互锁条件,目标参数状态作为目标条件值。可以针对第三类别的互锁条件设置第三互锁列表,第三互锁列表中存储与阀门关联的一项或多项系统状态的状态标识,以及与状态标识对应的目标系统状态,状态标识作为互锁条件,目标系统状态作为目标条件值。In one embodiment, the action devices may include action devices such as valves, chamber doors, and pumps in semiconductor processing equipment. The valve is, for example, an inlet valve for introducing a specific process gas into the process chamber. The pump can be a vacuum pump and an exhaust pump provided in the semiconductor process equipment, and the action devices can include but are not limited to the above examples. Taking valves in semiconductor process equipment as an example, valves in semiconductor process equipment usually have multiple interlock conditions. Before the valve is opened, it is necessary to determine whether the actual condition value of each interlock condition matches the target condition value. Among them, all the interlocking conditions of the valve mainly include three categories, the first category is the interlocking condition between the valve and the valve, the second category is the interlocking condition between the valve and the process parameters, and the third category is Interlock condition between valve and system state. A first interlock list may be set for the interlock conditions of the first category, and the first interlock list stores the device identifiers of one or more other action devices associated with the action device, and the device identifiers of other action devices corresponding to the device identifiers. The target switch state, the device ID is used as the interlock condition, and the target switch state is used as the target condition value. A second interlock list is set for the interlock conditions of the second category, and the second interlock list stores the parameter identifiers of one or more process parameters of the semiconductor process equipment associated with the valve, and the process parameters corresponding to the parameter identifiers. The target parameter state of the parameter, the parameter ID is used as the interlock condition, and the target parameter state is used as the target condition value. A third interlock list can be set for the interlock conditions of the third category, and the third interlock list stores the state identifiers of one or more system states associated with the valve, as well as the target system state corresponding to the state identifier, and the state identifier As the interlock condition, the target system state serves as the target condition value.

其中,半导体工艺设备中包括多个进气阀门,不同进气阀门用于在工艺处理过程中的不同阶段,控制向工艺腔室内通入不用类型的工艺气体。同一个阶段可能需要向工艺腔室内通入多种工艺气体,不同阶段之间的工艺气体不能混合,因此某个进气阀门在开启之前,与之相关联的部分进气阀门需要处于关闭状态,部分进气阀门需要处于开启状态。例如,若需要开启的进气阀门为阀门A,在阀门A开启之前,阀门B需要处于开启状态,阀门C需要处于关闭状态。针对阀门A,可以设置与阀门B对应的互锁条件1,以及与阀门C对应的互锁条件2,互锁条件1的目标条件值可以设置为1,1表示开启状态,为阀门B的目标开关状态,表示阀门A开启时阀门B需要处于开启状态;互锁条件2的目标条件值可以设置为0,0表示关闭状态,为阀门C的目标开关状态,表示阀门A开启时阀门C需要处于关闭状态。互锁条件1可以设置为阀门B的器件标识,互锁条件2可以设置为阀门C的器件标识。因此,针对阀门A具有的所有互锁条件,可以将阀门A与其他阀门之间的互锁条件划分为第一类别的互锁条件,并设置第一互锁列表,第一互锁列表中包括所有第一类别的互锁条件和对应的目标条件值。Among them, the semiconductor process equipment includes a plurality of intake valves, and different intake valves are used to control the introduction of different types of process gases into the process chamber at different stages of the process. The same stage may need to pass a variety of process gases into the process chamber. The process gases between different stages cannot be mixed. Therefore, before an intake valve is opened, some of the intake valves associated with it need to be closed. Some intake valves need to be open. For example, if the intake valve to be opened is valve A, before valve A is opened, valve B needs to be open, and valve C needs to be closed. For valve A, interlock condition 1 corresponding to valve B can be set, and interlock condition 2 corresponding to valve C can be set. The target condition value of interlock condition 1 can be set to 1, and 1 indicates the open state, which is the target of valve B On-off state, which means that valve B needs to be in the open state when valve A is opened; the target condition value of interlock condition 2 can be set to 0, 0 means the closed state, which is the target switch state of valve C, which means that valve C needs to be in the open state when valve A is opened. Disabled. Interlock condition 1 can be set as the device ID of valve B, and interlock condition 2 can be set as the device ID of valve C. Therefore, for all the interlocking conditions that valve A has, the interlocking conditions between valve A and other valves can be divided into the interlocking conditions of the first category, and a first interlocking list is set, and the first interlocking list includes All interlock conditions of the first category and corresponding target condition values.

在对晶圆的工艺处理过程中,会涉及多项工艺参数,每项工艺参数均需要达到目标范围时才能对晶圆进行工艺处理,工艺参数例如工艺腔室内的腔室压力和目标工艺气体的气体浓度等。因此阀门在开启之前,与之相关联的工艺参数需要达到目标范围。例如,针对阀门A,可以设置与腔室压力对应的互锁条件3,以及与目标工艺气体的气体浓度对应的互锁条件4,互锁条件3的目标条件值可以设置1,1表示腔室压力位于目标压力范围内,为腔室压力的目标参数状态,互锁条件4的目标条件值可以为1,1表示工艺腔室内目标工艺气体的气体浓度位于目标浓度范围内,为气体浓度的目标参数状态。互锁条件3可以设置为腔室压力的参数标识,互锁条件4可以设置为目标工艺气体的气体浓度的参数标识。因此,针对阀门A具有的所有互锁条件,可以将阀门A与相关的工艺参数之间的互锁条件划分为第二类别的互锁条件,并设置第二互锁列表,第二互锁列表中包括所有第二类别的互锁条件和对应的目标条件值。需要说明的是工艺参数可以包括但不限于腔室压力和气体浓度,也可以包括半导体工艺设备的其他工艺参数。In the process of wafer processing, a number of process parameters will be involved. Each process parameter needs to reach the target range before the wafer can be processed. Process parameters such as the chamber pressure in the process chamber and the target process gas gas concentration, etc. Therefore, before the valve can be opened, the process parameters associated with it need to reach the target range. For example, for valve A, the interlock condition 3 corresponding to the chamber pressure can be set, and the interlock condition 4 corresponding to the gas concentration of the target process gas, the target condition value of the interlock condition 3 can be set to 1, 1 means the chamber The pressure is within the target pressure range, which is the target parameter state of the chamber pressure. The target condition value of the interlock condition 4 can be 1, 1 means that the gas concentration of the target process gas in the process chamber is within the target concentration range, which is the target gas concentration parameter status. The interlock condition 3 can be set as the parameter identification of the chamber pressure, and the interlock condition 4 can be set as the parameter identification of the gas concentration of the target process gas. Therefore, for all the interlocking conditions that valve A has, the interlocking conditions between valve A and related process parameters can be divided into a second category of interlocking conditions, and a second interlocking list is set. Include all the interlock conditions of the second category and the corresponding target condition values. It should be noted that the process parameters may include but are not limited to chamber pressure and gas concentration, and may also include other process parameters of the semiconductor process equipment.

半导体工艺设备在运行过程中,还会设置多项系统状态,当系统状态达到目标状态时,表示半导体工艺设备处于稳定状态,可以对晶圆进行工艺处理,当半导体工艺设备处于非目标状态时,表示半导体工艺设备未处于稳定状态,不可以对晶圆进行工艺处理。系统状态可以为半导体工艺设备的系统报警状态,例如管路压力状态和抽真空泵的工作状态,若管路压力值位于安全压力值以下,则管路压力状态处于目标状态,表示半导体工艺设备处于稳定状态,若抽真空泵的工作状态处于运行状态,则表示半导体工艺设备可以对晶圆进行工艺处理。针对阀门A,可以设置互锁条件5和互锁条件6,互锁条件5的目标条件值可以设置为1,1表示管路压力值位于安全压力值以下,为管路压力状态的目标系统状态;互锁条件6的目标条件值可以设置为1,表示抽真空泵处于运行状态,为抽真空泵的目标系统状态。可以设置互锁条件5为管路压力状态的状态标识,互锁条件6为抽真空泵的状态标识。因此,针对阀门A具有的所有互锁条件,可以将阀门A与各项相关联的系统状态之间的互锁条件划分为第三类别的互锁条件,并设置第三互锁列表,第三互锁列表中包括所有第三类别的互锁条件和对应的目标条件值。需要说明的是,系统状态可以包括但不限于上述举例中的系统报警状态,也可以包括半导体工艺设备的其他系统状态。During the operation of the semiconductor process equipment, a number of system states are also set. When the system state reaches the target state, it means that the semiconductor process equipment is in a stable state, and the wafer can be processed. When the semiconductor process equipment is in a non-target state, Indicates that the semiconductor process equipment is not in a stable state and the wafer cannot be processed. The system state can be the system alarm state of the semiconductor process equipment, such as the pipeline pressure state and the working state of the vacuum pump. If the pipeline pressure value is below the safe pressure value, the pipeline pressure state is in the target state, indicating that the semiconductor process equipment is in a stable state. If the working state of the vacuum pump is in the running state, it means that the semiconductor processing equipment can process the wafer. For valve A, interlock condition 5 and interlock condition 6 can be set. The target condition value of interlock condition 5 can be set to 1. 1 means that the line pressure value is below the safe pressure value, which is the target system state of the line pressure state. ; The target condition value of the interlock condition 6 can be set to 1, which means that the vacuum pump is in the running state, which is the target system state of the vacuum pump. The interlock condition 5 can be set as the status flag of the pipeline pressure state, and the interlock condition 6 is the status flag of the vacuum pump. Therefore, for all the interlocking conditions that valve A has, the interlocking conditions between valve A and the system states associated with each item can be divided into a third category of interlocking conditions, and a third interlocking list is set. The interlock list includes all third category interlock conditions and corresponding target condition values. It should be noted that the system state may include, but is not limited to, the system alarm state in the above example, and may also include other system states of the semiconductor process equipment.

结合上述举例,可以将阀门A的多个互锁条件划分第一类别、第二类别和第三类别,第一类别包括互锁条件1和互锁条件2,第二类别为包括互锁条件3和互锁条件4,第三类别包括互锁条件5和互锁条件6。针对三个类别的互锁条件,用户可以分别设置三个互锁列表,并将三个互锁列表预先存储在下位机中三个不同的预设位置。Combining the above examples, the multiple interlocking conditions of valve A can be divided into a first category, a second category and a third category. The first category includes interlocking condition 1 and interlocking condition 2, and the second category includes interlocking condition 3. and Interlock Condition 4, the third category includes Interlock Condition 5 and Interlock Condition 6. For the three types of interlocking conditions, the user can set three interlocking lists respectively, and store the three interlocking lists in three different preset positions in the lower computer in advance.

本实施例中,在获取到动作器件的启动信号之后,下位机可以响应于启动信号,从预设位置获取动作器件的多个互锁列表。结合上述举例,在得到阀门A的启动信号之后,可以响应于启动信号,分别从三个不同的预设位置获取阀门A的第一互锁列表、第二互锁列表和第三互锁列表。In this embodiment, after acquiring the activation signal of the action device, the lower computer may acquire a plurality of interlock lists of the action device from a preset position in response to the activation signal. In combination with the above example, after the start signal of valve A is obtained, the first interlock list, the second interlock list and the third interlock list of valve A can be obtained from three different preset positions respectively in response to the start signal.

实际应用中,也可以根据需求增加其他类别的互锁条件,例如可以增加第四类别的互锁条件,并设置对应的第四互锁列表,第四类别的互锁条件为阀门与半导体工艺设备中相关联的传感器之间的互锁条件。以上仅为示例性举例,互锁条件的类别划分也可以采用其它原则进行划分。互锁列表的具体形式,以及互锁条件和目标条件值的具体存储方式可以包括但不限于上述举例。In practical applications, other types of interlocking conditions can also be added according to requirements. For example, the fourth type of interlocking conditions can be added, and the corresponding fourth interlocking list can be set. The fourth type of interlocking conditions are valves and semiconductor process equipment. Interlock conditions between the associated sensors. The above is only an exemplary example, and other principles may also be adopted for the classification of the interlocking conditions. The specific form of the interlock list, and the specific storage manner of the interlock condition and target condition values may include, but are not limited to, the above examples.

步骤102、在互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按互锁条件所属的类别,存储互锁条件的错误信息。Step 102: If the target condition value of the interlock condition does not match the acquired actual condition value, store the error information of the interlock condition according to the category to which the interlock condition belongs.

本实施例中,在获取到动作器件的互锁列表之后,下位机可以从互锁列表中获取互锁条件,以及互锁条件的目标条件值。同时,下位机可以获取互锁条件的实际条件值,比较确定实际条件值与目标条件值是否匹配,并在实际条件值与目标条件值不匹配时,生成互锁条件的错误信息,并按互锁条件的类别存储错误信息。In this embodiment, after acquiring the interlock list of the action device, the lower computer can acquire the interlock condition and the target condition value of the interlock condition from the interlock list. At the same time, the lower computer can obtain the actual condition value of the interlock condition, compare and determine whether the actual condition value matches the target condition value, and when the actual condition value does not match the target condition value, generate an error message of the interlock condition, and press the interlock condition value. The class of lock conditions stores error information.

结合上述举例,在获取到阀门A的三个互锁列表之后,针对第一互锁列表中的互锁条件1,下位机可以根据互锁条件1的器件标识(即阀门B的器件标识),获取阀门B的开关状态,阀门B的开关状态即互锁条件1的实际条件值,若阀门B处于开启状态,则确定阀门B的实际条件值与目标条件值匹配;反之,若阀门B处于关闭状态,则确定阀门B的实际条件值与目标条件值不匹配,可以生成与互锁条件1对应的第一错误信息,第一错误信息可以是阀门的实际状态。针对第二互锁列表中的互锁条件3,下位机可以根据互锁条件3的参数标识(即腔室压力的参数标识),获取工艺腔室的腔室压力,若腔室压力位于目标压力范围内,则确定互锁条件3的实际条件值为1,与目标条件值1匹配;反之,若腔室压力位于目标压力范围之外,则确定互锁条件3的实际条件值为0,与目标条件值1不匹配,可以生成与互锁条件3对应的第二错误信息,第二序错误信息可以是腔室压力的实际压力值。同样的,针对第三互锁列表中的互锁条件5,下位机可以根据互锁条件5的状态标识(即管路压力状态的状态标识),获取管路压力状态,若管路压力状态位于安全压力以下,则确定互锁条件5的实际条件值为1,与目标条件值1匹配;反之,若管路压力状态位于安全压力以上,则确定互锁条件5的实际条件值为0与目标条件值1不匹配,可以生成与互锁条件5对应的第三错误信息,第三错误信息可以是实际的管路压力值。Combining the above example, after obtaining the three interlock lists of valve A, for the interlock condition 1 in the first interlock list, the lower computer can, according to the device identifier of the interlock condition 1 (that is, the device identifier of valve B), Obtain the on-off state of valve B. The on-off state of valve B is the actual condition value of interlock condition 1. If valve B is in the open state, it is determined that the actual condition value of valve B matches the target condition value; otherwise, if valve B is closed state, it is determined that the actual condition value of valve B does not match the target condition value, and the first error information corresponding to the interlock condition 1 can be generated, and the first error information can be the actual state of the valve. For the interlock condition 3 in the second interlock list, the lower computer can obtain the chamber pressure of the process chamber according to the parameter identifier of the interlock condition 3 (that is, the parameter identifier of the chamber pressure), if the chamber pressure is at the target pressure Within the range, the actual condition value of the interlock condition 3 is determined to be 1, which matches the target condition value 1; otherwise, if the chamber pressure is outside the target pressure range, the actual condition value of the interlock condition 3 is determined to be 0, and If the target condition value 1 does not match, a second error message corresponding to the interlock condition 3 may be generated, and the second sequence error message may be the actual pressure value of the chamber pressure. Similarly, for the interlock condition 5 in the third interlock list, the lower computer can obtain the pipeline pressure state according to the state identifier of the interlock condition 5 (that is, the state identifier of the pipeline pressure state). Below the safety pressure, the actual condition value of the interlock condition 5 is determined to be 1, which matches the target condition value of 1; on the contrary, if the pipeline pressure state is above the safety pressure, the actual condition value of the interlock condition 5 is determined to be 0 and the target condition value. If the condition value 1 does not match, a third error message corresponding to the interlock condition 5 may be generated, and the third error message may be the actual line pressure value.

可选地,错误信息可以同时包括互锁条件的实际条件值和目标条件值。例如,在生成互锁条件1的错误信息时,错误信息中可以包括阀门B的目标条件值和实际条件值,目标条件值为开启状态,实际条件值为关闭状态。Optionally, the error information may include both the actual condition value and the target condition value of the interlock condition. For example, when the error message of interlock condition 1 is generated, the error message may include the target condition value and the actual condition value of valve B, where the target condition value is in the open state and the actual condition value is in the closed state.

其中,第一错误信息、第二错误信息和第三错误信息可以按类别存储在不同的位置。当某个互锁条件不满足,即互锁条件的实际条件值与目标条件值不匹配时,需要对半导体工艺设备进行维护,查找半导体工艺设备中的故障点。此时,下位机可以从不同位置分别获取错误信息,根据不同位置的错误信息,可以确定互锁条件的所属类别,根据该类别包括的互锁条件查找故障点。例如,在获取到第一错误信息之后,可以确定针对阀门A,与阀门A关联的其它阀门可能存在异常,可以针对与阀门A关联的阀门进行检查。同理,在获取到第二错误信息之后,可以确定针对阀门A,与阀门A关联的工艺参数存在异常,可以针对与工艺参数关联的器件进行检查。由于互锁条件按类别划分,在查找故障点时,可以按类别进行查找,从而可以快速确定故障点。Wherein, the first error information, the second error information and the third error information may be stored in different locations according to categories. When a certain interlock condition is not satisfied, that is, the actual condition value of the interlock condition does not match the target condition value, the semiconductor process equipment needs to be maintained, and the fault point in the semiconductor process equipment needs to be found. At this time, the lower computer can obtain error information from different positions, and can determine the category of the interlock condition according to the error information at different positions, and find the fault point according to the interlock conditions included in the category. For example, after acquiring the first error information, it may be determined that for valve A, other valves associated with valve A may be abnormal, and the valve associated with valve A may be checked. Similarly, after acquiring the second error information, it can be determined that for valve A, the process parameter associated with valve A is abnormal, and the device associated with the process parameter can be checked. Since the interlock conditions are divided into categories, when finding the fault point, it can be searched by category, so that the fault point can be quickly determined.

同时,由于半导体工艺设备中包括的器件的种类和数量较多,相同种类的器件一般布置在半导体工艺设备中的同一个位置,因此在根据互锁条件的类别查找故障点时,可以缩小查找范围,在同一位置进行查找,可以快速确定故障点。At the same time, due to the large number and types of devices included in the semiconductor process equipment, the same types of devices are generally arranged in the same position in the semiconductor process equipment, so when searching for fault points according to the type of interlocking conditions, the search range can be narrowed. , search at the same location, you can quickly determine the fault point.

综上所述,本发明实施例中,在互锁条件的检测过程中,响应于半导体工艺设备的动作器件的启动信号,获取动作器件的多个互锁列表,每个互锁列表分别包括一个类别的互锁条件,以及互锁条件的目标条件值,在互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按互锁条件所属的类别,存储互锁条件的错误信息。动作器件的多个互锁条件划分为多个类别,根据互锁条件的类别存储互锁条件的错误信息时,在故障排查阶段,可以缩小故障排查范围,快速确定故障点,可以提高故障排查效率。To sum up, in the embodiment of the present invention, in the process of detecting the interlock condition, in response to the activation signal of the action device of the semiconductor process equipment, a plurality of interlock lists of the action device are obtained, and each interlock list includes a The interlock condition of the category and the target condition value of the interlock condition. If the target condition value of the interlock condition does not match the acquired actual condition value, the error of the interlock condition is stored according to the category to which the interlock condition belongs. information. The multiple interlocking conditions of the action device are divided into multiple categories. When storing the error information of the interlocking condition according to the category of the interlocking condition, in the troubleshooting stage, the scope of troubleshooting can be narrowed, the fault point can be quickly determined, and the efficiency of troubleshooting can be improved. .

可选地,步骤102可以包括:Optionally, step 102 may include:

同时获取每个互锁列表中包括的互锁条件的实际条件值;Simultaneously obtain the actual condition values of the interlock conditions included in each interlock list;

在目标互锁条件的目标条件值与实际条件值不匹配的情况下,生成目标互锁条件的错误信息;In the case that the target condition value of the target interlock condition does not match the actual condition value, an error message of the target interlock condition is generated;

在预先设置的多个存储区域中的目标存储区域存储目标互锁条件的错误信息;目标存储区域与目标互锁条件的类别对应。Error information of the target interlock condition is stored in a target storage area among the preset plurality of storage areas; the target storage area corresponds to the type of the target interlock condition.

在一种实施例中,用户可以为每个类别的互锁条件设置一个对应的存储区域,存储区域用于存储对应类别的互锁条件的错误信息。如图2所示,图2示出了本实施例提供的一种互锁条件检测方法的执行示意图,以阀门A为例,下位机中预先为阀门A配置第一存储区域、第二存储区域和第三存储区域,第一存储区域与第一互锁列表对应,第二存储区域与第二互锁列表对应,第三存储区域与第三互锁列表对应。在获取到阀门的启动信号之后,下位机可以获取阀门A的三个互锁列表,然后同时启动三个检测子程序,三个检测子程序并行运行,每个检测子程序分别对一个互锁列表中的互锁条件进行检测。例如,第一个检测子程序可以从第一互锁列表中读取互锁条件1的目标条件值,并获取互锁条件1的实际条件值,若互锁条件1的实际条件值与目标条件值不匹配,则互锁条件1为目标互锁条件,生成互锁条件1的错误信息,并在第一存储区域存储互锁条件1的错误信息。与此同时,第二个检测子程序对第二互锁列表中的互锁条件进行检测,并在检测到第二互锁列表中的某个互锁条件的实际条件值与目标条件值不匹配时,生成错误信息,并在第二存储区域存储错误信息;第三个检测子程序对第三互锁列表中的互锁条件进行检测,并在检测到第三互锁列表中的某个互锁条件的实际条件值与目标条件值不匹配时,生成错误信息,并在第三存储区域存储错误信息。In one embodiment, the user may set a corresponding storage area for each type of interlock condition, and the storage area is used to store error information of the corresponding type of interlock condition. As shown in FIG. 2, FIG. 2 shows a schematic diagram of the execution of an interlock condition detection method provided in this embodiment. Taking valve A as an example, the lower computer is pre-configured with a first storage area and a second storage area for valve A. and a third storage area, the first storage area corresponds to the first interlock list, the second storage area corresponds to the second interlock list, and the third storage area corresponds to the third interlock list. After obtaining the start signal of the valve, the lower computer can obtain the three interlock lists of valve A, and then start three detection subroutines at the same time. The interlock condition is detected in . For example, the first detection subroutine can read the target condition value of interlock condition 1 from the first interlock list, and obtain the actual condition value of interlock condition 1. If the actual condition value of interlock condition 1 is the same as the target condition If the values do not match, the interlock condition 1 is the target interlock condition, the error information of the interlock condition 1 is generated, and the error information of the interlock condition 1 is stored in the first storage area. At the same time, the second detection subroutine detects the interlock condition in the second interlock list, and detects that the actual condition value of an interlock condition in the second interlock list does not match the target condition value When the error information is generated, and the error information is stored in the second storage area; the third detection subroutine detects the interlock condition in the third interlock list, and detects an interlock condition in the third interlock list. When the actual condition value of the lock condition does not match the target condition value, an error message is generated, and the error message is stored in the third storage area.

在本发明实施例中,基于多个互锁列表,可以同时对多个互锁列表中包括的互锁条件进行检测,可以缩短互锁检测时间,从而可以提高互锁检测的效率。In the embodiment of the present invention, based on the multiple interlock lists, the interlock conditions included in the multiple interlock lists can be detected simultaneously, the interlock detection time can be shortened, and the efficiency of the interlock detection can be improved.

可选地,步骤102可以包括:Optionally, step 102 may include:

依次获取每个互锁列表中包括的互锁条件的实际条件值;Obtain the actual condition values of the interlock conditions included in each interlock list in turn;

在互锁条件的目标条件值与实际条件值不匹配的情况下,生成互锁条件的错误信息;When the target condition value of the interlock condition does not match the actual condition value, an error message of the interlock condition is generated;

在预先设置的多个存储区域中的目标存储区域中存储互锁条件的错误信息;所述目标存储区域与所述互锁条件所属的类别对应。Error information of the interlock condition is stored in a target storage area among the preset multiple storage areas; the target storage area corresponds to the category to which the interlock condition belongs.

在另一种实施例中,下位机在获取到多个互锁列表之后,可以依次对每个互锁列表中包括的互锁条件进行检测。结合上举例,在获取到阀门A的三个互锁列表之后,下位机可以启动一个检测程序,检测程序可以首先可以从第一互锁列表中读取每个互锁条件的目标条件值,然后获取互锁条件的实际条件值,在确定互锁条件的目标条件值与实际条件值不匹配时,生成对应的错误信息,并在第一存储区域存储错误信息。在第一互锁列表中的互锁条件检测完成之后,可以从第二互锁列表中读取每个互锁条件的目标条件值,然后获取互锁条件的实际条件值,在确定互锁条件的目标条件值与实际条件值不匹配时,生成对应的错误信息,并在第二存储区域存储错误信息。同样的,在第二互锁列表中的互锁条件检测完成之后,可以从第三互锁列表中读取每个互锁条件的目标条件值,然后获取互锁条件的实际条件值,在确定互锁条件的目标条件值与实际条件值不匹配时,生成对应的错误信息,并在第三存储区域存储错误信息。In another embodiment, after acquiring multiple interlock lists, the lower computer may sequentially detect the interlock conditions included in each interlock list. Combining the above example, after obtaining the three interlock lists of valve A, the lower computer can start a detection program. The detection program can first read the target condition value of each interlock condition from the first interlock list, and then The actual condition value of the interlock condition is acquired, and when it is determined that the target condition value of the interlock condition does not match the actual condition value, corresponding error information is generated, and the error information is stored in the first storage area. After the detection of the interlock condition in the first interlock list is completed, the target condition value of each interlock condition can be read from the second interlock list, and then the actual condition value of the interlock condition can be obtained. When the target condition value does not match the actual condition value, corresponding error information is generated, and the error information is stored in the second storage area. Similarly, after the detection of the interlock condition in the second interlock list is completed, the target condition value of each interlock condition can be read from the third interlock list, and then the actual condition value of the interlock condition can be obtained. When the target condition value of the interlock condition does not match the actual condition value, corresponding error information is generated, and the error information is stored in the third storage area.

可选地,该方法还可以包括:Optionally, the method may also include:

在目标存储区域的标志位设置错误标识,以标识目标互锁条件所属类别中的互锁条件不满足。An error flag is set in the flag bit of the target storage area to identify that the interlock condition in the category to which the target interlock condition belongs is not satisfied.

在一种实施例中,在生成目标互锁条件的错误信息之后,在存储错误信息的同时,下位机可以在目标存储区域的标志位设置错误标识,错误标识用于指示互锁条件所属类别的互锁条件不满足,不满足即互锁条件的实际条件值与目标条件值不匹配。结合图2所示,每个存储区域中均可以配置一个标志位,标志位存储的初始值为0。在确定互锁条件1的实际条件值与目标条件值不匹配时,互锁条件1为目标互锁条件,第一存储区域为目标存储区域,可以在第一存储区域的标志位存储一个错误标识,错误标识例如可以为1。在故障查找阶段,下位机可以只对错误标志位为1的第一存储区域进行读取,获取第一存储区域中存储的错误信息,从而可以方便用户快速确定哪个类别的互锁条件不满足。In one embodiment, after the error information of the target interlock condition is generated, while storing the error information, the lower computer may set an error flag in the flag bit of the target storage area, and the error flag is used to indicate the category of the interlock condition. The interlock condition is not satisfied, that is, the actual condition value of the interlock condition does not match the target condition value. As shown in FIG. 2 , a flag bit can be configured in each storage area, and the initial value stored in the flag bit is 0. When it is determined that the actual condition value of the interlock condition 1 does not match the target condition value, the interlock condition 1 is the target interlock condition, the first storage area is the target storage area, and an error flag can be stored in the flag bit of the first storage area , the error flag can be 1, for example. In the fault finding stage, the lower computer can only read the first storage area where the error flag is 1 to obtain the error information stored in the first storage area, so that it is convenient for the user to quickly determine which type of interlock condition is not satisfied.

可选地,存储区域中包括对应类别的每个互锁条件的存储位置。Optionally, the storage area includes a storage location for each interlock condition of the corresponding category.

在预先设置的多个存储区域中的目标存储区域存储目标互锁条件的错误信息的步骤可以包括:在目标存储区域中确定目标互锁条件的目标存储位置,并在目标存储位置存储目标互锁条件的错误信息。The step of storing the error information of the target interlock condition in the target storage area among the preset plurality of storage areas may include: determining a target storage location of the target interlock condition in the target storage area, and storing the target interlock condition in the target storage location Conditional error message.

在一种实施例中,在每个存储区域中,可以为对应类别的所有互锁条件分别配置一个存储位置。如图3所示,图3示出了本实施例提供的一种数据存储示意图,图中第一列301、第二列302和第三列303表示阀门A的互锁列表,第一列为阀门A的标识,第二列302中从上至下依次为三个互锁列表,依次存储多个互锁条件,第三列303为每个互锁条件分别对应的目标条件值。第四列304表示互锁列表的多个存储区域,第一存储区域为305,第二存储区域为306,第三存储区域为307,符号F1表示第一存储区域的标志位,符号F2表示第二存储区域的标志位,符号F3表示第三存储区域的标志位。结合上述举例,第一存储区域305中包括互锁条件1和互锁条件2的两个存储位置。当确定互锁条件1的目标条件值与实际条件值不一致时,可以从第一存储区域305中确定互锁条件1的目标存储位置,在目标存储位置存储互锁条件1的错误信息。同理,当确定互锁条件2的目标条件值与实际条件值不一致时,可以从第一存储区域中确定互锁条件2的目标存储位置,在目标存储位置存储互锁条件2的错误信息。In one embodiment, in each storage area, one storage location may be configured for all interlocking conditions of the corresponding category. As shown in FIG. 3, FIG. 3 shows a schematic diagram of a data storage provided in this embodiment. The first column 301, the second column 302 and the third column 303 in the figure represent the interlock list of the valve A, and the first column is For the identification of valve A, the second column 302 contains three interlock lists from top to bottom, storing multiple interlock conditions in sequence, and the third column 303 is the target condition value corresponding to each interlock condition. The fourth column 304 represents multiple storage areas of the interlock list, the first storage area is 305, the second storage area is 306, the third storage area is 307, the symbol F1 represents the flag bit of the first storage area, and the symbol F2 represents the first storage area. The flag bit of the second storage area, the symbol F3 represents the flag bit of the third storage area. Combining the above examples, the first storage area 305 includes two storage locations of interlock condition 1 and interlock condition 2 . When it is determined that the target condition value of the interlock condition 1 is inconsistent with the actual condition value, the target storage location of the interlock condition 1 can be determined from the first storage area 305, and the error information of the interlock condition 1 can be stored in the target storage location. Similarly, when it is determined that the target condition value of the interlock condition 2 is inconsistent with the actual condition value, the target storage location of the interlock condition 2 can be determined from the first storage area, and the error information of the interlock condition 2 can be stored in the target storage location.

在先技术中,通常只为动作器件设置一个存储位置,因此当动作器件的多个互锁条件不满足时,在先存入存储位置的某个互锁条件的错误信息会被在后存入的另一个互锁条件的错误信息覆盖掉。在故障排查阶段,只能从存储位置获取到一个错误信息,无法根据错误信息进行全面排查。本实施例中,在存储区域中为每个互锁条件分别设置对应的一个存储位置,可以避免出现数据覆盖的问题,可以持续在存储位置保互锁条件的错误信息,便于用户在排查阶段根据所有错误信息快速查找故障点。In the prior art, only one storage location is usually set for the action device. Therefore, when multiple interlock conditions of the action device are not satisfied, the error information of a certain interlock condition stored in the storage location earlier will be stored later. The error message of another interlock condition is overwritten. During the troubleshooting phase, only one error message can be obtained from the storage location, and comprehensive troubleshooting cannot be performed based on the error message. In this embodiment, a corresponding storage location is set for each interlocking condition in the storage area, which can avoid the problem of data overwriting, and can keep the error information of the interlocking condition in the storage location, which is convenient for the user to use the All error messages quickly find the point of failure.

需要说明的是,在不同半导体工艺设备中,动作器件的互锁条件不同,以半导体工艺设备中的炉管设备为例,图4示出了本实施例提供的炉管设备的结构示意图,炉管设备包括常压炉管设备401和低压炉管设备402,相比于常压炉管设备401,低压炉管设备402的排气口需要设置排气泵405,在对晶圆进行工艺处理的过程中,需要通过排气泵405排除炉管设备内的工艺气体。针对低压炉管设备402中的进气阀门404,当进气阀门404开启时,排气泵405需要处于关闭状态,针对进气阀门404设置互锁条件时,可以设置与排气泵405对应的互锁条件,互锁条件的目标条件值为关闭状态。而针对常压炉管设备401中的进气阀门403,不需要设置对应的互锁条件。It should be noted that in different semiconductor process equipment, the interlocking conditions of the actuating devices are different. Taking the furnace tube device in the semiconductor process device as an example, FIG. 4 shows a schematic structural diagram of the furnace tube device provided in this embodiment. The tube equipment includes an atmospheric pressure furnace tube device 401 and a low pressure furnace tube device 402. Compared with the atmospheric pressure furnace tube device 401, an exhaust pump 405 needs to be set at the exhaust port of the low pressure furnace tube device 402. During the process of processing the wafer , the process gas in the furnace tube equipment needs to be exhausted through the exhaust pump 405 . For the intake valve 404 in the low-pressure furnace tube device 402, when the intake valve 404 is opened, the exhaust pump 405 needs to be in a closed state. When setting interlock conditions for the intake valve 404, an interlock corresponding to the exhaust pump 405 can be set. condition, the target condition value of the interlock condition is the OFF state. For the intake valve 403 in the atmospheric pressure furnace tube device 401, it is not necessary to set corresponding interlocking conditions.

本实施例还提供的一种半导体工艺设备,半导体工艺设备中包括下位机和动作器件,下位机用于响应于动作器件的启动信号,获取动作器件的多个互锁列表;每个互锁列表分别包括一个类别的互锁条件,以及互锁条件的目标条件值;下位机还用于在互锁条件的目标条件值与获取到的实际条件值不匹配的情况下,按互锁条件所属的类别,存储互锁条件的错误信息。This embodiment also provides a semiconductor process equipment. The semiconductor process equipment includes a lower computer and an action device, and the lower computer is used to obtain a plurality of interlock lists of the action device in response to a start signal of the action device; each interlock list It includes a category of interlock conditions and the target condition value of the interlock condition respectively; the lower computer is also used for the target condition value of the interlock condition and the acquired actual condition value. Class that stores error information for interlock conditions.

可选地,下位机具体用于同时获取每个互锁列表中包括的互锁条件的实际条件值;在目标互锁条件的目标条件值与实际条件值不匹配的情况下,生成目标互锁条件的错误信息;在预先设置的多个存储区域中的目标存储区域存储目标互锁条件的错误信息;目标存储区域与目标互锁条件的类别对应。Optionally, the lower computer is specifically used to obtain the actual condition value of the interlock condition included in each interlock list at the same time; when the target condition value of the target interlock condition does not match the actual condition value, generate the target interlock. The error information of the condition; the target storage area among the preset multiple storage areas stores the error information of the target interlock condition; the target storage area corresponds to the category of the target interlock condition.

可选地,下位机具体用于依次获取每个互锁列表中包括的互锁条件的实际条件值;在目标互锁条件的目标条件值与实际条件值不匹配的情况下,生成目标互锁条件的错误信息;在预先设置的多个存储区域中的目标存储区域存储目标互锁条件的错误信息;目标存储区域与目标互锁条件的类别对应。Optionally, the lower computer is specifically used to obtain the actual condition value of the interlock condition included in each interlock list in turn; in the case that the target condition value of the target interlock condition does not match the actual condition value, generate the target interlock. The error information of the condition; the target storage area among the preset multiple storage areas stores the error information of the target interlock condition; the target storage area corresponds to the category of the target interlock condition.

可选地,下位机还用于在目标存储区域的标志位设置错误标识,以标识目标互锁条件所属类别中的互锁条件不满足。Optionally, the lower computer is further configured to set an error flag in the flag bit of the target storage area to identify that the interlock condition in the category to which the target interlock condition belongs is not satisfied.

可选地,存储区域中包括对应类别的每个互锁条件的存储位置;下位机具体用于在目标存储区域中确定目标互锁条件的目标存储位置,并在目标存储位置存储目标互锁条件的错误信息。Optionally, the storage area includes the storage location of each interlocking condition of the corresponding category; the lower computer is specifically used to determine the target storage location of the target interlocking condition in the target storage area, and stores the target interlocking condition in the target storage location. error message.

参照图5,示出了本实施例提供的一种半导体工艺设备的结构示意图,半导体工艺设备包括上位机501和下位机502,下位机502与上位机501连接;下位机502还用于向上位机501发送错误信息,以使上位机501显示错误信息。上位机例如计算机,上位机可以间隔预设时长向下位机发送数据请求,下位机可以响应于上位机发送的数据请求,向上位机发送存储的错误信息。上位机在接收到错误信息之后,可以在上位机包括的显示器中显示错误信息。上位机与下位机之间的信息交互方法,以及错误信息的显示方法可以根据需求具体设置,本实施例对此不做限制。Referring to FIG. 5 , a schematic structural diagram of a semiconductor process equipment provided in this embodiment is shown. The semiconductor process equipment includes an upper computer 501 and a lower computer 502 , and the lower computer 502 is connected to the upper computer 501 ; the lower computer 502 is also used for the upper computer 502 The computer 501 sends error information, so that the upper computer 501 displays the error information. The upper computer is such as a computer, the upper computer can send data requests to the lower computer at preset time intervals, and the lower computer can send stored error information to the upper computer in response to the data request sent by the upper computer. After the upper computer receives the error information, it can display the error information on the display included in the upper computer. The information interaction method between the upper computer and the lower computer and the display method of error information can be specifically set according to requirements, which are not limited in this embodiment.

本说明书中的各个实施例均采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似的部分互相参见即可。The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments may be referred to each other.

尽管已描述了本发明实施例的优选实施例,但本领域内的技术人员一旦得知了基本创造性概念,则可对这些实施例做出另外的变更和修改。所以,所附权利要求意欲解释为包括优选实施例以及落入本发明实施例范围的所有变更和修改。Although preferred embodiments of the embodiments of the present invention have been described, additional changes and modifications to these embodiments may be made by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications that fall within the scope of the embodiments of the present invention.

最后,还需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者移动设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者移动设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者移动设备中还存在另外的相同要素。Finally, it should also be noted that in this document, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply these entities or that there is any such actual relationship or sequence between operations. Furthermore, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or mobile device that includes a list of elements includes not only those elements, but also a non-exclusive list of elements. or other elements that are inherent to such a process, method, article or mobile device. Without further limitation, an element defined by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article, or mobile device that includes the element.

以上对本发明实施例所提供的互锁条件检测方法和半导体工艺设备,进行了详细介绍,本文中应用了具体个例对本发明实施例的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明实施例的方法及其核心思想;同时,对于本领域的一般技术人员,依据本发明实施例的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明实施例的限制。The method for detecting interlocking conditions and the semiconductor process equipment provided by the embodiments of the present invention have been described above in detail. In this paper, specific examples are used to illustrate the principles and implementations of the embodiments of the present invention. The descriptions of the above embodiments are only used for In order to help understand the method and the core idea of the embodiment of the present invention; at the same time, for those skilled in the art, according to the idea of the embodiment of the present invention, there will be changes in the specific implementation and application scope. As mentioned above, the contents of this specification should not be construed as limiting the embodiments of the present invention.

Claims (10)

1. An interlock condition detection method is applied to semiconductor process equipment and is characterized by comprising the following steps:
responding to a starting signal of an action device of the semiconductor process equipment, and acquiring a plurality of interlocking lists of the action device; each interlock list comprises a class of interlock conditions and target condition values of the interlock conditions respectively;
and under the condition that the target condition value of the interlocking condition is not matched with the obtained actual condition value, storing error information of the interlocking condition according to the category to which the interlocking condition belongs.
2. The method according to claim 1, wherein, in a case where the target condition value of the interlock condition does not match the obtained actual condition value, storing the error information of the interlock condition by the category to which the interlock condition belongs includes:
simultaneously acquiring actual condition values of the interlocking conditions included in each interlocking list;
generating error information of a target interlock condition under the condition that a target condition value of the target interlock condition does not match an actual condition value;
storing error information of the target interlocking condition in a target storage area of a plurality of preset storage areas; the target storage area corresponds to a category of the target interlock condition.
3. The method according to claim 1, wherein, in a case where the target condition value of the interlock condition does not match the obtained actual condition value, storing the error information of the interlock condition by the category to which the interlock condition belongs includes:
sequentially acquiring actual condition values of the interlocking conditions included in each interlocking list;
generating error information of a target interlock condition under the condition that a target condition value of the target interlock condition does not match an actual condition value;
Storing error information of the target interlocking condition in a target storage area of a plurality of preset storage areas; the target storage area corresponds to a category of the target interlock condition.
4. The method of claim 2 or 3, further comprising:
and setting an error identifier at a flag bit of the target storage area to identify that the interlocking condition in the category to which the target interlocking condition belongs is not met.
5. A method according to claim 2 or 3, characterized in that the storage area comprises a storage location for each interlock condition of the corresponding category; the storing of the error information of the target interlock condition in a target storage area among a plurality of storage areas set in advance includes:
and determining a target storage position of the target interlocking condition in the target storage area, and storing error information of the target interlocking condition in the target storage position.
6. The method of claim 1, wherein the plurality of interlock lists comprises a first interlock list, a second interlock list, and a third interlock list;
wherein the interlock condition in the first interlock list is a device identifier of at least one other action device associated with the action device in the semiconductor process equipment, and the target condition value in the first interlock list is a target switch state of the other action device; the interlocking condition in the second interlocking list is a parameter identification of at least one process parameter of the semiconductor process equipment, which is associated with the action device, and the target condition value in the second interlocking list is a target parameter state of the process parameter; the interlock condition in the third interlock list is a state identification of at least one system state in the semiconductor process equipment associated with the action device, and the target condition value in the third interlock list is a target system state of the system state.
7. The method of claim 6, wherein said action devices comprise valves, chamber doors and pumps in said semiconductor processing equipment.
8. The semiconductor process equipment is characterized by comprising an action device and a lower computer, wherein the lower computer is used for responding to a starting signal of the action device and acquiring a plurality of interlocking lists of the action device; each interlock list comprises a category of interlock conditions and target condition values of the interlock conditions respectively; and the lower computer is also used for storing the error information of the interlocking condition according to the category of the interlocking condition under the condition that the target condition value of the interlocking condition is not matched with the obtained actual condition value.
9. The semiconductor processing equipment according to claim 8, further comprising an upper computer connected to the lower computer; the lower computer is also used for sending the error information to the upper computer so that the upper computer displays the error information.
10. The semiconductor processing apparatus of claim 8 or 9, wherein the motion device comprises a valve, a chamber door, and a pump in the semiconductor processing apparatus.
CN202210257421.7A 2022-03-16 2022-03-16 Interlock condition detection method and semiconductor process equipment Pending CN114675606A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040050973A (en) * 2002-12-11 2004-06-18 삼성전자주식회사 Total management system and control method for realtime monitoring of time interlock
CN1848008A (en) * 2005-12-09 2006-10-18 北京北方微电子基地设备工艺研究中心有限责任公司 Method of controlling semiconductor etching equipment
CN101398669A (en) * 2007-09-29 2009-04-01 北京北方微电子基地设备工艺研究中心有限责任公司 Mutual locking and alarming processing method and system
CN104281141A (en) * 2013-07-04 2015-01-14 北京北方微电子基地设备工艺研究中心有限责任公司 Process gas interlocking control method and system
CN109143994A (en) * 2017-06-28 2019-01-04 费希尔-罗斯蒙特系统公司 Mutual chain visualization
CN109726091A (en) * 2018-12-28 2019-05-07 乐蜜有限公司 A kind of blog management method and relevant apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040050973A (en) * 2002-12-11 2004-06-18 삼성전자주식회사 Total management system and control method for realtime monitoring of time interlock
CN1848008A (en) * 2005-12-09 2006-10-18 北京北方微电子基地设备工艺研究中心有限责任公司 Method of controlling semiconductor etching equipment
CN101398669A (en) * 2007-09-29 2009-04-01 北京北方微电子基地设备工艺研究中心有限责任公司 Mutual locking and alarming processing method and system
CN104281141A (en) * 2013-07-04 2015-01-14 北京北方微电子基地设备工艺研究中心有限责任公司 Process gas interlocking control method and system
CN109143994A (en) * 2017-06-28 2019-01-04 费希尔-罗斯蒙特系统公司 Mutual chain visualization
CN109726091A (en) * 2018-12-28 2019-05-07 乐蜜有限公司 A kind of blog management method and relevant apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈勇平,等: "多重互锁安全型氢氧合成系统", 电子工业专用设备, vol. 49, no. 04, 20 August 2020 (2020-08-20), pages 6 - 8 *

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