CN114675498A - Two-sided automatic exposure machine that hinders that welds - Google Patents

Two-sided automatic exposure machine that hinders that welds Download PDF

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Publication number
CN114675498A
CN114675498A CN202210145046.7A CN202210145046A CN114675498A CN 114675498 A CN114675498 A CN 114675498A CN 202210145046 A CN202210145046 A CN 202210145046A CN 114675498 A CN114675498 A CN 114675498A
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China
Prior art keywords
frame
plate
sliding
assembled
carrier substrate
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Pending
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CN202210145046.7A
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Chinese (zh)
Inventor
代晓龙
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Shenzhen Xinguanghui Technology Co ltd
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Shenzhen Xinguanghui Technology Co ltd
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Priority to CN202210145046.7A priority Critical patent/CN114675498A/en
Publication of CN114675498A publication Critical patent/CN114675498A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a double-sided resistance welding automatic exposure machine, which belongs to the technical field of PCB manufacturing and comprises a main frame and a guide groove, wherein a detection camera component is assembled on the main frame, two ends of a carrier substrate are assembled in the guide groove in a sliding manner, a lower base is assembled on one side of the carrier substrate in a positioning and sliding manner, a lower film is assembled in the lower base, a cover plate is rotatably assembled at one end of the carrier substrate, an upper film is assembled in the cover plate, a fixed frame plate is assembled between the carrier substrate and the lower base in an elastic sliding manner, a bearing plate is arranged in the fixed frame plate, and a vacuum valve head array is arranged on one side of the bearing plate. The efficiency of exposure material loading has been improved, the productivity of PCB board has been improved.

Description

Two-sided automatic exposure machine that hinders that welds
Technical Field
The invention belongs to the technical field of PCB manufacturing, and particularly relates to a double-sided solder mask automatic exposure machine.
Background
The PCB circuit is usually printed with solder resist after being manufactured, short circuit of a circuit pad bridge during welding is prevented, solder loss of a non-welding area is reduced, a chemical protective layer is provided, the plate surface is prevented from being affected with damp and external damage, exposure is the core of the whole solder resist process, the principle of solder resist exposure is mainly that light scattering and photosensitive polymers contained in a solder resist film generate optical reaction, the quality stability of the PCB circuit board is directly influenced by exposure quality, exposure is irradiation of light, organic high polymer materials are initiated and decomposed into free radicals, the free radicals initiate photopolymerization monomers to perform polymerization crosslinking reaction, a macromolecular structure which is not easy to dissolve in dilute alkali liquor is formed, and the two sides of the macromolecular structure are generally carried out in an exposure machine.
Present exposure machine hinders to weld and sends into the exposure room after the laminating of counterpointing PCB base plate and film before exposing, present equipment detects PCB base plate position and through multiaxis motion board centre gripping PCB base plate displacement and verting through the CCD camera mostly, at the in-process of location centre gripping base plate, because the trace warpage of base plate, cause the clearance between film and the base plate very easily, it is unsatisfactory to lead to the exposure effect, and the slope of CCD camera survey base plate and carry out the process of proofreading and counterpointing comparatively take time, the speed of counterpointing the material loading has been reduced.
Disclosure of Invention
Aiming at the defects in the prior art, the embodiment of the invention aims to provide a double-sided solder mask automatic exposure machine to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a two-sided automatic exposure machine that hinders welding, includes the frame component, the frame component includes main frame and guide way, contain two sets of guide ways and two sets of guide way parallels in laying in the main frame, two-sided automatic exposure machine that hinders welding still includes:
the camera detection assembly comprises a transverse plate frame, a first driving motor, a longitudinal plate frame and a second driving motor, wherein the transverse plate frame is transversely assembled on the main rack and arranged towards one side of the middle part of the main rack;
the carrier mechanism comprises a carrier substrate, a hollow groove, a lower base and a lower film sheet, wherein the hollow groove is formed in the middle of the carrier substrate, two ends of the carrier substrate are in limited sliding assembly in the guide grooves, the lower base is positioned and in sliding assembly on one side of the carrier substrate, and the lower film sheet is assembled in the middle of the lower base;
The cover plate component comprises a cover plate part, a light transmission groove and an upper film, the cover plate part is rotatably assembled at one end of the carrier substrate, the light transmission groove is formed in the middle of the cover plate part, the upper film is assembled in the light transmission groove, and the upper film is arranged towards one side of the lower base and matched with the lower film;
the positioning machine frame comprises a fixed frame plate, a first sliding frame, a second sliding frame, a first bearing plate and balls, wherein the fixed frame plate is elastically assembled between the carrier substrate and the lower base in a sliding mode, the sliding direction of the fixed frame plate is matched with that of the lower base, the first sliding frame is arranged in the fixed frame plate in a sliding mode, the second sliding frame is arranged in the first sliding frame in a sliding mode, the moving direction of the second sliding frame is perpendicular to that of the first sliding frame, the first bearing plate is arranged at two ends of the inner wall of the second sliding frame, and the balls are movably assembled on the first bearing plate; and
inhale the material subassembly, it includes vacuum valve head and valve mouth to inhale the material subassembly, vacuum valve head array is laid in first bearing board one side, just vacuum valve head end intercommunication has the valve mouth, valve mouth array is laid in first bearing board one side and is faced the setting of second sliding sash middle part one side.
As a further scheme of the present invention, the frame member further includes a driving chain set, and the driving chain set is assembled on one side of the guide groove and is linked with the carrier mechanism for driving the directional sliding of the carrier substrate.
As a further scheme of the present invention, the number of the second driving motors is eight, and the arrangement positions of the second driving motors are matched with the alignment holes of the lower film and the upper film.
As a further scheme of the present invention, the carrier mechanism further includes a driver, which is disposed between the carrier substrate and the lower base, and is assembled and connected with the carrier substrate and the driver, and is used for driving the lower base to move towards one side of the carrier substrate.
As a further scheme of the present invention, the cover plate assembly further includes a locking groove fixedly disposed at one end of the carrier substrate for locking the cover plate member.
As a further aspect of the present invention, the positioning rack further includes:
the first positioning motor is fixedly assembled on one side of the fixed frame plate and used for movably connecting the fixed frame plate and the first sliding frame;
the second positioning motor is fixedly assembled on one side of the first sliding frame and is used for movably connecting the first sliding frame and the second sliding frame;
The limiting sleeve is fixedly arranged on one side of the second sliding frame and used for limiting the sliding track of the second sliding frame; and
and the second bearing plate is fixedly arranged at two ends of the inner wall of the second sliding frame and is arranged adjacent to the first bearing plate.
As a further scheme of the invention, a material pressing plate is further assembled on one side of the second support plate, and the material pressing plate is movably inserted into one side of the second support plate and arranged towards one side of the middle part of the second sliding frame, and is used for buckling and locking the PCB substrate placed on the balls.
In summary, compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the invention, the carrier substrate arranged in the guide groove in a sliding manner and the positioning rack movably assembled on one side of the carrier substrate can be used for quickly aligning the double-sided solder-resisting substrate and adsorbing the film, so that the extrusion positioning of the PCB substrate by conventional exposure equipment is avoided, exposure missing caused by board warping is prevented, the alignment efficiency of exposure feeding is improved, and the productivity of the PCB is improved.
Drawings
Fig. 1 is a schematic perspective view of a double-sided solder resist automatic exposure machine according to an embodiment of the present invention.
Fig. 2 is a schematic front structural view of a double-sided solder resist automatic exposure machine provided in an embodiment of the present invention.
Fig. 3 is a schematic top view of the double-sided solder resist automatic exposure machine provided in an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a positioning frame in the double-sided solder resist automatic exposure machine according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram illustrating a mark a in the double-sided solder resist automatic exposure machine provided in an embodiment of the present invention.
Fig. 6 is a schematic side view of a first support plate in the double-sided solder resist automatic exposure machine according to an embodiment of the present invention.
Reference numerals: 1-frame component, 101-main frame, 102-guide groove, 103-drive chain group, 2-detection camera component, 201-transverse plate frame, 202-first drive motor, 203-longitudinal plate frame, 204-second drive motor, 3-carrier mechanism, 301-carrier substrate, 302-hollow groove, 303-lower base, 304-lower film, 305-driver, 4-cover plate component, 401-cover plate component, 402-light transmission groove, 403-upper film, 404-locking groove, 5-positioning frame, 501-fixed frame plate, 502-first sliding frame, 503-second sliding frame, 504-first positioning motor, 505-second positioning motor, 506-limiting sleeve, 507-first supporting plate, 508-ball bearing, 509-a second supporting plate, 6-a material sucking component, 601-a vacuum valve head, 602-a valve nozzle and 7-a material pressing plate.
Detailed Description
In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1-6, the double-sided solder mask automatic exposure machine in an embodiment of the present invention includes a frame member 1, the frame member 1 includes a main frame 101 and two guide slots 102, the main frame 101 includes two sets of guide slots 102, and the two sets of guide slots 102 are disposed in the main frame 101 in parallel, the double-sided solder mask automatic exposure machine further includes: the detection camera assembly 2 comprises a transverse plate frame 201, a first driving motor 202, a longitudinal plate frame 203 and a second driving motor 204, wherein the transverse plate frame 201 is transversely assembled on the main frame 101 and is arranged towards one side of the middle part of the main frame 101, the first driving motor 202 is assembled on the transverse plate frame 201 and is vertically assembled with the longitudinal plate frame 203, and the second driving motor 204 is fixedly assembled on one side of the longitudinal plate frame 203; the carrier mechanism 3 comprises a carrier substrate 301, a hollow groove 302, a lower base 303 and a lower film sheet 304, wherein the hollow groove 302 is formed in the middle of the carrier substrate 301, two ends of the carrier substrate 301 are assembled in the guide groove 102 in a limiting and sliding manner, the lower base 303 is assembled on one side of the carrier substrate 301 in a positioning and sliding manner, and the lower film sheet 304 is assembled in the middle of the lower base 303; the cover plate assembly 4 comprises a cover plate member 401, a light transmission groove 402 and an upper film 403, the cover plate member 401 is rotatably assembled at one end of the carrier substrate 301, the light transmission groove 402 is formed in the middle of the cover plate member 401, the upper film 403 is assembled in the light transmission groove 402, and the upper film 403 faces one side of the lower base 303 and is matched with the lower film 304; the positioning machine frame 5 comprises a fixed frame plate 501, a first sliding frame 502, a second sliding frame 503, a first supporting plate 507 and balls 508, wherein the fixed frame plate 501 is elastically assembled between the carrier substrate 301 and the lower base 303 in a sliding manner, the sliding direction of the fixed frame plate 501 is matched with that of the lower base 303, the first sliding frame 502 is arranged in the fixed frame plate 501 in a sliding manner, the second sliding frame 503 is arranged in the first sliding frame 502 in a sliding manner, the moving direction of the second sliding frame 503 is perpendicular to that of the first sliding frame 502, the first supporting plate 507 is arranged at two ends of the inner wall of the second sliding frame 503, and the balls 508 are movably assembled on the first supporting plate 507; and the material sucking component 6, the material sucking component 6 comprises a vacuum valve head 601 and a valve nozzle 602, the vacuum valve head 601 is arranged on one side of the first supporting plate 507 in an array manner, the tail end of the vacuum valve head 601 is communicated with the valve nozzle 602, and the valve nozzle 602 is arranged on one side of the first supporting plate 507 in an array manner and faces one side of the middle of the second sliding frame 503.
In practical application of this embodiment, when the double-sided solder mask exposure machine is used to expose a solder mask, a solder mask layer is coated on a PCB substrate to be exposed by screen printing with green oil, then the cover plate 401 on one side of the carrier substrate 301 is opened, the PCB substrate is placed on the first support plate 507, at this time, the edge portion of the PCB substrate is fastened to the balls 508, after the cover plate 401 on one side of the carrier substrate 301 is closed, the vacuum valve head 601 on one side of the first support plate 507 is turned on after the air passage is opened, a negative pressure vacuum area is formed at one end of the valve nozzle 602, the PCB substrate movably placed on one side of the valve nozzle 602 is adsorbed toward one side of the valve nozzle 602, and in the adsorption process, the edge wall surface of the PCB substrate is attached to one side of the valve nozzle 602, so as to realize zero inclination in the horizontal direction, and meanwhile, the second driving motors 204 arranged on the main frame 101 and used for detecting the first detection camera assemblies 2, under the common driving action of the transverse plate frame 201 and the longitudinal plate frame 203, the lower plate frame is close to one side of the carrier substrate 301 and the lower base 303, and captures images of the lower film sheet 304, the upper film sheet 403 and the alignment hole at the edge of the PCB substrate, because the lower base 303 is positioned and assembled at one end of the carrier substrate 301, the alignment hole of the lower film sheet 304 and the alignment hole of the carrier substrate 301 are coincided by default, at the moment, when the alignment hole in the PCB substrate is matched with the alignment hole, a plurality of second driving motors 204 arranged at the top and the bottom of the carrier substrate 301 and the lower base 303 negatively feed back the captured images to a controller, and the compensation of offset errors is realized by driving the first sliding frame 502 to slide quantitatively in the fixed frame plate 501 and the second sliding frame 503 in the first sliding frame 502, and the PCB substrate on the second sliding frame 503 is driven to be aligned with the lower film sheet 304 and the upper film sheet 403 synchronously, after the counterpoint is accomplished second driving motor 204 is at vertical grillage 203 one side slip shrink to roll back to main frame 101 both sides, do not take place to interfere with carrier substrate 301's motion, just carrier substrate 301 backsliding on guide way 102 will counterpoint the PCB base plate and the film piece of accomplishing and send into to the exposure chamber jointly and expose, has realized counterpointing fast to PCB base plate and film piece, has avoided conventional location structure to the extrusion of PCB base plate, effectively prevents because of the exposure that the panel warpage caused to miss the seal, has promoted the efficiency of exposure material loading and has reduced the defective rate.
In one case of this embodiment, the exposure light source is generally an LED cold light source between 310 nm and 440nm, which has the excellent characteristics of high illumination intensity, short exposure time and low heat generation, and can control the expansion and contraction amount of the film within 0.3mil, thereby improving the stability of continuous exposure.
Referring to fig. 1, in a preferred embodiment of the present invention, the frame member 1 further includes a driving chain set 103, and the driving chain set 103 is mounted on one side of the guiding slot 102 and is linked with the carrier mechanism 3 for driving the directional sliding of the carrier substrate 301.
In practical application of the present embodiment, the two sets of guide grooves 102 disposed in the main frame 101 can be assembled with the two sets of carrier mechanisms 3 for alternate exposure, and an operator can assemble and disassemble a PCB substrate on the other set of carrier substrate 301 during exposure, thereby realizing continuous cyclic exposure and improving the productivity and efficiency.
Referring to fig. 1, in a preferred embodiment of the invention, the number of the second driving motors 204 is eight, and the arrangement positions of the second driving motors 204 are matched with the alignment holes of the lower film 304 and the upper film 403.
In practical application of this embodiment, the second driving motors 204 are arranged in an array at the top and the bottom of the carrier substrate 301 and the lower base 303 and are matched with the alignment reference holes on the film, four sets of the second driving motors 204 are respectively arranged on the front and back surfaces of the PCB substrate and are used for performing photo detection and alignment correction on the reference holes, and the second driving motors 204 are common knowledge in the prior art and are not described herein in detail.
Referring to fig. 2, in a preferred embodiment of the present invention, the carrier mechanism 3 further includes a driver 305, and the driver 305 is disposed between the carrier substrate 301 and the lower base 303 and assembled with the carrier substrate 301 and the driver 305, for driving the lower base 303 to move toward one side of the carrier substrate 301.
In practical application of this embodiment, the driver 305 can drive the lower base 303 to move towards one side of the carrier substrate 301, and press the fixing frame plate 501 to overcome the elastic acting force and move towards one side of the carrier substrate 301 synchronously in the moving process, and at this time, the cover plate 401 is positioned and buckled at one end of the carrier substrate 301, and at this time, the alignment hole of the upper film 403 on the cover plate 401 corresponds to the alignment hole on the PCB substrate, so that one end of the PCB substrate can be elastically abutted to the upper film 403 in the pressing process, and the other end of the PCB substrate is movably abutted to the lower film 304, thereby realizing the alignment and the fitting of the films at the two ends of the PCB substrate.
In one embodiment, the driver 305 may be driven by a servo motor or an electric telescopic rod, and the specific structure is not limited herein.
Referring to fig. 1, in a preferred embodiment of the present invention, the cover plate assembly 4 further includes a locking groove 404, and the locking groove 404 is fixedly disposed at one end of the carrier substrate 301 for locking and fastening the cover plate 401.
In practical application, the cover plate 401 can be locked on the carrier substrate 301 through the locking groove 404 after being closed towards one side of the carrier substrate 301, so that the lower base 303 presses the PCB substrate towards the upper film 403, the cover plate 401 is limited on the carrier substrate 301, and therefore the film and the substrate are fully abutted and pressed to be attached.
Referring to fig. 4, in a preferred embodiment of the invention, the positioning frame 5 further includes: the first positioning motor 504 is fixedly arranged on one side of the fixed frame plate 501, and is used for movably connecting the fixed frame plate 501 and the first sliding frame 502; the second positioning motor 505 is fixedly arranged on one side of the first sliding frame 502 and is used for movably connecting the first sliding frame 502 and the second sliding frame 503; the limiting sleeve 506 is fixedly arranged on one side of the second sliding frame 503 and used for limiting the sliding track of the second sliding frame 503; and a second bearing plate 509 fixedly arranged at both ends of the inner wall of the second sliding frame 503 and arranged adjacent to the first bearing plate 507, wherein a plurality of balls 508 are assembled on the surface of the second bearing plate 509.
In practical application of this embodiment, the first positioning motor 504 is configured to drive the first sliding frame 502 to directionally slide along the fixed frame plate 501, and the second positioning motor 505 is configured to drive the second sliding frame 503 to directionally slide along the first sliding frame 502, so as to implement two-axis motion in a horizontal plane, so that the second sliding frame 503 can be subjected to displacement adjustment through a position deviation detected by the second driving motor 204, and a PCB substrate alignment hole on the second sliding frame 503 is matched with a film alignment hole.
In one case of this embodiment, the position-limiting sleeve 506 can limit the sliding track of the fixed frame plate 501 between the carrier substrate 301 and the hollow slot 302, and prevent the fixed frame plate 501 from forming a position deviation during the movement.
In one case of this embodiment, during the rolling contact of the balls 508 with the PCB substrate, on one hand, the abrasion of the substrate by the conventional sliding friction is avoided by the rolling friction, and on the other hand, the frictional resistance between the substrate and the second sliding frame 503 is made smaller, which facilitates the horizontal correction of the substrate.
Referring to fig. 4 and 5, in a preferred embodiment of the present invention, a pressing plate 7 is further mounted on one side of the second supporting plate 509, and the pressing plate 7 is movably inserted into one side of the second supporting plate 509 and is disposed toward one side of the middle portion of the second sliding frame 503 for locking the PCB substrate placed on the balls 508.
In practical application of the present embodiment, when the valve nozzle 602 adsorbs the PCB substrate to the wall surface, the pressure plate 7 disposed on one side of the second support plate 509 can press the substrate onto the ball 508 in the process of sliding toward one side of the PCB substrate, and the end of the pressure plate 7 preferably adopts an inclined notch structure, and has a linear pressing function in the sliding process.
The embodiment of the invention provides a double-sided solder mask automatic exposure machine, which can perform quick alignment and adsorption of film on a double-sided solder mask substrate by sliding the carrier substrate 301 arranged in the guide groove 102 and the positioning frame 5 movably assembled on one side of the carrier substrate 301, thereby avoiding extrusion positioning of a PCB substrate by conventional exposure equipment, preventing exposure skip printing caused by warping of a plate, improving alignment efficiency of exposure feeding and improving productivity of the PCB.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (7)

1. The utility model provides a two-sided automatic exposure machine that hinders welding, includes the frame component, the frame component includes main frame and guide way, contain two sets of guide ways and two sets of guide way parallels in laying in the main frame, its characterized in that, two-sided automatic exposure machine that hinders welding still includes:
The detection camera assembly comprises a transverse plate frame, a first driving motor, a longitudinal plate frame and a second driving motor, wherein the transverse plate frame is transversely assembled on the main frame and is arranged towards one side of the middle part of the main frame;
the carrier mechanism comprises a carrier substrate, a hollow groove, a lower base and a lower film sheet, wherein the hollow groove is formed in the middle of the carrier substrate, two ends of the carrier substrate are in limited sliding assembly in the guide grooves, the lower base is in positioning sliding assembly on one side of the carrier substrate, and the lower film sheet is assembled in the middle of the lower base;
the cover plate component comprises a cover plate part, a light transmission groove and an upper film, the cover plate part is rotatably assembled at one end of the carrier substrate, the light transmission groove is formed in the middle of the cover plate part, the upper film is assembled in the light transmission groove, and the upper film faces one side of the lower base and is matched with the lower film;
the positioning machine frame comprises a fixed frame plate, a first sliding frame, a second sliding frame, a first bearing plate and balls, wherein the fixed frame plate is elastically assembled between the carrier substrate and the lower base in a sliding mode, the sliding direction of the fixed frame plate is matched with that of the lower base, the first sliding frame is arranged in the fixed frame plate in a sliding mode, the second sliding frame is arranged in the first sliding frame in a sliding mode, the moving direction of the second sliding frame is perpendicular to that of the first sliding frame, the first bearing plate is arranged at two ends of the inner wall of the second sliding frame, and the balls are movably assembled on the first bearing plate; and
Inhale the material subassembly, inhale the material subassembly and include vacuum valve head and valve mouth, vacuum valve head array is laid in first bearing board one side, just the terminal intercommunication of vacuum valve head has the valve mouth, the valve mouth array is laid in first bearing board one side and orientation second sliding frame middle part one side sets up.
2. The double-sided solder mask automatic exposure machine according to claim 1, wherein the frame member further comprises a driving chain group, the driving chain group is assembled on one side of the guide groove and is in linkage arrangement with the carrier mechanism, and the driving chain group is used for driving the directional sliding of the carrier substrate.
3. The double-sided solder mask automatic exposure machine according to claim 1, wherein the number of the second driving motors is eight, and the arrangement positions of the second driving motors are matched with the alignment holes of the lower film and the upper film.
4. The automatic exposure machine for double-sided solder mask as claimed in claim 1, wherein the carrier mechanism further comprises a driver disposed between and assembled with the carrier substrate and the lower base for driving the lower base to move towards one side of the carrier substrate.
5. The automatic exposure machine for double-sided solder mask as claimed in claim 1, wherein the cover plate assembly further comprises a locking groove fixedly disposed at one end of the carrier substrate for locking the cover plate member.
6. The double-sided solder mask automatic exposure machine of claim 1, wherein the positioning frame further comprises:
the first positioning motor is fixedly assembled on one side of the fixed frame plate and used for movably connecting the fixed frame plate and the first sliding frame;
the second positioning motor is fixedly assembled on one side of the first sliding frame and is used for movably connecting the first sliding frame and the second sliding frame;
the limiting sleeve is fixedly arranged on one side of the second sliding frame and used for limiting the sliding track of the second sliding frame; and
and the second bearing plate is fixedly arranged at two ends of the inner wall of the second sliding frame and is adjacent to the first bearing plate.
7. The automatic exposure machine for double-sided solder mask as claimed in claim 1, wherein a pressing plate is further assembled on one side of the second support plate, the pressing plate is movably inserted into one side of the second support plate and is disposed towards one side of the middle portion of the second sliding frame for locking the PCB substrate placed on the balls.
CN202210145046.7A 2022-02-17 2022-02-17 Two-sided automatic exposure machine that hinders that welds Pending CN114675498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210145046.7A CN114675498A (en) 2022-02-17 2022-02-17 Two-sided automatic exposure machine that hinders that welds

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Application Number Priority Date Filing Date Title
CN202210145046.7A CN114675498A (en) 2022-02-17 2022-02-17 Two-sided automatic exposure machine that hinders that welds

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CN114675498A true CN114675498A (en) 2022-06-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117420741A (en) * 2023-12-19 2024-01-19 深圳市欣光辉科技有限公司 Exposure positioning structure and exposure machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117420741A (en) * 2023-12-19 2024-01-19 深圳市欣光辉科技有限公司 Exposure positioning structure and exposure machine
CN117420741B (en) * 2023-12-19 2024-03-12 深圳市欣光辉科技有限公司 Exposure positioning structure and exposure machine

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