CN114666967A - Circuit board layout structure and brushless controller - Google Patents

Abstract

The present invention provides a circuit board layout structure, which includes: a first circuit board, which includes a power part and a driving part that are arranged on a main surface of the circuit board and are electrically connected; the power part includes a plurality of power elements and is partitioned with the driving part ; Capacitor, which is located on the outside of the side surface of the first circuit board and is electrically connected to it, and its longitudinal axis is parallel or coincident with the main surface of the first circuit board; The second circuit board includes MCU, the second circuit The board is correspondingly stacked on and electrically connected to the driving part of the first circuit board. The circuit board layout structure is small in size and stable in operation. In addition, the present invention also provides a brushless controller based on the circuit board layout structure, which is small in size and stable in operation.

Description

Circuit board layout and brushless controller

technical field

The invention relates to a circuit board layout structure and a brushless controller.

Background technique

At present, brushless motors are widely used in power tools. However, the traditional brushless controllers are large in size, which makes it inconvenient for brushless motor controllers for small-sized power tools (such as hand-held power tools). Installation, even if the brushless controller is installed in a small power tool, due to its many circuit units and complex structure, there are many internal parts, which is not easy to dissipate heat, resulting in the temperature of the main chip being too high during operation, which is serious. Affect the running stability of the main chip. In particular, the control system is the core part of the brushless DC motor (BLDC) and is susceptible to electromagnetic interference.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a circuit board layout structure with small size and stable operation.

A circuit board layout structure provided by the present invention includes:

a first circuit board, which includes a power part and a driving part arranged on a main surface thereof and electrically connected, the power part includes a plurality of power elements and is arranged in a partition with the driving part;

a capacitor, which is located on the outer side of the side surface of the first circuit board and is electrically connected to it, and whose longitudinal axis is parallel or coincident with the main surface of the first circuit board;

The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board.

Further, in a direction perpendicular to the length of the capacitor, the arrangement area of the first circuit board and/or the second circuit board is located within the radial height range of the capacitor.

Further, the driving part and the capacitor are located on the same side or opposite sides of the power part.

Further, one side of the power part partially extends and protrudes outward to form the driving part, the remaining part of the side and the driving part are combined to form a virtual plane, and the capacitor is arranged in the virtual plane.

Further, the capacitor includes a capacitor body and pins, and the projection of the capacitor body in the direction perpendicular to the main surface of the first circuit board is the same as that of the first circuit board and/or the second circuit board. The projections in the directions do not coincide.

Compared with the prior art, the beneficial technical effects of the present invention are:

1. Realize the modularized and standardized design of the controller; speed up the program replacement speed and reduce the program replacement cost; shorten the project development cycle; reduce the overall product cost.

Separate the first circuit board as the power center and the second circuit board as the MCU control center into two independent modules with different functions and common standard interfaces. The first circuit board is used as the driver and power module to realize this part. The modularization of the MCU is universal. It is only necessary to design different standard power modules according to different power segments, and use the universal standard interface to arbitrarily connect and install the second circuit board as the MCU control center to combine different products.

When customers have different solutions and MCU chip application requirements, or have extended functional requirements for the same solution, they can develop a second circuit board corresponding to the MCU chip in a targeted manner, without having to re-layout the design together with the first circuit board.

On the one hand, it can effectively solve the problem that there are many solution chip manufacturers in the market, and different customer groups need to use different chips, which often leads to the need to re-layout and design all the circuit board layout structures, which greatly speeds up the speed of solution replacement and reduces the cost of solution replacement. cost;

On the other hand, due to the replacement of chips, the overall circuit board layout structure of the project is redesigned, resulting in the rationality of MCU layout, mixed interference of analog and digital models, EMC electromagnetic radiation, etc., all need to be re-tested and confirmed, and the solution cycle is very long; , after the second circuit board is independently separated, only the first layout rationality verification is required due to the change of the circuit board layout. After the first circuit board is used as a standard module, the EMC, temperature rise, etc. of the standard module are also Only one-time verification is required, and when the second circuit board matching different chips is subsequently matched, there is no need to repeat it, which greatly shortens the project development cycle.

On the third aspect, standardization and modular operation of controllers will completely change the operation and sales model of the motor controller industry. Using standard modules as units, different product specifications can be combined, which greatly saves the inventory of raw materials, semi-finished products and finished products. , which greatly reduces the overall cost of the product.

2. Realize physical heat insulation under the limit size

The power part of the main heat source of the first circuit board as the power center and the drive part with small heat generation are arranged in partitions, and the power part of the main heat source is contacted with the heat sink for effective heat dissipation in a centralized manner, and will be used as the MCU control center The second circuit board is completely separated from the first circuit board with a large amount of heat, and it is arranged in layers. On the one hand, the heat conduction is directly isolated from the structure. , to ensure that under the extremely compact structure requirements, it can also effectively prevent the MCU temperature from being too high, so as to ensure the stable operation of the circuit board.

3. Space replacement to further compress the overall size

The capacitor with larger volume is arranged on the outside of the side surface of the first circuit board, and its longitudinal axis is parallel or coincident with the main surface of the first circuit board. In the vertical height direction, the capacitor part is only used for electrical connection. The pins overlap with the circuit board, and the other main parts do not overlap with the first circuit board, which can effectively reduce the vertical height of the overall layout of the circuit board; and separate the second circuit board as the MCU control center and stack it with the driving part, The space size is just spared to accommodate the volume of the electrolytic capacitor, that is, the second circuit board as the MCU control center is independently stacked and installed, not only for the modular standardization described in point 1 above, and point 2 The realization of physical insulation under the limit size is also to replace the installation space of the electrolytic capacitor and further reduce the vertical height of the overall layout of the circuit board, so as to minimize the overall circuit board structure size.

Another object of the present invention is to provide a circuit board layout structure with small size and stable operation.

A circuit board layout structure provided by the present invention includes:

a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements;

a capacitor, which includes a capacitor body and pins, the capacitor body is electrically connected to the first circuit board through the pins, and the capacitor body is laid flat on the outside of the first circuit board;

The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board, and does not overlap with the power element.

Further, the first circuit board includes a first area with a first area S1 and a second area with a second area S2, the first area and the second area are combined to form an L-shaped notch, the The driving part is arranged in the first area, the power part is arranged in the second area, and the capacitor is arranged in the gap; wherein, S1<S2.

Further, the second circuit board has an area S3, wherein S3≦S1.

Further, the arrangement area of the first circuit board and/or the second circuit board in the stacking direction is located within the vertical height range of the capacitor.

Compared with the prior art, the technical solution has all the above-mentioned beneficial technical effects, which will not be repeated here.

Another object of the present invention is to provide a brushless controller based on the above circuit board layout structure, which is small in size and stable in operation.

A brushless controller provided by the present invention includes:

a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements;

a filter capacitor, which is lying on the outer side of the first circuit board and is electrically connected to it;

a second circuit board, comprising an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board;

a power supply circuit comprising a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2;

The first power supply circuit is arranged on the first circuit board, and the second power supply circuit is arranged on the second circuit board, wherein: V1>V2.

Further, the second circuit board is connected to the first circuit board through at least 18 electrical connecting wires.

Further, the electrical connection network between the second circuit board and the first circuit board includes:

The VCC port, which is the positive pole of the power input of the first circuit board, is used for the second circuit board to detect the input power supply voltage of the first circuit board;

GND port, which is the power input negative pole of the first circuit board, and is used for grounding the negative pole of the second circuit board;

The DC port, which is the power port of the first circuit board, is used for the second circuit board to detect the power supply voltage of the first circuit board;

P_PowerLock port, which is the power control pin of the first circuit board, used for the power control of the second circuit board to the first circuit board;

NO_IO port, which is the normally closed terminal detection port of the first circuit board switch, used for the second circuit board to detect the normally closed terminal of the first circuit board switch;

NC_IO port, which is the normally open end detection port of the first circuit board switch, used for the second circuit board to detect the normally open end of the first circuit board switch;

TempFET port, which is the MOS temperature detection port of the first circuit board, used for the MOS temperature detection of the first circuit board by the second circuit board;

EMF_U port, which is the first circuit board output phase line U detection port, used for the second circuit board to detect the output phase line U;

EMF_V port, which is the first circuit board output phase line V detection port, used for the second circuit board to detect the output phase line V;

EMF_W port, which is the first circuit board output phase line W detection port, used for the second circuit board to detect the output phase line W;

PWM1H port, which is the bridge-one control port on the first circuit board, used for the second circuit board to control the bridge-one on the first circuit board;

The PWM2H port, which is the bridge two control port on the first circuit board, is used for the second circuit board to control the bridge two on the first circuit board;

The PWM3H port, which is the bridge three control port on the first circuit board, is used for the second circuit board to control the bridge three on the first circuit board;

PWM1L port, which is a control port of the lower bridge of the first circuit board, used for the control of the lower bridge of the first circuit board by the second circuit board;

The PWM2L port, which is the second control port of the lower bridge of the first circuit board, is used for the control of the second circuit board to the second lower bridge of the first circuit board;

PWM3L port, which is the lower bridge three control port of the first circuit board, used for the second circuit board to control the lower bridge three of the first circuit board;

OPI_P port, which is the first circuit board current detection signal P port, used for the second circuit board to detect the power current signal P;

The OPI_N port is the first circuit board current detection signal N port, which is used for the second circuit board to detect the power current signal N.

Compared with the prior art, the brushless controller has all the beneficial technical effects of the above-mentioned circuit board layout structure, which will not be repeated here; in addition, the power supply circuit is designed as a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2; the first power supply circuit is arranged on the first circuit board for the power supply of the first circuit board, and the second power supply circuit is arranged on the second circuit board for the first circuit board Two circuit board power supplies, wherein: V1>V2; can reduce the electrical connection lines between the first circuit board and the second circuit board.

Description of drawings

In order to illustrate the specific embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the specific embodiments or the prior art. Obviously, the accompanying drawings in the following description The drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

Fig. 1: Schematic diagram of the structure of the first circuit board according to the specific embodiment of the present invention;

Figure 2: A schematic diagram of the structure of the second circuit board according to the specific embodiment of the present invention;

Figure 3: A schematic diagram of the structure of the capacitor and the first circuit board in accordance with a specific embodiment of the present invention;

Figure 4: Side view of the matching structure of the capacitor and the first circuit board according to the specific embodiment of the present invention;

Fig. 5: Schematic diagram of the matching structure of the first circuit board, the second circuit board and the capacitor according to the specific embodiment of the present invention;

Figure 6: a schematic diagram of the capacitor separation state in Figure 5 according to a specific embodiment of the present invention;

Fig. 7: Schematic diagram of the structure layout of the first circuit board according to the specific embodiment of the present invention;

Figure 8: A schematic diagram of the first circuit board, the second circuit board, and the matching layout of the capacitor according to the specific embodiment of the present invention;

Fig. 9: The second schematic diagram of the first circuit board, the second circuit board, and the capacitor matching layout according to the specific embodiment of the present invention;

FIG. 10 is a schematic diagram of the cooperation of the first circuit board, the second circuit board and the capacitor according to the specific embodiment of the present invention.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

1 to 3 , a circuit board layout structure includes at least a first circuit board 100, a second circuit board 200 and a capacitor 300;

The first circuit board 100 includes a power portion 10a and a driving portion 10b that are electrically connected on the main surface thereof. The power portion 10a includes a plurality of power elements 10a-1, such as a plurality of MOS tubes; the power portion 10a and the driving portion 10b are partitioned layout;

The capacitor 300 is located on the outer side of the side surface of the first circuit board 100 and is electrically connected to it, and its longitudinal axis is parallel or parallel to the main surface of the first circuit board 100, as shown in FIG. 4 and FIG. 5 ;

The second circuit board 200 includes an MCU, and the second circuit board 200 is correspondingly stacked on the driving portion 10b of the first circuit board 100 and electrically connected thereto.

To put it simply, the first circuit board 100 and the second circuit board 200 have different functions respectively, the first circuit board 100 serves as a power center, and the second circuit board 200 serves as an MCU control center.

The first circuit board 100 as the power center and the second circuit board 200 as the MCU control center are separated into two independent modules with different functions and a common standard interface, and the first circuit board 100 is used as a driver and a power module, To realize the modularization of this part, it is only necessary to design different standard power modules according to different power segments, and use the universal standard interface to arbitrarily connect and install the second circuit board 200 as the MCU control center to combine different products.

When customers have different solutions and MCU chip application requirements, or have extended functional requirements for the same solution, they can develop the second circuit board 200 corresponding to the MCU chip in a targeted manner, and do not need to re-layout design together with the first circuit board 100 .

Therefore, on the one hand, it can effectively solve the problem that there are many solution chip manufacturers in the market, and different customer groups need to use different chips, which often leads to the need to re-layout and design all the circuit board layout structures, which greatly speeds up the speed of solution replacement and reduces solution replacement. the cost of;

On the other hand, due to the replacement of the chip, the overall circuit board layout structure of the project is redesigned, resulting in the rationality of the MCU board layout, the mixed interference of analog and digital models, and the electromagnetic radiation of EMC. After the second circuit board 200 serving as the MCU control center is independently separated, only the first layout rationality verification is required due to the change of the circuit board layout. EMC, temperature rise, etc. only need to be verified once. When the second circuit board 200 matching different chips is subsequently matched, there is no need to repeat it, which greatly shortens the project development cycle.

In addition, this technical solution can also realize the standardization and modular operation of the controller based on the layout structure of the circuit board, which will completely change the operation and sales mode of the motor controller industry. It greatly saves the inventory of raw materials, semi-finished products and finished products, and greatly reduces the overall cost of products.

At the same time, in this technical solution, the power part 10a of the main heat source of the first circuit board 100 serving as the power center and the drive part 10b with small heat generation are arranged in partitions. In the specific design, the power part 10a of the main heat source can be separated from the heat dissipation part 10a. As shown in FIG. 3, effective heat dissipation is carried out in a concentrated manner, and the second circuit board 200 as the MCU control center is completely separated from the first circuit board 100 which generates a large amount of heat. On the other hand, at this time, the MCU and the power components with high heat generation are dislocated to ensure that under the extremely compact structure requirements, the MCU temperature can be effectively prevented from being too high, thereby ensuring the stable operation of the circuit board;

In addition, the capacitor 300 with a larger volume is arranged on the outside of the side surface of the first circuit board 100, and its longitudinal axis is parallel or coincident with the main surface of the first circuit board 100. Referring to FIGS. 4 and 5, in In the vertical height direction, only the pins for electrical connection of the capacitor 300 overlap with the circuit board, and the other main parts do not overlap with the first circuit board 100, which can effectively reduce the vertical height of the overall layout of the circuit board; The second circuit board 200 of the MCU control center is independent and stacked with the driving part 10b, and the space size is just free to accommodate the volume of the capacitor 300, that is, the second circuit board 200 serving as the MCU control center is independently stacked and installed. , not only for the above-described modularization, standardization, and physical insulation under the limit size, but also to replace the installation space of the capacitor and further reduce the vertical height of the overall layout of the circuit board, so as to limit the overall circuit board structure size. .

Referring to FIG. 4 , FIG. 5 and FIG. 6 , in the direction perpendicular to the length of the capacitor 300 , the arrangement area of the first circuit board 100 and/or the second circuit board 200 is located within the radial height range of the capacitor 300 . which is:

Referring to FIG. 6 , the capacitor 300 has a central section S1 along the length direction, and the upper limit line L1 and the lower limit line L2 of the section S1 combine to form the arrangement area of the first circuit board 100 and/or the second circuit board 200 ; specifically , when the first circuit board 100 is arranged, the first circuit board 100 will not be lower than the lower limit line L2 at the lowest level, and the highest will not exceed the upper limit line L1; similarly; when the second circuit board 100 is arranged, the second circuit board 200 In the arrangement, the lowest will not be lower than the lower limit line L2, and the highest will not exceed the upper limit line L1; better; when the second circuit board 200 and the first circuit board 100 are stacked correspondingly, the lowest of both will not be lower than the lower limit line L2. , the maximum will not exceed the upper limit line L1. Therefore, the upper limit line L1 and the lower limit line L2 of the section S1 of the capacitor 300 basically limit the overall height of the circuit board layout structure. Obviously, the layout structure is obvious in the overall vertical height. Lowering, the height of the layout structure is already the limit state.

1, 3 and 7, as shown in FIG. 8, the driving part 10b and the capacitor 300 are located on the same side of the power part 10a, such as the left side in the figure; ) partially protrudes outward to form the driving portion 10b, the rest of the side (left side) is combined with the driving portion 10b to form a virtual plane, and the capacitor 300 is arranged in the virtual plane S2.

Of course, the driving part 10b and the capacitor 300 may also be located on opposite sides of the power part 10a, as shown in FIG. 9 for details.

In addition, the capacitor 300 includes a capacitor body 300a and a lead 300b, and the projection of the capacitor body 300a in a direction perpendicular to the main surface of the first circuit board 100 is the same as that of the first circuit board 100 and/or the second circuit board 200 in this direction projections are not coincident.

Please continue to refer to FIG. 8 , the circuit board layout structure includes at least a first circuit board 100 , a second circuit board 200 and a capacitor 300 ;

The first circuit board 100 includes a power part 10a and a driving part 10b that are electrically connected, and the power part 10a includes a plurality of power elements, such as MOS tubes;

The capacitor 300 includes a capacitor body 300a and a pin 300b. The capacitor body 300a is electrically connected to the first circuit board 100 through the pin 300b, and the capacitor body 300a is laid flat on the outside of the first circuit board 100; Except that the pin 300b overlaps with the first circuit board 100, the capacitor body 300a has no overlap with the first circuit board 100;

The capacitor 300 is a large-volume electronic device, generally in the shape of a cylinder. When the capacitor body 300a is laid flat, the overall height of the circuit board layout structure can be reduced.

The second circuit board 200 includes an MCU, and the second circuit board 200 is correspondingly stacked on the driving part 10b of the first circuit board 100 and electrically connected thereto, and does not overlap with the power element 10a.

This technical solution also has the beneficial technical effects of realizing the modular and standardized design of the controller recorded in the above-mentioned solution, accelerating the speed of solution replacement, reducing the cost of solution replacement, shortening the project development cycle, and reducing the overall cost of the product. In addition, the space of the capacitor and the second circuit board is replaced to further reduce the overall size.

Referring to FIG. 10, the first circuit board 100 includes a first area 100a having a first area S1 and a second area 100b having a second area S2, the first area 100a and the second area 100b are combined to form an L-shaped notch 100c , the driving part 10a is arranged in the first area 100a, the power part 10b is arranged in the second area 100b, and the capacitor 300 is arranged in the gap 100c; wherein, S1<S2.

The second circuit board has an area S3, where S3≦S1.

The arrangement area of the first circuit board 100 and/or the second circuit board 200 in the stacking direction is within the vertical height range of the capacitor 300 .

That is, as shown in FIG. 6 , the capacitor 300 has a central cross section S1 along the length direction, and the upper limit line L1 and the lower limit line L2 of the cross section S1 combine to form the arrangement area of the first circuit board 100 and/or the second circuit board 200; Specifically, when the first circuit board 100 is arranged, the first circuit board 100 will not be lower than the lower limit line L2 at the lowest level, and will not exceed the upper limit line L1 at the highest level; similarly; when the second circuit board 100 is arranged, the second circuit When the board 200 is arranged, the minimum value will not be lower than the lower limit line L2, and the maximum value will not exceed the upper limit line L1; better; when the second circuit board 200 and the first circuit board 100 are stacked correspondingly, the minimum value of both will not be lower than the lower limit line L1. Line L2, the highest will not exceed the upper limit line L1, so the upper limit line L1 and the lower limit line L2 of the section S1 of the capacitor 300 basically limit the overall height of the circuit board layout structure. Obviously, the layout structure is in the overall vertical height. The height of the layout structure is already the limit state.

In addition, the present application also relates to a brushless controller based on the circuit board layout structure.

The brushless controller at least includes a first circuit board 100, a second circuit board 200, and a filter capacitor 300;

The first circuit board 100 includes a power part 10a and a driving part 10b that are electrically connected, and the power part 10b includes a plurality of power elements, such as MOS tubes;

The filter capacitor 300 is lying on the outer side of the first circuit board 100 and is electrically connected with it;

The second circuit board 200 includes an MCU, and the second circuit board 200 is correspondingly stacked on the driving part 10b of the first circuit board 100 and is electrically connected to it;

The power supply circuit includes a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2;

The first power supply circuit is arranged on the first circuit board 100, and the second power supply circuit is arranged on the second circuit board 200, wherein: V1>V2.

The brushless controller has all the beneficial technical effects of the above-mentioned circuit board layout structure, such as small size, stable operation, etc., which will not be repeated here; in addition, the power supply circuit is designed to have a first nominal voltage V1. a power supply circuit and a second power supply circuit with a second nominal voltage V2; the first power supply circuit is arranged on the first circuit board for the power supply of the first circuit board, and the second power supply circuit is arranged on the second circuit board, It is used for the power supply of the second circuit board, wherein: V1>V2; the electrical connection lines between the first circuit board and the second circuit board can be reduced.

Specifically, the first power supply circuit is a 15V power supply circuit, and the second power supply circuit is a 5V capacitor circuit.

The second circuit board 200 is connected to the first circuit board 100 through at least 18 electrical connecting wires.

The second circuit board 200 and the first circuit board 100 are electrically connected to the network including:

The VCC port, which is the positive pole of the power input of the first circuit board, is used for the second circuit board to detect the input power supply voltage of the first circuit board;

GND port, which is the power input negative pole of the first circuit board, and is used for grounding the negative pole of the second circuit board;

The DC port, which is the power port of the first circuit board, is used for the second circuit board to detect the power supply voltage of the first circuit board;

P_PowerLock port, which is the power control pin of the first circuit board, used for the power control of the second circuit board to the first circuit board;

NO_IO port, which is the normally closed terminal detection port of the first circuit board switch, used for the second circuit board to detect the normally closed terminal of the first circuit board switch;

NC_IO port, which is the normally open end detection port of the first circuit board switch, used for the second circuit board to detect the normally open end of the first circuit board switch;

TempFET port, which is the MOS temperature detection port of the first circuit board, used for the MOS temperature detection of the first circuit board by the second circuit board;

EMF_U port, which is the first circuit board output phase line U detection port, used for the second circuit board to detect the output phase line U;

EMF_V port, which is the first circuit board output phase line V detection port, used for the second circuit board to detect the output phase line V;

EMF_W port, which is the first circuit board output phase line W detection port, used for the second circuit board to detect the output phase line W;

PWM1H port, which is the bridge-one control port on the first circuit board, used for the second circuit board to control the bridge-one on the first circuit board;

The PWM2H port, which is the bridge two control port on the first circuit board, is used for the second circuit board to control the bridge two on the first circuit board;

The PWM3H port, which is the bridge three control port on the first circuit board, is used for the second circuit board to control the bridge three on the first circuit board;

PWM1L port, which is a control port of the lower bridge of the first circuit board, used for the control of the lower bridge of the first circuit board by the second circuit board;

The PWM2L port, which is the second control port of the lower bridge of the first circuit board, is used for the control of the second circuit board to the second lower bridge of the first circuit board;

PWM3L port, which is the lower bridge three control port of the first circuit board, used for the second circuit board to control the lower bridge three of the first circuit board;

OPI_P port, which is the first circuit board current detection signal P port, used for the second circuit board to detect the power current signal P;

The OPI_N port is the first circuit board current detection signal N port, which is used for the second circuit board to detect the power current signal N.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some or all of the technical features thereof are equivalently replaced; these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (12)

1. a circuit board layout structure, is characterized in that, comprises: a first circuit board, which includes a power part and a driving part arranged on a main surface thereof and electrically connected, the power part includes a plurality of power elements and is arranged in a partition with the driving part; a capacitor, which is located on the outer side of the side surface of the first circuit board and is electrically connected to it, and whose longitudinal axis is parallel or coincident with the main surface of the first circuit board; The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board. 2 . The circuit board layout structure according to claim 1 , wherein in a direction perpendicular to the length of the capacitor, the layout area of the first circuit board and/or the second circuit board is located in the capacitor. 3 . within the radial height range. 3 . The circuit board layout structure according to claim 1 , wherein the driving part and the capacitor are located on the same side or opposite sides of the power part. 4 . 4 . The circuit board layout structure according to claim 3 , wherein one side of the power portion partially extends outward to form the driving portion, and the remaining portion of the side is combined with the driving portion to form a virtual plane, 5 . The capacitors are arranged in the virtual plane. 5. The circuit board layout structure according to claim 1, wherein the capacitor comprises a capacitor body and pins, and the projection of the capacitor body in a direction perpendicular to the main surface of the first circuit board is the same as that of the capacitor body. The projections of the first circuit board and/or the second circuit board in this direction do not overlap. 6. A circuit board layout structure, comprising: a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements; a capacitor, which includes a capacitor body and pins, the capacitor body is electrically connected to the first circuit board through the pins, and the capacitor body is laid flat on the outside of the first circuit board; The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board, and does not overlap with the power element. 7. The circuit board layout structure according to claim 6, wherein the first circuit board comprises a first area with a first area S1 and a second area with a second area S2, the first area In combination with the second area, an L-shaped notch is formed, the driving part is arranged in the first area, the power part is arranged in the second area, and the capacitor is arranged in the notch; wherein, S1 <S2. 8. The circuit board layout structure according to claim 7, wherein the second circuit board has an area S3, wherein S3≦S1. 9 . The circuit board layout structure according to claim 6 , wherein the arrangement area of the first circuit board and/or the second circuit board in the stacking direction is within the vertical height range of the capacitor. 10 . 10. A brushless controller, comprising: a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements; a filter capacitor, which is lying on the outside of the first circuit board and is electrically connected to it; a second circuit board, comprising an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board; a power supply circuit comprising a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2; The first power supply circuit is arranged on the first circuit board, and the second power supply circuit is arranged on the second circuit board, wherein: V1>V2. 11. The brushless controller according to claim 10, wherein the second circuit board is connected to the first circuit board through at least 18 electrical connecting wires. 12 . The brushless controller of claim 11 , wherein the electrical connection network between the second circuit board and the first circuit board comprises: 12 . The VCC port, which is the positive pole of the power input of the first circuit board, is used for the second circuit board to detect the input power supply voltage of the first circuit board; GND port, which is the power input negative pole of the first circuit board, and is used for grounding the negative pole of the second circuit board; The DC port, which is the power port of the first circuit board, is used for the second circuit board to detect the power supply voltage of the first circuit board; P_PowerLock port, which is the power control pin of the first circuit board, used for the power control of the second circuit board to the first circuit board; NO_IO port, which is the normally closed terminal detection port of the first circuit board switch, used for the second circuit board to detect the normally closed terminal of the first circuit board switch; NC_IO port, which is the normally open end detection port of the first circuit board switch, used for the second circuit board to detect the normally open end of the first circuit board switch; TempFET port, which is the MOS temperature detection port of the first circuit board, used for the MOS temperature detection of the first circuit board by the second circuit board; EMF_U port, which is the first circuit board output phase line U detection port, used for the second circuit board to detect the output phase line U; EMF_V port, which is the first circuit board output phase line V detection port, used for the second circuit board to detect the output phase line V; EMF_W port, which is the first circuit board output phase line W detection port, used for the second circuit board to detect the output phase line W; PWM1H port, which is the bridge-one control port on the first circuit board, used for the second circuit board to control the bridge-one on the first circuit board; The PWM2H port, which is the bridge two control port on the first circuit board, is used for the second circuit board to control the bridge two on the first circuit board; The PWM3H port, which is the bridge three control port on the first circuit board, is used for the second circuit board to control the bridge three on the first circuit board; PWM1L port, which is a control port of the lower bridge of the first circuit board, used for the control of the lower bridge of the first circuit board by the second circuit board; The PWM2L port, which is the second control port of the lower bridge of the first circuit board, is used for the control of the second circuit board to the second lower bridge of the first circuit board; PWM3L port, which is the lower bridge three control port of the first circuit board, used for the second circuit board to control the lower bridge three of the first circuit board; OPI_P port, which is the first circuit board current detection signal P port, used for the second circuit board to detect the power current signal P; The OPI_N port is the first circuit board current detection signal N port, which is used for the second circuit board to detect the power current signal N.

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