CN114666967A - Circuit board layout structure and brushless controller - Google Patents
Circuit board layout structure and brushless controller Download PDFInfo
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- CN114666967A CN114666967A CN202011522328.1A CN202011522328A CN114666967A CN 114666967 A CN114666967 A CN 114666967A CN 202011522328 A CN202011522328 A CN 202011522328A CN 114666967 A CN114666967 A CN 114666967A
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- 239000003990 capacitor Substances 0.000 claims abstract description 81
- 238000001514 detection method Methods 0.000 claims description 24
- 239000000047 product Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000012795 verification Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P6/00—Arrangements for controlling synchronous motors or other dynamo-electric motors using electronic commutation dependent on the rotor position; Electronic commutators therefor
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Abstract
The invention provides a circuit board layout structure, which comprises: a first circuit board including a power portion and a driving portion arranged on a main surface thereof and electrically connected, the power portion including a plurality of power elements and being arranged in a partitioned manner with the driving portion; the capacitor is positioned on the outer side of the side surface of the first circuit board and is electrically connected with the side surface of the first circuit board, and the length direction axis of the capacitor is parallel to or coincided with the main surface of the first circuit board; and the second circuit board comprises an MCU, and the second circuit board is correspondingly laminated on the driving part of the first circuit board and is electrically connected with the driving part. The circuit board layout structure has small volume and stable operation. In addition, the invention also provides a brushless controller based on the circuit board layout structure, which has small volume and stable operation.
Description
Technical Field
The invention relates to a circuit board layout structure and a brushless controller.
Background
At present, the brushless motor is widely applied to electric tools, but the traditional brushless controller has a large volume, which results in that the brushless motor controller is inconvenient to install for the electric tools with a small volume (such as handheld electric tools), even if the brushless controller is installed in the electric tools with a small volume, because the circuit units are multiple and the structure is complex, the brushless motor controller causes more internal parts and is inconvenient to dissipate heat, which results in that the temperature of the main chip is too high during the operation process, and the operation stability of the main chip is seriously affected. In particular, the control system is a core part of a brushless direct current motor (BLDC), which is susceptible to electromagnetic interference.
Disclosure of Invention
The invention aims to provide a circuit board layout structure which is small in size and stable in operation.
The invention provides a circuit board layout structure, which comprises:
a first circuit board including a power portion and a driving portion arranged on a main surface thereof to be electrically connected, the power portion including a plurality of power elements and being arranged in a partitioned manner with the driving portion;
a capacitor which is positioned outside the side surface of the first circuit board and is electrically connected with the first circuit board, and the length direction axis of the capacitor is parallel to or horizontally superposed with the main surface of the first circuit board;
and the second circuit board comprises an MCU, and the second circuit board is correspondingly laminated on the driving part of the first circuit board and is electrically connected with the driving part.
Further, in the direction perpendicular to the length direction of the capacitor, the arrangement area of the first circuit board and/or the second circuit board is located within the radial height range of the capacitor.
Further, the driving portion and the capacitor are located on the same side or opposite sides of the power portion.
Further, one side of the power portion is partially extended and protruded outwards to form the driving portion, the rest part of the side and the driving portion form a virtual plane in combination, and the capacitor is arranged in the virtual plane.
Further, the capacitor comprises a capacitor body and pins, and the projection of the capacitor body in the direction perpendicular to the main surface of the first circuit board is not overlapped with the projection of the first circuit board and/or the second circuit board in the direction.
Compared with the prior art, the invention has the beneficial technical effects that:
1. the modularization and standardization design of the controller is realized; the scheme replacement speed is accelerated, and the scheme replacement cost is reduced; shortening the project development period; the comprehensive cost of the product is reduced.
The first circuit board as the power center and the second circuit board as the MCU control center are separated and are independently divided into two independent modules with different functions and universal standard interfaces, the first circuit board is used as a driving and power module to realize the modularization and the universality of the part, different standard power modules are designed only according to different power sections, and the universal standard interfaces and the second circuit board as the MCU control center are connected and installed at will to combine different products.
When a customer has different schemes and MCU chip application requirements or has expansion function requirements for the same scheme, the second circuit board corresponding to the MCU chip can be developed in a targeted manner without carrying out layout design together with the first circuit board.
The first aspect can effectively solve the problems that a plurality of scheme chip manufacturers exist in the market, different customer groups need to use different chips, all circuit board layout structures are often required to be re-laid and designed, the scheme replacement speed is greatly increased, and the scheme replacement cost is reduced;
in the second aspect, the overall circuit board layout structure of the project is redesigned due to chip replacement, so that the MCU layout is reasonable, the mixed interference of analog and digital models, EMC electromagnetic radiation and the like all need to be tested and confirmed again, and the scheme period is long; according to the technical scheme, after the second circuit board is independently separated, only first-time board distribution rationality verification is needed due to the fact that the circuit board layout is changed, after the first circuit board is used as the standard module, only one-time verification needs to be conducted on EMC, temperature rise and the like of the standard module, when the second circuit board is matched with the second circuit boards of different chips in a follow-up corresponding mode, repeated operation is not needed, and the project research and development period is greatly shortened.
And in the third aspect, the controller is standardized and modularized, the industrial operation and sale modes of the motor controller are thoroughly changed, the standard modules are taken as units, different product specifications are combined, the stock of raw materials, semi-finished products and finished products is greatly saved, and the comprehensive cost of the products is greatly reduced.
2. Physical insulation of limited size
The power part of the main heating source of the first circuit board as a power center and the driving part with small heating amount are arranged in a partitioning mode, the power part of the main heating source is in contact with the radiating piece, effective heat dissipation is conducted in a centralized mode, the second circuit board as an MCU control center is completely separated from the first circuit board with large heating amount, and the second circuit board is arranged in a laminating mode.
3. Spatial permutation, further compression of overall dimensions
The capacitor with larger volume is arranged at the outer side of the side surface of the first circuit board, the axial line of the length direction of the capacitor is parallel to or coincided with the main surface of the first circuit board, only pins for electrical connection are overlapped with the circuit board in the vertical height direction of the capacitor, and other main parts are not overlapped with the first circuit board at all, so that the vertical height of the overall layout of the circuit board can be effectively reduced; and the second circuit board as the MCU control center is independently taken out and stacked with the driving part, and a space size part is just left for accommodating the volume of the electrolytic capacitor, namely: the second circuit board as the MCU control center is independently stacked and installed not only for the modularization standardization described in the point 1, but also for realizing physical heat insulation under the limit size of the point 2, and also for replacing the installation space of the electrolytic capacitor, so that the vertical height of the overall layout of the circuit board is further reduced, and the structural size of the overall circuit board can be reduced to the limit.
Another objective of the present invention is to provide a circuit board layout structure with small size and stable operation.
The invention provides a circuit board layout structure, which comprises:
a first circuit board including a power section and a driving section electrically connected, the power section including a plurality of power elements;
the capacitor comprises a capacitor body and pins, the capacitor body is electrically connected with the first circuit board through the pins, and the capacitor body is arranged on the outer side of the first circuit board in a lying manner;
and the second circuit board comprises an MCU, is correspondingly laminated on the driving part of the first circuit board and is electrically connected with the driving part, and is not overlapped with the power element.
Further, the first circuit board includes a first region having a first area S1 and a second region having a second area S2, the first region and the second region combining to form an L-shaped notch, the driving portion is disposed in the first region, the power portion is disposed in the second region, and the capacitor is disposed in the notch; wherein S1< S2.
Further, the second circuit board has an area S3, where S3 ≦ S1.
Further, an arrangement region of the first circuit board and/or the second circuit board in the stacking direction is located within a vertical height range of the capacitor.
Compared with the prior art, the technical scheme has all the beneficial technical effects, and is not repeated herein.
Another objective of the present invention is to provide a brushless controller based on the above circuit board layout structure, which has a small size and is stable in operation.
The invention provides a brushless controller, which comprises:
a first circuit board including a power section and a driving section electrically connected, the power section including a plurality of power elements;
the filter capacitor is laid on the outer side of the first circuit board and electrically connected with the first circuit board;
the second circuit board comprises an MCU, and the second circuit board is correspondingly stacked on the driving part of the first circuit board and is electrically connected with the driving part;
a power supply circuit including a first power supply circuit having a first nominal voltage V1 and a second power supply circuit having a second nominal voltage V2;
the first power supply circuit is disposed on the first circuit board, and the second power supply circuit is disposed on the second circuit board, wherein; v1> V2.
Further, the second circuit board is connected with the first circuit board through at least 18 electrical connection lines.
Further, the network for electrically connecting the second circuit board and the first circuit board comprises:
the VCC port is a power supply input positive electrode of the first circuit board and is used for detecting the input power supply voltage of the first circuit board by the second circuit board;
the GND port is used for grounding the negative electrode of the second circuit board and is the negative electrode of the power supply input of the first circuit board;
the DC port is a first circuit board power supply port and is used for detecting the first circuit board power supply voltage by the second circuit board;
the P _ PowerLock port is a power supply control pin of the first circuit board and is used for controlling the power supply of the first circuit board by the second circuit board;
the NO _ IO port is a detection port of the normally closed end of the first circuit board switch and is used for detecting the normally closed end of the first circuit board switch by the second circuit board;
the NC _ IO port is a normally-open end detection port of the first circuit board switch and is used for detecting the normally-open end of the first circuit board switch by the second circuit board;
the TempFET port is a MOS temperature detection port of the first circuit board and is used for detecting the MOS temperature of the first circuit board by the second circuit board;
an EMF _ U port which is a detection port of a first circuit board output phase line U and is used for detecting the output phase line U by a second circuit board;
an EMF _ V port which is a detection port of an output phase line V of the first circuit board and is used for detecting the output phase line V by the second circuit board;
the EMF _ W port is a detection port of the output phase line W of the first circuit board and is used for detecting the output phase line W by the second circuit board;
a PWM1H port, which is a first bridge control port on the first circuit board and is used for controlling the first bridge on the first circuit board by the second circuit board;
a PWM2H port, which is a second bridge control port on the first circuit board and is used for controlling the second bridge on the first circuit board by the second circuit board;
a PWM3H port, which is a third control port of the bridge on the first circuit board and is used for controlling the third bridge on the first circuit board by the second circuit board;
a PWM1L port, which is a first circuit board lower bridge control port and is used for the second circuit board to control the first circuit board lower bridge;
a PWM2L port, which is a second control port of the first circuit board lower bridge and is used for the second circuit board to control the second circuit board lower bridge;
a PWM3L port, which is a third control port of the lower bridge of the first circuit board and is used for the second circuit board to control the third lower bridge of the first circuit board;
an OPI _ P port which is a first circuit board current detection signal P port and is used for detecting a power current signal P by a second circuit board;
and an OPI _ N port which is a first circuit board current detection signal N port and is used for detecting the power current signal N by the second circuit board.
Compared with the prior art, the brushless controller has all the beneficial technical effects of the circuit board layout structure, and the details are not repeated herein; besides, the power supply circuits are designed as a first power supply circuit having a first nominal voltage V1 and a second power supply circuit having a second nominal voltage V2; arranging a first power supply circuit on a first circuit board for power supply of the first circuit board, and arranging a second power supply circuit on a second circuit board for power supply of the second circuit board, wherein; v1> V2; the number of electrical connection lines between the first circuit board and the second circuit board can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1: a first schematic circuit board structure according to an embodiment of the present invention;
FIG. 2: a schematic diagram of a second circuit board structure according to an embodiment of the invention;
FIG. 3: the capacitor and the first circuit board are matched in a structure schematic diagram in the specific embodiment of the invention;
FIG. 4: the capacitor and the first circuit board matching structure of the embodiment of the invention are in side view;
FIG. 5 is a schematic view of: the first circuit board, the second circuit board and the capacitor matching structure in the specific embodiment of the invention are schematically shown;
FIG. 6: FIG. 5 is a schematic diagram of a capacitor isolation state according to an embodiment of the present invention;
FIG. 7: a first circuit board structure layout diagram according to an embodiment of the present invention;
FIG. 8: in the embodiment of the invention, a schematic diagram of the matching layout of the first circuit board, the second circuit board and the capacitor is shown;
FIG. 9: the first circuit board, the second circuit board and the capacitor matching layout in the embodiment of the invention are shown in the second schematic diagram;
FIG. 10: the embodiment of the invention provides a matching schematic diagram of a first circuit board, a second circuit board and a capacitor.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1 to 3, a circuit board layout structure includes at least a first circuit board 100, a second circuit board 200 and a capacitor 300;
the first circuit board 100 includes a power portion 10a and a driving portion 10b arranged on main surfaces thereof to be electrically connected, the power portion 10a including a plurality of power elements 10a-1, such as a plurality of mos tubes; the power portion 10a is arranged in a partitioned manner with the driving portion 10 b;
the capacitor 300 is located outside the side surface of the first circuit board 100 and electrically connected thereto, and the longitudinal axis of the capacitor is parallel or parallel to the main surface of the first circuit board 100, as shown in fig. 4 and 5;
the second circuit board 200 includes an MCU, and the second circuit board 200 is stacked on the driving portion 10b of the first circuit board 100 and electrically connected thereto.
Briefly, the first circuit board 100 and the second circuit board 200 have different functions, respectively, the first circuit board 100 serves as a power center, and the second circuit board 200 serves as an MCU control center.
The first circuit board 100 as a power center and the second circuit board 200 as an MCU control center are separated and independent into two independent modules with different functions and universal standard interfaces, the first circuit board 100 is used as a driving and power module to realize the modularization and the universality of the part, different standard power modules are designed according to different power sections, and the universal standard interfaces and the second circuit board 200 as the MCU control center are connected and installed at will to combine different products.
When a customer has different schemes and MCU chip application requirements, or has extended function requirements for the same scheme, the second circuit board 200 corresponding to the MCU chip may be developed in a targeted manner without performing a re-layout design together with the first circuit board 100.
Therefore, on one hand, the problem that on the market, a plurality of scheme chip manufacturers exist, different customer groups need to use different chips, all circuit board layout structures are required to be designed again frequently, the scheme replacement speed is greatly increased, and the scheme replacement cost is reduced;
on the other hand, the overall circuit board layout structure of the project is redesigned due to chip replacement, so that the MCU layout is reasonable, the mixed interference of analog and digital models, EMC electromagnetic radiation and the like all need to be tested and confirmed again, and the scheme period is long; after the second circuit board 200 serving as the MCU control center is independently separated, only first-time board distribution rationality verification is needed due to circuit board layout change, after the first circuit board 100 serves as a standard module, only one-time verification needs to be conducted on EMC, temperature rise and the like of the standard module, and when the second circuit board 200 is subsequently matched with different chips correspondingly, repeated verification is not needed, and the project research and development period is greatly shortened.
In addition, the technical scheme can also realize standardization and modularized operation of the controller based on the circuit board layout structure, thoroughly change the industrial operation and sale modes of the motor controller, combine different product specifications by taking standard modules as units, greatly save the stock of raw materials, semi-finished products and finished products, and greatly reduce the comprehensive cost of the products.
Meanwhile, in the technical scheme, the power part 10a of the main heating source of the first circuit board 100 as the power center and the driving part 10b with small heating value are arranged in a partitioning manner, and during specific design, the power part 10a of the main heating source can be contacted with the heat dissipation part 400, as shown in fig. 3, effective heat dissipation is intensively performed, and the second circuit board 200 as the MCU control center is completely separated from the first circuit board 100 with large heating value and is arranged in a laminating manner, so that on one hand, heat conduction and insulation are directly performed from the structure, on the other hand, the MCU and the power element with large heating value are arranged in a staggered manner, and the condition that the temperature of the MCU is too high under the requirement of a compact structure is ensured, so that the circuit board is ensured to operate stably;
in addition, the capacitor 300 with a large volume is arranged outside the side surface of the first circuit board 100, and the longitudinal axis of the capacitor is parallel to or coincides with the main surface of the first circuit board 100, as shown in fig. 4 and 5, in the vertical height direction, only the pins for electrical connection of the capacitor 300 are overlapped with the circuit board, and the other main parts are not overlapped with the first circuit board 100, which can effectively reduce the vertical height of the overall layout of the circuit board; and the second circuit board 200 as the MCU control center is separately stacked with the driving part 10b, and just a space size part is left for accommodating the volume of the capacitor 300, that is: the second circuit board 200 as the MCU control center is independently stacked for not only the modularization and standardization described above and the physical insulation in the limit size, but also the installation space of the capacitor to be replaced, thereby further reducing the vertical height of the overall layout of the circuit board, and thus reducing the overall circuit board structure size to the limit.
Referring to fig. 4, 5 and 6, in a direction perpendicular to the length of the capacitor 300, the arrangement region of the first circuit board 100 and/or the second circuit board 200 is located within a radial height range of the capacitor 300. Namely:
referring to fig. 6, the capacitor 300 has a central section S1 along the length direction, and the upper limit line L1 and the lower limit line L2 of the section S1 constitute the arrangement region of the first circuit board 100 and/or the second circuit board 200 in combination; specifically, when the first circuit board 100 is arranged, the first circuit board 100 is arranged so as not to be lower than the lower limit line L2 at the lowest and not to exceed the upper limit line L1 at the highest; the same is true; when the second circuit board 100 is arranged, the second circuit board 200 is arranged so as not to be lower than the lower limit line L2 at the lowest and not to exceed the upper limit line L1 at the highest; better still; when the second circuit board 200 is stacked corresponding to the first circuit board 100, the lowest value of the two will not be lower than the lower limit line L2, and the highest value will not exceed the upper limit line L1, so that the upper limit line L1 and the lower limit line L2 of the section S1 of the capacitor 300 basically define the overall height of the circuit board layout structure, and obviously, the layout structure is obviously reduced in the overall vertical height, and the height of the layout structure is already in a limit state.
Referring to fig. 1, 3 and 7, fig. 8, the driving portion 10b and the capacitor 300 are located on the same side of the power portion 10a, as shown on the left side; specifically, one side (e.g., the left side) of the power portion 10a partially extends and protrudes outward to form the driving portion 10b, the remaining portion of the side (the left side) forms a virtual plane in combination with the driving portion 10b, and the capacitor 300 is arranged in the virtual plane S2.
Of course, the driving portion 10b and the capacitor 300 may also be located on opposite sides of the power portion 10a, as shown with particular reference to fig. 9.
In addition, the capacitor 300 includes a capacitor body 300a and a pin 300b, and a projection of the capacitor body 300a in a direction perpendicular to the main surface of the first circuit board 100 does not coincide with a projection of the first circuit board 100 and/or the second circuit board 200 in the direction.
Referring to fig. 8, the circuit board layout structure at least includes a first circuit board 100, a second circuit board 200 and a capacitor 300;
the first circuit board 100 includes a power portion 10a and a driving portion 10b electrically connected, the power portion 10a including a plurality of power elements, such as mos transistors;
the capacitor 300 includes a capacitor body 300a and a pin 300b, the capacitor body 300a is electrically connected to the first circuit board 100 through the pin 300b, and the capacitor body 300a is disposed on the outer side of the first circuit board 100 in a lying manner; that is, the capacitor 300 has no overlap with the first circuit board 100 at the capacitor body 300a except the pin 300b overlaps with the first circuit board 100;
the capacitor 300 is a large-sized electronic device, generally in the shape of a cylinder, and when the capacitor body 300a is laid down, the overall height of the circuit board layout structure can be reduced.
The second circuit board 200 includes an MCU, and the second circuit board 200 is stacked on the driving portion 10b of the first circuit board 100 and electrically connected thereto, and does not overlap the power device 10 a.
The technical scheme also has the advantages that the controller modularization and standardization design recorded in the scheme is realized, the scheme replacement speed is increased, and the scheme replacement cost is reduced; shortening the project development period; the beneficial technical effect of reducing the comprehensive cost of the product is achieved, and meanwhile, the physical heat insulation can be realized under the limit size, so that the stable operation of the MCU is ensured; in addition, the capacitors and the second circuit board space displace, further compressing the overall size.
Referring to fig. 10, the first circuit board 100 includes a first region 100a having a first area S1 and a second region 100b having a second area S2, the first region 100a and the second region 100b constitute an L-shaped notch 100c in combination, the driving portion 10a is disposed in the first region 100a, the power portion 10b is disposed in the second region 100b, and the capacitor 300 is disposed in the notch 100 c; wherein S1< S2.
The second circuit board has an area S3, wherein S3 ≦ S1.
The arrangement area of the first circuit board 100 and/or the second circuit board 200 in the stacking direction is located within the vertical height range of the capacitor 300.
That is, referring to fig. 6, the capacitor 300 has a central section S1 along the length direction, and the upper limit line L1 and the lower limit line L2 of the section S1 constitute in combination the arrangement region of the first circuit board 100 and/or the second circuit board 200; specifically, when the first circuit board 100 is arranged, the first circuit board 100 is arranged so as not to be lower than the lower limit line L2 at the lowest and not to exceed the upper limit line L1 at the highest; the same is true; when the second circuit board 100 is arranged, the second circuit board 200 is arranged so as not to be lower than the lower limit line L2 at the lowest and not to exceed the upper limit line L1 at the highest; better, the method is simple; when the second circuit board 200 is stacked corresponding to the first circuit board 100, the minimum value of the two will not be lower than the lower limit line L2, and the maximum value will not exceed the upper limit line L1, so the upper limit line L1 and the lower limit line L2 of the section S1 of the capacitor 300 basically define the overall height of the circuit board layout structure, and obviously, the layout structure is obviously reduced in the overall vertical height, and the height of the layout structure is already the limit state.
In addition, the application also relates to a brushless controller based on the circuit board layout structure.
The brushless controller at least comprises a first circuit board 100, a second circuit board 200 and a filter capacitor 300;
the first circuit board 100 includes a power section 10a and a driving section 10b electrically connected, the power section 10b including a plurality of power elements, such as mos transistors;
the filter capacitor 300 lies on the outer side of the first circuit board 100 and is electrically connected thereto;
the second circuit board 200 includes an MCU, the second circuit board 200 is correspondingly stacked on the driving part 10b of the first circuit board 100 and electrically connected therewith;
the power supply circuit includes a first power supply circuit having a first nominal voltage V1 and a second power supply circuit having a second nominal voltage V2;
a first power supply circuit is disposed on the first circuit board 100, and a second power supply circuit is disposed on the second circuit board 200, wherein; v1> V2.
The brushless controller has all the beneficial technical effects of the circuit board layout structure, such as small volume, stable operation and the like, and is not described again; besides, the power supply circuits are designed as a first power supply circuit having a first nominal voltage V1 and a second power supply circuit having a second nominal voltage V2; arranging a first power supply circuit on the first circuit board for first circuit board power supply, and arranging a second power supply circuit on the second circuit board for second circuit board power supply, wherein; v1> V2; the number of electrical connecting wires between the first circuit board and the second circuit board can be reduced.
Specifically, the first power supply circuit is a 15V power supply circuit, and the second power supply circuit is a 5V capacitor circuit.
The second circuit board 200 is connected to the first circuit board 100 by at least 18 electrical connection lines.
The network for electrically connecting the second circuit board 200 and the first circuit board 100 includes:
the VCC port is a power supply input anode of the first circuit board and is used for detecting the input power supply voltage of the second circuit board to the first circuit board;
the GND port is used for grounding the negative electrode of the second circuit board and is the negative electrode of the power supply input of the first circuit board;
the DC port is a first circuit board power supply port and is used for detecting the first circuit board power supply voltage by the second circuit board;
the P _ PowerLock port is a power supply control pin of the first circuit board and is used for controlling the power supply of the first circuit board by the second circuit board;
the NO _ IO port is a detection port of the normally closed end of the first circuit board switch and is used for detecting the normally closed end of the first circuit board switch by the second circuit board;
the NC _ IO port is a normally-open end detection port of the first circuit board switch and is used for detecting the normally-open end of the first circuit board switch by the second circuit board;
the TempFET port is a MOS temperature detection port of the first circuit board and is used for detecting the MOS temperature of the first circuit board by the second circuit board;
an EMF _ U port which is a detection port of a first circuit board output phase line U and is used for detecting the output phase line U by a second circuit board;
an EMF _ V port which is a detection port of an output phase line V of the first circuit board and is used for detecting the output phase line V by the second circuit board;
the EMF _ W port is a detection port of the output phase line W of the first circuit board and is used for detecting the output phase line W by the second circuit board;
a PWM1H port, which is a first bridge control port on the first circuit board and is used for controlling the first bridge on the first circuit board by the second circuit board;
a PWM2H port, which is a second bridge control port on the first circuit board and is used for controlling the second bridge on the first circuit board by the second circuit board;
a PWM3H port, which is a third control port of the bridge on the first circuit board and is used for controlling the third bridge on the first circuit board by the second circuit board;
a PWM1L port, which is a first circuit board lower bridge control port and is used for the second circuit board to control the first circuit board lower bridge;
a PWM2L port, which is a second control port of the first circuit board lower bridge and is used for the second circuit board to control the second circuit board lower bridge;
a PWM3L port, which is a third control port of the first circuit board lower bridge and is used for the second circuit board to control the third circuit board lower bridge;
an OPI _ P port which is a first circuit board current detection signal P port and is used for detecting a power current signal P by a second circuit board;
and an OPI _ N port which is a first circuit board current detection signal N port and is used for detecting the power current signal N by the second circuit board.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (12)
1. A circuit board layout structure, comprising:
a first circuit board including a power portion and a driving portion arranged on a main surface thereof to be electrically connected, the power portion including a plurality of power elements and being arranged in a partitioned manner with the driving portion;
the capacitor is positioned on the outer side of the side surface of the first circuit board and is electrically connected with the side surface of the first circuit board, and the length direction axis of the capacitor is parallel to or coincided with the main surface of the first circuit board;
and the second circuit board comprises an MCU, and the second circuit board is correspondingly laminated on the driving part of the first circuit board and is electrically connected with the driving part.
2. The circuit board layout structure of claim 1, wherein: in the direction perpendicular to the length direction of the capacitor, the arrangement area of the first circuit board and/or the second circuit board is located within the radial height range of the capacitor.
3. The circuit board layout structure of claim 1, wherein: the driving portion and the capacitor are located on the same side or opposite sides of the power portion.
4. The circuit board layout structure of claim 3, wherein: one side of the power part extends outwards partially to form the driving part, the rest part of the side and the driving part form a virtual plane in combination, and the capacitor is arranged in the virtual plane.
5. The circuit board layout structure according to claim 1, wherein: the capacitor comprises a capacitor body and pins, and the projection of the capacitor body in the direction perpendicular to the main surface of the first circuit board is not overlapped with the projection of the first circuit board and/or the second circuit board in the direction.
6. A circuit board layout structure, comprising:
a first circuit board including a power section and a driving section electrically connected, the power section including a plurality of power elements;
the capacitor comprises a capacitor body and pins, the capacitor body is electrically connected with the first circuit board through the pins, and the capacitor body is arranged on the outer side of the first circuit board in a lying manner;
and the second circuit board comprises an MCU, is correspondingly laminated on the driving part of the first circuit board and is electrically connected with the driving part, and is not overlapped with the power element.
7. The circuit board layout structure of claim 6, wherein: the first circuit board comprises a first region with a first area S1 and a second region with a second area S2, the first region and the second region combine to form an L-shaped gap, the driving part is arranged in the first region, the power part is arranged in the second region, and the capacitor is arranged in the gap; wherein S1< S2.
8. The circuit board layout structure according to claim 7, wherein: the second circuit board has an area S3, wherein S3 ≦ S1.
9. The circuit board layout structure of claim 6, wherein: the arrangement area of the first circuit board and/or the second circuit board in the stacking direction is located within the vertical height range of the capacitor.
10. A brushless controller, comprising:
a first circuit board including a power section and a driving section electrically connected, the power section including a plurality of power elements;
the filter capacitor is horizontally laid on the outer side of the first circuit board and is electrically connected with the first circuit board;
the second circuit board comprises an MCU, and the second circuit board is correspondingly stacked on the driving part of the first circuit board and is electrically connected with the driving part;
a power supply circuit including a first power supply circuit having a first nominal voltage V1 and a second power supply circuit having a second nominal voltage V2;
the first power circuit is disposed on the first circuit board, and the second power circuit is disposed on the second circuit board, wherein; v1> V2.
11. The brushless controller of claim 10, wherein: the second circuit board is connected with the first circuit board at least through 18 electric connecting wires.
12. The brushless controller of claim 11, wherein: the second circuit board and the first circuit board are electrically connected with the network, and the network comprises:
the VCC port is a power supply input anode of the first circuit board and is used for detecting the input power supply voltage of the second circuit board to the first circuit board;
the GND port is a power input negative electrode of the first circuit board and is used for grounding a negative electrode of the second circuit board;
the DC port is a first circuit board power supply port and is used for detecting the first circuit board power supply voltage by the second circuit board;
the P _ PowerLock port is a power supply control pin of the first circuit board and is used for controlling the power supply of the first circuit board by the second circuit board;
the NO _ IO port is a detection port of the normally closed end of the first circuit board switch and is used for detecting the normally closed end of the first circuit board switch by the second circuit board;
the NC _ IO port is a normally-opened end detection port of the first circuit board switch and is used for detecting the normally-opened end of the first circuit board switch by the second circuit board;
the TempFET port is a MOS temperature detection port of the first circuit board and is used for detecting the MOS temperature of the first circuit board by the second circuit board;
the EMF _ U port is a detection port of the output phase line U of the first circuit board and is used for detecting the output phase line U by the second circuit board;
an EMF _ V port which is a detection port of an output phase line V of the first circuit board and is used for detecting the output phase line V by the second circuit board;
the EMF _ W port is a detection port of the output phase line W of the first circuit board and is used for detecting the output phase line W by the second circuit board;
a PWM1H port, which is a first bridge control port on the first circuit board and is used for controlling the first bridge on the first circuit board by the second circuit board;
a PWM2H port, which is a second bridge control port on the first circuit board and is used for controlling the second bridge on the first circuit board by the second circuit board;
a PWM3H port, which is a third control port of the bridge on the first circuit board and is used for controlling the third bridge on the first circuit board by the second circuit board;
a PWM1L port, which is a first circuit board lower bridge control port and is used for the second circuit board to control the first circuit board lower bridge;
a PWM2L port which is a second control port of the lower bridge of the first circuit board and is used for the second circuit board to control the second lower bridge of the first circuit board;
a PWM3L port, which is a third control port of the first circuit board lower bridge and is used for the second circuit board to control the third circuit board lower bridge;
an OPI _ P port which is a first circuit board current detection signal P port and is used for detecting a power current signal P by a second circuit board;
and an OPI _ N port which is a first circuit board current detection signal N port and is used for detecting the power current signal N by the second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011522328.1A CN114666967A (en) | 2020-12-22 | 2020-12-22 | Circuit board layout structure and brushless controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011522328.1A CN114666967A (en) | 2020-12-22 | 2020-12-22 | Circuit board layout structure and brushless controller |
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| Publication Number | Publication Date |
|---|---|
| CN114666967A true CN114666967A (en) | 2022-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011522328.1A Pending CN114666967A (en) | 2020-12-22 | 2020-12-22 | Circuit board layout structure and brushless controller |
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| Country | Link |
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| CN (1) | CN114666967A (en) |
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| US20090156025A1 (en) * | 2007-12-17 | 2009-06-18 | Hipro Electronics Co., Ltd. | Electronic apparatus with a pin mount |
| CN104968145A (en) * | 2015-06-19 | 2015-10-07 | 中山海科力电子有限公司 | Circuit board device |
| CN213818337U (en) * | 2020-12-22 | 2021-07-27 | 谢渊斌 | Circuit board layout structure and brushless controller |
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| US6700795B1 (en) * | 2002-01-23 | 2004-03-02 | Yazaki North America | Scalable, modular architecture for automotive power distribution and body control functions |
| CN1988345A (en) * | 2005-10-25 | 2007-06-27 | 惠普开发有限公司 | Power converter comprising a controller and a power component mounted on separate circuit boards |
| US20090156025A1 (en) * | 2007-12-17 | 2009-06-18 | Hipro Electronics Co., Ltd. | Electronic apparatus with a pin mount |
| CN104968145A (en) * | 2015-06-19 | 2015-10-07 | 中山海科力电子有限公司 | Circuit board device |
| CN213818337U (en) * | 2020-12-22 | 2021-07-27 | 谢渊斌 | Circuit board layout structure and brushless controller |
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