CN114666967A - Circuit board layout structure and brushless controller - Google Patents

Circuit board layout structure and brushless controller Download PDF

Info

Publication number
CN114666967A
CN114666967A CN202011522328.1A CN202011522328A CN114666967A CN 114666967 A CN114666967 A CN 114666967A CN 202011522328 A CN202011522328 A CN 202011522328A CN 114666967 A CN114666967 A CN 114666967A
Authority
CN
China
Prior art keywords
circuit board
port
power
capacitor
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011522328.1A
Other languages
Chinese (zh)
Inventor
谢渊斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202011522328.1A priority Critical patent/CN114666967A/en
Publication of CN114666967A publication Critical patent/CN114666967A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K11/00Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30Structural association with control circuits or drive circuits
    • H02K11/33Drive circuits, e.g. power electronics
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02PCONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P6/00Arrangements for controlling synchronous motors or other dynamo-electric motors using electronic commutation dependent on the rotor position; Electronic commutators therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明提供了一种电路板布局结构,其包括:第一电路板,其包括布置于其主表面上电性连接的功率部分和驱动部分,功率部分包括多个功率元件且与驱动部分分区布置;电容,其位于第一电路板侧表面的外侧并与之电性连接,且其长度方向轴线与第一电路板的主表面相平行或重合;第二电路板,其包括MCU,第二电路板对应层叠于第一电路板的驱动部分并与之电性连接。该电路板布局结构体积小、运行稳定。此外,本发明还提供了一种基于该电路板布局结构的无刷控制器,其体积小,运行稳定。

Figure 202011522328

The present invention provides a circuit board layout structure, which includes: a first circuit board, which includes a power part and a driving part that are arranged on a main surface of the circuit board and are electrically connected; the power part includes a plurality of power elements and is partitioned with the driving part ; Capacitor, which is located on the outside of the side surface of the first circuit board and is electrically connected to it, and its longitudinal axis is parallel or coincident with the main surface of the first circuit board; The second circuit board includes MCU, the second circuit The board is correspondingly stacked on and electrically connected to the driving part of the first circuit board. The circuit board layout structure is small in size and stable in operation. In addition, the present invention also provides a brushless controller based on the circuit board layout structure, which is small in size and stable in operation.

Figure 202011522328

Description

电路板布局结构及无刷控制器Circuit board layout and brushless controller

技术领域technical field

本发明涉及一种电路板布局结构,以及一种无刷控制器。The invention relates to a circuit board layout structure and a brushless controller.

背景技术Background technique

目前,无刷电机的广泛的应用于电动工具中,但是,传统无刷控制器的体积较大,导致对于体积较小的电动工具(如手持型电动工具),不便于无刷电机控制器的安装,即使将无刷控制器安装于体积较小的电动工具中,由于其电路单元多且结构复杂,致使内部零部件较多,不便于散热,导致运行过程中主芯片的温度过高,严重影响主芯片的运行稳定性。特别是,控制系统是无刷直流电机(BLDC)的核心部分,易受到电磁干扰的影响。At present, brushless motors are widely used in power tools. However, the traditional brushless controllers are large in size, which makes it inconvenient for brushless motor controllers for small-sized power tools (such as hand-held power tools). Installation, even if the brushless controller is installed in a small power tool, due to its many circuit units and complex structure, there are many internal parts, which is not easy to dissipate heat, resulting in the temperature of the main chip being too high during operation, which is serious. Affect the running stability of the main chip. In particular, the control system is the core part of the brushless DC motor (BLDC) and is susceptible to electromagnetic interference.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种体积小、运行稳定的电路板布局结构。The purpose of the present invention is to provide a circuit board layout structure with small size and stable operation.

本发明提供的一种电路板布局结构,其包括:A circuit board layout structure provided by the present invention includes:

第一电路板,其包括布置于其主表面上电性连接的功率部分和驱动部分,所述功率部分包括多个功率元件且与所述驱动部分分区布置;a first circuit board, which includes a power part and a driving part arranged on a main surface thereof and electrically connected, the power part includes a plurality of power elements and is arranged in a partition with the driving part;

电容,其位于所述第一电路板侧表面的外侧并与之电性连接,且其长度方向轴线与所述第一电路板的主表面相行或平重合;a capacitor, which is located on the outer side of the side surface of the first circuit board and is electrically connected to it, and whose longitudinal axis is parallel or coincident with the main surface of the first circuit board;

第二电路板,其包括MCU,所述第二电路板对应层叠于所述第一电路板的驱动部分并与之电性连接。The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board.

进一步地,在垂直于所述电容长度方向上,所述第一电路板和/或所述第二电路板的布置区域位于所述电容的径向高度范围内。Further, in a direction perpendicular to the length of the capacitor, the arrangement area of the first circuit board and/or the second circuit board is located within the radial height range of the capacitor.

进一步地,所述驱动部分和所述电容位于所述功率部分的同一侧或相对的两侧。Further, the driving part and the capacitor are located on the same side or opposite sides of the power part.

进一步地,所述功率部分的一侧局部向外延伸突出形成所述驱动部分,该侧其余部分与所述驱动部分组合形成虚拟平面,所述电容布置于所述虚拟平面内。Further, one side of the power part partially extends and protrudes outward to form the driving part, the remaining part of the side and the driving part are combined to form a virtual plane, and the capacitor is arranged in the virtual plane.

进一步地,所述电容包括电容本体和引脚,其电容本体在垂直于所述第一电路板主表面的方向上的投影与所述第一电路板和/或所述第二电路板在该方向上的投影无重合。Further, the capacitor includes a capacitor body and pins, and the projection of the capacitor body in the direction perpendicular to the main surface of the first circuit board is the same as that of the first circuit board and/or the second circuit board. The projections in the directions do not coincide.

较现有技术,本发明的有益技术效果在于:Compared with the prior art, the beneficial technical effects of the present invention are:

1、实现控制器模块化、标准化设计;加快方案替换速度,降低方案替换成本;缩短项目开发周期;降低产品综合成本。1. Realize the modularized and standardized design of the controller; speed up the program replacement speed and reduce the program replacement cost; shorten the project development cycle; reduce the overall product cost.

将作为功率中心的第一电路板和作为MCU控制中心的第二电路板分开,独立成两个分别具有不同功能,通用标准接口的独立模块,第一电路板作为驱动和功率模块,实现该部分的模块化通用,只需要按不同的功率段,设计不同的标准功率模块,利用通用化标准接口与作为MCU控制中心的第二电路板进行任意连接安装,组合出不同的产品。Separate the first circuit board as the power center and the second circuit board as the MCU control center into two independent modules with different functions and common standard interfaces. The first circuit board is used as the driver and power module to realize this part. The modularization of the MCU is universal. It is only necessary to design different standard power modules according to different power segments, and use the universal standard interface to arbitrarily connect and install the second circuit board as the MCU control center to combine different products.

当客户有不同的方案和MCU芯片应用要求,或者对相同方案有扩展功能需求,可以针对性的开发对应MCU芯片的第二电路板即可,不必连同第一电路板进行重新布局设计。When customers have different solutions and MCU chip application requirements, or have extended functional requirements for the same solution, they can develop a second circuit board corresponding to the MCU chip in a targeted manner, without having to re-layout the design together with the first circuit board.

第一方面能够有效解决市场上方案芯片厂家众多,不同的客户群体需要使用不同的芯片,导致经常需要重新布局设计所有的电路板布局结构,极大加快了方案替换的速度,降低了方案替换的成本;On the one hand, it can effectively solve the problem that there are many solution chip manufacturers in the market, and different customer groups need to use different chips, which often leads to the need to re-layout and design all the circuit board layout structures, which greatly speeds up the speed of solution replacement and reduces the cost of solution replacement. cost;

第二方面,因更换芯片导致项目整体电路板布局结构重新设计,导致MCU布板合理性,模拟数字型号混合干扰,EMC电磁辐射等,都需要重新测试确认,方案周期很长;而本技术方案,将第二电路板独立分开后,因电路板布局改变只需要进行第一次布板合理性验证即可,将第一电路板作为标准模块之后,关于该标准模块的EMC、温升等也只需要进行一次性验证,后续对应匹配不同芯片的第二电路板时,则无需重复进行,极大缩短了项目研发周期。On the other hand, due to the replacement of chips, the overall circuit board layout structure of the project is redesigned, resulting in the rationality of MCU layout, mixed interference of analog and digital models, EMC electromagnetic radiation, etc., all need to be re-tested and confirmed, and the solution cycle is very long; , after the second circuit board is independently separated, only the first layout rationality verification is required due to the change of the circuit board layout. After the first circuit board is used as a standard module, the EMC, temperature rise, etc. of the standard module are also Only one-time verification is required, and when the second circuit board matching different chips is subsequently matched, there is no need to repeat it, which greatly shortens the project development cycle.

第三方面,让控制器实现标准化,模块化经营,将彻底改变电机控制器行业经营和销售模式,以标准的模块为单元,组合出不同的产品规格,大大节省了原材料、半成品、成品的库存,极大的降低了产品综合成本。On the third aspect, standardization and modular operation of controllers will completely change the operation and sales model of the motor controller industry. Using standard modules as units, different product specifications can be combined, which greatly saves the inventory of raw materials, semi-finished products and finished products. , which greatly reduces the overall cost of the product.

2、极限尺寸下实现物理隔热2. Realize physical heat insulation under the limit size

将作为功率中心的第一电路板的主要发热源的功率部分和发热量小的驱动部分,分区布置,将主要发热源的功率部分与散热件接触,集中进行有效散热,并且将作为MCU控制中心的第二电路板与发热量大的第一电路板完全分离,叠层布置,一方面,直接从结构上进行热量传导隔绝,另一方面,此时的MCU与发热量大的功率元件错位布置,保证在极限紧凑的结构要求下,也能够有效避免MCU温度过高,从而保证电路板运行稳定。The power part of the main heat source of the first circuit board as the power center and the drive part with small heat generation are arranged in partitions, and the power part of the main heat source is contacted with the heat sink for effective heat dissipation in a centralized manner, and will be used as the MCU control center The second circuit board is completely separated from the first circuit board with a large amount of heat, and it is arranged in layers. On the one hand, the heat conduction is directly isolated from the structure. , to ensure that under the extremely compact structure requirements, it can also effectively prevent the MCU temperature from being too high, so as to ensure the stable operation of the circuit board.

3、空间置换,进一步压缩总体尺寸3. Space replacement to further compress the overall size

将体积较大的电容布置于第一电路板侧表面的外侧,并且其长度方向轴线与第一电路板的主表面相平行或重合,在竖直高度方向上电容部分仅有用于电性连接的引脚与电路板重叠,其它主体部分与第一电路板无任何重叠,其能够有效缩减电路板整体布局的竖直高度;并且将作为MCU控制中心的第二电路板独立出来与驱动部分层叠,恰好空余出来空间尺寸部分,用来容纳电解电容的体积,即:将作为MCU控制中心的第二电路板独立出来叠层安装,不光是为了以上第1点描述的模块化标准化,和第2点极限尺寸下实现物理隔热,也是为了置换出电解电容的安装空间,进一步降低电路板整体布局的竖直高度,从而能够极限降低整体电路板结构尺寸。The capacitor with larger volume is arranged on the outside of the side surface of the first circuit board, and its longitudinal axis is parallel or coincident with the main surface of the first circuit board. In the vertical height direction, the capacitor part is only used for electrical connection. The pins overlap with the circuit board, and the other main parts do not overlap with the first circuit board, which can effectively reduce the vertical height of the overall layout of the circuit board; and separate the second circuit board as the MCU control center and stack it with the driving part, The space size is just spared to accommodate the volume of the electrolytic capacitor, that is, the second circuit board as the MCU control center is independently stacked and installed, not only for the modular standardization described in point 1 above, and point 2 The realization of physical insulation under the limit size is also to replace the installation space of the electrolytic capacitor and further reduce the vertical height of the overall layout of the circuit board, so as to minimize the overall circuit board structure size.

本发明的另一目的仍在于提供一种体积小、运行稳定的电路板布局结构。Another object of the present invention is to provide a circuit board layout structure with small size and stable operation.

本发明提供的一种电路板布局结构,其包括:A circuit board layout structure provided by the present invention includes:

第一电路板,其包括电性连接的功率部分和驱动部分,所述功率部分包括多个功率元件;a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements;

电容,其包括电容本体和引脚,所述电容本体通过所述引脚与所述第一电路板电性连接,且所述电容本体平躺地设置于所述第一电路板的外侧;a capacitor, which includes a capacitor body and pins, the capacitor body is electrically connected to the first circuit board through the pins, and the capacitor body is laid flat on the outside of the first circuit board;

第二电路板,其包括MCU,所述第二电路板对应层叠于所述第一电路板的驱动部分并与之电性连接,且与所述功率元件无重叠。The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board, and does not overlap with the power element.

进一步地,所述第一电路板包括具有第一面积S1的第一区域和具有第二面积S2的第二区域,所述第一区域和所述第二区域组合构成一L型缺口,所述驱动部分布置于所述第一区域,所述功率部分布置于所述第二区域,所述电容布置于所述缺口中;其中,S1<S2。Further, the first circuit board includes a first area with a first area S1 and a second area with a second area S2, the first area and the second area are combined to form an L-shaped notch, the The driving part is arranged in the first area, the power part is arranged in the second area, and the capacitor is arranged in the gap; wherein, S1<S2.

进一步地,所述第二电路板具有面积S3,其中,S3≦S1。Further, the second circuit board has an area S3, wherein S3≦S1.

进一步地,所述第一电路板和/或所述第二电路板在层叠方向上的布置区域位于所述电容的垂直高度范围内。Further, the arrangement area of the first circuit board and/or the second circuit board in the stacking direction is located within the vertical height range of the capacitor.

较现有技术,本技术方案具有上述所有有益技术效果,在此不再赘述。Compared with the prior art, the technical solution has all the above-mentioned beneficial technical effects, which will not be repeated here.

本发明的另一目的在于提供一种基于上述电路板布局结构的无刷控制器,其体积小,运行稳定。Another object of the present invention is to provide a brushless controller based on the above circuit board layout structure, which is small in size and stable in operation.

本发明提供的一种无刷控制器,其包括:A brushless controller provided by the present invention includes:

第一电路板,其包括电性连接的功率部分和驱动部分,所述功率部分包括多个功率元件;a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements;

滤波电容,其平躺于所述第一电路板的外侧并与之电性连接;a filter capacitor, which is lying on the outer side of the first circuit board and is electrically connected to it;

第二电路板,其包括MCU,所述第二电路板对应层叠于所述第一电路板的驱动部分并与之电性连接;a second circuit board, comprising an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board;

电源电路,其包括具有第一标称电压V1的第一电源电路和具有第二标称电压V2的第二电源电路;a power supply circuit comprising a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2;

所述第一电源电路布置于所述第一电路板上,所述第二电源电路布置于所述第二电路板上,其中;V1>V2。The first power supply circuit is arranged on the first circuit board, and the second power supply circuit is arranged on the second circuit board, wherein: V1>V2.

进一步地,所述第二电路板至少通过18根电连接线与所述第一电路板相连。Further, the second circuit board is connected to the first circuit board through at least 18 electrical connecting wires.

进一步地,所述第二电路板与所述第一电路板电性连接网络包括:Further, the electrical connection network between the second circuit board and the first circuit board includes:

VCC端口,其为第一电路板的电源输入正极,用于第二电路板对第一电路板输入电源电压检测;The VCC port, which is the positive pole of the power input of the first circuit board, is used for the second circuit board to detect the input power supply voltage of the first circuit board;

GND端口,其为第一电路板的电源输入负极,用于第二电路板负极接地;GND port, which is the power input negative pole of the first circuit board, and is used for grounding the negative pole of the second circuit board;

DC端口,其为第一电路板电源端口,用于第二电路板对第一电路板电源电压检测;The DC port, which is the power port of the first circuit board, is used for the second circuit board to detect the power supply voltage of the first circuit board;

P_PowerLock端口,其为第一电路板电源控制脚,用于第二电路板对第一电路板的电源控制;P_PowerLock port, which is the power control pin of the first circuit board, used for the power control of the second circuit board to the first circuit board;

NO_IO端口,其为第一电路板开关常闭端检测端口,用于第二电路板对第一电路板开关常闭端检测;NO_IO port, which is the normally closed terminal detection port of the first circuit board switch, used for the second circuit board to detect the normally closed terminal of the first circuit board switch;

NC_IO端口,其为第一电路板开关常开端检测端口,用于第二电路板对第一电路板开关常开端检测;NC_IO port, which is the normally open end detection port of the first circuit board switch, used for the second circuit board to detect the normally open end of the first circuit board switch;

TempFET端口,其为第一电路板MOS温度检测端口,用于第二电路板对第一电路板的MOS温度检测;TempFET port, which is the MOS temperature detection port of the first circuit board, used for the MOS temperature detection of the first circuit board by the second circuit board;

EMF_U端口,其为第一电路板输出相线U检测端口,用于第二电路板对输出相线U的检测;EMF_U port, which is the first circuit board output phase line U detection port, used for the second circuit board to detect the output phase line U;

EMF_V端口,其为第一电路板输出相线V检测端口,用于第二电路板对输出相线V的检测;EMF_V port, which is the first circuit board output phase line V detection port, used for the second circuit board to detect the output phase line V;

EMF_W端口,其为第一电路板输出相线W检测端口,用于第二电路板对输出相线W的检测;EMF_W port, which is the first circuit board output phase line W detection port, used for the second circuit board to detect the output phase line W;

PWM1H端口,其为第一电路板上桥一控制端口,用于第二电路板对第一电路板上桥一的控制;PWM1H port, which is the bridge-one control port on the first circuit board, used for the second circuit board to control the bridge-one on the first circuit board;

PWM2H端口,其为第一电路板上桥二控制端口,用于第二电路板对第一电路板上桥二的控制;The PWM2H port, which is the bridge two control port on the first circuit board, is used for the second circuit board to control the bridge two on the first circuit board;

PWM3H端口,其为第一电路板上桥三控制端口,用于第二电路板对第一电路板上桥三的控制;The PWM3H port, which is the bridge three control port on the first circuit board, is used for the second circuit board to control the bridge three on the first circuit board;

PWM1L端口,其为第一电路板下桥一控制端口,用于第二电路板对第一电路板下桥一的控制;PWM1L port, which is a control port of the lower bridge of the first circuit board, used for the control of the lower bridge of the first circuit board by the second circuit board;

PWM2L端口,其为第一电路板下桥二控制端口,用于第二电路板对第一电路板下桥二的控制;The PWM2L port, which is the second control port of the lower bridge of the first circuit board, is used for the control of the second circuit board to the second lower bridge of the first circuit board;

PWM3L端口,其为第一电路板下桥三控制端口,用于第二电路板对第一电路板下桥三的控制;PWM3L port, which is the lower bridge three control port of the first circuit board, used for the second circuit board to control the lower bridge three of the first circuit board;

OPI_P端口,其为第一电路板电流检测信号P端口,用于第二电路板对功率电流信号P的检测;OPI_P port, which is the first circuit board current detection signal P port, used for the second circuit board to detect the power current signal P;

OPI_N端口,其为第一电路板电流检测信号N端口,用于第二电路板对功率电流信号N的检测。The OPI_N port is the first circuit board current detection signal N port, which is used for the second circuit board to detect the power current signal N.

较现有技术,本无刷控制器具有上述电路板布局结构的所有有益技术效果,在此不再赘述;除此之外,将电源电路设计为具有第一标称电压V1的第一电源电路和具有第二标称电压V2的第二电源电路;将第一电源电路布置于第一电路板上,用于第一电路板电源,第二电源电路布置于第二电路板上,用于第二电路板电源,其中;V1>V2;可以减少第一电路板与第二电路板之间的电性连接线。Compared with the prior art, the brushless controller has all the beneficial technical effects of the above-mentioned circuit board layout structure, which will not be repeated here; in addition, the power supply circuit is designed as a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2; the first power supply circuit is arranged on the first circuit board for the power supply of the first circuit board, and the second power supply circuit is arranged on the second circuit board for the first circuit board Two circuit board power supplies, wherein: V1>V2; can reduce the electrical connection lines between the first circuit board and the second circuit board.

附图说明Description of drawings

为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the specific embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the specific embodiments or the prior art. Obviously, the accompanying drawings in the following description The drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

图1:本发明具体实施例第一电路板结构示意图;Fig. 1: Schematic diagram of the structure of the first circuit board according to the specific embodiment of the present invention;

图2:本发明具体实施例第二电路板结构示意图;Figure 2: A schematic diagram of the structure of the second circuit board according to the specific embodiment of the present invention;

图3:本发明具体实施例电容与第一电路板配合结构示意图;Figure 3: A schematic diagram of the structure of the capacitor and the first circuit board in accordance with a specific embodiment of the present invention;

图4:本发明具体实施例电容与第一电路板配合结构侧视图;Figure 4: Side view of the matching structure of the capacitor and the first circuit board according to the specific embodiment of the present invention;

图5:本发明具体实施例第一电路板、第二电路板、电容配合结构示意图;Fig. 5: Schematic diagram of the matching structure of the first circuit board, the second circuit board and the capacitor according to the specific embodiment of the present invention;

图6:本发明具体实施例图5中电容分离状态示意图;Figure 6: a schematic diagram of the capacitor separation state in Figure 5 according to a specific embodiment of the present invention;

图7:本发明具体实施例第一电路板结构布局示意图;Fig. 7: Schematic diagram of the structure layout of the first circuit board according to the specific embodiment of the present invention;

图8:本发明具体实施例第一电路板、第二电路板、电容配合布局一示意图;Figure 8: A schematic diagram of the first circuit board, the second circuit board, and the matching layout of the capacitor according to the specific embodiment of the present invention;

图9:本发明具体实施例第一电路板、第二电路板、电容配合布局二示意图;Fig. 9: The second schematic diagram of the first circuit board, the second circuit board, and the capacitor matching layout according to the specific embodiment of the present invention;

图10:本发明具体实施例第一电路板、第二电路板、电容配合示意图。FIG. 10 is a schematic diagram of the cooperation of the first circuit board, the second circuit board and the capacitor according to the specific embodiment of the present invention.

具体实施方式Detailed ways

下面将结合附图对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

参照图1至图3所示,一种电路板布局结构,其至少包括第一电路板100,第二电路板200和电容300;1 to 3 , a circuit board layout structure includes at least a first circuit board 100, a second circuit board 200 and a capacitor 300;

第一电路板100包括布置于其主表面上电性连接的功率部分10a和驱动部分10b,功率部分10a包括多个功率元件10a-1,如多个mos管;功率部分10a与驱动部分10b分区布置;The first circuit board 100 includes a power portion 10a and a driving portion 10b that are electrically connected on the main surface thereof. The power portion 10a includes a plurality of power elements 10a-1, such as a plurality of MOS tubes; the power portion 10a and the driving portion 10b are partitioned layout;

电容300位于第一电路板100侧表面的外侧并与之电性连接,且其长度方向轴线与第一电路板100的主表面相行或平重合,具体参照图4和图5所示;The capacitor 300 is located on the outer side of the side surface of the first circuit board 100 and is electrically connected to it, and its longitudinal axis is parallel or parallel to the main surface of the first circuit board 100, as shown in FIG. 4 and FIG. 5 ;

第二电路板200包括MCU,第二电路板200对应层叠于第一电路板100的驱动部分10b并与之电性连接。The second circuit board 200 includes an MCU, and the second circuit board 200 is correspondingly stacked on the driving portion 10b of the first circuit board 100 and electrically connected thereto.

简单而言,上述第一电路板100和第二电路板200分别具有不同功能,第一电路板100作为功率中心,而第二电路板200作为MCU控制中心。To put it simply, the first circuit board 100 and the second circuit board 200 have different functions respectively, the first circuit board 100 serves as a power center, and the second circuit board 200 serves as an MCU control center.

将作为功率中心的第一电路板100和作为MCU控制中心的第二电路板200分开,独立成两个分别具有不同功能,通用标准接口的独立模块,第一电路板100作为驱动和功率模块,实现该部分的模块化通用,只需要按不同的功率段,设计不同的标准功率模块,利用通用化标准接口与作为MCU控制中心的第二电路板200进行任意连接安装,组合出不同的产品。The first circuit board 100 as the power center and the second circuit board 200 as the MCU control center are separated into two independent modules with different functions and a common standard interface, and the first circuit board 100 is used as a driver and a power module, To realize the modularization of this part, it is only necessary to design different standard power modules according to different power segments, and use the universal standard interface to arbitrarily connect and install the second circuit board 200 as the MCU control center to combine different products.

当客户有不同的方案和MCU芯片应用要求,或者对相同方案有扩展功能需求,可以针对性的开发对应MCU芯片的第二电路板200即可,不必连同第一电路板100进行重新布局设计。When customers have different solutions and MCU chip application requirements, or have extended functional requirements for the same solution, they can develop the second circuit board 200 corresponding to the MCU chip in a targeted manner, and do not need to re-layout design together with the first circuit board 100 .

从而,一方面能够有效解决市场上方案芯片厂家众多,不同的客户群体需要使用不同的芯片,导致经常需要重新布局设计所有的电路板布局结构,极大加快了方案替换的速度,降低了方案替换的成本;Therefore, on the one hand, it can effectively solve the problem that there are many solution chip manufacturers in the market, and different customer groups need to use different chips, which often leads to the need to re-layout and design all the circuit board layout structures, which greatly speeds up the speed of solution replacement and reduces solution replacement. the cost of;

另一方面,因更换芯片导致项目整体电路板布局结构重新设计,导致MCU布板合理性,模拟数字型号混合干扰,EMC电磁辐射等,都需要重新测试确认,方案周期很长;而本技术方案将作为MCU控制中心的第二电路板200独立分开后,因电路板布局改变只需要进行第一次布板合理性验证即可,将第一电路板100作为标准模块之后,关于该标准模块的EMC、温升等也只需要进行一次性验证,后续对应匹配不同芯片的第二电路板200时,则无需重复进行,极大缩短了项目研发周期。On the other hand, due to the replacement of the chip, the overall circuit board layout structure of the project is redesigned, resulting in the rationality of the MCU board layout, the mixed interference of analog and digital models, and the electromagnetic radiation of EMC. After the second circuit board 200 serving as the MCU control center is independently separated, only the first layout rationality verification is required due to the change of the circuit board layout. EMC, temperature rise, etc. only need to be verified once. When the second circuit board 200 matching different chips is subsequently matched, there is no need to repeat it, which greatly shortens the project development cycle.

此外,本技术方案还可以让基于该电路板布局结构的控制器实现标准化,模块化经营,将彻底改变电机控制器行业经营和销售模式,以标准的模块为单元,组合出不同的产品规格,大大节省了原材料、半成品、成品的库存,极大的降低了产品综合成本。In addition, this technical solution can also realize the standardization and modular operation of the controller based on the layout structure of the circuit board, which will completely change the operation and sales mode of the motor controller industry. It greatly saves the inventory of raw materials, semi-finished products and finished products, and greatly reduces the overall cost of products.

同时,本技术方案中将作为功率中心的第一电路板100的主要发热源的功率部分10a和发热量小的驱动部分10b分区布置,具体设计时,可将主要发热源的功率部分10a与散热件400接触,如图3所示,集中进行有效散热,并且将作为MCU控制中心的第二电路板200与发热量大的第一电路板100完全分离,叠层布置,一方面,直接从结构上进行热量传导隔绝,另一方面,此时的MCU与发热量大的功率元件错位布置,保证在极限紧凑的结构要求下,也能够有效避免MCU温度过高,从而保证电路板运行稳定;At the same time, in this technical solution, the power part 10a of the main heat source of the first circuit board 100 serving as the power center and the drive part 10b with small heat generation are arranged in partitions. In the specific design, the power part 10a of the main heat source can be separated from the heat dissipation part 10a. As shown in FIG. 3, effective heat dissipation is carried out in a concentrated manner, and the second circuit board 200 as the MCU control center is completely separated from the first circuit board 100 which generates a large amount of heat. On the other hand, at this time, the MCU and the power components with high heat generation are dislocated to ensure that under the extremely compact structure requirements, the MCU temperature can be effectively prevented from being too high, thereby ensuring the stable operation of the circuit board;

此外,将体积较大的电容300布置于第一电路板100侧表面的外侧,并且其长度方向轴线与第一电路板100的主表面相平行或重合,参照图4和图5所示,在竖直高度方向上电容300仅有用于电性连接的引脚与电路板重叠,其它主体部分与第一电路板100无任何重叠,其能够有效缩减电路板整体布局的竖直高度;并且将作为MCU控制中心的第二电路板200独立出来与驱动部分10b层叠,恰好空余出来空间尺寸部分,用来容纳电容300的体积,即:将作为MCU控制中心的第二电路板200独立出来叠层安装,不光是为了以上描述的模块化、标准化,和极限尺寸下实现物理隔热,也是为了置换出电容的安装空间,进一步降低电路板整体布局的竖直高度,从而能够极限降低整体电路板结构尺寸。In addition, the capacitor 300 with a larger volume is arranged on the outside of the side surface of the first circuit board 100, and its longitudinal axis is parallel or coincident with the main surface of the first circuit board 100. Referring to FIGS. 4 and 5, in In the vertical height direction, only the pins for electrical connection of the capacitor 300 overlap with the circuit board, and the other main parts do not overlap with the first circuit board 100, which can effectively reduce the vertical height of the overall layout of the circuit board; The second circuit board 200 of the MCU control center is independent and stacked with the driving part 10b, and the space size is just free to accommodate the volume of the capacitor 300, that is, the second circuit board 200 serving as the MCU control center is independently stacked and installed. , not only for the above-described modularization, standardization, and physical insulation under the limit size, but also to replace the installation space of the capacitor and further reduce the vertical height of the overall layout of the circuit board, so as to limit the overall circuit board structure size. .

参照图4,图5和图6所示,在垂直于电容300长度方向上,第一电路板100和/或第二电路板200的布置区域位于电容300的径向高度范围内。即:Referring to FIG. 4 , FIG. 5 and FIG. 6 , in the direction perpendicular to the length of the capacitor 300 , the arrangement area of the first circuit board 100 and/or the second circuit board 200 is located within the radial height range of the capacitor 300 . which is:

参照图6所示,电容300具有沿长度方向的中心截面S1,其截面S1的上限线L1和下限线L2组合构成了第一电路板100和/或第二电路板200的布置区域;具体地,当布置第一电路板100时,第一电路板100布置时最低不会低于下限线L2,最高不会超过上限线L1;同样;当布置第二电路板100时,第二电路板200布置时最低不会低于下限线L2,最高不会超过上限线L1;更好的;当第二电路板200与第一电路板100对应层叠时,二者均最低不会低于下限线L2,最高不会超过上限线L1,于是,电容300截面S1的上限线L1和下限线L2基本就限定了该电路板布局结构的整体高度,很显然,该布局结构在整体的竖直高度上明显降低,布局结构的高度已然是极限状态。Referring to FIG. 6 , the capacitor 300 has a central section S1 along the length direction, and the upper limit line L1 and the lower limit line L2 of the section S1 combine to form the arrangement area of the first circuit board 100 and/or the second circuit board 200 ; specifically , when the first circuit board 100 is arranged, the first circuit board 100 will not be lower than the lower limit line L2 at the lowest level, and the highest will not exceed the upper limit line L1; similarly; when the second circuit board 100 is arranged, the second circuit board 200 In the arrangement, the lowest will not be lower than the lower limit line L2, and the highest will not exceed the upper limit line L1; better; when the second circuit board 200 and the first circuit board 100 are stacked correspondingly, the lowest of both will not be lower than the lower limit line L2. , the maximum will not exceed the upper limit line L1. Therefore, the upper limit line L1 and the lower limit line L2 of the section S1 of the capacitor 300 basically limit the overall height of the circuit board layout structure. Obviously, the layout structure is obvious in the overall vertical height. Lowering, the height of the layout structure is already the limit state.

参照图1,图3和图7,图8所示,驱动部分10b和电容300位于功率部分10a的同一侧,如图示中的左侧;具体地,功率部分10a的一侧(如左侧)局部向外延伸突出形成驱动部分10b,该侧(左侧)其余部分与驱动部分10b组合形成虚拟平面,电容300布置于虚拟平面S2内。1, 3 and 7, as shown in FIG. 8, the driving part 10b and the capacitor 300 are located on the same side of the power part 10a, such as the left side in the figure; ) partially protrudes outward to form the driving portion 10b, the rest of the side (left side) is combined with the driving portion 10b to form a virtual plane, and the capacitor 300 is arranged in the virtual plane S2.

当然,驱动部分10b和电容300还可以位于功率部分10a的相对的两侧,具体参照图9所示。Of course, the driving part 10b and the capacitor 300 may also be located on opposite sides of the power part 10a, as shown in FIG. 9 for details.

另外,电容300包括电容本体300a和引脚300b,其电容本体300a在垂直于第一电路板100主表面的方向上的投影与第一电路板100和/或第二电路板200在该方向上的投影无重合。In addition, the capacitor 300 includes a capacitor body 300a and a lead 300b, and the projection of the capacitor body 300a in a direction perpendicular to the main surface of the first circuit board 100 is the same as that of the first circuit board 100 and/or the second circuit board 200 in this direction projections are not coincident.

请继续参照图8所示,电路板布局结构至少包括第一电路板100,第二电路板200和电容300;Please continue to refer to FIG. 8 , the circuit board layout structure includes at least a first circuit board 100 , a second circuit board 200 and a capacitor 300 ;

第一电路板100包括电性连接的功率部分10a和驱动部分10b,功率部分10a包括多个功率元件,如mos管;The first circuit board 100 includes a power part 10a and a driving part 10b that are electrically connected, and the power part 10a includes a plurality of power elements, such as MOS tubes;

电容300包括电容本体300a和引脚300b,电容本体300a通过引脚300b与第一电路板100电性连接,且电容本体300a平躺地设置于第一电路板100的外侧;即,电容300除引脚300b与第一电路板100有重叠之外,其电容本体300a与与第一电路板100无任何重叠;The capacitor 300 includes a capacitor body 300a and a pin 300b. The capacitor body 300a is electrically connected to the first circuit board 100 through the pin 300b, and the capacitor body 300a is laid flat on the outside of the first circuit board 100; Except that the pin 300b overlaps with the first circuit board 100, the capacitor body 300a has no overlap with the first circuit board 100;

其中,电容300为大体积电子器件,一般呈圆柱体形状,电容本体300a平躺布置时,能减小电路板布局结构的整体高度。The capacitor 300 is a large-volume electronic device, generally in the shape of a cylinder. When the capacitor body 300a is laid flat, the overall height of the circuit board layout structure can be reduced.

第二电路板200包括MCU,第二电路板200对应层叠于第一电路板100的驱动部分10b并与之电性连接,且与功率元件10a无重叠。The second circuit board 200 includes an MCU, and the second circuit board 200 is correspondingly stacked on the driving part 10b of the first circuit board 100 and electrically connected thereto, and does not overlap with the power element 10a.

此技术方案同样具备上述方案记载的实现控制器模块化、标准化设计,加快方案替换速度,降低方案替换成本;缩短项目开发周期;降低产品综合成本的有益技术效果,同时,也能够满足在极限尺寸下实现物理隔热,保证MCU的运行稳定;此外,电容和第二电路板空间置换,进一步压缩总体尺寸。This technical solution also has the beneficial technical effects of realizing the modular and standardized design of the controller recorded in the above-mentioned solution, accelerating the speed of solution replacement, reducing the cost of solution replacement, shortening the project development cycle, and reducing the overall cost of the product. In addition, the space of the capacitor and the second circuit board is replaced to further reduce the overall size.

参照图10所示,第一电路板100包括具有第一面积S1的第一区域100a和具有第二面积S2的第二区域100b,第一区域100a和第二区域100b组合构成一L型缺口100c,驱动部分10a布置于第一区域100a,功率部分10b布置于第二区域100b,电容300布置于缺口100c中;其中,S1<S2。Referring to FIG. 10, the first circuit board 100 includes a first area 100a having a first area S1 and a second area 100b having a second area S2, the first area 100a and the second area 100b are combined to form an L-shaped notch 100c , the driving part 10a is arranged in the first area 100a, the power part 10b is arranged in the second area 100b, and the capacitor 300 is arranged in the gap 100c; wherein, S1<S2.

第二电路板具有面积S3,其中,S3≦S1。The second circuit board has an area S3, where S3≦S1.

第一电路板100和/或第二电路板200在层叠方向上的布置区域位于电容300的垂直高度范围内。The arrangement area of the first circuit board 100 and/or the second circuit board 200 in the stacking direction is within the vertical height range of the capacitor 300 .

即,参照图6所示,电容300具有沿长度方向的中心截面S1,其截面S1的上限线L1和下限线L2组合构成了第一电路板100和/或第二电路板200的布置区域;具体地,当布置第一电路板100时,第一电路板100布置时最低不会低于下限线L2,最高不会超过上限线L1;同样;当布置第二电路板100时,第二电路板200布置时最低不会低于下限线L2,最高不会超过上限线L1;更好的;当第二电路板200与第一电路板100对应层叠时,二者均最低不会低于下限线L2,最高不会超过上限线L1,于是,电容300截面S1的上限线L1和下限线L2基本就限定了该电路板布局结构的整体高度,很显然,该布局结构在整体的竖直高度上明显降低,布局结构的高度已然是极限状态。That is, as shown in FIG. 6 , the capacitor 300 has a central cross section S1 along the length direction, and the upper limit line L1 and the lower limit line L2 of the cross section S1 combine to form the arrangement area of the first circuit board 100 and/or the second circuit board 200; Specifically, when the first circuit board 100 is arranged, the first circuit board 100 will not be lower than the lower limit line L2 at the lowest level, and will not exceed the upper limit line L1 at the highest level; similarly; when the second circuit board 100 is arranged, the second circuit When the board 200 is arranged, the minimum value will not be lower than the lower limit line L2, and the maximum value will not exceed the upper limit line L1; better; when the second circuit board 200 and the first circuit board 100 are stacked correspondingly, the minimum value of both will not be lower than the lower limit line L1. Line L2, the highest will not exceed the upper limit line L1, so the upper limit line L1 and the lower limit line L2 of the section S1 of the capacitor 300 basically limit the overall height of the circuit board layout structure. Obviously, the layout structure is in the overall vertical height. The height of the layout structure is already the limit state.

此外,本申请还涉及基于该电路板布局结构的无刷控制器。In addition, the present application also relates to a brushless controller based on the circuit board layout structure.

该无刷控制器至少包括第一电路板100和第二电路板200,以及滤波电容300;The brushless controller at least includes a first circuit board 100, a second circuit board 200, and a filter capacitor 300;

第一电路板100包括电性连接的功率部分10a和驱动部分10b,功率部分10b包括多个功率元件,如mos管;The first circuit board 100 includes a power part 10a and a driving part 10b that are electrically connected, and the power part 10b includes a plurality of power elements, such as MOS tubes;

滤波电容300平躺于第一电路板100的外侧并与之电性连接;The filter capacitor 300 is lying on the outer side of the first circuit board 100 and is electrically connected with it;

第二电路板200包括MCU,第二电路板200对应层叠于第一电路板100的驱动部分10b并与之电性连接;The second circuit board 200 includes an MCU, and the second circuit board 200 is correspondingly stacked on the driving part 10b of the first circuit board 100 and is electrically connected to it;

电源电路包括具有第一标称电压V1的第一电源电路和具有第二标称电压V2的第二电源电路;The power supply circuit includes a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2;

第一电源电路布置于第一电路板100上,第二电源电路布置于第二电路板200上,其中;V1>V2。The first power supply circuit is arranged on the first circuit board 100, and the second power supply circuit is arranged on the second circuit board 200, wherein: V1>V2.

该无刷控制器具有上述电路板布局结构的所有有益技术效果,如体积小、运行稳定等,在此不再赘述;除此之外,将电源电路设计为具有第一标称电压V1的第一电源电路和具有第二标称电压V2的第二电源电路;将第一电源电路布置于第一电路板上,用于第一电路板电源,第二电源电路布置于第二电路板上,用于第二电路板电源,其中;V1>V2;可以减少第一电路板与第二电路板之间的电性连接线。The brushless controller has all the beneficial technical effects of the above-mentioned circuit board layout structure, such as small size, stable operation, etc., which will not be repeated here; in addition, the power supply circuit is designed to have a first nominal voltage V1. a power supply circuit and a second power supply circuit with a second nominal voltage V2; the first power supply circuit is arranged on the first circuit board for the power supply of the first circuit board, and the second power supply circuit is arranged on the second circuit board, It is used for the power supply of the second circuit board, wherein: V1>V2; the electrical connection lines between the first circuit board and the second circuit board can be reduced.

具体到,上述第一电源电路为15V电源电路,第二电源电路为5V电容电路。Specifically, the first power supply circuit is a 15V power supply circuit, and the second power supply circuit is a 5V capacitor circuit.

第二电路板200至少通过18根电连接线与第一电路板100相连。The second circuit board 200 is connected to the first circuit board 100 through at least 18 electrical connecting wires.

第二电路板200与第一电路板100电性连接网络包括:The second circuit board 200 and the first circuit board 100 are electrically connected to the network including:

VCC端口,其为第一电路板的电源输入正极,用于第二电路板对第一电路板输入电源电压检测;The VCC port, which is the positive pole of the power input of the first circuit board, is used for the second circuit board to detect the input power supply voltage of the first circuit board;

GND端口,其为第一电路板的电源输入负极,用于第二电路板负极接地;GND port, which is the power input negative pole of the first circuit board, and is used for grounding the negative pole of the second circuit board;

DC端口,其为第一电路板电源端口,用于第二电路板对第一电路板电源电压检测;The DC port, which is the power port of the first circuit board, is used for the second circuit board to detect the power supply voltage of the first circuit board;

P_PowerLock端口,其为第一电路板电源控制脚,用于第二电路板对第一电路板的电源控制;P_PowerLock port, which is the power control pin of the first circuit board, used for the power control of the second circuit board to the first circuit board;

NO_IO端口,其为第一电路板开关常闭端检测端口,用于第二电路板对第一电路板开关常闭端检测;NO_IO port, which is the normally closed terminal detection port of the first circuit board switch, used for the second circuit board to detect the normally closed terminal of the first circuit board switch;

NC_IO端口,其为第一电路板开关常开端检测端口,用于第二电路板对第一电路板开关常开端检测;NC_IO port, which is the normally open end detection port of the first circuit board switch, used for the second circuit board to detect the normally open end of the first circuit board switch;

TempFET端口,其为第一电路板MOS温度检测端口,用于第二电路板对第一电路板的MOS温度检测;TempFET port, which is the MOS temperature detection port of the first circuit board, used for the MOS temperature detection of the first circuit board by the second circuit board;

EMF_U端口,其为第一电路板输出相线U检测端口,用于第二电路板对输出相线U的检测;EMF_U port, which is the first circuit board output phase line U detection port, used for the second circuit board to detect the output phase line U;

EMF_V端口,其为第一电路板输出相线V检测端口,用于第二电路板对输出相线V的检测;EMF_V port, which is the first circuit board output phase line V detection port, used for the second circuit board to detect the output phase line V;

EMF_W端口,其为第一电路板输出相线W检测端口,用于第二电路板对输出相线W的检测;EMF_W port, which is the first circuit board output phase line W detection port, used for the second circuit board to detect the output phase line W;

PWM1H端口,其为第一电路板上桥一控制端口,用于第二电路板对第一电路板上桥一的控制;PWM1H port, which is the bridge-one control port on the first circuit board, used for the second circuit board to control the bridge-one on the first circuit board;

PWM2H端口,其为第一电路板上桥二控制端口,用于第二电路板对第一电路板上桥二的控制;The PWM2H port, which is the bridge two control port on the first circuit board, is used for the second circuit board to control the bridge two on the first circuit board;

PWM3H端口,其为第一电路板上桥三控制端口,用于第二电路板对第一电路板上桥三的控制;The PWM3H port, which is the bridge three control port on the first circuit board, is used for the second circuit board to control the bridge three on the first circuit board;

PWM1L端口,其为第一电路板下桥一控制端口,用于第二电路板对第一电路板下桥一的控制;PWM1L port, which is a control port of the lower bridge of the first circuit board, used for the control of the lower bridge of the first circuit board by the second circuit board;

PWM2L端口,其为第一电路板下桥二控制端口,用于第二电路板对第一电路板下桥二的控制;The PWM2L port, which is the second control port of the lower bridge of the first circuit board, is used for the control of the second circuit board to the second lower bridge of the first circuit board;

PWM3L端口,其为第一电路板下桥三控制端口,用于第二电路板对第一电路板下桥三的控制;PWM3L port, which is the lower bridge three control port of the first circuit board, used for the second circuit board to control the lower bridge three of the first circuit board;

OPI_P端口,其为第一电路板电流检测信号P端口,用于第二电路板对功率电流信号P的检测;OPI_P port, which is the first circuit board current detection signal P port, used for the second circuit board to detect the power current signal P;

OPI_N端口,其为第一电路板电流检测信号N端口,用于第二电路板对功率电流信号N的检测。The OPI_N port is the first circuit board current detection signal N port, which is used for the second circuit board to detect the power current signal N.

最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明实施例技术方案的范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some or all of the technical features thereof are equivalently replaced; these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (12)

1.一种电路板布局结构,其特征在于,包括:1. a circuit board layout structure, is characterized in that, comprises: 第一电路板,其包括布置于其主表面上电性连接的功率部分和驱动部分,所述功率部分包括多个功率元件且与所述驱动部分分区布置;a first circuit board, which includes a power part and a driving part arranged on a main surface thereof and electrically connected, the power part includes a plurality of power elements and is arranged in a partition with the driving part; 电容,其位于所述第一电路板侧表面的外侧并与之电性连接,且其长度方向轴线与所述第一电路板的主表面相平行或重合;a capacitor, which is located on the outer side of the side surface of the first circuit board and is electrically connected to it, and whose longitudinal axis is parallel or coincident with the main surface of the first circuit board; 第二电路板,其包括MCU,所述第二电路板对应层叠于所述第一电路板的驱动部分并与之电性连接。The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board. 2.根据权利要求1所述的电路板布局结构,其特征在于:在垂直于所述电容长度方向上,所述第一电路板和/或所述第二电路板的布置区域位于所述电容的径向高度范围内。2 . The circuit board layout structure according to claim 1 , wherein in a direction perpendicular to the length of the capacitor, the layout area of the first circuit board and/or the second circuit board is located in the capacitor. 3 . within the radial height range. 3.根据权利要求1所述的电路板布局结构,其特征在于:所述驱动部分和所述电容位于所述功率部分的同一侧或相对的两侧。3 . The circuit board layout structure according to claim 1 , wherein the driving part and the capacitor are located on the same side or opposite sides of the power part. 4 . 4.根据权利要求3所述的电路板布局结构,其特征在于:所述功率部分的一侧局部向外延伸突出形成所述驱动部分,该侧其余部分与所述驱动部分组合形成虚拟平面,所述电容布置于所述虚拟平面内。4 . The circuit board layout structure according to claim 3 , wherein one side of the power portion partially extends outward to form the driving portion, and the remaining portion of the side is combined with the driving portion to form a virtual plane, 5 . The capacitors are arranged in the virtual plane. 5.根据权利要求1所述的电路板布局结构,其特征在于:所述电容包括电容本体和引脚,其电容本体在垂直于所述第一电路板主表面的方向上的投影与所述第一电路板和/或所述第二电路板在该方向上的投影无重合。5. The circuit board layout structure according to claim 1, wherein the capacitor comprises a capacitor body and pins, and the projection of the capacitor body in a direction perpendicular to the main surface of the first circuit board is the same as that of the capacitor body. The projections of the first circuit board and/or the second circuit board in this direction do not overlap. 6.一种电路板布局结构,其特征在于,包括:6. A circuit board layout structure, comprising: 第一电路板,其包括电性连接的功率部分和驱动部分,所述功率部分包括多个功率元件;a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements; 电容,其包括电容本体和引脚,所述电容本体通过所述引脚与所述第一电路板电性连接,且所述电容本体平躺地设置于所述第一电路板的外侧;a capacitor, which includes a capacitor body and pins, the capacitor body is electrically connected to the first circuit board through the pins, and the capacitor body is laid flat on the outside of the first circuit board; 第二电路板,其包括MCU,所述第二电路板对应层叠于所述第一电路板的驱动部分并与之电性连接,且与所述功率元件无重叠。The second circuit board includes an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board, and does not overlap with the power element. 7.根据权利要求6所述的电路板布局结构,其特征在于:所述第一电路板包括具有第一面积S1的第一区域和具有第二面积S2的第二区域,所述第一区域和所述第二区域组合构成一L型缺口,所述驱动部分布置于所述第一区域,所述功率部分布置于所述第二区域,所述电容布置于所述缺口中;其中,S1<S2。7. The circuit board layout structure according to claim 6, wherein the first circuit board comprises a first area with a first area S1 and a second area with a second area S2, the first area In combination with the second area, an L-shaped notch is formed, the driving part is arranged in the first area, the power part is arranged in the second area, and the capacitor is arranged in the notch; wherein, S1 <S2. 8.根据权利要求7所述的电路板布局结构,其特征在于:所述第二电路板具有面积S3,其中,S3≦S1。8. The circuit board layout structure according to claim 7, wherein the second circuit board has an area S3, wherein S3≦S1. 9.根据权利要求6所述的电路板布局结构,其特征在于:所述第一电路板和/或所述第二电路板在层叠方向上的布置区域位于所述电容的垂直高度范围内。9 . The circuit board layout structure according to claim 6 , wherein the arrangement area of the first circuit board and/or the second circuit board in the stacking direction is within the vertical height range of the capacitor. 10 . 10.一种无刷控制器,其特征在于,包括:10. A brushless controller, comprising: 第一电路板,其包括电性连接的功率部分和驱动部分,所述功率部分包括多个功率元件;a first circuit board, which includes a power part and a driving part that are electrically connected, and the power part includes a plurality of power elements; 滤波电容,其平躺于所述第一电路板的外侧并与之电性连接;a filter capacitor, which is lying on the outside of the first circuit board and is electrically connected to it; 第二电路板,其包括MCU,所述第二电路板对应层叠于所述第一电路板的驱动部分并与之电性连接;a second circuit board, comprising an MCU, the second circuit board is correspondingly stacked on and electrically connected to the driving part of the first circuit board; 电源电路,其包括具有第一标称电压V1的第一电源电路和具有第二标称电压V2的第二电源电路;a power supply circuit comprising a first power supply circuit with a first nominal voltage V1 and a second power supply circuit with a second nominal voltage V2; 所述第一电源电路布置于所述第一电路板上,所述第二电源电路布置于所述第二电路板上,其中;V1>V2。The first power supply circuit is arranged on the first circuit board, and the second power supply circuit is arranged on the second circuit board, wherein: V1>V2. 11.根据权利要求10所述的无刷控制器,其特征在于:所述第二电路板至少通过18根电连接线与所述第一电路板相连。11. The brushless controller according to claim 10, wherein the second circuit board is connected to the first circuit board through at least 18 electrical connecting wires. 12.根据权利要求11所述的无刷控制器,其特征在于:所述第二电路板与所述第一电路板电性连接网络包括:12 . The brushless controller of claim 11 , wherein the electrical connection network between the second circuit board and the first circuit board comprises: 12 . VCC端口,其为第一电路板的电源输入正极,用于第二电路板对第一电路板输入电源电压检测;The VCC port, which is the positive pole of the power input of the first circuit board, is used for the second circuit board to detect the input power supply voltage of the first circuit board; GND端口,其为第一电路板的电源输入负极,用于第二电路板负极接地;GND port, which is the power input negative pole of the first circuit board, and is used for grounding the negative pole of the second circuit board; DC端口,其为第一电路板电源端口,用于第二电路板对第一电路板电源电压检测;The DC port, which is the power port of the first circuit board, is used for the second circuit board to detect the power supply voltage of the first circuit board; P_PowerLock端口,其为第一电路板电源控制脚,用于第二电路板对第一电路板的电源控制;P_PowerLock port, which is the power control pin of the first circuit board, used for the power control of the second circuit board to the first circuit board; NO_IO端口,其为第一电路板开关常闭端检测端口,用于第二电路板对第一电路板开关常闭端检测;NO_IO port, which is the normally closed terminal detection port of the first circuit board switch, used for the second circuit board to detect the normally closed terminal of the first circuit board switch; NC_IO端口,其为第一电路板开关常开端检测端口,用于第二电路板对第一电路板开关常开端检测;NC_IO port, which is the normally open end detection port of the first circuit board switch, used for the second circuit board to detect the normally open end of the first circuit board switch; TempFET端口,其为第一电路板MOS温度检测端口,用于第二电路板对第一电路板的MOS温度检测;TempFET port, which is the MOS temperature detection port of the first circuit board, used for the MOS temperature detection of the first circuit board by the second circuit board; EMF_U端口,其为第一电路板输出相线U检测端口,用于第二电路板对输出相线U的检测;EMF_U port, which is the first circuit board output phase line U detection port, used for the second circuit board to detect the output phase line U; EMF_V端口,其为第一电路板输出相线V检测端口,用于第二电路板对输出相线V的检测;EMF_V port, which is the first circuit board output phase line V detection port, used for the second circuit board to detect the output phase line V; EMF_W端口,其为第一电路板输出相线W检测端口,用于第二电路板对输出相线W的检测;EMF_W port, which is the first circuit board output phase line W detection port, used for the second circuit board to detect the output phase line W; PWM1H端口,其为第一电路板上桥一控制端口,用于第二电路板对第一电路板上桥一的控制;PWM1H port, which is the bridge-one control port on the first circuit board, used for the second circuit board to control the bridge-one on the first circuit board; PWM2H端口,其为第一电路板上桥二控制端口,用于第二电路板对第一电路板上桥二的控制;The PWM2H port, which is the bridge two control port on the first circuit board, is used for the second circuit board to control the bridge two on the first circuit board; PWM3H端口,其为第一电路板上桥三控制端口,用于第二电路板对第一电路板上桥三的控制;The PWM3H port, which is the bridge three control port on the first circuit board, is used for the second circuit board to control the bridge three on the first circuit board; PWM1L端口,其为第一电路板下桥一控制端口,用于第二电路板对第一电路板下桥一的控制;PWM1L port, which is a control port of the lower bridge of the first circuit board, used for the control of the lower bridge of the first circuit board by the second circuit board; PWM2L端口,其为第一电路板下桥二控制端口,用于第二电路板对第一电路板下桥二的控制;The PWM2L port, which is the second control port of the lower bridge of the first circuit board, is used for the control of the second circuit board to the second lower bridge of the first circuit board; PWM3L端口,其为第一电路板下桥三控制端口,用于第二电路板对第一电路板下桥三的控制;PWM3L port, which is the lower bridge three control port of the first circuit board, used for the second circuit board to control the lower bridge three of the first circuit board; OPI_P端口,其为第一电路板电流检测信号P端口,用于第二电路板对功率电流信号P的检测;OPI_P port, which is the first circuit board current detection signal P port, used for the second circuit board to detect the power current signal P; OPI_N端口,其为第一电路板电流检测信号N端口,用于第二电路板对功率电流信号N的检测。The OPI_N port is the first circuit board current detection signal N port, which is used for the second circuit board to detect the power current signal N.
CN202011522328.1A 2020-12-22 2020-12-22 Circuit board layout structure and brushless controller Pending CN114666967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011522328.1A CN114666967A (en) 2020-12-22 2020-12-22 Circuit board layout structure and brushless controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011522328.1A CN114666967A (en) 2020-12-22 2020-12-22 Circuit board layout structure and brushless controller

Publications (1)

Publication Number Publication Date
CN114666967A true CN114666967A (en) 2022-06-24

Family

ID=82024954

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011522328.1A Pending CN114666967A (en) 2020-12-22 2020-12-22 Circuit board layout structure and brushless controller

Country Status (1)

Country Link
CN (1) CN114666967A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119072000A (en) * 2024-11-07 2024-12-03 深圳市柠檬光子科技有限公司 Circuit heat dissipation device and electronic equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700795B1 (en) * 2002-01-23 2004-03-02 Yazaki North America Scalable, modular architecture for automotive power distribution and body control functions
CN1988345A (en) * 2005-10-25 2007-06-27 惠普开发有限公司 Power converter comprising a controller and a power component mounted on separate circuit boards
US20090156025A1 (en) * 2007-12-17 2009-06-18 Hipro Electronics Co., Ltd. Electronic apparatus with a pin mount
CN104968145A (en) * 2015-06-19 2015-10-07 中山海科力电子有限公司 Circuit board device
CN213818337U (en) * 2020-12-22 2021-07-27 谢渊斌 Circuit board layout structure and brushless controller

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700795B1 (en) * 2002-01-23 2004-03-02 Yazaki North America Scalable, modular architecture for automotive power distribution and body control functions
CN1988345A (en) * 2005-10-25 2007-06-27 惠普开发有限公司 Power converter comprising a controller and a power component mounted on separate circuit boards
US20090156025A1 (en) * 2007-12-17 2009-06-18 Hipro Electronics Co., Ltd. Electronic apparatus with a pin mount
CN104968145A (en) * 2015-06-19 2015-10-07 中山海科力电子有限公司 Circuit board device
CN213818337U (en) * 2020-12-22 2021-07-27 谢渊斌 Circuit board layout structure and brushless controller

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119072000A (en) * 2024-11-07 2024-12-03 深圳市柠檬光子科技有限公司 Circuit heat dissipation device and electronic equipment

Similar Documents

Publication Publication Date Title
US7275935B2 (en) Universal backplane connection or computer storage chassis
CN108022899A (en) Power module having lead member and method of manufacturing the same
US20090273908A1 (en) Network transformer, network module thereof, and electronic device thereof
KR20040070073A (en) An improved usb memory storage apparatus
CN114666967A (en) Circuit board layout structure and brushless controller
TW202127185A (en) Computer power supply assembly and manufacturing method thereof
JP2009182330A (en) Printed circuit board, semiconductor package, card and electronic system
CN210428132U (en) Master-slave control circuit structure of high-power multiphase motor servo drive system
CN213818337U (en) Circuit board layout structure and brushless controller
WO2024124981A1 (en) Power source and computing device
CN101572177B (en) Network transformer and network module and electronic device using network transformer
CN219176613U (en) Fan switching circuit board and fan module
JP4468614B2 (en) Power semiconductor device
CN113506793B (en) Integrated circuit with isolated interface and packaging method thereof
CN216290724U (en) Semiconductor circuit having a plurality of transistors
CN112510990A (en) Filter circuit design method, filter circuit and module
CN209570932U (en) PCI expansion device
CN218447229U (en) Solid state disk based on BGA encapsulation
CN210431286U (en) High-power multiphase motor servo drive system circuit structure
CN221380798U (en) Three-phase motor drive device, three-phase motor system and electronic equipment
CN111624923B (en) Low-voltage high-power controller structure
TWI600235B (en) Filter module structure
JP2021027145A (en) Semiconductor module
CN221979042U (en) Packaged Optical Fabric Switches
CN102969292A (en) Integrated power module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20220624