CN114665253A - Antenna module and production method thereof - Google Patents
Antenna module and production method thereof Download PDFInfo
- Publication number
- CN114665253A CN114665253A CN202210477137.0A CN202210477137A CN114665253A CN 114665253 A CN114665253 A CN 114665253A CN 202210477137 A CN202210477137 A CN 202210477137A CN 114665253 A CN114665253 A CN 114665253A
- Authority
- CN
- China
- Prior art keywords
- antenna
- circuit board
- flexible circuit
- radio frequency
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000003292 glue Substances 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- PEZNEXFPRSOYPL-UHFFFAOYSA-N (bis(trifluoroacetoxy)iodo)benzene Chemical compound FC(F)(F)C(=O)OI(OC(=O)C(F)(F)F)C1=CC=CC=C1 PEZNEXFPRSOYPL-UHFFFAOYSA-N 0.000 claims description 3
- 230000005404 monopole Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 9
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/525—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between emitting and receiving antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Aerials (AREA)
Abstract
The invention provides an antenna module which comprises a first flexible circuit board, a second flexible circuit board electrically connected with the first flexible circuit board, a radio frequency front end chip welded in the second flexible circuit board and an antenna, wherein the antenna is fixed on the first flexible circuit board and electrically connected with the radio frequency front end chip, a bonding pad is arranged on one side, close to the second flexible circuit board, of the first flexible circuit board, and the radio frequency front end chip is welded on the bonding pad in a bare chip flip-chip mode. The antenna module can improve the receiving sensitivity of the antenna, reduce the power consumption and improve the endurance time of the battery; compared with the prior design, the radio frequency front-end circuit can save 15% of area, save one layer of substrate, reduce metal shielding covers and reduce the height of the radio frequency front-end circuit by about 0.5 mm.
Description
Technical Field
The invention relates to an antenna module and a production method thereof.
Background
The built-in antenna is one of the more key hardware of smart phones, and functions such as conversation, internet surfing, Bluetooth transmission, GPS positioning and the like are realized through the antenna. As mobile phones become smaller and lighter, the size and signal transmitting/receiving capability of the antenna are also required. Yuan Tao Ph improves the structure of the Antenna in several papers, such as Zhang, X, Tan, T.Y., Wu, Q.S., Zhu, L., Zhong, S., & Yuan, T. (2021), Pin-loaded Patch Antenna with a Dual-mode SIW modifier for band Antenna and stationary High-impedance Antennas 20(2),279, U.S. G.L., Sim, C.Y.D., Liang, S.Y., Liao, W.S. & Yuan, T. (2018), Low-flexibility RFID for High-impedance Antenna, K.D. K.S. and D.S. (I.D., K.D. J., K.D. D. D.S. J.S. Pat. No. 8, K.D. D. D.S. D. D.S.S. Pat. No. D. Pat. D. Pat. No. D. Pat. No. D.S.S. D. Pat. No. D. H.S. No. 8, Li.S. Pat. D. Pat. D. No. D. 4, K. D. 3, K. D. 4, K. D. Pat. No. 3, K. A. A Han, C.Z., Huang, G.L., Yuan, T., & Hong, W. (2018) A frequency-configurable tuner-loaded coupled-fed frame-anti-enna for all-metal-shell handing, IEEE Access,6, 64041-.
With the increase of frequency bands and the wide use of MIMO and CA, the number of parts of the radio frequency front end and the antenna of the 5G mobile phone is increased/the complexity is greatly improved, and the radio frequency front end and the antenna space are further compressed by the extremely high appearance and high-capacity battery requirements. The urgent need for small size and high performance has led to the development of antennas and rf front-ends towards modularity.
Accordingly, there is a need for an improved antenna module to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide an antenna module to solve the problem that the radio frequency front end and the antenna occupy larger space in the prior art.
In order to achieve the above object, the present invention provides an antenna module, which includes a first flexible circuit board, a second flexible circuit board electrically connected to the first flexible circuit board, a radio frequency front end chip welded in the second flexible circuit board, and an antenna, wherein the antenna is fixed on the first flexible circuit board and electrically connected to the radio frequency front end chip, a bonding pad is disposed on one side of the first flexible circuit board close to the second flexible circuit board, and the radio frequency front end chip is flip-chip welded on the bonding pad in a bare chip manner.
As a further improvement of the present invention, the first flexible circuit board and the second flexible circuit board are FPC boards or LCP boards.
As a further improvement of the present invention, the first flexible circuit board and the second flexible circuit board are electrically connected by a ball-mounting method.
As a further improvement of the present invention, one or more of a capacitor, a resistor, and an inductor are embedded in the second flexible circuit board.
As a further improvement of the present invention, an accommodating cavity and a glue injection hole communicated with the accommodating cavity for injecting glue into the accommodating cavity are formed in the second flexible circuit board, and the radio frequency front end chip is accommodated in the accommodating cavity.
As a further improvement of the present invention, the antenna is in the form of one of a loop antenna, a monopole antenna, an IFA antenna, a PIFA antenna, a MIMO antenna, and an array antenna.
As a further improvement of the present invention, the rf front-end chip includes a transceiver module, and the transceiver module includes a first antenna tuning chip electrically connected to the antenna, a first rf switch electrically connected to the antenna, a duplexer electrically connected to the first rf switch, a power amplifier electrically connected to the duplexer, and a first low-noise amplifier.
As a further improvement of the present invention, the rf front-end chip includes a receiving module, and the receiving module includes a second antenna tuning chip electrically connected to the antenna, a second rf switch electrically connected to the antenna, a filter electrically connected to the second rf switch, and a second low-noise amplifier electrically connected to the filter.
The invention also provides a production method for forming the antenna module, which comprises the following steps:
s1: providing a first flexible circuit board, fixing the antenna on the first flexible circuit board, providing a second flexible circuit board, and forming an accommodating cavity and a glue injection hole communicated with the accommodating cavity on the second flexible circuit board for injecting glue into the accommodating cavity;
s2: welding a radio frequency front-end chip on the first flexible circuit board chip in a flip-chip mode by using a bare chip;
s3: electrically connecting the first flexible circuit board and the second flexible circuit board in a ball-planting mode, wherein the radio frequency front end chip is accommodated in the accommodating cavity;
s4: and injecting resin into the accommodating cavity through the glue injection hole.
As a further improvement of the present invention, one or more of a capacitor, a resistor, and an inductor are embedded in the second flexible circuit board provided in step S1, and are produced by a lamination process.
As a further improvement of the present invention, before step S1, the method further includes step S0: and designing an antenna and a radio frequency front-end chip according to the product requirement, and simulating according to the parameters of the antenna and the radio frequency front-end chip.
The invention has the beneficial effects that: the antenna module can improve the receiving sensitivity of the antenna, reduce the power consumption and improve the endurance time of the battery; compared with the existing design, the area can be saved by 15%, one layer of substrate is saved, the metal shielding cover is reduced, and the height of the radio frequency front-end circuit can be reduced by about 0.5 mm.
Drawings
Fig. 1 is a schematic structural diagram of an antenna module according to the present invention;
FIG. 2 is a schematic diagram of a RF front-end chip and an antenna structure of the antenna module according to the present invention;
fig. 3 is a flowchart of a method for producing the antenna module of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 to 2, the present invention provides an antenna module 100 used in a communication device, which is connected to a transceiver chip 201 on a main board 200 in the communication device through a radio frequency cable 202, wherein the antenna module 100 includes a first flexible circuit board 1, a second flexible circuit board 2 electrically connected to the first flexible circuit board 1, a radio frequency front end chip 3 soldered in the second flexible circuit board 2, and an antenna 4.
The first flexible circuit board 1 and the second flexible circuit board 2 are used for embedding circuits and components. The first flexible circuit board 1 and the second flexible circuit board 2 are FPC circuit boards or LCP circuit boards. When the LCP circuit board is selected, the dielectric constant is small, and the loss of high-frequency current is small; when the FPC circuit board is selected for use, the cost is lower.
One side of the first flexible circuit board 1 is provided with a bonding pad 11, and the antenna 4 is fixed on the other side. The side provided with the bonding pad 11 faces the second flexible circuit board 2, and the radio frequency front-end chip 3 is welded on the bonding pad 11 in a flip chip mode.
The radio frequency front-end chip 3 is fixed in a bare chip form, so that only one-time packaging is needed, the thickness and the size of the antenna module 100 are reduced, and the performance is better compared with the two-time packaging.
In this embodiment, the rf front-end chip 3 includes a transceiver module 31, the transceiver module 31 includes a first antenna tuning chip 311 electrically connected to the antenna 4, a first rf switch 312 electrically connected to the antenna 4, a duplexer 313 electrically connected to the first rf switch 312, a power amplifier 314 electrically connected to the duplexer 313, and a first low noise amplifier 315.
In other embodiments, the rf front-end chip 3 further includes a receiving module 32, and the receiving module 32 includes a second antenna tuning chip 321 electrically connected to the antenna 4, a second rf switch 322 electrically connected to the antenna 4, a filter 323 electrically connected to the second rf switch 322, and a second low noise amplifier 324 electrically connected to the filter 323.
The antenna 4 is one of a loop antenna, a monopole antenna, an IFA antenna, a PIFA antenna, a MIMO antenna, and an array antenna. The antenna 4 is used for receiving and radiating wireless signals. The signal transmitted by the radio frequency transmitting front-end chip 3 is radiated out through the antenna 4; the spatial wireless signal is received by the antenna 4 and then transmitted to the radio frequency receiving front-end chip 3.
The first antenna tuning chip 311 and the second antenna tuning chip 321 are used for optimizing the performance of the antenna 4 and are located between the antenna 4 and the radio frequency front end chip. By switching between the different states, the performance of the antenna 4 is optimized.
The first rf switch 312 and the second rf switch 322 are used for selecting rf signals, and are generally located between the rf front-end chip and the first tuning chip 311 or the antenna 4/the second tuning chip 311 or the antenna 4. And selecting corresponding signals according to the requirement of the working frequency.
The duplexer 313 is disposed between the first rf switch 312 and the power amplifier 314, and is used for filtering the received/transmitted signal and isolating the received/transmitted signal.
The filter 323 is disposed between the second rf switch 322 and the second low noise amplifier 324, and is used for filtering the received signal.
The power amplifier 314 is electrically connected to the duplexer 313, and is configured to amplify the transmit signal.
For the transceiver module 31, the duplexer 313 or the power amplifier 314 is integrated into the antenna module 100, so that the signal received by the antenna 4 passes through the first radio frequency switch 312 to select the corresponding duplexer 313 or the first low noise amplifier 315 according to the channel of the received signal, and the weak signal is amplified by the first low noise amplifier 315 and then enters the radio frequency cable 202 to be transmitted to the transceiver chip 201 of the communication device, thereby effectively improving the receiving sensitivity. Instead of the signal of antenna 4 directly through rf cable 202, causing power loss. The first antenna tuning chip 311 is electrically connected to the antenna 4 to improve the performance of the antenna 4.
The small transmission signal output by the transceiver chip 201 is transmitted on the rf cable 202, and the energy loss is much smaller than that of the amplified signal. The topological structure can reduce the length of the wire, is closer to the antenna 4, reduces energy loss, improves receiving sensitivity, reduces power consumption and improves the endurance time of a battery of the communication equipment.
The transceiver module 31 and the receiving module 32 have the same working principle, and can effectively improve the receiving sensitivity by reducing the intermediate loss during transmitting and receiving, improve the transmitting and receiving performance, and have better communication and data communication effects.
One or more of a capacitor 22, a resistor 21 and an inductor 23 are embedded in the second flexible circuit board 2. In this embodiment, the capacitor 22, the resistor 21, and the inductor 23 are embedded in the second flexible printed circuit board 2.
And a containing cavity and a glue injection hole communicated with the containing cavity and used for injecting glue into the containing cavity are formed in the second flexible circuit board 2.
The opening of the accommodating cavity faces the first flexible circuit board 1, and when the second flexible circuit board 2 is connected with the first flexible circuit board 1, the radio frequency front-end chip 3 is accommodated in the accommodating cavity. And then injecting glue into the accommodating cavity through the glue injection hole, so that the effect of packaging the radio frequency front end chip 3 can be realized.
The first flexible circuit board 1 and the second flexible circuit board 2 are electrically connected in a ball-planting 12 mode. Namely, the first flexible circuit board 1 and the second flexible circuit board 2 are provided with interconnection ports, so that the first flexible circuit board 1 and the second flexible circuit board 2 are electrically connected.
The method for producing the antenna module 100 of the present invention comprises the following steps:
s0: according to product requirements, an antenna 4 and a radio frequency front end chip 3 are designed, simulation is carried out according to parameters of the antenna 4 and the radio frequency front end chip 3, and a topological structure and matching are determined.
S1: providing a first flexible circuit board 1, fixing the antenna 4 on the first flexible circuit board 1, providing a second flexible circuit board 2, and forming an accommodating cavity and a glue injection hole communicated with the accommodating cavity on the second flexible circuit board 2 for injecting glue into the accommodating cavity. One or more of the capacitor 22, the resistor 21 and the inductor 23 are embedded in the second flexible circuit board 2 provided in step S1, and the second flexible circuit board 2 is produced by a lamination process, and includes an electromagnetic shield.
The embedded resistor 21 is formed as follows: the resistor 21 material is embedded into the second flexible circuit board 2, the corresponding flexible circuit board dielectric material layer is thinned, the function of the resistor 21 is realized after the flexible circuit board is pressed, and the resistors 21 with different resistance values are realized by adjusting the material quantity of the resistor 21.
The capacitor 22 is embedded as follows: the function of the capacitor 22 is realized by utilizing the metal of the adjacent layer of the second flexible circuit board 2 and the medium between the adjacent layer, and the capacitance value of the capacitor 22 is adjusted by controlling the size, the thickness and the characteristics of the metal area.
The inductor 23 is embedded as follows: and manufacturing a threaded metal wire on the metal layer of the second flexible circuit board 2, and realizing the functions of different inductance 23 values by adjusting parameters such as the length of the metal wire, the interval of the metal wire and the like.
In this embodiment, the resistor 21, the capacitor 22, and the inductor 23 are all embedded in the middle layer of the second flexible circuit board 2.
S2: and welding a radio frequency front-end chip 3 on the first flexible circuit board 1 in a flip-chip mode by using a bare chip.
The radio frequency front-end chip 3 is embedded in the first flexible circuit board 1 and the second flexible circuit board 2 in a bare chip flip-chip manner and a resistance-capacitance manner, so that the thickness of the antenna module 100 can be reduced.
S3: and electrically connecting the first flexible circuit board 1 and the second flexible circuit board 2 in a ball-planting 12 mode, wherein the radio frequency front end chip 3 is accommodated in the accommodating cavity.
S4: and injecting resin into the accommodating cavity through the glue injection hole.
The production method of the antenna module 100 can effectively reduce the area and the height of the antenna module 100 and save more space in communication equipment.
The antenna module 100 and the production method of the antenna module 100 can improve the receiving sensitivity of the antenna 4, reduce the power consumption and improve the endurance time of the battery; compared with the existing design, the area can be saved by 15%, one layer of substrate is saved, the metal shielding cover is reduced, and the height of the radio frequency front-end circuit can be reduced by about 0.5 mm.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. An antenna module, its characterized in that: the antenna module comprises a first flexible circuit board, a second flexible circuit board electrically connected with the first flexible circuit board, and a radio frequency front end chip and an antenna which are welded in the second flexible circuit board, wherein the antenna is fixed on the first flexible circuit board and electrically connected with the radio frequency front end chip, the first flexible circuit board is close to one side of the second flexible circuit board and is provided with a bonding pad, and the radio frequency front end chip is welded on the bonding pad in a bare chip flip-chip mode.
2. The antenna module of claim 1, wherein: the first flexible circuit board and the second flexible circuit board are FPC circuit boards or LCP circuit boards.
3. The antenna module of claim 1, wherein: the first flexible circuit board is electrically connected with the second flexible circuit board in a ball mounting mode.
4. The antenna module of claim 1, wherein: one or more of a capacitor, a resistor and an inductor are embedded in the second flexible circuit board.
5. The antenna module of claim 1, wherein: the second flexible circuit board is internally provided with an accommodating cavity and a glue injection hole communicated with the accommodating cavity and used for injecting glue into the accommodating cavity, and the radio frequency front end chip is accommodated in the accommodating cavity.
6. The antenna module of claim 1, wherein: the antenna is in the form of one of a loop antenna, a monopole antenna, an IFA antenna, a PIFA antenna, a MIMO antenna, and an array antenna.
7. The antenna module of claim 1, wherein: the radio frequency front end chip comprises a transceiver module, wherein the transceiver module comprises a first antenna tuning chip electrically connected with the antenna, a first radio frequency switch electrically connected with the antenna, a duplexer electrically connected with the first radio frequency switch, a power amplifier electrically connected with the duplexer, and a first low noise amplifier.
8. The antenna module of claim 7, wherein: the radio frequency front end chip comprises a receiving module, wherein the receiving module comprises a second antenna tuning chip electrically connected with the antenna, a second radio frequency switch electrically connected with the antenna, a filter electrically connected with the second radio frequency switch, and a second low noise amplifier electrically connected with the filter.
9. A method of manufacturing an antenna module according to any of claims 1-8, characterized in that: the method comprises the following steps:
s1: providing a first flexible circuit board, fixing the antenna on the first flexible circuit board, providing a second flexible circuit board, and forming an accommodating cavity and a glue injection hole communicated with the accommodating cavity on the second flexible circuit board for injecting glue into the accommodating cavity;
s2: welding a radio frequency front-end chip on the first flexible circuit board chip in a flip-chip mode of a bare chip;
s3: electrically connecting the first flexible circuit board and the second flexible circuit board in a ball-planting mode, wherein the radio frequency front end chip is accommodated in the accommodating cavity;
s4: and injecting resin into the accommodating cavity through the glue injection hole.
10. The method for producing an antenna module according to claim 9, wherein: one or more of a capacitor, a resistor and an inductor are embedded in the second flexible circuit board provided in the step S1, and the second flexible circuit board is produced by adopting a laminating process.
11. The method for producing an antenna module according to claim 9, wherein: step S0 is also included before step S1: and designing an antenna and a radio frequency front-end chip according to the product requirement, and simulating according to the parameters of the antenna and the radio frequency front-end chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210477137.0A CN114665253A (en) | 2022-05-03 | 2022-05-03 | Antenna module and production method thereof |
| PCT/CN2022/093827 WO2023212985A1 (en) | 2022-05-03 | 2022-05-19 | Antenna module and production method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210477137.0A CN114665253A (en) | 2022-05-03 | 2022-05-03 | Antenna module and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114665253A true CN114665253A (en) | 2022-06-24 |
Family
ID=82038131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210477137.0A Pending CN114665253A (en) | 2022-05-03 | 2022-05-03 | Antenna module and production method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114665253A (en) |
| WO (1) | WO2023212985A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10957969B2 (en) * | 2017-09-11 | 2021-03-23 | Apple Inc. | Integrated antennas for portable electronic devices |
| KR101940798B1 (en) * | 2018-03-06 | 2019-01-21 | 동우 화인켐 주식회사 | Film antenna and display device including the same |
| CN108966485B (en) * | 2018-08-17 | 2020-10-02 | Oppo（重庆）智能科技有限公司 | Circuit board assembly, electronic equipment, display screen device and assembling method thereof |
| CN211088302U (en) * | 2019-12-17 | 2020-07-24 | 重庆慧库科技有限公司 | COB lamp strip die bonder |
| CN113889458A (en) * | 2021-10-15 | 2022-01-04 | 平头哥(上海)半导体技术有限公司 | Packaged device and electronic apparatus |
-
2022
- 2022-05-03 CN CN202210477137.0A patent/CN114665253A/en active Pending
- 2022-05-19 WO PCT/CN2022/093827 patent/WO2023212985A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023212985A1 (en) | 2023-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101512832B (en) | Tunable antennas for handheld devices | |
| US8773324B2 (en) | Apparatus, method and computer program for wireless communication | |
| CN103635020B (en) | RF circuit module | |
| US7848771B2 (en) | Wireless terminals | |
| KR100801835B1 (en) | Antenna device and radio communication terminal | |
| US8886135B2 (en) | Apparatus, methods, computer programs and computer readable storage mediums for wireless communications | |
| KR101054713B1 (en) | Multiband Multimode Compact Antenna System | |
| EP2272189B1 (en) | Antenna arrangement and test method | |
| US11967758B2 (en) | Printed circuit board structure including a closed cavity | |
| KR101066885B1 (en) | Mobile phone case within antenna | |
| US20090061796A1 (en) | Antenna arrangement | |
| JP2007524310A (en) | antenna | |
| US20230328901A1 (en) | Method of making a closed cavity printed circuit board with patterned laminate structure | |
| US20180294569A1 (en) | Radio-frequency module with integrated shield layer antenna and integrated cavity-based antenna | |
| CN114830434B (en) | Packaged antenna device and wireless communication device | |
| CN114665253A (en) | Antenna module and production method thereof | |
| US20180294558A1 (en) | Radio-frequency module with integrated conformal shield antenna | |
| US20210399423A1 (en) | Radio-frequency module with integrated conformal shield antenna | |
| EP2023436A1 (en) | Mobile terminal with two antennas for reducing the rf radiation exposure of the user | |
| CN114665252A (en) | Antenna integrated assembly, communication equipment and production method of antenna integrated assembly | |
| KR20050043526A (en) | Quad band antenna switching apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: Room 009, No. 55 Shengchuang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province, 215312 Applicant after: KUNSHAN RUIXIANG XUNTONG COMMUNICATION TECHNOLOGY Co.,Ltd. Address before: 215316 no.1689-5 Zizhu Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: KUNSHAN RUIXIANG XUNTONG COMMUNICATION TECHNOLOGY Co.,Ltd. Country or region before: China |