CN114660439A

CN114660439A - IC testing device

Info

Publication number: CN114660439A
Application number: CN202210310233.6A
Authority: CN
Inventors: 孙炎俊; 胡昊; 刘治震
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2021-11-17
Filing date: 2022-03-28
Publication date: 2022-06-24
Also published as: KR20230072379A; TW202321719A; CN114264929A

Abstract

The invention relates to an IC testing device, which comprises a detection platform and one or more testing mechanisms arranged on the detection platform, wherein each testing mechanism comprises a horizontal driving system, a vertical driving system and a testing pressure head for performing a press-down test on an IC, the vertical driving system is arranged on the horizontal driving system and drives the vertical driving system to horizontally move through the horizontal driving system, the testing pressure head is arranged on the vertical driving system and drives the testing pressure head to vertically move through the vertical driving system, and the driving force of the vertical driving system on the testing pressure head and the reaction force of the IC on the testing pressure head are coaxially arranged. When the pressure testing head is used for pressing down the IC for testing, the two forces applied to the testing pressure head are coaxial and opposite in direction, so that the bending moment load applied to the testing pressure head is eliminated, the IC testing pressure is uniformly distributed, and the problem of structural deformation and inclination of the testing pressure head is avoided.

Description

IC testing device

Technical Field

The invention relates to the technical field of test equipment, in particular to an IC test device.

Background

As IC functional modules become more complex, the testing pressure and testing time of ICs are increasing. Aiming at the IC with longer test time, the number of the IC stations tested at one time is increased, which is beneficial to reducing the overall test cost. Therefore, the requirement of the multi-station large-pressure testing device arises at the same time, the presently disclosed multi-station testing device comprises two testing pressure heads with the same mechanism, and each set of testing pressure head is connected with an independent horizontal driving system and an independent vertical driving system. In the whole test process, the horizontal and vertical driving systems cooperatively drive the test pressure head to move in parallel in the horizontal and vertical directions, so that the test pressure head can pick and place the IC and perform a pressing test.

However, in the existing IC testing device, the vertical driving system is located at both sides of the testing pressure head, so that when the testing pressure head performs vertical downward pressing test, the testing pressure head is affected by two forces, namely the driving force of the side vertical driving system and the reaction force of the testing IC, and the two acting forces are not coaxial, thereby forming a bending moment load effect, and causing the problem that the testing pressure head has structural deformation and inclination when testing the IC, thereby causing uneven testing pressure of the IC and affecting the testing yield of the key indexes of the IC test.

Disclosure of Invention

In view of the above, it is desirable to provide an IC testing apparatus that can avoid the problem of the test indenter structure being deformed and inclined.

The invention provides an IC testing device, which comprises a detection platform and one or more testing mechanisms arranged on the detection platform, wherein each testing mechanism comprises a horizontal driving system, a vertical driving system and a testing pressure head for performing a press-down test on an IC, the vertical driving system is arranged on the horizontal driving system and drives the vertical driving system to horizontally move through the horizontal driving system, the testing pressure head is arranged on the vertical driving system and drives the testing pressure head to vertically move through the vertical driving system, and the driving force of the vertical driving system on the testing pressure head and the reaction force of the IC on the testing pressure head are coaxially arranged.

When adopting this IC testing arrangement to push down the test to IC (be miniature electronic components) this moment, because the test pressure head sets up on vertical actuating system, vertical actuating system drive test pressure head carries out vertical removal, vertical actuating system turns into the downforce of test pressure head to IC to the drive power of test pressure head this moment, vertical actuating system is to the drive power of test pressure head and the coaxial setting of IC to the reaction force of test pressure head, the moment of flexure load that test pressure head received has been eliminated, pressure evenly distributed during the IC test, and simultaneously, through horizontal drive system and vertical actuating system's control, the test pressure head can remove arbitrary position in the three-dimensional stereo space of predetermineeing, thereby can make things convenient for the test pressure head to shift IC and test IC.

In one embodiment, the vertical driving system comprises a first driving source, a vertical driving member and a pressing rod, wherein the first driving source is connected with the vertical driving member to drive the vertical driving member to rotate, the pressing rod is connected with the vertical driving member and can be controlled to move along the vertical direction when the vertical driving member rotates, and the test pressing head is connected to one end of the pressing rod to move along with the movement of the pressing rod.

The vertical driving piece of first driving source control rotates, and the one end of depression bar links to each other with vertical driving piece, and the test pressure head is connected to the other end, consequently tests the axial displacement of pressure head along vertical driving piece under the effect of first driving source.

In one embodiment, the test indenter is coaxially disposed with the vertical drive.

Because the test pressure head and the vertical driving piece are coaxially arranged, the driving force of vertical downward movement borne by the test pressure head and the reaction force of the tested IC reacting on the test pressure head are coaxial and opposite in direction, so that the bending moment load borne by the test pressure head is eliminated, the IC test pressure is uniformly distributed, the problem of structural deformation and inclination of the test pressure head is avoided, and the test yield of the IC test key index is ensured.

In one embodiment, the vertical driving system comprises a fixing frame fixed on the horizontal driving system, the vertical driving member comprises a vertical screw rod, the vertical screw rod is arranged along the vertical direction and is rotatably installed on the fixing frame, the first driving source is connected with the vertical screw rod to drive the vertical screw rod to rotate, and the pressing rod is sleeved on the outer side of the vertical screw rod and is in threaded connection with the vertical screw rod.

In one embodiment, the vertical driving system further includes a first driving wheel, a first driven wheel, and a first synchronous belt, the first driving source is fixed on the fixing frame, the first driving source is connected to the first driving wheel, the upper end of the vertical screw rod is connected to the first driven wheel, and the first synchronous belt is sleeved on the outer sides of the first driving wheel and the first driven wheel.

Through first action wheel, first from driving wheel and first synchronous belt matched with transmission structure, first driving source can set up in vertical lead screw one side to can avoid this vertical actuating system's whole length overlength, make overall structure reasonable compacter more.

In one embodiment, the vertical driving system further includes a vertical guide rail and a vertical slider, the vertical guide rail is fixedly connected to the pressing rod, the vertical slider is in sliding fit with the vertical guide rail, and the vertical slider is fixedly connected to the fixing frame.

So set up, play the spacing effect of direction through vertical guide rail and vertical slider sliding fit, the depression bar is more smooth and easy in the ascending removal of vertical side to the pressure head is also more smooth and easy in the ascending removal of vertical side.

In one embodiment, the vertical driving system comprises at least one pair of vertical guide rails, the at least one pair of vertical guide rails are symmetrically arranged at two sides of the compression bar, and the test pressure head is at least partially clamped between the at least one pair of vertical guide rails.

So set up, the depression bar is pressed from both sides between at least a pair of vertical guide rail, vertical guide rail and vertical slider cooperation, and the depression bar is very steady smooth and easy when reciprocating.

In one embodiment, the vertical drive system includes a mount, the mount being secured to the horizontal drive system, the horizontal drive system including: the detection platform comprises a second driving source, a horizontal screw rod and a horizontal nut, wherein the second driving source is fixedly installed on the detection platform, an output shaft of the second driving source is connected with the horizontal screw rod to drive the horizontal screw rod to rotate, the horizontal nut is sleeved on the outer side of the horizontal screw rod and is in threaded fit with the horizontal screw rod, and the fixing frame is fixedly connected with the horizontal nut so that when the second driving source drives the horizontal screw rod to rotate, the vertical driving system can move along the length direction of the horizontal screw rod.

So set up, the steerable horizontal screw of second driving source rotates to horizontal nut removes along horizontal screw, because mount fixed connection horizontal nut, consequently, structure on the mount is along with mount and horizontal nut translation together, also is exactly vertical actuating system and survey the pressure test head along with horizontal nut translation together. According to the embodiment, the vertical driving system is controlled to move through the second driving source, so that the accurate control of the vertical driving system can be realized, and the test pressure head is accurately translated to the preset position.

In one embodiment, the horizontal driving system further comprises a horizontal guide rail and a horizontal sliding block, the horizontal guide rail is fixed on the detection platform, the horizontal sliding block is in sliding fit with the horizontal guide rail, and the horizontal sliding block is fixedly connected with the fixing frame.

So set up, when the mount removed along with horizontal nut, horizontal slider removed along horizontal guide rail, and horizontal slider plays the direction with the horizontal guide rail cooperation and maintains stable effect for the mount can steadily smoothly remove under horizontal motor's drive, thereby has guaranteed the stability and the smooth and easy nature of pressure head translation.

In one embodiment, the horizontal driving system further includes a second driving wheel, a second driven wheel and a second synchronous belt, the second driving source is connected to the second driving wheel, one end of the horizontal screw rod is connected to the second driven wheel, and the second synchronous belt is sleeved outside the second driving wheel and the second driven wheel.

Through the transmission of horizontal action wheel, horizontal driven wheel and horizontal synchronous belt, the output shaft and the horizontal lead screw of second driving source can the disalignment set up to can arrange the mounted position of horizontal motor and horizontal lead screw more rationally, make overall structure reasonable compactness more.

In one embodiment, the horizontal driving system further comprises a balancing assembly, the balancing assembly comprises a balancing screw rod, a first balancing support, a second balancing support, a balancing nut and a balancing weight,

the balance screw rod and the horizontal screw rod are arranged in parallel,

one end of the balance screw rod is connected with the second driving source so as to drive the balance screw rod to rotate through the second driving source,

the first balance support and the second balance support are both fixed on the detection platform, the first balance support and the second balance support are respectively sleeved at two ends of the balance screw rod and are in rotating fit with the balance screw rod,

the balancing nut is sleeved outside the balancing screw rod and is in threaded fit with the balancing screw rod, the balancing weight is sleeved outside the balancing screw rod and is fixedly connected with the balancing nut,

when the second driving source rotates, the vertical driving system moves along the length direction of the horizontal wire rod, the balancing weight moves along the length direction of the balancing wire rod, and the moving direction of the balancing weight is opposite to that of the vertical driving system.

This embodiment is through setting up balanced subassembly, and when the vertical actuating system of second driving source drive removed along the length direction of horizontal filament pole, the balancing weight can be followed the direction removal opposite with vertical actuating system moving direction to offset vertical actuating system and survey the produced inertia of pressure testing head removal, reduce the condition that the test pressure head rocked, make this IC testing arrangement operate steadily.

In one embodiment, the balance assembly further includes a balance driving wheel, a balance driven wheel and a balance synchronous belt, the second driving source is connected to the balance driving wheel, one end of the balance screw rod is connected to the balance driven wheel, and the balance synchronous belt is sleeved outside the balance driving wheel and the balance driven wheel.

So set up, through the transmission of balanced action wheel, balanced follow driving wheel and balanced hold-in range, the output shaft of second driving source and balanced lead screw can the disalignment set up to can arrange the mounted position of second driving source and balanced lead screw more rationally, make overall structure reasonable compactness more.

In one embodiment, the balance assembly further comprises a balance guide rail, and the balancing weight is in sliding fit with the balance guide rail.

This embodiment sets up balanced guide rail and is favorable to direction and spacing to the balancing weight to when balanced lead screw rotates, balanced lead screw and balanced guide rail steady movement can be followed to the balancing weight, reduce the circumstances that the balancing weight appears rocking.

In one embodiment, a through hole is formed in the geometric center of the detection platform, a test area is arranged below the through hole, the horizontal driving system is mounted on the detection platform, and the vertical driving system at least partially penetrates through the through hole, so that the test pressure head can move to the test area.

In one embodiment, the detection platform is provided with two testing mechanisms, and the two testing mechanisms are symmetrically arranged on two sides of the through hole; two groups of material transporting assemblies are arranged below the detection platform and are respectively positioned on two sides of the test area.

By the arrangement, the IC to be tested can be moved to two sides of the test area or the IC which is tested can be moved away in time by the material conveying assembly, and the test pressure head can move between the material conveying assembly and the test area under the control of the first driving source and the second driving source, so that the IC to be tested can be obtained for testing, or the IC which is tested can be moved away.

Drawings

FIG. 1 is a perspective view of an IC testing apparatus according to an embodiment of the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a side view of a vertical drive system according to an embodiment of the present invention;

FIG. 4 is a perspective view of a vertical drive system according to one embodiment of the present invention;

FIG. 5 is a schematic view of a portion of the structure of FIG. 4;

FIG. 6 is a perspective view of a horizontal drive system according to one embodiment of the present invention;

FIG. 7 is a schematic view of the assembly of the counterweight and the balancing guide rail;

FIG. 8 is a top view of an initialization position when two testing mechanisms of the IC testing device test ICs in turn;

fig. 9 is a perspective view of the state shown in fig. 8;

FIG. 10 is a top view of the IC testing apparatus of the present invention in a state where the first testing mechanism carries an IC to be tested and the second testing mechanism carries an IC to wait;

fig. 11 is a perspective view of the state shown in fig. 10;

FIG. 12 is a top view of the IC testing apparatus of the present invention in a state where the second testing mechanism carries an IC to be tested and the first testing mechanism carries an IC to wait;

fig. 13 is a perspective view of the state shown in fig. 12;

FIG. 14 is a top view of an initialization position for the two testing mechanisms of the IC testing device of the present invention testing ICs simultaneously;

fig. 15 is a perspective view of the state shown in fig. 14;

FIG. 16 is a top view of the IC testing apparatus of the present invention in a position where the first testing mechanism and the second testing mechanism simultaneously pick up ICs;

fig. 17 is a perspective view of the state shown in fig. 16;

fig. 18 is a plan view of the IC testing apparatus of the present invention in a state where the first testing mechanism and the second testing mechanism simultaneously test ICs;

fig. 19 is a perspective view of the state shown in fig. 18.

Reference numerals: 1. a detection platform; 101. a through hole; 102. a test zone; 2. a testing mechanism; 2a, a first testing mechanism; 2b, a second testing mechanism; 3. a material conveying assembly; 3a, a first material conveying assembly; 3b, a second material conveying assembly; 20. a horizontal drive system; 201. a second drive source; 202. a horizontal screw rod; 203. a horizontal nut; 204. a horizontal guide rail; 205. a horizontal slider; 206. a first horizontal support seat; 207. a second horizontal support seat; 208. a second drive wheel; 209. a second driven wheel; 210. a second synchronous belt; 212. a balance screw rod; 213. a first balance support; 214. a second balance support; 215. a balance nut; 216. a balancing weight; 2161. a counterweight base; 2162. a counterweight unit; 217. a balance driving wheel; 218. balancing the driven wheel; 219. balancing a synchronous belt; 220. a balance guide rail; 40. a vertical drive system; 401. a fixed mount; 4011. a first fixing plate; 4012. a second fixing plate; 4013. a connecting plate; 402. a first drive source; 403. a vertical screw rod; 404. a vertical nut; 405. a pressure lever; 406. a first driving wheel; 407. a first driven wheel; 408. a first synchronization belt; 409. a first support section; 410. a second support portion; 411. a vertical guide rail; 412. a vertical slide block; 4121. a fixed block; 60. and testing the pressure head.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments of the present invention, belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The first embodiment is as follows:

referring to fig. 1 and 2, an IC testing apparatus according to the present invention includes a testing platform 1 and one or more testing mechanisms 2 disposed on the testing platform 1. The testing mechanism 2 includes a horizontal drive system 20, a vertical drive system 40, and a test ram 60. The vertical driving system 40 is installed on the horizontal driving system 20, and drives the vertical driving system 40 to move horizontally by the horizontal driving system 20. The test ram 60 is disposed on the vertical drive system 40, and the test ram 60 is driven to move vertically by the vertical drive system 40. In this way, the test indenter 60 can be moved to any position in the predetermined three-dimensional space by the control of the horizontal driving system 20 and the vertical driving system 40, so that the test indenter 60 can conveniently transfer an IC (Integrated Circuit, i.e., a micro electronic device) and test the IC.

In this application, vertical actuating system 40 is to the drive power of test pressure head 60 and the coaxial setting of IC to the reaction force of test pressure head 60, so, can effectively eliminate the moment of flexure load that test pressure head 60 received for IC test pressure evenly distributed, thereby avoided the problem of test pressure head 60 structural deformation slope, guaranteed the test yield of IC test key index. Referring to fig. 3 to 5, the vertical driving system 40 includes a first driving source 402, a vertical driving member and a pressing rod 405, the first driving source 402 is connected to the vertical driving member to drive the vertical driving member to rotate, the pressing rod 405 is connected to the vertical driving member, and can control the pressing rod 405 to move along a vertical direction when the vertical driving member rotates, and the testing pressing head 60 is connected to one end of the pressing rod 405 to move along with the movement of the pressing rod 405. That is, this embodiment enables the plunger 405 to move in the vertical direction by the driving force of the first driving source 402, so that the test ram 60 can perform pressure detection on the IC.

In this embodiment, the first driving source 402 is a vertical motor, and the vertical driving member is a vertical screw 403. The vertical driving system 40 further comprises a fixing frame 401, the fixing frame 401 is fixed on the horizontal driving system 20, and the vertical screw 403 is arranged along the vertical direction and is rotatably mounted on the fixing frame 401. The vertical motor is connected with the vertical screw 403 to drive the vertical screw 403 to rotate. The pressing rod 405 is sleeved outside the vertical screw rod 403 and is in threaded connection with the vertical screw rod 403, so that the rotation of the pressing rod 405 can be controlled when the vertical screw rod 403 rotates. It will be appreciated that the plunger 405 is considered a lead screw nut that is threadedly engaged with the vertical lead screw 403. Of course, in other embodiments, the vertical screw 403 is sleeved with the vertical nut 404, and the pressing rod 405 is fixedly connected with the vertical nut 404, so that the pressing rod 405 is more stable when moving along the vertical screw 403.

In this embodiment, the test ram 60 is coaxially disposed with the vertical screw 403. When the IC testing device is used for performing a press-down test on an IC, the vertical motor controls the vertical screw 403 to rotate, so that the pressing rod 405 and the vertical nut 404 move together in the axial direction along the vertical screw 403, and since the testing pressure head 60 is connected to one end of the pressing rod 405, the testing pressure head 60 moves together with the pressing rod 405 in the axial direction along the vertical screw 403. Because the test pressure head 60 and the vertical screw 403 are coaxially arranged, the driving force of vertical downward movement borne by the test pressure head 60 and the reaction force of the tested IC reacting on the test pressure head 60 are coaxial and opposite in direction, so that the bending moment load borne by the test pressure head 60 is eliminated, the IC test pressure is uniformly distributed, the problem of structural deformation and inclination of the test pressure head 60 is avoided, and the test yield of the IC test key index is ensured.

Further, vertical lead screw 403, depression bar 405 and test pressure head 60 all set up coaxially, so, depression bar 405 and test pressure head 60 remove more steadily, and test pressure head 60 is favorable to the even atress of IC when testing IC.

It is understood that the first driving source 402 may be a vertical motor or a cylinder.

Further, the fixing frame 401 includes a first fixing plate 4011, a second fixing plate 4012, and a connecting plate 4013, the second fixing plate 4012 is located below the first fixing plate 4011, and the connecting plate 4013 is fixedly connected to the first fixing plate 4011 and the second fixing plate 4012. Thus, the fixing frame 401 has a simple structure, and is convenient for the fixing frame 401 to be connected with the vertical screw 403, and is convenient for the fixing frame 401 to be fixedly connected with the horizontal driving system 20. In this embodiment, the vertical screw 403 is connected to the first fixing plate 4011, and the second fixing plate 4012 is fixedly connected to the horizontal driving system 20.

The vertical driving system 40 further includes a first driving wheel 406, a first driven wheel 407 and a first synchronous belt 408, the vertical motor is fixed to the first fixing plate 4011, an output shaft of the vertical motor is connected to the first driving wheel 406, an upper end of the vertical screw 403 passes through the first fixing plate 4011 and is connected to the first driven wheel 407, and the first synchronous belt 408 is sleeved outside the first driving wheel 406 and the first driven wheel 407. Through the transmission of first driving wheel 406, first driven wheel 407 and first synchronous belt 408, vertical motor can set up in vertical lead screw 403 one side to can avoid this vertical actuating system 40's whole length overlength, make overall structure reasonable compacter.

It is understood that the transmission structure formed by the first driving wheel 406, the first driven wheel 407 and the first synchronous belt 408 can be replaced by a structure matched with a gear and a rack.

Further, the vertical driving system 40 further includes a first support part 409 and a second support part 410. The first supporting portion 409 is sleeved on the upper end of the vertical screw rod 403, and the first supporting portion 409 is fixed to the first fixing plate 4011. The second supporting portion 410 is sleeved on the lower end of the vertical screw rod 403, and the second supporting portion 410 is fixed to the second fixing plate 4012. The first supporting portion 409 and the second supporting portion 410 are provided to support both ends of the vertical screw 403, which is beneficial to maintaining the stable rotation of the vertical screw 403.

In this embodiment, a first bearing is disposed between the first supporting portion 409 and the vertical screw 403, an outer ring of the first bearing is fixedly connected to the first supporting portion 409, and an inner ring of the first bearing is fixedly connected to the upper end of the vertical screw 403. A second bearing is arranged between the second supporting part 410 and the vertical screw 403, the outer ring of the second bearing is fixedly connected with the second supporting part 410, and the inner ring of the second bearing is fixedly connected with the lower end of the vertical screw 403. So, vertical lead screw 403 rotates more smoothly, and stability is better.

Further, the vertical driving system 40 further includes a vertical guide rail 411 and a vertical slider 412, the vertical guide rail 411 is fixedly connected to the pressing rod 405, the vertical slider 412 is slidably engaged with the vertical guide rail 411, and the vertical slider 412 is fixedly connected to the fixing frame 401. So, when vertical lead screw 403 rotated vertical nut 404 of drive and moved along vertical lead screw 403, vertical nut 404, depression bar 405 and vertical guide rail 411 removed relatively the mount 401 together, played the spacing effect of direction through vertical guide rail 411 and vertical slider 412 sliding fit, and the removal of depression bar 405 in the vertical side is more smooth and easy to test pressure head 60 is also more smooth and easy in the ascending removal of vertical side.

Referring to fig. 4 and 5, the second supporting portion 410 is in an i shape, an upper end of the second supporting portion 410 is fixedly connected to the first fixing plate 4011, and a lower end of the second supporting portion 410 is fixedly connected to the vertical slider 412 through the fixing block 4121, so that the vertical slider 412 is fixedly connected to the fixing frame 401.

The vertical driving system 40 includes at least one pair of vertical guide rails 411, the at least one pair of vertical guide rails 411 are symmetrically disposed on both sides of the pressing rod 405, and the testing indenter 60 is at least partially clamped between the at least one pair of vertical guide rails 411. Thus, the pressing rod 405 is clamped between at least one pair of vertical guide rails 411, the vertical guide rails 411 are matched with the vertical sliding blocks 412, and the pressing rod 405 is very stable and smooth when moving up and down.

In this embodiment, the vertical sliding block 412 is fixedly connected to the connecting plate 4013. Further, mount 401 includes at least a pair of parallel arrangement's connecting plate 4013, and the relative one side of at least a pair of connecting plate 4013 sets up vertical slider 412, and vertical slider 412 cooperates with vertical guide rail 411 to this pressure head setting is between at least a pair of connecting plate 4013, and vertical guide rail 411 cooperates with vertical slider 412 and plays direction and spacing effect, makes depression bar 405 and test pressure head 60 remove steadily, can not appear rocking or take place the slope.

Referring to fig. 6, the horizontal driving system 20 includes: a second driving source 201, a horizontal screw 202 and a horizontal nut 203, in this embodiment, the second driving source 201 is a horizontal motor. Horizontal motor fixed mounting is in testing platform 1, and horizontal motor's output shaft connects horizontal lead screw 202 to drive horizontal lead screw 202 and rotate, and horizontal nut 203 cover is located the horizontal lead screw 202 outside, and with horizontal lead screw 202 screw-thread fit, mount 401 fixed connection horizontal nut 203, so that when horizontal motor drive horizontal lead screw 202 rotates, vertical actuating system 40 can remove along the length direction of horizontal lead screw 202. In this manner, the horizontal motor may control the horizontal screw 202 to rotate, so that the horizontal nut 203 moves along the horizontal screw 202, and since the fixing frame 401 is fixedly connected with the horizontal nut 203, the structure on the fixing frame 401 translates along with the fixing frame 401 and the horizontal nut 203, that is, the vertical driving system 40 and the test indenter 60 translate along with the horizontal nut 203. In the embodiment, the horizontal motor controls the vertical driving system 40 to move, so that the vertical driving system 40 can be accurately controlled, and the test pressure head 60 can be accurately translated to the preset position.

The horizontal driving system 20 further comprises a horizontal guide rail 204 and a horizontal sliding block 205, the horizontal guide rail 204 is fixed on the detection platform 1, the horizontal sliding block 205 is in sliding fit with the horizontal guide rail 204, and the horizontal sliding block 205 is fixedly connected with the fixed frame 401. So, mount 401 removes along horizontal nut 203, and horizontal slider 205 removes along horizontal guide rail 204, and horizontal slider 205 plays the direction with horizontal guide rail 204 cooperation and maintains stable effect for mount 401 can steadily smoothly remove under horizontal motor's drive, thereby has guaranteed the stability and the smooth and easy nature of test pressure head 60 translation. In this embodiment, the horizontal sliding block 205 is fixedly connected to the second fixing plate 4012.

It is understood that the horizontal guide rail 204 is disposed parallel to the horizontal screw 202 in order to ensure that the fixing frame 401 can move along the length direction of the horizontal guide rail 204 and the horizontal screw 202 at the same time. Referring to fig. 1, in the embodiment, the horizontal guide rail 204 is disposed below the horizontal screw rod 202, and the horizontal sliding block 205 is disposed below the second fixing plate 4012 of the fixing frame 401, so that the structure is very compact, and the horizontal sliding block 205 supports the whole fixing frame 401, so that the fixing frame 401 moves more stably on the horizontal guide rail 204.

Referring to fig. 6, the horizontal driving system 20 further includes a first horizontal supporting seat 206 and a second horizontal supporting seat 207, the first horizontal supporting seat 206 is sleeved on one end of the horizontal screw 202 and is rotatably engaged with the horizontal screw 202, the second horizontal supporting seat 207 is sleeved on the other end of the horizontal screw 202 and is rotatably engaged with the horizontal screw 202, and the first horizontal supporting seat 206 and the second horizontal supporting seat 207 are both fixed on the detecting platform 1. The first horizontal supporting seat 206 and the second horizontal supporting seat 207 are arranged to support two ends of the horizontal screw 202, which is beneficial to maintaining the stability of the rotation of the horizontal screw 202. In this embodiment, the first horizontal supporting seat 206 and the second horizontal supporting seat 207 are both bearing seats, the bearing seats are fixed on the detection platform 1, and bearings are installed in the bearing seats, and the bearing seats are rotatably connected with the horizontal screw 202 through the bearings. Specifically, the outer ring of the bearing is fixedly connected with the bearing seat, and the inner ring of the bearing is fixedly connected with the horizontal screw 202.

Further, the horizontal driving system 20 further includes a second driving wheel 208, a second driven wheel 209 and a second synchronous belt 210, an output shaft of the horizontal motor is connected to the second driving wheel 208, one end of the horizontal screw 202 is connected to the second driven wheel 209, and the second synchronous belt 210 is sleeved outside the second driving wheel 208 and the second driven wheel 209. Through the transmission of second action wheel 208, second driven wheel 209 and second hold-in range 210, horizontal motor's output shaft and horizontal lead screw 202 can the disalignment set up to can arrange the mounted position of horizontal motor and horizontal lead screw 202 more rationally, make overall structure reasonable compacter.

Referring to fig. 1 and 7, the horizontal driving system 20 further includes a balance assembly, which includes a balance screw 212, a first balance support 213, a second balance support 214, a balance nut 215, and a weight 216. The balance screw 212 is disposed in parallel with the horizontal screw 202, that is, the balance screw 212 is disposed in parallel with the horizontal screw 202. One end of the balance screw rod 212 is connected with an output shaft of the horizontal motor so as to drive the balance screw rod 212 to rotate through the horizontal motor. The first balance support 213 and the second balance support 214 are both fixed on the detection platform 1, and the first balance support 213 and the second balance support 214 are respectively sleeved at two ends of the balance screw rod and are in running fit with the balance screw rod 212, so that the first balance support 213 and the second balance support 214 play a role in supporting the balance screw rod 212. The balance nut 215 is sleeved on the outer side of the balance screw 212 and is in threaded fit with the balance screw 212, and the balancing weight 216 is sleeved on the outer side of the balance screw 212 and is fixedly connected with the balance nut 215. When the horizontal motor rotates, the vertical driving system 40 moves along the length direction of the horizontal screw 202, the counterweight block 216 moves along the length direction of the balance screw 212, and the moving direction of the counterweight block 216 is opposite to the moving direction of the vertical driving system 40. This embodiment is through setting up balanced subassembly, and when horizontal motor drive vertical driving system 40 removed along the length direction of horizontal lead screw 202, balancing weight 216 can remove along the opposite direction with vertical driving system 40 moving direction to offset vertical driving system 40 and the produced inertia of test pressure head 60 removal, reduce the condition that test pressure head 60 rocked, make this IC testing arrangement operate steadily.

In this embodiment, the balance screw 212 is supported by the first balance support 213 and the second balance support 214, so as to be beneficial to maintaining the stability of the rotation of the balance screw 212. Further, the first balance support 213 and the second balance support 214 are bearing seats, the bearing seats are fixed on the detection platform 1, bearings are installed in the bearing seats, and the bearing seats are rotatably connected with the balance screw 212 through the bearings. Specifically, the outer ring of the bearing is fixedly connected with the bearing seat, and the inner ring of the bearing is fixedly connected with the balance screw 212.

The balance assembly further comprises a balance driving wheel 217, a balance driven wheel 218 and a balance synchronous belt 219, an output shaft of the horizontal motor is connected with the balance driving wheel 217, one end of the balance screw rod 212 is connected with the balance driven wheel 218, and the balance synchronous belt 219 is sleeved on the outer sides of the balance driving wheel 217 and the balance driven wheel 218. In this way, through the transmission of the balance driving wheel 217, the balance driven wheel 218 and the balance synchronous belt 219, the output shaft of the horizontal motor and the balance screw rod 212 can be arranged non-coaxially, so that the installation positions of the horizontal motor and the balance screw rod 212 can be arranged more reasonably, and the whole structure is more reasonable and compact. In this embodiment, the balance screw 212 and the horizontal screw 202 are both driven by a horizontal motor, and have few parts, and are favorable for keeping the test indenter 60 and the counterweight 216 to move in a synchronous and reverse direction, so as to be favorable for keeping the stability of the movement of the test indenter 60.

Referring to fig. 6, in the present embodiment, the horizontal screw rod 202 and the balance screw rod 212 are respectively located at two sides of the axis of the output shaft of the horizontal motor, and the turning direction of the screw thread on the horizontal screw rod 202 is opposite to the turning direction of the screw thread on the balance screw rod 212, that is, when the horizontal screw rod 202 is a left-handed screw thread, the balance screw rod 212 is a right-handed screw thread; when the horizontal screw 202 is right-handed, the balancing screw 212 is left-handed. Thus, when the output shaft of the horizontal motor rotates, the horizontal screw 202 and the balance screw 212 rotate in the same direction, and the horizontal nut 203 and the balance nut 215 move in opposite directions, so that the test ram 60 and the weight block 216 move in opposite directions.

The balancing assembly further includes a balancing rail 220, and the counterweight 216 is slidably engaged with the balancing rail 220. A balance slider (not shown) is disposed on the balance rail 220 and slidably engaged with the balance rail 220, and the weight 216 is fixedly mounted on the balance slider, so that the weight 216 and the balance rail 220 are slidably engaged. It will be appreciated that the balance rail 220 is disposed parallel to the balance screw 212, such that the weight 216 can move along both the balance screw 212 and the balance rail 220. This embodiment sets up balanced guide rail 220 and is favorable to leading and spacing to balancing weight 216 to when balanced lead screw 212 rotates, balancing weight 216 can follow balanced lead screw 212 and balanced guide rail 220 steady movement, reduces balancing weight 216 and appears rocking the condition.

In one embodiment, the weight 216 is an integrated structure, which is relatively simple. However, referring to fig. 7, in another embodiment, the weight block 216 is a split structure, specifically, the weight block 216 includes a weight base 2161 and a plurality of weight units 2162, the weight base 2161 is fixedly installed on the balancing slider, and the weight units 2162 are fixedly installed on the weight base 2161 by fasteners such as screws. In use, the weight base 2161 may be mounted only on the balancing slider without mounting the weight unit 2162, or one or more weight units 2162 may be fixedly mounted on the weight base 2161, as desired for the weight. The counterweight 216 of the split structure is more flexible to use, can be configured with different weights as required, and is also easier to install.

Referring to fig. 1, a through hole 101 is formed in the geometric center of the testing platform 1, and a testing area 102 is disposed below the through hole 101. The horizontal drive system 20 is mounted on the inspection platform 1 and the vertical drive system 40 is at least partially passed through the through-hole 101 to enable the test ram 60 to move to the test zone 102. The IC testing apparatus thus transfers the IC to the test area 102 for testing using the test ram 60.

In this embodiment, the detection platform 1 is provided with two testing mechanisms 2, and the two testing mechanisms 2 are symmetrically arranged on two sides of the through hole 101, so that the balance of the device is kept. Two sets of material transporting components 3 are arranged below the detection platform 1, and the two sets of material transporting components 3 are respectively positioned on two sides of the test area 102. Thus, the material transporting assembly 3 can be used to move the IC to be tested to both sides of the test area 102 or to remove the tested IC in time, and the test ram 60 can be moved between the material transporting assembly 3 and the test area 102 by the control of the horizontal motor and the vertical motor to obtain the IC to be tested for testing or remove the tested IC. The two testing mechanisms 2 can test the ICs in turn or simultaneously.

Referring to fig. 1 to 7, the working principle of the IC testing apparatus provided by the present invention is as follows:

the horizontal movement of the test ram 60 proceeds as follows: when the horizontal motor is turned on, the second capstan 208 connected to the output shaft of the horizontal motor and the balance capstan 217 rotate simultaneously. Under the transmission of the second synchronous belt 210 and the balance synchronous belt 219, the second driven pulley 209 fixed at the shaft end of the horizontal screw 202 and the balance driven pulley 218 fixed at the shaft end of the balance screw 212 rotate simultaneously, so that the horizontal screw 202 and the balance screw 212 rotate simultaneously. Since the second fixing plate 4012 is connected with the horizontal nut 203, the vertical driving system 40 and the test ram 60 will move horizontally along with the rotation of the horizontal screw 202 under the guidance of the horizontal guide rail 204. Since the weight 216 is fixedly connected to the balance nut 215, the weight 216 will move horizontally and linearly as the balance screw 212 rotates. Moreover, the weight block 216 and the vertical driving system 40 move in opposite directions, so that the inertia impact generated on the whole IC testing device when the vertical driving system 40 moves horizontally at a high speed can be counteracted, and the device can be kept in balanced and stable operation.

The test ram 60 moves vertically as follows: the vertical motor is started, the first driving wheel 406 rotates, and the first driven wheel 407 and the vertical screw 403 rotate along with the first driving wheel under the transmission of the first synchronous belt 408. Because the vertical nut 404 is connected with the pressing rod 405, the testing pressing head 60 is connected with one end of the pressing rod 405, and under the linear guiding action of the vertical guide rail 411, the rotating motion of the vertical screw rod 403 drives the pressing rod 405 to move linearly up and down, so that the testing pressing head 60 moves up and down along with the rotating motion.

The combination of the horizontal and vertical movements of the test ram 60 allows the test ram 60 to move back and forth between the test area 102 and the material handling assembly 3 to remove ICs to be tested from the material handling assembly 3 to the test area 102 for testing and to remove ICs that have completed testing from the test area 102 to the material handling assembly 3 and to be transported away by the material handling assembly 3.

Referring to fig. 8 and 9, the IC testing apparatus provided by the present invention includes two testing mechanisms 2 and two sets of material transporting assemblies 3, where the two testing mechanisms 2 are a first testing mechanism 2a and a second testing mechanism 2b, respectively. The two groups of material conveying assemblies 3 are respectively a first material conveying assembly 3a and a second material conveying assembly 3 b.

Referring to fig. 8 to 13, the following describes in detail the process of testing ICs by two testing mechanisms 2 in turn:

the first step is as follows: each testing mechanism 2 and material handling assembly 3 is moved to an initialization position.

Before the whole IC testing device is started, the first testing mechanism 2a and the second testing mechanism 2b control the respective testing pressure heads 60 to move upwards to the vertical initialization positions, and then the first material transporting assembly 3a and the second material transporting assembly 3b horizontally move to the respective initialization positions, which are respectively called as a first material transporting assembly 3a material inlet position and a second material transporting assembly 3b material inlet position. At this time, the test ram 60 of the first testing mechanism 2a is positioned directly above the first material transporting assembly 3a, and the test ram 60 of the second testing mechanism 2b is positioned directly above the second material transporting assembly 3b, and the initialization position is as shown in fig. 8 and 9.

The second step is that: the first testing mechanism 2a carries the IC to be tested for IC testing.

The first material transporting assembly 3a moves to the discharge position, and the IC to be tested on the first material transporting assembly 3a is located right below the testing ram 60 of the first testing mechanism 2 a. The first testing mechanism 2a controls the testing ram 60 to move vertically downward through the vertical motor to the first material transporting assembly 3a to suck the IC to be tested. And then after the testing pressure head 60 of the first testing mechanism 2a vertically moves upwards to a safe height, the horizontal motor of the first testing mechanism 2a is started, the testing pressure head 60 of the first testing mechanism 2a is horizontally moved to a testing position, and the testing pressure head 60 of the first testing mechanism 2a carries the IC to be tested to vertically move downwards to the testing area 102 while moving horizontally, and then the IC testing is started. Simultaneously with the above-described horizontal movement, the first carrier module 3a is moved to the initial charging position. Meanwhile, in the whole movement process of the first testing mechanism 2a, the second testing mechanism 2b finishes the process of sucking the ICs from the second material transporting assembly 3b, and finally waits for the ICs carried by the first testing mechanism 2a to finish testing above the second material transporting assembly 3 b. The test procedure is schematically shown in fig. 10 and 11.

The third step: the first testing mechanism 2a carries the IC which is finished to test to leave the testing position, sucks the IC to be tested to wait for testing, and the second testing mechanism 2b carries the IC to be tested to run to the testing position for testing.

After the IC carried by the first testing mechanism 2a is tested, the vertical motor of the first testing mechanism 2a controls the testing ram 60 to move vertically upward, and the horizontal motor of the first testing mechanism 2a controls the testing ram 60 to move horizontally, so that the tested IC is transported to the first material transporting assembly 3 a. Then the first material transporting component 3a moves horizontally to transport the tested IC to a material receiving position for the material receiving device to collect, and then the first testing mechanism 2a sucks the IC to be tested from the first material transporting component 3a and waits for the IC of the second testing mechanism 2b to complete the test. While the first testing mechanism 2a completes the above operation process, the second testing mechanism 2b carries the IC to be tested to the testing area 102 for testing. The test procedure is schematically shown in fig. 12 and 13.

The fourth step: repeating the above second and third steps will allow for a cycling test.

Referring to fig. 14 to 19, the process of simultaneously testing the ICs by the two testing mechanisms 2 is described in detail as follows:

Before the whole IC testing device is started, the first testing mechanism 2a and the second testing mechanism 2b control the respective testing pressure heads 60 to move upwards to the vertical initialization positions, and then the first material transporting assembly 3a and the second material transporting assembly 3b horizontally move to the respective initialization positions, which are respectively called as a first material transporting assembly 3a material inlet position and a second material transporting assembly 3b material inlet position. At this time, the test ram 60 of the first testing mechanism 2a is positioned directly above the first material transporting assembly 3a, and the test ram 60 of the second testing mechanism 2b is positioned directly above the second material transporting assembly 3b, and the initialization position is as shown in fig. 14 and 15.

The second step is that: the first testing mechanism 2a and the second testing mechanism 2b take the IC at the same time.

The first material transporting component 3a and the second material transporting component 3b move to the material placing position simultaneously, at the moment, the IC to be tested on the first material transporting component 3a is located under the testing pressure head 60 of the first testing mechanism 2a, and the IC to be tested on the second material transporting component 3b is located under the testing pressure head 60 of the second testing mechanism 2 b. Then, the first testing mechanism 2a moves vertically downward to the first material transporting assembly 3a to suck the IC to be tested, and the second testing mechanism 2b moves vertically downward to the second material transporting assembly 3b to suck the IC to be tested, as shown in fig. 16 and 17.

The third step: the first testing mechanism 2a and the second testing mechanism 2b move to the testing area 102 at the same time to perform the depression test.

As shown in fig. 18 and 19, the first testing mechanism 2a and the second testing mechanism 2b suck the ICs and simultaneously move to the testing area 102 to perform the push-down test. Meanwhile, the first material transporting assembly 3a and the second material transporting assembly 3b simultaneously move to respective material feeding positions, and the first material transporting assembly 3a and the second material transporting assembly 3b respectively wait for the first material taking and testing mechanism 2 and the second material taking and testing mechanism 2 to place the ICs which are already tested. The first material conveying assembly 3a and the second material conveying assembly 3b respectively receive the ICs to be tested, which are placed on the feeding assemblies.

The fourth step: the first testing mechanism 2a and the second testing mechanism 2b simultaneously carry the tested ICs to the first material transporting assembly 3a and the second material transporting assembly 3b, and suck new ICs to be tested.

When the IC test is completed, the first testing mechanism 2a and the second testing mechanism 2b place the tested IC on the first material transporting assembly 3a and the second material transporting assembly 3b, respectively. Then the first material transporting component 3a and the second material transporting component 3b move to respective material feeding positions respectively, then the first testing mechanism 2a and the second testing mechanism 2b absorb new ICs to be tested from the first material transporting component 3a and the second material transporting component 3b respectively, and then the second step to the fourth step are repeated, and the whole testing process is repeated circularly.

The second embodiment:

the present embodiment is different from the first embodiment in that the first driving source 402, the vertical driving member, the pressing rod 405, and the test ram 60 are coaxially disposed. In this embodiment, the first driving source 402 is disposed right above the vertical driving member, the first driving source 402 is a motor, the vertical driving member is a vertical screw 403, and at this time, one end of the vertical screw rod 403 is connected with the output shaft of the motor, the other end is in threaded connection with the pressure lever 405, the test pressure head 60 is arranged below the pressure lever 405, because the motor, the vertical screw 403, the pressure lever 405 and the testing ram 60 are all coaxially arranged, the driving force of the motor to the testing ram 60 is directly converted into the downward pressure of the testing ram 60 to the IC, the driving force of the vertical downward movement of the testing ram 60 and the reaction force of the tested IC reacting on the testing ram 60 are coaxial and opposite in direction, thereby eliminating the bending moment load on the test ram 60, enabling the IC test pressure to be evenly distributed, therefore, the problem that the structure of the test pressure head 60 is deformed and inclined is avoided, and the test yield of the IC test key index is ensured.

In this embodiment, the first driving source 402 may be a motor or a cylinder.

The remaining features of the IC testing apparatus in this embodiment are the same as those described in the first embodiment, and are not described herein again.

The features of the above-described embodiments may be combined arbitrarily, and for the sake of brevity, all possible combinations of the features in the above-described embodiments will not be described in detail, but should be construed as being within the scope of the present disclosure unless there is any conflict between such combinations of features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications to the above embodiments are within the scope of the claimed invention as long as they are within the spirit of the present invention.

Claims

1. An IC testing device is characterized by comprising an inspection platform (1) and one or more testing mechanisms (2) arranged on the inspection platform (1), the testing mechanism (2) comprises a horizontal driving system (20), a vertical driving system (40) and a testing pressure head (60) for performing a pressing test on the IC, the vertical drive system (40) is mounted on the horizontal drive system (20), and drives the vertical driving system (40) to move horizontally through the horizontal driving system (20), the test indenter (60) is disposed on the vertical drive system (40), and drives the test ram (60) to move vertically by the vertical drive system (40), the driving force of the vertical driving system (40) on the test pressure head (60) and the reaction force of the IC on the test pressure head (60) are coaxially arranged.

2. The IC testing device according to claim 1, wherein the vertical driving system (40) comprises a first driving source (402), a vertical driving member, and a pressing rod (405), the first driving source (402) is connected with the vertical driving member to drive the vertical driving member to rotate, the pressing rod (405) is connected with the vertical driving member, and can control the pressing rod (405) to move along a vertical direction when the vertical driving member rotates, and the testing pressing head (60) is connected with one end of the pressing rod (405) to move along with the movement of the pressing rod (405).

3. The IC testing apparatus of claim 2, wherein the test ram (60) is disposed coaxially with the vertical drive.

4. The IC testing device according to claim 2, wherein the vertical driving system (40) comprises a fixing frame (401), the fixing frame (401) is fixed on the horizontal driving system (20), the vertical driving member comprises a vertical screw (403), the vertical screw (403) is arranged along a vertical direction and rotatably mounted on the fixing frame (401), the first driving source (402) is connected with the vertical screw (403) to drive the vertical screw (403) to rotate, and the pressing rod (405) is sleeved outside the vertical screw (403) and is in threaded connection with the vertical screw (403).

5. The IC testing apparatus according to claim 4, wherein the vertical driving system (40) further comprises a first driving wheel (406), a first driven wheel (407), and a first synchronous belt (408), the first driving source (402) is fixed on the fixing frame (401), the first driving source (402) is connected to the first driving wheel (406), the upper end of the vertical screw (403) is connected to the first driven wheel (407), and the first synchronous belt (408) is sleeved outside the first driving wheel (406) and the first driven wheel (407).

6. The IC testing apparatus according to claim 4, wherein the vertical driving system (40) further comprises a vertical rail (411) and a vertical slider (412), the vertical rail (411) is fixedly connected with the pressing rod (405), the vertical slider (412) is slidably matched with the vertical rail (411), and the vertical slider (412) is fixedly connected with the fixing frame (401).

7. The IC testing apparatus according to claim 6, wherein the vertical drive system (40) comprises at least one pair of the vertical guide rails (411), the at least one pair of the vertical guide rails (411) are symmetrically disposed on both sides of the pressing bar (405), and the testing indenter (60) is at least partially clamped between the at least one pair of the vertical guide rails (411).

8. The IC testing apparatus according to claim 1, wherein the vertical driving system (40) comprises a fixed frame (401), the fixed frame (401) is fixed on the horizontal driving system (20), and the horizontal driving system (20) comprises: second driving source (201), horizontal lead screw (202) and horizontal nut (203), second driving source (201) fixed mounting in detect platform (1), the output shaft of second driving source (201) horizontal lead screw (202), in order to drive horizontal lead screw (202) rotate, horizontal nut (203) cover is located the horizontal lead screw (202) outside, and with horizontal lead screw (202) screw-thread fit, mount (401) fixed connection horizontal nut (203), in order when second driving source (201) drive horizontal lead screw (202) rotate, vertical actuating system (40) can be followed the length direction removal of horizontal lead screw (202).

9. The IC testing apparatus according to claim 8, wherein the horizontal driving system (20) further comprises a horizontal guide rail (204) and a horizontal slider (205), the horizontal guide rail (204) is fixed on the testing platform (1), the horizontal slider (205) is slidably engaged with the horizontal guide rail (204), and the horizontal slider (205) is fixedly connected to the fixing frame (401).

10. The IC testing apparatus according to claim 8, wherein the horizontal driving system (20) further comprises a second driving wheel (208), a second driven wheel (209), and a second synchronous belt (210), the second driving source (201) is connected to the second driving wheel (208), one end of the horizontal screw (202) is connected to the second driven wheel (209), and the second synchronous belt (210) is sleeved outside the second driving wheel (208) and the second driven wheel (209).

11. The IC testing apparatus of claim 8, wherein the horizontal drive system (20) further comprises a balancing assembly comprising a balancing screw (212), a first balancing seat (213), a second balancing seat (214), a balancing nut (215), and a balancing weight (216),

the balance screw rod (212) and the horizontal screw rod (202) are arranged in parallel,

one end of the balance screw rod (212) is connected with the second driving source (201) so as to drive the balance screw rod (212) to rotate through the second driving source (201),

the first balance support (213) and the second balance support (214) are fixed on the detection platform (1), the first balance support (213) and the second balance support (214) are respectively sleeved at two ends of the balance screw rod (212) and are in rotating fit with the balance screw rod (212),

the balance nut (215) is sleeved on the outer side of the balance screw rod (212) and is in threaded fit with the balance screw rod (212), the balancing weight (216) is sleeved on the outer side of the balance screw rod (212) and is fixedly connected with the balance nut (215),

when the second driving source (201) rotates, the vertical driving system (40) moves along the length direction of the horizontal screw rod (202), the counterweight block (216) moves along the length direction of the balance screw rod (212), and the moving direction of the counterweight block (216) is opposite to the moving direction of the vertical driving system (40).

12. The IC testing device according to claim 11, wherein the balance assembly further comprises a balance driving wheel (217), a balance driven wheel (218), and a balance synchronous belt (219), the second driving source (201) is connected to the balance driving wheel (217), one end of the balance screw (212) is connected to the balance driven wheel (218), and the balance synchronous belt (219) is sleeved outside the balance driving wheel (217) and the balance driven wheel (218).

13. The IC testing apparatus of claim 11, wherein the balancing assembly further comprises a balancing rail (220), the weight (216) being in sliding engagement with the balancing rail (220).

14. The IC testing apparatus according to claim 1, wherein a through hole (101) is formed in the geometric center of the testing platform (1), a testing area (102) is disposed below the through hole (101),

the horizontal drive system (20) is mounted on the testing platform (1) and the vertical drive system (40) at least partially passes through the through hole (101) to enable the test indenter (60) to move to the test zone (102).

15. The IC testing device according to claim 14, wherein the detection platform (1) is provided with two testing mechanisms (2), and the two testing mechanisms (2) are symmetrically arranged at two sides of the through hole (101); two groups of material conveying assemblies (3) are arranged below the detection platform (1), and the two groups of material conveying assemblies (3) are respectively positioned on two sides of the test area (102).