CN114657611B - Alkaline copper electroplating solution and electroplating method thereof - Google Patents
Alkaline copper electroplating solution and electroplating method thereof Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 61
- 239000010949 copper Substances 0.000 title claims abstract description 61
- 238000009713 electroplating Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 79
- 150000003839 salts Chemical class 0.000 claims abstract description 21
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 13
- 239000008139 complexing agent Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000005282 brightening Methods 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229940091173 hydantoin Drugs 0.000 claims abstract description 10
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical group [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 16
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 12
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 12
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical group FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 8
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 8
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 8
- 229940116318 copper carbonate Drugs 0.000 claims description 7
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 7
- 239000004323 potassium nitrate Substances 0.000 claims description 6
- 235000010333 potassium nitrate Nutrition 0.000 claims description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical group [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 6
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 6
- 150000001469 hydantoins Chemical class 0.000 claims description 5
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- 229940053195 antiepileptics hydantoin derivative Drugs 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000001556 precipitation Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 7
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical group [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 3
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 3
- 235000011180 diphosphates Nutrition 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229940058012 1,3-dimethylol-5,5-dimethylhydantoin Drugs 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- WSDISUOETYTPRL-UHFFFAOYSA-N dmdm hydantoin Chemical compound CC1(C)N(CO)C(=O)N(CO)C1=O WSDISUOETYTPRL-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- ODWOCWFQVSSOFE-UHFFFAOYSA-N [Cu].C(C(O)C(O)C(=O)O)(=O)O.C(CC(O)(C(=O)O)CC(=O)O)(=O)O Chemical compound [Cu].C(C(O)C(O)C(=O)O)(=O)O.C(CC(O)(C(=O)O)CC(=O)O)(=O)O ODWOCWFQVSSOFE-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- HPAXFNMMMBLYJU-UHFFFAOYSA-N copper sulfamic acid Chemical compound [Cu].S(N)(O)(=O)=O HPAXFNMMMBLYJU-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- VRLDVERQJMEPIF-UHFFFAOYSA-N dbdmh Chemical compound CC1(C)N(Br)C(=O)N(Br)C1=O VRLDVERQJMEPIF-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
The invention belongs to the technical field of electroplating, and discloses alkaline copper electroplating solution and an electroplating method thereof. The alkaline copper plating solution of the present invention comprises the following components in concentration: 80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent, water as solvent and pH of 9.0-11.0. The invention uses hydantoin and the derivatives thereof as complexing agents, and the hydantoin and the derivatives thereof coordinate with copper ions to lead the cathode deposition potential of copper to be more negative, thus obtaining a fine, smooth and bright copper plating layer. In addition, the electroplating solution also contains a reducing agent, improves the dispersion capacity of the electroplating solution, and can promote the precipitation of anode copper ions and regulate and control the deposition speed. The copper plating layer obtained by adopting the electroplating solution and the electroplating process has good combination with the matrix, low porosity, smooth surface and bright color.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to alkaline copper electroplating solution and an electroplating method thereof.
Background
With the development of industrialization, in order to meet the requirements of industrial products for performance, a process of electroplating on the surface of the industrial products is increasingly paid attention. The plating layer can endow the parts with higher corrosion resistance, high-temperature oxidation resistance, good conductivity, high hardness, high wear resistance and other physical and chemical properties, and can also play a role in decoration, such as providing vivid color or specular luster and the like.
At present, the plating layer obtained by the cyanide copper plating process has fine crystallization and good bonding force with a matrix, is a mature electroplating process at present, and has been widely applied to the bottoming plating layers of various metal matrix materials for a long time. However, cyanide in the plating solution is highly toxic and has an influence on the environment and human health. On this basis, researchers have developed clean and environmentally friendly copper plating processes to replace traditional cyanide copper plating systems, such as pyrophosphate copper plating, sulfate copper plating, citric acid-tartaric acid copper plating, sulfamic acid copper plating, and the like. Although the pyrophosphate copper electroplating system is applied to production on a large scale, the pyrophosphate copper electroplating system also needs to be subjected to pre-copper plating treatment in practical application, and the cost of the plating solution is high; the sulfate copper plating system needs to be continuously supplemented with sulfuric acid, and the binding force between a plating layer and a substrate is poor during direct plating. In conclusion, the existing cyanide-free copper plating process generally has the problems of poor performance of electroplating solution, low plating quality and poor bonding force with a substrate, and the cyanide-free copper plating process is seriously limited to be completely replaced by the cyanide copper plating process in industry.
Therefore, how to provide a cyanide-free copper plating process has great significance to the development of the electroplating industry.
Disclosure of Invention
The invention aims to provide an alkaline copper plating solution and an electroplating method thereof, which solve the problems existing in the prior cyanide-free copper plating process.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides an alkaline copper electroplating solution, which comprises the following components in percentage by weight:
80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent and water as solvent;
the pH of the alkaline copper plating solution is 9.0 to 11.0.
Preferably, in the above alkaline copper plating solution, the main salt is basic copper carbonate.
Preferably, in the above alkaline copper plating solution, the complexing agent is disodium edetate, hydantoin or a hydantoin derivative.
Preferably, in the above alkaline copper plating solution, the reducing agent is sodium hypophosphite.
Preferably, in the above alkaline copper plating solution, the conductive salt is potassium carbonate, potassium nitrate or potassium hydroxide.
Preferably, in the above alkaline copper plating solution, the brightening agent is sodium thiosulfate or furan.
Preferably, in the above-mentioned alkaline copper plating solution, the pH of the alkaline copper plating solution is adjusted with ammonia water.
The invention also provides a method for electroplating a workpiece by using the alkaline copper electroplating solution, wherein metal copper is used as an anode, the workpiece to be electroplated is used as a cathode for electroplating, and the current density of the cathode is 0.5-2A/dm 2 The electroplating time is 5-60 min, and the electroplating temperature is 40-50 ℃.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention uses hydantoin and the derivatives thereof as complexing agents, and the hydantoin and the derivatives thereof coordinate with copper ions to lead the cathode deposition potential of copper to be more negative, thus obtaining a fine, smooth and bright copper plating layer. In addition, the electroplating solution also contains a reducing agent, improves the dispersion capacity of the electroplating solution, and can promote the precipitation of anode copper ions and regulate and control the deposition speed.
(2) The copper plating layer obtained by adopting the electroplating solution and the electroplating process has good combination with the matrix, low porosity, smooth surface and bright color.
Detailed Description
The invention provides an alkaline copper electroplating solution, which comprises the following components in percentage by weight:
80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent and water as solvent;
the pH of the alkaline copper plating solution is 9.0 to 11.0.
In the present invention, an alkaline copper plating solution, preferably, comprises the following components in the following concentrations: 82-97 g/L of main salt, 114-155 g/L of complexing agent, 13-28 g/L of reducing agent, 0.07-0.15 g/L of conductive salt, 0.12-0.26 g/L of brightening agent and water as solvent;
further preferred, the composition comprises the following concentrations: 86-94 g/L of main salt, 123-146 g/L of complexing agent, 16-23 g/L of reducing agent, 0.09-0.13 g/L of conductive salt, 0.17-0.24 g/L of brightening agent and water as solvent;
more preferably, the composition comprises the following concentrations: 89g/L of main salt, 135g/L of complexing agent, 18g/L of reducing agent, 0.1g/L of conductive salt, 0.2g/L of brightening agent and water as solvent.
In the present invention, the pH of the alkaline copper plating solution is preferably 9.0 to 11.0, more preferably 9.2 to 10.7, and still more preferably 9.9.
In the present invention, the main salt is preferably basic copper carbonate.
In the present invention, the complexing agent is preferably disodium edetate, hydantoin or a hydantoin derivative, more preferably hydantoin or a hydantoin derivative, and even more preferably hydantoin.
In the present invention, the hydantoin derivative is preferably one or more of 5, 5-dimethylhydantoin, 1, 5-trimethylhydantoin, 1, 3-dibromo-5, 5-dimethylhydantoin and 1, 3-dimethylol-5, 5-dimethylhydantoin, more preferably one or more of 5, 5-dimethylhydantoin, 1, 5-trimethylhydantoin and 1, 3-dimethylol-5, 5-dimethylhydantoin, and still more preferably 5, 5-dimethylhydantoin.
In the present invention, the reducing agent is preferably sodium hypophosphite.
In the present invention, the conductive salt is preferably potassium carbonate, potassium nitrate or potassium hydroxide, more preferably potassium carbonate or potassium nitrate, and still more preferably potassium carbonate.
In the present invention, the brightening agent is preferably sodium thiosulfate or furan, and more preferably sodium thiosulfate.
In the present invention, the pH of the alkaline copper plating solution is preferably adjusted with ammonia, more preferably 10 to 20% by volume of ammonia, and still more preferably 14% by volume of ammonia.
The invention also provides a method for electroplating a workpiece by using the alkaline copper electroplating solution, wherein metal copper is used as an anode, the workpiece to be electroplated is used as a cathode for electroplating, and the current density of the cathode is 0.5-2A/dm 2 The electroplating time is 5-60 min, and the electroplating temperature is 40-50 ℃.
In the present invention, the current density of the cathode is preferably 0.6 to 1.9A/dm 2 More preferably 0.7 to 1.6A/dm 2 More preferably 1.2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The time for plating is preferably 6 to 54 minutes, more preferably 7 to 35 minutes, and still more preferably 11 minutes; the plating temperature is preferably 41 to 49 ℃, more preferably 42 to 47 ℃, and even more preferably 46 ℃.
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
This example provides an alkaline copper plating solution comprising the following concentrations of components:
90g/L of basic copper carbonate, 150g/L of 5, 5-dimethylhydantoin, 15g/L of sodium hypophosphite, 0.15g/L of potassium carbonate and 0.2g/L of sodium thiosulfate, wherein the solvent is water;
the pH of the alkaline copper plating solution was adjusted to 9.3 using 10% by volume aqueous ammonia.
The electroplating method comprises the following steps: copper plate (size of 10mm×10mm×0.2mm, sanded, washed, dried) was used as anode, Q235 steel plate (size of 10mm×10mm×0.2mm, sanded, deoiled, washed, dried) was used as cathode, and current density of the cathode was 1A/dm 2 The electroplating time is 20min, and the electroplating temperature is 45 ℃.
Example 2
This example provides an alkaline copper plating solution comprising the following concentrations of components:
85g/L of basic copper carbonate, 120g/L of disodium ethylenediamine tetraacetate, 20g/L of sodium hypophosphite, 0.05g/L of potassium nitrate, 0.1g/L of sodium thiosulfate and water as a solvent;
the pH of the alkaline copper plating solution was adjusted to 9.0 using 14% by volume aqueous ammonia.
The electroplating method comprises the following steps: copper plate (size of 10mm×10mm×0.2mm, sanded, washed, dried) was used as anode, Q235 steel plate (size of 10mm×10mm×0.2mm, sanded, deoiled, washed, dried) was used as cathode, and current density of the cathode was 0.5A/dm 2 The electroplating time was 10min and the electroplating temperature was 50 ℃.
Example 3
This example provides an alkaline copper plating solution comprising the following concentrations of components:
90g/L of basic copper carbonate, 160g/L of 1, 5-trimethylhydantoin, 30g/L of sodium hypophosphite, 0.2g/L of potassium nitrate and 0.2g/L of furan, and the solvent is water;
the pH of the alkaline copper plating solution was adjusted to 10.0 using 15% by volume aqueous ammonia.
The electroplating method comprises the following steps: copper plate (size of 10mm x 0.2mm, polished by sand paper),Washing and drying treatment) as an anode, a Q235 steel plate (10 mm. Times.10 mm. Times.0.2 mm in size, sanded, deoiled, washed and dried) as a cathode having a current density of 2A/dm 2 The electroplating time is 40min, and the electroplating temperature is 50 ℃.
Example 4
This example provides an alkaline copper plating solution comprising the following concentrations of components:
100g/L of basic copper carbonate, 100g/L of hydantoin, 20g/L of sodium hypophosphite, 0.2g/L of potassium carbonate and 0.3g/L of furan, wherein the solvent is water;
the pH of the alkaline copper plating solution was adjusted to 11.0 using 20% by volume aqueous ammonia.
The electroplating method comprises the following steps: copper plate (size of 10mm×10mm×0.2mm, sanded, washed, dried) was used as anode, Q235 steel plate (size of 10mm×10mm×0.2mm, sanded, deoiled, washed, dried) was used as cathode, and current density of the cathode was 1A/dm 2 The electroplating time is 60min, and the electroplating temperature is 40 ℃.
Comparative example 1
This comparative example provides an alkaline copper plating solution, see in particular example 1, except that sodium hypophosphite is not included.
The electroplating process is described in example 1.
Comparative example 2
This comparative example provides an alkaline copper plating solution, see in particular example 1, with the exception that the potassium carbonate concentration is 1g/L.
The electroplating process is described in example 1.
Plating solution dispersibility:
the test is carried out by adopting a far-near cathode method, wherein the test groove is a Hall groove, the electroplating temperature is 50 ℃, the cathode current is 1.0A, the electroplating time is 30min, the cathode is an iron sheet, and the ratio of the distance from the far cathode to the distance from the near cathode to the distance from the anode is 2. The results of the dispersibility test are shown in Table 1.
Deep plating ability of plating solution:
the inner hole method is adopted for measurement, the cathode is a copper pipe with the inner diameter of l10mm and the pipe length of 50mm, and one end is closed. During testing, the distance between the pipe orifice and the anode is 80mm, the cathode current is 0.2A, and the electroplating time is 30min. The results of the deep plating ability test are shown in table 1.
Coating bonding strength:
and (3) measuring the binding force of the plating layer by adopting a scribing method, scribing the electrodeposited plating layer by using a hard scribing cutter with the cutting edge of 30 degrees to form parallel lines with the distance of 2mm, and observing whether the scribed plating layer is tilted or peeled off. The plating bond strength test results are shown in table 1.
TABLE 1 plating solution and plating Performance test results
As can be seen from Table 1, the plating solution of the present invention has good dispersibility and deep plating ability, and as can be seen from the comparison of comparative example 1 and example 1, the use of the reducing agent in the plating solution effectively improves the dispersibility and deep plating ability of the plating solution. The test result of the bonding strength of the plating layer shows that the copper plating layer obtained by adopting the plating solution and the plating process has good bonding with the substrate, low porosity, smooth surface and bright color of the plating layer, and the plating layer has the color affected by pocking marks caused by excessive use of conductive salt.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (3)
1. An alkaline copper plating solution comprising the following components in concentration:
80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent and water as solvent;
the pH value of the alkaline copper plating solution is 9.0-11.0;
the main salt is basic copper carbonate;
the complexing agent is hydantoin or hydantoin derivatives;
the reducing agent is sodium hypophosphite;
the conductive salt is potassium carbonate, potassium nitrate or potassium hydroxide;
the brightening agent is sodium thiosulfate or furan.
2. The alkaline copper plating solution of claim 1, wherein the pH of the alkaline copper plating solution is adjusted with ammonia.
3. A method for plating a workpiece by using the alkaline copper plating solution as claimed in claim 1 or 2, wherein the workpiece to be plated is plated by using metallic copper as an anode and a cathode, and the current density of the cathode is 0.5-2A/dm 2 The electroplating time is 5-60 min, and the electroplating temperature is 40-50 ℃.
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| US20080156652A1 (en) * | 2006-12-28 | 2008-07-03 | Chang Gung University | Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof |
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| CN103046089A (en) * | 2012-12-28 | 2013-04-17 | 广东达志环保科技股份有限公司 | Functional copper electroplating solution of and method thereof |
| CN104630846A (en) * | 2013-11-08 | 2015-05-20 | 无锡市雪江环境工程设备有限公司 | Electroplating solution for EDTA salt cyanide-free copper plating and electroplating method |
| CN105671600A (en) * | 2016-03-16 | 2016-06-15 | 武汉奥邦表面技术有限公司 | Cyanogen-free alkaline copper electroplating solution |
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