CN114657611A - Alkaline copper electroplating solution and electroplating method thereof - Google Patents
Alkaline copper electroplating solution and electroplating method thereof Download PDFInfo
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- CN114657611A CN114657611A CN202210415473.2A CN202210415473A CN114657611A CN 114657611 A CN114657611 A CN 114657611A CN 202210415473 A CN202210415473 A CN 202210415473A CN 114657611 A CN114657611 A CN 114657611A
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- electroplating
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- alkaline copper
- copper plating
- alkaline
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- 238000009713 electroplating Methods 0.000 title claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 66
- 239000010949 copper Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000007747 plating Methods 0.000 claims abstract description 63
- 150000003839 salts Chemical class 0.000 claims abstract description 21
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 13
- 239000008139 complexing agent Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229940091173 hydantoin Drugs 0.000 claims abstract description 8
- 238000005282 brightening Methods 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical group [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 16
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 12
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 10
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 9
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical group FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 8
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 8
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 8
- 229940116318 copper carbonate Drugs 0.000 claims description 7
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 7
- 239000004323 potassium nitrate Substances 0.000 claims description 6
- 235000010333 potassium nitrate Nutrition 0.000 claims description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical group [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 6
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 6
- 150000001469 hydantoins Chemical class 0.000 claims description 5
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 4
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical group [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 4
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 229910001431 copper ion Inorganic materials 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 2
- 238000001556 precipitation Methods 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- ZNYIPTYJBRGSSL-UHFFFAOYSA-N 1,5,5-trimethylimidazolidine-2,4-dione Chemical compound CN1C(=O)NC(=O)C1(C)C ZNYIPTYJBRGSSL-UHFFFAOYSA-N 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229940058012 1,3-dimethylol-5,5-dimethylhydantoin Drugs 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 2
- 235000011180 diphosphates Nutrition 0.000 description 2
- WSDISUOETYTPRL-UHFFFAOYSA-N dmdm hydantoin Chemical compound CC1(C)N(CO)C(=O)N(CO)C1=O WSDISUOETYTPRL-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- ODWOCWFQVSSOFE-UHFFFAOYSA-N [Cu].C(C(O)C(O)C(=O)O)(=O)O.C(CC(O)(C(=O)O)CC(=O)O)(=O)O Chemical compound [Cu].C(C(O)C(O)C(=O)O)(=O)O.C(CC(O)(C(=O)O)CC(=O)O)(=O)O ODWOCWFQVSSOFE-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- HPAXFNMMMBLYJU-UHFFFAOYSA-N copper sulfamic acid Chemical compound [Cu].S(N)(O)(=O)=O HPAXFNMMMBLYJU-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- VRLDVERQJMEPIF-UHFFFAOYSA-N dbdmh Chemical compound CC1(C)N(Br)C(=O)N(Br)C1=O VRLDVERQJMEPIF-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
The invention belongs to the technical field of electroplating, and discloses alkaline copper electroplating solution and an electroplating method thereof. The alkaline copper plating solution of the present invention comprises the following components in the following concentrations: 80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent, water as solvent and pH of 9.0-11.0. The invention uses hydantoin and derivatives thereof as complexing agents which coordinate with copper ions to make the deposition potential of the cathode of copper more negative, thereby obtaining a fine, smooth and bright copper coating. In addition, the electroplating solution also contains a reducing agent, so that the dispersing capacity of the electroplating solution is improved, the precipitation of anode copper ions can be promoted, and the deposition speed can be regulated and controlled. The copper plating layer obtained by the electroplating solution and the electroplating process has good combination with a substrate, low porosity, flat plating layer surface and bright color.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to alkaline copper electroplating solution and an electroplating method thereof.
Background
With the development of the industrialization process, in order to meet the performance requirements of industrial products, the process of electroplating on the surface of the industrial products is more and more emphasized. The plating layer can endow the parts with higher corrosion resistance, high-temperature oxidation resistance, good conductivity, high hardness, high wear resistance and other physical and chemical properties, and simultaneously can play a decorative role, such as providing bright color or mirror surface gloss and the like.
At present, a plating layer obtained by a cyanide copper plating process has fine crystals and good bonding force with a substrate, is a mature electroplating process at present, and has been widely applied to priming plating layers of various metal substrate materials for a long time. However, cyanide in the plating solution is highly toxic and has an influence on the environment and human health. On the basis, researchers have developed clean and environment-friendly copper plating processes to replace traditional cyanide copper plating, such as pyrophosphate copper plating, sulfate copper plating, citric acid-tartaric acid copper plating, sulfamic acid copper plating and other systems. The pyrophosphate copper electroplating system is applied to production in a large scale, but needs to be subjected to copper pre-plating treatment in actual application, and the cost of the plating solution is high; the sulfate copper electroplating system needs to continuously supplement sulfuric acid, and the binding force between a plating layer and a substrate is poor when the sulfate copper electroplating system is directly electroplated. In conclusion, the problems of poor performance of electroplating solution, low quality of plating layer and poor binding force with a substrate generally exist in the existing cyanide-free copper plating process, and the cyanide-free copper plating process is seriously limited to replace the cyanide copper plating process industrially.
Therefore, how to provide a cyanide-free copper plating process is of great significance to the development of the electroplating industry.
Disclosure of Invention
The invention aims to provide an alkaline copper electroplating solution and an electroplating method thereof, which solve the problems of the existing cyanide-free copper plating process.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides an alkaline copper electroplating solution, which comprises the following components in concentration:
80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent and water as solvent;
the pH of the alkaline copper plating solution is 9.0 to 11.0.
Preferably, in one of the above alkaline copper plating solutions, the primary salt is basic copper carbonate.
Preferably, in the above alkaline copper plating solution, the complexing agent is disodium ethylenediaminetetraacetate, hydantoin or a hydantoin derivative.
Preferably, in one of the above alkaline copper plating solutions, the reducing agent is sodium hypophosphite.
Preferably, in the above-mentioned one alkaline copper plating solution, the conductive salt is potassium carbonate, potassium nitrate or potassium hydroxide.
Preferably, in the above-mentioned one alkaline copper plating solution, the brightener is sodium thiosulfate or furan.
Preferably, in the above-described alkaline copper plating solution, the pH of the alkaline copper plating solution is adjusted with ammonia water.
The invention also provides a method for electroplating a workpiece by using the alkaline copper electroplating solution, which comprises the step of electroplating by using metal copper as an anode and a workpiece to be electroplated as a cathode, wherein the current density of the cathode is 0.5-2A/dm2The electroplating time is 5-60 min, and the electroplating temperature is 40-50 ℃.
Through the technical scheme, compared with the prior art, the invention has the following beneficial effects:
(1) the invention uses hydantoin and derivatives thereof as complexing agents which coordinate with copper ions to make the deposition potential of the cathode of copper more negative, thereby obtaining a fine, smooth and bright copper coating. In addition, the electroplating solution also contains a reducing agent, so that the dispersing capacity of the electroplating solution is improved, the precipitation of anode copper ions can be promoted, and the deposition speed can be regulated and controlled.
(2) The copper plating layer obtained by the electroplating solution and the electroplating process has good combination with a substrate, low porosity, flat plating layer surface and bright color.
Detailed Description
The invention provides an alkaline copper electroplating solution, which comprises the following components in concentration:
80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent and water as solvent;
the pH of the alkaline copper plating solution is 9.0 to 11.0.
In the present invention, an alkaline copper plating solution preferably includes the following components in the following concentrations: 82-97 g/L of main salt, 114-155 g/L of complexing agent, 13-28 g/L of reducing agent, 0.07-0.15 g/L of conductive salt, 0.12-0.26 g/L of brightening agent and water as solvent;
further preferred, the following concentrations of components are included: 86-94 g/L of main salt, 123-146 g/L of complexing agent, 16-23 g/L of reducing agent, 0.09-0.13 g/L of conductive salt, 0.17-0.24 g/L of brightening agent and water as solvent;
more preferably, the following concentrations of components are included: 89g/L of main salt, 135g/L of complexing agent, 18g/L of reducing agent, 0.1g/L of conductive salt, 0.2g/L of brightening agent and water as solvent.
In the present invention, the pH of the alkaline copper plating solution is preferably 9.0 to 11.0, more preferably 9.2 to 10.7, and still more preferably 9.9.
In the present invention, the main salt is preferably basic copper carbonate.
In the present invention, the complexing agent is preferably disodium ethylenediaminetetraacetate, hydantoin or a hydantoin derivative, more preferably hydantoin or a hydantoin derivative, and still more preferably hydantoin.
In the present invention, the hydantoin derivative is preferably one or more selected from the group consisting of 5, 5-dimethylhydantoin, 1,5, 5-trimethylhydantoin, 1, 3-dibromo-5, 5-dimethylhydantoin and 1, 3-dimethylol-5, 5-dimethylhydantoin, more preferably one or more selected from the group consisting of 5, 5-dimethylhydantoin, 1,5, 5-trimethylhydantoin and 1, 3-dimethylol-5, 5-dimethylhydantoin, and even more preferably 5, 5-dimethylhydantoin.
In the present invention, the reducing agent is preferably sodium hypophosphite.
In the present invention, the conductive salt is preferably potassium carbonate, potassium nitrate or potassium hydroxide, more preferably potassium carbonate or potassium nitrate, and still more preferably potassium carbonate.
In the present invention, the brightener is preferably sodium thiosulfate or furan, and more preferably sodium thiosulfate.
In the present invention, the pH of the alkaline copper plating solution is preferably adjusted with ammonia water, more preferably with 10 to 20% by volume of ammonia water, and still more preferably with 14% by volume of ammonia water.
The invention also provides a method for electroplating a workpiece by using the alkaline copper electroplating solution, which comprises the step of electroplating by using metal copper as an anode and a workpiece to be electroplated as a cathode, wherein the current density of the cathode is 0.5-2A/dm2Of electroplatingThe time is 5-60 min, and the electroplating temperature is 40-50 ℃.
In the present invention, the current density of the cathode is preferably 0.6 to 1.9A/dm2More preferably 0.7 to 1.6A/dm2More preferably 1.2A/dm2(ii) a The electroplating time is preferably 6-54 min, more preferably 7-35 min, and even more preferably 11 min; the plating temperature is preferably 41 to 49 ℃, more preferably 42 to 47 ℃, and even more preferably 46 ℃.
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Example 1
This example provides an alkaline copper plating solution comprising the following components in the following concentrations:
90g/L of basic copper carbonate, 150g/L of 5, 5-dimethylhydantoin, 15g/L of sodium hypophosphite, 0.15g/L of potassium carbonate, 0.2g/L of sodium thiosulfate and water as a solvent;
the pH of the alkaline copper plating solution was adjusted to 9.3 using 10% by volume ammonia water.
The electroplating method comprises the following steps: using copper plate (with size of 10mm × 10mm × 0.2mm, and processed by sanding, washing, and drying) as anode, and Q235 steel plate (with size of 10mm × 10mm × 0.2mm, and processed by sanding, degreasing, washing, and drying) as cathode, wherein the current density of the cathode is 1A/dm2The electroplating time is 20min, and the electroplating temperature is 45 ℃.
Example 2
This example provides an alkaline copper plating solution comprising the following components in the following concentrations:
85g/L of basic copper carbonate, 120g/L of disodium ethylene diamine tetraacetate, 20g/L of sodium hypophosphite, 0.05g/L of potassium nitrate, 0.1g/L of sodium thiosulfate and water as a solvent;
the pH of the alkaline copper plating solution was adjusted to 9.0 using 14% by volume ammonia water.
The electroplating method comprises the following steps: copper plate (10 mm × 10mm × 0.2mm in size, sanded, washed, and dried) was used as an anode, Q235 steel plate (10 mm × 10mm × 0.2mm in size, sanded, deoiled, washed, and dried) was used as a cathode, and the current density of the cathode was 0.5A/dm2The electroplating time is 10min, and the electroplating temperature is 50 ℃.
Example 3
This example provides an alkaline copper plating solution comprising the following components in the following concentrations:
90g/L of basic copper carbonate, 160g/L of 1,5, 5-trimethylhydantoin, 30g/L of sodium hypophosphite, 0.2g/L of potassium nitrate, 0.2g/L of furan and water as a solvent;
the pH of the alkaline copper plating solution was adjusted to 10.0 using 15% by volume ammonia water.
The electroplating method comprises the following steps: copper plate (10 mm × 10mm × 0.2mm in size, sanded, washed, and dried) was used as an anode, and Q235 steel plate (10 mm × 10mm × 0.2mm in size, sanded, deoiled, washed, and dried) was used as a cathode, the current density of which was 2A/dm2The electroplating time is 40min, and the electroplating temperature is 50 ℃.
Example 4
This example provides an alkaline copper plating solution comprising the following components in the following concentrations:
100g/L of basic copper carbonate, 100g/L of hydantoin, 20g/L of sodium hypophosphite, 0.2g/L of potassium carbonate, 0.3g/L of furan and water as a solvent;
the pH of the alkaline copper plating solution was adjusted to 11.0 using 20% by volume ammonia water.
The electroplating method comprises the following steps: using copper plate (with size of 10mm × 10mm × 0.2mm, and processed by sanding, washing, and drying) as anode, and Q235 steel plate (with size of 10mm × 10mm × 0.2mm, and processed by sanding, degreasing, washing, and drying) as cathode, wherein the current density of the cathode is 1A/dm2The electroplating time is 60min, and the electroplating temperature is 40 ℃.
Comparative example 1
This comparative example provides an alkaline copper electroplating bath, see example 1 for details, except that sodium hypophosphite is not included.
See example 1 for plating methods.
Comparative example 2
This comparative example provides an alkaline copper electroplating bath, see in particular example 1, with the exception that the potassium carbonate concentration is 1 g/L.
See example 1 for plating methods.
Plating solution dispersibility:
the testing is carried out by adopting a far-near cathode method, the testing groove is a Hull groove, the electroplating temperature is 50 ℃, the cathode current is 1.0A, the electroplating time is 30min, the cathode is an iron sheet, and the ratio of the distances from the far cathode to the anode to the distances from the near cathode to the anode is 2. The results of the dispersibility test are shown in table 1.
Deep plating capability of the electroplating solution:
the cathode is a copper tube with the inner diameter of l10mm and the length of 50mm, and one end of the copper tube is closed. During testing, the distance between the pipe orifice and the anode is 80mm, the cathode current is 0.2A, and the electroplating time is 30 min. The results of the throwing power test are shown in Table 1.
Coating bonding strength:
the binding force of the coating is measured by adopting a scribing method, the electrodeposited coating is scribed by a hard scribing knife with a cutting edge of 30 degrees into parallel lines with a distance of 2mm, and whether the scribed coating is tilted or peeled is observed. The results of the plating bond strength test are shown in table 1.
TABLE 1 electroplating baths and plating property test results
As is apparent from Table 1, the plating liquid of the present invention has good dispersibility and throwing power, and from the comparison of comparative example 1 and example 1, the use of the reducing agent in the plating liquid is effective in improving the dispersibility and throwing power of the plating liquid. The test result of the bonding strength of the plating layer shows that the copper plating layer obtained by adopting the electroplating solution and the electroplating process has good bonding with a substrate, low porosity, flat surface and bright color, and pocking marks can occur when the amount of the conductive salt is too much, so that the color of the plating layer is influenced.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. An alkaline copper electroplating bath, comprising the following components in the following concentrations:
80-100 g/L of main salt, 100-160 g/L of complexing agent, 10-30 g/L of reducing agent, 0.05-0.2 g/L of conductive salt, 0.1-0.3 g/L of brightening agent and water as solvent;
the pH of the alkaline copper plating solution is 9.0 to 11.0.
2. The alkaline copper plating solution according to claim 1, wherein the primary salt is basic copper carbonate.
3. The alkaline copper plating solution according to claim 1 or 2, wherein the complexing agent is disodium ethylenediaminetetraacetate, hydantoin or a hydantoin derivative.
4. The alkaline copper electroplating bath according to claim 1 or 2, wherein the reducing agent is sodium hypophosphite.
5. The alkaline copper electroplating solution according to claim 3, wherein the conductive salt is potassium carbonate, potassium nitrate or potassium hydroxide.
6. The alkaline copper electroplating bath as set forth in claim 1 or claim 5 wherein the brightener is sodium thiosulfate or furan.
7. The alkaline copper plating solution according to claim 1, wherein the pH of the alkaline copper plating solution is adjusted using ammonia water.
8. A method of electroplating a workpiece using the alkaline copper electroplating solution as claimed in any one of claims 1 to 7, wherein the electroplating is carried out using metallic copper as an anode and the workpiece to be electroplated as a cathode, the current density of the cathode being 0.5 to 2A/dm2The electroplating time is 5-60 min, and the electroplating temperature is 40-50 ℃.
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| US20080156652A1 (en) * | 2006-12-28 | 2008-07-03 | Chang Gung University | Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof |
| CN103014787A (en) * | 2012-12-28 | 2013-04-03 | 广东达志环保科技股份有限公司 | Copper-electroplating solution and electroplating process thereof |
| CN103046089A (en) * | 2012-12-28 | 2013-04-17 | 广东达志环保科技股份有限公司 | Functional copper electroplating solution of and method thereof |
| CN104630846A (en) * | 2013-11-08 | 2015-05-20 | 无锡市雪江环境工程设备有限公司 | Electroplating solution for EDTA salt cyanide-free copper plating and electroplating method |
| CN105671600A (en) * | 2016-03-16 | 2016-06-15 | 武汉奥邦表面技术有限公司 | Cyanogen-free alkaline copper electroplating solution |
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