CN114657520A - Fixing method of planar target - Google Patents

Fixing method of planar target Download PDF

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Publication number
CN114657520A
CN114657520A CN202210210588.8A CN202210210588A CN114657520A CN 114657520 A CN114657520 A CN 114657520A CN 202210210588 A CN202210210588 A CN 202210210588A CN 114657520 A CN114657520 A CN 114657520A
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CN
China
Prior art keywords
vacuum
planar target
target
fixing
chuck
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Pending
Application number
CN202210210588.8A
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Chinese (zh)
Inventor
刘毅华
余芳
谭继军
雷永杰
林昊
裴炜炀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vital Thin Film Materials Guangdong Co Ltd
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Vital Thin Film Materials Guangdong Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vital Thin Film Materials Guangdong Co Ltd filed Critical Vital Thin Film Materials Guangdong Co Ltd
Priority to CN202210210588.8A priority Critical patent/CN114657520A/en
Publication of CN114657520A publication Critical patent/CN114657520A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a fixing method of a planar target, aiming at shortening the time consumption for fixing the planar target and improving the processing efficiency, and the technical scheme is as follows: a method for fixing a planar target, S1: placing a vacuum sucker on an electromagnetic sucker, starting the electromagnetic sucker to suck the vacuum sucker, and enabling the bottom surface of the vacuum sucker to be attached to the electromagnetic sucker; s2: placing the planar target on the top surface of a vacuum chuck and starting a vacuum pump to enable the vacuum chuck to adsorb and fix the planar target, wherein two adjacent side edges of the planar target are respectively parallel to an X axis and a Y axis of the electromagnetic chuck; s3: the cylinder is placed on the electromagnetic chuck, the bottom of the cylinder is attached to the electromagnetic chuck, a piston rod of the cylinder is arranged at the top of the cylinder and can stretch out and draw back up and down, and the piston rods of the two cylinders can abut against two side edges, adjacent to each other, of the plane target and used for tool setting when in an extending state, and the target processing technology field is achieved.

Description

Fixing method of planar target material
Technical Field
The invention belongs to the technical field of target processing, and particularly relates to a fixing method of a planar target.
Background
With the large-scale development of LCD and photo-excited display, the demand for large-area ITO target material is increasing. The planar target material occupies a leading position in both international and domestic markets, so that the improvement of the production efficiency of the planar target material is particularly important.
The existing plane target material is ground on the plane, the side is ground mostly in a CNC (computer numerical control) machining mode, the plane target material needs to be fixed before machining, and due to the particularity of the plane target material, the plane target material needs to be prevented from being damaged when being fixed.
For large-area planar targets and special-shaped planar targets, the conventional clamping method is a bonding method, when the planar target is fixed by the bonding method, a bonding material needs to be heated, then the planar target is fixed by cooling the bonding material, a large amount of time is consumed for heating and cooling, the planar target is easy to crack due to too large temperature difference, and the problem that the bonding material is difficult to clean in subsequent processes occurs; it can be seen that the time spent on fixing the planar target is very much, which greatly affects the processing efficiency of the planar target.
Disclosure of Invention
The invention mainly aims to provide a fixing method of a planar target, aiming at shortening the time consumption for fixing the planar target and improving the processing efficiency.
According to a first aspect of the present invention, a method for fixing a planar target is provided, which employs a target fixing device, wherein the target fixing device includes an electromagnetic chuck, a plurality of vacuum chucks capable of being magnetically attracted to the electromagnetic chuck, and at least two cylinders capable of being magnetically attracted to the electromagnetic chuck; further comprising the steps of:
s1: placing a vacuum sucker on an electromagnetic sucker, starting the electromagnetic sucker to suck the vacuum sucker, and enabling the bottom surface of the vacuum sucker to be attached to the electromagnetic sucker;
s2: placing the planar target on the top surface of a vacuum chuck and starting a vacuum pump to enable the vacuum chuck to adsorb and fix the planar target, wherein two adjacent side edges of the planar target are respectively parallel to an X axis and a Y axis of the electromagnetic chuck;
s3: the air cylinder is placed on the electromagnetic chuck, the bottom of the air cylinder is attached to the electromagnetic chuck, a piston rod of the air cylinder is arranged at the top of the air cylinder and can stretch up and down, and the piston rods of the two air cylinders can abut against two adjacent side edges of the plane target, which are used for tool setting, when the piston rods of the two air cylinders are in an extending state.
In the above method for fixing a planar target, the vacuum chucks are arranged in an array, and a distance between two adjacent vacuum chucks does not exceed 350 mm.
In the above method for fixing the planar target, the distance between the vacuum chuck close to the side of the planar target and the side is 8-120 mm.
In the fixing method of the planar target, the vacuum chuck comprises a first fixing block and a vacuum seat which are sequentially arranged from bottom to top, the first fixing block can be magnetically adsorbed on the electromagnetic chuck, and the top surface of the vacuum seat is provided with a plurality of air exhaust holes which are connected with a vacuum pump.
In the fixing method of the planar target, a sealing rubber ring is arranged around the top surface of the vacuum seat, the sealing rubber ring encloses the air exhaust hole, and the sealing rubber ring protrudes upwards to support the planar target.
In the above method for fixing the planar target, the top surface of the vacuum base is further provided with a plurality of bosses protruding upwards and used for supporting the planar target, and the protruding height of each boss is smaller than or equal to that of the sealing rubber ring.
In the above method for fixing the planar target, the bosses are all arranged in the sealing rubber ring.
In the above method for fixing the planar target, the boss is a circular boss.
In the fixing method of the planar target, a cavity is arranged in the vacuum seat, at least one through hole communicated with the cavity is arranged on the side surface of the vacuum seat, the air exhaust hole is communicated with the cavity, and the through hole is connected with the vacuum pump.
One of the above technical solutions of the present invention has at least one of the following advantages or beneficial effects:
according to the invention, the vacuum chuck is used for adsorbing and fixing the planar target, so that the time for heating and cooling the bonding material is saved, the electromagnetic chuck arranged on the CNC machine is used for setting the vacuum chuck into the material which can be magnetically adsorbed, the fixation of the vacuum chuck is facilitated, the time consumption for fixing the planar target is greatly shortened, and the processing efficiency is improved;
meanwhile, the air cylinders are arranged and can be magnetically adsorbed by the electromagnetic chuck, so that the CNC machine table is very convenient to fix, after the CNC machine table utilizes the first plane target to set the knife, the piston rods of the two air cylinders also position the two side edges used for setting the knife, when the next plane target with the same specification is fixed, only the two corresponding side edges are required to be tightly abutted to the piston rods of the two air cylinders, the knife does not need to be reset, and the time required for fixing the plane target is further shortened.
Drawings
The invention is further described with reference to the following figures and examples;
FIG. 1 is a fixed flow chart of example 1 of the present invention;
fig. 2 is a top view of a target fixing device according to embodiment 1 of the present invention;
fig. 3 is a front view of a target fixing device according to embodiment 1 of the present invention;
FIG. 4 is a plan view of the vacuum chuck in accordance with embodiment 1 of the present invention;
FIG. 5 is a front view of the vacuum chuck of embodiment 1 of the present invention;
FIG. 6 is a schematic structural view of a planar target fixed according to embodiment 1 of the present invention;
fig. 7 is a schematic view of the structure of comparative example 1 of the present invention when a planar target is fixed.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The following disclosure provides many different embodiments, or examples, for implementing different aspects of the invention.
Example 1
Referring to fig. 1 to 6, in an embodiment of the present invention, a method for fixing a planar target employs a target fixing device, where the target fixing device includes an electromagnetic chuck 1, a plurality of vacuum chucks 2 capable of being magnetically attracted to the electromagnetic chuck 1, and at least two cylinders 3 capable of being magnetically attracted to the electromagnetic chuck 1;
s1: placing the vacuum chuck 2 on the electromagnetic chuck 1, starting the electromagnetic chuck 1 to adsorb the vacuum chuck 2, and enabling the bottom surface of the vacuum chuck 2 to be attached to the electromagnetic chuck 1;
s2: placing the planar target on the top surface of the vacuum chuck 2 and starting the vacuum pump to enable the vacuum chuck 2 to adsorb and fix the planar target, wherein two adjacent side edges of the planar target are respectively parallel to the X axis and the Y axis of the electromagnetic chuck 1;
the planar target is adsorbed and fixed through the vacuum chuck 2, the time for heating and cooling the bonding material is saved, the vacuum chuck 2 is set to be the material which can be adsorbed by magnetism by utilizing the electromagnetic chuck 1 equipped on a CNC machine table, the fixation of the vacuum chuck 2 is facilitated, the time consumption for fixing the planar target is greatly shortened, and the processing efficiency is improved;
when the planar target is placed, the direction needs to be adjusted, two adjacent side edges of the planar target are respectively parallel to the X axis and the Y axis of the electromagnetic chuck 1, then the vacuum pump is started to adsorb the planar target, and during actual operation, whether the side edges of the planar target are parallel to the X axis or the Y axis of the electromagnetic chuck 1 can be judged through the ruler or the scale stripes on the electromagnetic chuck 1; as a concrete expression of the present embodiment, the planar target is generally a rectangular target;
s3: placing an air cylinder 3 on an electromagnetic chuck 1, wherein the bottom of the air cylinder 3 is attached to the electromagnetic chuck 1, a piston rod of the air cylinder 3 is arranged at the top of the air cylinder and can extend up and down, and the piston rods of the two air cylinders 3 can be tightly abutted against two adjacent side edges for tool setting of the planar target when in an extending state;
the cylinders 3 can be magnetically adsorbed by the electromagnetic chuck 1, so that the fixing is very convenient, after the CNC machine platform uses the first plane target to perform tool setting, the piston rods of the two cylinders 3 also position two side edges for tool setting, when the next plane target with the same specification is fixed, only the two corresponding side edges are required to be abutted against the piston rods of the two cylinders 3, the tool setting is not required to be performed again, and the time required for fixing the plane target is further shortened; when the CNC machine table polishes the side edge, the piston rod of the air cylinder 3 is in a retraction state, and when the planar target is fixed, the piston rod of the air cylinder 3 extends out for positioning;
when the cylinder 3 is placed, two ways are provided, one is that the electromagnetic chuck 1 is not closed, under the condition, a piston cylinder of the cylinder 3 needs to be in an extending state, then the piston cylinder is tightly propped against the side edge of the plane target material, and then the piston cylinder is slowly placed down and directly fixed by the electromagnetic chuck 1; the other method is that the electromagnetic chuck 1 is closed, the vacuum chuck 2 can also move at this time, the cylinder 3 is placed on the electromagnetic chuck 1, the cylinder 3 is moved to enable the piston rod of the cylinder to be tightly abutted to the side edge of the planar target, and then the electromagnetic chuck 1 is started to fix the vacuum chuck 2 and the cylinder 3;
as a specific expression form of the embodiment, in the embodiment, the electromagnetic chuck 1 is firstly closed, then the cylinder 3 is placed, and after the electromagnetic chuck 1 is started again to fix the vacuum chuck 2 and the cylinder 3, the CNC machine station performs a tool setting process; after the tool setting is finished, a preset machining program can be started to polish the side edge of the planar target.
Preferably, the vacuum chucks 2 are arranged in a plurality of arrays, and the distance between two adjacent vacuum chucks 2 is not more than 350 mm; the problem that the plane target is cracked due to the fact that the vacuum chuck 2 cannot form good support because the suspended area of the plane target is too large is avoided; in a specific embodiment, when the size of the planar target is small, the planar target can be only in a single row and multiple rows; when the size of the planar target is large, the planar target can be multiple columns and multiple rows, and the specific array mode can be arranged according to actual conditions.
In this embodiment, the distance between the vacuum chuck 2 near the side of the planar target and the side is 8-120 mm; under the condition of ensuring that side grinding is not influenced, the edge position of the planar target material can be well supported.
More preferably, the distance between the vacuum chuck 2 near the side of the planar target and the side is 10-100 mm.
In this embodiment, the vacuum chuck 2 includes a first fixing block 22 and a vacuum seat 23 sequentially arranged from bottom to top, the first fixing block 22 can be magnetically adsorbed on the electromagnetic chuck 1, the top surface of the vacuum seat 23 is provided with a plurality of air extraction holes 21, and the air extraction holes 21 are connected with a vacuum pump; the vacuum seat 23 can be adsorbed on the electromagnetic chuck 1 through the first fixing block 22, and the planar target is also adsorbed through the air exhaust hole 21;
in a specific embodiment, the first fixing block 22 is made of iron or iron alloy; the vacuum seat 23 may be welded to the first fixing block 22, or may be fixed to the first fixing block 22 by using a connector.
Preferably, the edge of the first fixing block 22 may be provided with a plurality of U-shaped open grooves, and when the electromagnetic chuck 1 is not provided, a mounting hole or a mounting groove may be provided on the worktable and connected using a bolt.
Preferably, a sealing rubber ring 24 is arranged on the periphery of the top surface of the vacuum seat 23, the sealing rubber ring 24 encloses the pumping hole 21, and the sealing rubber ring 24 protrudes upwards to support the planar target; when the sealing rubber ring 24 is in contact with the planar target, a sealed chamber is formed in the area encircled by the sealing rubber ring 24, at this time, the air suction hole 21 sucks air under the operation of the externally arranged vacuum pump, so that the sealed chamber is in a vacuum state to adsorb the planar target, and at this time, the sealing rubber ring 24 also plays a role in supporting the planar target.
When the negative pressure of the closed chamber is high, the planar target can apply high pressure to the sealing rubber ring 24, so that the sealing rubber ring 24 deforms seriously and is easy to incline or lose efficacy, and the like, therefore, the top surface of the vacuum seat 23 is also provided with a plurality of bosses (not shown in the figure) protruding upwards and used for supporting the planar target, and the protruding height of each boss is less than or equal to that of the sealing rubber ring 24; the plane target material can touch the boss when extruding the sealing rubber ring 24, and the plane target material can be kept horizontal under the support of the boss, so that the sealing rubber ring can not be excessively extruded.
Preferably, the bosses are all arranged in the sealing rubber ring 24, so that the position of the planar target corresponding to the sealing cavity can be prevented from being suspended, and the planar target has more stable supporting capability.
As a concrete manifestation of the embodiment, the boss is a circular boss.
In a specific embodiment, a cavity is arranged in the vacuum seat 23, at least one through hole 25 communicated with the cavity is arranged on the side surface of the vacuum seat 23, the air suction hole 21 is communicated with the cavity, and the through hole 25 is connected with a vacuum pump; because the number of the air exhaust holes 21 is generally multiple, the through hole 25 and the cavity are designed for facilitating the connection of the peripheral vacuum pump, and the peripheral vacuum pump exhausts the air in the cavity, so that each air exhaust hole 21 communicated with the cavity can exhaust air.
In this embodiment, the bottom of the cylinder 3 is provided with a second fixed block 4, the second fixed block 4 can be magnetically adsorbed on the electromagnetic chuck 1, the cylinder 3 can be magnetically adsorbed on the electromagnetic chuck 1 through the second fixed block 4, and the second fixed block 4 is made of iron or iron alloy; the cylinder 3 may be welded to the second fixing block 4, or may be fixed to the second fixing block 4 by using a connector.
Of course, when the size of the planar target is large, the number of the cylinders 3 corresponding to one side of the planar target is not necessarily one, and may be plural, so that the positioning effect is more excellent.
Comparative example 2
Referring to fig. 7, a plane target is fixed by using a bonding method, in the present comparative example, paraffin is used as a bonding material, paraffin is placed on a graphite block 5, the graphite block 5 is heated to melt the paraffin, then the plane target is placed, the parallelism of the target is adjusted, the graphite block 5 is cooled to solidify the paraffin, the plane target is fixed, a very long time is required, then a CNC machine performs a tool setting process on the plane target, and after the tool setting is completed, a preset machining program can be started to perform side edge polishing on the plane target;
after the side edge of one planar target is polished, the graphite block 5 needs to be heated to remove the bonding, and the planar target can be taken down. And due to the characteristics of the bonding material, the parallelism of the planar target is difficult to adjust, the bonding material can leave residues on the planar target, and extra time is needed for removing the residues.
And (3) comparing and analyzing results:
the fixing methods of example 1 and comparative example 1 were used to fix planar targets of the same specification, followed by side grinding, and the time required to fix the planar targets from the start of operation to the time at which the preset machining program can be started was recorded.
Wherein, two plane targets are continuously fixed and processed by using the embodiment 1, and the two plane targets are numbered as A and B according to the processing sequence; two planar targets were continuously fixed and processed using comparative example 2, and the two planar targets were numbered C and D according to the processing order. The pre-machining specifications of the fixed planar target required for example 1 and comparative example 1 were 412mm × 212mm × 6.1mm, and the machining results are shown in table 1:
TABLE 1 processing results
Post-process dimension Time consuming Crack(s) Other exceptions
A 400.2mm×200.2mm×6.1mm 7min35s Is free of Is free of
B 400.2mm×200.2mm×6.1mm 4min20s Is free of Is free of
C 400.2mm×200.2mm×6.1mm 60min Is free of Is free of
D 400.2mm×200.2mm×6.1mm 10min Is free of Is free of
Compared with the processing results of A and C, the planar target is fixed according to the fixing method provided by the invention, so that the time consumption for fixing the planar target can be greatly shortened, the processing quality is not influenced, and the processing efficiency is greatly improved;
compared with the processing results of A and B, the planar target is fixed according to the fixing method provided by the invention, when the planar targets with the same specification are continuously processed, the tool setting time of the planar target behind the first planar target can be saved, the time consumption for fixing the planar target is further shortened, and the processing efficiency is improved;
comparing the processing results of a and D, it can be seen that when the planar target is fixed according to the fixing method provided by the comparative example, the time for heating paraffin is saved for the planar target behind the first planar target when the planar targets of the same specification are continuously processed, but the time required for fixing the planar target is much longer, and the processing efficiency of the planar target is still affected.
Therefore, the fixing method can effectively shorten the time consumption for fixing the planar target, and particularly can greatly improve the processing efficiency of the planar target when the planar target with the same specification is continuously processed.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. A fixing method of a planar target is characterized in that a target fixing device is adopted, and the target fixing device comprises an electromagnetic chuck, a plurality of vacuum chucks and at least two cylinders, wherein the vacuum chucks can be magnetically adsorbed on the electromagnetic chuck; further comprising the steps of:
s1: placing a vacuum sucker on an electromagnetic sucker, starting the electromagnetic sucker to suck the vacuum sucker, and enabling the bottom surface of the vacuum sucker to be attached to the electromagnetic sucker;
s2: placing the planar target on the top surface of a vacuum chuck and starting a vacuum pump to enable the vacuum chuck to adsorb and fix the planar target, wherein two adjacent side edges of the planar target are respectively parallel to an X axis and a Y axis of the electromagnetic chuck;
s3: the air cylinder is placed on the electromagnetic chuck, the bottom of the air cylinder is attached to the electromagnetic chuck, a piston rod of the air cylinder is arranged at the top of the air cylinder and can stretch up and down, and the piston rods of the two air cylinders can abut against two adjacent side edges of the plane target, which are used for tool setting, when the piston rods of the two air cylinders are in an extending state.
2. The method of claim 1, wherein the vacuum chucks are arranged in an array, and a distance between two adjacent vacuum chucks does not exceed 350 mm.
3. The method of claim 2, wherein the vacuum chuck is positioned near the side of the planar target at a distance of 8-120mm from the side.
4. The method for fixing a planar target according to claim 1, wherein the vacuum chuck comprises a first fixing block and a vacuum base, the first fixing block and the vacuum base are sequentially arranged from bottom to top, the first fixing block can be magnetically adsorbed on the electromagnetic chuck, the top surface of the vacuum base is provided with a plurality of air suction holes, and the air suction holes are connected with a vacuum pump.
5. The method for fixing a planar target according to claim 4, wherein a sealing rubber ring is disposed around the top surface of the vacuum base, the sealing rubber ring encloses the air suction holes, and the sealing rubber ring protrudes upward to support the planar target.
6. The method according to claim 5, wherein the top surface of the vacuum base further comprises a plurality of upwardly protruding bosses for supporting the planar target, and the height of the bosses is less than or equal to the height of the rubber sealing rings.
7. The method for fixing a planar target according to claim 6, wherein the bosses are all disposed in the rubber sealing ring.
8. The method of claim 6, wherein the projection is a circular projection.
9. The method for fixing the planar target according to claim 4, wherein a cavity is formed in the vacuum base, at least one through hole communicated with the cavity is formed in a side surface of the vacuum base, the suction hole is communicated with the cavity, and the through hole is connected with a vacuum pump.
CN202210210588.8A 2022-03-03 2022-03-03 Fixing method of planar target Pending CN114657520A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204487404U (en) * 2014-12-30 2015-07-22 东莞市南兴家具装备制造股份有限公司 The work location of grid table top machining center and clamping structure
CN210849316U (en) * 2020-05-18 2020-06-26 爱发科电子材料(苏州)有限公司 Vacuum adsorption tray device for fixing target material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204487404U (en) * 2014-12-30 2015-07-22 东莞市南兴家具装备制造股份有限公司 The work location of grid table top machining center and clamping structure
CN210849316U (en) * 2020-05-18 2020-06-26 爱发科电子材料(苏州)有限公司 Vacuum adsorption tray device for fixing target material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
姚远 等: "模块磁力真空吸盘装置设计", 《金属加工(冷加工)》 *

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