CN114654611A

CN114654611A - Wafer scribing machine of hard disk video recorder for dynamic environment monitoring

Info

Publication number: CN114654611A
Application number: CN202210568642.6A
Authority: CN
Inventors: 袁润冬; 朱梓萍
Original assignee: Jiangsu Banghan Information Technology Co ltd
Current assignee: Jiangsu Banghan Information Technology Co ltd
Priority date: 2022-05-24
Filing date: 2022-05-24
Publication date: 2022-06-24

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a wafer scribing machine of a hard disk video recorder for dynamic environment monitoring. The wafer is buffered by the liquid rubber bag, chip corner breakage is avoided, the liquid rubber bag is high in mobility of buffer oil in the rubber bag, the liquid rubber bag can adapt to more wafers of different sizes, in order to prevent the wafer from moving along with the cutting force of a scribing cutter when the scribing cutter cuts, at the moment, the characteristic that the wafer is placed on the rubber bag and liquid is extruded is utilized, the coil is electrified by the weight of the liquid, and the edge of the wafer is clamped and positioned by the movable piston to contact the edge of the wafer by the magnetic repulsion force of the coil, so that the wafer is prevented from shifting.

Description

Wafer scribing machine of hard disk video recorder for dynamic environment monitoring

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to a wafer scribing machine of a hard disk video recorder for dynamic environment monitoring.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to form an integrated circuit product with a specific electrical function.

A wafer is usually formed by connecting hundreds of single chips, a gap for scribing is left between the chips, which is called a scribing block, a scribing knife cuts the block part of the wafer at a high rotation speed of 3-4 ten thousand per minute, and a worktable bearing the wafer moves linearly at a certain speed along the tangential direction of the contact point between the blade and the wafer, during the cutting process of the wafer, because the silicon material of the wafer is weak, the mechanical cutting mode can cause the front side and the back side of the wafer to generate mechanical stress, the mechanical stress acts on the wafer, which can cause the edge of the chip to have front and back side breakages, while the occurrence of the front and back side breakages can reduce the mechanical strength of the chip, the initial chip can cause the chip to further spread in the subsequent packaging process or the use process due to the initial edge crack and the reduction of the mechanical strength, finally, the chip cracks and the electrical failure are caused.

Disclosure of Invention

Aiming at the defects of the existing wafer scribing machine in the background technology in the use process of mechanical cutting, the invention provides the wafer scribing machine for the hard disk video recorder for dynamic environment monitoring, which has the advantages of reducing the wafer breakup angle, preventing the reduction of the mechanical strength of a wafer chip and avoiding the electrical failure of the chip, and solves a series of problems of chip breakup angle and the like caused by the mechanical stress of mechanical cutting in the background technology.

The invention provides the following technical scheme: a wafer scribing machine for a hard disk video recorder for monitoring dynamic environment comprises a liquid rubber bag, wherein a liquid cavity is formed in the liquid rubber bag, buffer oil is filled in the liquid cavity, a variable bag body is wrapped outside the liquid rubber bag, a variable cavity is formed in the variable bag body, electrorheological fluid is filled in the variable cavity, a wafer is placed above the liquid rubber bag, a curing cavity is formed in one side, close to the wafer, of the liquid rubber bag, the side edge of the curing cavity is communicated with the inside of the variable cavity, a movable piston is slidably mounted in the curing cavity and is a magnet with magnetism, equidistant contact blocks are mounted in the liquid rubber bag, the liquid rubber bag is located above the curing cavity, the equidistant contact blocks are adjacent to each other and connected through flexible wires, and a workbench is fixedly mounted on the outer side of the variable bag body, the inside of the workbench, which is close to the upper surface, is provided with a cavity for mounting the magnetic pole control device, the workbench is internally provided with another mounting cavity for mounting the electric control device, and one side of the electric control device, which is far away from the variable cavity, is provided with a resistance block.

Preferably, the movable piston comprises a plug body, the plug body has magnetism, the magnetic pole of the plug body is along the radial direction of a curing cavity, the upper surface of the plug body is provided with a first conductive head, the upper surface of the plug body is exposed in the air, a sliding cavity is further formed in the plug body, a second conductive head is arranged on one side, close to a wafer, of the sliding cavity, the second conductive head is electrically connected with the first conductive head, a pulling spring is arranged in the sliding cavity, the pulling spring is not conductive, a movable contact block is arranged at the bottom of the pulling spring, a conductive block is arranged in the middle of one side, close to the second conductive head, of the movable contact block, another conductive block is arranged on the other side of the movable contact block, two conductive blocks are connected through a short wire, the short wire is arranged in the movable contact block, one side, far away from the curing cavity, of the sliding cavity is provided with a conductive block, the length of the conducting strip is equal to the longitudinal length of the sliding cavity, and the conducting strip extends to the outside of one side, away from the wafer, of the movable contact block through a long lead and is in contact with the curing cavity.

Preferably, the equidistance blocks are linearly and uniformly distributed along the radial direction of the curing cavity, the equidistance blocks are adjacent, the distance between the equidistance blocks is one inch, the distance between the equidistance blocks and the circle center of the liquid rubber bag is four inches, and the flexible conducting wire is made of flexible conducting materials.

Preferably, the magnetic pole control device comprises a coil, the axial lead of the coil is collinear with the transverse center line of the movable piston, electrode contacts are fixedly mounted at two ends of the coil, the electrode contacts are respectively connected with two ends of a conductive wire wound on the coil, a power-on ring is mounted at the outer side of the coil, an annular power-on sheet is fixedly mounted on the inner wall of the power-on ring, the electrode contacts and the annular power-on sheet are attached to each other, the annular power-on sheet is respectively connected to a positive electrode and a negative electrode of a power supply, when a wafer is placed on a liquid rubber bag, the magnetic pole distribution at two ends of the coil is limited at the moment and is opposite to the magnetic pole distribution at two ends of the movable piston, a rotating handle is fixedly mounted at the upper end of the coil, the rotating handle extends to the outer side of the workbench, the manual operation is convenient, a support is movably mounted at the bottom of the coil, and is mounted in the workbench, and meanwhile, the bracket is fixedly installed with the power connection ring.

Preferably, the electric control device comprises a fixed frame, a cavity is arranged in the fixed frame, one side of the fixed frame close to the liquid cavity is fixedly provided with a liquid passing pipe, the other end of the liquid passing pipe is communicated with the inside of the liquid cavity, the top of the inside of the fixed frame is fixedly provided with a fixed electric connector, the inside of the fixed frame is slidably provided with a movable electric connector, a telescopic pipe is fixedly arranged between the fixed electric connector and the movable electric connector, one side of the telescopic pipe close to the variable cavity forms an airtight space, a reset spring is fixedly arranged between the fixed electric connector and the movable electric connector, the reset spring is positioned in the telescopic pipe, the reset spring is non-conductive, two annular electric connecting pieces are respectively electrically connected with the fixed electric connector and the movable electric connector through leads, one side of the movable electric connector close to the resistance block is fixedly provided with a sliding contact, the resistance block is provided with a sliding track, the sliding contact slides on the sliding track, and the position of the sliding contact at the initial position of the sliding track is provided with an insulating sheet.

Preferably, the liquid flowing pipe comprises a first pipeline, the first pipeline is located inside the liquid rubber bag and extends to the inside of the variable cavity, a hose is fixedly mounted at one end of the first pipeline located inside the variable cavity, a second pipeline is fixedly mounted at the other end of the hose, the other end of the second pipeline extends to the inside of the workbench to the inside of the fixed frame, and the hose is mounted only inside the variable cavity.

The invention has the following beneficial effects:

1. the liquid rubber bag is used for buffering the wafer, so that the chip corner breakage is avoided, and the buffer oil in the rubber bag has high fluidity, so that the liquid rubber bag can adapt to more wafers with different sizes.

2. The electric control device is arranged in the workbench to adapt to the clamping force strength required by wafers of different sizes, the quantity of buffer oil in the squeezed liquid cavity is different due to the different sizes of the wafers, and when the buffer oil with different weights acts on the movable electric connector, the lengths of resistors connected with current on the resistor blocks are different, so that the current on the fixed electric connector is different, the magnetic force generated by the coil is limited, the magnetic force on the large-size wafer and the movable piston is reduced, the magnetic force on the small wafer and the movable piston is increased, the clamping force of the movable piston on the edge of the wafer can be automatically adjusted according to the wafers of different sizes, and the phenomenon that the clamping force is too large to cause the edge corner collapse of the wafer is avoided.

Drawings

FIG. 1 is a schematic view of an unplaced wafer structure according to the present invention;

FIG. 2 is a schematic view of a wafer placement structure according to the present invention;

FIG. 3 is a schematic top view of a magnetic pole control device according to the present invention;

FIG. 4 is a schematic view of the structure of FIG. 2 at A according to the present invention;

fig. 5 is an enlarged view of a part of the structure of the present invention.

In the figure: 1. a liquid rubber bladder; 2. a liquid chamber; 3. a variable bladder; 4. a variable cavity; 5. a wafer; 6. a curing chamber; 7. moving the piston; 71. a plug body; 72. a first conductive head; 73. a sliding cavity; 74. pulling the spring; 75. moving the contact block; 76. a second conductive head; 8. equidistant electric contact blocks; 9. a flexible wire; 10. a work table; 11. a magnetic pole control device; 111. a coil; 112. an electrode contact; 113. a power connection ring; 114. an annular electric connecting piece; 115. rotating the handle; 116. a support; 12. a liquid pipe is communicated; 121. a first conduit; 122. a hose; 123. a second conduit; 13. an electric control device; 131. a fixing frame; 132. fixing the electric connector; 133. moving the electric connector; 134. a telescopic pipe; 135. a return spring; 136. a sliding contact; 137. a sliding track; 14. a resistive block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, a wafer dicing saw for a hard disk video recorder for dynamic environment monitoring includes a liquid rubber bag 1, a liquid cavity 2 is formed inside the liquid rubber bag 1, buffer oil is filled inside the liquid cavity 2, a variable bag body 3 is wrapped outside the liquid rubber bag 1, a variable cavity 4 is formed inside the variable bag body 3, electrorheological fluid is filled inside the variable cavity 4, the variable cavity 4 is partitioned by partitions to increase the stability of the variable cavity 4, a wafer 5 is placed above the liquid rubber bag 1, the liquid rubber bag 1 and the variable bag body 3 mainly function to buffer the wafer 5 from mechanical stress of a dicing blade, when the dicing blade cuts on the wafer 5, the buffer oil inside the liquid cavity 2 and the liquid inside the variable cavity 4 can play a role in buffering, the problem that a broken corner appears when stress is applied is avoided, but because the inside of the liquid cavity 2 is buffered by liquid, another problem is accompanied by the occurrence, namely when the scribing cutter cuts the wafer 5, the mechanical stress of the scribing cutter acts on the wafer 5, on one hand, the wafer 5 may move along with the scribing cutter under the action of friction force along the cutting direction, on the other hand, the downward cutting force may cause the wafer 5 to move downwards, and the fundamental problem is that because the liquid in the liquid cavity 2 has too strong fluidity, a curing cavity 6 is formed inside one side of the liquid rubber bag 1 close to the wafer 5, the side of the curing cavity 6 is communicated with the inside of the variable cavity 4, a moving piston 7 is slidably mounted in the curing cavity 6, the moving piston 7 is a magnet with magnetism, and referring to fig. 4, the internal structure of the moving piston 7 can be seen as follows, the movable piston 7 comprises a plug body 71, the plug body 71 is magnetic, the magnetic pole of the plug body 71 is along the radial direction of the curing cavity 6, a first conductive head 72 is installed on the upper surface of the plug body 71, the upper surface of the plug body 71 is exposed in the air, a sliding cavity 73 is further formed inside the plug body 71, a second conductive head 76 is installed on one side, close to the wafer 5, of the sliding cavity 73, the second conductive head 76 is electrically connected with the first conductive head 72, a pulling spring 74 is installed inside the sliding cavity 73, the pulling spring 74 is non-conductive, a movable contact block 75 is installed at the bottom of the pulling spring 74, a conductive block is installed in the middle of one side, close to the second conductive head 76, of the movable contact block 75, another conductive block is installed on the other side of the movable contact block 75, the two conductive blocks are connected through a short wire, the short wire is installed inside the movable contact block 75, and a conductive sheet is installed on one side, far from the curing cavity 6, of the sliding cavity 73, the length of the conducting strip is equal to the longitudinal length of the sliding-down cavity 73, the conducting strip extends to the outside of one side of the movable contact block 75 far away from the wafer 5 through a long wire and contacts with the curing cavity 6, in the reference figure 4, part of the structure is not completely shown, in the structure of the movable piston 7, the first conducting head 72 is electrically connected with the second conducting head 76, the conducting strip and the long wire through a conducting wire, the arrangement on the movable contact block 75 is mainly used for controlling the on-off of current between the second conducting head 76 and the conducting strip on two sides of the sliding-down cavity 73, because the liquid rubber bag 1 is elastic, when the wafer 5 is not positioned on the upper surface of the liquid rubber bag 1, at this time, because the curing cavity 6 is arranged inside the liquid rubber bag 1, when the bottom of the plug body 71 is completely positioned at the bottom of the curing cavity 6, the movable contact block 75 at this time is acted by buffer oil and rubber elasticity, the plug body 71 moves to the area, the rubber of the liquid rubber bag 1 below the wafer 5 is pressed downwards, a part of the curing cavity 6 is parallel to the side edge of the wafer 5, so that a part of space is reserved, when the plug body 71 moves to the area, the movable contact block 75 in the area can move outwards from the inside of the sliding cavity 73 due to the lack of the effect of the liquid rubber bag 1, the conductive block moving to the movable contact block 75 is contacted with the second conductive head 76, and at the moment, the conductive blocks and the conductive blocks on the two sides of the sliding cavity 73 are electrified, at the moment, the side of the curing cavity 6 far away from the wafer 5 is electrified, at the moment, the electrorheological fluid in the curing cavity 6 is cured, the volume of the liquid changed into solid is increased, the plug body 71 is clung to the side edge of the wafer 5, because a layer of rubber is respectively arranged between the wafer 5 and the plug body 71, the plug body can play a role of buffering while fastening the wafer 5, the phenomenon that the edge of the wafer 5 is cracked due to overlarge fastening stress is avoided, the electrorheological fluid in the curing cavity 6 comes from the interior of the variable cavity 4, when the movable piston 7 starts to move, the space of the curing cavity 6 close to the variable cavity 4 is under negative pressure, the curing cavity 6 extracts the electrorheological fluid in the variable cavity 4, after the electrorheological fluid is cured, the wafer 5 can be fixed and positioned, and because the interior of the liquid rubber bag 1 is liquid, the liquid rubber bag 1 can adapt to wafers with different sizes, the fixing and positioning functions can be carried out according to wafers of different shapes, equidistant electric contact blocks 8 are installed inside the liquid rubber bag 1 above the curing cavity 6, the equidistant electric contact blocks 8 are linearly and uniformly distributed along the radial direction of the curing cavity 6, the distance between every two adjacent equidistant electric contact blocks 8 is one inch, the distance between every two equidistant electric contact blocks 8 and the center of the liquid rubber bag 1 is four inches, the adjacent equidistant electric contact blocks 8 are connected through flexible conducting wires 9, the flexible conducting wires 9 are made of flexible conducting materials, the smallest size of the existing wafer is four inches and the largest size is eight inches during scribing, the largest size of the liquid rubber bag 1 is set to be a little larger than eight inches during setting, the redundant space is used for placing a moving piston 7, when the four-inch wafer is placed in the middle of the liquid rubber bag 1, the moving piston 7 can reach the distance closest to the center of the liquid rubber bag 1 at the moment, first equidistant contact blocks 8 are arranged on the liquid rubber bag 1, then equidistant contact blocks 8 are arranged at intervals along the radial direction of the liquid rubber bag 1, the equidistant contact blocks 8 are connected through flexible leads 9, the equidistant contact blocks 8 on the outermost side are connected with a power supply of a dicing saw, and accordingly, a complete circuit is formed, the current of the power supply of the dicing saw is connected to the flexible leads 9 through leads, then the equidistant contact blocks 8 are connected, when the movable piston 7 moves to different positions, the first conductive head 72 is in contact with the equidistant contact blocks 8, so that the first conductive head 72 and the second conductive head 76 are electrified, the state of the movable contact block 75 is controlled through the position of the sliding cavity 73, the on-off of the current is controlled, the conductive blocks on the two sides of the sliding cavity 73 are in contact with each other, the electrorheological fluid inside the curing cavity 6 is cured, and then the side edge of the wafer 5 is fixed, referring to fig. 3, the magnetic pole control device 11 includes a coil 111, an axial line of the coil 111 is collinear with a transverse center line of the movable piston 7, two large ends of the coil 111 are fixedly mounted with electrode contacts 112, the electrode contacts 112 are respectively connected with two ends of a conductive wire wound on the coil 111, an electrical connection ring 113 is mounted on the outer side of the coil 111, an annular electrical connection sheet 114 is fixedly mounted on the inner wall of the electrical connection ring 113, the electrode contacts 112 are attached to the annular electrical connection sheet 114, the annular electrical connection sheet 114 is respectively connected to an anode and a cathode of a power supply, when a wafer 5 is placed on the liquid rubber capsule 1, the distribution of magnetic poles at two ends of the coil 111 is limited to be opposite to the distribution of magnetic poles at two ends of the movable piston 7, so when different ends of the electrode contacts 112 are connected to the annular electrical connection sheet 114, at the moment, the magnetic poles at the two ends of the coil 111 are different, because the coil 111 and the movable piston 7 are on the same central line, when the positive and negative poles of the electrode contacts 112 at the two ends of the coil 111 are different, the magnetic force generated to the movable piston 7 is also different, when the wafer 5 is placed, the coil 111 generates a magnetic repulsion force to the movable piston 7, the magnetic repulsion force repels the movable piston 7 to move towards the direction close to the wafer 5, the movement is stopped after the movable piston 7 contacts the outer side of the wafer 5, but the magnetic force still exists, the magnetic repulsion force always acts on the movable piston 7, so that the movable piston 7 has a clamping and fixing effect on the wafer 5, and the solidified electrorheological fluid can also exert the fixing effect through the hardness of the solid, so that the wafer 5 is prevented from shifting during scribing, the upper end of the coil 111 is fixedly provided with a rotating handle 115, the rotating handle 115 extends to the outer side of the workbench 10 for convenient manual operation, a support 116 is movably installed at the bottom of the coil 111, the support 116 is installed inside the workbench 10, meanwhile, the support 116 is fixedly installed with the power connection ring 113, another installation cavity is formed in the workbench 10 for installing the power control device 13, a resistance block 14 is installed at one side of the power control device 13 away from the variable cavity 4, the power control device 13 comprises a fixed frame 131, a cavity is formed inside the fixed frame 131, a fixed power connection head 132 is fixedly installed at the top inside the fixed frame 131, a movable power connection head 133 is slidably installed inside the fixed frame 131, an extension tube 134 is fixedly installed between the fixed power connection head 132 and the movable power connection head 133, an enclosed space is formed between the extension tube 134 and one side close to the variable cavity 4, a return spring 135 is fixedly installed between the fixed power connection head 132 and the movable power connection head 133, and the return spring 135 is located inside the extension tube 134, the reset spring 135 is non-conductive, the two annular electric connecting pieces 114 are respectively electrically connected with the fixed electric connecting head 132 and the movable electric connecting head 133 through conducting wires, a sliding contact 136 is fixedly installed on one side of the movable electric connecting head 133 close to the resistance block 14, a sliding track 137 is formed on the resistance block 14, the sliding contact 136 slides on the sliding track 137, an insulating sheet is installed at the position of the sliding contact 136 at the initial position of the sliding track 137, a liquid through pipe 12 is fixedly installed on one side of the fixed frame 131 close to the liquid cavity 2, the other end of the liquid through pipe 12 is communicated with the inside of the liquid cavity 2, the liquid through pipe 12 comprises a first pipeline 121, the first pipeline 121 is located inside the liquid rubber bag 1 and extends to the inside of the variable cavity 4, a hose 122 is fixedly installed at one end of the first pipeline 121 located inside the variable cavity 4, a second pipeline 123 is fixedly installed at the other end of the hose 122, and the other end of the second pipeline 123 extends to the inside of the fixed frame 131 of the workbench 10, the flexible pipe 122 is only arranged in the variable cavity 4, the liquid in the liquid cavity 2 can be finally guided into the telescopic pipe 134 by the liquid through pipe 12, the weight of the liquid acts on the movable electric connector 133, so that the movable electric connector 133 moves downwards, the fixed electric connector 132 and the movable electric connector 133 are connected with a circuit through the resistor block 14, when the sizes of the wafers 5 are different, the weight and the volume are different, therefore, when different wafers 5 act on the liquid rubber bag 1, buffer oil with different volumes flows into the liquid through pipe 12 from the inside of the liquid cavity 2 and then flows to the upper surface of the movable electric connector 133 through the second pipe 123, the different weights of the buffer oil can drive the movable electric connector 133 to move downwards for different distances, so that the distance between the fixed electric connector 132 and the movable electric connector 133 can also be changed differently and the size is larger, the farther the distance is, the greater the resistance between the fixed contact 132 and the mobile contact 133, the current on the coil 111 comes from the power control device 13, where the complete circuit is that the power supply of the dicing saw is electrically connected with the mobile contact 133 through the electric wire, then the current on the mobile contact 133 is transmitted to the fixed contact 132 through the resistance block 14, the current on the fixed contact 132 is transmitted to the annular contact 114 through the electric wire, the annular contact 114 is in contact with the electrode contact 112, so that the coil 111 is charged, and the magnetic property acts on the mobile piston 7, thereby controlling the moving distance of the mobile piston 7, when the size of the wafer 5 is larger, the smaller the distance the mobile piston 7 needs to move is, so as to avoid that the magnetic force on the coil 111 is too large, and excessive pressing force is generated on the side wall of the wafer 5, so that the edge chipping of the wafer 5 is caused, at this time, the magnetic force of the coil 111 is adjusted reasonably by utilizing the different extrusion amounts of the buffer oil in the liquid chamber 2 caused by different sizes, when the size of the wafer 5 is smaller, the moving piston 7 needs larger magnetic force, so that the moving distance of the moving piston 7 is farther to realize clamping, and the small size represents that the accumulation amount of the buffer oil is small, the gravity on the moving electric contact 133 is correspondingly reduced, the downward moving distance of the moving electric contact 133 is reduced, the resistance distance between the moving electric contact 133 and the fixed electric contact 132 is reduced, so that the current flowing from the moving electric contact 133 to the fixed electric contact 132 is larger, the larger current causes the magnetic force on the coil 111 to be correspondingly larger, then the moving piston 7 is subjected to larger magnetic repulsion force, when the size of the wafer 5 is larger, the distance that the moving piston 7 needs to move is reduced, and the extrusion amount of the buffer oil is increased, the distance between the fixed electric connector 132 and the movable electric connector 133 is also larger, the current on the movable electric connector 133 is smaller, the magnetic repulsion force on the coil 111 is also smaller, the moving distance of the movable piston 7 is correspondingly reduced, the extrusion force on the edge of the wafer 5 is also reduced, so that the movable piston 7 can adjust the fixing force and the fixing distance of the wafer 5 correspondingly by wafers with different sizes, and under the premise of realizing fixation, the occurrence of edge corner collapse caused by overlarge fixing force can be avoided.

The using method of the invention is as follows:

firstly, when no wafer 5 is placed, at this time, no gravity acts on the liquid rubber bladder 1, the movable piston 7 is located at the position closest to the edge in the curing chamber 6, and a certain distance exists between the first conductive head 72 on the movable piston 7 and the nearest equidistant contact block 8, so that the movable contact block 75 does not contact with the bottom rubber of the curing chamber 6, and the movable contact block 75 can contract in the sliding-down chamber 73 against elastic force due to the action of the bottom rubber of the curing chamber 6, at this time, the first circuit is composed of the flexible lead 9, the equidistant contact blocks 8, the first conductive head 72, the sliding-down chamber 73, the conductive sheets and conductive blocks on both sides of the sliding-down chamber 73, and the second conductive head 76, the first circuit is in a power-off state at the beginning, the second circuit is composed of the movable contact head 133, the resistance block 14, the fixed contact head 132, the annular contact sheet 114, the electrode contact 112, and the coil 111, and the power supplies of the two circuits are from the power supply of the dicing machine itself, at this time, the second circuit is also in a power-off state, when the wafer 5 starts to be placed on the liquid rubber bag 1, the buffer oil in the liquid cavity 2 starts to work at first, the buffer oil flows to the extension tube 134 through the liquid through tube 12 under the gravity extrusion of the variable bag body 3, the movable electrical connector 133 is pressed downwards to be separated from the insulating sheet and is contacted with the resistance block 14, the fixed electrical connector 132 is electrified, the coil 111 is magnetized, the magnetic force acts on the plug body 71, the plug body 71 starts to move towards the wafer 5 until being contacted with the wafer 5 and does not move any more, at this time, due to the existence of the curing cavity 6, the movable contact block 75 falls downwards to be close to the second electrical connector 76, so that the electrical conduction blocks at the two sides of the sliding cavity 73 are electrified with the conductive sheets, the long lead wire contacted with the conductive sheets on the sliding cavity 73 can transmit the current to the inside the curing cavity 6, at this time, due to the movement of the movable piston 7, the curing cavity 6 is enabled to be close to the area negative pressure of the variable cavity 4, and in addition, the curing cavity 6 and the variable cavity 4 are in a communication state, the electrorheological fluid can also move towards the curing cavity 6, the electrorheological fluid is electrified and cured, the electrorheological fluid in the area of the variable cavity 4 and the area of the curing cavity 6 far away from the wafer 5 is completely cured, the fixed clamping effect of the movable piston 7 on the wafer 5 is enhanced, meanwhile, as the electrorheological fluid in the variable cavity 4 is cured, the hose 122 can also be compressed and closed by the cured electrorheological fluid, and subsequently, when the scribing knife starts to work, even if the downward mechanical pressure of the scribing knife acts on the liquid rubber bag 1, as the pipeline of the liquid through pipe 12 is closed, the liquid in the liquid cavity 2 can also be fixed and can not flow into the telescopic pipe 134 any more, the clamping force on the movable piston 7 is prevented from being reduced, and when the wafer 5 starts to change the size, after the wafer 5 disappears, the middle part prevents the solid that the movable piston 7 moved from disappearing, the movable piston 7 can move a bit position to the centre of a circle position of the liquid rubber bag 1, and the liquid rubber bag 1 can kick-back, the bottom rubber of the curing chamber 6 can make the movable contact block 75 retract into the landing chamber 73, the current of the electrorheological fluid is broken, there is solid-state becoming liquid, change the positive and negative poles of the coil 111 this moment, make the coil 111 produce magnetic attraction to the movable piston 7, the movable piston 7 gets back to the home position, the electrorheological fluid gets back to the variable chamber 4 this moment, and can produce the buffer oil attraction in the extension tube 134 in the liquid chamber 2, the buffer oil gets back to the home position, the movable electric connector 133 also can get back to the home position, the coil 111 is cut off the power supply, wait for the beginning of next wafer operation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer scribing machine for dynamic environmental monitoring's hard disk video recorder, includes liquid rubber bag (1), its characterized in that: the liquid rubber capsule is characterized in that a liquid cavity (2) is formed in the liquid rubber capsule (1), buffer oil is filled in the liquid cavity (2), a variable capsule body (3) wraps the outer side of the liquid rubber capsule (1), a variable cavity (4) is formed in the variable capsule body (3), electrorheological fluid is filled in the variable cavity (4), a wafer (5) is placed above the liquid rubber capsule (1), a curing cavity (6) is formed in one side, close to the wafer (5), of the liquid rubber capsule (1), the side edge of the curing cavity (6) is communicated with the interior of the variable cavity (4), a movable piston (7) is slidably mounted in the curing cavity (6), the movable piston (7) is a magnet with magnetism, and equidistant electric contact blocks (8) are mounted in the liquid rubber capsule (1) above the curing cavity (6), adjacent connect through flexible wire (9) between equidistance electricity touching block (8), the outside fixed mounting of variable utricule (3) has workstation (10), workstation (10) are close to the inside of upper surface and have been offered the cavity and be used for installing magnetic pole controlling means (11), it is used for installing accuse electric installation (13) to have seted up another installation cavity in workstation (10), accuse electric installation (13) are kept away from one side of variable chamber (4) and are installed resistance block (14).

2. The wafer dicing saw for hard disk video recorder for dynamic environment monitoring as claimed in claim 1, characterized in that: remove piston (7) including cock body (71), cock body (71) possess magnetism to the magnetic pole of cock body (71) is along the radial direction of solidification chamber (6), the upper surface mounting of cock body (71) has first conductive head (72), the upper surface of cock body (71) exposes in the air, landing chamber (73) have still been seted up to the inside of cock body (71), landing chamber (73) are close to one side of wafer (5) and install second conductive head (76), electric connection between second conductive head (76) and first conductive head (72), the internally mounted of landing chamber (73) has pulling spring (74), pulling spring (74) are on-conductive, removal touch multitouch (75) are installed to the bottom of pulling spring (74), it has the conductive block to remove touch multitouch (75) to be close to one side mid-mounting of second conductive head (76), remove the opposite side of feeler block (75) and install another conducting block, two connect through the stub between the conducting block, the inside at removal feeler block (75) is installed to the stub, one side that solidification chamber (6) were kept away from in landing chamber (73) is equipped with the conducting strip, conducting strip length equals with the vertical length in landing chamber (73), extend to one side outside of keeping away from wafer (5) to removal feeler block (75) through the long wire on the conducting strip, contact with solidification chamber (6).

3. The wafer dicing saw for hard disk video recorder for dynamic environment monitoring according to claim 1, characterized in that: the equidistance touches electric piece (8) and is adjacent along the linear equipartition of radial direction of curing chamber (6) the equidistance touches interval between electric piece (8) and is an inch, the equidistance touches the distance of the centre of a circle of electric piece (8) apart from liquid rubber bag (1) and is four inches, flexible wire (9) are flexible conducting material.

4. The wafer dicing saw for hard disk video recorder for dynamic environment monitoring as claimed in claim 1, characterized in that: magnetic pole controlling means (11) includes coil (111), the axial lead of coil (111) and the horizontal central line collineation of removing piston (7), the both ends fixed mounting of coil (111) has electrode contact (112), electrode contact (112) are connected with winding conductor wire both ends on coil (111) respectively, electricity ring (113) is installed in the outside of coil (111), the inner wall fixed mounting who connects electricity ring (113) has annular electricity connection piece (114), laminate between electrode contact (112) and annular electricity connection piece (114), annular electricity connection piece (114) are connected to the positive negative pole of power respectively, when having placed wafer (5) on liquid rubber bag (1), it is opposite with the magnetic pole distribution that removes piston (7) both ends to restrict the magnetic pole distribution at coil (111) both ends this moment, the upper end fixed mounting of coil (111) has rotation handle (115), the utility model discloses a work platform, including swivel handle (115), coil (111), support (116), power ring (113), support (116) and power ring (113), swivel handle (115) extend to the outside of workstation (10), the manual operation of being convenient for, the bottom movable mounting of coil (111) has support (116), the inside at workstation (10) is installed in support (116), and support (116) still with connect electric ring (113) fixed mounting simultaneously.

5. The wafer dicing saw of the hard disk video recorder for dynamic environment monitoring as claimed in claim 4, characterized in that: the electric control device (13) comprises a fixed frame (131), a cavity is formed in the fixed frame (131), one side of the fixed frame (131) close to the liquid cavity (2) is fixedly provided with a liquid through pipe (12), the other end of the liquid through pipe (12) is communicated with the inside of the liquid cavity (2), the inside top of the fixed frame (131) is fixedly provided with a fixed electric connector (132), the inside of the fixed frame (131) is slidably provided with a movable electric connector (133), a telescopic pipe (134) is fixedly arranged between the fixed electric connector (132) and the movable electric connector (133), the telescopic pipe (134) and one side close to the variable cavity (4) form a closed space, a reset spring (135) is fixedly arranged between the fixed electric connector (132) and the movable electric connector (133), and the reset spring (135) is located inside the telescopic pipe (134), reset spring (135) nonconducting, two ring-shaped connects electric piece (114) to connect electric head (132) and remove to connect through wire electric connection between electric head (133) with fixed respectively, remove one side fixed mounting that connects electric head (133) to be close to resistance piece (14) and have sliding contact (136), sliding track (137) have been seted up on resistance piece (14), sliding contact (136) slide on sliding track (137), the insulating piece is installed in the position that sliding contact (136) are in sliding track (137) initial position.

6. The wafer dicing saw of a hard disk video recorder for dynamic environment monitoring as claimed in claim 5, characterized in that: lead to liquid pipe (12) including first pipeline (121), first pipeline (121) are located the inside of liquid rubber bag (1) and extend to the inside in variable chamber (4), first pipeline (121) are located the inside one end fixed mounting in variable chamber (4) and have hose (122), the other end fixed mounting of hose (122) has second pipeline (123), the other end of second pipeline (123) extends to the inside of fixed frame (131) of workstation (10), hose (122) are only at the internally mounted in variable chamber (4).