CN114650376A

CN114650376A - Image sensor and electronic device

Info

Publication number: CN114650376A
Application number: CN202210200935.9A
Authority: CN
Inventors: 梁杰
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-06-21

Abstract

The embodiment of the application discloses image sensor and electronic equipment belongs to terminal equipment technical field, wherein, image sensor includes: the optical filter comprises a photosensitive element layer, a micro-lens layer, a filter layer and a driving mechanism, wherein the filter layer is arranged between the photosensitive element layer and the micro-lens layer and is connected with the micro-lens layer; at least one of the filter layer and the microlens layer is connected with the driving mechanism, and the driving mechanism is used for driving the filter layer and the microlens layer to move relative to the photosensitive element layer.

Description

Image sensor and electronic device

Technical Field

The application belongs to the technical field of terminal equipment, and particularly relates to an image sensor and electronic equipment.

Background

Along with the popularization of mobile terminals such as mobile phones in people's lives, people also put higher demands on images shot by the mobile terminals, and in addition to the fact that the shot images are clearer and more beautiful, higher resolution needs to be achieved.

In the related art, the resolution of a photographed picture is mostly increased by increasing the number of pixels (pixels) of a photo sensor. However, due to the limitation of the processing technology and the like, the number of pixels (pixels) cannot be increased without limit under the same size of the photosensitive sensor; meanwhile, if the size of the photosensor is increased, the requirements of power consumption and thickness of the electronic device are violated, and the requirements of low power consumption and light weight of the electronic device are not met.

Disclosure of Invention

The application aims to provide an image sensor and electronic equipment, and solves the problems that the number of pixels of an existing image sensor cannot be increased under the condition that the size of a photosensitive chip is limited, and the image resolution is low.

In a first aspect, an embodiment of the present application provides an image sensor. The image sensor includes:

a photosensitive element layer;

a microlens layer;

the filter layer is arranged between the photosensitive element layer and the micro-lens layer and is connected with the micro-lens layer; and

and at least one of the filter layer and the micro-lens layer is connected with the driving mechanism, and the driving mechanism is used for driving the filter layer and the micro-lens layer to move relative to the photosensitive element layer.

In a second aspect, an embodiment of the present application provides an electronic device. The electronic device comprises an image sensor as described above.

In the embodiment of the application, a scheme capable of improving the resolution is provided for the image sensor, wherein the filter layer and the microlens layer are stably driven by the driving mechanism to move relative to the photosensitive element layer for setting pixels (such as 1pixel), so that the resolution can be improved on the premise of not increasing the number of pixels and the size of the photosensitive chip.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an image sensor provided in an embodiment of the present application;

fig. 2 is a second schematic structural diagram of an image sensor according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a driving assembly of an image sensor provided according to an embodiment of the present application;

FIG. 4 is a comparison graph of an image sensor provided by an embodiment of the present application before and after processing an image;

FIG. 5 is a schematic diagram of a conventional RGB sensor chip sensor pattern arrangement;

FIG. 6 is a cross-sectional schematic view of FIG. 5;

fig. 7 is a schematic diagram of a pattern arrangement of an image sensor provided in an embodiment of the present application;

fig. 8 is a schematic diagram of two results obtained by the same photosensitive element layer before and after the image sensor provided by the embodiment of the present application is moved.

Reference numerals:

1. a photosensitive element layer; 2. a microlens layer; 3. a filter layer; 4. a drive mechanism; 5. a first accommodating space; 6. a support structure; 7. a second accommodating space; 8. a circuit board; 9. a heat conductive member; 10. a lens; 11. a support; 12. an infrared filter;

41. a first driving section; 411. a first bearing part; 412. a first drive assembly; 4121. a first electrode plate; 4122. a second polar plate;

42. a second driving section; 421. a second bearing part; 422. a second drive assembly; 4221. a third polar plate; 4222. and a fourth polar plate.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The image sensor and the electronic device provided in the embodiments of the present application are described in detail with reference to fig. 1 to 8 through specific embodiments and application scenarios thereof.

According to one embodiment of the present application, an image sensor is provided, which can achieve high-resolution image through a series of low-resolution images, i.e., perform super-resolution reconstruction. Specifically, the method comprises the following steps: the image sensor provided by the embodiment of the application can obtain a high-resolution image under the conditions of not increasing the size of a photosensitive chip and not increasing the number of pixels (pixels).

An image sensor provided in an embodiment of the present application, with reference to fig. 1, includes: the optical filter comprises a photosensitive element layer 1, a micro-lens layer 2 and a filter layer 3, wherein the filter layer 3 is arranged between the photosensitive element layer 1 and the micro-lens layer 2, and the filter layer 3 is connected with the micro-lens layer 2; the image sensor further comprises a driving mechanism 4, at least one of the filter layer 3 and the microlens layer 2 is connected with the driving mechanism 4, and the driving mechanism 4 is used for driving the filter layer 3 and the microlens layer 2 to move relative to the photosensitive element layer 1.

The photosensitive element layer 1 includes a plurality of photosensitive units, i.e., Photodiodes (PDs), for example. The plurality of photosensitive units may be arranged according to a set array to form a specific photosensitive plane, for example, and a person skilled in the art may flexibly set a specific arrangement form of the plurality of photosensitive units according to needs, which is not specifically limited herein. The multiple photosensitive units can sense light with different wave bands and convert light signals into sensing electric signals.

Wherein the Micro-LENS layer 2(Micro-LENS) covers the filter layer 3, and the Micro-LENS layer 2 can be used for converging light. The filter layer 3 and the microlens layer 2 are connected together, and the filter layer 3 and the photosensitive element layer 1 are designed separately. In this way, both the filter layer 3 and the microlens layer 2 can be moved relative to the photosensitive element layer 1 by the drive of the drive mechanism 4.

That is to say, design in the embodiment of this application, actuating mechanism 4 is used for the drive filter 3(color filter, CF) with microlens layer 2(Micro-LENS) takes place to remove together, and is located these two lower parts photosensitive element layer 1 does not follow filter 3 with microlens layer 2 removes together, promptly photosensitive element layer 1's fixed position is motionless, brings a technical effect just so and just for example can photosensitive element layer 1's bottom (deviating from promptly one side of filter layer 3) pastes establishes auxiliary parts such as heat dissipation piece, and the heat dissipation piece of establishing that pastes helps improving image sensor's heat dispersion. And further avoid the phenomenon that the junction temperature of the image sensor rises during operation, which is very beneficial to improving the picture quality.

For example, see the conventional RGB style design shown in fig. 5 and 6, which is as follows:

fig. 5 and 6 show the RGB arrangement, each pixel is composed of a Micro-LENS (Micro-LENS), a Color Filter (CF), a Photodiode (PD), etc., and each pixel represents a color information. The method comprises the steps of arranging pixels of three filters with different colors on a spatial plane, and conducting demosaicing processing after signals are collected to form a color pixel. However, the disadvantage of this arrangement is also apparent because each pixel can capture only one color, which is done collectively by 4 pixels RGGB if a normal color is to be presented. In order to achieve high resolution and high color reproduction, the RGGB array size needs to be continuously reduced, and the small pixel size (pixel size) is limited by the process, or the image sensor size needs to be increased, but the sensor with the large pixel size (pixel size) necessarily requires a thicker electronic device size, which is opposite to the current demand for thinning of electronic devices. Therefore, new designs are required.

In view of the above problems of the conventional RGB design, in the embodiment of the present application, the design realizes resolution enhancement by moving the microlens layer 2 and the filter layer 3, and further realizes super resolution, specifically:

before moving the microlens layer 2 and the filter layer 3, exposure is started, see the photosensitive element layer 1 shown in fig. 8, which includes, for example, 6 photosensitive units (1# PD to 6# PD), each of the 6 photosensitive units can obtain one color information, for example, the photosensitive unit #1 (PD) obtains red color information, the photosensitive unit #2 (PD) obtains green color information, the photosensitive unit # 3 (PD) obtains green color information, and the like;

then, the microlens layer 2 and the filter layer 3 can be driven by the driving mechanism 4 to move 1pixel to the right side shown in fig. 8, and at this time, the photosensitive element layer 1 at the bottom remains stationary; thus, after exposure, the #1 photo-sensitive unit (PD) obtains color information of blue, the #2 photo-sensitive unit (PD) obtains color information of red, and the # 3 photo-sensitive unit (PD) obtains color information of blue. It can be seen that for each movement of the microlens layer 2 and the filter layer 3 (one pixel for each movement), a photosensitive unit (PD) on the photosensitive element layer 1 can obtain different color information. Thus, by moving 3 times, the same Photosite (PD) can acquire 4 color information (including one color information before not moving and the other three color information after moving 3 times), thus forming the complete color information of RGGB. And then, synthesizing by a software algorithm to obtain 4 times of image resolution, thereby achieving the effects of eliminating false color and improving resolution.

The software algorithm synthesis method comprises the following steps: by shifting the same Photosite (PD) 3 times, 4 color information software algorithms can be obtained, from the previous: black level correction-lens shading correction-dead pixel correction-color difference value-automatic white balance-color correction, etc., becomes: black level correction, lens shading correction, dead pixel correction, color aliasing, automatic white balance, color correction and the like, and the difference is changed into color aliasing without color interpolation of a conventional algorithm, namely the acquired complete 4 pieces of color information are fused.

The image sensor provided by the embodiment of the application can realize super-resolution reconstruction of images, does not need to participate in mosaic processing, and is low in power consumption. The resolution can be improved, and moire fringes on the picture can be reduced, so that more real color data can be obtained.

In the embodiment of the present application, a solution capable of improving the resolution is provided for the image sensor, wherein the filter layer 3 and the microlens layer 2 are stably driven by the driving mechanism 4 to move together with the set pixels (e.g., 1pixel) relative to the photosensitive element layer 1, so that the resolution can be improved without increasing the number of pixels and the size of the photosensitive chip.

The filter layer 3 and the microlens layer 2 can move, and the photosensitive element layer 1 at the bottom is fixed, so that the bottom surface of the photosensitive element layer 1 can be reserved for installing a heat conducting piece, better heat dissipation performance can be realized, and the phenomenon that the texture of a formed picture is reduced due to high temperature is avoided.

In some examples of the present application, referring to fig. 1, the driving mechanism 4 and the filter layer 3 enclose a receiving space, and the photosensitive device layer 1 is disposed in the receiving space.

In the embodiment of the application, the position of the driving mechanism 4 is reasonably set, so that the driving mechanism and the driving mechanism 4 can directly drive the filter layer 3 and the microlens layer 2 to move, and can also form an accommodating space by surrounding the filter layer 3, and the photosensitive element layer 1 can be just installed in the space. The arrangement of the inner cavity of the image sensor is more reasonable, and the space is effectively utilized.

In some examples of the present application, referring to fig. 7 and 8, the photosensitive element layer 1 includes a plurality of photosensitive cells, the microlens layer 2 includes a plurality of microlens cells, and the filter layer 3 includes a plurality of filter cells; the micro lens units and the light filtering units are arranged in a one-to-one correspondence manner;

in the process of moving the filter layer 3 and the microlens layer 2, one of the filter units may be moved from being opposed to one of the light emitting units to being opposed to the other of the light emitting units.

That is, for example, referring to fig. 8, a description will be given taking a filter unit and a microlens unit corresponding to the #1 photosensitive unit as an example: the corresponding filter unit and the corresponding micro-lens unit correspond to the photosensitive unit No. 1 before moving, and correspond to the photosensitive unit No. 2 after moving by one pixel, and the photosensitive unit No. 1 and the photosensitive unit No. 2 are adjacently arranged.

Optionally, referring to fig. 1 and 2, the driving mechanism 4 includes a first driving part 41 and a second driving part 42; at least one of the filter layer 3 and the microlens layer 2 is connected to the first driving portion 41, the first driving portion 41 is connected to the filter layer 3 and the microlens layer 2, and the filter layer 3 and the microlens layer 2 are driven by the first driving portion 41 to move in a first direction with respect to the photosensitive element layer 1; the second driving portion 42 is connected to the first driving portion 41 to drive the filter layer 3 and the microlens layer 2 to move in a second direction relative to the photosensitive device layer 1, and the first direction and the second direction are perpendicular to each other and parallel to the photosensitive device layer 1.

Wherein the photosensitive element layer 1 forms a photosensitive plane. The movement of the filter layer 3 and the microlens layer 2 is parallel to the light sensing plane. That is, the filter layer 3 and the microlens layer 2 move up, down, left, and right on a plane parallel to the light sensing plane.

In the embodiment of the present application, the driving mechanism 4 is divided into two parts, i.e., the first driving part 41 and the second driving part 42, which can be used to drive the filter layer 3 and the microlens layer 2 combined together to move in different directions.

For example, referring to fig. 2, the first direction is set to be a horizontal direction (e.g., an X-axis direction) on a horizontal plane, and the first driving unit 41 may drive the filter layer 3 and the microlens layer 2 to move left and right, i.e., move 1pixel to the left or move 1pixel to the right. With reference to fig. 2, if the second direction is a longitudinal direction on the horizontal plane, and the second direction is perpendicular to the first direction, the second driving portion 42 may drive the filter layer 3 and the microlens layer 2 to move up and down, that is, move 1pixel up or 1pixel down.

In some examples of the present application, referring to fig. 2 and 3, the driving mechanism 4 includes a first driving portion 41 and a second driving portion 42;

the first driving part 41 comprises a first bearing part 411 and a first driving assembly 412, the second driving part 42 comprises a second bearing part 421 and a second driving assembly 422, and the second bearing part 421 surrounds the outer periphery of the first bearing part 411;

a first accommodating space 5 is arranged in the first bearing part 411, a supporting structure 6 is arranged in the first accommodating space 5, the supporting structure 6 can be bent and moved, the filter layer 3 and the microlens layer 2 are arranged on the supporting structure 6, the first driving component 412 is arranged in the first accommodating space 5 and is respectively connected with the first bearing part 411, the filter layer 3 and the microlens layer 2, and the first driving component 412 can drive the filter layer 3 and the microlens layer 2 to move in a first direction relative to the photosensitive element layer 1;

a second receiving space 7 is formed between the first carrying portion 411 and the second carrying portion 421, the second driving component 422 is disposed in the second receiving space 7 and is respectively connected to the first carrying portion 411 and the second carrying portion 421, and the second driving component 422 drives the first carrying portion 411 to drive the filter layer 3 and the microlens layer 2 to move in the second direction relative to the photosensitive device layer 1.

Referring to fig. 2, the first supporting portion 411 is, for example, a ring structure, and the first supporting portion 411 is disposed around the filter layer 3 and the microlens layer 2. The second supporting portion 421 is also in a ring structure, for example, and the second supporting portion 421 surrounds the first supporting portion 411. Thus, the first bearing part 411 may correspond to an inner ring support structure, and the second bearing part 421 may correspond to an outer ring support structure.

For example, the first receiving portion 411 and the second receiving portion 421 are both rectangular ring structures.

The first driving element 412 is disposed on the first carrying portion 411 located at the inner ring, the filter layer 3 and the microlens layer 2 are accommodated in the inner space of the first carrying portion 411 and connected to the first driving element 412, and the first driving element 412 is configured to drive the filter layer 3 and the microlens layer 2 to move left or right relative to the photosensitive device layer 1.

The second driving component 422 is connected between the first bearing part 411 located at the inner ring and the second bearing part 421 located at the outer ring, the second driving component 422 does not directly drive the filter layer 3 and the microlens layer 2 to move up and down, but drives the first bearing part 411 directly connected with the second driving component to move correspondingly, and then the first bearing part 411 synchronously drives the filter layer 3 and the microlens layer 2 to move up and down.

In the embodiment of the present application, the filter layer 3 and the microlens layer 2 are controlled separately from each other in the left-right and up-down directions, so that the driving control is more convenient and more stable.

Wherein the support structure 6 is flexible, for example, and can be driven to perform bending movement.

Wherein the first driving component 412 and the second driving component 422 are both MEMS capacitive driving devices, for example.

Compared with the current camera moving actuating mechanism, the MEMS (Micro-Electro-Mechanical System) has the characteristics of small volume and high precision, and can realize high-precision movement.

The MEMS structure is selected to be adopted in the embodiment of the application, so that the control with higher precision and more stability can be realized, and compared with other motor schemes, the power consumption is lower, the super-resolution performance is improved, and the picture effect is improved.

In some examples of the present application, referring to fig. 3, the first driving assembly 412 is provided in plurality; the first driving assembly 412 comprises a first polar plate 4121 and a second polar plate 4122 which are arranged in parallel and in a staggered manner, the first polar plate 4121 is connected with the first bearing part 411, and the second polar plate 4122 is connected with the supporting structure 6; when the first driving element 412 is powered on, the second plate 4122 drives the filter layer 3 and the microlens layer 2 to move in the first direction relative to the photosensitive device layer 1.

The first electrode plate 4121 is connected to the first supporting portion 411, and the first electrode plate 4121 is fixed to the first supporting portion 411 and can be used as a fixed electrode plate. The second plate 4122 is connected to the support structure 6, the support structure 6 supports the filter layer 3 and the microlens layer 2, the second plate 4122 is required to drive the filter layer 3 and the microlens layer 2 to move, and therefore, the second plate 4122 is designed as a movable plate (which is movable relative to the first plate 4121).

Wherein, under the condition that the driving force generated by the first driving component 412 is balanced with the bending stress of the support structure 6, the filter layer 3 and the microlens layer 2 stay at the target position.

It should be noted that, when the first plate 4121 and the second plate 4122 are energized, an electrostatic force may be generated between the first plate 4121 and the second plate 4122, and when the electrostatic force between the two plates is balanced with the bending stress of the support structure 6, the filter layer 3 and the microlens layer 2 may be stably retained to be fixed at a target position.

In some examples of the present application, referring to fig. 2 and 3, the first plate 4121 comprises a plurality of first comb teeth and the second plate 4122 comprises a plurality of second comb teeth; the plurality of first comb teeth and the plurality of second comb teeth are parallel to each other and are arranged in a staggered mode.

It is understood that the first plate 4121 and the second plate 4122 each have a comb structure, as can be seen in fig. 2 and 3.

The first driving assembly 412 operates according to the following principle:

the parallel plate driver can generate a driving force in a specific direction, and the control mass can move along the specific direction. Referring to fig. 3, the electrostatic force generated by the two parallel plates in the x direction is:

in formulae (1) and (2): dielectric constant ε₀＝8.854×10^-12F/m, V is a voltage applied between the first plate 4121 and the second plate 4122, y₀Is the distance (constant) between the comb teeth of the two polar plates, x₀Is the width of the plate (constant).

From the above formula, the electrostatic force F_XIs proportional to the added square.

Varying the electrostatic force F by applying different voltages_XDue to the movable second plate 4122 being (bendable) connected to the support structure 6, the electrostatic force F increases when the voltage increases_XAnd also becomes larger, pushing the movable second plate 4122 to move, and when this electrostatic force is balanced with the bending stress of the support structure 6, the second plate 4122 is at rest, thus acting to change the distance between the two plates. By reasonably designing the above design values, stable um-level driving can be achieved.

In some examples of the present application, referring to fig. 2, the second driving assembly 422 is provided in plurality; the second driving assembly 422 comprises a third polar plate 4221 and a fourth polar plate 4222 which are arranged in parallel and in a staggered manner, the third polar plate 4221 is connected with the second bearing part 421, and the fourth polar plate 4222 is connected with the first bearing part 411; when the second driving component 422 is powered on, the fourth electrode plate 4222 drives the filter layer 3 and the microlens layer 2 to move in the second direction relative to the photosensitive device layer 1.

Optionally, the third plate 4221 includes a plurality of third comb teeth, and the fourth plate 4222 includes a plurality of fourth comb teeth; the plurality of third comb teeth and the plurality of fourth comb teeth are parallel to each other and are arranged in a staggered mode.

The first driving component 412 and the second driving component 422 provided by the embodiment of the present application can meet the requirement of less than 1pixel in the process of cooperatively driving the filter layer 3 and the microlens layer 2 to move together, and can provide a stable fixed precision, such as 0.5 pixel. The step of each movement does not fluctuate, so that the super-resolution can be improved.

In some examples of the present application, referring to fig. 1, the image sensor further includes a circuit board 8 and a heat-conducting member 9, the photosensitive element layer 1 and the driving mechanism 4 are disposed on the circuit board 8 and electrically connected to the circuit board 8, and the heat-conducting member 9 is disposed on a side of the circuit board 8 facing away from the photosensitive element layer 1.

The circuit board 8 is a flexible circuit board and can be bent.

The circuit board 8 can realize the electrical conduction between the photosensitive element layer 1 and the driving mechanism 4 and an external circuit, so that the photosensitive element layer and the driving mechanism can work normally.

According to the image sensor provided by the embodiment of the application, the photosensitive element layer 1, the Flexible Printed Circuit (FPC) and the heat conducting piece 9 can be in direct contact, and the heat conducting piece 9 can directly conduct heat to other hardware parts of electronic equipment, so that better heat dissipation performance is facilitated.

Optionally, the heat conducting member 9 is a metal sheet.

Further, the heat-conducting member 9 is a steel sheet.

Referring to fig. 1, the image sensor further includes a lens assembly, the lens assembly includes a lens 10, a support 11 and an infrared filter 12, the lens 10 and the infrared filter 12 are disposed on the support 11, and the infrared filter 12 is disposed opposite to the lens 10.

Referring to fig. 4, there is shown a comparison graph before and after processing the same image by using the image sensor provided by the embodiment of the present application, as is apparent from the comparison: and the right picture is subjected to super-resolution reconstruction, so that the image quality level is obviously improved.

According to another embodiment of the present application, an electronic device is provided.

The electronic device comprises an image sensor as described above.

Referring to fig. 1, the image sensor may be mounted to a hardware portion of an electronic device, such as a cell phone, for example, a cell phone bezel.

In addition, a Pyrolytic Graphite Sheet (PGS), which is a thin film for heat dissipation, is provided in the mobile phone, to which the image sensor is assembled, that is, the photosensitive element layer 1 of the image sensor is disposed on the Pyrolytic graphite sheet.

It should be noted that the electronic device may be a terminal, or may be another device besides the terminal. For example, the electronic Device may be a Mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic Device, a Mobile Internet Device (MID), an Augmented Reality (AR)/Virtual Reality (VR) Device, a robot, a wearable Device, an ultra-Mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and may also be a server, a Network Attached Storage (Network Attached Storage, NAS), a personal computer (NAS), a Television (TV), a teller machine, a self-service machine, and the like, and the embodiments of the present application are not limited thereto.

Other configurations and operations of the electronic device according to the embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An image sensor, comprising:

a photosensitive element layer;

a microlens layer;

2. The image sensor as claimed in claim 1, wherein the driving mechanism and the filter layer define a receiving space, and the photosensitive element layer is disposed in the receiving space.

3. The image sensor of claim 1, wherein the photosensitive element layer comprises a plurality of photosensitive cells, the microlens layer comprises a plurality of microlens cells, and the filter layer comprises a plurality of filter cells;

the micro lens units and the light filtering units are arranged in a one-to-one correspondence manner;

in the process of moving the filter layer and the microlens layer, one of the filter units can be moved from being opposed to one of the light emitting units to being opposed to the other of the light emitting units.

4. The image sensor of claim 1, wherein the drive mechanism includes a first drive portion and a second drive portion;

the first driving part comprises a first bearing part and a first driving assembly, the second driving part comprises a second bearing part and a second driving assembly, and the second bearing part is arranged around the outer peripheral side of the first bearing part;

a first accommodating space is formed in the first bearing part, a supporting structure is arranged in the first accommodating space, the supporting structure can be bent and moved, the filter layer and the micro-lens layer are arranged on the supporting structure, the first driving component is arranged in the first accommodating space and is respectively connected with the first bearing part, the filter layer and the micro-lens layer, and the first driving component can drive the filter layer and the micro-lens layer to move in the first direction relative to the photosensitive element layer;

a second accommodating space is formed between the first bearing part and the second bearing part, the second driving component is arranged in the second accommodating space and is respectively connected with the first bearing part and the second bearing part, and the second driving component drives the first bearing part to drive the filter layer and the micro-lens layer to move in the second direction relative to the photosensitive element layer.

5. The image sensor according to claim 4, wherein the first driving member is provided in plurality;

the first driving assembly comprises a first polar plate and a second polar plate which are arranged in parallel and staggered, the first polar plate is connected with the first bearing part, and the second polar plate is connected with the supporting structure;

when the first driving component is electrified, the second pole plate drives the filter layer and the micro-lens layer to move in the first direction relative to the photosensitive element layer.

6. The image sensor as claimed in claim 5, wherein the filter layer and the microlens layer stay at a target position under a condition that the driving force generated by the first driving component is balanced with a bending stress of the support structure.

7. The image sensor of claim 5, wherein the first plate includes a plurality of first comb teeth and the second plate includes a plurality of second comb teeth;

the plurality of first comb teeth and the plurality of second comb teeth are parallel to each other and are arranged in a staggered mode.

8. The image sensor according to claim 4, wherein the second driving member is provided in plurality;

the second driving assembly comprises a third polar plate and a fourth polar plate which are arranged in parallel and in a staggered mode, the third polar plate is connected with the second bearing part, and the fourth polar plate is connected with the first bearing part;

under the condition that the second driving component is electrified, the fourth polar plate drives the filter layer and the micro-lens layer to move in the second direction relative to the photosensitive element layer.

9. The image sensor according to any one of claims 1 to 8, further comprising a circuit board and a heat conductive member, wherein the photosensitive element layer and the driving mechanism are disposed on the circuit board and electrically connected to the circuit board;

the heat conducting piece is arranged on one side of the circuit board, which is far away from the photosensitive element layer.

10. An electronic device, characterized in that it comprises an image sensor according to any one of claims 1-9.