CN114649739A - Laser packaging structure, laser chip packaging method and laser radar - Google Patents
Laser packaging structure, laser chip packaging method and laser radar Download PDFInfo
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- CN114649739A CN114649739A CN202011515475.6A CN202011515475A CN114649739A CN 114649739 A CN114649739 A CN 114649739A CN 202011515475 A CN202011515475 A CN 202011515475A CN 114649739 A CN114649739 A CN 114649739A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Abstract
The invention discloses a laser packaging structure, a packaging method of a laser chip and a laser radar, wherein the laser packaging structure comprises the following components: a base body on which an electrode is provided; a laser chip disposed on the base and electrically connected to the electrode so that power can be supplied through the electrode; the packaging material is arranged on the substrate and the laser chip so as to coat the laser chip; and the reflecting part is arranged on the part of the packaging material opposite to the light-emitting surface of the laser chip, so that the laser emitted by the laser chip can be reflected by the reflecting part and emitted from the emitting surface of the packaging material, and the direction of a main ray of the laser emitted from the emitting surface of the packaging material is basically vertical to the normal direction of the light-emitting surface of the laser chip. By the embodiment of the invention, the laser chip is integrally packaged, so that the laser beam can be emitted perpendicular to the surface of the substrate and can be adjusted on the light emitting surface.
Description
Technical Field
The present disclosure relates to the field of optoelectronics, and in particular, to a laser package structure, a laser chip package method, and a laser radar.
Background
Edge-emitting lasers (EELs), which are one type of semiconductor lasers, are widely used in optical communications, laser displays, medical treatment, sensors, and industrial applications. Compared with a Vertical Cavity Surface Emitting Laser (VCSEL), the edge emitting laser has a remarkable brightness advantage, but because edge emission is adopted, the edge emitting laser is not convenient to use as the VCSEL, and array emission is not easy to form. Fig. 1(a) and 1(b) show light-emitting schematic diagrams of an EEL and a VCSEL, respectively, in which a laser beam of the EEL shown in fig. 1(a) is emitted in parallel to a substrate surface, and a light-emitting direction of the VCSEL shown in fig. 1(b) is perpendicular to the substrate surface.
The edge-emitting laser is used as a light source commonly used by the current laser radar and has the advantages of good reliability, high power density, mature technology and the like. However, since the light emitted from the edge-emitting laser is at the side edge of the semiconductor laser chip, it is difficult TO package the chip in a very small size, and most of the packaged edge-emitting lasers currently adopt TO-Can packages and butterfly packages. If the edge-emitting laser is not packaged, the lifetime and reliability of the laser may be substantially reduced due to the effects of moisture and contaminants. Therefore, the current solution is difficult to simultaneously ensure the requirements of small size, high reliability, low cost and the like. In addition, the divergence angle of the edge-emitting laser in the fast axis direction is very large, and the divergence angle of the fast axis and the slow axis is very different (as shown in fig. 2, the divergence angle α in the fast axis direction is about 30 degrees, and the divergence angle θ in the slow axis direction is about 10 degrees), if the divergence angle is not adjusted (collimated or compressed), the system power loss is caused, so that the divergence angle of the fast axis and/or the slow axis needs to be adjusted at the same time in many applications. Most of the current applications adopt a single fast-axis lens and/or a single slow-axis lens to adjust the divergence angle of the fast axis and/or the slow axis respectively (fig. 3 shows a schematic diagram of the divergence angle adjustment in the fast axis direction of the current edge-emitting laser), and the mode has the disadvantages of complex structure, high cost and poor reliability. Fig. 3 shows a schematic diagram of the adjustment of the divergence angle of the current edge-emitting laser to the fast axis direction.
The statements in the background section are merely prior art as they are known to the inventors and do not, of course, represent prior art in the field.
Disclosure of Invention
The invention provides a laser packaging structure, which changes the emitting direction of a laser beam through packaging and solves the problems that the packaging size, reliability and packaging cost of a laser chip are difficult to ensure at the same time.
To solve the above technical problem, an embodiment of the present invention provides a laser sensor package structure, including:
a substrate on which an electrode is disposed;
a laser chip disposed on the substrate and electrically connected to the electrode so that power can be supplied through the electrode;
an encapsulation material disposed on the substrate and the laser chip to encapsulate the laser chip; and
the reflecting part is arranged on the part, opposite to the light emitting surface of the laser chip, of the packaging material, so that the laser emitted by the laser chip can be reflected by the reflecting part and emitted from the emitting surface of the packaging material, and the direction of a main ray of the laser emitted from the emitting surface of the packaging material is basically vertical to the normal direction of the light emitting surface of the laser chip.
According to an aspect of the present invention, wherein the laser chip is an edge-emitting laser chip, a light emitting surface of the laser chip has fast axis and slow axis directions; the laser packaging structure comprises a packaging material, a laser chip and a reflection part, wherein the packaging material is arranged on the laser chip, the reflection part is attached to a reflection film on the plane or the curved surface and used for reflecting laser emitted by the laser chip, and the direction of a principal ray of the laser emitted from the emitting surface of the packaging material is basically parallel to the fast axis direction of the light emitting surface of the laser chip.
According to an aspect of the present invention, a side of a portion of the encapsulation material opposite to the light emitting surface of the laser chip facing the outside is a plane, and an included angle between the plane and the light emitting surface of the laser chip is 45 degrees; or the side, facing the outside, of the part of the packaging material opposite to the light emitting surface of the laser chip is a curved surface and is configured to adjust the divergence angle of the laser light from the laser chip in at least one direction.
According to an aspect of the present invention, wherein the exit surface is a plane or a curved surface, when the exit surface is a curved surface, the exit surface includes a cylindrical lens or a spherical lens configured to adjust a divergence angle of the laser light from the reflection part in at least one direction.
According to an aspect of the present invention, when the exit surface includes a cylindrical lens, an extending direction of the cylindrical lens is substantially parallel to a slow axis direction of a light emitting surface of the laser chip.
According to an aspect of the present invention, wherein the electrodes include a second electrode disposed inside the substrate, a fourth electrode, and a first electrode and a third electrode disposed outside the substrate, wherein one of a positive electrode and a negative electrode of the laser chip is disposed on the second electrode by a patch process, and the other is electrically connected to the fourth electrode by a wire; the second electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the third electrode.
According to an aspect of the present invention, the substrate further includes a first through hole and a second through hole, wherein the first electrode and the second electrode are opposite to each other with the first through hole interposed therebetween, the third electrode and the fourth electrode are opposite to each other with the second through hole interposed therebetween, and the first through hole and the second through hole are filled with a conductive material so that the first electrode and the second electrode are electrically connected to each other, and the third electrode and the fourth electrode are electrically connected to each other.
According to an aspect of the present invention, wherein the encapsulating material is an optical resin, the material of the base is ceramic, and the conductive material is copper.
According to one aspect of the invention, the laser device comprises a plurality of laser chips, the laser chips are arranged at intervals along the slow axis direction of a light emitting surface, share the same reflecting part and the same emergent surface, and the light emitting surface of each laser chip corresponds to the reflecting part.
The invention also relates to a packaging method of the laser chip, which comprises the following steps:
s101: providing a laser chip;
s102: providing a substrate, wherein an electrode is arranged on the substrate;
s103: mounting the laser chip on the substrate and electrically connected to the electrode;
s104: disposing an encapsulation material on the substrate and the laser chip to encapsulate the laser chip; and
s105: and arranging a reflecting part on a part of the packaging material opposite to the light emitting surface of the laser chip, so that the laser emitted by the laser chip can be reflected by the reflecting part and emitted from the emitting surface of the packaging material, and the direction of a principal ray of the laser emitted from the emitting surface of the packaging material is basically vertical to the normal direction of the light emitting surface of the laser chip.
According to an aspect of the present invention, wherein the laser chip is an edge-emitting laser chip, a light emitting surface of the laser chip has fast axis and slow axis directions; the reflection part is a reflection film, and the reflection part is a reflection film,
the step S104 further includes: forming a flat or curved surface shape on a side of a portion of the encapsulating material facing the light emitting surface of the laser chip toward the outside by a mold;
the step S105 further includes: and attaching a reflecting film on the plane or the curved surface.
According to an aspect of the invention, the step S104 further comprises: forming a plane on one side, facing the outside, of a part, opposite to the light emitting surface of the laser chip, of the packaging material through a mold, wherein an included angle between the plane and the light emitting surface of the laser chip is set to be 45 degrees; or forming a curved surface on a side of a portion of the encapsulating material facing the light emitting surface of the laser chip toward the outside by a mold, the curved surface and the reflective film being configured to reflect the laser light from the laser chip and emit the laser light after adjusting a divergence angle of the laser light in at least one direction.
According to an aspect of the invention, further comprising:
s106: and forming the emergent surface into a plane or curved surface shape through a mold.
According to an aspect of the present invention, wherein the step S106 further comprises: forming the exit surface into a shape of a cylindrical lens or a spherical lens by a mold, wherein the cylindrical lens or the spherical lens is configured to adjust a divergence angle of the laser light from the reflection part in at least one direction.
According to an aspect of the present invention, wherein the step S106 further comprises: and forming the emergent surface into a cylindrical lens shape by a mold, wherein the extending direction of the cylindrical lens is basically parallel to the slow axis direction of the luminous surface of the laser chip.
According to one aspect of the invention, the method further comprises the steps of arranging a second electrode and a fourth electrode on the inner side of the substrate, and arranging a first electrode and a third electrode on the outer side of the substrate, wherein one of a positive electrode and a negative electrode of the laser chip is arranged on the second electrode through a patch process, and the other is electrically connected to the fourth electrode through a lead; the second electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the third electrode, the substrate further includes a first through hole and a second through hole, wherein the first electrode and the second electrode are opposite to each other with the first through hole interposed therebetween, the third electrode and the fourth electrode are opposite to each other with the second through hole interposed therebetween, the first through hole and the second through hole are filled with a conductive material, the first electrode and the second electrode are electrically connected, and the third electrode and the fourth electrode are electrically connected.
According to an aspect of the present invention, wherein the encapsulating material is an optical resin, the material of the base is ceramic, and the conductive material is copper.
According to an aspect of the present invention, wherein the step S101 comprises: providing a plurality of said laser chips;
the step S103 includes: arranging the laser chips at intervals along the slow axis direction of the light emitting surface, and installing the laser chips on the substrate;
the step S104 includes: and forming an integral part for attaching a reflecting film and an integral emergent surface on the packaging material through a mould, so that the luminous surface of each laser chip is opposite to the reflecting part.
The invention also relates to a lidar comprising:
a transmitting unit including the laser package structure as described in any one of the above, configured to transmit a detection laser for detecting a target object;
the receiving unit comprises a photoelectric detector and can receive the echo of the detection laser reflected on the target object and convert the echo into an electric signal;
and the processing unit is connected with the receiving unit to receive the electric signal and calculate the distance and/or the reflectivity of the target object according to the electric signal.
Through the embodiment, the problems that in the prior art, due to the fact that the fast axis and the slow axis are adjusted through the independent fast axis lens and the independent slow axis lens respectively, the laser is complex in structure, high in cost, poor in reliability and the like are solved, the emitting direction of the laser beam is changed by the packaging material, the laser beam can be emitted upwards perpendicular to the surface of the substrate, and the laser beam is adjusted on the light emitting surface.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not to limit the disclosure. In the drawings:
FIG. 1(a) shows a schematic of the light extraction of an edge-emitting laser;
FIG. 1(b) shows a schematic drawing of the light output of a VCSEL;
FIG. 2 is a schematic diagram showing the light emitting surface of an edge-emitting laser chip and the divergence angle in the fast-slow axis direction;
FIG. 3 shows a schematic diagram of fast axis direction divergence angle adjustment for edge-emitting lasers;
fig. 4A shows a schematic diagram of a laser package structure according to a first embodiment of the present invention;
FIG. 4B illustrates a first perspective view of the laser package structure shown in FIG. 4A;
FIG. 4C illustrates a second perspective view of the laser package structure shown in FIG. 4A;
fig. 5 shows a schematic diagram of a laser package structure according to a second embodiment of the present invention;
fig. 6A shows a schematic diagram of a laser package structure according to a third embodiment of the present invention;
FIG. 6B illustrates a first perspective view of the laser package structure shown in FIG. 6A;
FIG. 6C illustrates a second perspective view of the laser package structure shown in FIG. 6A;
fig. 7A shows a first perspective view of a laser array package structure according to a fourth embodiment of the present invention;
fig. 7B shows a second perspective view of a laser array package structure according to a fourth embodiment of the present invention;
FIG. 8 shows a flow diagram of a laser chip packaging method according to one embodiment of the invention; and
FIG. 9 shows a block diagram of a lidar in accordance with one embodiment of the invention.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection, either mechanically, electrically, or in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Fig. 4A shows a schematic diagram of a laser package structure according to a first embodiment of the present invention, and fig. 4B and 4C show perspective views of two directions of the laser package structure shown in fig. 4A, respectively. As shown in fig. 4A, 4B and 4C, the laser package structure 100 includes: a base body 2, a laser chip 1, a packaging material 6, and a reflection portion 11. Wherein, the substrate 2 is provided with electrodes (fig. 4A is a first electrode 3A, a second electrode 3B, a third electrode 4A, and a fourth electrode 4B, respectively, which will be described in detail below), and the laser chip 1 is disposed on the substrate 2 and electrically connected to the electrodes, so that power can be supplied through the electrodes to drive the laser chip 1 to emit a detection laser beam. The encapsulating material 6 is provided on the base 2 and the laser chip 1 so as to coat the laser chip 1. The reflection portion 11 is disposed on a portion of the package material 6 opposite to the light emitting surface of the laser chip 1, so that the laser light emitted from the laser chip 1 can be reflected by the reflection portion 11 and emitted from the emitting surface 10 of the package material 6, and a direction 13 of a principal ray of the laser light emitted from the emitting surface 10 of the package material 6 is substantially perpendicular to a normal direction 14 of the light emitting surface of the laser chip 1.
According to a preferred embodiment of the present invention, wherein the laser chip 1 is an edge emitting laser chip, as shown in fig. 2, the light emitting surface of the laser chip 1 has fast axis and slow axis directions. As shown in fig. 4A, a side 12 of the encapsulating material 6 facing the light emitting surface of the laser chip 1 is a flat surface. The reflecting part 11 is a reflecting film or a reflecting mirror attached to the plane, and is configured to reflect the laser emitted from the laser chip 1, and a direction 13 of a principal ray of the laser emitted from the emitting surface 10 of the encapsulating material 6 is substantially parallel to a fast axis direction (Y direction in the drawing) of the light emitting surface of the laser chip 1. After the edge-emitting laser chip is packaged, the emitting direction of original emitting laser emitted along the surface parallel to the substrate is changed, the emitting laser of the laser packaging structure also realizes the light emitting effect similar to a vertical cavity surface emitting laser, namely, the laser emitted by the laser packaging structure has the light emitting direction vertical to the surface of the substrate, so that the edge-emitting laser is more convenient to use on the premise of having an obvious brightness advantage and is easy to form array emission (detailed description in figures 7A and 7B).
According to an embodiment of the present invention, as shown in fig. 4A, 4B and 4C, a side 12 of the portion of the encapsulating material 6 opposite to the light emitting surface of the laser chip 1 facing the outside is a flat surface. Preferably, an included angle between the plane and the light emitting surface of the laser chip 1 is 45 degrees. It will be understood by those skilled in the art that when the side 12 of the package material 6 facing the light-emitting surface of the laser chip 1 is formed by a plurality of planes, the included angle may be set to different angles as long as it is ensured that the laser emitted from the laser package structure has a light-emitting direction perpendicular to the substrate surface, and these are within the scope of the present invention.
Fig. 5 shows a schematic diagram of a laser package structure according to a second embodiment of the present invention. As shown in the drawing, unlike the laser package structure shown in fig. 4A, in the laser package structure 100 shown in fig. 5, a side 12 of a portion of the encapsulating material 6 facing the light emitting surface of the laser chip 1 toward the outside is a curved surface configured to adjust a divergence angle of laser light from the laser chip in at least one direction. Correspondingly, the reflecting part 11 is a reflecting film attached to the curved surface. The curved surface and the reflective film attached thereto are configured to reflect the laser light from the laser chip 1 and emit the laser light after adjusting the divergence angle of the laser light in at least one direction. Preferably, as shown in fig. 5, the curved surface-shaped reflection structure is configured to reflect the laser light from the laser chip 1 and to emit the laser light with the divergence angle in the fast axis direction adjusted, and in fig. 5, for example, the laser light is collimated with respect to the divergence angle in the fast axis direction. In this way, there is no need to provide a separate lens downstream of the laser chip 1 for adjusting the divergence angle in the fast axis direction.
Fig. 6A shows a schematic diagram of a laser package structure according to a third embodiment of the present invention, and fig. 6B and 6C show two perspective views of the laser package structure shown in fig. 6A, respectively. As shown in fig. 6A, 6B, and 6C, the laser package structure 100 includes: a base body 2, a laser chip 1, a packaging material 6, and a reflection portion 11. The laser chip 1 is disposed on the substrate 2 and electrically connected to the electrodes (in fig. 6A, a first electrode 3A, a second electrode 3B, a third electrode 4A, and a fourth electrode 4B are respectively disposed on the substrate, and the electrodes are the same as those shown in fig. 4A), so that power can be supplied through the electrodes to drive the laser chip 1 to emit a detection laser beam. The encapsulating material 6 is provided on the base 2 and the laser chip 1 so as to coat the laser chip 1. The reflection portion 11 is disposed on a portion of the package material 6 opposite to the light emitting surface of the laser chip 1, so that the laser light emitted from the laser chip 1 can be reflected by the reflection portion 11 and emitted from the emitting surface 10 of the package material 6, and a direction 13 of a principal ray of the laser light emitted from the emitting surface 10 of the package material 6 is substantially perpendicular to a normal direction 14 of the light emitting surface of the laser chip 1. Optionally, the exit surface 10 is a plane or a curved surface. When the emitting surface 10 is a curved surface, the emitting surface 10 includes a cylindrical lens (as shown in fig. 6A) or a spherical lens configured to adjust a divergence angle of the laser light from the reflecting portion 11 in at least one direction. Alternatively, when the emitting surface 10 is a cylindrical lens, the extending direction of the cylindrical lens is substantially parallel to the slow axis direction (X direction in the figure) of the emitting surface of the laser chip 1, and thus the divergence angle of the emitted laser spot in the fast axis direction can be adjusted. When the emitting surface 10 is a spherical lens, the spherical lens is arranged to adjust divergence angles of the emitted laser spot in the fast axis direction and the slow axis direction respectively.
In addition, the curved exit surface 10 shown in fig. 6A-6C may also be incorporated into the embodiment shown in fig. 5. For example, in the embodiment of fig. 5, a curved reflective structure is used in conjunction with the curved exit surface 10 to achieve the desired beam modulation effect. In addition, fig. 5 and fig. 6A to 6C each show the effect of adjusting the divergence angle in the fast axis direction of the light beam emitted from the laser chip 1, and it is easily understood by those skilled in the art that when the reflection of the curved surface shape is configured as a two-dimensional curved surface and the emitting surface 10 includes a spherical lens, the divergence angles in the fast axis direction and the slow axis direction of the light beam emitted from the laser chip 1 can be adjusted at the same time. These are all within the scope of the present invention.
In the first and second embodiments described above, the direction of emitting laser light is adjusted by providing the side 12 of the encapsulating material 6 facing the light emitting surface of the laser chip 1 as a flat surface or a curved surface; in the third embodiment, the divergence angle of the emergent laser spot in the fast axis direction and/or the slow axis direction is adjusted by setting the light emitting surface 10 to be a curved surface. Those skilled in the art will understand that the shape of the light-emitting surface 10 or the side 12 of the packaging material 6 facing the outside of the portion opposite to the light-emitting surface of the laser chip 1 may be set separately according to specific requirements, or the shape of the light-emitting surface 10 and the side 12 of the packaging material 6 facing the outside of the portion opposite to the light-emitting surface of the laser chip 1 may be set simultaneously. For example, it is within the scope of the present invention to provide the light emitting surface 10 and the side 12 of the packaging material 6 facing the outside opposite to the light emitting surface of the laser chip 1 as curved surfaces.
According to an embodiment of the present invention, a side 12 and/or a light emitting surface 10 of a portion of the encapsulation material 6 opposite to the light emitting surface of the laser chip 1 facing the outside may be coated. Through the coating film, on the one hand can guarantee the effective utilization of light beam, on the other hand can also play certain effect of preventing vapor infiltration.
As shown in fig. 4A and 6A, the electrodes of the laser package structure 100 include a second electrode 3B and a fourth electrode 4B disposed inside the substrate 2, and a first electrode 3A and a third electrode 4A disposed outside the substrate, wherein one of the positive electrode and the negative electrode of the laser chip 1 is disposed on the second electrode 3B by a die bonding process, and the other is electrically connected to the fourth electrode 4B by a wire; the second electrode 3B is electrically connected to the first electrode 3A, and the fourth electrode 4B is electrically connected to the third electrode 4A. Those skilled in the art will understand that the substrate inner side and the substrate outer side mean that after the laser chip 1 is packaged, the side of the substrate 2 facing the inside of the laser package structure 100 is the substrate inner side, and the side of the substrate 2 facing the outside of the laser package structure 100 is the substrate outer side.
Further, the base body 2 further includes a first through hole 9 and a second through hole 8, wherein the first electrode 3A and the second electrode 3B are opposed to each other through the first through hole 9, and the third electrode 4A and the fourth electrode 4B are opposed to each other through the second through hole 8. And conductive materials are filled in the first through hole 9 and the second through hole 8, so that the first electrode 3A is communicated with the second electrode 3B, and the third electrode 4A is communicated with the fourth electrode 4B. And the first electrode 3A, the second electrode 3B, the third electrode 4A and the fourth electrode 4B which are conducted supply power to the laser chip 1.
In the laser package structure 100 shown in fig. 4A, 5 and 6A, the package material 6 is an optical resin, the material of the substrate 2 is ceramic, and the conductive material is copper. The packaging material 6 packages the laser chip 1, plays a role in fixing, sealing and protecting the laser chip 1, and isolates the laser chip 1 from external impurities, so that the influence of water vapor and pollution on the service life and reliability of the laser is avoided. The optical resin in the encapsulating material 6 may be replaced with other materials having the same physical properties as the optical resin and performing the same function as described above with respect to the laser. Likewise, it will be understood by those skilled in the art that the material of the substrate 2 and the conductive material may be other materials that can achieve the same effect and the same function, and all of them are within the scope of the present invention.
Fig. 7A and 7B respectively show two perspective views of a laser array package structure according to a fourth embodiment of the present invention. As shown in fig. 7A and 7B, the laser array package structure includes a plurality of laser chips 1, and the plurality of laser chips 1 are respectively arranged at intervals along an X-axis direction (i.e., a slow-axis direction of a light-emitting surface) to form an array, and are packaged. The plurality of laser chips 1 share the same reflection portion 11 and the same emission surface 10, and the emission surface of each laser chip 1 corresponds to the reflection portion 11. The lasers can be packaged according to linear arrangement to form a linear array module as shown in fig. 7A and 7B, a laser linear array emitting vertically is formed, and the high-density array combined in such a way has the advantages of compact structure and flexibility in arrangement and is suitable for mass production.
Fig. 8 shows a flow chart of a laser chip packaging method according to an embodiment of the invention. The packaging method 800 may be used to package single or multiple laser chips as described above. The following detailed description refers to the accompanying drawings. The method comprises the following steps:
in step S101: a laser chip, for example an edge emitting laser chip, is provided.
In step S102: providing a substrate, wherein the substrate is provided with an electrode. The electrodes comprise two groups, are respectively and electrically connected with the anode and the cathode of the laser chip and supply power to the laser chip.
In step S103: the laser chip is mounted on the substrate and electrically connected to the electrode.
In step S104: an encapsulation material is disposed over the substrate and the laser chip to encapsulate the laser chip. Optionally, the laser chip and the substrate are plastically packaged by using a packaging material in a mould pressing mode.
In step S105: and arranging a reflecting part on a part of the packaging material opposite to the light emitting surface of the laser chip, so that the laser emitted by the laser chip can be reflected by the reflecting part and emitted from the emitting surface of the packaging material, and the direction of a principal ray of the laser emitted from the emitting surface of the packaging material is basically vertical to the normal direction of the light emitting surface of the laser chip.
The packaging method as described above, wherein the laser chip is an edge-emitting laser chip, and a light-emitting surface of the laser chip has fast axis and slow axis directions; the reflecting portion is a reflecting film, and the step S104 further includes:
the side of the portion of the encapsulation material opposite to the light emitting surface of the laser chip facing the outside is formed into a shape of a flat surface (as shown in fig. 4A) or a curved surface (as shown in fig. 5) by a mold. The step S105 further includes: the reflecting film is attached to the plane or the curved surface so that the laser beam can be emitted toward a designated direction, for example, by coating the reflecting film on the plane or the curved surface.
In the above packaging method, the step S104 further includes: forming a plane on one side, facing the outside, of a part, opposite to the light emitting surface of the laser chip, of the packaging material through a mold, wherein an included angle between the plane and the light emitting surface of the laser chip is set to be 45 degrees; or forming a curved surface on a side of a portion of the encapsulating material facing the light emitting surface of the laser chip toward the outside by a mold, the curved surface and the reflective film being configured to reflect the laser light from the laser chip and emit the laser light after adjusting a divergence angle of the laser light in at least one direction.
The packaging method as described above, further comprising:
in step S106: and forming the emergent surface into a plane or curved surface shape through a mold.
In the above packaging method, the step S106 further includes: forming the exit surface into a shape of a cylindrical lens or a spherical lens by a mold, wherein the cylindrical lens or the spherical lens is configured to adjust a divergence angle of the laser light from the reflection part in at least one direction.
In the packaging method described above, the step S106 further includes: and forming the emergent surface into a cylindrical lens shape by a mold, wherein the extending direction of the cylindrical lens is basically parallel to the slow axis direction of the luminous surface of the laser chip.
The packaging method further comprises disposing a second electrode and a fourth electrode inside the substrate, and disposing a first electrode and a third electrode outside the substrate, wherein one of the positive electrode and the negative electrode of the laser chip is disposed on the second electrode by a chip-on-chip process, and the other is electrically connected to the fourth electrode by a wire; the second electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the third electrode, the substrate further includes a first through hole and a second through hole, wherein the first electrode and the second electrode are opposite to each other with the first through hole interposed therebetween, the third electrode and the fourth electrode are opposite to each other with the second through hole interposed therebetween, the first through hole and the second through hole are filled with a conductive material, the first electrode and the second electrode are electrically connected, and the third electrode and the fourth electrode are electrically connected.
The above packaging method, wherein the packaging material is optical resin, the material of the substrate is ceramic, and the conductive material is copper.
According to an aspect of the present invention, step S101 of the packaging method further includes: a plurality of the laser chips are provided. The step S103 further includes: and arranging the laser chips at intervals along the slow axis direction of the light emitting surface and installing the laser chips on the substrate. The step S104 further includes: and forming an integral part for attaching a reflecting film and an integral emergent surface on the packaging material through a mould, so that the luminous surface of each laser chip is opposite to the reflecting part.
The invention also provides a laser radar comprising the laser packaging structure. The lidar 900 will be described in detail below with reference to fig. 9. FIG. 9 shows a block diagram of lidar 900, according to one embodiment of the invention. As shown, the lidar 900 includes a transmitting unit 910, a receiving unit 920, and a processing unit 930. Wherein the transmitting unit 910 includes a plurality of the laser packages 100 or the laser array package composed of a plurality of laser chips, and is configured to transmit a detection laser pulse to the surrounding environment of the laser radar 900 for detecting the object OB. The receiving unit 920 includes a photodetector configured to receive an echo of the detection laser beam reflected on the object OB and convert the echo into an electrical signal. The processing unit 930 is connected to the receiving unit 920 to receive the electrical signal and calculate the distance and/or reflectivity of the object OB according to the electrical signal.
As shown in fig. 9, when the laser radar 900 is in operation, the laser chip 1 in the laser package structure 100 emits a laser beam and reflects the laser beam by the reflection portion 11, the laser beam L is emitted from the light emitting surface 10, the laser beam L irradiates the detection object OB, and then is diffusely reflected by the detection object OB, and a reflection echo L' returns to the laser radar 900 and is received by the photodetector, and the photodetector converts the received optical signal into an electrical signal, and the electrical signal is transmitted to the signal processing unit 930. The signal processing unit 930 is coupled to the transmitting unit 910 and the receiving unit 920, and controls the transmission of the laser in the transmitting unit 910 and the processing of the signal received by the receiving unit 920, and according to the transmission time and the receiving time of the laser pulse, the distance and/or the reflectivity between the detection target object OB and the laser radar 900 are analyzed and calculated. The laser package structure 100 can adjust the divergence angle of the emitted laser spot along the fast axis direction and/or the slow axis direction as required.
Advantages of embodiments of the invention include, but are not limited to:
the laser chip is packaged, the exposed area of the laser chip in the air is reduced through the optical resin, so that the influence of the external environment is resisted, and the water vapor and pollution resisting capacity of the laser is enhanced;
the laser packaging structure can adjust the divergence angle of the emergent laser spot along the fast axis direction and/or the slow axis direction so as to meet the requirements of different applications;
laser instrument packaging structure's compact structure, integrated level are high, and laser instrument packaging structure can change the transmission laser beam direction, when taking into account limit transmission laser instrument luminance advantage, obtains the convenient to use of similar VCSEL (for example, a plurality of lasers can set up on same circuit board, realizes the complanation dress and transfers), has promoted laser radar's the detection performance and the assembly degree of difficulty, has improved production efficiency.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (19)
1. A laser package structure comprising:
a substrate on which an electrode is disposed;
a laser chip disposed on the substrate and electrically connected to the electrode so that power can be supplied through the electrode;
an encapsulation material disposed over the substrate and the laser chip to encapsulate the laser chip; and
the reflecting part is arranged on the part, opposite to the light emitting surface of the laser chip, of the packaging material, so that the laser emitted by the laser chip can be reflected by the reflecting part and emitted from the emitting surface of the packaging material, and the direction of a main ray of the laser emitted from the emitting surface of the packaging material is basically vertical to the normal direction of the light emitting surface of the laser chip.
2. The laser package structure of claim 1, wherein the laser chip is an edge emitting laser chip, a light emitting face of the laser chip having fast and slow axis directions; the laser packaging structure comprises a packaging material, a laser chip and a reflection part, wherein the packaging material is arranged on the laser chip, the reflection part is attached to a reflection film on the plane or the curved surface and used for reflecting laser emitted by the laser chip, and the direction of a principal ray of the laser emitted from the emitting surface of the packaging material is basically parallel to the fast axis direction of the light emitting surface of the laser chip.
3. The laser package structure according to claim 2, wherein a side of a portion of the encapsulation material opposite to a light emitting surface of the laser chip facing outside is a plane, and an included angle between the plane and the light emitting surface of the laser chip is 45 degrees; or the side, facing the outside, of the part of the packaging material opposite to the light emitting surface of the laser chip is a curved surface and is configured to adjust the divergence angle of the laser light from the laser chip in at least one direction.
4. The laser package structure according to claim 2, wherein the exit surface is a plane or a curved surface, and when the exit surface is a curved surface, the exit surface includes a cylindrical lens or a spherical lens configured to adjust a divergence angle of the laser light from the reflection portion in at least one direction.
5. The laser package structure of claim 4, wherein the exit surface comprises a cylindrical lens, and the cylindrical lens extends in a direction substantially parallel to a slow axis direction of the light emitting surface of the laser chip.
6. The laser package structure of any one of claims 1-5, wherein the electrodes comprise a second electrode disposed inside the substrate, a fourth electrode, and a first electrode and a third electrode disposed outside the substrate, wherein one of a positive electrode and a negative electrode of the laser chip is disposed on the second electrode by a chip-on-chip process, and the other is electrically connected to the fourth electrode by a wire; the second electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the third electrode.
7. The laser package structure of claim 6, wherein the substrate further comprises a first via and a second via, wherein the first electrode and the second electrode are opposite to each other across the first via, wherein the third electrode and the fourth electrode are opposite to each other across the second via, and wherein the first via and the second via are filled with a conductive material to conduct the first electrode and the second electrode and the third electrode and the fourth electrode.
8. The laser package structure of claim 7, wherein the encapsulation material is an optical resin, the material of the base is a ceramic, and the conductive material is copper.
9. The laser package structure according to any one of claims 2 to 5, comprising a plurality of the laser chips, the plurality of the laser chips being arranged at intervals along a slow axis direction of a light emitting surface, sharing a same reflecting portion and a same emitting surface, the light emitting surface of each of the laser chips corresponding to the reflecting portion.
10. A method of packaging a laser chip, comprising:
s101: providing a laser chip;
s102: providing a substrate, wherein an electrode is arranged on the substrate;
s103: mounting the laser chip on the substrate and electrically connected to the electrode;
s104: disposing an encapsulation material on the substrate and the laser chip to encapsulate the laser chip; and
s105: and arranging a reflection part on a part of the packaging material opposite to the light-emitting surface of the laser chip, so that the laser emitted by the laser chip can be reflected by the reflection part and emitted from the emitting surface of the packaging material, and the direction of a main ray of the laser emitted from the emitting surface of the packaging material is basically vertical to the normal direction of the light-emitting surface of the laser chip.
11. The packaging method according to claim 10, wherein the laser chip is an edge-emitting laser chip, a light emitting face of the laser chip having fast and slow axis directions; the reflection part is a reflection film,
the step S104 further includes: forming a flat or curved surface shape on a side of a portion of the encapsulating material facing the light emitting surface of the laser chip toward the outside by a mold;
the step S105 further includes: and attaching a reflecting film on the plane or the curved surface.
12. The packaging method of claim 11, the step S104 further comprising: forming a plane on one side, facing the outside, of a part, opposite to the light emitting surface of the laser chip, of the packaging material through a mold, wherein an included angle between the plane and the light emitting surface of the laser chip is set to be 45 degrees; or forming a curved surface on a side of a portion of the encapsulating material facing the light emitting surface of the laser chip toward the outside by a mold, the curved surface and the reflective film being configured to reflect the laser light from the laser chip and emit the laser light after adjusting a divergence angle of the laser light in at least one direction.
13. The packaging method of claim 11, further comprising:
s106: and forming the emergent surface into a plane or curved surface shape through a mold.
14. The packaging method of claim 13, wherein the step S106 further comprises: forming the exit surface into a shape of a cylindrical lens or a spherical lens by a mold, wherein the cylindrical lens or the spherical lens is configured to adjust a divergence angle of the laser light from the reflection part in at least one direction.
15. The packaging method of claim 14, wherein the step S106 further comprises: and forming the emergent surface into a cylindrical lens shape through a mold, wherein the extension direction of the cylindrical lens is basically parallel to the slow axis direction of the luminous surface of the laser chip.
16. The packaging method according to any one of claims 10 to 15, further comprising providing a second electrode, a fourth electrode inside the substrate, and providing a first electrode and a third electrode outside the substrate, wherein one of a positive electrode and a negative electrode of the laser chip is provided on the second electrode by a chip-on-chip process, and the other is electrically connected to the fourth electrode by a wire; the second electrode is electrically connected to the first electrode, the fourth electrode is electrically connected to the third electrode, the substrate further includes a first through hole and a second through hole, wherein the first electrode and the second electrode are opposite to each other with the first through hole interposed therebetween, the third electrode and the fourth electrode are opposite to each other with the second through hole interposed therebetween, the first through hole and the second through hole are filled with a conductive material, the first electrode and the second electrode are electrically connected, and the third electrode and the fourth electrode are electrically connected.
17. The packaging method according to claim 16, wherein the packaging material is an optical resin, the material of the base is ceramic, and the conductive material is copper.
18. The packaging method according to any one of claims 11 to 15, wherein the step S101 includes: providing a plurality of said laser chips;
the step S103 includes: arranging the laser chips at intervals along the slow axis direction of the light emitting surface, and installing the laser chips on the substrate;
the step S104 includes: and forming an integral part for attaching a reflecting film and an integral emergent surface on the packaging material through a mould, so that the luminous surface of each laser chip is opposite to the reflecting part.
19. A lidar comprising:
an emission unit comprising the laser package of any one of claims 1-9, configured to emit detection laser light for detecting a target;
the receiving unit comprises a photoelectric detector and can receive the echo of the detection laser reflected on the target object and convert the echo into an electric signal;
and the processing unit is connected with the receiving unit to receive the electric signal and calculate the distance and/or the reflectivity of the target object according to the electric signal.
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| CN202011515475.6A CN114649739A (en) | 2020-12-21 | 2020-12-21 | Laser packaging structure, laser chip packaging method and laser radar |
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| CN210379765U (en) * | 2019-10-10 | 2020-04-21 | 深圳市彩立德照明光电科技有限公司 | Semiconductor laser packaging structure |
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| US5999552A (en) * | 1995-07-19 | 1999-12-07 | Siemens Aktiengesellschaft | Radiation emitter component |
| US20190252852A1 (en) * | 2016-10-28 | 2019-08-15 | Osram Opto Semiconductors Gmbh | Laser component and method of producing a laser component |
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