CN114647288A - 8K display card assembly with high heat dissipation performance and electronic equipment - Google Patents
8K display card assembly with high heat dissipation performance and electronic equipment Download PDFInfo
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- CN114647288A CN114647288A CN202210270483.1A CN202210270483A CN114647288A CN 114647288 A CN114647288 A CN 114647288A CN 202210270483 A CN202210270483 A CN 202210270483A CN 114647288 A CN114647288 A CN 114647288A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 88
- 238000003780 insertion Methods 0.000 claims abstract description 39
- 230000037431 insertion Effects 0.000 claims abstract description 39
- 238000001816 cooling Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 14
- 238000009434 installation Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 12
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an 8K display card assembly with high heat dissipation performance and electronic equipment. The mounting seat is provided with an inserting groove, and the bottom wall of the inserting groove is provided with a conductive column; the 8K display card is inserted into the insertion groove in a matched mode and is electrically connected with the conductive column, and a gap is formed between the conductive column and the bottom wall of the insertion groove; the heat radiation structure comprises a first heat radiation assembly and a second heat radiation assembly, the first heat radiation assembly comprises two heat conduction plates, the upper end of the mounting seat is arranged on the two heat conduction plates, the two heat conduction plates can be close to each other and the upper end of the 8K display card can be clamped and fixed, the second heat radiation assembly comprises a plurality of heat radiation fans, the mounting seat is provided with a plurality of air inlet channels communicated with the bottom wall of the insertion groove, each heat radiation fan is arranged in one air inlet channel, and the side walls of the two opposite insertion grooves are concavely provided with a plurality of air outlet channels communicated with the outside. According to the technical scheme, the installation stability of the 8K display card can be improved, so that the 8K display card has high heat dissipation performance and can be normally used.
Description
Technical Field
The invention relates to the technical field of display cards, in particular to an 8K display card assembly with high heat dissipation performance and electronic equipment applying the 8K display card assembly with high heat dissipation performance.
Background
Video cards (Video cards, Display cards, Graphics cards, Video adapters) are one of the components of the pc base, convert Display information required by a computer system to drive a Display, provide progressive or interlaced signals to the Display, and control the correct Display of the Display, and are important components for connecting the Display and the pc motherboard. Wherein, the display card generates heat easily at the during operation, consequently in order to guarantee that the display card can comparatively normal work, can dispel the heat to it through heat radiation structure among the correlation technique. However, the heat dissipation effect of the heat dissipation structure is relatively poor, which affects the normal use of the display card.
Disclosure of Invention
The invention mainly aims to provide an 8K display card assembly with high heat dissipation performance, and aims to improve the scattering effect of an 8K display card, so that the 8K display card assembly has high heat dissipation performance and ensures normal use.
In order to achieve the above object, the present invention provides an 8K graphic card assembly with high heat dissipation performance, comprising:
the upper end of the mounting seat is provided with an insertion groove, and the bottom wall of the insertion groove is convexly provided with a conductive column;
one end of the 8K display card is inserted into the insertion groove in a matched mode, and is electrically connected to the upper end of the conductive column, and a gap is formed between the upper end of the conductive column and the bottom wall of the insertion groove; and
the heat dissipation structure comprises a first heat dissipation assembly and a second heat dissipation assembly, the first heat dissipation assembly comprises two heat-conducting plates, the two heat-conducting plates are arranged at the upper end of the mounting seat and can be close to each other and clamped and fixed at the upper end of the 8K display card, the second heat dissipation assembly comprises a plurality of heat dissipation fans, the mounting seat is provided with a plurality of air inlet channels communicated with the bottom wall of the insertion groove, each heat dissipation fan is arranged in one air inlet channel, and two opposite groove side walls of the insertion groove are also sunken to form a plurality of air outlet channels communicated with the outside.
Optionally, the heat-conducting plate is the rectangular plate structure, just the length direction of heat-conducting plate with the length direction of 8K display card is the same, each the heat-conducting plate deviates from the surface of 8K display card is equipped with a plurality of radiating fin, and is a plurality of radiating fin follows the length direction of heat-conducting plate sets up at interval in proper order, and with the heat-conducting plate forms a body structure.
Optionally, the heat-conducting plates are slidably arranged on the mounting seat, and each heat-conducting plate is provided with an elastic part between the mounting seats so as to drive the two heat-conducting plates to be close to each other.
Optionally, each the heat-conducting plate deviates from the surface of 8K display card still is equipped with the slip post, the upper end of mount pad is equipped with two backup pads, each the backup pad corresponds one the heat-conducting plate sets up, each the slip post on the heat-conducting plate is kept away from the equal slidable ground of one end of heat-conducting plate passes and corresponds with this heat-conducting plate the backup pad, each the elastic component cover is located one on the slip post to elasticity butt in one the heat-conducting plate with one the backup pad.
Optionally, each the heat-conducting plate deviates from the surface of 8K display card is equipped with two the slip post, two the slip post is located a plurality ofly respectively radiating fin's the ascending both ends of arranging in proper order, two the slip post passes be connected with the spliced pole between the one end of backup pad, just the spliced pole with be formed with the clearance between the backup pad.
Optionally, the air intake channel includes:
the two first channel sections are oppositely arranged, and the ends, which are far away from each other, of the two first channel sections penetrate through the two opposite side wall surfaces of the mounting seat; and
the second channel section is vertically arranged, the lower end of the second channel section is communicated with the two second channel sections, the upper end of the second channel section is communicated with the bottom wall of the insertion groove, and the cooling fan is arranged in the second channel section.
Optionally, the two first channel segments are both arranged obliquely upwards, so that the upper ends of the two first channel segments are communicated with the second channel segment.
Optionally, each pair of the second channel segments on the two opposite groove side walls of the insertion groove is provided with two air outlet channels, and the second channel segments are located between the two corresponding air outlet channels.
Optionally, a contact plate is convexly arranged on the side wall of the lower end of the mounting seat, and a mounting hole is formed in the contact plate.
The present invention also provides an electronic device including an 8K graphics card assembly having high heat dissipation, the 8K graphics card assembly having high heat dissipation including:
the upper end of the mounting seat is provided with an insertion groove, and the bottom wall of the insertion groove is convexly provided with a conductive column;
one end of the 8K display card is inserted into the insertion groove in a matched mode, and is electrically connected to the upper end of the conductive column, and a gap is formed between the upper end of the conductive column and the bottom wall of the insertion groove; and
the heat dissipation structure comprises a first heat dissipation assembly and a second heat dissipation assembly, the first heat dissipation assembly comprises two heat-conducting plates, the two heat-conducting plates are arranged at the upper end of the mounting seat and can be close to each other and clamped and fixed at the upper end of the 8K display card, the second heat dissipation assembly comprises a plurality of heat dissipation fans, the mounting seat is provided with a plurality of air inlet channels communicated with the bottom wall of the insertion groove, each heat dissipation fan is arranged in one air inlet channel, and two opposite groove side walls of the insertion groove are also sunken to form a plurality of air outlet channels communicated with the outside.
According to the technical scheme, the 8K display card assembly can be connected to the mainboard through the mounting seat, and the 8K display card can be inserted into the insertion groove to perform preliminary limiting and fixing. Afterwards can carry out the centre gripping fixedly to the 8K display card of protrusion in the inserting groove through two heat-conducting plates among the heat radiation structure, so make the lower extreme of this 8K display card carry on spacing fixedly through the inserting groove, and the upper end can carry on spacing fixedly through two heat-conducting plates, and then make the 8K display card can carry out stable installation. Namely, the 8K display card has high stability, thereby being beneficial to ensuring the normal use of the 8K display card. And, because two heat-conducting plates of centre gripping in 8K display card upper end form first radiator unit to have better heat conductivility and can carry out timely the removal to the heat that 8K display card produced at the during operation. Simultaneously, heat radiation structure is still including the second radiator unit who is formed by a plurality of radiator fan, can order about the external air current through these a plurality of radiator fan and get into from inlet air channel, later in entering into the inserting groove to and flow through the in-process that the air-out passageway discharged to the external world and 8K display card carry out the heat exchange and take away 8 display cards produced heat at the during operation. Therefore, the 8K display card assembly in the scheme effectively dissipates the heat of the upper end and the lower end of the 8K display card through the first heat dissipation assembly and the second heat dissipation assembly in the heat dissipation structure respectively, in other words, all areas of the 8K display card can be dissipated simultaneously, so that the scattering effect of the 8K display card is greatly improved, the 8K display card assembly has high heat dissipation performance, and the 8K display card can be further ensured to be normally used.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of an 8K graphics card assembly with high heat dissipation performance according to the present invention;
FIG. 2 is an exploded view of the 8K graphics card assembly of FIG. 1 with high heat dissipation;
fig. 3 is a partial structural view of the 8K graphics card assembly with high heat dissipation in fig. 1;
FIG. 4 is a schematic structural diagram of a mounting seat of the 8K graphics card assembly with high heat dissipation performance in FIG. 1;
FIG. 5 is a schematic structural diagram of another view angle of the mounting seat of the 8K graphics card assembly with high heat dissipation performance in FIG. 1;
fig. 6 is a schematic cross-sectional view of the mounting base of the 8K graphics card assembly with high heat dissipation in fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
30 | |
| 11 | Plug-in |
50 | |
| 12 | |
51 | First |
| 13 | |
511 | |
| 131 | |
512 | Radiating |
| 133 | |
513 | |
| 14 | |
514 | |
| 15 | |
515 | Connecting |
| 16 | |
53 | Second |
| 17 | |
531 | Heat radiation fan |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides an 8K display card assembly with high heat dissipation performance.
Referring to fig. 1 to fig. 6, in an embodiment of the invention, the 8K graphics card assembly with high heat dissipation performance includes a mounting base 10, an 8K graphics card 30 and a heat dissipation structure 50. The upper end of the mounting seat 10 is provided with an inserting groove 11, and the bottom wall of the inserting groove 11 is convexly provided with a conductive column 12; one end of the 8K display card 30 is inserted into the insertion groove 11 in an adaptive manner, and is electrically connected to the upper end of the conductive column 12, and a gap is formed between the upper end of the conductive column and the bottom wall of the insertion groove 11; the heat dissipation structure 50 includes a first heat dissipation assembly 51 and a second heat dissipation assembly 53, the first heat dissipation assembly 51 includes two heat-conducting plates 511, the upper end of mount pad 10 is all located to two heat-conducting plates 511, and can be close to each other and the upper end of the fixed 8K display card 30 of centre gripping, the second heat dissipation assembly 53 includes a plurality of radiator fan 531, the mount pad 10 is equipped with a plurality of inlet air channel 13 that communicate in the tank bottom wall of inserting groove 11, each radiator fan 531 is located in an inlet air channel 13, two relative tank side walls of inserting groove 11 still all sunken being formed with many external air outlet channel 14 of intercommunication.
In an embodiment of the present invention, the mounting base 10 may be used to connect to a motherboard, and meanwhile, a mounting position is provided, so that the mounting base 10 is provided with a plug-in slot 11 for mounting and fixing the 8K graphics card 30, thereby implementing the spaced mounting and fixing of the 8K graphics card 30 on the motherboard. In order to realize the electrical connection between the 8-card display card and the motherboard, the bottom wall of the insertion slot 11 is provided with a conductive column 12 in a protruding manner, the lower end of the conductive column 12 is electrically connected to the motherboard, and the upper end of the conductive column can be electrically connected to the 8K display card 30 inserted in the insertion slot 11. The conductive column 12 may have a conductive metal column, and of course, the conductive column 12 may also have a pogopin pogo pin structure. The 8K graphics card 30 can be used to convert and drive the display information required by the computer system, and provide line scan signals to the display to control the display correctly. The working principle and the specific structure of the 8K graphics card 30 are the prior art, and reference may be made to the 8K graphics card 30 in the prior art. The first heat dissipation assembly 51 of the heat dissipation structure 50 can be used for clamping and limiting the upper end of the 8K graphics card 30 inserted in the mounting base 10 through the two heat conduction plates 511, and can also absorb and remove heat generated at the upper end of the 8K graphics card 30 during working. The heat conducting plate 511 may be a copper plate with high heat conducting performance, or may be another metal material with high heat conducting performance. The plurality of heat dissipation fans in the second heat dissipation assembly 53 may be used to provide power to drive external air flow into the insertion groove 11 through the air inlet channel 13, and meanwhile, because a gap exists between the bottom wall of the insertion groove 11 and the lower end of the 8K graphics card 30, the air flow entering the insertion groove 11 may further enter the air outlet channel 14, and may exchange heat with the 8K graphics card 30 inserted in the insertion groove 11 in the process of flowing through the air outlet channel 14, thereby absorbing and removing heat generated at the lower end of the 8K graphics card 30 during operation.
According to the technical scheme, the 8K display card assembly can be connected to the mainboard through the mounting seat 10, and the 8K display card 30 can be inserted into the insertion groove 11 to be initially limited and fixed. Afterwards, the 8K display card 30 protruding out of the insertion groove 11 can be clamped and fixed through the two heat conduction plates 511 in the heat dissipation structure 50, so that the lower end of the 8K display card 30 can be limited and fixed through the insertion groove 11, the upper end can be limited and fixed through the two heat conduction plates 511, and the 8K display card 30 can be stably installed. That is, the 8K graphic card 30 has high stability, thereby being beneficial to ensuring that the 8K graphic card 30 can be normally used. In addition, the two heat conducting plates 511 clamped at the upper end of the 8K graphics card 30 form the first heat dissipation assembly 51, and have better heat conducting performance, so that heat generated by the 8K graphics card 30 during operation can be timely conducted away. Meanwhile, the heat dissipation structure 50 further includes a second heat dissipation assembly 53 formed by a plurality of heat dissipation fans 531, and external air flow can be driven by the plurality of heat dissipation fans 531 to enter from the air inlet channel 13, and then enter into the insertion groove 11, and exchange heat with the 8K graphics card 30 in the process of flowing through the air outlet channel 14 and being discharged to the outside, so as to take away heat generated by the 8K graphics card during operation. Therefore, the 8K graphics card assembly in this embodiment respectively performs effective heat dissipation on the upper end and the lower end of the 8K graphics card 30 through the first heat dissipation assembly 51 and the second heat dissipation assembly 53 in the heat dissipation structure 50, in other words, can simultaneously perform heat dissipation on each region of the 8K graphics card 30, thereby greatly improving the scattering effect on the 8K graphics card 30, and making it have high heat dissipation performance to further ensure that the 8K graphics card 30 can be normally used.
Referring to fig. 1 to fig. 3, in an embodiment of the present invention, the heat conducting plate 511 is a rectangular plate structure, a length direction of the heat conducting plate 511 is the same as a length direction of the 8K display card 30, a plurality of heat dissipating fins 512 are disposed on a surface of each heat conducting plate 511 facing away from the 8K display card 30, and the plurality of heat dissipating fins 512 are sequentially disposed at intervals along the length direction of the heat conducting plate 511 and form an integral structure with the heat conducting plate 511.
In this embodiment, the heat conducting plate 511 is configured as a rectangular plate structure, so that the shape of the heat conducting plate can be adapted to the 8K graphics card 30, and then the heat conducting plate can have a larger contact area with the 8K graphics card 30 to improve the clamping effect and the heat dissipation effect on the 8K graphics card 30. Further, it is so arranged that a plurality of heat radiating fins 512 may also be provided on the surface of the heat conductive plate 511 facing away from the 8K display card 30. At this time, the plurality of heat dissipation fins 512 can increase the contact area between the heat conduction plate 511 and the air to improve the heat exchange effect, thereby further improving the heat conduction effect to the 8K graphic card 30. The plurality of heat dissipating fins 512 and the heat conducting plate 511 are formed as an integral structure, so that the heat dissipating fins and the heat conducting plate 511 can be manufactured by integral molding, thereby improving the manufacturing efficiency of the heat conducting plate 511. Meanwhile, the strength of the connection part of the heat conducting plate 511 and the heat conducting plate can be enhanced by the arrangement, so that the overall strength of the heat conducting plate 511 is improved, and the service life of the heat conducting plate is ensured.
Referring to fig. 3, in an embodiment of the present invention, two heat-conducting plates 511 are slidably disposed on the mounting base 10, and an elastic member 513 is disposed between each heat-conducting plate 511 and the mounting base 10 to drive the two heat-conducting plates 511 to approach each other.
In this embodiment, the heat conducting plate 511 is slidably disposed on the mounting base 10, and the elastic member 513 provides power to clamp the heat conducting plate 511 on the 8K display card 30. Thus, the heat conducting plate 511 can be continuously kept in close contact with the 8K display card 30 under the driving of the elastic member 513, thereby being beneficial to ensuring the stability of the heat conducting plate 511 in clamping the 8K display card 30. In addition, such arrangement makes it more convenient to take off the 8K graphic card 30 from the mounting seat 10, directly overcomes the elastic force of the elastic member 513 to drive the two heat conducting plates 511 not to abut against the 8K graphic card 30, and thus the 8K graphic card 30 can be pulled out from the insertion slot 11 with relatively small force. Wherein, this elastic component 513 can be the spring, and the spring has better elasticity, can guarantee the drive dynamics to heat-conducting plate 511, and then guarantees the stability of heat-conducting plate 511 to the centre gripping of 8K display card 30. Meanwhile, the spring can be directly purchased in the market easily, so that the acquisition convenience is improved. In addition, the present invention is not limited to this, and in another embodiment, the two heat conduction plates 511 may be fixed to the mounting base 10 by screws and may be in a state of being abutted against the 8K graphics card 30 after being fixed.
Referring to fig. 3, in an embodiment of the present invention, a sliding column 514 is further disposed on a surface of each heat conducting plate 511 facing away from the 8K display card 30, two supporting plates 15 are disposed at an upper end of the mounting base 10, each supporting plate 15 is disposed corresponding to one heat conducting plate 511, one end of each sliding column 514 on each heat conducting plate 511, which is away from the heat conducting plate 511, slidably penetrates through the supporting plate 15 corresponding to the heat conducting plate 511, and each elastic member 513 is sleeved on one sliding column 514 and elastically abuts against one heat conducting plate 511 and one supporting plate 15.
In the present embodiment, the heat conductive plate 511 is slidably coupled to the support plate 15 by the sliding post 514, so that the sliding coupling structure between the heat conductive plate 511 and the mounting seat 10 can be simplified, thereby facilitating the convenience of processing and molding thereof. Meanwhile, the sliding fit between the heat conducting plate and the elastic piece 513 can also guide the driving process of the heat conducting plate 511 by the elastic piece 513, so that the heat conducting plate 511 can be accurately abutted against the 8K display card 30 under the driving of the elastic piece 513. Moreover, the elastic element 513 can be directly sleeved on the sliding column 514, so that the elastic element 513 can be installed, and convenience in installing the elastic element 513 is improved. In addition, the supporting plate 15 and the sliding column 514 are arranged so that a gap exists between the lower surface of the heat conducting plate 511 and the surface of the mounting seat 10, and further, the air outlet channel 14 on the side wall of the slot 11 is not blocked, thereby being beneficial to ensuring the air volume passing through the air outlet channel 14 and improving the heat dissipation effect of the 8K graphics card 30.
Referring to fig. 3, in an embodiment of the invention, two sliding columns 514 are disposed on a surface of each heat conducting plate 511 facing away from the 8K graphics card 30, the two sliding columns 514 are respectively located at two ends of the plurality of heat dissipation fins 512 in the sequential arrangement direction, a connecting column 515 is connected between ends of the two sliding columns 514 penetrating through the supporting plate 15, and a gap is formed between the connecting column 515 and the supporting plate 15.
In this embodiment, the two sliding columns 514 are provided to improve the stability of the sliding connection of the heat conducting plate 511 on the mounting base 10, and when the heat conducting plate 511 is provided with a plurality of heat dissipating fins 512 away from the 8K display card 30, the heat conducting plate 511 is conveniently and symmetrically arranged to further improve the convenience of the processing and forming of the heat conducting plate 511. The connecting column 515 can connect two ends of the two sliding columns 514, thereby being beneficial to improving the overall strength of the part of the structure. Meanwhile, a gap is formed between the connecting column 515 and the supporting plate 15, so that the connecting column 515 is also formed as a holding part, and a person can hold the connecting column to pull the sliding column 514 and the heat conducting plate 511 to be away from the 8K display card 30, thereby conveniently removing the 8K display card 30 from the mounting seat 10.
Referring to fig. 5 and fig. 6, in an embodiment of the present invention, the air intake channel 13 includes two first channel segments 131 and a second channel segment 133, the two first channel segments 131 are disposed oppositely, and ends of the two first channel segments 131 facing away from each other penetrate through two opposite side wall surfaces of the mounting base 10; the second channel segments 133 are vertically arranged, the lower ends of the second channel segments 133 are communicated with the two second channel segments 133, the upper ends of the second channel segments 133 are communicated with the bottom wall of the insertion groove 11, and the heat dissipation fan 531 is arranged in the second channel segments 133.
In this embodiment, the air inlet channel 13 includes two first channel segments 131, and the heat dissipating fan 531 is disposed at the second channel segment 133, so that the heat dissipating fan 531 can uniformly and largely intake air on two opposite sides of the mounting base 10 through the two first channel segments 131 when being started, thereby being beneficial to greatly improving the subsequent heat exchange effect on the 8K graphics card 30.
Referring to fig. 5 and fig. 6, in an embodiment of the present invention, the two first channel segments 131 are disposed obliquely upward, so that the upper ends of the two first channel segments 131 are communicated with the second channel segment 133.
In the present embodiment, both the first channel segments 131 are disposed obliquely upward, so that the air flow may gradually go upward under the guidance of the shape of the obliquely-shaped first channel segment 131 after entering from the lower end of the first channel segment 131. At this time, the possibility of convection impact occurring at the upper end of the air flow of the two first channel sections 131 can be reduced, so as to enter the second channel more smoothly, thereby being beneficial to ensuring the air inlet effect of the air inlet channel 13. When the two first channel segments 131 are inclined upward, the first channel segments 131 may be linear, or arc-shaped, and then form an inclined extending structure.
Referring to fig. 4 to fig. 6, in an embodiment of the present invention, each pair of the second channel segments 133 on the two opposite slot sidewalls of the inserting slot 11 is provided with two air outlet channels 14, and the second channel segments 133 are located between the two air outlet channels 14.
In this embodiment, the second channel segment 133 is located between two corresponding air outlet channels 14, so that the air outlet can be performed through two corresponding air outlet channels 14 near a second channel region, and the heat generated by the 8K graphics card 30 at the lower end of the work can be timely taken away by ensuring the air outlet effect. Of course, it should be noted that the present application is not limited thereto, and in other embodiments, when the cross-section setting direction of the air outlet channel 14 is larger, one second channel segment 133 is disposed corresponding to one air outlet channel 14.
In an embodiment of the present invention, an abutting plate 16 is convexly disposed on a side wall of a lower end of the mounting seat 10, and a mounting hole 17 is opened on the abutting plate 16.
In the embodiment, the abutting plate 16 can abut against the main board, so that the contact area between the main board and the main board is increased, and the stability of installation is improved. Meanwhile, a mounting position can be better provided, so that the mounting seat 10 can be quickly and stably fixed on the main board by penetrating a screw subsequently.
The present invention further provides an electronic device, where the electronic device includes an 8K graphics card assembly with high heat dissipation, and the specific structure of the 8K graphics card assembly with high heat dissipation refers to the above embodiments, and since the electronic device adopts all technical solutions of all the above embodiments, the electronic device at least has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated here.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, which are directly or indirectly applied to the present invention, are included in the scope of the present invention.
Claims (10)
1. An 8K graphics card assembly with high heat dissipation, comprising:
the upper end of the mounting seat is provided with an inserting groove, and the bottom wall of the inserting groove is convexly provided with a conductive column;
one end of the 8K display card is inserted into the insertion groove in a matched mode, and is electrically connected to the upper end of the conductive column, and a gap is formed between the upper end of the conductive column and the bottom wall of the insertion groove; and
the heat dissipation structure comprises a first heat dissipation assembly and a second heat dissipation assembly, the first heat dissipation assembly comprises two heat-conducting plates which are arranged at the upper end of the mounting seat and can be close to each other and clamped and fixed at the upper end of the 8K display card, the second heat dissipation assembly comprises a plurality of heat dissipation fans, the mounting seat is provided with a plurality of air inlet channels communicated with the bottom wall of the insertion groove, each heat dissipation fan is arranged in the air inlet channel, and two opposite groove side walls of the insertion groove are also sunken to form a plurality of air outlet channels communicated with the outside.
2. The 8K graphic card assembly with high heat dissipation as claimed in claim 1, wherein the heat conductive plate has a rectangular plate structure, and the length direction of the heat conductive plate is the same as the length direction of the 8K graphic card, and a plurality of heat dissipation fins are provided on each of the surfaces of the heat conductive plates facing away from the 8K graphic card, and the plurality of heat dissipation fins are sequentially spaced along the length direction of the heat conductive plate and are integrally formed with the heat conductive plate.
3. The 8K graphic card assembly with high heat dissipation performance of claim 2, wherein two heat-conducting plates are slidably disposed on the mounting seat, and an elastic member is disposed between each heat-conducting plate and the mounting seat to urge the two heat-conducting plates to approach each other.
4. The 8K graphic card assembly with high heat dissipation as claimed in claim 3, wherein each of the heat-conducting plates is further provided with a sliding column at a surface thereof facing away from the 8K graphic card, two supporting plates are provided at an upper end of the mounting seat, each of the supporting plates is provided corresponding to one of the heat-conducting plates, an end of each of the sliding columns of the heat-conducting plates, which is away from the heat-conducting plate, slidably penetrates the supporting plate corresponding to the heat-conducting plate, and each of the elastic members is sleeved on one of the sliding columns and elastically abuts against one of the heat-conducting plates and one of the supporting plates.
5. The 8K graphic card assembly with high heat dissipation as claimed in claim 4, wherein two sliding columns are disposed on a surface of each heat conductive plate facing away from the 8K graphic card, the two sliding columns are respectively disposed at two ends of the heat dissipation fins in the sequential arrangement direction, a connection column is connected between the two sliding columns passing through one end of the support plate, and a gap is formed between the connection column and the support plate.
6. The 8K graphic card assembly with high heat dissipation of any one of claims 1 to 5, wherein the air inlet channel comprises:
the two first channel sections are oppositely arranged, and the ends, which are far away from each other, of the two first channel sections penetrate through the two opposite side wall surfaces of the mounting seat; and
the second channel section is vertically arranged, the lower end of the second channel section is communicated with the two second channel sections, the upper end of the second channel section is communicated with the bottom wall of the insertion groove, and the cooling fan is arranged in the second channel section.
7. The 8K graphic card assembly with high heat dissipation performance according to claim 6, wherein the two first channel segments are each disposed to be inclined upward such that upper ends of the two first channel segments communicate with the second channel segment.
8. The 8K graphic card assembly with high heat dissipation performance of claim 6, wherein two air outlet channels are disposed on each corresponding second channel segment on two opposite slot sidewalls of the insertion slot, and the second channel segment is located between the two corresponding air outlet channels.
9. The 8K graphics card assembly with high heat dissipation performance as claimed in any one of claims 1 to 5, wherein a contact plate is protruded from a sidewall of a lower end of the mounting seat, and the contact plate is provided with a mounting hole.
10. An electronic device, characterized by comprising the 8K graphics card assembly with high heat dissipation of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210270483.1A CN114647288A (en) | 2022-03-18 | 2022-03-18 | 8K display card assembly with high heat dissipation performance and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210270483.1A CN114647288A (en) | 2022-03-18 | 2022-03-18 | 8K display card assembly with high heat dissipation performance and electronic equipment |
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| Publication Number | Publication Date |
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| CN114647288A true CN114647288A (en) | 2022-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210270483.1A Pending CN114647288A (en) | 2022-03-18 | 2022-03-18 | 8K display card assembly with high heat dissipation performance and electronic equipment |
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| CN (1) | CN114647288A (en) |
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