CN114646660A - Temperature self-adaptive pulsating heat pipe experimental device with variable liquid filling rate, adjusting method and testing method - Google Patents
Temperature self-adaptive pulsating heat pipe experimental device with variable liquid filling rate, adjusting method and testing method Download PDFInfo
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- 238000001704 evaporation Methods 0.000 claims abstract description 30
- 230000008020 evaporation Effects 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims description 40
- 238000005057 refrigeration Methods 0.000 claims description 31
- 238000009833 condensation Methods 0.000 claims description 23
- 230000005494 condensation Effects 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000002474 experimental method Methods 0.000 claims description 14
- 230000008859 change Effects 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
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- 230000008569 process Effects 0.000 description 7
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Abstract
The invention provides a variable-liquid-filling-rate temperature self-adaptive pulsating heat pipe experimental device, an adjusting method and a testing method. Wherein, the pulsating heat pipe is connected with a tee joint, three check valves and two liquid pipelines. The pulsating heat pipe is connected with the liquid pool through a liquid pipeline. The temperature of the liquid pool is controlled to be connected with the pulsating heat pipe, so that the working medium can be accurately filled and discharged for many times, and the liquid filling rate is adjusted. Meanwhile, the pulsating heat pipe externally connected with the liquid pool is realized by utilizing the device, wherein the temperature of the liquid pool and the temperature of the evaporation section can realize temperature self-adaptation, so that the equivalent heat conductivity coefficient is higher and the performance of the pulsating heat pipe is better.
Description
Technical Field
The invention relates to the technical field of pulsating heat pipe research, in particular to a variable-liquid-filling-rate temperature self-adaptive pulsating heat pipe experimental device, an adjusting method and a testing method.
Background
The pulsating heat pipe (OHP) is a novel and efficient heat transfer element which is provided by Akachi in the early 90 s of the 20 th century and can be used under the conditions of tiny space and high heat flow density. The pulsating heat pipe is composed of a bent capillary tube, and a proper amount of working fluid is filled into the tube after the tube is vacuumized. When the working device works, working media absorb heat to expand and boost pressure in the evaporation section, gas-liquid phase change occurs, the air plug flows to the low-temperature condensation section, is cooled, contracted and broken, is liquefied into a liquid plug under the action of gravity, and flows back to the high-temperature evaporation section. Because of the pressure difference between the two ends and the unbalanced pressure between the adjacent pipes, the working medium oscillates between the evaporation section and the condensation section, thereby realizing the heat transfer. Pulsating heat pipes are considered to be a promising and promising heat transfer element in heat dissipation solutions for high heat flux density in small spaces.
The factors influencing the heat transfer performance of the pulsating heat pipe are more, and other factors are required to be ensured to be the same in the process of researching the influence of factors such as liquid filling rate on the performance of the pulsating heat pipe, but in the performance research, only single liquid filling can be realized for each pulsating heat pipe in the experimental process of each group, and the research on the influence of a certain influence factor on the heat transfer performance of the pulsating heat pipe usually requires a plurality of pulsating heat pipes to be manufactured, but because the plurality of pulsating heat pipes are different, the heat transfer performance is caused to have errors, so that the cost is saved, the accuracy of the test is ensured, and the multiple liquid filling rate adjustment on one pulsating heat pipe is required to be realized.
In the experiment, the pulsating heat pipe is easy to start under low liquid filling rate but is easy to dry due to less working medium in the pipe, and under high liquid filling rate, the existing pulsating heat pipe liquid filling device cannot change the liquid filling rate for many times in the experiment process due to the limitation that more working medium in the pipe is difficult to dry but the pulsation resistance is large, so that the liquid filling rate in the pipe can be changed in the experiment by constructing the experiment device which completes the change of the liquid filling rate by forming the internal and external pressure difference through heating and condensation. The pulsating heat pipe externally connected with the liquid pool is realized under the device, because the pressure in the pulsating heat pipe is approximately the saturated vapor pressure of the evaporation section and is adjusted by the saturated vapor pressure in the liquid pool connected with the pulsating heat pipe, the temperature of the evaporation section in the experiment is self-adaptive to the temperature of the liquid pool. Under the condition that the input thermal power is continuously increased, the equivalent thermal conductivity of the pulsating heat pipe is effectively improved, the variable equivalent thermal conductivity is realized, the performance of the pulsating heat pipe is improved, and the heat transfer is enhanced.
Therefore, the invention discloses a temperature self-adaptive pulsating heat pipe experimental device with variable liquid filling rate, which is the basis for realizing effective application of the pulsating heat pipe.
Disclosure of Invention
According to the technical problem that the conventional pulsating heat pipe liquid filling device cannot adjust the liquid filling rate for multiple times in the experimental process, the temperature self-adaptive pulsating heat pipe experimental device with the variable liquid filling rate, the adjusting method and the testing method are provided. The invention mainly utilizes the temperature self-adaptive pulsating heat pipe experiment device with variable liquid filling rate to realize multiple liquid filling rate adjustment in the experiment, realizes that the liquid filling rate is increased or reduced in the experiment process on the premise of not changing the type of the working medium, and solves the problem of limitation under the conditions of starting and stable operation of the pulsating heat pipe. The temperature of the liquid pool is controlled to be connected with the pulsating heat pipe, so that the working medium can be accurately filled and discharged for many times, and the liquid filling rate is adjusted; meanwhile, the pulsating heat pipe externally connected with the liquid pool is realized by utilizing the device, and the liquid pool temperature and the evaporation section temperature can realize temperature self-adaptation, so that the equivalent heat conductivity coefficient is higher and the performance of the pulsating heat pipe is better.
The technical means adopted by the invention are as follows:
a variable-filling-rate temperature-adaptive pulsating heat pipe experimental device comprises: the device comprises a liquid charging pipe, a pulsating heat pipe, a liquid pool, a semiconductor refrigerating sheet power supply, a tee joint, three check valves and two liquid pipelines, wherein the three check valves are a first check valve, a second check valve and a third check valve respectively, and the two liquid pipelines are a first liquid pipeline and a second liquid pipeline respectively;
the tee joint is provided with three interfaces which are respectively a first interface, a second interface and a third interface; one side of the first liquid pipeline is connected with the first interface, and the other side of the first liquid pipeline is communicated with the top of the pulsating heat pipe; one side of the second liquid pipeline is connected with the second interface, and the other side of the second liquid pipeline is connected with the liquid pool; one side of the liquid charging pipe is connected with the third interface, and the other side of the liquid charging pipe is connected with an external liquid charging device or an external vacuum pumping device; the first check valve, the second check valve and the third check valve are respectively arranged on the first liquid pipeline, the second liquid pipeline and the liquid charging pipe at positions close to the tee joint;
the liquid pool is connected with the semiconductor refrigeration piece, the semiconductor refrigeration piece is connected with the semiconductor refrigeration piece power supply, the semiconductor refrigeration piece is used for heating or refrigerating the liquid pool, and the semiconductor refrigeration piece power supply is used for improving input power of the semiconductor refrigeration piece to realize heating or refrigerating.
Furthermore, scales are engraved on the tank body of the liquid tank and used for accurately adjusting the liquid filling rate of the pulsating heat pipe.
Furthermore, heat-conducting silicone grease is smeared on the semiconductor refrigerating sheet and is attached to the back of the liquid pool.
Furthermore, the connecting part between the pulsating heat pipe and the first liquid pipeline is sealed; the tee joint is sealed with the connecting parts among the first liquid pipeline, the second liquid pipeline and the liquid filling pipe; and the connecting part between the second liquid pipeline and the liquid pool is sealed.
The invention also provides an adjusting method of the temperature self-adaptive pulsating heat pipe experimental device with variable liquid filling rate, which comprises the following steps:
s1, carrying out first liquid filling by using a temperature self-adaptive pulsating heat pipe experimental device with a variable liquid filling rate;
s2, after the first liquid filling is finished, the liquid filling rate is adjusted for many times according to the requirement in the experiment by using the temperature self-adaptive pulsating heat pipe experiment device with the variable liquid filling rate; the multiple fill rate adjustments include increasing the fill rate and decreasing the fill rate.
Further, in step S1, the first liquid filling method includes the following steps:
s1.1, connecting all devices in the experimental device, switching on and opening a first check valve, a second check valve and a third check valve, vacuumizing the whole device through a first liquid pipeline, a second liquid pipeline and a liquid charging pipe, and ensuring that the inside of the device is airtight;
s1.2, closing the first check valve by screwing, enabling the liquid working medium to be in a normal atmospheric pressure state, enabling the liquid working medium to be filled into the liquid pool through the liquid filling pipe, the third check valve, the tee joint and the second check valve under the action of internal and external pressure difference through the second liquid pipeline, enabling the filling amount to be equal to the calculated full liquid amount of the pulsating heat pipe, closing the third check valve and the second check valve, using hydraulic pliers to clamp off the liquid filling pipe at the connection part with an external liquid filling device, and using tin soldering to weld and seal the clamped part;
s1.3, opening a first check valve and a second check valve, establishing liquid-gas distribution in the pulsating heat pipe and the liquid pool, filling liquid working medium in the liquid pool into the pulsating heat pipe through a second liquid pipeline and the first liquid pipeline, and closing the first check valve and the second check valve after the working medium is completely filled to finish the first liquid filling of the pulsating heat pipe.
Further, in step S2, on the premise that the kind of the working medium is not changed, the method for reducing the liquid filling rate includes the following steps:
s2.1.1, connecting the devices in the experimental device, closing the third check valve, opening the first check valve and the second check valve, heating the evaporation section and condensing the condensation section of the pulsating heat pipe after the first liquid filling in the step S1, and measuring the temperature of the evaporation section, the condensation section, the outer wall surface of the heat insulation section and the cooling water inlet and outlet of the condensing device of the pulsating heat pipe by using a temperature measuring instrument;
s2.1.2, controlling the positive and negative electrodes of the semiconductor refrigeration piece to be positively connected by using the power supply of the semiconductor refrigeration piece, reducing the temperature of the liquid pool, ensuring that the internal pressure of the liquid pool is reduced and forms a pressure difference with the internal pressure of the pulsating heat pipe, and enabling the working medium in the pulsating heat pipe to be sprayed out into the liquid pool through the first liquid pipeline, the first check valve, the second check valve and the second liquid pipeline;
s2.1.3, quantitatively controlling the amount of working media in the pulsating heat pipe entering the liquid pool according to the liquid pool scale by adjusting the temperature of the liquid pool, ensuring that the liquid filling rate in the pulsating heat pipe is reduced, and realizing the quick start of the pulsating heat pipe under low liquid filling rate;
s2.1.4, stopping heating to cool the device, closing all check valves, and obtaining the accurate liquid filling rate reduction value according to the scale of the liquid pool at the moment.
Further, in step S2, on the premise that the kind of the working medium is not changed, the method for increasing the liquid filling rate includes the following steps:
s2.2.1, connecting the devices in the experimental apparatus, closing the third check valve, opening the first check valve and the second check valve, controlling the reverse connection of the anode and the cathode of the semiconductor chilling plate by using the power supply of the semiconductor chilling plate, raising the temperature of the liquid pool which is used for reducing the liquid filling rate of the pulsating heat pipe in the step S2.1.3, so that the internal pressure of the liquid pool is increased and forms a pressure difference with the internal pressure of the pulsating heat pipe which is successfully started at the low liquid filling rate in the step S2.1.3, and further, the working medium in the liquid pool flows back to the pulsating heat pipe through the second liquid pipeline, the second check valve, the first check valve and the first liquid pipeline, the liquid level of the liquid pool is reduced, and the liquid filling rate in the pulsating heat pipe is increased;
s2.2.2, quantitatively controlling the amount of the working medium in the liquid pool entering the pulsating heat pipe according to the liquid pool scale by adjusting the temperature of the liquid pool, ensuring the rise of the liquid filling rate in the pulsating heat pipe, and realizing the stable operation of the pulsating heat pipe which is not easy to burn out under high liquid filling rate;
s2.2.3, stopping heating to cool the device, closing all check valves, and obtaining the accurate filling rate increase value according to the scale of the liquid pool at the moment.
The invention also provides a test method of the temperature self-adaptive pulsating heat pipe experimental device with variable liquid filling rate, which is used for testing the performance of the pulsating heat pipe and comprises the following steps:
step one, connecting all devices in the experimental device, closing a third check valve, opening a first check valve and a second check valve, performing evaporation section heating and condensation section condensation treatment on the pulsating heat pipe after the first liquid filling in the step S1, and measuring the temperature of the evaporation section, the condensation section, the outer wall surface of the heat insulation section and the cooling water inlet and outlet of the pulsating heat pipe by using a temperature measuring instrument;
controlling the temperature of the liquid pool to be a fixed value by controlling the semiconductor refrigeration piece through the power supply of the semiconductor refrigeration piece, keeping the temperature of the condensation section constant, enabling the heat input of the evaporation section to rise along with the unit time gradient, and observing the relevance between the temperature of the evaporation section and the temperature of the liquid pool;
and thirdly, calculating the net heat input heat of the pulsating heat pipe by using the temperature change of the inlet and the outlet of the cooling water, and observing the change of the equivalent heat conductivity coefficient of the pulsating heat pipe externally connected with the liquid pool along with the increase of the net heat input heat according to the defined equivalent heat conductivity coefficient.
Further, the equivalent thermal conductivity is the net heat input divided by the temperature difference between the evaporator and condenser sections.
Compared with the prior art, the invention has the following advantages:
1. the variable-liquid-filling-rate temperature self-adaptive pulsating heat pipe experimental device, the adjusting method and the testing method provided by the invention can adjust the liquid filling rate for multiple times, realize that the liquid filling rate is increased or reduced in the experimental process on the premise of not changing the type of the working medium, and solve the limitation problem under the conditions of starting and stable operation of the pulsating heat pipe.
2. The variable liquid filling rate temperature self-adaptive pulsating heat pipe experimental device, the adjusting method and the testing method provided by the invention can improve the equivalent heat conductivity coefficient of the pulsating heat pipe by enabling the temperature of the evaporation section of the pulsating heat pipe to be self-adaptively changed along with the temperature of the liquid pool, and optimize the performance of the pulsating heat pipe.
3. The temperature self-adaptive pulsating heat pipe experimental device with the variable liquid filling rate, the adjusting method and the testing method provided by the invention can be applied to heat dissipation of electronic equipment. Before the electronic equipment is started, the pulsating heat pipe completes gas-liquid redistribution, and the liquid tank temperature is changed to induce that the liquid is conveyed back to the evaporation section and the steam is simultaneously conveyed to the condensation section. The problem that after the pulsating heat pipe is cooled for a long time, liquid is concentrated in a condensation section, and steam is difficult to start in a concentration manner in an evaporation section is solved.
In conclusion, the technical scheme of the invention can solve the problem that the conventional pulsating heat pipe liquid filling device cannot change the liquid filling rate for many times in the experimental process.
Based on the reasons, the invention can be widely popularized in the fields of heat transfer of the pulsating heat pipe and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of the structure of the apparatus of the present invention.
In the figure: 1. a first check valve; 2. a second check valve; 3. a third check valve; 4. a first liquid line; 5. a second liquid line; 6. a liquid charging pipe; 7. pulsating heat pipes; 8. a liquid pool; 9. a semiconductor refrigeration sheet; 10. a semiconductor refrigeration chip power supply; 11. a tee joint; 201. a first interface; 202. a second interface; 203. and a third interface.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. Any specific values in all examples shown and discussed herein are to be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the absence of any contrary indication, these directional terms are not intended to indicate and imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be considered as limiting the scope of the present invention: the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
Example 1
As shown in fig. 1, the present invention provides a temperature adaptive pulsating heat pipe experimental apparatus with variable liquid filling rate, comprising:
the liquid charging pipe 6 is a pipeline for charging liquid for the first time, is connected with an external liquid charging device, and charges working media into the device through the external liquid charging device and the liquid charging pipe;
the pulsating heat pipe 7 is an experimental object for carrying out variable liquid filling rate and performance tests;
the liquid pool 8 is provided with scales on the pool body, and the filling rate of the pulsating heat pipe is accurately adjusted;
the semiconductor refrigerating sheet 9 heats the liquid pool 8 to increase the internal pressure of the liquid pool, or refrigerates the liquid pool 8 to reduce the internal pressure of the liquid pool;
the semiconductor refrigerating sheet power supply 10 is used for supplying input power to the semiconductor refrigerating sheet 9 to realize heating or refrigerating;
the pulsating heat pipe is connected with a tee joint 11, three check valves, two liquid pipelines and a vacuum-pumping pipeline.
The tee 11 has three interfaces, namely a first interface 201, a second interface 202 and a third interface 203; the three check valves are respectively a first check valve 1, a second check valve 2 and a third check valve 3; the two liquid pipelines are a first liquid pipeline 4 and a second liquid pipeline 5 respectively; one vacuumizing pipeline is a first vacuumizing pipeline, the first vacuumizing pipeline is a liquid charging pipe 6, namely the liquid charging pipe 6 can be used as a pipeline for charging liquid for the first time, and can also be used as a vacuumizing pipeline and is connected with an external vacuumizing device, and the whole device is vacuumized through the external vacuumizing device and the vacuumizing pipeline;
the pulsating heat pipe 7 is connected with the liquid pool 8 through two liquid pipelines to form a closed chamber, and a check valve is connected to each pipeline close to the tee joint 11;
the two liquid pipelines and the liquid charging pipe 6 (a first vacuum pumping pipeline) are connected together through a tee 11, the first liquid pipeline 4 is connected with the pulsating heat pipe 7 through a first check valve 1, and the second liquid pipeline 5 is connected with the liquid pool 8 through a second check valve 2;
one side of the first liquid pipeline 4 is connected with the first check valve 1, the other side is connected with a first connector 201 of the tee joint 11, one side of the second liquid pipeline 5 is connected with the second check valve 2, the other side is connected with a second connector 202 of the tee joint 11, and a third connector 203 of the tee joint 11 is connected with the liquid charging pipe 6;
the semiconductor refrigerating plate 9 is coated with heat-conducting silicone grease and stuck to the back of the liquid pool 8.
Example 2
On the basis of embodiment 1, the invention also provides an adjusting method of the temperature self-adaptive pulsating heat pipe experimental device with variable liquid filling rate, which is an adjusting method of the variable liquid filling rate of the pulsating heat pipe and is used for adjusting the liquid filling rate of the working medium in the pulsating heat pipe, and the adjusting method comprises the following steps:
s1, carrying out first liquid filling by using a temperature self-adaptive pulsating heat pipe experimental device with a variable liquid filling rate;
s2, after the first liquid filling is finished, the liquid filling rate is adjusted for many times according to the requirement in the experiment by using the temperature self-adaptive pulsating heat pipe experiment device with the variable liquid filling rate; multiple fill rate adjustments include increasing the fill rate and decreasing the fill rate.
In this embodiment, in step S1, the first liquid filling method includes the following steps:
s1.1, connecting all devices, connecting and opening a first check valve, a second check valve and a third check valve, vacuumizing the whole device through a first liquid pipeline, a second liquid pipeline and a first vacuumizing pipeline, and ensuring that the inside of the device is airtight;
s1.2, closing the first check valve by screwing, enabling the liquid-state working medium to be in a normal atmospheric pressure state, enabling the liquid-state working medium to be filled into the liquid pool through the liquid filling pipe, the third check valve, the tee joint and the second check valve under the action of internal and external pressure difference through the second liquid pipeline, enabling the filling amount to be equal to the calculated full liquid amount of the pulsating heat pipe, closing the third check valve and the second check valve, clamping the liquid filling pipe at the external connection part by using hydraulic tongs, and welding and sealing the clamped part by using tin soldering;
s1.3, opening a first check valve and a second check valve, establishing liquid-gas distribution in the pulsating heat pipe and the liquid pool, filling liquid working medium in the liquid pool into the pulsating heat pipe through a second liquid pipeline and the first liquid pipeline, and closing the first check valve and the second check valve after the working medium is completely filled to finish the first liquid filling of the pulsating heat pipe.
In this embodiment, in step S2, on the premise that the kind of the working medium is not changed, the method for reducing the liquid filling rate includes the following steps:
s2.1.1, connecting the devices, closing the third check valve, opening the first check valve and the second check valve, heating the evaporation section and condensing the condensation section of the pulsating heat pipe which is filled with liquid for the first time in the step S1.2, and measuring the temperature of the evaporation section, the condensation section, the outer wall surface of the heat insulation section and the cooling water inlet and outlet of the condensing device of the pulsating heat pipe by using a temperature measuring instrument;
s2.1.2, controlling the positive and negative electrodes of the semiconductor refrigeration piece to be positively connected by using the power supply of the semiconductor refrigeration piece, reducing the temperature of the liquid pool, ensuring that the internal pressure of the liquid pool is reduced and forms a pressure difference with the internal pressure of the pulsating heat pipe, and enabling the working medium in the pulsating heat pipe to be sprayed out into the liquid pool through the first liquid pipeline, the first check valve, the second check valve and the second liquid pipeline;
s2.1.3, the quantity of working media entering the liquid pool in the pulsating heat pipe can be quantitatively controlled according to the liquid pool scale by adjusting the temperature of the liquid pool, the liquid filling rate in the pulsating heat pipe is reduced, and the pulsating heat pipe can be quickly started at a low liquid filling rate better;
s2.1.4, cooling the system by suspending heating, closing all check valves, and obtaining the accurate liquid filling rate reduction value according to the scale of the liquid pool at the moment.
In this embodiment, in step S2, on the premise that the kind of the working medium is not changed, the method for increasing the liquid filling rate includes the following steps:
s2.2.1, connecting the devices, closing the third check valve, opening the first check valve and the second check valve, controlling the negative and positive electrodes of the semiconductor refrigeration sheet to be reversely connected by using the power supply of the semiconductor refrigeration sheet, increasing the temperature of the liquid pool which is used for reducing the liquid filling rate of the pulsating heat pipe in the step S2.1.3, so that the internal pressure of the liquid pool is increased and forms a pressure difference with the internal pressure of the pulsating heat pipe which is successfully started at the low liquid filling rate in the step S2.1.3, and further, the working medium in the liquid pool flows back to the pulsating heat pipe through the second liquid pipeline, the second check valve, the first check valve and the first liquid pipeline, the liquid level of the liquid pool is reduced, and the liquid filling rate in the pulsating heat pipe is increased;
s2.2.2, the quantity of the working medium in the liquid pool entering the pulsating heat pipe can be quantitatively controlled according to the scale of the liquid pool by adjusting the temperature of the liquid pool, so that the liquid filling rate in the pulsating heat pipe is increased, and the stable operation of the pulsating heat pipe which is difficult to burn out under high liquid filling rate is better realized;
s2.2.3, cooling the system by suspending heating, closing all check valves, and obtaining the accurate filling rate increase value according to the scale of the liquid pool at the moment.
The equivalent thermal conductivity of the ordinary pulsating heat pipe tends to increase along with the increase of heat input, but the increase of the equivalent thermal conductivity of the pulsating heat pipe externally connected with the liquid pool, which is realized by the experimental device of the invention, along with the increase of heat input is far larger than that of the ordinary pulsating heat pipe, and the equivalent thermal conductivity is higher and better. The pulsating heat pipe can be used as a pulsating heat pipe with the temperature of the evaporation section changing along with the temperature of the liquid pool in a self-adaptive manner and higher equivalent heat conductivity coefficient, and can run more stably. The performance test method comprises the following steps:
step one, connecting all the devices, closing a third check valve, opening a first check valve and a second check valve, carrying out evaporation section heating and condensation section condensation treatment on the pulsating heat pipe which is filled with liquid for the first time in the step S1.2, and measuring the temperature of the evaporation section, the condensation section, the outer wall surface of the heat insulation section and the cooling water inlet and outlet of the pulsating heat pipe by using a temperature measuring instrument;
controlling the temperature of the liquid pool to be a fixed value by using a semiconductor chilling plate power supply, controlling the temperature of the condensing section to be constant, and observing the relevance between the temperature of the evaporating section and the temperature of the liquid pool, wherein the heat input of the evaporating section is increased along with the gradient of unit time;
and thirdly, calculating the net heat input heat of the pulsating heat pipe by using the temperature change of the inlet and the outlet of the cooling water, and observing the change of the equivalent heat conductivity coefficient of the pulsating heat pipe externally connected with the liquid pool along with the increase of the net heat input heat according to a defined equivalent heat conductivity coefficient (the net heat input heat is divided by the temperature difference between the evaporation section and the condensation section).
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides a temperature self-adaptation pulsation heat pipe experimental apparatus of variable prefill rate which characterized in that includes: the device comprises a liquid charging pipe (6), a pulsating heat pipe (7), a liquid pool (8), a semiconductor refrigerating sheet (9), a semiconductor refrigerating sheet power supply (10), a tee joint (11), three check valves and two liquid pipelines, wherein the three check valves are a first check valve (1), a second check valve (2) and a third check valve (3) respectively, and the two liquid pipelines are a first liquid pipeline (4) and a second liquid pipeline (5) respectively;
the tee joint (11) is provided with three interfaces which are a first interface (201), a second interface (202) and a third interface (203); one side of the first liquid pipeline (4) is connected with the first interface (201), and the other side of the first liquid pipeline is communicated with the top of the pulsating heat pipe (7); one side of the second liquid pipeline (5) is connected with the second interface (202), and the other side of the second liquid pipeline is connected with the liquid pool (8); one side of the liquid charging pipe (6) is connected with the third interface (203), and the other side of the liquid charging pipe is connected with an external liquid charging device or an external vacuum pumping device; the first check valve (1), the second check valve (2) and the third check valve (3) are respectively arranged on the first liquid pipeline (4), the second liquid pipeline (5) and the liquid charging pipe (6) and are close to the tee joint (11);
liquid pond (8) with semiconductor refrigeration piece (9) link to each other, semiconductor refrigeration piece (9) with semiconductor refrigeration piece power (10) link to each other, semiconductor refrigeration piece (9) are used for heating or refrigeration to liquid pond (8), semiconductor refrigeration piece power (10) are used for improving input power to semiconductor refrigeration piece (9) and realize heating or refrigeration.
2. The variable-filling-rate temperature-adaptive pulsating heat pipe experimental device as claimed in claim 1, wherein scales are engraved on the body of the liquid pool (8) for precisely adjusting the filling rate of the pulsating heat pipe (7).
3. The variable-filling-rate temperature-adaptive pulsating heat pipe experimental device as claimed in claim 1 or 2, wherein heat-conducting silicone grease is coated on the semiconductor refrigeration sheet (9) and attached to the back surface of the liquid pool (8).
4. The variable-filling-rate temperature-adaptive pulsating heat pipe experimental device according to claim 1, wherein a connecting part between the pulsating heat pipe (7) and the first liquid pipeline (4) is sealed; the tee joint (11) is sealed with the connecting parts among the first liquid pipeline (4), the second liquid pipeline (5) and the liquid charging pipe (6); and the connecting part between the second liquid pipeline (5) and the liquid pool (8) is sealed.
5. The method for adjusting the variable-filling-rate temperature-adaptive pulsating heat pipe experimental device according to any one of claims 1 to 4, comprising the following steps:
s1, carrying out first liquid filling by using a temperature self-adaptive pulsating heat pipe experimental device with a variable liquid filling rate;
s2, after the first liquid filling is completed, the liquid filling rate is adjusted for multiple times according to the requirement in the experiment by using the temperature self-adaptive pulsating heat pipe experiment device with the variable liquid filling rate; the multiple fill rate adjustments include increasing the fill rate and decreasing the fill rate.
6. The method for adjusting the variable liquid filling rate temperature-adaptive pulsating heat pipe experimental device according to claim 5, wherein in step S1, the method for the first liquid filling comprises the following steps:
s1.1, connecting all devices in the experimental device, switching on and opening a first check valve (1), a second check valve (2) and a third check valve (3), vacuumizing the whole device through a first liquid pipeline (4), a second liquid pipeline (5) and a liquid charging pipe (6), and ensuring that the inside of the device is airtight;
s1.2, closing the first check valve (1) by screwing, enabling the liquid working medium to be in a normal atmospheric pressure state, enabling the liquid working medium to pass through the liquid filling pipe (6), the third check valve (3), the tee joint (11) and the second check valve (2) under the action of internal and external pressure difference and fill the liquid working medium into the liquid pool (8) through the second liquid pipeline (5), enabling the filling amount to be equal to the calculated full liquid amount of the pulsating heat pipe (7), closing the third check valve (3) and the second check valve (2), using hydraulic pliers to clamp off the liquid filling pipe (6) at the connection part with an external liquid filling device, and using tin soldering to weld and seal the clamped part;
s1.3, opening a first check valve (1) and a second check valve (2), establishing liquid-gas distribution in the pulsating heat pipe (7) and the liquid pool (8), filling liquid working medium in the liquid pool (8) into the pulsating heat pipe (7) through a second liquid pipeline (5) and a first liquid pipeline (4), and closing the first check valve (1) and the second check valve (2) after the working medium is completely filled to finish the first liquid filling of the pulsating heat pipe (7).
7. The adjusting method of the temperature adaptive pulsating heat pipe experimental apparatus with variable liquid filling rate as claimed in claim 5 or 6, wherein in step S2, under the premise that the kind of the working medium is not changed, the method for reducing the liquid filling rate comprises the following steps:
s2.1.1, connecting the devices in the experimental device, closing the third check valve (3), opening the first check valve (1) and the second check valve (2), heating the evaporation section and condensing the condensation section of the pulsating heat pipe (7) which is filled with liquid for the first time in the step S1, and measuring the temperature of the evaporation section, the condensation section, the outer wall surface of the heat insulation section and the cooling water inlet and outlet of the condensing device of the pulsating heat pipe (7) by using a temperature measuring instrument;
s2.1.2, controlling the positive and negative electrodes of the semiconductor refrigeration sheet (9) to be positively connected by using a semiconductor refrigeration sheet power supply (10), reducing the temperature of the liquid pool (8), ensuring that the internal pressure of the liquid pool (8) is reduced and forms a pressure difference with the internal pressure of the pulsating heat pipe (7), and spraying the working medium in the pulsating heat pipe (7) into the liquid pool (8) through the first liquid pipeline (4), the first check valve (1), the second check valve (2) and the second liquid pipeline (5);
s2.1.3, quantitatively controlling the amount of working media in the pulsating heat pipe (7) entering the liquid pool (8) according to the scale of the liquid pool (8) by adjusting the temperature of the liquid pool (8), ensuring that the liquid filling rate in the pulsating heat pipe (7) is reduced, and realizing the quick start of the pulsating heat pipe (7) at a low liquid filling rate;
s2.1.4, stopping heating to cool the device, closing all check valves, and obtaining the accurate filling rate reduction value according to the scale of the liquid pool (8).
8. The method for adjusting a variable-filling-rate temperature-adaptive pulsating heat pipe experimental device according to claim 7, wherein in step S2, under the premise that the kind of the working medium is not changed, the method for increasing the filling rate comprises the following steps:
s2.2.1, connecting each device in the experimental device, closing the third check valve (3), opening the first check valve (1) and the second check valve (2), controlling the positive and negative electrodes of the semiconductor refrigeration sheet (9) to be reversely connected by using the semiconductor refrigeration sheet power supply (10), increasing the temperature of the liquid pool (8) which is used for reducing the liquid filling rate of the pulsating heat pipe (7) in the step S2.1.3, so that the internal pressure of the liquid pool (8) is increased and forms a pressure difference with the internal pressure of the pulsating heat pipe (7) which is started successfully at the low liquid filling rate in the step S2.1.3, and further the working medium in the liquid pool (8) flows back to the pulsating heat pipe (7) through the second liquid pipeline (5), the second check valve (2), the first check valve (1) and the first liquid pipeline (4), the liquid level of the liquid pool (8) is reduced, and the liquid filling rate in the pulsating heat pipe (7) is increased;
s2.2.2, quantitatively controlling the amount of the working medium in the liquid pool (8) entering the pulsating heat pipe (7) according to the scale of the liquid pool (8) by adjusting the temperature of the liquid pool (8), ensuring the rise of the liquid filling rate in the pulsating heat pipe (7), and realizing the stable operation of the pulsating heat pipe (7) which is not easy to burn out under high liquid filling rate;
s2.2.3, stopping heating to cool the device, closing all check valves, and obtaining the accurate filling rate increase value according to the scale of the liquid pool (8).
9. A method for testing a variable-filling-rate temperature-adaptive pulsating heat pipe experimental device according to any one of claims 5-8, which is used for testing the performance of a pulsating heat pipe (7), and comprises the following steps:
step one, connecting all devices in the experimental device, closing a third check valve (3), opening a first check valve (1) and a second check valve (2), carrying out evaporation section heating and condensation section condensation treatment on the pulsating heat pipe (7) which is filled with liquid for the first time in the step S1, and measuring the temperature of an evaporation section, a condensation section, the outer wall surface of an adiabatic section and a cooling water inlet and outlet of the pulsating heat pipe (7) by using a temperature measuring instrument;
controlling the temperature of the liquid pool (8) to be a fixed value by controlling the semiconductor refrigeration piece (9) through the semiconductor refrigeration piece power supply (10), keeping the temperature of the condensation section constant, enabling the heat input of the evaporation section to rise along with unit time gradient, and observing the relevance between the temperature of the evaporation section and the temperature of the liquid pool (8);
and thirdly, calculating the net heat input heat of the pulsating heat pipe (7) by using the temperature change of the inlet and outlet of the cooling water, and observing the change of the equivalent heat conductivity coefficient of the pulsating heat pipe (7) externally connected with the liquid pool (8) along with the increase of the net heat input heat according to the defined equivalent heat conductivity coefficient.
10. The method of claim 9, wherein the equivalent thermal conductivity is the net heat input divided by the temperature difference between the evaporator section and the condenser section.
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