CN114644863A - Far infrared heating slurry, heating coating, preparation method and application thereof - Google Patents
Far infrared heating slurry, heating coating, preparation method and application thereof Download PDFInfo
- Publication number
- CN114644863A CN114644863A CN202210244202.5A CN202210244202A CN114644863A CN 114644863 A CN114644863 A CN 114644863A CN 202210244202 A CN202210244202 A CN 202210244202A CN 114644863 A CN114644863 A CN 114644863A
- Authority
- CN
- China
- Prior art keywords
- carbide
- far infrared
- infrared heating
- parts
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/68—Particle size between 100-1000 nm
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Resistance Heating (AREA)
Abstract
The invention belongs to the technical field of heating materials, and discloses far infrared heating slurry, a heating coating, and a preparation method and application thereof. A far infrared heating slurry comprises graphene, carbide, film forming resin and a solvent; the carbide is powder with a particle size of 500nm-1 μm. The far infrared heating slurry provided by the invention can be uniformly dispersed, and has strong stability and no agglomeration phenomenon; the components are matched for use, so that stronger infrared radiation can be excited, and the far infrared radiance and the surface activity of the slurry are improved; the heating coating prepared by the far infrared heating slurry has high electric-thermal radiation conversion efficiency, uniform radiation surface temperature and high normal total emissivity. The preparation method is simple, efficient, environment-friendly and capable of realizing large-scale production.
Description
Technical Field
The invention belongs to the technical field of heating materials, and particularly relates to far infrared heating slurry, a heating coating, and a preparation method and application thereof.
Background
Graphene is a material with carbon atoms connected in an sp2 hybridization close-packed monolayer two-dimensional structure. The graphene has excellent optical, electrical and mechanical properties and has huge potential application prospects. Graphene is exfoliated from graphite by a micromechanical exfoliation method. The main preparation methods of graphene include a mechanical stripping method, a redox method, a chemical vapor deposition method, a silicon carbide epitaxial growth method and the like. Graphene has excellent heat conduction performance and is the highest heat conduction coefficient in the current carbon materials. Graphene is also one of the important components in the preparation of the heat-generating material.
The far infrared heating material is one of heating materials, has strong radiation force and permeability, can enable water molecules in a human body to generate a resonance effect after the human body absorbs far infrared rays, and can transfer the far infrared heat to the skin of the human body to promote blood circulation and improve the immunity of the human body. The main raw materials for preparing the far infrared heating material comprise: biochar, carbon fiber products, tourmaline, far infrared ceramics, metal oxides and the like.
At present, far infrared heating materials are researched more, but most of the far infrared heating materials still have more defects. For example, the single-component far infrared heating material has the problem of low electric-thermal radiation conversion efficiency, while the multi-component far infrared heating material has the problems of uneven radiation surface temperature, low normal total emissivity and the like.
Therefore, it is highly desirable to provide a far infrared heating material with high electro-thermal radiation conversion efficiency, uniform radiation surface temperature, and high normal total emissivity.
Disclosure of Invention
The present invention has been made to solve at least one of the above-mentioned problems occurring in the prior art. Therefore, the invention provides far infrared heating slurry, a heating coating, and a preparation method and application thereof. The far infrared heating slurry has the advantages of uniform dispersion, strong stability and no agglomeration, and the heating coating prepared by the far infrared heating slurry has higher electric-thermal radiation conversion efficiency, uniform radiation surface temperature and high normal total emissivity.
The invention provides far infrared heating slurry in a first aspect.
Specifically, the far infrared heating slurry comprises graphene, carbide, film forming resin and a solvent; the carbide is powdery, and the grain diameter of the carbide is 500nm-1 μm.
Preferably, the carbide has a particle size of 500-800 nm. By controlling the particle size of the carbide, the quality of the far infrared slurry can be further improved, the mixing of the carbide and graphene is facilitated, the radiation uniformity of a heating material is improved by interaction, and the electric-thermal radiation conversion efficiency is improved.
Preferably, the graphene is graphene powder, and the particle size of the graphene powder is 1-20 μm; further preferably, the particle size of the graphene powder is 5 to 10 μm.
Preferably, the graphene has a bulk density of 0.01-0.08 g/mL; further preferably, the graphene has a bulk density of 0.03 to 0.05 g/mL.
Preferably, the carbide is selected from titanium carbonitride (TiCN), molybdenum carbide (Mo)2C) Chromium carbide (Cr)3C2) At least one of tungsten carbide (WC), zirconium carbide (ZrC), or titanium carbide (TiC).
Further preferably, the carbide is selected from titanium carbonitride (TiCN), molybdenum carbide (Mo)2C) Chromium carbide (Cr)3C2) At least two of tungsten carbide (WC), zirconium carbide (ZrC), or titanium carbide (TiC). When two or more than two carbides are selected, the electric-thermal radiation conversion efficiency and normal total emissivity of the far infrared heating slurry and the heating coating can be further improved.
More preferably, the carbide is chromium carbide (Cr)3C2) And tungsten carbide (WC). When selected, chromium carbide (Cr)3C2) When the far infrared heating slurry is used in combination with tungsten carbide (WC) and graphene, the prepared far infrared heating slurry and the heating coatingThe electric-thermal radiation conversion efficiency and the normal total emissivity are highest.
Preferably, the film-forming resin is a polyacrylic resin and/or an epoxy resin. By selecting the film-forming resin, the dispersibility of the components can be improved, and the conductivity and the electric-thermal radiation conversion efficiency of the heating slurry can be improved; meanwhile, the adhesive property of the far infrared heating slurry can be improved, so that the service life is prolonged.
Preferably, the solvent is either or both of water and ethanol. The solvent is environment-friendly and pollution-free.
Preferably, the far infrared heating paste further comprises a dispersant.
Preferably, the dispersant is selected from at least one of an ammonium salt dispersant, a polyammonium salt dispersant, or a polycarboxylate dispersant. The graphene and the carbide can be better dispersed by using the ammonium salt dispersant, the polyacrylic acid ammonium salt dispersant or the polycarboxylic acid ammonium salt dispersant, the viscosity can be effectively reduced, the uniformity of the slurry is improved, and the storage stability of the slurry is improved; meanwhile, the gloss and the leveling property of the slurry can be improved.
Preferably, the far-infrared heating slurry comprises, by weight, 10-30 parts of graphene, 10-30 parts of carbide, 10-30 parts of a dispersant, 10-35 parts of a film-forming resin and 20-50 parts of a solvent; further preferably, the far-infrared heating slurry comprises, by weight, 18-30 parts of graphene, 10-22 parts of carbide, 10-25 parts of a dispersing agent, 10-18 parts of a film-forming resin and 30-45 parts of a solvent. The control of the use amount of the components in the far infrared heating slurry is beneficial to the mutual matching of the components, and the electric-thermal radiation conversion efficiency and the uniform temperature of a radiation surface of the heating coating prepared by the far infrared heating slurry are improved.
Preferably, the far infrared heating paste further comprises an auxiliary agent.
Preferably, the at least one selected from the group consisting of a wetting agent, a leveling agent, and an antifoaming agent.
Preferably, the wetting agent is selected from at least one of GS-2455, GS-2007, GS-2346, GS-2014, GS-8131 or GS-2066.
Preferably, the leveling agent is selected from at least one of GS-1432, GS-1033, GS-1041, GS-1033, GS-1450 or GS-1033.
Preferably, the antifoaming agent is selected from at least one of GS-5901, GS-5902, GS-T211, GS-5902, GS-5528, GS-T578 or GS-5420.
The invention provides a preparation method of far-infrared heating slurry in a second aspect.
Specifically, the preparation method of the far infrared heating slurry comprises the following steps:
and respectively dispersing the graphene and the film-forming resin in a solvent, then mixing, adding the carbide, and stirring to prepare the far infrared heating slurry.
Preferably, the dispersant is added to disperse the graphene together.
Preferably, the film-forming resin is dispersed with the addition of the auxiliary agent.
Specifically, the preparation method of the far infrared heating slurry comprises the following steps:
(1) adding the solvent and the dispersant into the reactor A, uniformly stirring, adding the graphene, and continuously stirring to obtain a base material A;
(2) adding the film-forming resin and the solvent into a reactor B, uniformly stirring, and adding the auxiliary agent to obtain an auxiliary material;
(3) adding the slurry A into the base material B under the condition of stirring, adding the carbide after stirring and dispersing, and stirring again to obtain the far infrared heating slurry.
A third aspect of the invention provides a heat-generating coating.
Specifically, the heating coating is obtained by curing the far infrared heating slurry.
Preferably, the temperature of the curing is 20-150 ℃. The heating coating can be obtained by curing at normal temperature (20-40 ℃) or high temperature (40-150 ℃). The curing process is simple and is not limited by temperature.
Preferably, the thickness of the heat-generating coating layer is 10 to 50 micrometers; further preferably, the thickness of the heat-generating coating layer is 20 to 40 μm.
A fourth aspect of the invention provides a heat-generating microchip plate.
The heating microcrystalline board comprises the heating coating and a microcrystalline board substrate.
The preparation method of the heating microcrystal plate comprises the following steps: and coating the far infrared heating slurry on a microcrystalline plate substrate, and curing to obtain the product.
Preferably, the preparation method is to screen print the far infrared heating slurry on a microcrystalline board substrate and to cure the paste.
The far infrared heating slurry is solidified on the substrate of the microcrystal plate through screen printing, the operation is simple, quick and efficient, and the formed heating coating has strong adhesion effect.
Compared with the prior art, the invention has the following beneficial effects:
(1) the far infrared heating slurry provided by the invention comprises graphene, carbide, film-forming resin and a solvent; the carbide is powdery, and the particle size of the carbide is controlled to be 500nm-1 mu m, so that the carbide is matched with graphene and film-forming resin for use, and the prepared far infrared heating slurry can be uniformly dispersed, has strong stability and does not have an agglomeration phenomenon; the components are matched to excite stronger infrared radiation, so that the far infrared function of the slurry is enhanced, and the far infrared radiance and the surface activity of the slurry are improved; the heating coating prepared by the far infrared heating slurry has high electric-thermal radiation conversion efficiency, uniform radiation surface temperature and high normal total emissivity.
(2) The far infrared heating slurry and the heating coating provided by the invention are green and safe, and the harm of radioactive substances contained in common ceramic far infrared materials is avoided.
(3) The preparation method of the far infrared heating slurry and the heating coating provided by the invention is simple, efficient, environment-friendly and capable of realizing large-scale production.
Drawings
FIG. 1 is a relative radiant energy spectrum of a heat-generating coating layer obtained in example 1;
FIG. 2 is a scanning electron micrograph of a far infrared heating paste prepared in example 1;
FIG. 3 is a scanning electron micrograph of a far infrared heating paste prepared in example 2;
FIG. 4 is a scanning electron micrograph of a far-infrared heating paste prepared in example 3;
FIG. 5 is an infrared thermal map of the heat-generating coating layer obtained in example 1;
FIG. 6 is an infrared thermal map of the heat-generating coating layer obtained in example 2;
fig. 7 is an infrared thermal map of the heat-generating coating layer obtained in example 3.
Detailed Description
In order to make the technical solutions of the present invention more apparent to those skilled in the art, the following examples are given for illustration. It should be noted that the following examples are not intended to limit the scope of the claimed invention.
The graphene used in the following examples is a powder of lamellar graphene having a diameter of 5 to 10 μm and a bulk density of 0.03 to 0.05 g/mL; the carbide titanium carbonitride (TiCN) and molybdenum carbide (Mo) are used2C) Chromium carbide (Cr)3C2) The grain sizes of the tungsten carbide (WC), the zirconium carbide (ZrC) and the titanium carbide (TiC) are 500-800 nm. All starting materials, reagents or equipment may be obtained from conventional commercial sources or may be obtained by methods known in the art, unless otherwise specified.
Example 1
This example provides a far-infrared heating slurry, which includes, by weight, 20 parts of graphene, 10 parts of titanium carbonitride (TiCN), and 6 parts of molybdenum carbide (Mo)2C) 15 parts of polyacrylic resin (acrylic resin MB-2952 purchased from Shanghai Jiu chemical Co., Ltd.), 10 parts of polycarboxylic acid ammonium salt dispersant (model HT-5020 purchased from Tantai chemical Co., Ltd., Nantong city), 1 part of wetting agent GS-2455, 0.8 part of defoaming agent GS-5901, 0.6 part of flatting agent GS-1432, 15 parts of solvent water and 15 parts of solvent ethanol.
The embodiment provides a preparation method of far-infrared heating slurry, which comprises the following steps:
adding 15 parts of solvent water, 5 parts of solvent ethanol and 10 parts of polycarboxylic acid ammonium salt dispersant into a reactor A, stirring for 15min at 500r/min, adding 20 parts of graphene after uniformly stirring and mixing, and continuously stirring for 25min at 700r/min until the solution is uniform to obtain the slurry.
And (2) adding 15 parts of polyacrylic resin and 10 parts of solvent ethanol into the reactor B, stirring for 15min at 500r/min, uniformly mixing, sequentially adding 1 part of wetting agent GS-2455, 0.8 part of defoaming agent GS-5901 and 0.6 part of flatting agent GS-1432, and stirring for 25min at 700r/min until the solution is uniform to obtain the auxiliary material.
Adding the slurry in the reactor A into the auxiliary material in the reactor B under the stirring state of 700r/min, continuously stirring for 10min, and then adding 10 parts of titanium carbonitride (TiCN) and 6 parts of molybdenum carbide (Mo)2C) In that respect Then stirring the mixture for 25 minutes at 800r/min to be in a uniform state to prepare the far infrared heating slurry.
The embodiment also provides a heating microcrystalline board which comprises a microcrystalline board substrate and a heating coating solidified on the microcrystalline board substrate by adopting the far infrared heating slurry provided by the embodiment.
The preparation method of the heating microcrystal plate comprises the following steps:
the far infrared heating slurry provided by the embodiment is sprayed on a microcrystalline board substrate by adopting a screen printing mode, is baked for 35min at 110 ℃ for curing, and forms a heating coating with the thickness of 25 +/-5 microns on the microcrystalline board substrate after curing, so that the heating microcrystalline board is prepared. The heat-generating coating on the heat-generating microcrystal plate prepared in example 1 was tested according to the method of chapter 20 in GB/T7287-2008, and the relative radiation energy spectrum of the test is shown in fig. 1. In fig. 1, the ordinate is relative radiation intensity and the abscissa is wavelength. As can be seen from FIG. 1, the heating coating layer generates far infrared light waves (ranging from 6 to 14 μm) after heating.
Example 2
The embodiment provides far-infrared heating slurry which comprises, by weight, 20 parts of graphene and 10 parts of chromium carbide (Cr)3C2) 10 parts of tungsten carbide (WC), 15 parts of epoxy resin (type: EPICLON EXA-4850 purchased from Shanghai Diei Sheng Jing Ching Co., Ltd.), 10 parts of polycarboxylic acid ammonium salt dispersant (model HT-5020, purchased from break Tai chemical Co., Ltd., Nantong City), 1 part of wetting agent GS-2455, 0.8 part of defoaming agent GS5901, 0.6 part of flatting agent GS-1432, 15 parts of solvent water and 15 parts of solvent ethanol.
The embodiment provides a preparation method of far infrared heating slurry, which comprises the following steps:
adding 15 parts of solvent water, 5 parts of solvent ethanol and 10 parts of polycarboxylic acid ammonium salt dispersant into a reactor A, stirring for 15min at 500r/min, adding 20 parts of graphene after uniformly stirring and mixing, and continuously stirring for 25min at 700r/min until the solution is uniform to obtain the slurry.
And (2) adding 15 parts of epoxy resin and 10 parts of solvent ethanol into the reactor B, stirring for 15min at 500r/min, uniformly mixing, sequentially adding 1 part of wetting agent GS-2455, 0.8 part of defoaming agent GS-5901 and 0.6 part of flatting agent GS-1432, and stirring for 25min at 700r/min until the solution is uniform to obtain the auxiliary material.
Adding the slurry in the reactor A into the auxiliary material in the reactor B under the stirring state of 700r/min, continuously stirring for 10min, and adding 10 parts of chromium carbide (Cr)3C2) And 10 parts of tungsten carbide (WC). Then stirring the mixture for 25 minutes at the speed of 800r/min till the mixture is uniform, and preparing the far infrared heating slurry.
The embodiment also provides a heating microcrystalline board which comprises a microcrystalline board substrate and a heating coating solidified on the microcrystalline board substrate by adopting the far infrared heating slurry provided by the embodiment.
The preparation method of the heating microcrystal plate comprises the following steps:
the far infrared heating slurry provided by the embodiment is sprayed on a microcrystalline board substrate by adopting a screen printing mode, is baked for 35min at 110 ℃ for curing, and forms a heating coating with the thickness of 25 +/-5 microns on the microcrystalline board substrate after curing, so that the heating microcrystalline board is prepared.
Example 3
The embodiment provides far-infrared heating slurry which comprises, by weight, 20 parts of graphene, 10 parts of zirconium carbide (ZrC) and 10 parts of titanium carbide (TiC), 15 parts of polyacrylic resin (acrylic resin MB-2952, purchased from Shanghai Jiu chemical Co., Ltd.), 10 parts of ammonium polycarboxylate dispersant (model HT-5020, purchased from Funtai chemical Co., Ltd. in Nantong), 1 part of a wetting agent GS-2455, 0.8 part of a defoaming agent GS-5901, 0.6 part of a flatting agent GS-1432, 15 parts of solvent water and 15 parts of solvent ethanol.
The embodiment provides a preparation method of far infrared heating slurry, which comprises the following steps:
adding 15 parts of solvent water, 5 parts of solvent ethanol and 10 parts of polycarboxylic acid ammonium salt dispersant into a reactor A, stirring for 15min at 500r/min, adding 20 parts of graphene after uniformly stirring and mixing, and continuously stirring for 25min at 700r/min until the solution is uniform to obtain the slurry.
And (2) adding 15 parts of polyacrylic resin and 10 parts of solvent ethanol into the reactor B, stirring for 15min at 500r/min, uniformly mixing, sequentially adding 1 part of wetting agent GS-2455, 0.8 part of defoaming agent GS-5901 and 0.6 part of flatting agent GS-1432, and stirring for 25min at 700r/min until the solution is uniform to obtain the auxiliary material.
Adding the slurry in the reactor A into the auxiliary material in the reactor B under the stirring state of 700r/min, continuously stirring for 10min, and then adding 10 parts of zirconium carbide (ZrC) and 10 parts of titanium carbide (TiC). Then stirring at 800r/min for 25 minutes until the mixture is uniform, and preparing the far infrared heating slurry.
The embodiment also provides a heating microcrystalline board which comprises a microcrystalline board substrate and a heating coating solidified on the microcrystalline board substrate by adopting the far infrared heating slurry provided by the embodiment.
The preparation method of the heating microcrystal plate comprises the following steps:
the far infrared heating slurry provided by the embodiment is sprayed on a microcrystalline board substrate by adopting a screen printing mode, is baked for 35min at 110 ℃ for curing, and forms a heating coating with the thickness of 25 +/-5 microns on the microcrystalline board substrate after curing, so that the heating microcrystalline board is prepared.
Example 4
The embodiment provides a far-infrared heating slurry which comprises, by weight, 15 parts of graphene, 12 parts of titanium carbonitride (TiCN) and 12 parts of molybdenum carbide (Mo)2C) 20 parts of polyacrylic resin (acrylic resin MB-2952 purchased from Shanghai Jiu chemical Co., Ltd.), 15 parts of polycarboxylic acid ammonium salt dispersant (model HT-5020 purchased from Nantong City broken Tai chemical Co., Ltd.), 1.5 parts of wetting agent GS-2455, and a preparation method thereof,0.8 part of defoaming agent GS-5901, 0.6 part of flatting agent GS-1432, 15 parts of solvent water and 20 parts of solvent ethanol.
The embodiment provides a preparation method of far infrared heating slurry, which comprises the following steps:
adding 15 parts of solvent water and 10 parts of solvent ethanol and 15 parts of polycarboxylic acid ammonium salt dispersant into a reactor A, stirring for 15min at 500r/min, stirring and mixing uniformly, then adding 15 parts of graphene, and continuously stirring for 25min at 700r/min until the solution is uniform to obtain the slurry.
And (2) adding 20 parts of polyacrylic resin and 10 parts of solvent ethanol into the reactor B, stirring for 15min at 500r/min, uniformly mixing, sequentially adding 1.5 parts of wetting agent GS-2455, 0.8 part of defoaming agent GS-5901 and 0.6 part of flatting agent GS-1432, and stirring for 25min at 700r/min until the solution is uniform to obtain the auxiliary material.
Adding the slurry in the reactor A into the auxiliary material in the reactor B under the stirring state of 700r/min, continuously stirring for 10min, and then adding 12 parts of titanium carbonitride (TiCN) and 12 parts of molybdenum carbide (Mo)2C) In that respect Then stirring the mixture for 25 minutes at the speed of 800r/min till the mixture is uniform, and preparing the far infrared heating slurry.
The embodiment also provides a heating microcrystalline board which comprises a microcrystalline board substrate and a heating coating solidified on the microcrystalline board substrate by adopting the far infrared heating slurry provided by the embodiment.
The preparation method of the heating microcrystal plate comprises the following steps:
the far infrared heating slurry provided by the embodiment is sprayed on a microcrystalline board substrate by adopting a screen printing mode, is baked for 35min at 110 ℃ for curing, and forms a heating coating with the thickness of 25 +/-5 microns on the microcrystalline board substrate after curing, so that the heating microcrystalline board is prepared.
Product effectiveness testing
(1) The far-infrared heating slurries prepared in examples 1 to 3 were diluted with ethanol solutions, respectively, and dropped on silicon wafers, and the surface morphologies of the respective samples were observed by a scanning electron microscope to measure surface morphology Scans (SEM) of the far-infrared heating slurries. The SEM images are shown in fig. 2, 3, and 4, respectively, and it can be seen from fig. 2-4 that in the far infrared heating slurry, graphene and ultra-fine carbide are uniformly mixed, and there is no phenomenon of significant carbide agglomeration and granular feel, and a uniform slurry is formed. The uniformly dispersed slurry is the key of uniform heating temperature distribution and stable infrared thermal imaging of the heating coating.
(2) According to the method of chapter 8 in GB/T7287-. The infrared heatmaps of the heat-generating coatings in examples 1 to 3 are shown in FIG. 5, FIG. 6 and FIG. 7, respectively. Wherein the heat-generating coating layer in example 1 is plotted with a point of 84.0 ℃; the points at 82.5 ℃ of the heat-generating coating layer in example 2 were plotted; the point at which the heat-generating coating layer in example 3 was 82.6 ℃ was plotted. As can be seen from FIGS. 5 to 7, the heat-generating coatings in examples 1 to 3 had uniform temperature distribution and good infrared thermal imaging effect.
(3) The heat-generating microchip plates prepared in examples 1 to 4 were tested for their electric-thermal radiation conversion efficiency according to Chapter 17 method B in GB/T7287-. The normal total emissivity of the heat-emitting microcrystalline plates prepared in examples 1 to 4 was tested according to method B of chapter 18 in GB/T7287-2008. The test results are shown in Table 1.
TABLE 1
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Electric-thermal radiation conversion efficiency | 75％ | 80％ | 78％ | 70％ |
| Normal total emissivity | 0.88 | 0.90 | 0.88 | 0.83 |
As is clear from table 1, the heat-generating microcrystal plates prepared in examples 1 to 4 had an electric-thermal radiation conversion efficiency of 70% or more and as high as 80%. And the normal total emissivity ranges from 0.83 to 0.90.
(4) The heat-generating microcrystal plates prepared in examples 1 to 4 were tested for unevenness in radiant surface temperature according to the method of chapter 8 in GB/T7287-2008. The heat-generating microcrystal plates prepared in examples 1 to 4 were tested for leakage current according to the method of chapter 14 in GB/T7287-2008. The test results are shown in Table 2.
TABLE 2
| Inspection item | Standard requirements | Example 1 | Example 2 | Example 3 | Example 4 |
| Temperature unevenness of radiation surface/. degree.C | ≤7 | 6 | 5 | 5 | 6 |
| Leakage current/mA | ≤0.75 | 0.02 | 0.01 | 0.01 | 0.02 |
As can be seen from table 2, the heat-generating microcrystal plates prepared in examples 1 to 4 had a low unevenness in radiation surface temperature of 5 ℃. And the leakage current is as low as 0.01mA which is far less than the standard requirement of 0.75 mA.
(5) The heat-generating microcrystal panels prepared in examples 1 to 4 were tested for electrical strength according to the method of chapter 14 in GB/T7287-2008. The leading-out bar or two electrodes of the heating microcrystal plate can bear 50Hz and 1500V basic sine wave alternating current test voltage for 1min without breakdown phenomenon between the leading-out bar or the two electrodes and the shell.
(6) The heat-generating microcrystalline plates prepared in examples 1 to 4 were tested for cold heat resistance according to the method of chapter 16 in GB/T7287-2008. After a cold-heat exchange resistance test, the heating microcrystal plate substrate has no crack and deformation; the leading-out rod (wire) has no looseness.
Claims (10)
1. The far infrared heating slurry is characterized by comprising graphene, carbide, film-forming resin and a solvent; the carbide is powdery, and the grain diameter of the carbide is 500nm-1 μm.
2. The far infrared heating paste as set forth in claim 1, wherein the carbide has a particle size of 500-800 nm.
3. The far infrared heating paste as claimed in claim 1 or 2, wherein the graphene is graphene powder, and the particle size of the graphene powder is 1-20 μm.
4. The far infrared heating paste as set forth in claim 1 or 2, wherein the carbide is at least one selected from titanium carbonitride, molybdenum carbide, chromium carbide, tungsten carbide, zirconium carbide, or titanium carbide.
5. The far-infrared heating paste according to claim 4, wherein the carbide is selected from at least two of titanium carbonitride, molybdenum carbide, chromium carbide, tungsten carbide, zirconium carbide, or titanium carbide.
6. The far infrared heating paste as set forth in claim 1 or 2, wherein the far infrared heating paste further comprises a dispersant; the dispersant is at least one selected from ammonium salt dispersant, polyacrylic acid ammonium salt dispersant or polycarboxylic acid ammonium salt dispersant.
7. The far infrared heating paste as claimed in claim 6, which comprises, by weight, 10-30 parts of graphene, 10-30 parts of carbide, 10-30 parts of a dispersant, 10-35 parts of a film forming resin and 20-50 parts of a solvent; preferably, the far-infrared heating slurry comprises 18-30 parts of graphene, 10-22 parts of carbide, 10-25 parts of dispersant, 10-18 parts of film-forming resin and 30-45 parts of solvent.
8. The method for preparing a far-infrared heating paste according to any one of claims 1 to 7, characterized by comprising the steps of:
and respectively dispersing the graphene and the film-forming resin in a solvent, then mixing, adding the carbide, and stirring to prepare the far infrared heating slurry.
9. A heat-generating coating layer, characterized in that the heat-generating coating layer is prepared by curing the far infrared heat-generating paste according to any one of claims 1 to 7.
10. A heat-generating microchip comprising the heat-generating coating layer according to claim 9 and a microchip substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210244202.5A CN114644863A (en) | 2022-03-11 | 2022-03-11 | Far infrared heating slurry, heating coating, preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210244202.5A CN114644863A (en) | 2022-03-11 | 2022-03-11 | Far infrared heating slurry, heating coating, preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114644863A true CN114644863A (en) | 2022-06-21 |
Family
ID=81993895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210244202.5A Pending CN114644863A (en) | 2022-03-11 | 2022-03-11 | Far infrared heating slurry, heating coating, preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114644863A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085104A (en) * | 2016-06-14 | 2016-11-09 | 深圳市鑫成炭素科技有限公司 | Infrared heat radiation coating of Graphene and preparation method thereof |
| CN114096021A (en) * | 2021-12-01 | 2022-02-25 | 浙江希维纳米科技有限公司 | High-emissivity negative ion modified graphene heating carbon slurry and preparation method thereof |
-
2022
- 2022-03-11 CN CN202210244202.5A patent/CN114644863A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085104A (en) * | 2016-06-14 | 2016-11-09 | 深圳市鑫成炭素科技有限公司 | Infrared heat radiation coating of Graphene and preparation method thereof |
| CN114096021A (en) * | 2021-12-01 | 2022-02-25 | 浙江希维纳米科技有限公司 | High-emissivity negative ion modified graphene heating carbon slurry and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 许亚娟等: ""远红外保暖材料发展现状及趋势"", 《现代丝绸科学与技术》, vol. 28, no. 3, pages 112 - 117 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107903751B (en) | Graphene heat dissipation coating and preparation method thereof | |
| CN108102579B (en) | Preparation method and application of high-thermal-conductivity and electric-conductivity adhesive | |
| CN108752713A (en) | One kind aligning graphene superelevation thermal conductivity composite material and preparation method | |
| CN109517520B (en) | Aerogel coating, aerogel coating and method for preparing aerogel coating from aerogel coating | |
| CN110628264B (en) | Preparation method of graphene far-infrared additive and far-infrared slurry | |
| CN109205607B (en) | Method for forming graphene film by horizontally tiling and self-assembling graphene | |
| CN110467467B (en) | Bulk silicon carbide polymer precursor ceramic and blending and cracking preparation method | |
| CN109280426A (en) | A kind of preparation method of electric heating ink and electric heating ink therefrom and application | |
| CN106498313A (en) | High-strength high ductility CNTs SiCp reinforced aluminum matrix composites and preparation method thereof | |
| CN103318878A (en) | Preparation method and application of large size and shape ratio graphene microsheet | |
| CN105368060B (en) | Organosilicon fever layer material, infrared radiation heating body and preparation method thereof | |
| CN103937264A (en) | graphene coordinated carbon nanotube-silicone rubber composite material and preparation method thereof | |
| CN105228273A (en) | For the preparation of the precursor solution of semiconductor thermoelectric film, Electric radiant Heating Film and preparation method | |
| CN109095926A (en) | A kind of high-volume fractional graphene enhancing carborundum based material and preparation method thereof | |
| CN109852235A (en) | A kind of nano material recombination radiation radiating and cooling coating | |
| Sun et al. | Highly thermal-conductive graphite flake/Cu composites prepared by sintering intermittently electroplated core-shell powders | |
| CN110607104B (en) | High-dispersion high-stability graphene resin dispersion liquid and preparation method and application thereof | |
| Sun et al. | Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders | |
| CN108531780A (en) | A kind of preparation method of graphene enhancing nickel alumin(i)um alloy based composites | |
| CN113735590B (en) | Preparation method and product of high-temperature-resistant electromagnetic wave-absorbing ceramic matrix composite material | |
| CN114644863A (en) | Far infrared heating slurry, heating coating, preparation method and application thereof | |
| CN113563760A (en) | Electrothermal ink, preparation method thereof and electrothermal product | |
| CN114155992A (en) | High-adhesion conductive silver paste for ceramic matrix composite and preparation method thereof | |
| CN110194910A (en) | Electric heating ink and preparation method thereof with low-work voltage and farsighted infrared emittance | |
| CN109778352A (en) | A kind of Ti of electrostatic spinning in-situ reducing preparation4O7Nanofiber and its method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |