CN114643773B - Printing jig, printing equipment and working method of printing equipment - Google Patents
Printing jig, printing equipment and working method of printing equipment Download PDFInfo
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- CN114643773B CN114643773B CN202210468635.9A CN202210468635A CN114643773B CN 114643773 B CN114643773 B CN 114643773B CN 202210468635 A CN202210468635 A CN 202210468635A CN 114643773 B CN114643773 B CN 114643773B
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- 238000007639 printing Methods 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims description 52
- 230000008569 process Effects 0.000 claims description 16
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 33
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000008901 benefit Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The invention provides a printing jig, printing equipment and a working method thereof, wherein the printing jig comprises: the printing device comprises a base, wherein a plurality of supporting blocks are arranged on the base and used for bearing a packaging structure to be printed; the fixed cover plate corresponds to the base, a plurality of limit grooves are formed in the fixed cover plate, and the limit grooves are arranged in one-to-one correspondence with the supporting blocks; an opening penetrating through the fixed cover plate is arranged in the limit groove and used for fixing the packaging structure to be printed; the printing jig greatly improves the printing speed and has a wider application range.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a printing jig, printing equipment and a working method thereof.
Background
With the rapid development of electronic, information and communication industries, electronic products are developed to be short, small, light and thin, meanwhile, the electronic products work at high functions and high transmission rates, the working temperature of each component (such as a CPU) is greatly increased, and the heating power of the electronic components and the whole machine is also increased. Generally, when the heating power of the traditional electronic component is smaller, the heat dissipation mode mainly depends on adding a heat sink or a fan to improve the heat dissipation efficiency. At this time, important factors for contact resistance, diffusion heat resistance, and the like are generally ignored. However, with the improvement of the functions and the power of the whole machine, the requirements of the thermal management technology are relatively more and more severe. In the way of heat dissipation from inside to outside of each component of the electronic product, the heat dissipation element is required to have low thermal resistance and fully use high-efficiency heat dissipation elements, and has great relation with the interconnection density between the elements and the heat conduction performance of interface contact materials. Therefore, in the heat dissipation path of electronic product components, the thermal interface material (Thermal Interface Materials:TIM) is a critical material for determining the heat dissipation power.
The thermal interface material was developed in the 80 s of the last century because of its good heat dissipation and manufacturability, and developed rapidly from the 90 s to an important thermal interface material. The phase-change type heat-conducting interface material combines the advantages of the heat-conducting adhesive and the heat-conducting grease, has characteristics similar to those of the heat-conducting adhesive before reaching the phase-change temperature, has higher viscosity, can not cause the problems of overflow and the like of the heat-conducting grease during buckling and pressing, and can be directly adhered above a radiating fin or a wafer. When the working temperature of the wafer exceeds the phase transition temperature, part of interface materials are changed from solid to liquid, and the interface materials are similar to heat conduction grease in characteristics, have stronger fluidity, and are easier to fill the pores between interfaces, so that the surface bonding compactness is improved, and the thermal resistance is reduced.
However, the thermal interface material is easy to generate unqualified product quality in the printing process due to the characteristic of high viscosity, so that the yield of the product is low and the repair rate is high.
Therefore, how to improve a printing jig and a printing device, ensure the formation quality of printed thermal interface materials and ensure the stability of the printing quality is a technical problem which needs to be solved urgently at present.
Disclosure of Invention
The invention solves the problem of providing a printing jig, printing equipment and a working method thereof, ensures the stability of a printing process, improves the printing quality, realizes the printing of a plurality of chips to be printed at the same time, and has wider application range.
In order to solve the above problems, the present invention provides a printing jig, comprising: the printing device comprises a base, wherein a plurality of supporting blocks are arranged on the base and used for bearing a packaging structure to be printed; the fixed cover plate corresponds to the base, a plurality of limit grooves are formed in the fixed cover plate, and the limit grooves are arranged in one-to-one correspondence with the supporting blocks; the limiting groove is positioned in the fixing cover plate, and the limiting groove is provided with an opening penetrating through the fixing cover plate, and the opening is used for fixing the packaging structure to be printed.
Optionally, the supporting block is an elastic supporting block or a non-elastic supporting block.
Optionally, when the supporting block is an elastic supporting block, the elastic supporting block includes an elastic member and a supporting member located on the elastic member.
Optionally, one end of the elastic element is fixed with the base, and the other end of the elastic element is fixedly connected with the supporting element.
Optionally, a notch is further formed at the edge of the opening, and a buffer member is arranged at the notch.
Optionally, the packaging structure to be printed comprises a substrate and a chip which is flipped on the substrate.
Optionally, a chamfer is disposed below the opening, and the chamfer and the edge of the opening define a containing area of the substrate together.
Optionally, the size of the opening is smaller than the size of the substrate and larger than the size of the chip, and when the substrate rises to the opening, the substrate is just clamped in the accommodating area.
Correspondingly, the invention further provides printing equipment comprising the printing jig.
Correspondingly, the invention also provides a working method of the printing equipment, which comprises the following steps:
providing the printing jig to be installed on printing equipment;
conveying the packaging structure to be printed to the upper part of the printing jig base by using a carrier;
lifting the base to the printing height, enabling at least part of the packaging structure to be printed to penetrate through the opening of the limiting groove of the fixed cover plate, enabling the surface of the packaging structure to be printed to protrude out of the surface of the opening, enabling the surface to be printed of the packaging structure to be attached to the steel mesh, and enabling the scraper to print the surface to be printed.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the printing jig of the technical scheme of the invention, a plurality of supporting blocks are arranged on a base, the supporting blocks are used for bearing the packaging structure to be printed, a plurality of limiting grooves are arranged in a fixed cover plate, the limiting grooves are arranged in one-to-one correspondence with the supporting blocks, openings penetrating through the fixed cover plate are arranged in the limiting grooves, and the openings are used for fixing the packaging structure to be printed; on the other hand, the limit grooves are arranged in one-to-one correspondence with the support blocks, the limit grooves are internally provided with openings penetrating through the fixed cover plate, the openings fix the packaging structure to be printed, and meanwhile, the packaging structure to be printed is printed, so that the printing speed is greatly improved, and the device has a wider application range.
Drawings
FIG. 1 is a cross-sectional view of a flip chip package structure according to an embodiment of the present invention;
FIG. 2 is a top view of a base in an embodiment of the invention;
FIG. 3 is a cross-sectional view of FIG. 2 taken along section line A-A;
FIG. 4 is a top view of a stationary cover plate according to an embodiment of the invention;
FIG. 5 is an enlarged view of the broken line of FIG. 4;
fig. 6 is a cross-sectional view of fig. 5 taken along section line B-B.
Detailed Description
As described in the background, there are still problems with printing thermal interface materials on chips in the prior art. The following will specifically explain.
At present, when the thermal interface material is printed on the chip in the market, the effective pressing sum is not available between the thermal interface material and the surface of the chip, so that more holes exist between the thermal interface material and the surface of the chip, the quality and the yield of a printed product are reduced, the experience of a terminal customer is very poor, and the thermal interface material is covered excessively, so that the material is wasted.
On the basis, the invention provides a printing jig, and the printing quality is improved by utilizing the printing jig in the printing process of the thermal interface material. The printing jig comprises a base and a fixed cover plate, wherein the base and the fixed cover plate are matched with each other to improve the printing quality of the thermal interface material. The printing jig comprises a base, a fixed cover plate, a fixing cover plate, a plurality of limiting grooves, a plurality of supporting blocks, a plurality of fixing plates and a plurality of fixing plates, wherein the supporting blocks are used for bearing a packaging structure to be printed; on the other hand, the limit grooves are arranged in one-to-one correspondence with the support blocks, the limit grooves are internally provided with openings penetrating through the fixed cover plate, the fixed cover plate fixes the packaging structure to be printed, and the printing jig can be used for simultaneously printing a plurality of packaging structures to be printed, so that the printing speed is greatly improved, and the printing device has a wider application range.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
FIG. 1 is a cross-sectional view of a flip chip package structure according to an embodiment of the present invention; FIG. 2 is a top view of a base in an embodiment of the invention; FIG. 3 is a cross-sectional view of FIG. 2 taken along section line A-A; FIG. 4 is a top view of a stationary cover plate according to an embodiment of the invention; FIG. 5 is an enlarged view of the broken line of FIG. 4; fig. 6 is a cross-sectional view of fig. 5 taken along section line B-B.
In order to facilitate understanding of the printing jig of the present invention, as shown in fig. 1, an exemplary flip chip packaging structure is provided, which includes a substrate a, a chip c disposed on the substrate a, and a heat dissipation cover b, wherein the chip c is mounted on the substrate a by a metal or solder ball under the chip c, the heat dissipation cover b is adhered to the substrate a by an adhesive d, a thermal interface material e is disposed between the chip c and the heat dissipation cover b, and the upper and lower sides of the thermal interface material e are respectively connected with the heat dissipation cover b and the chip c independently, so as to facilitate rapid heat dissipation. The printing jig of the present invention is applied to a process of printing the thermal interface material e on the chip c after the chip c is flip-chip mounted on the substrate a.
In this embodiment, the package structure to be printed includes a substrate a and a chip c flip-chip mounted on the substrate a.
Referring to fig. 2 and fig. 4 in combination, a printing fixture includes a base 101 and a fixed cover plate 102, where in the process of printing a thermal interface material e, the base 101 and the fixed cover plate 102 are mutually matched to fix the substrate a with the chip c in a flip-chip manner, so that the substrate a is not easy to deviate when the thermal interface material e is printed on the chip c, and the printing quality of the thermal interface material e is ensured.
As shown in fig. 2 and 3, the base 101 has a support block 103 thereon, and the support block 103 stands on the base 101.
In this embodiment, the supporting block 103 is used for supporting the substrate a on which the chip c is flipped, and when the chip c is subjected to the action force of the wiper during printing, the supporting block 103 can provide a reaction force for supporting and counteracting the action force, so that the chip c is ensured not to be separated or deviate from the printing steel mesh due to the pressure extruded by the wiper, and the printing quality and the forming quality of the thermal interface material e are ensured.
In this embodiment, the base 101 is provided with a plurality of supporting blocks 103, and each supporting block 103 can be provided with a substrate a with a plurality of chips c in a flip-chip manner, so that a plurality of chips c can be printed simultaneously in the printing process, the printing efficiency is greatly improved, and the printing device has a wider application range.
In this embodiment, the supporting block 103 is an elastic supporting block, and the advantage of selecting an elastic supporting block is that, because the elastic supporting block has elasticity, when a doctor applies a force to the chip c during printing, the contact surface between the substrate a and the supporting block 103 becomes contact between the non-deformable surface and the deformable surface, so that by using the deformation of the supporting block 103, a sufficient supporting force can be given to the substrate a during the extrusion of the chip c, so that the substrate a can be stably located at a precise position without being deviated.
In this embodiment, when the support block 103 is an elastic support block, the support block 103 includes an elastic member (not numbered in the figure) and a support member (not numbered in the figure) located on the elastic member.
In this embodiment, one end of the elastic member is fixed on the base 101, and the other end of the elastic member is fixedly connected with the supporting member.
In this embodiment, the elastic member is a spring, and the supporting member is an aluminum alloy or a composite material having a certain hardness.
In this embodiment, the elastic force of the supporting block 103 should be controlled in the range of 15N to 25N. When the elastic force of the supporting block 103 is smaller than 15N, the supporting force provided by the supporting block 103 to the substrate a is smaller when the chip c is subjected to the action of the scraper, so that the substrate a is easy to fall off from the base 101 or deviate in the printing process; when the elastic force of the supporting block 103 is greater than 25N, the supporting block 103 can provide too great force to the substrate a during printing, which also easily causes the substrate a to deviate, reducing the quality of printing.
In other embodiments, the support block 103 may also be a non-elastic support block.
With continued reference to fig. 4, 5 and 6, the cover plate 102 is fixed, the cover plate 102 corresponds to the base 101, a limiting groove (not labeled in the drawing) is provided on the cover plate 102, an opening 104 penetrating the cover plate 102 is provided in the limiting groove, and the limiting groove and the opening 104 correspond to the supporting blocks 103 one by one. A chamfer 105 is provided below the opening 104 of the limiting groove, and the chamfer 105 and the edge of the opening 104 jointly define a containing area of the substrate. The size of the opening 104 of the limiting groove is smaller than that of the substrate a and larger than that of the chip c, so that the substrate a can be just clamped in the accommodating area when the substrate a rises to the opening 104. Therefore, when in printing, the chamfer 105 and the accommodating area can limit the substrate a in the vertical direction and the radial direction, and the chip c is exposed, so that the position accuracy and stability of the chip c to be printed are ensured, the risk of deviation of thermal interface materials in the printing process is reduced, the stable and efficient printing quality is ensured, and the production hidden troubles such as abrasion of the chip to be printed are ensured and eliminated. The chamfer 105 and the receiving area play a guiding role in the process of jacking up the substrate a, and meanwhile damage to the substrate a caused by burrs on the edge of the opening 104 can be avoided.
Specifically, in the printing process, the supporting block 103 on the base 101 supports the substrate a, the workbench lifts the base 101 to the printing height, the chip c passes through the opening 104, and the surface of the chip c protrudes out of the surface of the opening 104, and the substrate a is just clamped in the accommodating area, and protrudes out of the surface of the chip c of the opening 104 for subsequent printing of the thermal interface material e.
In this embodiment, the fixed cover 102 has a plurality of limiting grooves thereon.
In other embodiments, only one of the limiting grooves may be provided on the fixed cover 102.
In this embodiment, one of the limiting grooves has one of the openings 104 therein.
In other embodiments, the shape of the opening 104 may be circular, and may be selected according to the shape of the substrate a.
In this embodiment, when the base 101 and the fixed cover plate 102 are mutually matched, the positions of the limiting grooves are in one-to-one correspondence with the positions of the supporting blocks 103, so that when one of the supporting blocks 103 is placed with one of the packaging structures to be printed, the corresponding opening of the limiting groove limits and fixes the substrate of the packaging structure to be printed, and therefore, printing of a plurality of packaging structures to be printed can be ensured, the printing period is greatly shortened, and the printing device has a wider application range.
Preferably, the edge of the opening 104 further has notches 106, and the number of notches 106 is two, and the notches are located on opposite sides of the opening 104. In other embodiments, the number of notches 106 may be one, three, or other numbers.
The gap 106 is further provided with a buffer member 107, one end of the buffer member 107 is fixed on the body of the fixed cover plate 102 through a screw, the buffer member 107 is located below the plane where the opening 104 of the limiting groove is located, so that the buffer member 107 is contacted with the buffer member 107 preferentially in the rising process of the substrate a, then contacted with the edge of the opening 104 of the limiting groove, finally clamped in the accommodating area, the buffer member 107 is arranged to enable the substrate a and the edge of the opening 104 not to have hard collision, in the printing process, the support block 103 can provide a support force for the bottom of the substrate a, and the buffer member 107 can play a role of buffering on the upper surface of the substrate a, so that the protection of the substrate a and the accuracy of the printing position of the product substrate a in the printing process are ensured under the dual roles.
Further, the buffer member 107 is a spring.
In other embodiments, the number of the notches 106 and the number of the buffer members 107 may be set according to practical situations, and will not be described herein.
In this embodiment, the material of the printing jig is aluminum, and the surface of the printing jig is required to be anodized, and is required to be ESD-protective coated, and the electrostatic voltage on the ESD surface is less than 100V.
Correspondingly, the invention also provides printing equipment, which comprises: the printing jig, the working unit (not shown) and the rails (not shown) on both sides of the working unit and the conveyor belt (not shown) on the rails. The working unit is used for fixing and driving the lifting motion of the base 101. The working unit includes a working table (not shown) and a lifting device (not shown) connected to the working table, the lifting device is used for lifting the working table, and the base 101 is fixed on the working table through buckles 108 (please refer to fig. 2) on the left and right sides of the base 101, so that the base 101 can be lifted along with the lifting of the working table. The fixed cover plate 102 is fixed on the track of the printing equipment, screw holes are formed in the left side and the right side of the fixed cover plate 102, and the fixed cover plate 102 is fixed with the track of the printing equipment in a screw driving mode.
Correspondingly, the invention also provides a working method of the printing equipment, which comprises the following steps:
the above-mentioned printing jig is provided to be mounted on a printing apparatus (not shown) for printing a thermal interface material on the back surface of the chip c, the printing apparatus comprising: the printing device comprises a working unit, a printing jig arranged on the working unit, rails positioned on two sides of the working unit and a conveying belt positioned on the rails. Specifically, the working unit includes a working table and a lifting device connected with the working table, the lifting device is used for lifting the working table, the base 101 is fixed on the working table through a buckle 108 (see fig. 2), the fixed cover plate 102 is locked on the track through a screw, the base 101 is correspondingly arranged with the fixed cover plate 102, that is, the supporting blocks 103 on the base 101 are in one-to-one correspondence with the openings 104 on the fixed cover plate 102.
The package structure to be printed is transported to the top of the printing jig base by a carrier (not shown). The carrier bears the packaging structure to be printed, the carrier is provided with a plurality of hollow areas, the opening inner diameter of each hollow area is smaller than the outer diameter of the substrate in the packaging structure, so that the carrier can bear the packaging structure to be printed, the packaging structure to be printed is conveyed into the track by the carrier through the conveying belt, the conveying belt drives the carrier to carry out conveying motion along the track, and the packaging structure to be printed is conveyed to the upper side of the base, so that the positions of the supporting blocks 103 and the packaging structure to be printed are in one-to-one correspondence. The inner diameter of the hollowed-out area on the carrier is larger than or equal to the outer diameter of the supporting block 103, so that the supporting block can transmit the hollowed-out area of the carrier to jack up the packaging structure to be printed during printing.
In this embodiment, the printing apparatus further includes a limiting cylinder (not shown in the figure), where after the package structure to be printed corresponds to the position of the supporting block one by one, the limiting cylinder limits the carrier.
Lifting the workbench to enable the base 101 to rise to the printing height, enabling at least part of packaging structures to be printed to penetrate through the opening of the fixed cover plate and enabling the surfaces of the packaging structures to protrude out of the surfaces of the opening, enabling the surfaces to be printed of the packaging structures to be printed to be attached to a steel screen, and enabling the scraper to print the surfaces to be printed. Specifically, when the substrate a rises to the opening 104 of the fixed cover plate, the substrate a is just clamped in the accommodating area. The chip c is exposed, the printing surface of the chip c is attached to the steel mesh, and the scraper prints a thermal interface material on the back surface of the chip c.
After printing, the lifting device drives the workbench to descend, so that the packaging structure printed with the thermal interface material returns to the carrier, and the carrier is driven by the conveying belt to enter the next working procedure along the track.
In the invention, as the printing jig is introduced into the printing equipment, the supporting block can play a role in providing support for the packaging structure to be printed in the process of printing the thermal interface material on the back surface of the chip, thereby ensuring the smooth proceeding of the printing process, simplifying the printing difficulty and ensuring the printing quality; in addition, on the one hand, the limit grooves on the fixed cover plate are in one-to-one correspondence with the supporting blocks on the base, the limit grooves are provided with openings penetrating through the fixed cover plate, the openings fix the substrate in the packaging structure to be printed, and meanwhile, the plurality of chips to be printed are printed, so that the printing speed is greatly improved, and the packaging structure has a wider application range.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (8)
1. A printing jig, its characterized in that includes:
the packaging structure to be printed comprises a substrate and a chip which is flip-chip mounted on the substrate;
the fixed cover plate corresponds to the base, a plurality of limit grooves are formed in the fixed cover plate, and the limit grooves are arranged in one-to-one correspondence with the supporting blocks;
the packaging structure comprises a limiting groove, a limiting cover plate, a buffer piece, a chip and a fixing cover plate, wherein the limiting groove is arranged in the limiting groove, the opening penetrates through the fixing cover plate, the opening is used for fixing the packaging structure to be printed, a notch is further formed in the edge of the opening, the buffer piece is arranged at the notch, a chamfer is arranged below the opening, the size of the opening is smaller than that of the substrate and larger than that of the chip, the buffer piece is arranged below the plane where the opening is located, the buffer piece is preferentially touched in the rising process of the substrate, and then the buffer piece is touched at the edge of the opening.
2. The printing jig of claim 1, wherein the support block is an elastic support block or a non-elastic support block.
3. The printing jig of claim 2 wherein when the support block is an elastic support block, the elastic support block comprises an elastic member and a support member located on the elastic member.
4. The printing jig of claim 3, wherein one end of the elastic member is fixed to the base, and the other end of the elastic member is fixedly connected to the supporting member.
5. The printing jig of claim 1 wherein the chamfer and the edge of the opening together define a receiving area for the substrate.
6. The printing jig of claim 5, wherein the substrate is exactly clamped in the receiving area when the substrate is lifted to the opening.
7. A printing apparatus, comprising: the printing jig of any one of claims 1 to 6.
8. A method of operating a printing apparatus, comprising:
providing a printing jig according to any one of claims 1 to 6 mounted on a printing device;
conveying the packaging structure to be printed to the upper part of the printing jig base by using a carrier;
lifting the base to the printing height, enabling at least part of the packaging structure to be printed to penetrate through the opening of the limiting groove of the fixed cover plate, enabling the surface of the packaging structure to be printed to protrude out of the surface of the opening, enabling the surface to be printed of the packaging structure to be attached to the steel mesh, and enabling the scraper to print the surface to be printed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210468635.9A CN114643773B (en) | 2022-04-29 | 2022-04-29 | Printing jig, printing equipment and working method of printing equipment |
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| CN202210468635.9A CN114643773B (en) | 2022-04-29 | 2022-04-29 | Printing jig, printing equipment and working method of printing equipment |
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| CN114643773A CN114643773A (en) | 2022-06-21 |
| CN114643773B true CN114643773B (en) | 2023-10-24 |
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| CN206884418U (en) * | 2017-06-19 | 2018-01-16 | 方林红 | A kind of color screen process press of efficient energy-saving four |
| CN208277600U (en) * | 2018-03-19 | 2018-12-25 | 东莞市悦目光学科技有限公司 | A kind of plated film lantern ring jig for improving camera and scratching |
| CN111989219A (en) * | 2018-04-18 | 2020-11-24 | Ekra自动化系统有限公司 | Printing system for imprinting a substrate, method for operating a printing system |
| CN212242631U (en) * | 2019-12-20 | 2020-12-29 | 南京协辰电子科技有限公司 | Tool and have conveyor and printing ink jet equipment of this tool |
| CN111083881A (en) * | 2019-12-31 | 2020-04-28 | 广东晶科电子股份有限公司 | Printing backflow jig |
| CN214188861U (en) * | 2020-11-16 | 2021-09-14 | 湖北新石器电陶科技有限公司 | Special support for ceramic vacuum tube screen printing |
| CN113942291A (en) * | 2021-11-17 | 2022-01-18 | 伟创力电子技术(苏州)有限公司 | Semi-automatic jig for replacing dispensing with heat-dissipation offset printing brush |
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