CN114641128A

CN114641128A - Packaging assembly and method for high-frequency tube seat and flexible circuit board

Info

Publication number: CN114641128A
Application number: CN202210241797.9A
Authority: CN
Inventors: 阮扬; 周程; 吴杨
Original assignee: Accelink Technologies Co Ltd
Current assignee: Accelink Technologies Co Ltd
Priority date: 2022-03-11
Filing date: 2022-03-11
Publication date: 2022-06-17

Abstract

The invention relates to the technical field of optical communication, and provides a packaging assembly and a packaging method of a high-frequency tube seat and a flexible circuit board. A grounding pattern 21 is manufactured on the surface of the flexible circuit board 2, which is used for being attached to the high-frequency tube seat 1, and the grounding pattern 21 avoids other functional pins except the RF pin 11 and the GND pin 12 on the high-frequency tube seat 1; the ground pattern 21 is formed with an avoidance hole 211 corresponding to the RF pin 11, and a PTH hole 212 and a mating pad 213 corresponding to the GND pin 12, wherein the PTH hole 212 is used to conduct electrical characteristics between the ground pattern 21 of the flexible circuit board 2 and the GND pin 12. The invention enables the GND plane of the FPC and the GND plane of the TO tube seat TO be tightly attached and connected with low impedance, and eliminates the parasitic capacitance between the two GND planes; while increasing and shortening the signal return path.

Description

Packaging assembly and method for high-frequency tube seat and flexible circuit board

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of optical communication, in particular to a packaging assembly and a packaging method of a high-frequency tube seat and a flexible circuit board.

[ background of the invention ]

In the field of optical communication, an Electro Absorption Modulated Laser (EML) is mainly used for long-distance transmission. The high-speed EML laser used for the carrier-grade single-wave 100G needs TO adopt airtight packaging and high-speed TO packaging with refrigeration, and becomes a current research hotspot due TO the advantages of low cost, low power consumption and suitability for batch production. How TO improve the radio frequency performance of the EML TO packaging assembly with refrigeration is an urgent problem TO be solved in the industry. And the packaging matching design of the high-frequency tube seat and the flexible circuit board is a main factor influencing the radio frequency performance. There are mainly 2 problems with the current universal design:

1) the flexible circuit board that links TO each other with take refrigeration EML TO tube socket has set up cover film and stiffening plate at the back usually, has a parasitic electric capacity between the GND plane of flexible circuit board and the GND plane of TO tube socket like this, can arouse the resonance, leads TO device frequency response curve TO appear shaking, and bandwidth and eye pattern degradation lead TO unable meeting eye pattern index.

2) The EML TO pipe seat with the refrigeration function is generally provided with a radio frequency RF pin 11 and a GND pin 12, and in the existing FPC design, when a signal is input into the base RF pin 11 from the FPC, the position of switching the GND layer from the GND pin 12 of the pipe seat TO the GND pin 12 of the pipe seat from the FPC is not close TO the position of switching the signal from the FPC TO the pipe seat, and the GND layer is switched only through the GND pin 12 of the FPC TO the pipe seat. In this way, the signal return path is far, and the return path is few, which affects the frequency response of the device, and meanwhile, the anti-jamming capability is poor.

In view of the above, overcoming the drawbacks of the prior art is an urgent problem in the art.

[ summary of the invention ]

The technical problem to be solved by the embodiment of the invention is to optimize the packaging matching design of the high-frequency tube seat and the flexible circuit board and improve the radio frequency performance of the high-speed EML coaxial transmitting assembly.

The embodiment of the invention adopts the following technical scheme:

in a first aspect, the present invention provides a packaging assembly of a high-frequency tube socket and a flexible circuit board, the assembly comprising a high-frequency tube socket 1 and a flexible circuit board 2, specifically:

the high-frequency tube socket 1 comprises an RF pin 11 and a GND pin 12;

a grounding pattern 21 is manufactured on the surface of the flexible circuit board 2, which is used for being attached to the high-frequency tube seat 1, and the grounding pattern 21 avoids other functional pins except the RF pin 11 and the GND pin 12 on the high-frequency tube seat 1; the ground pattern 21 is formed with an avoidance hole 211 corresponding to the RF pin 11, and a PTH hole 212 and a mating pad 213 corresponding to the GND pin 12, wherein the PTH hole 212 is used to conduct electrical characteristics between the ground pattern 21 of the flexible circuit board 2 and the GND pin 12.

Preferably, the RF pin 11 is disposed on one side of the high-frequency socket 1 and opposite to other functional pins, wherein the extending direction of the flexible circuit board 2 starts with the functional pin side, and extends out of the functional circuit module part after passing through the RF pin 11, and the flexible circuit board 2 further includes:

first and

second PTH holes

214 and 215 electrically connected to the ground pattern 21 are formed on the flexible printed circuit board 2 at both sides of the land corresponding to the RF lead 11, respectively, so that solder is introduced through the first and

second PTH holes

214 and 215 to fix the first and

second PTH holes

214 and 215 to the bottom of the high frequency stem 1.

Preferably, a high frequency glass material is filled between the RF pin 11 and the high frequency stem 1 for repelling a solder material filled through the first PTH hole 214 and the second PTH hole 215; the evasion hole (211) is not electrically connected with the grounding pattern (21), and the minimum electrical distance is ensured; and the avoiding hole 211 is formed by manufacturing a pad on one side opposite to the high-frequency tube seat 1, and the corresponding pad is used for completing electrical connection with a high-frequency circuit on the flexible circuit board 2.

Preferably, the bottom of the high-frequency socket 1 is formed with an arc-shaped protrusion around the periphery of the RF pin 11, and the size of the evasive hole 211 on the corresponding flexible circuit board 2 is slightly larger than the edge of the protrusion, so that when the soldering material is poured into the first PTH hole 214 and the second PTH hole 215, the corresponding arc-shaped protrusion structure can form a relative height, and the solder is prevented from pouring into the periphery of the RF pin 11.

Preferably, the high-frequency tube base 1 further comprises at least 5 functional pins, and the 5 functional pins are arranged in an arc around the center of the high-frequency tube base 1; the GND pin is positioned at the central position of the high-frequency tube seat 1;

the grounding pattern 21 covers the central area where the GND pin on the high-frequency tube socket 1 is positioned, and covers the area where the RF pin 11 is positioned; the portion of the ground pattern 21 corresponding to the central region where the GND pin of the stem 1 is covered and the portion of the ground pattern 21 corresponding to the region where the RF pin 11 is covered constitute the entire ground pattern 21.

Preferably, the surface of the ground pattern 21 is plated with gold.

Preferably, the bottom layer of the flexible circuit board 2 is a reference ground plane, the routing of the flexible circuit board 2 is arranged at the top layer, and the top layer is the side of the corresponding flexible circuit board 2 opposite to the bottom surface of the high-frequency tube seat 1 after the high-frequency tube seat 1 and the flexible circuit board 2 are installed; the ground pattern 21 is formed by windowing the bottom cover film of the flexible printed circuit board 2.

In a second aspect, the present invention provides an assembling method of a package assembly of a high-frequency header and a flexible circuit board, for assembling the package assembly of the high-frequency header and the flexible circuit board according to the first aspect, the method comprising:

the flexible circuit board 2 penetrates through the pin of the tube seat and is flatly attached to the tube seat; each tube seat pin is connected with a corresponding pad on the flexible circuit board 2 in a soldering tin mode; the pin of the tube seat comprises an RF pin 11, a GND pin 12 and various functional pins;

applying solder to the first and

second PTH holes

214 and 215 to make the solder uniformly infiltrate into the FPC bottom cover film ground pattern 21 and the GND plane of the header through the first and

second PTH holes

214 and 215, thereby ensuring uniform and close adhesion of the solder between the bottom ground pattern 21 of the flexible circuit board 2 and the GND plane of the header.

Preferably, the surface of the ground pattern 21 is plated with gold.

Compared with the prior art, the embodiment of the invention has the beneficial effects that:

according TO the invention, windows are formed at specific positions of the bottom cover film of the FPC, and simultaneously, GND (Plated Through Hole, abbreviated as PTH) plating Through Hole processes are respectively added at two sides of the RF pin close TO the TO tube seat. The GND plane of the FPC and the GND plane of the TO tube seat are tightly attached and connected with low impedance, and parasitic capacitance between the two GND planes is eliminated; meanwhile, the signal return path is increased and shortened, the frequency response and the eye pattern of the device are optimized, and the anti-interference capability of the assembly is improved.

[ description of the drawings ]

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a general schematic view of a package assembly of a high-frequency header and a flexible circuit board according to an embodiment of the invention;

fig. 2 is an exploded view of an assembly of a hf header and a flexible circuit board according to an embodiment of the present invention;

FIG. 3 is a bottom view of a coaxial stem provided in accordance with an embodiment of the present invention;

FIG. 4 is a schematic perspective view of a bottom layer of a flexible circuit board provided in an embodiment of the present invention;

fig. 5 is a schematic diagram of an RF pin structure with an arc-shaped boss structure according to an embodiment of the present invention;

FIG. 6 is a schematic top view of a top layer of a flexible circuit board according to an embodiment of the present invention;

FIG. 7 is a flow chart of a method for packaging a high-frequency header and a flexible circuit board according to an embodiment of the invention;

FIG. 8 is an optical eye diagram of a coaxial launch assembly provided by an embodiment of the present invention;

FIG. 9 is a second layout design of a coaxial header according to an embodiment of the present invention.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are for convenience only to describe the present invention without requiring the present invention to be necessarily constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The common FPC design requires a coverlay and a stiffener on the back side, and there is no space to open a window to expose the GND of the FPC because there are usually traces and pads on the back side, which must be isolated by the coverlay to prevent short circuits. This design is walked line and pad and has been adopted special design, and is openly at FPC through all walking the line design, and suitable GND windowing space has been left at the back, and the convenience is connected with the GND of base, and the pad except GND simultaneously is designed at the FPC back with empty solder ring, has guaranteed sufficient electric interval.

The conventional base design has only one GND pin and is not in the position for signal conversion from FPC to header in many cases. In the prior art, the matching design between the base and the FPC needs to be optimized.

In addition, the technical features involved in the respective embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

Example 1:

embodiment 1 of the present invention provides a package assembly of a high-frequency socket and a flexible circuit board, as shown in fig. 1 and fig. 2, the package assembly includes a high-frequency socket 1 and a flexible circuit board 2, specifically:

as shown in fig. 3, which is a bottom perspective view of the high-frequency stem 1 shown in fig. 1, the high-frequency stem 1 includes an RF pin 11 and a GND pin 12; in the scenario illustrated in fig. 3, the corresponding GND pin 12 is located at the center of the stem 1, and the corresponding RF pin 11 is located near the outer ring of pins arranged around the center in the stem 1.

A grounding pattern 21 is manufactured on the surface of the flexible circuit board 2, which is used for being attached to the high-frequency tube base 1, and the grounding pattern 21 avoids other functional pins except the RF pin 11 and the GND pin 12 on the high-frequency tube base 1; the ground pattern 21 is formed with an avoidance hole 211 corresponding to the RF pin 11, and a PTH hole 212 and a mating pad 213 corresponding to the GND pin 12, wherein the PTH hole 212 is used to conduct electrical characteristics between the ground pattern 21 of the flexible circuit board 2 and the GND pin 12.

According TO the embodiment of the invention, windows are formed in specific positions of the bottom cover film of the FPC, and simultaneously, GND (ground) through hole plating technology PTH (plated through hole) is respectively added at two sides of the RF (radio frequency) pin close TO the TO (transistor) tube seat. The GND plane of the FPC and the GND plane of the TO tube seat are tightly attached and connected with low impedance, and parasitic capacitance between the two GND planes is eliminated; meanwhile, the signal return path is increased and shortened, the frequency response and the eye pattern of the device are optimized, and the anti-interference capability of the assembly is improved.

As shown in fig. 4, in a preferred implementation manner further provided in combination with the embodiment of the present invention, the RF pin 11 is disposed on one side of the high-frequency socket 1 and is opposite to other functional pins, wherein an extending direction of the flexible circuit board 2 starts with the functional pin side, and extends out of the functional circuit module part after passing through the RF pin 11, and the flexible circuit board 2 further includes:

first and

second PTH holes

214 and 215 to fix the first and

second PTH holes

214 and 215 to the bottom of the high frequency stem 1.

It should be noted that fig. 4 shows a symmetrical manner of the first PTH hole 214 and the second PTH hole 215, but in a specific implementation process, the two PTH holes may also be present in a special-shaped manner, and are not limited to the symmetrical structure shown in fig. 4, so that fig. 4 for example should not be taken as an over-limit basis for limiting possible implementations of the first PTH hole 214 and the second PTH hole 215 in the present invention.

In connection with the embodiment of the present invention, a high frequency glass material (as represented by a circle of concentric circles around the RF pin 11 in fig. 3) is filled between the RF pin 11 and the high frequency header 1 for repelling the solder material poured through the first PTH hole 214 and the second PTH hole 215; the evasion hole (211) is not electrically connected with the ground pattern (21), and a minimum electrical distance is ensured. And the evasion hole 211 is provided with a pad on one side opposite to the high-frequency tube seat 1, and the corresponding pad is used for completing electrical connection with a high-frequency circuit on the flexible circuit board 2. The high-frequency glass material ensures high-frequency performance on one hand and prevents short circuit between soldering tin and 11 pins on the other hand.

In addition to the protection scheme given above for forming the RF pin 11, i.e. to avoid that the RF pin 11 is abnormally grounded due to the solder poured in during the process of pouring the solder material into the first and second PTH holes 214 and 215. As shown in fig. 5, an arc-shaped protrusion (a trapezoid boss shown in fig. 5) is formed around the periphery of the RF pin 11 at the bottom of the high-frequency header 1, and the size of the evasive hole 211 on the corresponding flexible circuit board 2 is slightly larger than the protrusion edge (preferably, the inner wall profile of the corresponding evasive hole 211 is adapted to the corresponding protrusion edge), so that when soldering material is poured into the first PTH hole 214 and the second PTH hole 215, the corresponding arc-shaped protrusion structure can form a relative height, and solder is prevented from pouring into the periphery of the RF pin 11. The idea of the modification shown in fig. 5 is considered that the angle of the solder material poured into the first and second PTH holes 214 and 215 is just the angle shown in fig. 5, from the top to the bottom.

As shown in fig. 4 and 6, in which fig. 4 and 6 are both structures of a side facing away from the high-frequency header 1, except that fig. 4 is shown shaded to show the blocked ground pattern 21, and fig. 6 is a schematic structure showing each pin and associated through-hole (including PTH hole, evasion hole, functional pin hole, and the like) in a manner of including a land. The high-frequency tube socket 1 further comprises at least 5 functional pins, and the 5 functional pins are arranged in an arc around the center of the high-frequency tube socket 1; the GND pin is positioned at the central position of the high-frequency tube seat 1;

the grounding pattern 21 covers the central area where the GND pin on the high-frequency tube socket 1 is positioned, and covers the area where the RF pin 11 is positioned; the portion of the ground pattern 21 corresponding to the central region where the GND pin on the stem 1 is covered and the portion of the ground pattern 21 corresponding to the region where the RF pin 11 is covered constitute the entire ground pattern 21. Preferably, the surface of the ground pattern 21 is plated with gold.

In the embodiment of the invention, the bottom layer of the flexible circuit board 2 is a reference ground plane, the wiring of the flexible circuit board 2 is arranged at the top layer, and the top layer is the side of the corresponding flexible circuit board 2 opposite to the bottom surface of the high-frequency tube seat 1 after the high-frequency tube seat 1 and the flexible circuit board 2 are installed; the ground pattern 21 is formed by windowing the bottom cover film of the flexible printed circuit board 2.

Example 2:

an embodiment of the present invention provides an assembling method of a packaging assembly of a high-frequency header and a flexible circuit board, for assembling the packaging assembly of the high-frequency header and the flexible circuit board described in embodiment 1, as shown in fig. 7, the method includes:

in step 201, the flexible circuit board 2 is passed through the pin of the socket and pasted on the socket; each tube seat pin is connected with a corresponding welding disc on the flexible circuit board 2 in a soldering tin mode; the header pins include an RF pin 11, a GND pin 12, and respective functional pins.

In step 202, solder is applied to the first PTH hole 214 and the second PTH hole 215, so that the solder uniformly infiltrates the FPC bottom cover film ground pattern 21 and the GND plane of the header through the first PTH hole 214 and the second PTH hole 215, thereby ensuring that the solder is uniformly and closely attached between the bottom ground pattern 21 of the flexible circuit board 2 and the GND plane of the header.

first and second PTH holes 214 and 215 electrically connected to the ground pattern 21 are formed on the flexible printed circuit board 2 at both sides of the land corresponding to the RF lead 11, respectively, so that solder is introduced through the first and second PTH holes 214 and 215 to fix the first and second PTH holes 214 and 215 to the bottom of the high frequency stem 1.

In combination with the embodiment of the present invention, the evasive hole 211 is formed with a pad on a side opposite to the high-frequency tube seat 1, and the corresponding pad is used for completing electrical connection with a high-frequency circuit on the flexible circuit board 2.

To avoid the RF pin 11 from being abnormally grounded due to the solder poured during the process of pouring the solder material into the first and second PTH holes 214 and 215. An embodiment of the present invention provides a preferred implementation manner, as shown in fig. 5, an arc-shaped protrusion (a trapezoid boss shown in fig. 5) is formed at the bottom of the high-frequency header 1 around the periphery of the RF pin 11, and the size of the evasive hole 211 on the corresponding flexible circuit board 2 is slightly larger than the protrusion edge (in a preferred embodiment, the inner wall profile of the corresponding evasive hole 211 is adapted to the corresponding protrusion edge), so that when soldering material is poured into the first PTH hole 214 and the second PTH hole 215, the corresponding arc-shaped protrusion structure can form a relative ground height, and solder is prevented from pouring into the periphery of the RF pin 11. The idea of the modification presented in fig. 5 is considered that the angle of the solder material poured into the first and second PTH holes 214, 215 is exactly the angle shown in fig. 5, from top to bottom.

Example 3:

embodiment 3 of the invention provides a packaging assembly of a high-speed EML coaxial tube socket and a flexible circuit board. The assembly is shown in figure 1 in a schematic structural view and figure 2 in an exploded view, and comprises a high-frequency tube socket 1 and a flexible circuit board 2.

For the high-frequency socket 1, the pin layout is shown in fig. 3, and includes an RF pin 11 and a GND pin 12, and the GND pin 12 is arranged at the center. The corresponding FPC design, FPC are 2 plywood structures, and the FPC bottom is the reference horizon, and FPC walks that the line is whole to be set up at the top layer, corresponds the position at the base pin, sets up the via hole to FPC. The FPC bottom layer covering film is windowed, and is designed into a windowed area 11, wherein the surface of the windowed area is an exposed FPC GND plane, gold plating is carried out on the surface of the windowed area, and the windowed area is shown as a shaded part in figure 4, and the remaining 5 Direct Current (DC) pins are not included in the windowed area. On the top layer of the FPC, a first PTH via 214 and a second PTH via 215, which are connected to the bottom layer of the FPC and have GND properties, are respectively disposed at both sides of the RF pad, as shown in fig. 6, and a GND pad is disposed at each of the PTH vias, the hole diameter of the GND PTH is made as large as possible, and the PTH via is disposed in the windowing region 11.

In the assembly process, the FPC penetrates through the cut short tube socket pins and is pasted on the tube socket, and then each tube socket pin is connected in a soldering tin mode. And finally, applying soldering tin to the GND first PTH holes 214 and 33 and the corresponding GND bonding pads, so that the soldering tin uniformly infiltrates the FPC bottom cover film windowing area 11 and the GND plane of the tube seat through the GND first PTH holes 214 and 33, and the soldering tin is uniformly and tightly attached between the FPC bottom layer GND windowing area 11 and the GND plane of the tube seat, thereby realizing low-impedance connection.

Considering further that a first PTH via 214 and a second PTH via 215 with GND property are needed to be respectively disposed on both sides of the FPC near the RF pad, the number of the pins GND of the header can be increased to 2 and distributed on both sides of the RF pin 11, i.e. a second layout design as a high-speed EML coaxial header, as shown in fig. 9. At the moment, the design of the FPC designs the positions of the through holes according to the pin layout of the tube seat, and simultaneously ensures that the hole diameters of the first PTH hole 214 and the second PTH hole 215 of the two GND pin positions respectively corresponding to the GND of the FPC are as large as possible. The FPC assembly and welding are completed by adopting the welding mode, the soldering tin between the GND windowing area 11 of the FPC bottom layer and the GND plane of the base is ensured to be uniform and tightly attached, and low-impedance connection is realized.

The high-speed EML coaxial emission component adopting the scheme of the invention meets the requirement of a 100G LR1 module by indexes, and the optical eye diagram of the device is shown in figure 8, wherein TDECQ reaches 1.6 dB.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A packaging assembly of a hf tube holder and a flexible circuit board, characterized in that the assembly comprises a hf tube holder (1) and a flexible circuit board (2), in particular:

the high-frequency tube seat (1) comprises an RF pin (11) and a GND pin (12);

the surface of the flexible circuit board (2) for being attached to the high-frequency tube seat (1) is provided with a grounding pattern (21), and the grounding pattern (21) avoids other functional pins except the RF pin (11) and the GND pin (12) on the high-frequency tube seat (1); an avoiding hole (211) is formed on the ground pattern (21) corresponding to the RF pin (11), and a PTH hole (212) and a mating pad (213) are formed corresponding to the GND pin (12), wherein the PTH hole (212) is used for conducting the electrical characteristics between the ground pattern (21) of the flexible circuit board (2) and the GND pin (12).

2. The assembly of claim 1, wherein the RF pin (11) is disposed on one side of the hf header (1) and opposite to other functional pins, wherein the extending direction of the flexible printed circuit (2) starts with the functional pin side, and extends out of the functional circuit module part after passing through the RF pin (11), and further comprises on the flexible printed circuit (2):

and a first PTH hole (214) and a second PTH hole (215) which are electrically communicated with the grounding pattern (21) are respectively arranged on the flexible circuit board (2) corresponding to two sides of a bonding pad close to the RF pin (11), so that soldering tin can be conveniently led in through the first PTH hole (214) and the second PTH hole (215) to complete the fixation of the first PTH hole (214) and the second PTH hole (215) with the bottom of the high-frequency tube seat (1).

3. The assembly of claim 2, wherein a high frequency glass material is filled between the RF pin (11) and the high frequency header (1) for repelling solder material poured through the first and second PTH holes (214, 215); the evasion hole (211) is not electrically connected with the grounding pattern (21), and the minimum electrical distance is ensured; and the evasion hole (211) is characterized in that a pad is manufactured on one side of the high-frequency tube seat (1) opposite to the high-frequency tube seat, and the corresponding pad is used for completing electrical connection with a high-frequency circuit on the flexible circuit board (2).

4. The assembly of claim 2, wherein the bottom of the hf header (1) is formed with an arc-shaped protrusion around the perimeter of the RF pin (11), and the evasive hole (211) of the corresponding flexible circuit board (2) is slightly larger than the protrusion edge, so that when the solder material is poured into the first PTH hole (214) and the second PTH hole (215), the corresponding arc-shaped protrusion structure can form a relative height to avoid the solder from flowing into the perimeter of the RF pin (11).

5. The assembly of claim 1, wherein the HF header (1) further comprises at least 5 functional pins, the 5 functional pins being arranged in an arc around the center of the HF header (1); the GND pin is positioned at the central position of the high-frequency tube seat (1);

the grounding pattern (21) covers the central area where the GND pin on the high-frequency tube seat (1) is located, and covers the area where the RF pin (11) is located; the part of the grounding pattern (21) corresponding to the central area covered by the GND pins on the high-frequency tube seat (1) and the part of the grounding pattern (21) corresponding to the area covered by the RF pins (11) jointly form the whole grounding pattern (21).

6. The package assembly of the HF header and the FPC board as claimed in any one of claims 1 to 5, wherein the surface of the ground pattern (21) is plated with gold.

7. The packaging assembly of the high-frequency tube socket and the flexible circuit board according to any one of claims 1 to 5, wherein the bottom layer of the flexible circuit board (2) is a reference ground plane, the routing of the flexible circuit board (2) is arranged on the top layer, and the top layer is the side of the corresponding flexible circuit board (2) opposite to the bottom surface of the high-frequency tube socket (1) after the high-frequency tube socket (1) and the flexible circuit board (2) are installed; the grounding pattern (21) is generated by windowing the bottom layer covering film of the flexible circuit board (2).

8. A method of assembling the assembly of the hf header and the flexible circuit board, for assembling the assembly of the hf header and the flexible circuit board according to any one of claims 2 to 7, the method comprising:

the flexible circuit board (2) penetrates through the pin of the tube seat and is flatly attached to the tube seat; each tube seat pin is connected with a corresponding pad on the flexible circuit board (2) in a soldering tin mode; the socket pins comprise an RF pin (11), a GND pin (12) and various functional pins;

and applying soldering tin to the first PTH hole (214) and the second PTH hole (215), so that the soldering tin uniformly infiltrates the FPC bottom cover film grounding pattern (21) and the GND plane of the tube seat through the first PTH hole (214) and the second PTH hole (215), and the uniform and close fit of the soldering tin between the bottom grounding pattern (21) of the flexible circuit board (2) and the GND plane of the tube seat is ensured.

9. The assembling method of the packaging assembly of the high-frequency tube socket and the flexible circuit board according to claim 8, wherein the bottom layer of the flexible circuit board (2) is a reference ground plane, the routing of the flexible circuit board (2) is arranged at the top layer, and the top layer is the side of the corresponding flexible circuit board (2) opposite to the bottom surface of the high-frequency tube socket (1) after the high-frequency tube socket (1) and the flexible circuit board (2) are installed; the grounding pattern (21) is generated by windowing the bottom layer covering film of the flexible circuit board (2).

10. The assembling method of the package assembly of the high-frequency header and the flexible circuit board according to claim 8, wherein the surface of the ground pattern (21) is plated with gold.