CN114639508A - Method for preparing high-temperature-resistant electric heating device based on transparent conductive film - Google Patents
Method for preparing high-temperature-resistant electric heating device based on transparent conductive film Download PDFInfo
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- CN114639508A CN114639508A CN202011469763.2A CN202011469763A CN114639508A CN 114639508 A CN114639508 A CN 114639508A CN 202011469763 A CN202011469763 A CN 202011469763A CN 114639508 A CN114639508 A CN 114639508A
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- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000005485 electric heating Methods 0.000 title claims abstract description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 69
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 35
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 34
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 28
- 239000002131 composite material Substances 0.000 claims abstract description 25
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000007787 solid Substances 0.000 claims abstract description 15
- 239000002238 carbon nanotube film Substances 0.000 claims abstract description 12
- 238000001338 self-assembly Methods 0.000 claims abstract description 10
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 7
- 238000001465 metallisation Methods 0.000 claims abstract description 5
- 238000012858 packaging process Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000002834 transmittance Methods 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 15
- 239000000565 sealant Substances 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 238000005336 cracking Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 239000005022 packaging material Substances 0.000 claims description 7
- 238000004528 spin coating Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004115 Sodium Silicate Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 239000000839 emulsion Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000005240 physical vapour deposition Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000004590 silicone sealant Substances 0.000 claims description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 21
- 239000000243 solution Substances 0.000 description 17
- 229910000881 Cu alloy Inorganic materials 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000010453 quartz Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 229910018054 Ni-Cu Inorganic materials 0.000 description 4
- 229910018481 Ni—Cu Inorganic materials 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 230000001788 irregular Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite alkene Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention provides a method for preparing a high-temperature resistant electric heating device based on a transparent conductive film, which comprises the following steps: 1) preparing a nickel-based metal transparent conductive material on a high-temperature resistant transparent substrate by adopting a self-assembly template-metal deposition method; 2) introducing a carbon nanotube film by coating on the basis of the nickel-based metal transparent conductive material obtained in the step 1); 3) preparing a graphene film on the nickel-based metal transparent conductive material by a low-pressure high-temperature solid carbon source chemical vapor deposition method on the basis of the step 2), so as to obtain a metal-graphene/carbon nanotube composite transparent conductive film; 4) preparing the transparent high-temperature-resistant electric heating device by adopting a packaging process on the basis of the metal-graphene/carbon nano tube composite transparent conductive film obtained in the step 3).
Description
Technical Field
The invention relates to a preparation method of a transparent high-temperature-resistant electric heating device, belonging to the technical field of transparent conductive films.
Background
In recent years, along with the implementation of the policy of changing coal into electricity in the north of China, various electric coal-replacing heating devices begin to come into common families, and play an important role in promoting clean energy application and atmospheric pollution control in the north of China, wherein various electric heating wall warm paintings and electric heating floor heating devices have obvious advantages in installation construction, use convenience and comfort. In addition, with the gradual development of heating in the south, electrical heating products for heating in winter in families in the south also become more and more popular, and the market potential of various electrical heating products is huge.
Graphene is a strategic emerging material developed in the new century, and has a plurality of unique properties, such as extremely strong electric conduction and heat conduction capacities. In the far infrared electric heat application field, graphite alkene electric heat membrane can radiate human required far infrared, has the potentiality of medical grade application, therefore its application demand that generates heat is flourishing. In recent years, the development of graphene electric heating film devices and manufacturing industries is fast, and the graphene electric heating film devices have gradually replaced the traditional electric heating film heating materials and become the industrial trend of the development of far infrared electric heating films.
The statements in the background section are merely prior art as they are known to the inventors and do not, of course, represent prior art in the field.
Disclosure of Invention
The present invention is directed to one or more of the problems of the prior art, and provides a method for manufacturing a high temperature resistant electric heating device based on a transparent conductive film, comprising:
1) preparing a nickel-based metal transparent conductive material on a high-temperature resistant transparent substrate by adopting a self-assembly template-metal deposition method;
2) introducing a carbon nanotube film by coating on the basis of the nickel-based metal transparent conductive material obtained in the step 1);
3) preparing a graphene film on the nickel-based metal transparent conductive material by a low-pressure high-temperature solid carbon source chemical vapor deposition method on the basis of the step 2), so as to obtain a metal-graphene/carbon nanotube composite transparent conductive film;
4) preparing the transparent high-temperature-resistant electric heating device by adopting a packaging process on the basis of the metal-graphene/carbon nano tube composite transparent conductive film obtained in the step 3).
According to one aspect of the invention, in the step 1), the specific method for preparing the nickel alloy metal-based transparent conductive material on the high-temperature resistant transparent substrate by adopting the self-assembly template-metal deposition method comprises the following steps:
1-1) forming a self-assembled cracking template on the surface of a glass substrate by adopting an organosol capable of realizing self-assembly through a method of printing, spin coating, spray coating, blade coating or slit coating, wherein the crack position of the self-assembled cracking template is a metal area to be deposited;
1-2) depositing one or more layers of metal materials on the cracking template by adopting a physical vapor deposition, chemical vapor deposition or electrochemical deposition method, and ensuring that the top layer metal is a pure nickel material or a nickel-containing alloy material;
1-3) removing the self-assembly template to obtain the nickel-based metal transparent conductive material.
When a layer of metal material is deposited on the cracking template, the metal material can only be pure nickel material or nickel-containing alloy material. When a plurality of layers of metal materials are deposited on the cracking template, only pure nickel materials or nickel-containing alloy materials are required to be deposited finally, and the deposited bottom layer or the deposited middle layer can be made of other materials.
According to one aspect of the invention, the organic sol adopts crack nail polish gel, titanium dioxide sol and acrylic emulsion. After natural airing or heating and drying, irregularly distributed cracks can be generated, and the cracks are connected together to form an irregular grid shape. And removing the self-assembly template after depositing the metal, so that the metal with an irregular grid shape is formed on the surface of the high-temperature resistant transparent substrate. The carbon nanotube solution is coated on the substrate of the metal forming the irregular grid shape, and the carbon nanotube solution fills the open area of the metal grid, so as to be beneficial to improving the total far infrared radiation efficiency.
According to an aspect of the present invention, the other component of the nickel alloy may be one or more of chromium (Cr), iron (Fe), copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W), and silicon (Si).
According to one aspect of the invention, the step 2) is realized by coating a carbon nanotube solution on a nickel-based metal transparent conductive material, and the specific method comprises the following steps:
2-1) preparing a carbon nano tube solution, wherein the mass concentration of the carbon nano tube is 0.1-5 wt%;
2-2) coating the carbon nano tube solution on the nickel-based metal conductive film by adopting a spraying, spin coating, blade coating or slit coating method;
2-3) baking and drying after coating to form a layer of continuously dried carbon nano tube film.
According to an aspect of the present invention, in the step 2-1), the solvent of the carbon nanotube solution is water.
According to an aspect of the present invention, in the step 2-1), the mass concentration of the carbon nanotubes is 0.1 to 0.5 wt%, preferably 0.2 wt%. The invention adopts the carbon nano tube with low concentration, can form good dispersion, simultaneously keeps certain mass concentration, such as 0.1-5 wt%, can ensure the coating thickness, namely, a good continuous film is formed on the surface of irregular metal, and simultaneously ensures better transmittance. When the mass concentration of the carbon nano tube is 0.2 wt%, the coating is more convenient, and the finished product rate is highest after film forming.
According to one aspect of the present invention, in the step 2-2), the coating thickness is 1 to 5 μm. The thickness of the wet film after the carbon nano tube aqueous solution is coated is 1-5 microns, and the thickness of the film formed after drying is 100-500 nanometers.
According to an aspect of the present invention, in the step 2-2), the baking conditions are: 100-150 ℃ for 10-60 min; preferably, the baking conditions are: at 150 deg.C for 30 min.
According to one aspect of the present invention, the specific method of step 3) is:
3-1) firstly coating a solid carbon source on the surface of the metal-nano carbon conductive film on the high-temperature resistant transparent substrate, and then heating and curing to form a film;
3-2) putting the transparent conductive film coated with the solid carbon source into a vacuum chamber, and reacting at 600-1000 ℃ to generate a graphene film on the surface of the nickel or the nickel alloy and enable the graphene to be tightly connected with the carbon nano tube.
According to one aspect of the invention, the high temperature resistant transparent substrate is made of temperature resistant glass which can resist temperature higher than 350 ℃, such as quartz, microcrystalline glass and the like.
According to an aspect of the present invention, the solid carbon source gas is benzene, PMMA or other organic solution.
According to an aspect of the present invention, in the step 4), the packaging process is:
taking the same packaging material as the high-temperature-resistant transparent substrate, and pre-perforating the packaging material to expose the wiring terminal of the device after packaging;
on the basis of the nickel-based transparent conductive film on which the graphene is deposited, an adhesive is used for bonding a packaging material to form a sandwich structure, namely a glass-composite transparent conductive film-glass structure.
According to one aspect of the invention, the adhesive is a silicone sealant, an inorganic sodium silicate high temperature resistant sealant or an inorganic fritted glass frit paste;
preferably, the packaging material is glass with the thickness of 0.05-20mm, and the optical transmittance of the glass substrate is more than 40%. Thus ensuring that the total optical transmittance of the device product obtained by the method is more than 30 percent. The optical transmittance of the electric heating device can reach more than 90% by selecting the glass with high optical transmittance.
Preferably, the encapsulation process is performed under vacuum conditions throughout. This can better ensure complete gas removal.
In order to solve the problems, the invention provides a transparent heating element prepared based on a carbon nano tube, a graphene material and a high-temperature-resistant metal composite material, so that on one hand, the problem of high-temperature resistance of the heating element can be solved, and simultaneously, a better far infrared characteristic can be kept. The invention firstly prepares a transparent conductive film based on nickel (Ni) alloy, in order to enhance the far infrared radiation characteristic, a carbon nano tube film is firstly introduced on the surface of the nickel alloy conductive film by coating, a metal grid opening area is filled, then a graphene material is prepared by a Chemical Vapor Deposition (CVD) method, thereby obtaining a metal-graphene/carbon tube composite transparent conductive film, and on the basis, a complete high-temperature resistant transparent heating body is prepared.
The method provided by the invention realizes that the metal-graphene-carbon nanotube composite transparent conductive film is used as a heating material, on one hand, the conductive property of the conductive material is ensured, and the driving voltage requirements of different electric heating devices can be met; on the other hand, the introduction of the carbon-based material ensures high-efficiency far infrared radiation, which is beneficial to the design of cooking and baking kitchen appliances. Meanwhile, the method can realize the design of the electric heating devices with different transmittances according to the requirements, solves the problem that the traditional high-temperature electric heating device only can adopt non-transparent materials, and greatly expands the application direction of the electric heating device.
The product obtained by the method provided by the invention has the heating temperature of 250-600 ℃. The specific properties are as follows:
1. optical transparency of the electrical heating device: the whole conductive film is of a micron metal grid structure based on a traditional nickel-based or nickel alloy electrothermal heating body, so that the conductive film has high transmittance, the highest optical transmittance can exceed 90%, and the display panel-level optical transmittance is achieved;
2. the conductivity and far infrared performance are better: due to the adoption of the metal grid structure, the conductivity of the metal grid can be greatly regulated and controlled according to the opening ratio (light transmission ratio) of the grid and the components of the metal material, so that the requirements (different voltage driving) of different application occasions can be met; in addition, the carbon nano tube and the graphene film are introduced, so that electric energy can be effectively converted into far infrared radiation, and the problems that a traditional metal-based electric heating device is poor in far infrared effect and difficult to adapt to baking household appliances are greatly solved. Table 1 shows a comparison in the electric-thermal radiation conversion efficiency between examples 1 to 3 of the present invention and comparative example 1.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the description is to be regarded as illustrative in nature and not as restrictive.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "straight", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown, and are used merely for convenience of description and simplicity of description, but do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present invention. Moreover, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Example 1:
a method for preparing a high-temperature resistant electric heating device based on a transparent conductive film specifically comprises the following steps:
1) selecting microcrystalline glass with the thickness of 5mm, then obtaining a layer of crack-type nail glue (ROSALIND, A624) with the thickness of 3 microns by a spin coating process, and then obtaining a crack patterned nail glue film (sacrificial layer) by UV irradiation;
2) respectively depositing a Cr (chromium) film with the thickness of 10nm as a buffer layer and a Ni-Cu (nickel-copper) alloy film on the surface of the cracking pattern by a vacuum magnetron sputtering method, wherein the thickness of the alloy film is 800 nanometers, and the mass ratio of the nickel-copper alloy is as follows: 80% (nickel): 20% (copper);
3) repeatedly cleaning the surface of the redundant sacrificial layer in the step 2) and the metal film on the surface by respectively adopting acetone, ethanol and deionized water solution to obtain the patterned nickel-copper alloy metal grid, wherein the transmittance is more than 80%;
4) forming a layer of carbon nanotube film solution on the nickel-copper alloy metal grid formed in the step 3) by adopting carbon nanotube ink with the mass concentration of 0.1 wt% through a spraying method, and baking at 150 ℃ for 60min to remove the solvent to obtain a layer of carbon nanotube film;
5) coating a solid carbon source on the surface of the nickel-copper alloy-carbon nanotube composite conductive film formed in the step 4), specifically, coating a PMMA organic solution on the surface of the conductive film, and then heating and curing to form a film, wherein the thickness of the film is 10 microns. Then putting the transparent conductive film coated with the PMMA solid carbon source into a vacuum chamber (the background vacuum reaches 1.5Pa), introducing 20sccm hydrogen, reacting for 10min at 600 ℃, and generating a graphene film on the surface of the nickel-copper alloy and enabling the graphene to be tightly connected with the carbon nano tube;
6) on the basis of the composite structure conductive film prepared in the step 5), high-temperature-resistant silver paste is printed on two sides of the conductive film, and sintering is carried out at 600 ℃ for 60min in an argon protective atmosphere to obtain a current carrying strip electrode;
7) coating American Staton (850 DEG F) transparent sealant on one side of the conductive film on the basis of the microcrystalline glass-nickel-copper alloy-carbon nano tube-CVD graphene-current carrying strip electrode composite structure formed in the step 6);
8) under the vacuum condition (the vacuum degree is 1000Pa), the microcrystalline glass (the thickness is 3mm) of a reserved wiring terminal is adopted, and the microcrystalline glass are combined to form a structure: bonding the microcrystalline glass-nickel-copper alloy-carbon nanotube-CVD graphene-sealant composite structure;
9) and naturally drying the sealant to obtain the high-temperature-resistant transparent electric heating device (resistant to 500 ℃) with the transmittance exceeding 80%.
Example 2:
a method for preparing a high-temperature resistant electric heating device based on a transparent conductive film specifically comprises the following steps:
1) selecting 5mm thick high-transmittance quartz glass, then obtaining a layer of crack type nail glue (ROSALIND, A624) with the thickness of 5 microns by a spin coating process, and then obtaining a crack patterned nail glue film (sacrificial layer) by UV irradiation;
2) respectively depositing a Cr (chromium) film with the thickness of 10nm as a buffer layer and a Ni-Cu (nickel-copper) alloy film on the surface of the cracking pattern by a vacuum magnetron sputtering method, wherein the thickness of the alloy film is 1 micron, and the mass ratio of the nickel-copper alloy is as follows: 90% (nickel): 10% (copper);
3) repeatedly cleaning the surface of the redundant sacrificial layer in the step 2) and the metal film on the surface by respectively adopting acetone, ethanol and deionized water solution to obtain the patterned nickel-copper alloy metal grid, wherein the transmittance is more than 85%;
4) forming a layer of carbon nano tube film solution on the nickel-copper alloy metal grid formed in the step 3) by adopting carbon nano tube ink with the mass concentration of 0.2 wt% through a spraying method, and baking at 150 ℃ for 30min to remove the solvent to obtain a layer of carbon nano tube film;
5) coating a solid carbon source on the surface of the nickel-copper alloy-carbon nanotube composite conductive film formed in the step 4), specifically, coating a PMMA organic solution on the surface of the conductive film, and then heating and curing to form a film, wherein the thickness of the film is 10 microns. Then putting the transparent conductive film coated with the PMMA solid carbon source into a vacuum chamber (the background vacuum reaches 1.5Pa), introducing 20sccm hydrogen, reacting for 10min at 700 ℃, and generating a graphene film on the surface of the nickel-copper alloy and enabling the graphene to be tightly connected with the carbon nano tube;
6) on the basis of the composite structure conductive film prepared in the step 5), high-temperature-resistant silver paste is printed on two sides of the conductive film, and sintering is carried out at 600 ℃ for 60min in an argon protective atmosphere to obtain a current carrying strip electrode;
7) coating American Staton (850 DEG F) transparent sealant on one side of the conductive film on the basis of the quartz glass-nickel copper alloy-carbon nanotube-CVD graphene-current carrying strip electrode composite structure formed in the step 6);
8) under the vacuum condition (the vacuum degree is 1000Pa), a structure formed by adopting quartz glass (with the thickness of 3mm) with a reserved wiring terminal hole and 5) is adopted: laminating the quartz glass-nickel-copper alloy-carbon nanotube-CVD graphene-sealant composite structure;
9) and naturally drying the sealant to obtain the high-temperature-resistant transparent electric heating device (resistant to 500 ℃) with the transmittance exceeding 82%.
Example 3:
a method for preparing a high-temperature resistant electric heating device based on a transparent conductive film specifically comprises the following steps:
1) selecting 5mm thick high-transmittance quartz glass, then obtaining a layer of crack-type nail glue (ROSALIND, A624) with the thickness of 3 microns by a spin coating process, and then obtaining a crack patterned nail glue film (sacrificial layer) by UV irradiation;
2) a Cr (chromium) film with a thickness of 10nm was deposited on the surface of the crack pattern by vacuum evaporation to form a buffer layer. And then, depositing a layer of Ni-Cu (nickel-copper) alloy film on the surface of the Cr buffer layer, wherein the thickness of the alloy film is 800nm, and the mass ratio of the nickel-copper alloy is as follows: 70% (nickel): 30% (copper);
3) repeatedly cleaning the surface of the redundant sacrificial layer in the step 2) and the metal film on the surface by respectively adopting acetone, ethanol and deionized water solution to obtain the patterned nickel-copper alloy metal grid, wherein the transmittance is more than 85%;
4) forming a layer of carbon nanotube film solution on the nickel-copper alloy metal grid formed in the step 3) by adopting carbon nanotube ink with the mass concentration of 0.1 wt% through a spraying method, and baking at 150 ℃ for 30min to remove the solvent to obtain a layer of carbon nanotube film;
5) coating a solid carbon source on the surface of the nickel-copper alloy-carbon nanotube composite conductive film formed in the step 4), specifically, coating a PMMA organic solution on the surface of the conductive film, and then heating and curing to form a film, wherein the thickness of the film is 10 microns. Then putting the transparent conductive film coated with the PMMA solid carbon source into a vacuum chamber (the background vacuum reaches 1.5Pa), introducing 20sccm hydrogen, reacting for 10min at 600 ℃, and generating a graphene film on the surface of the nickel-copper alloy and enabling the graphene to be tightly connected with the carbon nano tube;
6) on the basis of the composite structure conductive film prepared in the step 5), high-temperature resistant silver paste is printed on two sides of the conductive film, and sintering is carried out at 600 ℃ for 60min in an argon protective atmosphere to obtain a current carrying strip electrode;
7) coating American Staton (850 DEG F) transparent sealant on one side of the conductive film on the basis of the quartz glass-nickel copper alloy-carbon nanotube-CVD graphene-current carrying strip electrode composite structure formed in the step 6);
8) under the vacuum condition (the vacuum degree is 1000Pa), a structure formed by adopting quartz glass (with the thickness of 3mm) with a reserved wiring terminal hole and 5) is adopted: laminating the quartz glass-nickel-copper alloy-carbon nanotube-CVD graphene-sealant composite structure;
9) and naturally drying the sealant to obtain the high-temperature-resistant transparent electric heating device (resistant to 500 ℃) with the transmittance exceeding 82%.
Comparative example 1:
a preparation method of a composite transparent conductive material and a high-temperature electric heating device comprises the following steps:
1) selecting high-transparency quartz with the thickness of 5mm, and obtaining a patterned latticed photoresist pattern (sacrificial layer) on the surface of the glass by a standard yellow light process;
2) respectively depositing a Cr (chromium) film with the thickness of 10nm as a buffer layer and a Ni-Cu (nickel-copper) alloy film on the surface of the photoresist pattern by a vacuum magnetron sputtering method, wherein the thickness of the alloy film is 800 nanometers, and the mass ratio of the nickel-copper alloy is as follows: 80% (nickel): 20% (copper);
3) respectively and repeatedly cleaning the redundant sacrificial layer photoresist and the metal film on the sacrificial layer photoresist in the step 2) by using acetone, ethanol and deionized water solution to obtain a patterned nickel-copper alloy metal grid, wherein the characteristic line width is 5 micrometers, current-carrying electrodes are formed on two sides, and the transmittance is more than 90%;
4) coating American Staton (850 DEG F) transparent sealant on one side of the conductive film on the basis of the quartz glass-nickel-copper alloy composite structure formed in the step 3);
5) under the vacuum condition (the vacuum degree is 1000Pa), a structure formed by adopting quartz glass (with the thickness of 3mm) with a reserved wiring terminal hole and 4) is adopted: laminating the quartz glass-nickel-copper alloy-sealant composite structure;
6) and naturally airing the sealant to obtain the high-temperature-resistant transparent electric heating device (resistant to the temperature of 400 ℃) with the transmittance exceeding 89%.
Table 1: results of comparing the performances of examples 1 to 3 with that of comparative example 1
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method for preparing a high-temperature resistant electric heating device based on a transparent conductive film is characterized by comprising the following steps:
1) preparing a nickel-based metal transparent conductive material on a high-temperature resistant transparent substrate by adopting a self-assembly template-metal deposition method;
2) introducing a carbon nanotube film by coating on the basis of the nickel-based metal transparent conductive material obtained in the step 1);
3) preparing a graphene film on the nickel-based metal transparent conductive material by a low-pressure high-temperature solid carbon source chemical vapor deposition method on the basis of the step 2), so as to obtain a metal-graphene/carbon nanotube composite transparent conductive film;
4) preparing the transparent high-temperature-resistant electric heating device by adopting a packaging process on the basis of the metal-graphene/carbon nano tube composite transparent conductive film obtained in the step 3).
2. The method for preparing a high-temperature resistant electrothermal device based on a transparent conductive film according to claim 1, wherein in the step 1), the specific method for preparing the nickel alloy metal-based transparent conductive material on the high-temperature resistant transparent substrate by using the self-assembly template-metal deposition method comprises the following steps:
1-1) forming a self-assembled cracking template on the surface of a glass substrate by adopting a method of printing, spin coating, spray coating, blade coating or slit coating by adopting an organic sol capable of realizing self-assembly, wherein the crack position of the self-assembled cracking template is a metal area to be deposited;
1-2) depositing one or more layers of metal materials on the cracking template by adopting a physical vapor deposition, chemical vapor deposition or electrochemical deposition method, and ensuring that the top layer metal is a pure nickel material or a nickel-containing alloy material;
1-3) removing the self-assembly template to obtain the nickel-based metal transparent conductive material.
3. The method for preparing a high-temperature resistant electrothermal device based on a transparent conductive film according to claim 2, wherein the organosol is selected from cracked nail polish gel, titanium dioxide sol, and acrylic emulsion.
4. The method for preparing a high-temperature resistant electrothermal device based on a transparent conductive film according to claim 2, wherein the other component of the nickel alloy can be one or more of chromium (Cr), iron (Fe), copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W) and silicon (Si).
5. The method for preparing a high-temperature resistant electric heating device based on the transparent conductive film according to claim 1, wherein the step 2) is realized by coating a carbon nanotube solution on a nickel-based metal transparent conductive material, and the specific method comprises the following steps:
2-1) preparing a carbon nano tube solution, wherein the mass concentration of the carbon nano tube is 0.1-5 wt%;
2-2) coating the carbon nano tube solution on the nickel-based metal conductive film by adopting a spraying, spin coating, blade coating or slit coating method;
2-3) baking and drying after coating to form a layer of continuously dried carbon nano tube film.
6. The method for manufacturing a high-temperature-resistant electrothermal device based on a transparent conductive film according to claim 5,
in the step 2-1), the solvent of the carbon nano tube solution is water;
in the step 2-1), the mass concentration of the carbon nano tube is 0.1-0.5 wt%, preferably 0.2 wt%; and/or
In the step 2-2), the coating thickness is 1-5 microns; and/or the presence of a gas in the gas,
in the step 2-2), the baking conditions are as follows: 100-150 ℃ for 10-60 min; preferably, the baking conditions are: at 150 deg.C for 30 min.
7. The method for preparing a high-temperature resistant electric heating device based on the transparent conductive film according to claim 1, wherein the specific method of the step 3) is as follows:
3-1) firstly coating a solid carbon source on the surface of the metal-nano carbon conductive film on the high-temperature resistant transparent substrate, and then heating and curing to form a film;
3-2) putting the transparent conductive film coated with the solid carbon source into a vacuum chamber, and reacting at 600-1000 ℃ to generate a graphene film on the surface of the nickel or the nickel alloy and enable the graphene to be tightly connected with the carbon nano tube.
8. The method for preparing a high-temperature resistant electrothermal device based on a transparent conductive film according to claim 7, wherein the high-temperature resistant transparent substrate is made of temperature resistant glass having a temperature resistance of more than 350 ℃; and/or the presence of a gas in the gas,
the solid carbon source gas adopts organic solution such as benzene, PMMA and the like.
9. The method for preparing a high-temperature resistant electric heating device based on the transparent conductive film as claimed in claim 1, wherein in the step 4), the packaging process is as follows:
taking the same packaging material as the high-temperature-resistant transparent substrate, and pre-perforating the packaging material to expose the wiring terminal of the device after packaging;
on the basis of the nickel-based transparent conductive film on which the graphene is deposited, an adhesive is used for bonding an encapsulating material to form a sandwich structure, namely a glass-composite transparent conductive film-glass structure.
10. The method for preparing a high temperature resistant electrothermal device based on a transparent conductive film according to claim 9, wherein the adhesive is a silicone sealant, an inorganic sodium silicate high temperature resistant sealant or an inorganic sintered glass frit paste;
preferably, the packaging material adopts glass with the thickness of 0.05-20mm, and the optical transmittance of the glass substrate is more than 40%;
preferably, the encapsulation process is performed under vacuum conditions throughout.
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| CN105989911A (en) * | 2015-02-10 | 2016-10-05 | 北京大学 | Graphene and metal nanowire composite transparent and conductive plastic film, manufacturing method and application thereof |
| WO2017178841A1 (en) * | 2016-04-15 | 2017-10-19 | Fgv Cambridge Nanosystems Limited | Heater elements, heat exchangers and heater element arrays |
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