CN114632673A - Solid brilliant device of electronic tags packaging machine - Google Patents

Solid brilliant device of electronic tags packaging machine Download PDF

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Publication number
CN114632673A
CN114632673A CN202210377614.6A CN202210377614A CN114632673A CN 114632673 A CN114632673 A CN 114632673A CN 202210377614 A CN202210377614 A CN 202210377614A CN 114632673 A CN114632673 A CN 114632673A
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CN
China
Prior art keywords
axis
motor
jacking
dispensing
cam
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Pending
Application number
CN202210377614.6A
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Chinese (zh)
Inventor
刘宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalian Haida Automation Equipment Co ltd
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Dalian Haida Automation Equipment Co ltd
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Publication date
Application filed by Dalian Haida Automation Equipment Co ltd filed Critical Dalian Haida Automation Equipment Co ltd
Priority to CN202210377614.6A priority Critical patent/CN114632673A/en
Publication of CN114632673A publication Critical patent/CN114632673A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a die bonding device for an electronic tag packaging machine, which comprises a rack, wherein the middle part of the rack is provided with a die bonding part, the incoming direction of the die bonding part is provided with a dispensing part, and the discharging direction of the die bonding part is provided with a traction part, and the die bonding device is characterized in that: the die comprises a dispensing part, a wafer adjusting platform, a vertical turnover mechanism, a horizontal turnover mechanism, an antenna driving adjusting mechanism and a chip jacking mechanism, wherein a dispensing roller is arranged in the dispensing part, a dispensing head is arranged above the dispensing roller, the dispensing head consists of a dispensing valve and a nozzle which are communicated with each other, the length ratio between the dispensing valve and the nozzle is 105:15.5, a positioning camera and an illuminating lamp are also arranged in the dispensing part, the focus of the positioning camera and a dispensing position right below the dispensing head are arranged, and the die bonding part comprises the wafer adjusting platform, the vertical turnover mechanism, the horizontal turnover mechanism and the antenna driving adjusting mechanism and also comprises the chip jacking mechanism matched with the wafer adjusting platform.

Description

Solid brilliant device of electronic tags packaging machine
Technical Field
The invention relates to the field of automatic packaging of electronic tags, in particular to a die bonder for an electronic tag packaging machine.
Background
In the automatic packaging process of the electronic tag, a die bonding device is needed to bond the chip on the wafer to the strip antenna, the traditional die bonding device is provided with a dispensing part and a die bonding part, wherein the dispensing part can coat the bonding glue on the specified position of the strip antenna, and the die bonding part can bond the chip taken off from the wafer at the position coated with the bonding glue;
the traditional die bonder mainly has the following two problems that the first is that the shooting position of a positioning camera in a dispensing part is the previous position of a dispensing station, when the specification and the type of an electronic tag to be packaged are changed, the distance between a detection position and the dispensing station is possibly changed, so that the positioning camera needs to be adjusted to adapt to the switching of different products, the operation is complex, the time for exchanging is long, and the working efficiency of the whole automatic packaging production line is influenced;
the second problem is that the chip transfer is realized by adopting a structure combining turnover and linear translation in the traditional die bonding structure, and the productivity of the structure is relatively low due to a large amount of reciprocating motion; the other chip moving structure is that an inverted wafer platform structure is adopted, the inverted wafer platform is arranged in a die bonder and is matched with two groups of turnover mechanisms to realize chip transfer, and compared with the former mode, the structure can improve certain capacity, but the gravity center of a main moving part wafer platform is higher, larger vibration can be generated in the working process, and the position accuracy of chip bonding is influenced;
meanwhile, after the traditional die bonding structure works for a period of time, the strip antenna may have a certain position deviation, so that manual adjustment is needed after shutdown, and the production efficiency is seriously influenced.
There is therefore a need for a method or apparatus that addresses the above-mentioned problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides the die bonding device for the electronic tag packaging machine, which has the advantages of simple structure, ingenious design and reasonable layout, and can realize accurate bonding on the premise of ensuring the die bonding efficiency.
The technical solution of the invention is as follows: the utility model provides an electronic tags packaging machine is with solid brilliant device, includes frame 1, the middle part of frame 1 is provided with solid brilliant part 2, is provided with some glue 3 in the supplied materials direction of solid brilliant part 2, is provided with traction part 4, its characterized in that in the ejection of compact direction of solid brilliant part 3: a dispensing roller 5 is arranged in the dispensing part 3, a dispensing head is arranged above the dispensing roller 5, the dispensing head consists of a dispensing valve 6 and a nozzle 7 which are communicated with each other, the length ratio of the dispensing valve 6 to the nozzle 7 is 105:15.5, a positioning camera 8 and an illuminating lamp 9 are also arranged in the dispensing part 3, the focus of the positioning camera 8 and a dispensing position right below the dispensing head are arranged,
the die bonding part 2 comprises a wafer adjusting platform, a vertical turnover mechanism, a horizontal turnover mechanism, an antenna driving adjusting mechanism and a chip jacking mechanism matched with the wafer adjusting platform,
the wafer adjusting platform comprises a bottom plate 10 fixedly arranged on a frame 1, the bottom plate 10 is connected with a Y-axis supporting plate 12 in a sliding way through a pair of Y-axis sliding rails 11, one end of the bottom plate 10 is provided with a Y-axis motor 13, a working end of the Y-axis motor 13 is provided with a Y-axis lead screw 14, the Y-axis lead screw 14 is in threaded connection with a nut seat arranged on the bottom end face of the Y-axis supporting plate 12, the Y-axis supporting plate 12 is connected with an X-axis supporting plate 16 in a sliding way through a pair of X-axis sliding rails 15, one end of the Y-axis supporting plate 12 is provided with an X-axis motor 17, a working end of the X-axis motor is provided with an X-axis lead screw 18, the X-axis lead screw is in threaded connection with a nut seat arranged on the bottom end face of the X-axis supporting plate 16, and a wafer clamp 19 is also arranged on the top end face of the X-axis supporting plate 16,
the chip jacking mechanism is positioned below the wafer adjusting platform and comprises a jacking mechanism support 20 directly connected with the machine frame 1, the bottom end face of the jacking mechanism support 20 is in sliding connection with a jacking mechanism Y-axis support plate 22 through a pair of jacking mechanism Y-axis slide rails 21, a Y-axis adjusting screw 23 is rotatably supported on the jacking mechanism support 20, the Y-axis adjusting screw 23 is in mutual contact with the jacking mechanism Y-axis support plate 22, the bottom end face of the jacking mechanism Y-axis support plate 22 is in sliding connection with a jacking mechanism X-axis support plate 25 through a pair of jacking mechanism X-axis slide rails 24, an X-axis adjusting screw 26 is rotatably supported on the jacking mechanism Y-axis support plate 22, the X-axis adjusting screw 26 is in mutual contact with the jacking mechanism X-axis support plate 25, and tension springs 27 are respectively arranged between the jacking mechanism support 20 and the jacking mechanism Y-axis support plate 22 and between the jacking mechanism Y-axis support plate 22 and the jacking mechanism X-axis support plate 20, the jacking mechanism X-axis supporting plate 25 is also fixedly connected with a jacking motor bracket 28, a jacking motor 29 is arranged on the jacking motor bracket 28, the working end of the jacking motor 29 is connected with a jacking lead screw 30, the jacking lead screw 30 is in threaded connection with a jacking rod supporting plate 31, a jacking rod 32 is arranged on the jacking rod supporting plate 31,
the vertical turnover mechanism comprises a DD motor 33 fixedly supported on the frame 1, the working end of the DD motor 33 is connected with a vertical turntable 34, the rotating shaft of the vertical turntable 34 is horizontally distributed, four first suction head sliding rails 35 which are uniformly distributed in the circumferential direction and are arranged along the radial direction of the vertical turntable 34 are arranged on the vertical turntable 34, a first suction head sliding rail 36 is connected on the first suction head sliding rail 35 in a sliding manner, a first suction head 37 and a first driven roller 38 are arranged on the first suction head sliding rail 36, a suction head return spring is arranged between the vertical turntable 34 and the first suction head sliding rail 36, a vertical turnover cam mechanism matched with the feeding level A of the vertical turnover mechanism is further arranged on the frame 1, the vertical turnover cam mechanism comprises a first cam motor 40, and a first cam 41 is arranged at the working end of the first cam motor 40, a vertical turnover slide rail which is longitudinally distributed is arranged on the machine frame 1, a follow-up block 42 is connected on the vertical turnover slide rail in a sliding way, a groove 43 which is matched with the first cam 41 is arranged on the follow-up block 42, the bottom end of the follow-up block 42 is matched with the first driven roller 38 on the first suction head slide frame 36 positioned at the material loading position A,
the horizontal turnover mechanism also comprises a DD motor 33 fixedly supported on the frame 1, the working end of the DD motor 33 is connected with a horizontal turntable 44, the rotating shafts of the horizontal turntable 44 are longitudinally distributed, four second sucker slide rails 45 which are uniformly and longitudinally distributed in the circumferential direction are arranged on the horizontal turntable 44, a second sucker carriage 46 is slidably connected on the second sucker slide rails 45, a second sucker 47 and a second driven roller 48 are arranged on the second sucker carriage 46, a sucker return spring is arranged between the horizontal turntable 44 and the second sucker carriage 46, a pair of horizontal turnover cam mechanisms are further arranged on the frame 1, the two horizontal turnover cam mechanisms are respectively matched with the feeding position B and the discharging position C of the horizontal turnover mechanism, each horizontal turnover cam mechanism comprises a second cam motor 49, and a second cam 50 is arranged on the working end of the second cam motor 49, the second cam 50 is an end cam, and the cam end of the second cam 50 is matched with the second driven roller 48 on the second nozzle carriage 46 at the loading position B or the discharging position C,
the antenna driving and adjusting mechanism comprises an antenna base plate 51 connected to the frame 1, a length direction adjusting plate 52 is connected to the antenna base plate 51 in a sliding manner, a length direction adjusting motor 53 is arranged on the antenna base plate 51, a screw rod positioned at the working end of the length direction adjusting motor 53 is connected with a nut seat arranged on the length direction adjusting plate 52, a width direction adjusting motor 54 and a traction motor 55 are arranged on the length direction adjusting plate 52, a width direction adjusting plate 56 is also connected to the length direction adjusting plate 52 in a sliding manner, a screw rod positioned at the working end of the width direction adjusting motor 54 is connected with a nut seat arranged on the width direction adjusting plate 56, a plurality of suction nozzles are arranged on the width direction adjusting plate 56, a traction pressure roller 57 is arranged at the working end of the traction motor 55, and a driven roller rotatably supported on the antenna base plate 51 is arranged below the traction pressure roller 57, the traction pressure roller 57 and the driven roller can drive the strip antenna 58 to move, the suction nozzle is positioned below the strip antenna 58, the antenna driving and adjusting mechanism further comprises an industrial camera 59, and a lens of the industrial camera 59 is aligned with the bonding station D of the strip antenna 58.
Compared with the prior art, the invention has the following advantages:
the die bonder for the electronic tag packaging machine in the structural form has the advantages of simple structure, ingenious design and reasonable layout, and is designed to be a special structure aiming at various problems of sudden leakage of the traditional die bonder in the working process.
Firstly, through the improvement of a dispensing valve nozzle, a positioning camera can directly concentrate a focus at a dispensing position, so that the dispensing condition can be accurately detected without adjusting the positioning camera no matter which specification of electronic tag is packaged;
secondly, a vertical turnover mechanism and a horizontal turnover mechanism with special structures are arranged in the die bonding part of the die bonding machine, the two mechanisms are matched to act, so that the chips on the wafer can be quickly and accurately transferred to the bonding position, accurate bonding is realized, the whole action process is smooth and reliable, the working efficiency is high,
meanwhile, after the traditional die bonder works for a period of time, certain position deviation of the strip antenna may occur, and aiming at the problem, the device is provided with a set of strip antenna adjusting mechanism which can automatically adjust the relative position of the strip antenna after the position deviation is found, so that the position precision of bonding is ensured on the premise of not influencing the production efficiency.
In conclusion, the die bonding device has multiple advantages, is particularly suitable for popularization and application in the field, and has a very wide market prospect.
Drawings
FIG. 1 is a front view of an embodiment of the present invention.
Fig. 2 is a schematic perspective view of a dispensing portion according to an embodiment of the invention.
FIG. 3 is a schematic perspective view of a die bonding portion according to an embodiment of the present invention.
Fig. 4 is a partially enlarged view of fig. 3.
FIG. 5 is a front view of a die bonding portion in an embodiment of the present invention.
FIG. 6 is a top view of a wafer adjustment platform in accordance with an embodiment of the present invention.
Fig. 7 is a front view of a chip lift mechanism in an embodiment of the present invention.
Fig. 8 is a top view of an antenna drive adjustment mechanism in an embodiment of the present invention.
FIG. 9 is a front view of a vertical canting mechanism and a horizontal canting mechanism in an embodiment of the invention.
Fig. 10 is a schematic structural view of the horizontal turnover mechanism in the embodiment of the present invention.
Fig. 11 is a front view of a portion of a vertically flipped cam mechanism in an embodiment of the invention.
Detailed Description
The following description will explain embodiments of the present invention with reference to the accompanying drawings. As shown in fig. 1 to 11: a die bonder for an electronic tag packaging machine comprises a frame 1 serving as a base, a die bonding part 2 is arranged in the middle of the frame 1, a dispensing part 3 is arranged in the material feeding direction of the die bonding part 2, a traction part 4 is arranged in the material discharging direction of the die bonding part 3, a dispensing roller 5 is arranged in the dispensing part 3, a dispensing head is arranged above the dispensing roller 5, the dispensing head consists of a dispensing valve 6 and a nozzle 7 which are mutually communicated, the length ratio of the dispensing valve 6 to the nozzle 7 is 105:15.5, a positioning camera 8 and an illuminating lamp 9 are further arranged in the dispensing part 3, the focus of the positioning camera 8 and a dispensing position right below the dispensing head are arranged,
the die bonding part 2 comprises a wafer adjusting platform, a vertical turnover mechanism, a horizontal turnover mechanism, an antenna driving adjusting mechanism and a chip jacking mechanism matched with the wafer adjusting platform,
the wafer adjusting platform comprises a bottom plate 10 fixedly arranged on a frame 1, the bottom plate 10 is connected with a Y-axis supporting plate 12 in a sliding way through a pair of Y-axis sliding rails 11, one end of the bottom plate 10 is provided with a Y-axis motor 13, a working end of the Y-axis motor 13 is provided with a Y-axis lead screw 14, the Y-axis lead screw 14 is in threaded connection with a nut seat arranged on the bottom end face of the Y-axis supporting plate 12, the Y-axis supporting plate 12 is connected with an X-axis supporting plate 16 in a sliding way through a pair of X-axis sliding rails 15, one end of the Y-axis supporting plate 12 is provided with an X-axis motor 17, a working end of the X-axis motor is provided with an X-axis lead screw 18, the X-axis lead screw is in threaded connection with a nut seat arranged on the bottom end face of the X-axis supporting plate 16, and a wafer clamp 19 is also arranged on the top end face of the X-axis supporting plate 16,
the chip jacking mechanism is positioned below the wafer adjusting platform and comprises a jacking mechanism support 20 directly connected with the machine frame 1, the bottom end face of the jacking mechanism support 20 is in sliding connection with a jacking mechanism Y-axis support plate 22 through a pair of jacking mechanism Y-axis slide rails 21, a Y-axis adjusting screw 23 is rotatably supported on the jacking mechanism support 20, the Y-axis adjusting screw 23 is in mutual contact with the jacking mechanism Y-axis support plate 22, the bottom end face of the jacking mechanism Y-axis support plate 22 is in sliding connection with the jacking mechanism X-axis support plate 25 through a pair of jacking mechanism X-axis slide rails 24, an X-axis adjusting screw 26 is rotatably supported on the jacking mechanism Y-axis support plate 22, the X-axis adjusting screw 26 is in mutual contact with the jacking mechanism X-axis support plate 25, and tension springs 27 are respectively arranged between the jacking mechanism support 20 and the jacking mechanism Y-axis support plate 22 and between the jacking mechanism Y-axis support plate 22 and the jacking mechanism X-axis support plate 20, the jacking mechanism X-axis supporting plate 25 is also fixedly connected with a jacking motor bracket 28, a jacking motor 29 is arranged on the jacking motor bracket 28, the working end of the jacking motor 29 is connected with a jacking lead screw 30, the jacking lead screw 30 is in threaded connection with a jacking rod supporting plate 31, a jacking rod 32 is arranged on the jacking rod supporting plate 31,
the vertical turnover mechanism comprises a DD motor 33 fixedly supported on the frame 1, the working end of the DD motor 33 is connected with a vertical turntable 34, the rotating shaft of the vertical turntable 34 is horizontally distributed, four first suction head sliding rails 35 which are uniformly distributed in the circumferential direction and are arranged along the radial direction of the vertical turntable 34 are arranged on the vertical turntable 34, a first suction head sliding rail 36 is connected on the first suction head sliding rail 35 in a sliding manner, a first suction head 37 and a first driven roller 38 are arranged on the first suction head sliding rail 36, a suction head return spring is arranged between the vertical turntable 34 and the first suction head sliding rail 36, a vertical turnover cam mechanism matched with the feeding level A of the vertical turnover mechanism is further arranged on the frame 1, the vertical turnover cam mechanism comprises a first cam motor 40, and a first cam 41 is arranged at the working end of the first cam motor 40, a vertical turnover slide rail which is longitudinally distributed is arranged on the machine frame 1, a follow-up block 42 is connected on the vertical turnover slide rail in a sliding way, a groove 43 which is matched with the first cam 41 is arranged on the follow-up block 42, the bottom end of the follow-up block 42 is matched with the first driven roller 38 on the first suction head slide frame 36 positioned at the material loading position A,
the horizontal turnover mechanism also comprises a DD motor 33 fixedly supported on the frame 1, the working end of the DD motor 33 is connected with a horizontal turntable 44, the rotating shafts of the horizontal turntable 44 are longitudinally distributed, four second sucker slide rails 45 which are uniformly and longitudinally distributed in the circumferential direction are arranged on the horizontal turntable 44, a second sucker carriage 46 is slidably connected on the second sucker slide rails 45, a second sucker 47 and a second driven roller 48 are arranged on the second sucker carriage 46, a sucker return spring is arranged between the horizontal turntable 44 and the second sucker carriage 46, a pair of horizontal turnover cam mechanisms are further arranged on the frame 1, the two horizontal turnover cam mechanisms are respectively matched with the feeding position B and the discharging position C of the horizontal turnover mechanism, each horizontal turnover cam mechanism comprises a second cam motor 49, and a second cam 50 is arranged on the working end of the second cam motor 49, the second cam 50 is an end cam, and the cam end of the second cam 50 is matched with the second driven roller 48 on the second nozzle carriage 46 at the loading position B or the discharging position C,
the antenna driving and adjusting mechanism comprises an antenna base plate 51 connected to the frame 1, a length direction adjusting plate 52 is connected to the antenna base plate 51 in a sliding manner, a length direction adjusting motor 53 is arranged on the antenna base plate 51, a screw rod positioned at the working end of the length direction adjusting motor 53 is connected with a nut seat arranged on the length direction adjusting plate 52, a width direction adjusting motor 54 and a traction motor 55 are arranged on the length direction adjusting plate 52, a width direction adjusting plate 56 is also connected to the length direction adjusting plate 52 in a sliding manner, a screw rod positioned at the working end of the width direction adjusting motor 54 is connected with a nut seat arranged on the width direction adjusting plate 56, a plurality of suction nozzles are arranged on the width direction adjusting plate 56, a traction pressure roller 57 is arranged at the working end of the traction motor 55, and a driven roller rotatably supported on the antenna base plate 51 is arranged below the traction pressure roller 57, the traction pressure roller 57 and the driven roller can drive the strip antenna 58 to move, the suction nozzle is positioned below the strip antenna 58, the antenna driving and adjusting mechanism further comprises an industrial camera 59, a lens of the industrial camera 59 is aligned with a bonding station D of the strip antenna 58, and the bonding station D is positioned right below the discharging position C.
The working process of the die bonder for the electronic tag packaging machine in the embodiment of the invention is as follows: a strip antenna 58 to be subjected to a die bonding operation is attached to the pulling portion 4, and under the action of the pulling portion 4, the strip antenna 58 can move in the dispensing portion 3 and the die bonding portion 2,
the strip-shaped antenna 58 advances on the dispensing roller 5, the traction part 4 stops working every time the strip-shaped antenna advances by a unit distance, at the moment, a dispensing head descends, and adhesive glue is coated on the strip-shaped antenna 58, in the process, the positioning camera 8 can acquire picture information of the position of the adhesive glue, and if the position of the adhesive glue on the strip-shaped antenna 58 is found to have deviation, a signal is sent to a control system to remind an operator of timely processing; because the dispensing valve 6 and the nozzle 7 in the dispensing head have special length ratio, and the length of the nozzle 7 is longer than that of the traditional dispensing head, the relatively thick dispensing valve 6 does not block the sight of the positioning camera 8 in the dispensing process, so that the focus of the positioning camera 8 can be directly aligned to the dispensing position; the dispensing position is fixed no matter which specification of electronic tag is, so that the dispensing part does not need to adjust or switch the positioning camera 8 when packaging electronic tags of different specifications, a large amount of labor can be saved, and the working efficiency is prevented from being influenced;
when the die bonding part 2 works, a wafer (a plurality of chips distributed in an array manner are arranged on the wafer) is clamped on the wafer clamp 19 in advance, the wafer adjusting platform drives the wafer to move in the horizontal direction, a target chip is moved to a loading position A in the vertical turnover mechanism, after the wafer is moved in place, the control system controls the chip jacking mechanism to jack the current chip upwards, the vertical turnover cam mechanism works at the same time, the first suction head sliding frame 36 which moves to the loading position A is driven to move downwards, the upward jacking of the chip and the opposite matching action of the first suction head 37 can enable the current chip to be in contact with the first suction head 37, and the chip is adsorbed on the first suction head 37;
after a first chip in the chip array is taken away, the wafer adjusting platform drives the wafer to move in the horizontal direction, and drives a second chip to move to the upper material level A, and so on, until all chips in one wafer are taken away, in the operation process, the video monitoring system matched with the device can always detect the number of the remaining chips, and after the chips are found to be taken away completely, the video monitoring system can send a signal to the control system, and the control system can remind an operator to replace a new wafer in time;
after the vertical turnover mechanism takes a first chip, the vertical rotary disc 34 on the vertical turnover mechanism rotates 90 degrees under the drive of the DD motor 33 connected with the vertical turnover mechanism, and after a next first sucker 37 takes a second chip, the vertical rotary disc 34 rotates 90 degrees again, namely the vertical rotary disc 34 rotates 90 degrees every time, and the sucked chips are gradually conveyed to a loading position B from a loading position A;
the horizontal turnover cam mechanism at the loading level B works to drive a second sucker carriage 46 in the horizontal turnover mechanism to move downwards, and a second sucker 47 on the second sucker carriage 46 can suck the chip moving to the loading level B (the corresponding first sucker 37 stops sucking) so that the chip is transferred from the vertical turnover mechanism to the horizontal turnover mechanism; after the above actions are finished, the horizontal turntable 44 is driven by the DD motor 33 connected thereto to rotate 90 degrees, and after the next second suction head 47 takes a second chip, the horizontal turntable 44 rotates 90 degrees again, that is, the horizontal turntable 44 rotates 90 degrees each time, and the taken chip is gradually transported from the loading position B to the discharging position C; the horizontal turnover cam mechanism positioned at the discharging position C works to drive the second suction head 47 which is provided with the chip to move downwards, and the chip moves downwards from the discharging position C to the bonding station D right below the chip;
after the chip contacts with the strip antenna 58 at the bonding station D, the second suction head 47 stops the suction action, and the chip is bonded on a specific position of the strip antenna 58 because the strip antenna 58 at the bonding station D is coated with the bonding glue;
the industrial camera 59 shoots the bonded chip, sends the acquired picture information to the control system, and the control system automatically compares the acquired picture with the picture of the standard bonding position, if the bonding position is found to meet the precision requirement, the device normally works, otherwise, warning information is sent;
all the actuating mechanisms in the device work in a matching mode according to the steps, and finally the working process of gluing specific positions on the strip-shaped antenna 58, conveying chips on the wafer to the discharging position C from the feeding position A one by one and finally bonding the chips to the gluing positions on the strip-shaped antenna 58 is achieved.
Before each bonding operation, the industrial camera 59 shoots the bonding position, namely the control system corrects the bonding position in each bonding operation, and if the bonding position is found to have deviation, the industrial camera controls the action of the antenna driving mechanism adjusting mechanism to finely adjust the specific position of the strip-shaped antenna 58 on the plane space;
the suction nozzle located below the strip antenna 58 works to suck the strip antenna 58, then the length direction adjusting motor 53 drives the screw rod to rotate, the length direction adjusting plate 52 can be driven to displace along the length direction of the strip antenna 58, the width direction adjusting motor 54 drives the screw rod to rotate, the width direction adjusting plate 56 can be driven to displace along the width direction of the strip antenna 56, the traction compression roller 57 and the driven roller which drive the strip antenna 58 to move can displace on the X axis and the Y axis in the movement process, meanwhile, the suction nozzle can also drive the strip antenna 58 to displace, and the specific position of the strip antenna 58 can be adjusted by the mode, so that the strip antenna can return to the standard position; after the bonding operation is finished, air is not supplied to the suction nozzle, the traction mechanism drives the strip antenna 58 to move for a unit distance, the industrial camera 59 shoots the bonding position at the time, and the control system judges the bonding position again, namely, the bonding operation can be carried out after the control system judges each time;
the working process of the wafer adjusting platform is as follows: when the Y-axis motor 13 works, the Y-axis lead screw 14 can drive the Y-axis support plate 12 to displace along the Y-axis direction, and when the X-axis motor 17 works, the X-axis lead screw 18 can drive the X-axis support plate 16 to displace along the X-axis direction, so that the wafer clamp 19 connected to the X-axis support plate 16 can drive the wafer to be accurately adjusted in the X-axis direction and the Y-axis direction;
the working process of the chip jacking mechanism is as follows: an operator adjusts the Y-axis adjusting screw 23 and the X-axis adjusting screw 26 in advance, the specific positions of the X-axis supporting plate 25 and the jacking motor support 28 in space can be adjusted in such a way to ensure that the jacking rod 32 is positioned right below the loading position A, after the adjustment is finished, the control system can control the chip jacking mechanism to act in coordination with the action of the wafer adjusting platform, the jacking motor 29 works to drive the jacking screw 30 to rotate, and then the jacking rod supporting plate 31 in threaded connection with the jacking screw 30 is driven to move longitudinally, and finally the longitudinal movement of the jacking rod 32 connected to the jacking rod supporting plate 31 is realized;
the working process of the vertical turnover mechanism is as follows: the DD motor 33 drives the vertical turntable 34 to rotate step by step (rotate by 90 degrees each time), the vertical turnover cam mechanism located at the loading position a works, the first cam motor 40 drives the first cam 41 to rotate at a constant speed, in the rotating process, the first cam 41 drives the follower block 42 to make a reciprocating linear motion through the groove 43, the motion of the follower block 42 drives the first suction head carriage 36 to move along the first suction head slide rail 35, so as to realize the longitudinal motion of the first suction head 37, it should be noted that after the first suction head carriage 36 moves downward, when the cam part of the first cam 41 rotates away, the first suction head carriage 36 returns to the initial position again under the action of the suction head return spring;
the working process of the horizontal turnover mechanism is similar to that of the vertical turnover mechanism, and the difference lies in that the horizontal turntable 44 rotates in the horizontal plane direction, two horizontal turnover cam mechanisms are provided for driving the second suction head 47 to move longitudinally, the two horizontal turnover cam mechanisms are respectively matched with the feeding position B and the discharging position C, the horizontal turnover cam mechanisms can drive the second hair washing carriage 46 moving to the positions to move longitudinally, the second suction head 47 cooperates with other actuating mechanisms to act, the chip is taken down from the vertical turnover mechanism and is conveyed to the discharging position C from the feeding position B, and finally the chip is bonded on the ribbon antenna 58 at the bonding position D.

Claims (1)

1. The utility model provides an electronic tags packaging machine is with solid brilliant device, includes frame (1), the middle part of frame (1) is provided with solid brilliant part (2), is provided with some glue part (3) in the supplied materials direction of solid brilliant part (2), is provided with traction part (4), its characterized in that in the ejection of compact direction of solid brilliant part (3): a dispensing roller (5) is arranged in the dispensing part (3), a dispensing head is arranged above the dispensing roller (5), the dispensing head consists of a dispensing valve (6) and a nozzle (7) which are communicated with each other, the length ratio between the dispensing valve (6) and the nozzle (7) is 105:15.5, a positioning camera (8) and a lighting lamp (9) are also arranged in the dispensing part (3), the focus of the positioning camera (8) and a dispensing position right below the dispensing head are arranged,
the die bonding part (2) comprises a wafer adjusting platform, a vertical turnover mechanism, a horizontal turnover mechanism, an antenna driving adjusting mechanism and a chip jacking mechanism matched with the wafer adjusting platform,
the wafer adjusting platform comprises a bottom plate (10) fixedly arranged on a rack (1), the bottom plate (10) is connected with a Y-axis supporting plate (12) in a sliding mode through a pair of Y-axis sliding rails (11), a Y-axis motor (13) is arranged at one end of the bottom plate (10), a Y-axis lead screw (14) is arranged at the working end of the Y-axis motor (13), the Y-axis lead screw (14) is connected with a nut seat arranged on the bottom end face of the Y-axis supporting plate (12) in a threaded mode, the Y-axis supporting plate (12) is connected with an X-axis supporting plate (16) in a sliding mode through a pair of X-axis sliding rails (15), an X-axis motor (17) is arranged at one end of the Y-axis supporting plate (12), an X-axis lead screw (18) is arranged at the working end of the X-axis motor, the X-axis lead screw is connected with a nut seat arranged on the bottom end face of the X-axis supporting plate (16) in a threaded mode, and a wafer clamp (19) is further arranged on the top end face of the X-axis supporting plate (16),
the chip jacking mechanism is positioned below the wafer adjusting platform and comprises a jacking mechanism support (20) directly connected with the rack (1), the bottom end face of the jacking mechanism support (20) is in sliding connection with a jacking mechanism Y-axis support plate (22) through a pair of jacking mechanism Y-axis slide rails (21), a Y-axis adjusting screw rod (23) is rotatably supported on the jacking mechanism support (20), the Y-axis adjusting screw rod (23) is in mutual contact with the jacking mechanism Y-axis support plate (22), the bottom end face of the jacking mechanism Y-axis support plate (22) is in sliding connection with a jacking mechanism X-axis support plate (25) through a pair of jacking mechanism X-axis slide rails (24), an X-axis adjusting screw rod (26) is rotatably supported on the jacking mechanism Y-axis support plate (22), and the X-axis adjusting screw rod (26) is in mutual contact with the jacking mechanism X-axis support plate (25), tensioning springs (27) are respectively arranged between the jacking mechanism support (20) and the jacking mechanism Y-axis support plate (22) and between the jacking mechanism Y-axis support plate (22) and the jacking mechanism X-axis support plate (20), the jacking mechanism X-axis support plate (25) is also fixedly connected with a jacking motor support (28), a jacking motor (29) is arranged on the jacking motor support (28), the working end of the jacking motor (29) is connected with a jacking lead screw (30), the jacking lead screw (30) is in threaded connection with a jacking rod support plate (31), a jacking rod (32) is arranged on the jacking rod support plate (31),
the vertical turnover mechanism comprises a DD motor (33) fixedly supported on a rack (1), the working end of the DD motor (33) is connected with a vertical turntable (34), the rotating shafts of the vertical turntable (34) are horizontally distributed, four first suction head sliding rails (35) which are uniformly distributed in the circumferential direction and radially arranged along the vertical turntable (34) are arranged on the vertical turntable (34), a first suction head sliding frame (36) is connected on the first suction head sliding rails (35) in a sliding manner, a first suction head (37) and a first driven roller (38) are arranged on the first suction head sliding frame (36), a suction head return spring is also arranged between the vertical turntable (34) and the first suction head sliding frame (36), a vertical turnover cam mechanism matched with the feeding level A of the vertical turnover mechanism is also arranged on the rack (1), and the vertical turnover cam mechanism comprises a first cam motor (40), a first cam (41) is arranged at the working end of the first cam motor (40), vertical turnover slide rails which are longitudinally distributed are arranged on the rack (1), a follow-up block (42) is connected to the vertical turnover slide rails in a sliding manner, a groove (43) which is matched with the first cam (41) is arranged on the follow-up block (42), the bottom end of the follow-up block (42) is matched with a first driven roller (38) on a first suction head sliding frame (36) at an upper material level A,
the horizontal turnover mechanism also comprises a DD motor (33) fixedly supported on the rack (1), the working end of the DD motor (33) is connected with a horizontal turntable (44), the rotating shafts of the horizontal turntable (44) are longitudinally distributed, four second sucker slide rails (45) which are uniformly distributed and longitudinally distributed in the circumferential direction are arranged on the horizontal turntable (44), a second sucker carriage (46) is connected on the second sucker slide rails (45) in a sliding manner, a second sucker (47) and a second driven roller (48) are arranged on the second sucker carriage (46), a sucker reset spring is also arranged between the horizontal turntable (44) and the second sucker carriage (46), a pair of horizontal turnover cam mechanisms are also arranged on the rack (1), and the two horizontal turnover cam mechanisms are respectively matched with the feeding position B and the discharging position C of the horizontal turnover mechanism, the horizontal overturning cam mechanism comprises a second cam motor (49), a second cam (50) is arranged at the working end of the second cam motor (49), the second cam (50) is an end face cam, the cam end face of the second cam (50) is matched with a second driven roller (48) on a second sucker carriage (46) positioned at a feeding position B or a discharging position C,
the antenna driving and adjusting mechanism comprises an antenna bottom plate (51) connected to a rack (1), a length direction adjusting plate (52) is connected to the antenna bottom plate (51) in a sliding manner, a length direction adjusting motor (53) is arranged on the antenna bottom plate (51), a screw rod positioned on the working end of the length direction adjusting motor (53) is connected with a nut seat arranged on the length direction adjusting plate (52), a width direction adjusting motor (54) and a traction motor (55) are arranged on the length direction adjusting plate (52), meanwhile, a width direction adjusting plate (56) is also connected to the length direction adjusting plate (52) in a sliding manner, the screw rod positioned on the working end of the width direction adjusting motor (54) is connected with the nut seat arranged on the width direction adjusting plate (56), a plurality of suction nozzles are arranged on the width direction adjusting plate (56), a traction compression roller (57) is arranged on the working end of the traction motor (55), the antenna driving and adjusting mechanism is characterized in that a driven roller rotatably supported on the antenna base plate (51) is arranged below the traction compression roller (57), the traction compression roller (57) and the driven roller can drive the strip antenna (58) to move forward, the suction nozzle is located below the strip antenna (58), the antenna driving and adjusting mechanism further comprises an industrial camera (59), and a lens of the industrial camera (59) is aligned to a bonding station D of the strip antenna (58).
CN202210377614.6A 2022-04-12 2022-04-12 Solid brilliant device of electronic tags packaging machine Pending CN114632673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210377614.6A CN114632673A (en) 2022-04-12 2022-04-12 Solid brilliant device of electronic tags packaging machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210377614.6A CN114632673A (en) 2022-04-12 2022-04-12 Solid brilliant device of electronic tags packaging machine

Publications (1)

Publication Number Publication Date
CN114632673A true CN114632673A (en) 2022-06-17

Family

ID=81952628

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210377614.6A Pending CN114632673A (en) 2022-04-12 2022-04-12 Solid brilliant device of electronic tags packaging machine

Country Status (1)

Country Link
CN (1) CN114632673A (en)

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