CN114631883A - Laser appearance that moults - Google Patents

Abstract

The application provides a laser appearance that moults, it includes: the laser assembly comprises a laser chip, and the laser chip is used for emitting laser; a heat dissipation assembly, comprising: the laser chip is fixedly connected to one side of the chip fixing seat; the semiconductor refrigerating piece is provided with a refrigerating surface and a heating surface, and the refrigerating surface is fixedly connected with the other side of the chip fixing seat; the heating surface of the first radiator is fixedly connected with the first radiator; the utility model provides a laser appearance that moults can realize multistage heat dissipation, adopt the semiconductor refrigeration piece to dispel the heat to laser chip earlier, adopt first radiator to dispel the heat to the semiconductor refrigeration piece again, multistage radiating mode like this, can realize maintaining laser chip's operating temperature below the room temperature, make laser chip can keep the best luminous state, guarantee laser chip's photoelectric conversion efficiency, and then guarantee this laser appearance that moults's the effect that moults, also can prolong laser chip's service life to a certain extent.

Description

Laser appearance that moults

Technical Field

The application relates to the technical field of medical equipment, in particular to a household laser depilation instrument.

Background

The traditional household laser depilation instrument uses a side-emitting semiconductor laser, the light emitting direction of the side-emitting semiconductor laser is emitted along the surface of a laser substrate, the photoelectric conversion rate of the laser is low and is generally 10%; the working temperature of the laser is 35 ℃ or below, and when the temperature exceeds 35 ℃, the photoelectric conversion rate of the laser is lower and the laser is easier to burn; some laser appearance that moults adopts the semiconductor refrigeration piece to dispel the heat, but the semiconductor refrigeration piece is used for dispelling the heat for skin, prevents when laser irradiation skin, and the temperature of skin is too high, and the semiconductor refrigeration piece is not used for giving the heat dissipation of laser instrument, and like this, the position temperature of the inside laser instrument of appearance that moults is still too high, still can have laser instrument operating temperature too high, and the photoelectric conversion rate that leads to is low, and laser instrument burns out scheduling problem even.

Disclosure of Invention

The utility model provides a laser appearance that moults can realize giving the laser chip heat dissipation, can guarantee the photoelectric conversion rate of laser chip and the effect that laser moults, and the laser of mouling of this application moults the appearance.

Therefore, the embodiment of the application provides a laser depilation instrument, which comprises a laser component and a heat dissipation component, wherein the heat dissipation component comprises a chip fixing seat, a semiconductor refrigeration sheet and a first radiator, the laser component comprises a laser chip for emitting laser, and the laser chip is fixedly connected to one side of the chip fixing seat; the semiconductor refrigeration piece is provided with a refrigeration surface and a heating surface, the refrigeration surface is fixedly connected with the other side of the chip fixing seat, and the heating surface is fixedly connected with the first radiator.

The application provides a laser appearance that moults, compares with prior art, and its beneficial effect lies in:

the laser chip can emit laser which acts on the hair follicle on the skin to kill the hair follicle so as to realize permanent depilation; the laser chip can generate heat when emitting laser, the heat can be transmitted to the chip fixing seat and further transmitted to the refrigerating surface of the semiconductor refrigerating piece, and the heat can be well absorbed and can not be gathered on the chip fixing seat and the laser chip due to the large temperature difference between the refrigerating surface and the chip fixing seat, so that the heat can be well dissipated to the laser chip, the temperature of the laser chip when emitting the laser can be maintained below the room temperature, the photoelectric conversion efficiency of the laser chip can be ensured, and the laser chip can not be burnt due to overhigh temperature; the heating surface of the semiconductor refrigerating sheet is connected with the first radiator, and the first radiator can radiate heat to the semiconductor refrigerating sheet so as to ensure that the temperature of the semiconductor refrigerating sheet is not too high and the semiconductor refrigerating sheet can normally work and cool the laser chip; the utility model provides a laser appearance that moults can realize multistage heat dissipation, adopt the semiconductor refrigeration piece to dispel the heat to laser chip earlier, adopt first radiator to dispel the heat to the semiconductor refrigeration piece again, multistage radiating mode like this, can realize maintaining laser chip's operating temperature below the room temperature, make laser chip can keep the best luminous state, guarantee laser chip's photoelectric conversion efficiency, and then guarantee this laser appearance that moults's the effect that moults, also can prolong laser chip's service life to a certain extent.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts. In addition, in the drawings, like parts are denoted by like reference numerals, and the drawings are not drawn to actual scale.

FIG. 1 is a schematic structural diagram of a laser hair removal device according to an embodiment of the present application;

fig. 2 is a schematic structural view of a first housing and a second housing of the laser hair removal device of the present application;

FIG. 3 is a schematic view of the air outlet of the laser hair removal device of the present application;

FIG. 4 is a schematic view of the laser epilator shown in FIG. 1 from another perspective;

FIG. 5 is an exploded view of the laser epilator of the present application;

FIG. 6 is a schematic view of a first heat sink of the laser epilator of the present application;

FIG. 7 is a schematic illustration of the relative position between a first heat pipe and a second heat pipe of the present application;

FIG. 8 is a schematic view of a second heat sink of the present application;

description of reference numerals:

1. a laser assembly; 11. a laser chip; 12. a skin sensing member; 121. a light outlet; 13. a lens; 14. An insulating pad; 15. a silica gel ring; 16. a heat-insulating pad; 2. a heat dissipating component; 21. a chip fixing seat; 22. a semiconductor refrigeration sheet; 221. refrigerating noodles; 222. heating surface; 223. a temperature probe; 23. a first heat sink; 231. a first heat dissipation plate; 2311. a first side surface; 2312. a second side surface; 232. a heat dissipation grid; 233. A first heat pipe; 234. a second heat pipe; 235. a second heat dissipation plate; 236. heat conducting cotton; 24. a second heat sink; 241. a heat-dissipating fan; 2411. a first edge; 2412. a second edge; 2413. a third edge; 3. a housing; 31. an air inlet; 32. an opening; 33. a baffle plate; 34. guiding wind; 35. an air outlet; 36. An air guide inclined plane; 37. a first housing; 38. a second housing; 39. a third housing; 4. a control component; 41. A control circuit board; 5. a gear adjusting button; 6. and (4) switching.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1-8, the present application proposes a laser epilation apparatus comprising a laser assembly 1 and a heat dissipation assembly 2; the laser component 1 comprises a laser chip 11, and the laser chip 11 is used for emitting laser; the heat radiation module 2 includes: the laser chip comprises a chip fixing seat 21, a semiconductor refrigerating sheet 22 and a first radiator 23, wherein a laser chip 11 is fixedly connected to one side of the chip fixing seat 21; the semiconductor refrigeration piece 22 is provided with a refrigeration surface 221 and a heating surface 222, and the refrigeration surface 221 is fixedly connected with the other side of the chip fixing seat 21; the heat generating surface 222 is fixedly connected to the first heat sink 23.

Based on the technical scheme, the laser chip 11 can emit laser which acts on hair follicles on the skin to kill the hair follicles so as to realize permanent depilation; when the laser chip 11 emits laser, heat is generated and is transmitted to the chip fixing seat 21 and further transmitted to the refrigerating surface 221 of the semiconductor refrigerating sheet 22, and because the temperature difference between the refrigerating surface 221 and the chip fixing seat 21 is large, the heat can be well absorbed and cannot be gathered on the chip fixing seat 21 and the laser chip 11, the heat can be well dissipated to the laser chip 11, the temperature of the laser chip 11 when emitting laser can be maintained below room temperature, so that the photoelectric conversion efficiency of the laser chip 11 is ensured, and the laser chip 11 cannot be burnt due to overhigh temperature; the heating surface 222 of the semiconductor refrigeration piece 22 is connected with the first radiator 23, and the first radiator 23 can radiate heat to the semiconductor refrigeration piece 22 so as to ensure that the temperature of the semiconductor refrigeration piece 22 is not too high, ensure that the semiconductor refrigeration piece can normally work and cool the laser chip 11; the laser appearance that moults can realize multistage heat dissipation, adopt semiconductor refrigeration piece 22 to dispel the heat to laser chip 11 earlier, adopt first radiator 23 to dispel the heat to semiconductor refrigeration piece 22 again, multistage radiating mode like this, can realize maintaining laser chip 11's operating temperature below the room temperature, make laser chip 11 can keep the best luminous state, guarantee laser chip 11's photoelectric conversion efficiency, and then guarantee this laser appearance that moults's the effect that moults, also can prolong laser chip 11's service life to a certain extent.

The laser chip 11 of the application comprises a VCSEL laser chip 11, wherein the VCSEL laser chip 11 emits laser rays with wavelength of 808nm, heat of 150 joules to 180 joules can be generated in 15s, the laser can directly irradiate on skin, skin pricking cannot be caused, hair follicles can be killed, and the hair removal effect is ensured; in the present application, the photoelectric conversion efficiency of the VCSEL laser chip 11 is as high as 35%, and no other stray light is generated. In addition, when the VCSEL laser chip 11 emits laser, the optimal environment temperature is 10-15 ℃, the semiconductor refrigerating sheet 22 can provide a 10-15 ℃ working environment for the laser chip 11 so as to ensure that the VCSEL laser chip 11 can work in the state of the highest photoelectric conversion rate, and when the environment temperature is 35 ℃ or above, the VCSEL laser chip 11 does not work, so that the stability of the VCSEL laser chip 11 is ensured, and the VCSEL laser chip is prevented from being burnt.

As shown in fig. 6, in some embodiments, the semiconductor chilling plate 22 further has a temperature probe 223, the temperature probe 223 is connected to the chip holder 21, in the present application, the laser chip 11 is attached to the chip holder 21, the contact area between the laser chip 11 and the chip holder 21 is very large, the heat transfer between the laser chip 11 and the chip holder 21 can be well realized, therefore, the temperature of the laser chip 11 is the same as the temperature of the chip holder 21, the temperature probe 223 is connected to the chip holder 21, the real-time temperature of the chip holder 21 can be obtained, namely, the real-time temperature of the laser chip 11 can be obtained, so that whether the laser chip 11 needs to be cooled or not can be judged according to the real-time temperature of the laser chip 11, controlling the heat dissipation time of the laser chip 11 according to the real-time temperature of the laser chip 11; in particular, the present application further comprises a control assembly 4, wherein the control assembly 4 comprises a control circuit board 41, the control circuit board 41 is electrically connected with the semiconductor chilling plate 22,

under normal conditions, namely in the working process, the refrigerating plate works all the time, and when the laser emits light continuously or in a pulse mode, the temperature of the laser can be controlled to be 10-15 ℃, and meanwhile the effect of skin icing can be achieved.

If the laser is started and does not emit light, the temperature of the laser is lower than 10 ℃, and in order to prevent the laser from being frozen and damaged and reduce the light emitting efficiency and the heat dissipation efficiency, the refrigeration piece stops working only when the temperature is lower than 10 DEG

In an abnormal situation: when the temperature of laser instrument was higher than 35 degrees, belonged to unusual protection, only closed the laser instrument, can not close the refrigeration piece, the laser instrument rapid cooling of being convenient for prevents the laser damage.

The temperature probe 223223 detects that the real-time temperature of the laser chip 11 is within 10-15 ℃, the control circuit board 41 can control the semiconductor refrigeration piece 22 to be opened, the refrigeration power of the semiconductor refrigeration piece 22 is equal to the actual heat production power of the laser chip 11, the real-time heat production of the laser chip 11 is equal to the real-time refrigeration quantity of the semiconductor refrigeration piece 22, and the laser chip 11 transmits the heat production to the refrigeration surface 221 of the semiconductor refrigeration piece 22 and is absorbed by the refrigeration surface 221, so that the balance between the heat production and the refrigeration between the laser chip 11 and the semiconductor refrigeration piece 22 can be realized, and the real-time temperature of the laser chip 11 can be maintained between 10-15 ℃; when the temperature of laser chip 11 was less than 10 ℃, 41 limit control semiconductor refrigeration pieces 22 of control circuit board were closed, like this, laser chip 11 can make its self temperature be higher than 10 ℃ gradually because the light-emitting heat production, and laser chip 11 is under 10 ℃ of working environment for a long time, can reduce its life, and its light-emitting efficiency can reduce. When the temperature of the laser chip 11 is higher than 35 ℃, which is an abnormal condition, the control circuit board 41 controls the laser chip 11 to be closed, and controls the semiconductor refrigeration piece 22 to dissipate heat and cool the laser chip 11.

The opening and closing of the semiconductor refrigeration piece 22 and the opening time of the semiconductor refrigeration piece 22 can be controlled according to the real-time temperature of the laser chip 11 obtained by the temperature probe 223, so as to ensure the most suitable heat dissipation of the laser chip 11, for example, when the real-time temperature of the laser chip 11 is between 10 ℃ and 15 ℃, the control circuit board 41 can control the semiconductor refrigeration piece 22 to be closed, so that the semiconductor refrigeration piece 22 stops the heat dissipation of the laser chip 11, when the real-time temperature of the laser chip 11 is 15 ℃ or above, the control circuit board 41 can control the semiconductor refrigeration piece 22 to be opened, so as to dissipate the heat of the laser chip 11, therefore, when the depilating instrument is used in summer, the semiconductor refrigeration piece 22 can control the temperature of the laser chip 11 below the room temperature.

In some embodiments, the material of the chip fixing base 21 is at least one of silver, copper and aluminum, the silver, copper and aluminum are metals with good thermal conductivity, wherein the silver has the best thermal conductivity, the copper is centered, and the aluminum is inferior, the chip fixing base 21 made of the metals such as silver, copper and aluminum has very small thermal resistance with the laser chip 11, so that the heat of the laser chip 11 can be well transferred to the cooling surface 221 of the semiconductor cooling plate 22, and the heat cannot be accumulated on the contact surface between the chip fixing base 21 and the laser chip 11, so as to ensure that the semiconductor cooling plate 22 can well dissipate heat of the laser chip 11; in addition, chip fixing base 21 can fix laser chip 11 well, and this application adopts screw installation or welded mode to be fixed in laser chip 11 on chip fixing base 21 to avoid because the collision leads to laser chip 11 to compare in chip fixing base 21's positional deviation, causes this laser appearance of mouling can not normally the light-emitting. Specifically, the chip holder 21 is preferably made of red copper, which has a heat conductivity second to that of silver, and has good ductility, so that the chip holder can be processed into various shapes, and the red copper can be made into a desired shape according to actual needs, so as to fix the laser chip 11 well.

As shown in fig. 6-7, in some embodiments, the first heat sink 23 includes a first heat sink 231 and a heat dissipation grid 232, a first side 2311 of the first heat sink 231 is fixedly connected to the heat generating surface 222, the heat dissipation grid 232 is fixedly connected to a second side 2312 of the first heat sink 231, one surface of the semiconductor chilling plate 22 can cool and accordingly generate heat, the first heat sink 231 is fixedly connected to the heat generating surface 222 of the semiconductor chilling plate 22 and can exchange heat with the heat generating surface 222, the heat of the heat generating surface 222 is transferred to the first heat sink 231, and the heat dissipation grid 232 is fixedly connected to the second side 2312 of the first heat sink 231, so that the first heat sink 231 can transfer the heat to the heat dissipation grid 232, since the heat dissipation grid 232 has a plurality of heat dissipation fins arranged at intervals, the contact area between the heat dissipation grid 232 and the air is large, the heat can be uniformly dispersed on each heat dissipation fin, the radiating fins are transmitted to the air; in the present application, the semiconductor cooling fins 22 are attached to the first heat sink 231, that is, the heat generating surface 222 is in surface contact with the first side surface 2311 of the first heat sink 231, and the heat resistance between the heat generating surface 222 and the first side surface 2311 of the first heat sink 231 is small, so that heat transfer can be performed well; the heat dissipation grid 232 is connected to the first heat dissipation plate 231, and one end of each of the plurality of heat dissipation fins is connected to the second side surface 2312 of the first heat dissipation plate 231, so that the heat of the first heat dissipation plate 231 can be uniformly transferred to each heat dissipation plate, and the heat dissipation effect can be guaranteed.

In the present application, the semiconductor cooling plate 22 is attached to the first heat dissipating plate 231, the chip fixing base 21 is attached to the cooling surface 221 of the semiconductor cooling plate 22, which is equivalent to the chip fixing base 21 being attached to the first heat dissipating plate 231, and the laser chip 11 is attached to the chip fixing base 21, which is equivalent to the laser chip 11 being attached to the first heat dissipating plate 231, so that the arrangement effectively utilizes the limited space in the depilating device, and can ensure that the laser chip 11 can be well heat dissipated.

Further, the first heat dissipation plate 231 and/or the heat dissipation grid 232 are made of silver, red copper and aluminum, preferably, the first heat dissipation plate 231 is made of red copper, and the heat dissipation grid 232 is made of aluminum, so that the first heat dissipation plate 231 can exchange heat with the semiconductor refrigeration sheet 22 well, the heat of the heating surface 222 of the semiconductor refrigeration sheet 22 is transferred to the heat dissipation grid 232, the heat dissipation grid 232 mainly exchanges heat with air, the air takes away the heat, the thermal resistance between the heat dissipation grid 232 and the air is large, but the heat can be transferred to the air from the heat dissipation grid 232 quickly due to the large contact area between the heat dissipation grid 232 and the air, and the requirement on the heat conduction capability of the heat dissipation grid 232 does not need to be too high; and based on the cost and the later stage production of product, select the material of heat dissipation grid 232 as the aluminum product is most suitable, can guarantee when the radiating effect, the manufacturing cost of guaranteeing the product is unlikely to too high.

In some embodiments, the first heat sink 23 further comprises a first heat pipe 233 and a second heat pipe 234; the heat absorbing end of the first heat pipe 233 and the heat absorbing end of the second heat pipe 234 are connected to the second side 2312 of the first heat sink 231 and are inserted into the end of the heat sink 232; the condensation end of the first heat pipe 233 and the condensation end of the second heat pipe 234 are inserted into the heat dissipation grid 232, the heat absorption end of the first heat pipe 233 and the heat absorption end of the second heat pipe 234 can absorb the heat of the second side surface 2312 of the first heat dissipation plate 231 and transfer the heat to the respective condensation ends thereof, and in the process of heat transfer, the heat can be gradually diffused into the heat dissipation plates and then transferred to the air by the heat dissipation plates, so that the first heat pipe 233 and the second heat pipe 234 can accelerate the heat dissipation of the first heat dissipation plate 231, the heat dissipation of the heating surface 222 of the semiconductor chip 22 is accelerated, the semiconductor chip 22 can be ensured to be cooled rapidly, and the semiconductor refrigeration chip 22 can be kept working normally.

In some embodiments, the first heat sink 23 includes two first heat pipes 233, the second heat pipe 234 is located between the two first heat pipes 233, the two first heat pipes 233 and the one second heat pipe 234 can ensure the heat dissipation effect of the first heat dissipation plate 231, and can well transfer the heat of the first heat dissipation plate 231 to the heat dissipation grid 232, and the two first heat pipes 233 and the one second heat pipe 234 contact with the air, and can also transfer the heat of the first heat dissipation plate 231 to the air, so as to accelerate the heat dissipation of the first heat dissipation plate; further, the first heat pipe 233 and the second heat pipe 234 each include a U-shaped pipe, the arrangement directions of the first heat pipe 233 and the second heat pipe 234 are opposite, the arrangement direction of the heat absorption end of the first heat pipe 233 on the second side 2312 of the first heat dissipation plate 231 is opposite to the arrangement direction of the heat absorption end of the second heat pipe 234 on the second side 2312 of the first heat dissipation plate 231, and the penetrating direction of the condensation end of the first heat pipe 233 in the heat dissipation grid 232 is opposite to the penetrating direction of the condensation end of the second heat pipe 234 in the heat dissipation grid 232, so that an annular heat transfer structure can be formed between the first heat pipe 233 and the second heat pipe 234, the heat of the first heat dissipation plate 231 can be uniformly transferred to the heat dissipation grid 232, and the heat can be exchanged with air through the gap between the two heat dissipation fins, so as to further ensure the heat dissipation effect of the first heat sink 23; in addition, the arrangement mode can also save the internal space of the depilating instrument, reduce the overall dimension of the depilating instrument and facilitate the placement of the depilating instrument in daily life.

The first heat pipe 233 and the second heat pipe 234 of the present application can be selected from known structures, and the specific operation principle thereof will not be described herein.

As shown in fig. 8, in some embodiments, the heat dissipation assembly 2 further includes a second heat sink 24, the second heat sink 24 is disposed on one side of the heat dissipation grid 232 for further dissipating heat from the heat dissipation grid 232 and accelerating heat exchange between the heat dissipation grid 232 and air; the laser chip is cooled by the semiconductor refrigeration sheet 22, the first radiator 23 radiates the laser chip 22, the second radiator 24 radiates the heat dissipation grating 232, which can be regarded as radiating the first radiator 23, therefore, the laser chip is effectively cooled by gradually transferring the heat of the laser chip 11 to the air by adopting a three-stage radiation mode, the semiconductor refrigeration sheet 22 can maintain the working environment temperature of the laser chip 11 within 10-15 ℃ so as to ensure that the laser chip 11 can work under the working condition of the highest photoelectric conversion rate, the first radiator 23 mainly cools the laser chip 22 by contact and air cooling, the second radiator 24 mainly cools the first radiator 23 by air cooling, and thus, the radiation of the laser chip 11 is simplified step by step, unnecessary energy loss can be saved and the laser chip 11 is given the most effective heat dissipation.

In some embodiments, the second heat sink 24 includes a heat dissipation fan 241, the heat dissipation fan 241 having a first edge 2411, a second edge 2412, and a third edge 2413, the second edge 2412 and the third edge 2413 being disposed opposite to each other; the first edge 2411 is hermetically connected to the first heat sink 231; the second edge 2412 and the third edge 2413 are respectively connected to two opposite edges of the heat dissipation grille 232 in a sealing manner, and the heat dissipation fan 241 can accelerate the air flow inside the heat dissipation grille 232 to accelerate the air to carry away the heat in the heat dissipation grille 232, so that the heat is not accumulated and stayed in the heat dissipation grille 232, thereby ensuring the heat dissipation effect of the first heat sink 23; in addition, the first edge 2411 of the heat dissipation fan 241 is hermetically connected with the first heat dissipation plate 231, and the second edge 2412 and the third edge 2413 are correspondingly hermetically connected with two opposite edges of the heat dissipation grid 232, so that air can only enter from an impeller inside the heat dissipation fan 241, but cannot enter from the edge where the heat dissipation fan 241 is in contact with the first heat dissipation plate 231 and the edge where the heat dissipation fan 241 is in contact with the heat dissipation grid 232, and thus the air is always blown to the heat dissipation grid 232 by the heat dissipation fan 241 and takes heat away, so that the heat dissipation effect is ensured; in this application, can be at the edge that radiator fan 241 and first heating panel 231 contacted, and at the edge that radiator fan 241 and radiator grid 232 contacted, adopt interference fit or the mode of sealing washer, realize the sealed of the edge that radiator fan 241 and first heating panel 231 contacted, and realize the edge that radiator fan 241 and radiator grid 232 contacted, the sealing washer can be silica gel pad etc. or adopt glue to pack up the edge that radiator fan 241 and first heating panel 231 contacted, and pack up the edge that radiator fan 241 and radiator grid 232 contacted.

As shown in fig. 1 to 5, in particular, the present application further includes a housing 3, the housing 3 is provided with an air inlet 31, the air inlet 31 corresponds to an impeller of the heat dissipation fan 241, the impeller of the heat dissipation fan 241 rotates to form a negative pressure at the air inlet 31, so that air can be sucked into the air inlet 31, and the air passes through the impeller and contacts with the heat dissipation grid 232 to take away heat of the heat dissipation grid 232.

Further, the housing 3 is provided with an opening 32, and the opening 32 is recessed toward the inside of the housing 3; a baffle 33 is arranged on the outer shell 3 and at the position of the opening 32, the baffle 33 and the wall part of the outer shell 3 at the position of the opening 32 jointly form an air inlet 31, the projection of the baffle 33 along the direction of the opening 32 can cover the opening 32, and the baffle 33 and the wall part of the outer shell 3 at the position of the opening 32 jointly form the air inlet 31, so that the shape of the air inlet 31 is annular, air can uniformly enter from the air inlet 31, and then uniformly diffuse to contact with the heat dissipation grid 232 and take away the heat of the heat dissipation grid 232; the opening 32 is recessed toward the inside of the housing 3, so that a wind guiding slope 34 is naturally formed on the wall of the housing 3 at the opening 32, when air enters the air inlet 31, the air is conducted through the wind guiding slope 34, so that the air can orderly enter the inside of the housing 3, when the wind power of the cooling fan 241 is adjusted to strong wind, the air can still uniformly enter the inside of the housing 3 from the air inlet 31 and uniformly spread to contact each fin of the cooling grid 232 without hurry passing through the surface of some fins, thereby ensuring the air cooling effect of the cooling fan 241.

The outer shell 3 is also provided with an air outlet 35, the outer shell 3 is provided with an air guide inclined plane 36 with one end connected with the air outlet 35, the other end of the air guide inclined plane 36 is connected with the radiating grid 232, and air can come out of the air outlet 35 after exchanging heat with the radiating grid 232; an air guide inclined plane 36 is arranged between the air outlet 35 and the heat dissipation grating 232, so that air passing through the heat dissipation grating 232 can be well conducted out, and the air is prevented from rotating at the air outlet 35 and not coming out of the air outlet 35 to influence the heat dissipation of the heat dissipation grating 232; the air outlet 35 includes a plurality of air holes with small inner diameters, which can ensure smooth air passage and prevent dust or particles from entering the inside of the housing 3.

The air inlet 31 is opened at a position corresponding to the impeller of the heat dissipating fan 241, and the air outlet 35 is opened at a position corresponding to the heat dissipating grill 232, so that the flow path of the air is: the air inlet 31, the impeller of the cooling fan 241, the cooling grid 232 and the air outlet 35 do not pass through the semiconductor cooling plate 22, the chip fixing seat 21 and other components, thus, the cooling grid 232 is ensured to be cooled, and meanwhile, the cooling grid is not contacted with the semiconductor cooling plate 22, the chip fixing seat 21 and other components, thus, some small-particle dust in the air is not contacted or even attached to the semiconductor cooling plate 22, the chip fixing seat 21 and other components, and to a certain extent, the stability of circuits of the semiconductor cooling plate 22, the chip fixing seat 21 and other components can be ensured, and accidents caused by dust covering can be avoided.

As shown in fig. 5, in the present application, the housing 3 includes a first casing 37, a second casing 38 and a third casing 39, the first casing 37 is provided with an air inlet 31, the second casing 38 is provided with an air outlet 35, the first casing 37, the second casing 38 and the third casing 39 together form a cavity structure for mounting the laser assembly 1 and the heat dissipation assembly 2, the third casing 39 is provided with a slot for passing the skin sensing element 12, a silicone ring 15 is disposed between the slot and the skin sensing element 12 for sealing, and a thermal pad 16 is disposed between the third casing 39 and the skin sensing element 12 for isolating heat transfer between the third casing 39 and the skin sensing element 12, preventing external heat from being transferred to the skin sensing element 12, and further isolating heat transfer between the chip fixing base 21 and the outside. The thermal pad 16 is made of cotton.

In some embodiments, the laser assembly 1 further comprises a skin sensing member 12 and a lens 13; the skin sensing piece 12 is provided with a light outlet 121, and the lens 13 is connected with the light outlet 121; the skin sensing piece 12 is fixedly connected with the chip fixing seat 21, the skin sensing piece 12 is covered on the periphery of the laser chip 11, the laser chip 11 emits laser, and the laser is emitted from the light outlet 121 and is transmitted to the skin through the lens 13 so as to kill hair follicles of the skin and realize permanent hair removal; skin response piece 12, laser chip 11 all are connected with control circuit board 41 electricity, whether skin response piece 12 can detect light-emitting port 121 and aim at is people's skin, if when people's skin, control circuit board 41 just can control laser chip 11 and launch laser, if detect light-emitting port 121 and aim at not people's skin, like people's hair, eyes etc., control circuit board 41 just controls laser chip 11 and does not work, in order to prevent the maloperation, prevent that laser from shining eyes, cause the injury to eyes.

In this application, lens 13 adopts the sapphire material, and sapphire lens 13 can see through laser well, and when laser passed lens 13, the heat of laser can distribute on lens 13's surface very evenly to conduct away through lens 13, can not pile up, stop on lens 13, consequently, lens 13's temperature does not have too obvious change, when unhairing, lens 13 is close to the skin, can paste the skin even, and can not arouse the discomfort of skin.

Preferably, the laser assembly 1 further includes an isolation pad 14, the isolation pad 14 has a through hole, the isolation pad 14 is disposed between the skin sensing element 12 and the chip fixing seat 21, and the laser chip 11 passes through the through hole, the isolation pad 14 can isolate the heat transfer between the skin sensing element 12 and the chip fixing seat 21, and the heat of the skin sensing element 12 is rarely transferred to the chip fixing seat 21, that is, rarely transferred to the laser chip 11, so that the semiconductor refrigeration piece 22 can only dissipate and cool the laser chip 11, and the skin sensing element 12 is not cooled, so as to reduce the refrigeration consumption of the semiconductor refrigeration piece 22, and control the temperature of the laser chip 11 between 10 ℃ and 15 ℃; the insulating mat 14 of the present application comprises insulating cotton, silicone; in addition, when the laser chip 11 emits laser, electromagnetic waves are generated, and the isolation pad 14 can shield the electromagnetic waves to prevent the electromagnetic waves from interfering with the skin sensing member 12, so as to ensure that the skin sensing member 12 can accurately acquire skin information; the isolation pad 14 can also seal the skin sensing part 12 and the chip fixing seat 21, when the depilating device is used in a low-temperature environment, the chip fixing seat 21 generates heat and heats air to form water mist, the isolation pad 14 seals the skin sensing part 12 and the chip fixing seat 21 to prevent the water mist from entering and contacting the laser chip 11, and when the water mist is irradiated by laser, huge heat can be generated to possibly burn the laser chip 11; the isolating cotton can also isolate the circuit conduction between the skin sensing piece 12 and the chip fixing seat 21.

Further, the lens 13 is hermetically connected with the skin sensing element 12, and the lens 13 and the skin sensing element 12 need to be sealed to prevent dust and water vapor from entering the light outlet 121 through a gap between the lens 13 and the skin sensing element 12, so that when the laser chip 11 irradiates black dust or water vapor, huge heat is generated, the temperature of the laser chip 11 is rapidly increased, and the laser chip 11 may be burned; this application optional use adopts silica gel circle 15 to seal between lens 13 and skin response piece 12, and like this, laser chip 11's operational environment is totally enclosed to, can guarantee the stability of laser chip 11's work.

In some embodiments, the present application further includes a control component 4, where the control component 4 includes a control circuit board 41, and the control circuit board 41 is electrically connected to the laser component 1 and the heat sink component 2; the control circuit board 41 can control the on-off of the laser chip 11 and control the semiconductor refrigeration piece 22 to dissipate heat of the laser chip 11; specifically, the control circuit board 41 includes a gear control area and a heat dissipation control area; the gear control area is used for being electrically connected with the laser chip 11; the heat dissipation control area is used for being electrically connected with the semiconductor refrigeration sheet 22; the heat dissipation control area is set with the optimal environment temperature of the laser chip 11 during working, and when the real-time temperature value detected by the temperature probe 223 is within the optimal environment temperature, the heat dissipation control area controls the semiconductor refrigeration piece 22 not to work; when the real-time temperature value detected by the temperature probe 223 is greater than or equal to 35 ℃, the heat dissipation control area sends the temperature information detected by the temperature probe 223 to the gear control area, the gear control area controls the laser chip 11 not to work, the optimal environment temperature when the laser chip 11 works is 10-15 ℃, in the temperature interval, the photoelectric conversion rate of the laser chip 11 can reach 35%, the working power of the semiconductor refrigeration piece 22 is 50w, the laser chip 11 can be rapidly cooled, when the real-time temperature of the laser chip 11 detected by the temperature probe 223 of the semiconductor refrigeration piece 22 is 10-15 ℃, the heat dissipation control area controls the semiconductor refrigeration piece 22 to be closed so as to prevent the real-time temperature of the laser chip 11 from being below 10 ℃, some energy loss is saved, and then, when the real-time temperature of the laser chip 11 is 15-35 ℃ due to continuous laser emission, the heat dissipation control area controls the semiconductor refrigeration piece 22 to be opened so as to carry out heat dissipation and cooling on the laser chip 11, the temperature of the laser chip 11 is maintained between 10 ℃ and 15 ℃, namely, the semiconductor refrigeration piece 22 is controlled by the heat dissipation control area to be repeatedly opened and closed in a circulating manner so as to cool the laser chip 11, the real-time temperature of the laser chip 11 during working is controlled between 10 ℃ and 15 ℃, and the energy loss is saved as much as possible while the photoelectric conversion efficiency of the laser chip 11 is ensured; when the real-time temperature of the laser chip 11 is greater than or equal to 35 ℃, the gear control area controls the laser chip 11 to be closed, and meanwhile, the semiconductor refrigeration piece 22 cools the laser chip 11 to prevent the laser chip 11 from being burnt.

Specifically, the depilating device further comprises a gear adjusting button 5 and a switch 6 which are electrically connected with the control circuit board 41, the switch 6 is used for starting and stopping the depilating device, the gear adjusting button 5 is used for adjusting the gear of the depilating device, the depilating device of the application is provided with 5 gears which are respectively 0 gear, 1 gear, 2 gear, 3 gear and 4 gear, the gears are controlled by a gear control area, the laser chip 11 in the 0 gear state does not work, the 1 gear, 2 gear, 3 gear and 4 gear are controlled by the gear adjusting button 5, when the gears are 1 gear, the laser emitted by the laser chip 11 is continuous laser with lower energy, when the gears are 2 gear, 3 gear or 4 gear, the laser emitted by the laser chip 11 is single-point type and discontinuous laser, but the energy of the laser rises step by step, and the depilating effect also rises step by step, thus, the depilating device of the application can meet the requirements of different customers, and a proper working gear is selected to ensure the depilation effect and reduce the pricking feeling of the client when the client is irradiated by laser as far as possible.

In some embodiments, the first heat sink 23 further includes a second heat dissipation plate 235, the second heat dissipation plate 235 is connected to the control circuit board 41 for dissipating heat from the control circuit board 41, the control circuit board 41 generates some heat, which is also required to be conducted, one side of the second heat dissipation plate 235 is connected to the control circuit board 41, and the other side of the second heat dissipation plate 235 is connected to the heat dissipation grid 232 for transferring the heat between the control circuit boards 41 to the heat dissipation grid 232 and to the air through the heat dissipation grid 232; the second heat dissipation plate 235 of the present application is also made of red copper; specifically, the second heat dissipation plate 235 is in surface contact with the heat dissipation grid 232 for heat transfer, the first heat pipe 233 may pass through the second heat dissipation plate 235 and penetrate into the heat dissipation grid 232, the second heat dissipation plate 235 may also perform heat transfer with the first heat pipe 233, and the heat of the first heat pipe 233 is transferred to the heat dissipation grid 232 by the second heat dissipation plate 235; a flexible insulating material such as a heat conductive cotton 236 is further disposed between the second heat dissipation plate 235 and the control circuit board 41 to prevent current conduction between the control circuit board 41 and the second heat dissipation plate 235, thereby preventing the control circuit board 41 from short-circuiting and ensuring the safety of the control circuit board 41.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

It should be readily understood that "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest sense such that "on … …" means not only "directly on something", but also includes the meaning of "on something" with intervening features or layers therebetween, and "above … …" or "above … …" includes not only the meaning of "above something" or "above" but also includes the meaning of "above something" or "above" with no intervening features or layers therebetween (i.e., directly on something).

Furthermore, spatially relative terms, such as "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or feature's illustrated relationship to another element or feature. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (20)

1. The laser hair removal instrument is characterized by comprising a laser assembly and a heat dissipation assembly, wherein the heat dissipation assembly comprises a chip fixing seat, a semiconductor refrigeration piece and a first heat radiator, and the laser hair removal instrument is characterized in that:

the laser assembly comprises a laser chip for emitting laser, and the laser chip is fixedly connected to one side of the chip fixing seat;

the semiconductor refrigeration piece is provided with a refrigeration surface and a heating surface, the refrigeration surface is fixedly connected with the other side of the chip fixing seat, and the heating surface is fixedly connected with the first radiator.

2. The laser hair removal device of claim 1, wherein the semiconductor cooling plate further comprises a temperature probe, and the temperature probe is connected to the chip holder.

3. The laser hair removal device as claimed in claim 1, wherein the chip holder is made of at least one of silver, copper and aluminum.

4. The laser hair removal device of claim 1, wherein the first heat sink includes a first heat dissipation plate and a heat dissipation grid, a first side of the first heat dissipation plate is fixedly connected to the heat generating surface, and the heat dissipation grid is fixedly connected to a second side of the first heat dissipation plate.

5. The laser hair removal device of claim 4, wherein the first heat dissipation plate and/or the heat dissipation grid is made of at least one of silver, purple copper and aluminum.

6. The laser epilation apparatus according to claim 4, wherein the first heat sink further comprises a first heat pipe and a second heat pipe;

the heat absorption end of the first heat pipe and the heat absorption end of the second heat pipe are both connected with the second side face of the first heat dissipation plate and are inserted into the end part of the heat dissipation grid;

and the condensation end of the first heat pipe and the condensation end of the second heat pipe are inserted in the radiating grids in a penetrating manner.

7. The laser epilator as claimed in claim 6, wherein the first heat sink comprises two first heat pipes, the second heat pipe being located between the two first heat pipes.

8. The laser hair removal device of claim 6, wherein the first heat pipe and the second heat pipe each comprise a U-shaped pipe, and the first heat pipe and the second heat pipe are arranged in opposite directions.

9. The laser hair removal apparatus of claim 4, wherein the heat dissipation assembly further comprises a second heat sink disposed on one side of the heat dissipation grid.

10. The laser epilator as claimed in claim 9, wherein the second heat sink comprises a heat dissipating fan having a first edge, a second edge and a third edge, the second edge and the third edge being oppositely disposed;

the first edge is hermetically connected with the first heat dissipation plate;

the second edge and the third edge are respectively connected with two opposite edges of the heat dissipation grid in a sealing mode.

11. The laser hair removal device of claim 10, further comprising a housing, wherein the housing has an air inlet, and the air inlet corresponds to the impeller of the heat dissipation fan.

12. The laser hair removal instrument of claim 11, wherein the housing has an opening therein, the opening being recessed toward an interior of the housing;

the shell is provided with a baffle at the position of the opening, and the baffle and the wall part of the shell at the opening form the air inlet together.

13. The laser hair removal device as claimed in claim 11, wherein the housing further comprises an air outlet, the housing further comprises an air guiding inclined plane having one end connected to the air outlet, and the other end of the air guiding inclined plane is connected to the heat dissipation grid.

14. The laser hair removal device of claim 1, wherein the laser assembly further comprises a skin sensing member and a lens;

the skin sensing piece is provided with a light outlet, and the lens is connected with the light outlet;

the skin sensing piece is fixedly connected with the chip fixing seat and is covered on the periphery of the laser chip.

15. The laser hair removal device of claim 14, wherein the laser assembly further comprises a spacer having a through hole, the spacer being disposed between the skin sensor and the chip holder and allowing the laser chip to pass through the through hole.

16. The laser hair removal instrument of claim 15, wherein the lens and the skin sensing member are sealingly connected.

17. The laser epilator as claimed in claim 1, wherein the laser chip comprises a VCSEL laser chip.

18. The laser epilation apparatus in accordance with claim 2, further comprising a control assembly including a control circuit board electrically connected to the laser assembly and to the heat dissipation assembly.

19. The laser hair removal instrument of claim 18, wherein the control circuit board includes a gear control area and a heat dissipation control area;

the gear control area is used for being electrically connected with the laser chip;

the heat dissipation control area is used for being electrically connected with the semiconductor refrigerating sheet;

the heat dissipation control area is set with the optimal environment temperature of the laser chip during working, and when the real-time temperature value detected by the temperature probe is within the optimal environment temperature, the heat dissipation control area controls the semiconductor refrigerating sheet to not work; when the real-time temperature value detected by the temperature probe is greater than or equal to 35 ℃, the heat dissipation control area sends the temperature information detected by the temperature probe to the gear control area, and the gear control area controls the laser chip to be out of work.

20. The laser epilator as claimed in claim 18, wherein the first heat sink further comprises a second heat sink plate for dissipating heat from the control circuit board.

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