CN114630502B - Combined type variable-diameter spray head circuit board chemical etching equipment - Google Patents
Combined type variable-diameter spray head circuit board chemical etching equipment Download PDFInfo
- Publication number
- CN114630502B CN114630502B CN202210527502.4A CN202210527502A CN114630502B CN 114630502 B CN114630502 B CN 114630502B CN 202210527502 A CN202210527502 A CN 202210527502A CN 114630502 B CN114630502 B CN 114630502B
- Authority
- CN
- China
- Prior art keywords
- etching
- pipe
- head
- tail
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003486 chemical etching Methods 0.000 title claims abstract description 19
- 239000007921 spray Substances 0.000 title description 4
- 238000005530 etching Methods 0.000 claims abstract description 312
- 239000007788 liquid Substances 0.000 claims abstract description 154
- 239000000725 suspension Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 51
- 239000002699 waste material Substances 0.000 claims description 25
- 210000001503 joint Anatomy 0.000 claims description 23
- 210000000078 claw Anatomy 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 13
- 238000005260 corrosion Methods 0.000 description 13
- 230000007797 corrosion Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention relates to a combined variable-diameter nozzle circuit board chemical etching device, which belongs to the technical field of circuit board etching and comprises a base, wherein a vacuum suction table is arranged on the base, a liquid supply component and a vertical frame are arranged on the side edge of the base, a three-dimensional traction device is arranged at the suspension end of the vertical frame, the three-dimensional traction device comprises a mounting frame, an etching device is arranged on the mounting frame, the etching device comprises an etching head group, an adjusting mechanism and a pipeline net group, the pipeline net group is used for communicating the etching head group with the liquid supply component, the output end of the etching head group is in a circular shape, the adjusting mechanism is used for adjusting the aperture of the output end of the etching head group, the etching head group comprises etching heads, the etching heads are provided with a plurality of groups, the etching heads positioned at the top are head etching heads, the etching heads positioned at the bottom are tail etching heads, the etching heads positioned between the head etching heads and the tail etching heads are middle etching heads, the first etching head and the tail etching head are only provided with one group, and the middle etching head is provided with at least one group.
Description
Technical Field
The invention relates to the technical field of circuit board etching, in particular to a combined type circuit board chemical etching device with a variable-diameter spray head.
Background
Before the circuit board is put into production, a sample needs to be manufactured and subjected to performance test, and the circuit board can be put into production after being confirmed to be correct.
In the prior art, a chemical agent corrosion method is mainly used for manufacturing the circuit board, a displacement reaction principle between chemical corrosive liquid and copper is utilized, the copper foil without an anti-corrosion layer is corroded, if a sample is manufactured by the method, the number of the samples is generally small, the chemical corrosive liquid needs to be poured and destroyed after the sample is manufactured, resources are wasted, and therefore the chemical corrosion method is suitable for manufacturing the circuit board in batches and is not suitable for manufacturing the sample.
Disclosure of Invention
In order to solve the problems mentioned in the background, the invention provides a combined type variable-diameter spray head circuit board chemical etching device.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.
A combined type variable-diameter nozzle circuit board chemical etching device comprises a base, wherein a vacuum suction table is arranged on the base, a liquid supply assembly and a vertical frame are arranged on the side edge of the base, a three-dimensional traction device is arranged at the suspension end of the vertical frame, the three-dimensional traction device comprises a mounting frame, and an etching device is mounted on the mounting frame;
the three-dimensional traction device is used for driving the etching device to move along a preset track according to a preset program, and the liquid supply assembly is used for providing chemical corrosive liquid for the etching device;
the etching device comprises an etching head group, an adjusting mechanism and a pipeline network group, wherein the pipeline network group is used for communicating the etching head group with the liquid supply assembly, the output end of the etching head group is in a circular shape, and the adjusting mechanism is used for adjusting the aperture of the output end of the etching head group;
the etching head group comprises etching heads, the etching heads are provided with a plurality of groups of etching heads, the etching head positioned on the uppermost part is a head etching head, the etching head positioned on the lowermost part is a tail etching head, the etching head positioned between the head etching head and the tail etching head is a middle etching head, the head etching head and the tail etching head are only provided with one group, and the middle etching head is provided with at least one group.
Furthermore, the tail etching head comprises a tail etching pipe vertically and fixedly installed on the installation frame, a tail joint is coaxially and threadedly arranged on an upper pipe orifice of the tail etching pipe, a joint nozzle b is arranged on the side surface of the tail joint, and a joint groove a penetrating through the height of the tail etching pipe and communicated with an inner cavity of the tail joint is formed in the inner wall of the tail etching pipe;
the upper closed end of the tail joint is also coaxially provided with a tail sliding hole, and the aperture of the tail sliding hole is consistent with the inner diameter of the tail etching pipe.
Further, a guide rod is vertically arranged on the mounting rack;
the middle etching head comprises a middle etching pipe which is vertically arranged, an external step b coaxially extends around the upper pipe opening of the middle etching pipe, the upper end of the external step b is coaxially provided with a middle connector, the lower opening end of the middle connector is coaxially in threaded connection with the upper end of the external step b, the upper closed end of the middle connector is coaxially provided with a middle slide hole, and the aperture of the middle slide hole is consistent with the inner diameter of the middle etching pipe;
the side surface of the middle joint is provided with a nozzle c and a lug c, and the lug c is connected with the guide rod in a sliding manner;
the inner wall of the middle etching pipe is provided with a connecting groove b which penetrates through the height of the middle etching pipe and is communicated with the inner cavity of the middle joint.
Further, the first etching head comprises first etching pipes which are vertically arranged, external steps a coaxially extend around the upper pipe opening of each first etching pipe, a first connector is coaxially arranged at the upper end of each external step a, and the lower opening end of each first connector is coaxially in threaded connection with the upper end of each external step a;
the side surface of the head joint is provided with a nozzle a and a lug a, and the lug a is connected with the guide rod in a sliding manner;
the inner wall of the first etching pipe is provided with a connecting hole penetrating through the wall thickness of the first etching pipe, and the connecting hole is close to a lower pipe opening of the first etching pipe.
Further, in the initial state, between the tail etching head and the adjacent middle etching head: the aperture of the tail sliding hole is consistent with the outer diameter of the middle etching pipe, the middle etching pipe is coaxially sleeved in the tail etching pipe in a sliding mode, and the upper closed end of the tail joint supports the external step b;
in the initial state, between the etching heads in two adjacent groups: the inner diameter of a middle etching pipe in the middle etching head positioned below is consistent with the outer diameter of a middle etching pipe in the middle etching head positioned above, the middle etching pipe in the middle etching head positioned above is coaxially sleeved in the middle etching pipe in the middle etching head positioned below in a sliding manner, and the upper closed end of a middle joint in the middle etching head positioned below supports an external step b in the middle etching head positioned above;
in the initial state, between the first etching head and the adjacent middle etching head: the outer diameter of the first etching pipe is consistent with the inner diameter of the middle etching pipe, the first etching pipe is coaxially sleeved in the middle etching pipe in a sliding mode, the upper closed end of the middle joint supports the external step a, and the connecting hole is communicated with the connecting groove b;
in the initial state, the lower pipe openings of the first etching pipes, the lower pipe openings of the middle etching pipes in all the middle etching heads and the lower pipe openings of the tail etching pipes are flush.
Further, the pipeline network group comprises a main pipeline, a liquid inlet branch pipe and a liquid discharge branch pipe;
the main liquid inlet pipe is provided with a first connector and a second connector, one end of the liquid inlet branch pipe is communicated with the second connector, and the other end of the liquid inlet branch pipe is communicated with the connector a;
the liquid discharge main pipe is provided with a third connecting nozzle and a fourth connecting nozzle, one end of the liquid discharge branch pipe is communicated with the third connecting nozzle, the other end of the liquid discharge branch pipe is communicated with a connecting nozzle c in the middle etching head or a connecting nozzle b in the tail etching head, and a plurality of groups of the connecting nozzles are arranged corresponding to the middle etching head and the tail etching head.
Further, the liquid supply assembly comprises a liquid storage tank and a water pump, and two groups of areas which are not communicated with each other are arranged in the liquid storage tank: new liquid district and waste liquid district, the water pump is provided with two sets ofly: a water pump a and a water pump b;
a first connecting pipe for communicating the liquid inlet end of the water pump a with the new liquid area is arranged between the liquid inlet end of the water pump a and the new liquid area, a second connecting pipe for communicating the liquid outlet end of the water pump a with the first connecting nozzle is arranged between the liquid outlet end of the water pump a and the first connecting nozzle, and a flow valve a is arranged on the second connecting pipe;
a third connecting pipe for communicating the liquid inlet end of the water pump b with the fourth connecting nozzle is arranged between the liquid inlet end of the water pump b and the fourth connecting pipe, a fourth connecting pipe for communicating the liquid outlet end of the water pump b with the waste liquid area is arranged between the liquid outlet end of the water pump b and the waste liquid area, and a flow valve b is arranged on the third connecting pipe.
Further, the adjusting mechanism comprises a motor frame fixedly installed on the installation frame, a first motor is installed on the motor frame, the output end of the first motor faces downwards vertically and is coaxially provided with a first screw rod, and the outer thread of the first screw rod is provided with a nut;
the mounting frame is further provided with a first sliding rail which is vertically arranged, an upright post is arranged in the first sliding rail in a sliding mode, and the upright post is fixed with the screw.
Furthermore, a second slide rail horizontally arranged is arranged at the top of the upright post, a slide seat is slidably sleeved outside the second slide rail, connecting rods vertically extend downwards from two sides of the slide seat, and lifting claws are arranged at the bottoms of the connecting rods;
and a second motor is installed on the sliding seat, the axial direction of an output shaft of the second motor is parallel to the extending direction of the second sliding rail, a second lead screw is coaxially arranged at the output end of the second motor, and the second lead screw is in threaded connection with the second sliding rail.
Furthermore, the top of the guide rod is connected with the motor frame, and a spring positioned between the first etching head and the motor frame is sleeved outside the guide rod.
Compared with the prior art, the invention has the beneficial effects that:
1. in the scheme, the copper foil is subjected to replacement corrosion by adopting the continuously flowing chemical corrosive liquid, and the corrosive liquid continuously flows, so that waste liquid with reduced concentration after replacement with the copper can be discharged in time, namely, the corrosive liquid in contact with the copper foil is a new corrosive liquid with constant concentration, the replacement reaction efficiency is greatly accelerated, and the proofing time is further shortened;
2. in the scheme, the amount of the corrosive liquid consumed by proofing is matched with the area of a to-be-corroded area of the circuit board sample, so that the resource utilization is high;
3. in the scheme, a newly designed sample can be sampled at the sampling position only by resetting a new preset program, namely, the use is flexible, and circuit board samples with different design requirements can be sampled by one machine;
4. in this scheme, the bottom opening of etching head group is circular shape, and can adjust opening aperture size, when large tracts of land region corrodes, increase the bottom opening aperture of etching head group, when the small area orbit corrodes, it is comparatively nimble to reduce the bottom opening aperture of etching head group, in addition, because the bottom opening of etching head group is circular shape, so the bottom opening aperture of etching head group is adjusted the back, can put into use, if the bottom of etching head group is the rectangle, rhombus and other shapes, then open area changes the back, still need adjust open-ended position, with the shape requirement that adapts to the corrosion zone, one process has been added, the proofing time has been increased, and this scheme compares with it, one process is few, the proofing time has been shortened.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a three-dimensional drawing apparatus, an etching apparatus, and a liquid supply assembly;
FIG. 3 is a schematic structural view of a three-dimensional traction device;
FIG. 4 is a first schematic structural diagram of an etching apparatus;
FIG. 5 is a second schematic structural view of an etching apparatus;
FIG. 6 is a schematic structural view of an adjustment mechanism;
FIG. 7 is an exploded view of the adjustment mechanism;
FIG. 8 is a schematic view of the structure of the etching head set and the pipe network set;
FIG. 9 is a schematic view of the main duct;
FIG. 10 is a cross-sectional view of the etching head set from a front view;
FIG. 11 is a cross-sectional view of the leading etch head;
FIG. 12 is a cross-sectional view of a middle etch head;
FIG. 13 is a cross-sectional view of the trailing etch head;
FIG. 14 is a first cross-sectional view of the etching head set in a three-dimensional state;
fig. 15 is a second cross-sectional view of the etching head set in a three-dimensional state.
The reference numbers in the figures are:
100. a base; 101. a vacuum suction table; 102. erecting a frame;
200. a three-dimensional traction device; 210. a linear module a; 220. a linear module b; 230. a linear module c; 240. a mounting frame;
300. an etching device;
310. etching head group; 311. a guide bar; 312. a spring; 313. firstly etching the head; 3131. a first joint; 3132. a lug a; 3133. a nozzle a; 3134. firstly, etching a tube; 3135. an external step a; 3136. connecting holes; 314. etching the tail to etch the head; 3141. a tail joint; 3142. a nozzle b; 3143. etching the tube at the tail; 3144. a connecting groove a; 315. a middle etching head; 3151. a middle joint; 3152. a lug c; 3153. a nozzle c; 3154. etching the tube; 3155. an external step b; 3156. a connecting groove b;
320. an adjustment mechanism; 321. a motor frame; 322. a first motor; 323. a first screw rod; 324. a nut; 325. a first slide rail; 326. a column; 327. a second slide rail; 3271. a slide base; 3272. a connecting rod; 3273. lifting the claw; 328. a second screw rod; 329. a second motor;
330. a pipeline network group; 331. liquid inlet branch pipes; 332. liquid discharging and pipe distributing; 333. a main pipeline; 334. a liquid inlet main pipe; 335. a first connecting nozzle; 336. a liquid drainage main pipe; 337. a second connecting nozzle; 338. a third connecting nozzle; 339. a nozzle IV;
400. a liquid supply assembly; 401. a liquid storage tank; 402. a fresh liquid zone; 403. a waste liquid zone; 404. a water pump a; 405. and a water pump b.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1 to fig. 15, a combined type variable diameter nozzle circuit board chemical etching apparatus includes a base 100, a vacuum suction table 101 is disposed on the base 100, a liquid supply assembly 400 and a vertical frame 102 are disposed on a side of the base 100, a three-dimensional traction device 200 is disposed on a suspension end of the vertical frame 102, and an etching device 300 is disposed on an output end of the three-dimensional traction device 200.
The vacuum suction table 101 is used for placing a circuit board to be etched.
The three-dimensional pulling device 200 is used for driving the etching apparatus 300 to move along a predetermined track according to a predetermined program.
The liquid supply assembly 400 is used for supplying a chemical etching liquid for the chemical etching of the etching apparatus 300.
As shown in fig. 3, the three-dimensional towing attachment 200 includes three sets of linear modules: a straight line module a210, a straight line module b220, and a straight line module c 230.
The linear module a210 comprises a guide frame a which is connected with the vertical frame 102 and is horizontally arranged, a screw rod a is horizontally arranged on the guide frame a, the input end of the screw rod a is in power connection with a motor a, a screw rod seat a is arranged on the external thread of the screw rod a, and the screw rod seat a and the guide frame a form sliding guide fit with the guide direction parallel to the axial direction of the screw rod a; the motor a operates to drive the screw rod a to rotate, and further drives the screw rod seat a to displace along the axial direction of the screw rod a.
The linear module b220 comprises a guide frame b which is connected with the screw rod seat a and is horizontally arranged, a screw rod b is horizontally arranged on the guide frame b, the screw rod b is vertical to the screw rod a, the input end of the screw rod b is in power connection with a motor b, the screw rod seat b is arranged on the external thread of the screw rod b, and the screw rod seat b and the guide frame b form sliding guide fit with the guide direction parallel to the axial direction of the screw rod b; when the screw rod seat a displaces along the axial direction of the screw rod a, the linear module b220 is driven to move together, and in addition, the motor b operates to drive the screw rod b to rotate, so that the screw rod seat b is driven to displace along the axial direction of the screw rod b.
The linear module c230 comprises a guide frame c which is connected with the screw rod seat b and is vertically arranged, a screw rod c is vertically arranged on the guide frame c, the input end of the screw rod c is in power connection with the motor c, the screw rod seat c is arranged on the external thread of the screw rod c, and the screw rod seat c is also in sliding guide fit with the guide frame c in the vertical direction; when the screw rod seat a displaces along the axial direction of the screw rod a, the linear module b220 and the linear module c230 are driven to move together, when the screw rod seat b displaces along the axial direction of the screw rod b, the linear module c230 is driven to move together, in addition, the motor c operates to drive the screw rod c to rotate, and further the screw rod seat c is driven to displace along the vertical direction.
The three-dimensional traction device 200 further comprises an installation frame 240, the installation frame 240 is connected with the screw rod seat c, and the three groups of linear modules are matched to drive the installation frame 240 to move randomly in a three-dimensional coordinate system formed by the screw rod a, the screw rod b and the screw rod c.
As shown in fig. 4 and 5, the etching apparatus 300 is mounted on the mounting frame 240.
The etching apparatus 300 comprises an etching head set 310, an adjusting mechanism 320 and a pipe network 330, wherein the pipe network 330 is used for communication between the etching head set 310 and the liquid supply assembly 400, the output end of the etching head set 310 is circular, and the adjusting mechanism 320 is used for adjusting the aperture of the output end of the etching head set 310.
As shown in fig. 4, 5 and 8, a guide rod 311 is vertically installed on the mounting bracket 240.
As shown in fig. 10 to 15, the etching head group 310 includes etching heads, the etching heads are provided with multiple groups and among the multiple groups of etching heads, the etching head located at the uppermost position is a head etching head 313, the etching head located at the lowermost position is a tail etching head 314, the etching head located between the head etching head 313 and the tail etching head 314 is a middle etching head 315, only one group of the head etching head 313 and the tail etching head 314 is provided, and at least one group of the middle etching head 315 is provided.
Tail etch head 314: as shown in fig. 13, the tail etching head 314 includes a tail etching pipe 3143 vertically and fixedly installed on the mounting frame 240, a tail connector 3141 is coaxially and threadedly disposed at an upper pipe opening of the tail etching pipe 3143, a connector b3142 is disposed at a side surface of the tail connector 3141, and a connector groove a3144 penetrating the height of the tail etching pipe 3143 and communicating with an inner cavity of the tail connector 3141 is disposed on an inner wall of the tail etching pipe 3143.
The upper closed end of the tail joint 3141 is also coaxially provided with a tail sliding hole, and the aperture of the tail sliding hole is consistent with the inner diameter of the tail etching pipe 3143.
Middle etch head 315: as shown in fig. 12, the middle etching head 315 includes a middle etching pipe 3154 vertically arranged, an external step b3155 coaxially extends around an upper opening of the middle etching pipe 3154, an upper end of the external step b3155 is coaxially provided with a middle joint 3151, specifically, a lower opening end of the middle joint 3151 is coaxially screwed with an upper end of the external step b3155, an upper closed end of the middle joint 3151 is coaxially provided with a middle sliding hole, and an aperture of the middle sliding hole is consistent with an inner diameter of the middle etching pipe 3154.
The side of the middle joint 3151 is provided with a nozzle c3153 and a lug c3152, and the lug c3152 is connected with the guide rod 311 in a sliding manner.
The inner wall of the middle etching pipe 3154 is provided with a connecting groove b3156 which penetrates the height of the middle etching pipe 3154 and is communicated with the inner cavity of the middle joint 3151.
First etching head 313: as shown in fig. 11, the first etching head 313 includes a first etching pipe 3134 vertically arranged, an upper opening of the first etching pipe 3134 extends coaxially around to form an external step a3135, an upper end of the external step a3135 is coaxially provided with a first connector 3131, and specifically, a lower opening end of the first connector 3131 is coaxially in threaded connection with an upper end of the external step a 3135.
A nozzle a3133 and a lug a3132 are arranged on the side surface of the head 3131, and the lug a3132 is slidably connected with the guide rod 311.
The inner wall of the first etched tube 3134 is provided with a connection hole 3136 penetrating through the wall thickness thereof, and the connection hole 3136 is close to the lower nozzle of the first etched tube 3134.
As shown in fig. 10, 14 and 15, in the initial state:
between the trailing etch head 314 and the adjacent middle etch head 315: the diameter of the tail slide hole is consistent with the outer diameter of the middle etching pipe 3154, the middle etching pipe 3154 is coaxially sleeved in the tail etching pipe 3143 in a sliding mode, and the upper closed end of the tail connector 3141 bears the external step b 3155.
Between the etch heads 315 in adjacent sets: the inner diameter of the middle etching pipe 3154 in the middle etching head 315 positioned below is consistent with the outer diameter of the middle etching pipe 3154 in the middle etching head 315 positioned above, the middle etching pipe 3154 in the middle etching head 315 positioned above is coaxially sleeved in the middle etching pipe 3154 in the middle etching head 315 positioned below in a sliding manner, and the upper closed end of the middle joint 3151 in the middle etching head 315 positioned below supports the external step b3155 in the middle etching head 315 positioned above.
Between the leading etching head 313 and the adjacent middle etching head 315: the outer diameter of the first etching pipe 3134 is the same as the inner diameter of the middle etching pipe 3154, the first etching pipe 3134 is coaxially and slidably sleeved in the middle etching pipe 3154, the upper closed end of the middle joint 3151 bears the external step a3135, and the connection hole 3136 is communicated with the connection groove b 3156.
As shown in fig. 10 and 14, the lower orifices of leading etched tubes 3134, of middle etched tubes 3154 in all middle etched heads 315, and of trailing etched tubes 3143 are flush.
Pipe network group 330: as shown in fig. 8 and 9, the pipe network 330 includes a main pipe 333, a liquid inlet branch pipe 331, and a liquid outlet branch pipe 332.
The main pipe 333 is composed of a liquid inlet main pipe 334 and a liquid discharge main pipe 336, the liquid inlet main pipe 334 is provided with a first nozzle 335 and a second nozzle 337, one end of the liquid inlet branch pipe 331 is communicated with the second nozzle 337, and the other end is communicated with a nozzle a 3133.
The main liquid discharge pipe 336 is provided with a third connector 338 and a fourth connector 339, one end of the main liquid discharge pipe 332 is communicated with the third connector 338, the other end of the main liquid discharge pipe 332 is communicated with a c3153 connector in the middle etching head 315 or a b3142 connector in the tail etching head 314, and a plurality of groups of the third connectors 338 are arranged corresponding to the number of the middle etching head 315 and the number of the tail etching heads 314.
As shown in fig. 2, the liquid supply assembly 400 includes a liquid storage tank 401 and a water pump, and two groups of areas that are not communicated with each other are disposed in the liquid storage tank 401: new liquid district 402 and waste liquid district 403, the water pump is provided with two sets of: water pump a404 and water pump b 405.
A first connecting pipe used for communicating the liquid inlet end of the water pump a404 with the new liquid area 402 is arranged between the liquid inlet end of the water pump a404 and the new liquid area 402, a second connecting pipe used for communicating the liquid outlet end of the water pump a404 with the first connecting nozzle 335 is arranged between the liquid outlet end of the water pump a404 and the first connecting nozzle, and a flow valve a is arranged on the second connecting pipe.
A third connecting pipe for communicating the liquid inlet end of the water pump b405 with the fourth nozzle 339, a fourth connecting pipe for communicating the liquid outlet end of the water pump b405 with the waste liquid area 403, and a flow valve b arranged on the third connecting pipe.
The new corrosive liquid in the new liquid area 402 sequentially flows into the etching head group 310 through the first connecting pipe, the water pump a404, the second connecting pipe, the first nozzle 335, the main liquid inlet pipe 334, the second nozzle 337, the branch liquid inlet pipe 331 and the nozzle a3133, and meanwhile, the flow valve a can control the flow rate of the new corrosive liquid flowing into the etching head group 310;
the waste etching liquid in the etching head group 310 sequentially flows into the waste liquid area 403 through a liquid discharge branch pipe 332, a third nozzle 338, a main liquid discharge pipe 336, a fourth nozzle 339, a third connecting pipe, a water pump b405 and a fourth connecting pipe, and meanwhile, the flow valve b can control the flow rate of the waste etching liquid discharged by the etching head group 310.
The adjusting mechanism 320: as shown in fig. 4-7, the adjusting mechanism 320 includes a motor frame 321 fixedly mounted on the mounting frame 240, a first motor 322 is mounted on the motor frame 321, an output end of the first motor 322 faces downward vertically and is coaxially provided with a first screw rod 323, and an external thread of the first screw rod 323 is provided with a nut 324.
The mounting rack 240 is also provided with a first slide rail 325 which is vertically arranged, a stand column 326 is arranged in the first slide rail 325 in a sliding manner, and the stand column 326 is fixed with the screw 324; the first motor 322 operates to drive the first screw 323 to rotate, and further drives the nut 324 and the upright 326 to displace in the vertical direction.
The top of stand 326 is provided with two 327 of slide rail that are the horizontal arrangement, and the outside cover of two 327 of slide rail is equipped with the promotion body, and is specific, promotes the body and establishes slide 3271 at the outside of two 327 of slide rail including the slip cover, and the both sides of slide 3271 all vertically extend down have connecting rod 3272, and the bottom of connecting rod 3272 is provided with carries claw 3273.
A second motor 329 is mounted on the sliding seat 3271, an output shaft of the second motor 329 is axially parallel to the extending direction of the second sliding rail 327, a second lead screw 328 is coaxially arranged at the output end of the second motor 329, and the second lead screw 328 is in threaded connection with the second sliding rail 327; when the vertical column 326 displaces along the vertical direction, the second sliding rail 327, the lifting body, the second motor 329 and the second screw rod 328 are driven to move together, in addition, when the second motor 329 operates to drive the second screw rod 328 to rotate, because the second sliding rail 327 is fixedly arranged at the top of the vertical column 326, the second screw rod 328 is in threaded connection with the second sliding rail 327, the sliding seat 3271 and the second sliding rail 327 form sliding fit, and when the second screw rod 328 rotates, the lifting body, the second screw rod 328 and the second motor 329 displace together along the axial direction of the second screw rod 328.
As shown in fig. 4, 5 and 8, the top of the guide rod 311 is connected to the motor frame 321, and the spring 312 between the first etching head 313 and the motor frame 321 is sleeved outside the guide rod 311.
The working principle of the invention is as follows:
the part of the circuit board which needs to be reserved is a circuit, and the part which does not need to be reserved is a corrosion area;
firstly: the three-dimensional traction device 200 operates to pull the bottom of the etching head group 310 to be attached to the corrosion area of the circuit board placed on the vacuum suction table 101, and at the moment, the corrosion area in the opening at the bottom of the etching head group 310 is named as point A;
then: two groups of water pumps run;
the new corrosive liquid in the new liquid area 402 sequentially flows into the etching head group 310 through the first connecting pipe, the water pump a404, the second connecting pipe, the first connecting nozzle 335, the main liquid inlet pipe 334, the second connecting nozzle 337, the branch liquid inlet pipe 331 and the connecting nozzle a3133, and undergoes a displacement reaction with the copper foil at the point A to corrode the copper foil at the point A;
in the replacement reaction, the concentration of the corrosive liquid is continuously reduced to form waste corrosive liquid, and the waste corrosive liquid in the etching head group 310 sequentially flows into the waste liquid area 403 through the liquid discharge branch pipe 332, the third connecting nozzle 338, the main liquid discharge pipe 336, the fourth connecting nozzle 339, the third connecting pipe, the water pump b405 and the fourth connecting pipe;
thus, a flow of flowing and constant-concentration corrosion liquid is formed to perform replacement reaction on the copper foil at the point A, and the copper foil is thin and is corroded quickly within a few seconds;
then: after the copper foil at the point a is corroded, if the bottom opening area of the etching head group 310 does not need to be adjusted, the three-dimensional traction device 200 operates, the etching device 300 is driven to move to the next point according to the setting of a preset program, the next point is named as a point B, and copper foil replacement corrosion is performed on the point B;
after the copper foil at the point a is corroded, if the opening area at the bottom of the etching head group 310 needs to be adjusted, the water pump a404 stops operating, the water pump B405 continues operating, the etching liquid in the etching head group 310 is emptied, the opening area at the bottom of the etching head group 310 is adjusted by the adjusting mechanism 320, the etching device 300 is driven to move to the point B by the three-dimensional traction device 200, and copper foil replacement corrosion is performed on the point B.
In the above process, the aperture of the bottom opening of the etching head set 310 is the minimum value in the initial state, as shown in fig. 14, the specific flow trajectory of the etching solution at this time is as follows:
the new corrosive liquid in the new liquid area 402 sequentially flows into the first etching pipe 3134 through the first connecting pipe, the water pump a404, the second connecting pipe, the first connecting nozzle 335, the liquid inlet main pipe 334, the second connecting nozzle 337, the liquid inlet branch pipe 331, the first connecting nozzle a3133 and the first connector 3131, after a preset time, the corrosive liquid submerges the connecting hole 3136, and then the waste corrosive liquid sequentially flows into the waste liquid area 403 through the connecting hole 3136, the connecting groove b3156 in the middle etching head 315 adjacent to the first etching head 313, the middle connector 3151, the first connecting nozzle c3153, the liquid drainage branch pipe 332, the third connecting nozzle 338, the liquid drainage main pipe 336, the fourth connecting nozzle 339, the third connecting pipe, the water pump b405 and the fourth connecting pipe;
in the above process, the process of adjusting the bottom opening area of the etching head set 310 by the adjusting mechanism 320 specifically includes:
as shown in fig. 15, five groups of middle etching heads 315 are provided, and the bottom opening aperture of the group 310 of etching heads needs to be consistent with the inner diameter of the middle etching pipe 3154 in the etching head 315 in the penultimate group as an example, for illustration:
firstly: the water pump a404 stops running, the water pump b405 continues running, and the etching solution in the etching head group 310 is emptied;
then: the first motor 322 operates to drive the first screw rod 323 to rotate, so that the nut 324 and the upright 326 are driven to displace along the vertical direction, the upright 326 moves to drive the second sliding rail 327, the lifting body, the second motor 329 and the second screw rod 328 to move together, and the lifting claw 3273 in the lifting body moves to a height range between the middle joint 3151 of the etching head 315 in the penultimate group and the middle joint 3151 of the etching head 315 in the penultimate group;
then: the second motor 329 operates to drive the second screw rod 328 to rotate, so that the lifting body, the second screw rod 328 and the second motor 329 are displaced together along the axial direction of the second screw rod 328, and the lifting claw 3273 is moved to a region between the middle joint 3151 of the etching head 315 in the penultimate group and the middle joint 3151 of the etching head 315 in the penultimate group;
then: the first motor 322 continues to operate to drive the lifting claw 3273 to move vertically upwards by a preset distance, the lifting claw 3273 carries the first etching head 313 and the sequentially first, second and third groups of middle etching heads 315 to move upwards synchronously by the preset distance, and at this time, as shown in fig. 15, the inner diameter of the middle etching pipe 3154 in the sequentially second group of middle etching heads 315 is the bottom opening aperture of the etching head group 310.
In the above process, the specific flow path of the etching solution in the etching head set 310 after the bottom opening adjustment is as follows:
the new corrosive liquid in the new liquid area 402 sequentially flows into the first etching pipe 3134 through the first connecting pipe, the water pump a404, the second connecting pipe, the first nozzle 335, the main liquid inlet pipe 334, the second nozzle 337, the branch liquid inlet pipe 331, the nozzle a3133 and the first connector 3131, after a preset time, the corrosive liquid submerges the connecting hole 3136, then a part of the waste corrosive liquid sequentially flows into the waste liquid area 403 through the connecting hole 3136, the connecting groove b3156 in the middle etching head 315 adjacent to the first etching head 313, the middle connector 3151, the nozzle c3153, the branch liquid draining pipe 332, the third nozzle 338, the main liquid draining pipe 336, the fourth nozzle 339, the third connecting pipe, the water pump b405 and the fourth connecting pipe, and the other part of the waste corrosive liquid sequentially flows into the waste liquid area 403 through the connecting groove b3156, the middle liquid draining connector 3151, the nozzle c3153, the branch liquid draining pipe 332, the third nozzle 338, the main liquid draining pipe 336, the fourth nozzle 339, the third connecting pipe, the water pump b405 and the fourth connecting pipe 405.
In the above process, after the new etching solution flows into the first etching pipe 3134 and immerses the contact hole 3136, the water pump b405 starts to operate, so that the etching solution in the etching head set 310 keeps a constant concentration state of continuous flow, wherein, as shown in fig. 14, the bottom opening of the etching head set 310 is at a minimum in the initial state, and at this time, the time taken for the etching solution to immerse the contact hole 3136 is the shortest, which can be tested and named as T1;
after the bottom opening of the etching head set 310 is changed, the time that it takes for the etching solution to soak the contact hole 3136 = T1+ S1 × H1/V1, where, as shown in fig. 15, H1 is the distance of the middle etching pipe 3154 moving vertically upward, S1 is the adjusted area of the opening at the bottom of the etching head set 310, and it can be calculated according to the circular area formula, and V1 is the flow rate of the new etching solution flowing into the first etching pipe 3134 and is a constant value.
In the above process, the flow rate of the new etching solution flowing into the first etching pipe 3134 is constant, that is, the flow rate M of the new etching solution flowing into the etching head set 310 is a fixed value, and after the bottom opening of the etching head set 310 is adjusted, the outflow rate V2 of the waste etching solution in the etching head set 310 should be changed, specifically: v2= M/S2, wherein S2 represents the cross-sectional area of the outflow channel of the etching head set 310, and can be calculated from the area values of the slot b3156 and the connection hole 3136, and the size data of the slot b3156 and the connection hole 3136 are clear during production, so that the area of the slot b3156 in contact with the etching solution and the area of the connection hole 3136 can be calculated, and the sum of the two areas is V2.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a modular but reducing shower nozzle circuit board chemical etching equipment, its includes base (100), is provided with vacuum suction table (101) on base (100), and the side of base (100) is provided with and supplies liquid subassembly (400) and grudging post (102), and the suspension end of grudging post (102) is provided with three-dimensional draw gear (200), its characterized in that: the three-dimensional traction device (200) comprises a mounting frame (240), and the etching device (300) is mounted on the mounting frame (240); the vacuum suction table (101) is used for placing a circuit board to be etched, the three-dimensional traction device (200) is used for driving the etching device (300) to move along a preset track according to a preset program, and the liquid supply assembly (400) is used for providing chemical corrosive liquid for the etching device (300); the etching device (300) comprises an etching head group (310), an adjusting mechanism (320) and a pipeline network group (330), wherein the pipeline network group (330) is used for communicating the etching head group (310) with the liquid supply assembly (400), the output end of the etching head group (310) is in a circular shape, and the adjusting mechanism (320) is used for adjusting the aperture of the output end of the etching head group (310); the etching head group (310) comprises etching heads, the etching heads are provided with a plurality of groups of etching heads, the etching head positioned at the top is a head etching head (313), the etching head positioned at the bottom is a tail etching head (314), the etching head positioned between the head etching head (313) and the tail etching head (314) is a middle etching head (315), only one group of the head etching head (313) and the tail etching head (314) is arranged, and at least one group of the middle etching head (315) is arranged.
2. The apparatus of claim 1, wherein the chemical etching apparatus comprises: the tail etching head (314) comprises a tail etching pipe (3143) vertically and fixedly mounted on the mounting frame (240), a tail joint (3141) is coaxially and threadedly arranged at an upper pipe opening of the tail etching pipe (3143), a connector b (3142) is arranged on the side surface of the tail joint (3141), and a connector groove a (3144) which penetrates through the height of the tail etching pipe (3143) and is communicated with the inner cavity of the tail joint (3141) is formed in the inner wall of the tail etching pipe (3143); the upper closed end of the tail joint (3141) is also coaxially provided with a tail sliding hole, and the aperture of the tail sliding hole is consistent with the inner diameter of the tail etching pipe (3143).
3. The apparatus of claim 2, wherein the chemical etching apparatus comprises: a guide rod (311) is vertically arranged on the mounting rack (240); the middle etching head (315) comprises a middle etching pipe (3154) which is vertically arranged, an external step b (3155) coaxially extends around the upper pipe opening of the middle etching pipe (3154), the upper end of the external step b (3155) is coaxially provided with a middle joint (3151), the lower opening end of the middle joint (3151) is coaxially in threaded connection with the upper end of the external step b (3155), the upper closed end of the middle joint (3151) is coaxially provided with a middle sliding hole, and the aperture of the middle sliding hole is consistent with the inner diameter of the middle etching pipe (3154); the side surface of the middle joint (3151) is provided with a nozzle c (3153) and a lug c (3152), and the lug c (3152) is connected with the guide rod (311) in a sliding way; the inner wall of the middle etching pipe (3154) is provided with a connecting groove b (3156) which penetrates through the height of the middle etching pipe and is communicated with the inner cavity of the middle joint (3151).
4. The apparatus of claim 3, wherein the chemical etching apparatus comprises: the first etching head (313) comprises a vertically arranged first etching pipe (3134), an external step a (3135) coaxially extends around the upper pipe opening of the first etching pipe (3134), the upper end of the external step a (3135) is coaxially provided with a first connector (3131), and the lower opening end of the first connector (3131) is coaxially in threaded connection with the upper end of the external step a (3135); the side surface of the head joint (3131) is provided with a nozzle a (3133) and a lug a (3132), and the lug a (3132) is in sliding connection with the guide rod (311); the inner wall of the head etching pipe (3134) is provided with a connecting hole (3136) penetrating the wall thickness of the head etching pipe, and the connecting hole (3136) is close to the lower pipe mouth of the head etching pipe (3134).
5. The apparatus of claim 4, wherein the chemical etching equipment comprises: in the initial state, between the tail etching head (314) and the adjacent middle etching head (315): the aperture of the tail sliding hole is consistent with the outer diameter of the middle etching pipe (3154), the middle etching pipe (3154) is coaxially sleeved in the tail etching pipe (3143) in a sliding mode, and the upper closed end of the tail joint (3141) bears the external step b (3155); in the initial state, between the etching heads (315) in two adjacent groups: the inner diameter of a middle etching pipe (3154) in the middle etching head (315) positioned below is consistent with the outer diameter of a middle etching pipe (3154) in the middle etching head (315) positioned above, the middle etching pipe (3154) in the middle etching head (315) positioned above is coaxially sleeved in the middle etching pipe (3154) in the middle etching head (315) positioned below in a sliding manner, and the upper closed end of a middle joint (3151) in the middle etching head (315) positioned below supports an external step b (3155) in the middle etching head (315) positioned above; in the initial state, between the first etching head (313) and the adjacent middle etching head (315): the outer diameter of the first etching pipe (3134) is consistent with the inner diameter of the middle etching pipe (3154), the first etching pipe (3134) is coaxially sleeved in the middle etching pipe (3154) in a sliding mode, the upper closed end of the middle joint (3151) supports an external step a (3135), and the connection hole (3136) is communicated with the connection groove b (3156); in the initial state, the lower orifices of the leading etched tube (3134), the middle etched tubes (3154) of all the middle etched heads (315), and the lower orifices of the trailing etched tubes (3143) are flush.
6. The apparatus of claim 5, wherein the chemical etching apparatus comprises: the pipeline network group (330) comprises a main pipeline (333), a liquid inlet branch pipe (331) and a liquid discharge branch pipe (332); the main pipeline (333) consists of a liquid inlet main pipe (334) and a liquid drainage main pipe (336), a first connecting nozzle (335) and a second connecting nozzle (337) are arranged on the liquid inlet main pipe (334), one end of the liquid inlet branch pipe (331) is communicated with the second connecting nozzle (337), and the other end of the liquid inlet branch pipe is communicated with a first connecting nozzle (3133); the liquid drainage main pipe (336) is provided with a third connecting nozzle (338) and a fourth connecting nozzle (339), one end of the liquid drainage branch pipe (332) is communicated with the third connecting nozzle (338), the other end of the liquid drainage branch pipe is communicated with a c connecting nozzle (3153) in the middle etching head (315) or a b connecting nozzle (3142) in the tail etching head (314), and a plurality of groups of the number of the middle etching heads (315) corresponding to the third connecting nozzle (338) and the number of the tail etching heads (314) are arranged.
7. The apparatus of claim 6, wherein the chemical etching apparatus comprises: the liquid supply assembly (400) comprises a liquid storage tank (401) and a water pump, wherein two groups of areas which are not communicated with each other are arranged in the liquid storage tank (401): new liquid district (402) and waste liquid district (403), the water pump is provided with two sets ofly: a water pump a (404) and a water pump b (405); a first connecting pipe for communicating the liquid inlet end of the water pump a (404) with the new liquid area (402) is arranged between the liquid inlet end of the water pump a (404) and the new liquid area, a second connecting pipe for communicating the liquid outlet end of the water pump a (404) with the first connecting nozzle (335) is arranged between the liquid outlet end of the water pump a (404) and the second connecting pipe, and a flow valve a is arranged on the second connecting pipe; a third connecting pipe for communicating the liquid inlet end of the water pump b (405) with the fourth connecting nozzle (339) is arranged between the liquid inlet end of the water pump b (405) and the waste liquid area (403), a fourth connecting pipe for communicating the liquid outlet end of the water pump b (405) with the waste liquid area is arranged between the liquid outlet end of the water pump b (405) and the waste liquid area, and a flow valve b is arranged on the third connecting pipe.
8. The apparatus of claim 7, wherein the chemical etching apparatus comprises: the adjusting mechanism (320) comprises a motor frame (321) fixedly installed on the installation frame (240), a first motor (322) is installed on the motor frame (321), the output end of the first motor (322) faces downwards vertically and is coaxially provided with a first screw rod (323), and a nut (324) is arranged on the outer thread of the first screw rod (323); the mounting rack (240) is further provided with a first sliding rail (325) which is vertically arranged, an upright post (326) is arranged in the first sliding rail (325) in a sliding mode, and the upright post (326) is fixed with the screw nut (324).
9. The apparatus of claim 8, wherein the chemical etching apparatus comprises: a second sliding rail (327) which is horizontally arranged is arranged at the top of the upright post (326), a sliding seat (3271) is sleeved outside the second sliding rail (327) in a sliding manner, connecting rods (3272) vertically and downwards extend from two sides of the sliding seat (3271), and lifting claws (3273) are arranged at the bottom of the connecting rods (3272); a second motor (329) is installed on the sliding seat (3271), the axial direction of an output shaft of the second motor (329) is parallel to the extending direction of the second sliding rail (327), a second screw rod (328) is coaxially arranged at the output end of the second motor (329), and the second screw rod (328) is in threaded connection with the second sliding rail (327).
10. The apparatus of claim 9, wherein the chemical etching apparatus comprises: the top of the guide rod (311) is connected with the motor frame (321), and a spring (312) positioned between the first etching head (313) and the motor frame (321) is sleeved outside the guide rod (311).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210527502.4A CN114630502B (en) | 2022-05-16 | 2022-05-16 | Combined type variable-diameter spray head circuit board chemical etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210527502.4A CN114630502B (en) | 2022-05-16 | 2022-05-16 | Combined type variable-diameter spray head circuit board chemical etching equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114630502A CN114630502A (en) | 2022-06-14 |
| CN114630502B true CN114630502B (en) | 2022-07-15 |
Family
ID=81907279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210527502.4A Active CN114630502B (en) | 2022-05-16 | 2022-05-16 | Combined type variable-diameter spray head circuit board chemical etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114630502B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114760765B (en) * | 2022-06-16 | 2022-09-02 | 深圳市惠利电子科技有限公司 | Dry-type circuit board chemical etching equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS621885A (en) * | 1985-06-27 | 1987-01-07 | Fuji Photo Film Co Ltd | Etching apparatus for printed board |
| CN103322938A (en) * | 2013-06-15 | 2013-09-25 | 厦门大学 | Optical element fixed point etching and observing device |
| WO2014069711A1 (en) * | 2012-10-30 | 2014-05-08 | (주)에스엠씨 | Method for manufacturing microcircuit |
| CN211570832U (en) * | 2019-11-14 | 2020-09-25 | 杭州协宇自动化设备有限公司 | Electrolytic etching machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201406235A (en) * | 2012-07-20 | 2014-02-01 | ming-hong Guo | Improved transmission mechanism of vertical circuit board etching device |
-
2022
- 2022-05-16 CN CN202210527502.4A patent/CN114630502B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS621885A (en) * | 1985-06-27 | 1987-01-07 | Fuji Photo Film Co Ltd | Etching apparatus for printed board |
| WO2014069711A1 (en) * | 2012-10-30 | 2014-05-08 | (주)에스엠씨 | Method for manufacturing microcircuit |
| CN103322938A (en) * | 2013-06-15 | 2013-09-25 | 厦门大学 | Optical element fixed point etching and observing device |
| CN211570832U (en) * | 2019-11-14 | 2020-09-25 | 杭州协宇自动化设备有限公司 | Electrolytic etching machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114630502A (en) | 2022-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114630502B (en) | Combined type variable-diameter spray head circuit board chemical etching equipment | |
| CN103774147B (en) | Etching method and etching device with nozzle group reciprocating in etching region | |
| JP6798070B1 (en) | High-pressure spray spray device dedicated to electroplating production | |
| CN210847410U (en) | Siphon overflow water washing tank | |
| WO2023201961A1 (en) | Pulse aeration apparatus comprising safety notches | |
| CN2601259Y (en) | Water bath heating chemical plating plant | |
| CN210765576U (en) | Horizontal spraying structure and electrolytic etching device | |
| CN214936189U (en) | Automatic fire fighting equipment in landfill leachate aerobic tank | |
| CN2675279Y (en) | Voltage-regulating energy-saving water-supplying device for hot rolled steel controlled-cooling system | |
| CN108144450A (en) | Dynamic membrane tube, bioreactor and the method for realizing automatic replacement film base material net | |
| CN211665028U (en) | Oil-water separation device for extracting essential oil | |
| CN219652813U (en) | Defoaming device for sewage treatment equipment | |
| CN110113884B (en) | Rapid etching device and method for printed circuit board for new energy automobile | |
| CN110592653A (en) | Horizontal spraying structure and electrolytic etching device applied by same | |
| CN110681635B (en) | Siphon overflow water washing tank | |
| CN114760765B (en) | Dry-type circuit board chemical etching equipment | |
| CN219941813U (en) | Stripping tower for CO-production of melamine and urea CO ₂ | |
| CN212786853U (en) | Fog device falls in manual simulation | |
| CN220834255U (en) | Slurry defoaming device | |
| CN221183296U (en) | Paint spraying equipment | |
| CN219662949U (en) | Foam breaker with adjustable foam suction height | |
| CN216367324U (en) | Novel chlorine gas absorbs device | |
| CN213382922U (en) | Polymer tubular product extrusion lines | |
| CN116988051B (en) | Excellent electroless copper plating equipment and copper plating method thereof | |
| CN113384972B (en) | Gas purifying and separating device capable of automatically balancing liquid level and moving and taking at fixed point |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A combined variable diameter nozzle chemical etching equipment for circuit boards Granted publication date: 20220715 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN HUA JIAN CNC TECHNOLOGY Co.,Ltd. Registration number: Y2024980013603 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |