CN114622264A - Fluid monitoring device - Google Patents

Fluid monitoring device Download PDF

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Publication number
CN114622264A
CN114622264A CN202011457748.6A CN202011457748A CN114622264A CN 114622264 A CN114622264 A CN 114622264A CN 202011457748 A CN202011457748 A CN 202011457748A CN 114622264 A CN114622264 A CN 114622264A
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fluid
monitoring
state
container
monitoring device
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CN202011457748.6A
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Chinese (zh)
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CN114622264B (en
Inventor
郭忠军
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SIPLP Microelectronics Chongqing Ltd
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SIPLP Microelectronics Chongqing Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present application provides a fluid monitoring device. In this application, this fluid monitoring device includes: a container and a hydrodynamic force monitoring section; the container comprises a transparent part, and the fluid dynamic monitoring part is positioned in the container and fixed on the transparent part; a container for containing a fluid; when the fluid is disturbed, the state of the fluid dynamic monitoring part is visually changed, and the state of the fluid dynamic monitoring part is changed along with the change of the disturbed state of the fluid, and the state of the fluid dynamic monitoring part is used for indicating the disturbed state of the fluid, wherein the disturbed state comprises the circulation direction and the disturbed amplitude of the fluid. In the embodiment of the application, the turbulent flow state of the electroplating fluid can be directly monitored, and then the improvement direction of the electroplating device can be found according to the turbulent flow state of the electroplating fluid, so that the electroplating device is favorably and timely improved, the electroplating uniformity is improved, and the electroplating quality is improved.

Description

Fluid monitoring device
Technical Field
The application relates to the technical field of electroplating, in particular to a fluid monitoring device.
Background
In the related art, the current distribution theory of the electrolytic cell shows that the electroplating uniformity is determined by the combination of the hardware of the electroplating equipment and the electroplating solution to improve the primary current distribution and the secondary current distribution. Theoretically, the dispersion of the plating solution not only has the characteristics of the plating solution, but also has the greatest influence on the power design of the fluid (plating solution). Therefore, the research on the dynamic state of the electroplating fluid is very important.
In the related technology, electroplating products are mostly used as research objects for electroplating fluid dynamics research, and no direct means is provided for researching the turbulent flow state and the pressure state of the electroplating fluid.
Disclosure of Invention
The embodiment of the application provides a fluid monitoring device, can directly monitor the disturbed flow state of electroplating class fluid.
The embodiment of the application provides a fluid monitoring device, includes: a container and a hydrodynamic force monitoring section;
the container comprises a transparent part, and the fluid power monitoring part is positioned in the container and fixed on the transparent part;
the container is used for containing fluid;
when the fluid is disturbed, the state of the fluid dynamic monitoring part is visually changed, and the state of the fluid dynamic monitoring part is changed along with the change of the disturbed state of the fluid, and the state of the fluid dynamic monitoring part is used for indicating the disturbed state of the fluid, wherein the disturbed state comprises the circulation direction and/or the disturbed amplitude of the fluid.
In one embodiment, the material of the transparent part is a corrosion-resistant material;
the transparent portion is at least a portion of a sidewall of the container.
In one embodiment, the material of the transparent portion is polypropylene.
In one embodiment, the hydrodynamic monitoring portion comprises N clusters of ribbons, wherein each cluster of ribbons comprises at least one ribbon, and the N clusters of ribbons are respectively fixed at N locations on the transparent portion, the N locations being evenly distributed on the transparent portion; n is a positive integer.
In one embodiment, the material of the ribbon is chemical fiber.
In one embodiment, the ribbon material is polyimide fiber.
In one embodiment, the fluid monitoring device further comprises a fluid pressure monitoring part, which is located in the container and fixed on the transparent part for monitoring the pressure distribution of the fluid.
In one embodiment, the fluid pressure monitoring part is a pressure measurement film, the pressure measurement film covers the transparent part, and the fluid dynamic monitoring part is fixed on the pressure measurement film.
In one embodiment, the fluid pressure monitoring portion includes a plurality of pressure sensors arranged in an array, and the fluid dynamic monitoring portion is fixed to the plurality of pressure sensors.
In one embodiment, the fluid monitoring device further comprises a heater, a circulating pump and a swing mechanism;
the heater, the circulating pump and the swing mechanism are respectively positioned in the container;
the heater is used for heating the fluid, the circulating pump is used for promoting the fluid to circulate, and the swing mechanism is used for stirring the fluid.
In the embodiment of the application, the container comprises the transparent part, the hydrodynamic force monitoring part is located in the container and fixed on the transparent part, and when fluid is disturbed, the state of the hydrodynamic force monitoring part is visually changed, so that monitoring personnel can observe the state of the hydrodynamic force monitoring part through the transparent part, the state of the hydrodynamic force monitoring part is changed along with the change of the disturbed state of the fluid, and the state of the hydrodynamic force monitoring part is used for indicating the disturbed state of the fluid, so that the monitoring personnel can observe the disturbed state of the fluid through the transparent part. In conclusion, the technical scheme of the application can directly monitor the turbulent flow state of the electroplating fluid. Furthermore, the improvement direction of the electroplating device can be found according to the turbulent flow state of the electroplating fluid, so that the electroplating device can be improved in time, the electroplating uniformity is improved, and the electroplating quality is improved.
Drawings
Fig. 1 is a schematic structural diagram of a fluid monitoring device according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Embodiments of the present application provide a fluid monitoring device. The structure of the fluid monitoring device is approximately the same as that of an electroplating device for single-side electroplating, and the fluid monitoring device is used for directly monitoring the turbulent flow state of electroplating fluid so as to find the defects of the electroplating device and find an improvement direction. The plating fluid is a fluid that is the same as or similar to the environment in which the plating solution is present. As shown in fig. 1, the fluid monitoring device includes a container 11, a fluid dynamic monitoring portion 12, a fluid pressure monitoring portion 13, an electrically conductive structure 14, a heater (not shown), a circulation pump (not shown), and a rocking mechanism (not shown).
Wherein the container 11 is used for containing a fluid. In this embodiment, the container 11 is a plating tank for containing a plating solution. Alternatively, the container 11 is a tank body similar to the structure of the plating tank and is used for containing the plating fluid. The container 11 may be a rectangular parallelepiped including four sidewalls, but is not limited thereto, and for example, the container 11 may also be a cube or a cylinder.
Wherein the container 11 comprises a transparent portion 111. In the present embodiment, the transparent part 111 is a part of one sidewall of the container 11. Of course, the transparent part 111 may be one side wall of the container 11. The monitoring person can observe the inside of the container 11 through the transparent part 111.
In the present embodiment, the material of the transparent portion 111 is a corrosion-resistant material, for example, polypropylene, but is not limited thereto.
Wherein the heater, the circulating pump and the swing mechanism are respectively positioned in the container 11. The heater is used for heating fluid, and the circulating pump is used for promoting the fluid to circulate, and the rocking mechanism is used for stirring the fluid. In the present embodiment, as shown in fig. 1, when the fluid is heated by the heater, circulated by the circulating pump, and stirred by the oscillating mechanism, turbulence 21 is present in the fluid. The states of the spoilers 21 at different positions may be the same or different. For example, the spoiler 21 may include a first spoiler 211 and a second spoiler 212, a circulation direction of the first spoiler 211 may be different from a circulation direction of the second spoiler 212, and a perturbation amplitude of the first spoiler 211 may be the same as or different from a perturbation amplitude of the second spoiler 212.
Wherein the conductive structure 14 is located in the container 11 for simulating an anode of the electroplating device, and the position of the conductive structure 14 in the container 11 is the same as the position of the anode of the electroplating device in the electroplating bath. In this embodiment, the conductive structure 14 is not energized and is used only to simulate the anode of an electroplating device.
The fluid pressure monitoring unit 13 is located in the container 11, and is fixed on the transparent unit 111 for monitoring the pressure distribution of the fluid. In this embodiment, the fluid pressure monitoring unit 13 is a pressure measuring film, and the transparent unit 111 is covered with the pressure measuring film. For example, the pressure measurement patch may be a fuji pressure measurement patch, and when the fluid presses the pressure measurement patch, the microcapsules in the pressure measurement patch rupture, the chromogenic substance interacts with the chromogenic substance, and the area of the pressure measurement patch where the pressure is sensed displays red. The shade of red is used to indicate the amount of pressure sensed, e.g., the darker the red, the greater the pressure sensed by the pressure measurement film, and the lighter the red, the less pressure sensed by the pressure measurement film. Monitoring personnel can observe the red area and the red depth distribution on the pressure measurement film through the transparent part 111, so that the pressure distribution of the fluid can be determined qualitatively, possible defects of the electroplating device can be found according to the pressure distribution of the fluid, the improvement direction of the electroplating device can be found, the electroplating device can be improved timely, and the electroplating quality is improved. For example, the monitoring personnel can evaluate and improve parameters such as a circulating pump, a swing mechanism, a mechanical structure of a tank body of the plating tank and the like according to the pressure distribution of the fluid.
Of course, in other embodiments, the fluid pressure monitoring portion 13 may include a plurality of pressure sensors arranged in an array, and the fluid dynamic monitoring portion 12 is fixed to the plurality of pressure sensors. Monitoring personnel can obtain a plurality of pressure values detected by the pressure sensors through the processing equipment and process the obtained pressure values to obtain the pressure distribution of the fluid.
The fluid dynamic force monitoring part 12 is located in the container 11 and fixed on the transparent part 111. When the fluid is disturbed, the state of the fluid dynamic monitoring portion 12 changes visually, and the state of the fluid dynamic monitoring portion 12 changes with the change of the disturbed state of the fluid, and the state of the fluid dynamic monitoring portion 12 is used for indicating the disturbed state of the fluid, wherein the disturbed state may include the circulation direction of the fluid and the disturbance amplitude. Of course, the disturbance state may also include one of a circulation direction and a disturbance magnitude of the fluid.
In the present embodiment, the fluid dynamic monitoring unit 12 is fixed to the pressure measuring film. As shown in fig. 1, the hydrodynamic force monitoring part 12 includes 3 bunches of ribbons 121, wherein each bunched ribbon 121 includes 3 ribbons 1211, and the 3 bunches of ribbons 121 are respectively fixed at 3 positions on the transparent part 111, and the 3 positions for fixing the 3 bunches of ribbons 121 are uniformly distributed on the transparent part 111. The material of the filament band 1211 can be resistant to corrosion and has high flexibility. The ribbon material may be chemical fiber, for example, polyimide fiber, but is not limited thereto. Of course, in other embodiments, hydrodynamic monitoring portion 12 may also include 4, 5, or 6 tufts of ribbons 121, and is not limited to the embodiments listed in this application. Each tuft of ribbons 121 may include 1, 2, 4, or 5 ribbons 1211 and is not limited to the embodiments set forth herein.
In this embodiment, the state of the ribbon 1211 changes with the state of the spoiler 21, and the change in the state of the ribbon 1211 is a visual change that can be seen by the naked eye of the monitoring person. For example, the curling direction of the ribbons 1211 changes as the circulation direction of the spoiler 21 changes, and when the circulation direction of the spoiler 21 is clockwise, the curling direction of the ribbons 1211 from the transparent portion 111 to the transparent portion 111 is clockwise, and when the circulation direction of the spoiler 21 is counterclockwise, the curling direction of the ribbons 1211 from the transparent portion 111 to the transparent portion 111 is counterclockwise. For another example, the swinging amplitude of the ribbon 1211 changes with the change of the disturbance amplitude of the disturbance flow 21, when the disturbance amplitude of the disturbance flow 21 is relatively large, the swinging amplitude of the ribbon 1211 is relatively large, and when the disturbance amplitude of the disturbance flow 21 is relatively small, the swinging amplitude of the ribbon 1211 is relatively small.
In this embodiment, the disturbance change (state change) of the ribbon 1211 can be used to evaluate the disturbance state of the disturbed flow 21 within the whole plating window (within the range observable through the transparent part 111), and the abnormal disturbance point can be manually intervened to reduce the plating edge effect by improving the plating device. Meanwhile, for the position with poor disturbance, the corresponding mass transfer state can be researched, and the electroplating effect can be checked, for example, the hole filling electroplating effect can be checked, and the electroplating effect of other electroplating processes can also be checked.
Therefore, monitoring personnel can observe the disturbance state (the state of the disturbed flow 21) of the fluid through the transparent part 111, namely the disturbance state of the electroplating fluid can be directly monitored, and then the improvement direction of the electroplating device can be found according to the disturbance state of the electroplating fluid, so that the electroplating device can be improved in time, and the electroplating quality is improved. For example, the monitoring personnel may evaluate and improve parameters of the circulation pump, the rocking mechanism, the mechanical structure of the bath of the plating cell, etc. based on the pressure distribution of the fluid. The parameters of the circulating pump include flow rate and frequency, the parameters of the rocking mechanism include frequency, amplitude, speed and angle of the blade, wherein the rocking mechanism includes a plurality of blades arranged at a specified angle, and the parameters of the mechanical structure of the tank body of the electroplating tank include size, but are not limited thereto.
The technical scheme provided by the embodiment is simple to realize, can visually present the disturbance state of the fluid, is low in cost and strong in practicability, can enable monitoring personnel to conveniently and quickly master the fluid dynamics state and the mass transfer effect, and is very helpful for qualitative research at a factory level.
In the embodiment of the application, as the container comprises the transparent part, the hydrodynamic force monitoring part is positioned in the container and fixed on the transparent part, and when the fluid is disturbed, the state of the hydrodynamic force monitoring part is visually changed, the state of the hydrodynamic force monitoring part can be observed by a monitoring person through the transparent part, and the state of the hydrodynamic force monitoring part is changed along with the change of the disturbed state of the fluid, and is used for indicating the disturbed state of the fluid, so that the monitoring person can observe the disturbed state of the fluid through the transparent part. In conclusion, the technical scheme of the application can directly monitor the turbulent flow state of the electroplating fluid. Furthermore, the improvement direction of the electroplating device can be found according to the turbulent flow state of the electroplating fluid, so that the electroplating device can be improved in time, the electroplating uniformity is improved, and the electroplating quality is improved.
In the present application, the apparatus embodiments and the method embodiments may complement each other without conflict. The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of the application. One of ordinary skill in the art can understand and implement it without inventive effort.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims (10)

1. A fluid monitoring device, comprising: a container and a hydrodynamic force monitoring section;
the container comprises a transparent part, and the fluid power monitoring part is positioned in the container and fixed on the transparent part;
the container is used for containing fluid;
when the fluid is disturbed, the state of the fluid dynamic monitoring part is visually changed, and the state of the fluid dynamic monitoring part is changed along with the change of the disturbed state of the fluid, and the state of the fluid dynamic monitoring part is used for indicating the disturbed state of the fluid, wherein the disturbed state comprises the circulation direction and/or the disturbed amplitude of the fluid.
2. The fluid monitoring device of claim 1, wherein the container is a plating bath and the material of the transparent portion is a corrosion resistant material;
the transparent portion is at least a portion of a sidewall of the container.
3. A fluid monitoring device according to claim 2 wherein the transparent portion is of polypropylene.
4. The fluid monitoring device of claim 1, wherein the hydrodynamic monitoring portion comprises N clusters of ribbons, wherein each cluster of ribbons comprises at least one ribbon, wherein the N clusters of ribbons are affixed to N locations on the transparent portion, respectively, the N locations being evenly distributed on the transparent portion; n is a positive integer.
5. The fluid monitoring device of claim 4, wherein the ribbon is made of chemical fiber.
6. The fluid monitoring device of claim 5, wherein the ribbon material is polyimide fiber.
7. The fluid monitoring device according to claim 1, further comprising a fluid pressure monitoring portion located within the container and secured to the transparent portion for monitoring a pressure profile of the fluid.
8. The fluid monitoring device of claim 7 wherein the fluid pressure monitoring portion is a pressure measuring membrane overlying the transparent portion, the hydrodynamic monitoring portion being secured to the pressure measuring membrane.
9. The fluid monitoring device of claim 7, wherein the fluid pressure monitoring portion comprises a plurality of pressure sensors arranged in an array, and the fluid dynamic monitoring portion is fixed to the plurality of pressure sensors.
10. The fluid monitoring device of claim 1, further comprising a heater, a circulation pump, and a rocking mechanism;
the heater, the circulating pump and the swing mechanism are respectively positioned in the container;
the heater is used for heating the fluid, the circulating pump is used for promoting the fluid to circulate, and the swing mechanism is used for stirring the fluid.
CN202011457748.6A 2020-12-10 2020-12-10 Fluid monitoring device Active CN114622264B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN202011457748.6A CN114622264B (en) 2020-12-10 2020-12-10 Fluid monitoring device

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CN114622264A true CN114622264A (en) 2022-06-14
CN114622264B CN114622264B (en) 2023-06-27

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1449491A (en) * 2000-02-23 2003-10-15 卡钳技术有限公司 Multi-reservoir pressure control system
TW200502442A (en) * 2003-07-03 2005-01-16 Suntek Compound Semiconductor Co Ltd Electroplating apparatus
US20110226614A1 (en) * 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
CN208104598U (en) * 2018-03-19 2018-11-16 广州市深盈新材料有限责任公司 Purifying electroplating solution alarm system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1449491A (en) * 2000-02-23 2003-10-15 卡钳技术有限公司 Multi-reservoir pressure control system
TW200502442A (en) * 2003-07-03 2005-01-16 Suntek Compound Semiconductor Co Ltd Electroplating apparatus
US20110226614A1 (en) * 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
CN208104598U (en) * 2018-03-19 2018-11-16 广州市深盈新材料有限责任公司 Purifying electroplating solution alarm system

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