CN114616213A

CN114616213A - Glass manufacturing apparatus and method

Info

Publication number: CN114616213A
Application number: CN202080062948.3A
Authority: CN
Inventors: 阿列克谢·谢尔盖耶维奇·阿莫索夫; 罗伯特·迪莉娅; 布朗特科·卡图卢姆; 亚历山大·拉马尔·罗宾逊; 威廉·安东尼·惠登
Original assignee: Corning Inc
Current assignee: Corning Inc
Priority date: 2019-08-12
Filing date: 2020-08-04
Publication date: 2022-06-10
Also published as: TW202120444A; JP2022544409A; WO2021030097A1; KR20220047604A

Abstract

The glass manufacturing apparatus can include a forming device having a conduit. The tube may include a tube wall defining a flow passage and a slot extending through the tube wall. The glass manufacturing apparatus may further comprise a thermal control device for defining a thermal control path. The projection of the thermal control path may intersect the footprint limited by the outer perimeter of the slot. The method of making glass may comprise: the molten material is caused to flow in a flow direction of the flow path. The method may also include: the molten material is allowed to flow through the footprint of the slot. The method may further comprise: a thermal control device is operated to define a thermal control path. The projection of the thermal control path may intersect the footprint. The method may additionally comprise: adjusting a temperature of the molten material at a location where the thermal control path intersects the molten material.

Description

Glass manufacturing apparatus and method

Technical Field

This application claims priority to U.S. provisional application No. 62/885,478 filed on 12.8.2019, the contents of which are hereby incorporated by reference in their entirety.

Background

It is known to process molten material into a glass ribbon using forming equipment. Known forming apparatuses may operate to draw a quantity of molten material downward from the forming apparatus as a glass ribbon that may be separated into glass sheets. For example, glass sheets are often used in display applications (e.g., Liquid Crystal Displays (LCDs), electrophoretic displays (EPDs), organic light emitting diode displays (OLEDs), Plasma Display Panels (PDPs), touch sensors, photovoltaics, or the like).

Disclosure of Invention

The following presents a simplified summary of the disclosure in order to provide a basic understanding of some example embodiments described in the detailed description.

In some embodiments, a glass manufacturing apparatus can include a forming device. The forming means may comprise a tube having a tube wall for defining the flow passage. The forming means may comprise a slot in fluid communication with the flow passage and extending through the wall of the conduit. The slot may contain a footprint limited by an outer perimeter of the slot. The glass manufacturing apparatus may also include a thermal control device for defining a thermal control path whose projection intersects the occupied space.

In a further embodiment, the forming device may further comprise a first wall comprising the first outer surface. The first wall may be attached at a first peripheral location of the outer surface of the pipeline wall. The forming device may also include a second wall including a second outer surface. The second wall may be attached at a second peripheral location of the outer surface of the pipeline wall. The first outer surface and the second outer surface may converge at a root of the forming device. The integration interface may comprise forming a root of the device.

In a further embodiment, the projection may be limited by the occupied space.

In further embodiments, the thermal control device may comprise a plurality of thermal control devices arranged along the flow direction of the flow passage.

In further embodiments, the conduit wall may comprise a thickness in a range from about 0.5 millimeters to about 10 millimeters.

In further embodiments, the tube wall may comprise platinum or a platinum alloy.

In a further embodiment, the heat control means may comprise an electric heater.

In still further embodiments, the electric heater may comprise a plurality of electric heaters. The thermal insulator may be positioned between a first electric heater of the plurality of electric heaters and a second electric heater of the plurality of electric heaters.

In still further embodiments, the electric heater may comprise one or more of molybdenum disilicide, silicon carbide, or lanthanum chromite.

In a further embodiment, the thermal control means may comprise a gas nozzle.

In a further embodiment, the thermal control device may comprise a laser.

In still further embodiments, the laser may be configured to emit a laser beam comprising a wavelength in a range of about 760 nanometers to about 5000 nanometers.

In still further embodiments, the mirror may be configured to reflect the laser beam emitted from the laser such that the laser beam scans the footprint.

In still further embodiments, the mirror may be rotatable.

In still further embodiments, the mirror may comprise a polygonal mirror.

In still further embodiments, the laser may comprise a plurality of laser diodes.

In further embodiments, the glass manufacturing apparatus can further include a housing including a wall defining an interior region and a wall passage extending through the wall. The forming device may be positioned in the interior region.

In still further embodiments, the thermal control path may be aligned with the passageway.

In still further embodiments, the glass manufacturing apparatus can additionally comprise a tube positioned within the wall passageway.

In still further embodiments, the thermal control device may comprise a gas nozzle.

In still further embodiments, the housing may comprise an inner surface facing the forming means and an outer surface opposite the inner surface. The thermal insulator may extend from the exterior surface.

In a further embodiment, the electric heater may be rotatable about an axis.

In still further embodiments, the wall passage may comprise a slot comprising a length and a width less than the length.

In a further embodiment, the thermal control device may comprise a laser.

In still further embodiments, the laser may be configured to scan the length of the conduit by emitting a laser beam through the wall passageway.

In still further embodiments, the laser may comprise a laser diode. The laser diode may be optically coupled to the first end of the optical fiber. The second end of the optical fiber may face the slot.

In still further embodiments, the optical fiber may extend partially through the wall passage.

In some embodiments, a method of making glass can comprise: the molten material is caused to flow in a flow direction along a flow path defined by a tube wall of the tube. The slot may extend through the conduit wall and may contain a footprint limited by an outer perimeter of the slot. The method may comprise: the molten material is caused to flow through the space occupied by the slot. The method may also include: a thermal control device is operative to define a thermal control path whose projection intersects the footprint. The method may further comprise: adjusting a temperature of the molten material at a location where the thermal control path intersects the molten material.

In a further embodiment, the method may comprise: flowing a first stream of molten material from the location along a first outer surface of a forming device in a first direction. The method may also include: flowing a second stream of molten material from the location along a second outer surface of the forming device in a second direction. The first and second flows can converge to form a glass ribbon.

In a further embodiment, the location may lie entirely within a projection of the footprint extending outwardly from the slot in an outward direction perpendicular to the flow direction.

In a further embodiment, adjusting the temperature of the molten material at the location may comprise: the temperature of the molten material is reduced.

In a further embodiment, operating the thermal control device may comprise: gas is ejected from the gas nozzle.

In a further embodiment, adjusting the temperature of the molten material at the location may comprise: the temperature of the molten material is increased.

In still further embodiments, operating the thermal control device may comprise: electricity is circulated through the heating element.

In still further embodiments, the method may comprise: the heating element is caused to rotate about the axis.

In still further embodiments, operating the thermal control device may comprise: a laser beam is emitted from a laser.

In still further embodiments, the absorption depth of the laser beam in the molten material may range from about 50 microns to about 10 millimeters.

In still further embodiments, the laser beam may comprise a wavelength in a range from about 760 nanometers to about 5000 nanometers.

In still further embodiments, the method may comprise: the laser beam is scanned over the length of the slit.

In still further embodiments, the method may comprise: the laser beam emitted from the laser is reflected off the mirror.

In still further embodiments, the method may comprise: the mirror is rotated.

In still further embodiments, the mirror may comprise a polygonal mirror.

Additional features and advantages of the embodiments described herein will be disclosed in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments described herein, including the detailed description which follows, the claims, as well as the appended drawings. It is to be understood that both the foregoing general description and the following detailed description present embodiments, and are intended to provide an overview or framework for understanding the nature and character of the embodiments described herein. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate various embodiments of the disclosure and, together with the description, explain the principles and operations thereof.

Drawings

These and other features, embodiments and advantages of the present disclosure may be better understood when read in conjunction with the following drawings, wherein:

FIG. 1 schematically illustrates an exemplary embodiment of a glass manufacturing apparatus according to an embodiment of the present disclosure;

FIG. 2 illustrates a cross-sectional view of the forming device along line 2-2 of FIG. 1;

FIG. 3 is an enlarged view 3 of FIG. 2;

FIG. 4 illustrates a cross-sectional view of the forming device along line 4-4 of FIG. 2;

FIG. 5 is an enlarged view 5 of FIG. 2, according to some embodiments of the present disclosure;

FIG. 6 is an enlarged view 5 of FIG. 2, according to some embodiments of the present disclosure;

FIG. 7 is an enlarged view 5 of FIG. 2, according to some embodiments of the present disclosure;

FIG. 8 is an enlarged view 5 of FIG. 2, according to some embodiments of the present disclosure;

FIG. 9 illustrates a view of the thermal control device along line 9-9 of FIG. 6;

fig. 10 illustrates a side view of a thermal control device according to some embodiments of the present disclosure; and

figure 11 illustrates a cross-sectional view of the thermal control device along line 11-11 of figure 7.

Detailed Description

Referring now to the drawings, which illustrate exemplary embodiments of the present disclosure, embodiments will be described more fully below. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Unless otherwise stated, discussion of features of one embodiment of the present disclosure may be equally applicable to corresponding features of other embodiments of the present disclosure. The glass ribbon from any of these embodiments can then be subsequently separated to provide a plurality of glass articles (e.g., separated glass ribbons) suitable for further processing into applications (e.g., display applications). For example, glass articles (e.g., discrete glass ribbons) may be used in various applications including Liquid Crystal Displays (LCDs), electrophoretic displays (EPDs), organic light emitting diode displays (OLEDs), Plasma Display Panels (PDPs), touch sensors, photovoltaics, or the like.

Embodiments disclosed herein may provide technical benefits of using a thermal control device to adjust the mass flow rate, viscosity, and/or temperature of molten material exiting a slot of a conduit forming the device. Embodiments of the present disclosure may provide local control and/or adjustment of the mass flow rate, viscosity, and/or temperature of the molten material. The location at which the mass flow rate, viscosity, and/or temperature location of the molten material can be controlled may lie entirely within a projection of the footprint defined by the outer perimeter of the slot. In addition, acting on the molten material exiting the slot may reduce the need for additional thermal control at a later stage of the glass making process. The design of the slot may be used to reduce the area of the thermal control device acting on the molten material. Embodiments including thin conduit walls (e.g., about 0.5mm to about 10mm) can reduce the thermal mass of the forming device near where the thermal control device acts on the molten material, and can increase the effectiveness of the thermal control device. Adjusting the mass flow rate, viscosity, and/or temperature of the molten material may also allow for simultaneous control of the first flow of molten material and the second flow of molten material according to embodiments of the present disclosure. Further, providing a forming device within the interior region of the enclosure can reduce (e.g., minimize, prevent) uncontrolled heat loss and/or the effects of thermal current on the quality of the glass ribbon produced, while increasing the locality of the effect of the thermal control device. Providing access through the wall of the enclosure may allow a thermal control device positioned at least partially outside of the interior region to act on the molten material. Providing a passageway with a tube may further reduce uncontrolled heat loss and/or thermal current, and allow for adjustment (e.g., repositioning, removal, insertion, replacement) for the thermal control device. Providing a thermal insulator extending from the exterior surface of the wall of the housing may further localize the effect of the thermal control device.

As schematically illustrated in fig. 1, in some embodiments, a glass manufacturing apparatus 100 may include a glass melting and delivery apparatus 102 and a forming apparatus 101, the forming apparatus 101 including a forming device 140 designed to produce a glass ribbon 103 from a quantity of molten material 121. The term "glass ribbon" as used herein refers to a material after being drawn from the forming device 140 even if the material is not in a glass state (e.g., above its glass transition temperature). In some embodiments, the glass ribbon 103 can include a central portion 152, the central portion 152 positioned between opposing edge beads formed along a first outer edge 153 and a second outer edge 155 of the glass ribbon 103. Further, in some embodiments, the separated glass ribbon 104 can be separated from the glass ribbon 103 along a separation path 151 by a glass separator 149 (e.g., score line, score wheel, diamond tip, laser). In some embodiments, the edge beads formed along the first outer edge 153 and the second outer edge 155 can be removed before or after separating the separated glass ribbon 104 from the glass ribbon 103 to provide the central portion 152 as a separated glass ribbon 104 having a more uniform thickness.

In some embodiments, the glass melting and delivery apparatus 102 may include a melting vessel 105, the melting vessel 105 being oriented to receive batch material 107 from the storage bin 109. The batch material 107 may be introduced by a batch delivery device 111 powered by a motor 113. In some embodiments, the controller 115 may be selectively operated to activate the motor 113 to introduce a quantity of the batch material 107 into the melting vessel 105, as indicated by arrow 117. The melting vessel 105 may heat the batch material 107 to provide a molten material 121. In some embodiments, glass melting probe 119 can be used to measure the level of molten material 121 within standpipe 123 and communicate the measurement information to controller 115 via communication line 125.

Further, in some embodiments, the glass melting and delivery apparatus 102 may include a first conditioning station including a fining vessel 127 and located downstream from the melting vessel 105 to couple to the melting vessel 105 through a first connecting conduit 129. In some embodiments, the molten material 121 may be gravity fed from the melting vessel 105 to the fining vessel 127 by way of the first connecting conduit 129. For example, in some embodiments, gravity may drive molten material 121 from melting vessel 105 to fining vessel 127 through the internal path of first connecting conduit 129. Further, in some embodiments, bubbles may be removed from the molten material 121 within the fining vessel 127 by various techniques.

In some embodiments, the glass melting and delivery apparatus 102 may further comprise a second conditioning station comprising a mixing chamber 131 that may be located downstream of the fining vessel 127. The mixing chamber 131 may be used to provide a uniform composition of the molten material 121, thereby reducing or eliminating non-uniformities that may be present in the molten material 121 exiting the fining vessel 127. As shown, the fining vessel 127 may be coupled to the mixing chamber 131 by a second connecting conduit 135. In some embodiments, the molten material 121 may be gravity fed from the fining vessel 127 to the mixing chamber 131 through the second connecting conduit 135. For example, in some embodiments, gravity may drive the molten material 121 from the fining vessel 127 through the internal path of the second connecting conduit 135 to the mixing chamber 131.

Further, in some embodiments, the glass melting and delivery apparatus 102 can include a third conditioning station that includes a delivery vessel 133 that can be located downstream from the mixing chamber 131. In some embodiments, the delivery vessel 133 can condition the molten material 121 fed to the inlet conduit 141. For example, the delivery vessel 133 may act as an accumulator and/or flow controller to adjust and provide a consistent flow of molten material 121 to the inlet conduit 141. As shown, the mixing chamber 131 may be coupled to the delivery vessel 133 by a third connecting conduit 137. In some embodiments, the molten material 121 may be gravity fed from the mixing chamber 131 to the delivery vessel 133 through a third connecting conduit 137. For example, in some embodiments, gravity may drive the molten material 121 from the mixing chamber 131 through the internal path of the third connecting conduit 137 to the delivery container 133. As further illustrated, in some embodiments, the delivery line 139 may be positioned to deliver the molten material 121 to the forming apparatus 101 (e.g., the inlet conduit 141 of the forming device 140).

Forming apparatus 101 may include a forming device 140 having a forming wedge (e.g., forming wedge 209 of fig. 2) for drawing (e.g., fusion drawing) glass ribbon 103. In the manner illustrated with reference to fig. 2, the forming device 140 shown and described below may be provided to draw (e.g., fusion draw) the molten material 121 from the bottom edge (defined as root 235) of the forming wedge 209 to produce a ribbon of molten material 121 that may be drawn into the glass ribbon 103. For example, in some embodiments, the molten material 121 may be delivered from the inlet conduit 141 to the forming device 140. The molten material 121 may then be formed into a glass ribbon 103 depending in part on the configuration of the forming device 140. For example, as shown, the molten material 121 may be drawn from a bottom edge (e.g., root 235) of the forming device 140 along a draw path that extends in the draw direction 154 of the glass manufacturing apparatus 100. In some embodiments, edge directors 237, 238 (see fig. 4) may direct the molten material 121 away from the forming device 140 and at least partially define the width "W" of the glass ribbon 103. In some embodiments, the width "W" of the glass ribbon 103 can extend between the first outer edge 153 of the glass ribbon 103 and the second outer edge 155 of the glass ribbon 103. In some embodiments, the width "W" of the glass ribbon 103 can be about 20 millimeters (mm) or more, about 50mm or more, about 100mm or more, about 500mm or more, about 1000nn or more, about 2000mm or more, about 3000mm or more, about 4000mm or more, although other widths can be provided in other embodiments. In some embodiments, the width "W" of the glass ribbon 103 may range from about 20mm to about 4000mm, from about 50mm to about 4000mm, from about 100mm to about 4000mm, from about 500mm to about 4000mm, from about 1000mm to about 4000mm, from about 2000mm to about 4000mm, from about 3000mm to about 4000mm, from about 20mm to about 3000mm, from about 50mm to about 3000mm, from about 100mm to about 3000mm, from about 500mm to about 3000mm, from about 1000mm to about 3000mm, from about 2000mm to about 2500mm, or any range and subrange therebetween.

Fig. 2 illustrates a cross-sectional view of forming apparatus 101 (e.g., forming device 140) along line 2-2 of fig. 1. In some embodiments, forming device 140 may include a conduit 201 oriented to receive molten material 121 from inlet conduit 141. The forming device 140 may further include a forming wedge 209, the forming wedge 209 including a first wall 213 and a second wall 214, the first wall 213 and the second wall 214 including a pair of downwardly sloping converging surface portions. The first wall 213 and the second wall 214 may comprise the pair of opposing downwardly inclined converging surface portions that form the wedge 209 converging along the draw direction 154 and intersecting along the root 235 of the forming device 140. As used herein, the locations on the forming device 140 and its parts of the present disclosure are referred to as upstream or downstream relative to another location depending on the direction of stretching 154. Further, in some embodiments, the molten material 121 may flow into and along the conduit 201 forming the device 140. As shown in fig. 2, the tube 201 may include a tube wall 205, the tube wall 205 including an inner surface 206 defining a flow passage 207. As shown, the tube wall 205 partially circumscribes the flow passage 207 to define the flow passage 207. As shown, the conduit 201 may include a slot 203 in fluid communication with the flow passage 207 and extending through the conduit wall 205. As shown, the slot 203 may extend through an opening in the outer surface 204 of the tube wall 205, an opening in the inner surface 206 of the tube wall 205, and the thickness of the tube wall 205 defined between the outer surface 204 and the inner surface 206. The slot 203 may comprise a single continuous slot, but multiple slots aligned along the flow direction 208 (see fig. 4) of the flow path 207 may also be provided. In some embodiments, although not shown, the slot 203 may include an enlarged end. In some embodiments, although not shown, the slots 203 may vary along the flow direction 208 by, for example, intermittently or continuously decreasing from the intermediate portion to the first outer end portion and the second outer end portion. Further, although not shown, the slots 203 may include multiple rows of slots that may extend along the flow direction 208 and parallel to one another.

As shown in fig. 3, the slot 203 may contain a footprint 301 that is limited by an outer perimeter 303 of the slot 203. For purposes of this application, the footprint 301 of slot 203 is considered to be the smallest slot area defined by the innermost portion of outer perimeter 303 that serves to confine slot 203. The innermost portion of outer perimeter 303 of slot 203 may include the outermost edges or surfaces at outer surface 204 and/or inner surface 206 or between outer surface 204 and/or inner surface 206 of tube wall 205. For example, as shown in fig. 3, the footprint 301 is defined by the innermost edge 305 of the slot 203 at the inner surface 206 of the pipeline wall 205. As shown, the innermost edge 305 defines a slot width 307 along a direction perpendicular to the flow direction 208.

As shown in fig. 2 and 4, the slot 203 may comprise a through slot extending through the duct wall 205. As shown, in some embodiments, the slot 203 may open the outer surface 204 and the inner surface 206 of the tube wall 205 to provide fluid communication between the flow passage 207 and the outer surface 204 of the tube wall 205. As can be appreciated from fig. 2 and 4, a slot 203 (optionally including a plurality of slots) may be provided in the outer surface 204 of the tube wall 205 at the apex of the tube 201 in any of the embodiments of the present disclosure. In further embodiments, a slot (optionally including a plurality of slots) may extend along a slot plane bisecting the slot, and may further bisect the tube 201 and/or the root 235. Without wishing to be bound by theory, bisecting conduit 201 and/or root 235 along the uppermost point of conduit 201 with a slot plane (e.g., for bisecting the slot) may help to evenly divide the molten material exiting the slot into counter-flowing streams (e.g., first stream 211 of molten material 121, second stream 212 of molten material 121).

The conduit wall 205 of the conduit 201 may comprise an electrically conductive material. As used herein, a material is electrically conductive if it has a resistivity of about 0.0001 ohm-meters (Ω -m) or less at 20 ℃ (e.g., a conductivity of about 10000 siemens per meter (S/m) or higher). Examples of conductive materials include manganese, nichrome (e.g., nickel-chromium), steel, titanium, iron, nickel, zinc, tungsten, gold, copper, silver, platinum, rhodium, iridium, osmium, palladium, ruthenium, and combinations thereof. In further embodiments, the tube wall 205 of the tube 201 may comprise platinum or a platinum alloy, but other materials that may be compatible with the molten material and provide structural integrity at high temperatures may also be provided. In some embodiments, the platinum alloy may comprise platinum rhodium, platinum iridium, platinum palladium, platinum gold, platinum osmium, platinum ruthenium, and combinations thereof. In some embodiments, the platinum or platinum alloy may also include a refractory metal (e.g., molybdenum, rhenium, tantalum, titanium, tungsten, ruthenium, osmium, zirconium dioxide (zirconia), and/or alloys thereof). In further embodiments, the platinum or platinum alloy may comprise an oxide dispersion strengthened material. In further embodiments, the entire tube wall 205 may comprise or consist essentially of platinum or a platinum alloy. Thus, in some embodiments, a conduit may comprise platinum tubing 201, with the platinum tubing 201 comprising a tubing wall 205 defining a flow path 207. In some embodiments, the tube wall may comprise one or more of the above materials other than platinum. The thickness of the tube wall 205 may be defined between the outer surface 204 of the tube wall 205 and the inner surface 206 of the tube wall 205. To reduce the material cost of the conduit 201 (e.g., a platinum conduit), the conduit wall 205 of the conduit may have a thickness in a range of about 0.5 millimeters (mm) to about 10mm, about 0.5mm to about 7mm, about 0.5mm to about 3mm, about 1mm to about 10mm, about 1mm to about 7mm, about 3mm to about 10mm, about 3mm to about 7mm, or any range or subrange therebetween. Providing a tube 201 having a tube wall 205 thickness within any of the above ranges may provide a thickness that is sufficiently large to provide a desired level of structural integrity for the tube 201, while also providing a thickness that may be minimized to reduce the material cost of producing the tube 201 (e.g., platinum tube). Providing a tube wall 205 having a thin thickness (e.g., about 0.5mm to about 10mm) can reduce the thermal mass of the forming device 140 around a location 315 (see fig. 3) where the thermal control device 251 acts on the molten material 121, which can increase the effectiveness of the thermal control device 251.

The conduit wall 205 of the conduit 201 may comprise a wide range of sizes, shapes, and configurations to reduce manufacturing and/or assembly costs and/or increase the functionality of the conduit 201. For example, as shown, the outer surface 204 and/or the inner surface 206 of the tube wall 205 may comprise a circular shape, but other curvilinear (e.g., elliptical) or polygonal shapes may be provided in further embodiments. Providing a curvilinear shape (e.g., a circular shape) for both outer surface 204 and inner surface 206 may provide a conduit wall 205 with a constant thickness, and may provide a conduit wall 205 with high structural strength and help promote consistent flow of molten material 121 through flow passage 207 of conduit 201. Furthermore, as will be appreciated from fig. 2 and 4, the outer surface 204 and/or the inner surface 206 of the conduit 201 may include a geometrically similar rounded shape (or other shape) along the length in a direction perpendicular to the views shown in fig. 2 and 4. In such embodiments, the flow rate through the slot 203 may be controlled (e.g., maintained substantially the same) by modifying the width of the slot 203.

The conduit 201 of any of the embodiments of the present disclosure may comprise a continuous conduit, although segmented conduits may be provided in further embodiments. For example, the conduit 201 may comprise a continuous conduit that is not segmented along its length. Such continuous tubing may be beneficial in providing seamless tubing with increased structural strength. In some embodiments, a segmented conduit may be provided. For example, the conduit 201 forming the device 140 may optionally comprise conduit sections that may be connected together in series at a joint between abutting ends of pairs of adjacent conduit sections. In some embodiments, the joint may comprise a welded joint to integrally join the pipe sections as an integrated pipe. In some embodiments, the joint may comprise a diffusion bonded joint, a male/female joint, or a threaded joint. Providing the tubing 201 as a series of tubing sections may simplify the manufacture of the tubing 201 in some applications.

As shown in fig. 2, forming the wedge 209 may include a first wall 213 defining a first outer surface 223 and a second wall 214 defining a second outer surface 224. As shown in fig. 2, in some embodiments, a first wall 213 (e.g., a platinum wall) may be attached to a tube wall 205 of a tube 201 (e.g., a platinum tube) by a first interface at a first peripheral location 208a of an outer surface 204 of the tube 201. Likewise, a second wall 214 (e.g., a platinum wall) can be attached to the tubing wall 205 of the tubing 201 (e.g., a platinum tubing) at a second peripheral location 208b of the outer surface 204 of the tubing 201 via a second interface. As shown, each of the first and second

peripheral locations

208a, 208b may be located downstream of the slot 203 of the conduit 201. Thus, the slot 203 may be located circumferentially between the first and second

peripheral locations

208a, 208 b. In some embodiments, the upstream end of the first wall 213 and the upstream end 214 of the second wall may be integrally joined to the pipeline wall 205 of the pipeline 201 and machined to have a smooth corresponding interface between the outer surface 204 of the pipeline 201 and the outer surface of the walls (e.g., the first outer surface 223 of the first wall 213, the second outer surface 224 of the second wall 214). In some embodiments, integrally joining the upstream end of the first wall 213 and the upstream end of the second wall 214 to the pipeline wall 205 may include forming a joint (e.g., a welded joint, a diffusion bonded joint, a male/female joint, or a threaded joint).

In some embodiments, as shown in fig. 2-3, the upstream portion of first wall 213 and the upstream portion of second wall 214 may initially flare relative to each other along stretch direction 154 from an interface corresponding to conduit 201. Without wishing to be bound by theory, in some embodiments, expanding the first and second walls apart from each other may facilitate the flow of molten material along the direction of stretching while also allowing for increased space for the support beams. In some embodiments, although not shown, the upstream portions of the first and second walls may be parallel to each other.

In some embodiments, as shown in fig. 2, the first outer surface 223 and the second outer surface 224 may converge along the stretch direction 154 to form a root 235 that forms the wedge 209. In some embodiments, root 235 may include an integral interface where first outer surface 223 meets second outer surface 224. In some embodiments, the integration interface may comprise a single (e.g., monomeric) material, or may comprise a linker. In further embodiments, the joint may comprise a diffusion bonded joint, a male/female joint, or a threaded joint.

In some embodiments, the first wall 213 and/or the second wall 214 forming the device 140 may comprise a conductive material, as defined above. In further embodiments, the first wall 213 and/or the second wall 214 may comprise platinum and/or a platinum alloy similar or identical in composition to the conduit 201 described above, although in further embodiments different compositions may be used. In still further embodiments, each of the first wall 213 and the second wall 214 may comprise platinum. In further embodiments, the first wall 213 and/or the second wall 214 may comprise one or more of the materials described above for the conduit 201 without comprising platinum. The thickness 225 of the first wall 213 may be defined between the first outer surface 223 and the first inner surface 233. The thickness 226 of the second wall 214 may be defined between the second outer surface 224 and the second inner surface 234. To reduce material costs, the thickness 225 of the first wall 213 and/or the thickness 226 of the second wall 214 (e.g., a platinum wall) may range, for example, from 0.5mm to about 10mm, from about 0.5mm to about 7mm, from about 0.5mm to about 3mm, from about 1mm to about 10mm, from about 1mm to about 7mm, from about 3mm to about 10mm, from about 3mm to about 7mm, or any range or subrange therebetween. The reduced thickness may result in an overall reduced material cost.

As shown in fig. 2, the first wall 213 may include a first inner surface 233 opposite the first outer surface 223 of the first wall 213. As shown, the second wall 214 may include a second inner surface 234 opposite the second outer surface 224 of the second wall 214. As shown in fig. 2, the first inner surface 233 and the second inner surface 234 may partially define the cavity 220 within the device 140. In some embodiments, cavity 220 may be further defined by a tube wall 205 of tube 201. As discussed below, the support beam 157 may be positioned within the cavity 220 defined in part by the first inner surface 233 and the second inner surface 234.

As shown in fig. 2 and 4, support beams 157 positioned in the cavity 220 may support the weight of the conduit 201 and the molten material 121 within the flow path 207. In further embodiments, in addition to supporting the weight of the pipe 201 and the molten material 121 associated with the pipe 201, the support beams 157 may be configured to help maintain the shape and/or size of the pipe 201 (e.g., the shape and size of the slots 203). In some embodiments, as shown in FIG. 1, the support beams 157 may extend laterally outside the width of the root 235 while supporting (e.g., simply supporting) at opposing locations 158a, 158 b. Thus, the support beam 157 may be longer than the width "W" of the formed glass ribbon 103 and may extend through the cavity 220 (extending laterally through the forming device 140) to fully support the forming device 140. Furthermore, as shown in FIG. 2, the support beam 157 may be positioned between the first wall 213 and the second wall 214 within the cavity 220 forming the device 140 despite the low thickness of the first wall 213 and/or the second wall 214, while providing a wall with sufficient structural integrity to resist deformation during use. Thus, the structure of the first wall 213 and the second wall 214 may be maintained by the support beams 157 positioned therebetween. Further, the first wall 213 and the second wall 214 converge along the draw direction 154 to form the root 235, wherein the first wall 213 and the second wall 214 may form a strong triangular configuration. Thus, a structurally rigid configuration can be achieved with thin walls within the above specified range.

For example, the support beam of the present disclosure may be provided as a single monolithic support beam. In some embodiments, although not shown, the support beams may optionally include a first support beam and a second support beam for supporting the first support beam. In further embodiments, the first support beam and the second support beam may comprise a stack of support beams, wherein the first support beam is stacked on top of the second support beam. Providing a stack of support beams may simplify and/or reduce manufacturing costs. For example, in some embodiments, the second support beam may be longer than the first support beam such that opposing end portions of the second support beam may extend laterally outside of the width of the root 235 with supports (e.g., simple supports) at opposing locations (e.g., locations 158a, 158 b). Thus, the second support beam may be longer than the width "W" of the formed glass ribbon 103 and may extend through the cavity 220 (laterally through the forming device 140) to fully support the forming device 140. Additionally, the second support beam may include a shape (e.g., a rectangular shape as shown), but a hollow shape, I-beam shape, or other shape may be provided to reduce material costs while still providing a high moment of inertia for the support beam. In addition, the first support beam may be manufactured to have a shape that supports the conduit to help maintain the shape and size of the conduit as described above.

In some embodiments, the support beams 157 may comprise a support material comprising one or more ceramics. Exemplary embodiments of the ceramic material for the support beam may include silicon carbide (SiC). In some embodiments, other ceramics (e.g., oxides, carbides, nitrides, oxynitrides) may be used in the support beam. In some embodiments, the support material can be designed to be at about 1200 ℃ or higher, about 1300 ℃ or higher, about 1400 ℃ or higher, about 150Maintain its mechanical properties and dimensional stability at a temperature of 0 ℃ or higher, about 1600 ℃ or higher, or about 1700 ℃ or lower. In further embodiments, the support beams 157 may utilize 1 x 10 at temperatures of about 1400 ℃ or higher and pressures of about 1 megapascals (MPa) to 5MPa^-12s^-1To 1X 10^-14s^-1Is made of a support material having a creep rate of. Such support materials may provide sufficient support at high temperatures (e.g., 1400 ℃) for the conduit and molten material carried by the conduit with minimal creep to provide a forming device 140 for minimal use of platinum or other expensive refractory materials that physically contact the molten material without contaminating the molten material, while providing support beams 157 made of inexpensive materials that can withstand greater stresses under the weight of the forming device 140 and the molten material 121 carried by the forming device 140. At the same time, the support beams 157 made of the above materials may withstand creep under high stress and high temperature to allow the position and shape of the conduit and the walls associated with the conduit (e.g., platinum walls) to be maintained. In other embodiments, the support beam 157 may comprise a first support beam and a second support beam, and the first support beam and the second support beam may be made of substantially the same or equivalent materials, although alternative materials may be provided in other embodiments.

In some embodiments, the material of the first wall 213 and/or the second wall 214 may not be compatible with physical contact with the material of the support beams 157. For example, in some embodiments, the first wall 213 and/or the second wall 214 may comprise platinum (e.g., platinum or a platinum alloy), and the support beam 157 may comprise a support material (e.g., silicon carbide) that may corrode or chemically react with the platinum of the first wall 213 and/or the second wall 214 if the platinum is allowed to contact the support beam 157. Thus, in some embodiments, to avoid contact between incompatible materials, any portion of the walls (e.g., first wall 213, second wall 214) and any portion of the pipeline 201 may be prevented from physically contacting any portion of the support beam 157. As shown, for example, in fig. 2, the first wall 213 is spaced apart from each of the second walls 214 without physically contacting any portion of the support beam 157. Further, the conduit 201 may be spaced from any portion of the support beam 157 without physical contact. Various techniques may be used to space the walls from the support beams 157. For example, struts or ribs may be provided to provide spacing.

In some embodiments, as shown, an intermediate layer of material 210 may be provided between the walls (e.g., first wall 213, second wall 214) and the support beams 157 to space the respective walls (e.g., first wall 213, second wall 214) apart from contact with the support beams 157. In further embodiments, the layer of intermediate material 210 may be provided continuously between all portions of the first wall 213 and/or the second wall 214 and adjacent spaced portions of the support beam 157. In some embodiments, as shown, an intermediate layer of material 210 may be provided between the pipe 201 and the support beams 157 to space the pipe 201 apart from contact with the support beams 157. In further embodiments, the layer of intermediate material 210 may be provided continuously between all portions of the pipeline 201 and adjacent spaced portions of the support beams 157. Without wishing to be bound by theory, providing a continuous intermediate layer of material 210 may promote uniform support across all portions of first wall 213, second wall 214, and conduit 201 by support beams 157 spaced from the structure described above. Various materials may be used as the intermediate material 210 depending on the materials of the walls (e.g., the first wall 213, the second wall 214) and the support beam 157. For example, intermediate material 210 may comprise a compatible material for contacting conduit 201, first wall 213 and/or second wall 214 (e.g., platinum), and a support member (e.g., silicon carbide) under the high temperature and high pressure conditions associated with utilizing forming device 140 to contain and direct molten material 121. In some embodiments, the intermediate material 210 may comprise a refractory material. Exemplary embodiments of suitable refractory materials include zirconia and alumina. In some embodiments, other refractory materials (e.g., oxides, quartz, mullite) may be used. Thus, in other embodiments, the platinum or platinum alloy walls (e.g., first wall 213, second wall 214) and the platinum tube (e.g., conduit 201) may be spaced apart by the layer of intermediate material 210 (e.g., alumina) without physically contacting any portion of the support beam 157 (e.g., comprising silicon carbide).

In some embodiments, as shown in fig. 2 and 4-10, the glass manufacturing apparatus 100 can include a housing 240 having a housing wall 241, the housing wall 241 being defined between an interior surface 243 and an exterior surface 245, the exterior surface 245 being opposite the interior surface 243 of the housing wall 241. In some embodiments, the interior region 247 of the housing 240 may be defined by an interior surface 243 of the housing wall 241. In some embodiments, an interior surface 243 of the housing wall 241 may face the forming device 140. In some embodiments, the housing wall 241 at least partially surrounds the forming device 140 such that the forming device 140 and a portion of the glass ribbon 103 are positioned within the interior region 247 of the housing 240. As shown, the bulk material of the housing 240 between the inner surface 243 and the outer surface 245 may comprise a first material, which may be a ceramic or other material having a low thermal conductivity. Without wishing to be bound by theory, materials with lower thermal conductivity tend to have better insulating properties than materials with higher thermal conductivity. In some embodiments, the first material comprises a thermal conductivity of about 150Wm^-1K^-1Or less, 50Wm^-1K^-1Or less, about 30Wm^-1K^-1Or less, at about 0.01Wm^-1K^-1To about 150Wm^-1K^-1In the range of about 0.01Wm^-1K^-1To about 50Wm^-1K^-1In the range of, or at about 0.25Wm^-1K^-1To about 30Wm^-1K^-1Or any range or subrange therebetween, but other thermal conductivities may be permitted in other embodiments. The enclosure 240 can provide a technical benefit of reducing (e.g., minimizing, preventing) uncontrolled heat loss and/or the impact of thermal current on the quality of the produced glass ribbon 103.

Further, the first material may maintain structural integrity and provide dimensional stability at the operating temperature of the interior region 247 of the housing 240 when the molten material 121 is present in the forming device 140. In some embodiments, the operating temperature may be about 500 ℃ or more, about 800 ℃ or more, about 1000 ℃ or more, about 1200 ℃ or more, about 1500 ℃ or more, about1700 ℃ or less, or about 1600 ℃ or less. In some embodiments, the operating temperature may range from about 500 ℃ to about 1700 ℃, from about 800 ℃ to about 1700 ℃, from about 1000 ℃ to about 1700 ℃, from about 1200 ℃ to about 1700 ℃, from about 500 ℃ to about 1600 ℃, from about 800 ℃ to about 1600 ℃, from about 1000 ℃ to about 1600 ℃, or from about 1200 ℃ to about 1600 ℃, or any range and subrange therebetween. In some embodiments, the first material comprises a melting temperature above 1600 ℃. If the first material comprises an amorphous material, the operating temperature may be below the glass transition temperature of said material. In some embodiments, the first material comprises Boron Nitride (BN), silicon carbide (SiC), zirconium dioxide (ZrO)₂) SiAlON (i.e., a combination of aluminum oxide and silicon nitride, and may have, for example, Si_12-m-nAl_m+nO_nN_16-n、Si_6-nAl_nO_nN_8-nOr Si_2-nAl_nO_1+nN_2-nWherein m, n, and the resulting subscripts are all non-negative integers), aluminum nitride (AlN), graphite, aluminum oxide (Al)₂O₃) Silicon nitride (Si)₃N₄) Fused silica, mullite (i.e., a mineral comprising a combination of alumina and silica), or a combination of two or more of the foregoing.

Although not shown, it is understood that the housing 240 (if present) and the thermal control devices 251 (e.g.,

thermal control devices

251a, 251b, 251c, and 251d) may be positioned within an interior region of the outer housing. In some embodiments, the outer housing may comprise one or more of the materials, thermal conductivities, and/or structural properties discussed above with respect to housing 240. In some embodiments, the outer housing may reduce heat loss from the interior region.

In some embodiments, as shown in fig. 2 and 4-10, the wall passageways 249 (e.g.,

wall passageways

249a, 249b, 249c, and 249d) extend through the housing 240 from an opening in the exterior surface 245 of the housing wall 241 to an opening in the interior surface 243 of the housing wall 241. Providing a wall passage 249 through the housing wall 241 may allow the thermal control device 251 to be positioned at least partially outside of the interior region 247, while still acting on the molten material 121 within the interior region 247. Further, the wall passages 249 may provide technical benefits for localizing the effect of the heat control device 251 to allow for localized adjustment of the molten material 121.

In some embodiments, as shown in fig. 5, a tube 503 comprising a second material may be positioned within a wall passage 249 (as shown) and may be aligned with the wall passage 249, although in other embodiments a wall passage 249 may be provided without a tube 503 (see, e.g., fig. 6-10). In some embodiments, the tube 503 comprises a second material, which may be the same as the first material of the housing wall 241. In some embodiments, the thermal conductivity of the second material of the tubes 503 may be approximately equal to or greater than the thermal conductivity of the first material of the wall vias 249. In further embodiments, the second material may still comprise a melting temperature of about 1600 ℃ or more. For example, the first material may comprise less than about 25Wm^-1K^-1And the second material may comprise about 30Wm (e.g., fused quartz, fused silica, zirconium dioxide, mullite, SiAlON, graphite), and^-1K^-1or more thermal conductivity (e.g., silicon nitride, boron nitride, aluminum oxide, silicon carbide, aluminum nitride). In some embodiments, the second material may be used to homogenize the temperature within wall passage 249 relative to a passage without the second material (e.g., without tube 503). In some embodiments, although not shown, the tube 503 (if provided) may comprise a plurality of tubes that may be positioned with a corresponding one of the plurality of wall passages (e.g., surrounded by the first material of the housing 240). In some embodiments, one or more of the tubes may be fixedly mounted within the corresponding wall passage. The fixed mounting may be achieved by, for example, press fitting the tube into the wall passage. In some embodiments, the tube 503 may contain a liner of the wall channel 249 that may coat the wall channel 249. The tube 503 may provide technical benefits of further reducing uncontrolled heat loss and/or thermal current. Further, tube 503 may allow for adjustment (e.g., repositioning, removal, insertion, replacement) of thermal control device 251.

In some embodiments, as shown in fig. 5, tube 503 may comprise a thickness 505 measured between an outer surface portion of tube 503 and an opposing inner surface portion of tube 503. In some embodiments, the thickness 505 of the tube 503 may be about 100nm or more, about 1 μm or more, about 10 μm or more, about 50 μm or more, about 2000 μm or less, about 990 μm or less, 490 μm or less, about 400 μm or less, about 300 μm or less, about 200 μm or less, or about 100 μm or less. In some embodiments, the thickness 505 of the tube 503 may range from about 100nm to about 2000 μm, from about 1 μm to about 2000 μm, from about 10 μm to about 2000 μm, from about 50 μm to about 2000 μm, from about 100nm to about 990 μm, from about 1 μm to about 990 μm, from about 10 μm to about 990 μm, from about 50 μm to about 990 μm, from about 100nm to about 490 μm, from about 1 μm to about 490 μm, from about 10 μm to about 490 μm, from about 50 μm to about 490 μm, from about 100nm to about 400 μm, from about 1 μm to about 400 μm, from about 10 μm to about 400 μm, from about 50 μm to about 400 μm, from about 100nm to about 300 μm, from about 10 μm to about 300 μm, from about 50 μm to about 300 μm, from about 100nm to about 200 μm, from about 1 μm to about 200 μm, from about 100 μm to about 200 μm, About 1 μm to about 100 μm, about 10 μm to about 100 μm, or about 50 μm to about 100 μm, or any range and subrange therebetween. In other embodiments, although not shown, the second material may comprise a portion of the housing 240 surrounding the wall passage 249 without the tube 503. In some embodiments, the wall channel 249 can be in the portion of the housing wall 241 containing the second material. In some embodiments, as shown in fig. 2, 4, 6-8, wall passageway 249 may not provide tube 503. In some embodiments, although not shown, the tube 503 comprising the second material described above may optionally be positioned within the wall passage 249 that also comprises the second material, such that the tube 503 may be adjusted or interchanged independently of the housing 240 itself.

The wall channel 249 may include a cross-section (e.g., perpendicular to an elongated axis of the wall channel 249) having a cross-sectional channel area. In some embodiments, the cross-sectional passage area may be about 0.01mm²Or more, about 0.04mm²Or moreMore than, about 0.1mm²Or more, about 500mm²Or less, about 100mm²Or less, about 50mm²Or less, about 10mm²Or less, about 5mm²Or less, about 1mm²Or less, about 0.8mm²Or less, about 0.4mm²Or less, about 0.2mm²Or less, or about 0.1mm²Or less. In some embodiments, the cross-sectional passage area may range from about 0.01mm²To about 500mm²About 0.04mm²To about 500mm²、0.1mm²To about 500mm²About 0.01mm²To about 100mm²About 0.04mm²To about 100mm²、0.1mm²To about 100mm²About 0.01mm²To about 50mm²About 0.04mm²To about 50mm²About 0.1mm²To about 50mm²About 0.01mm²To about 10mm²About 0.04mm²To about 10mm²About 0.1mm²To about 10mm²About 0.01mm²To about 5mm²About 0.04mm²To about 5mm²、0.1mm²To about 5mm²About 0.01mm²To about 1mm²About 0.04mm²To about 1mm²About 0.1mm²To about 1mm²About 0.01mm²To about 0.8mm²About 0.04mm²To about 0.8mm²About 0.1mm²To about 0.8mm²About 0.01mm²To about 0.4mm²About 0.04mm²To about 0.4mm²About 0.1mm²To about 0.4mm²About 0.01mm²To about 0.2mm²About 0.04mm²To about 0.2mm²About 0.1mm²To about 0.2mm²About 0.01mm²To about 0.1mm²About 0.04mm²To about 0.1mm²Or about 0.1mm²To about 0.6mm²Or any range or subrange therebetween. In some embodiments, the cross-sectional passage area may be minimized to reduce the amount of heat transferred through the wall passage 249 while still accommodating the optical fibers 703 (discussed below), the tubes 503 (if present), and heat that may extend into the wall passage 249Control device 251 (discussed below).

In some embodiments, as shown in fig. 9,

thermal insulators

903a, 903b, and/or 903c can extend from an exterior surface 245 of housing wall 241. For example, as shown,

thermal insulators

903a, 903b, and/or 903c can be attached to an exterior surface 245 of housing wall 241 and extend from exterior surface 245 in a direction that extends away from interior area 247. In further embodiments, a plurality of wall passages (e.g.,

wall passages

249a, 249b, 249c, and 249d) can extend through the housing wall 241. In still further embodiments, a thermal insulator (e.g., thermal insulator 903a) can be positioned laterally between a pair of adjacent wall passages (e.g., wall passage 249a, wall passage 249 b). In further embodiments, a plurality of thermal insulators (e.g.,

thermal insulators

903a, 903b, and 903c) can be attached to exterior surface 245 and extend from exterior surface 245 of housing wall 241. In still further embodiments, a wall passage (e.g., wall passage 249b) may be positioned laterally between a pair of adjacent thermal insulators (e.g.,

thermal insulators

903a, 903 b). In some embodiments,

thermal insulators

903a, 903b, and/or 903c can comprise one or more of the materials listed above for the first material and/or the second material. Thermal insulators 903a-c may provide technical benefits of localizing the effect of thermal control device 253.

The glass manufacturing apparatus 100 includes one or more heat control devices 251. In some embodiments, as shown in fig. 4, glass manufacturing apparatus 100 may include a plurality of thermal control devices (e.g.,

thermal control devices

251a, 251b, 251c, and 251 d). In further embodiments, as shown in fig. 4, a plurality of thermal control devices may be arranged (e.g., in a column) along the flow direction 208 of the flow path 207.

As shown in fig. 2, a thermal control path 253 may extend from the thermal control device 251 toward the slot 203. In some embodiments, as shown in fig. 2-3 and 5-7, the thermal control path 253 may comprise a linear path. In some embodiments, as shown in fig. 8 and 10, the thermal control path 253 may include a plurality of linear path segments. In some embodiments, as shown in fig. 4 and 9, there may be multiple thermal control paths (e.g.,

thermal control paths

253a, 253b, 253c, and 253 d). In further embodiments, the number of thermal control paths 253 may be equal to the number of thermal control devices 251. In still further embodiments, a thermal control path 253 may be associated with a thermal control device 251. In still further embodiments, a thermal control device 251 may be associated with a thermal control path 253. In some embodiments, although not illustrated, one thermal control device may be associated with multiple thermal control paths.

In some embodiments, as shown in fig. 2, the thermal control device 251 may be positioned outside of the interior region 247 of the housing 240. In further embodiments, the thermal control path 253 may extend through the wall passage 249. In still further embodiments, as shown, the thermal control path may be aligned with the wall channel 249. As used herein, a thermal control path 253 is aligned with a wall passage 249 if the direction of a portion of the thermal control path 253 through the wall passage 249 extends along the direction of a centerline segment of the wall passage 249. In still further embodiments, the thermal control path 253 may be aligned with the wall passage and may include a central axis of the wall passage 249.

As shown in fig. 3, the projection 309 of the thermal control path 253 may intersect the footprint 301. As used herein, the projection 309 of the thermal control path 253 extends along the thermal control path 253 and continues in a direction 313 of the thermal control path 253 beyond an end 311 of the thermal control path 253 opposite the thermal control device 251. In some embodiments, the projection 309 of the thermal control path 253 may be limited by the footprint 301. Positioning the thermal control path 253 to allow the projection 309 of the thermal control path 253 to be limited by the footprint 301 may reduce the need for additional thermal control later in the glass manufacturing process. Furthermore, positioning of the thermal control path 253 to allow the projection 309 of the thermal control path 253 to allow simultaneous control (e.g., using a single thermal control device, using a single train of thermal control devices) of the flow rate, viscosity, and/or temperature of the first stream 211 of molten material 121 and the second stream 212 of molten material 121 as limited by the footprint 301.

The thermal control device 251 may include one or more of a gas nozzle, an electric heater, or a laser. Although one type of thermal control device is illustrated in any given figure, it should be understood that combinations of different types of thermal control devices may be combined. For example, multiple electric heaters may be operated simultaneously with multiple gas nozzles in the same glass manufacturing apparatus.

In some embodiments, as shown in fig. 5, the thermal control device may comprise a gas nozzle 501 as shown. The gas nozzle 501 may extend into the wall channel 249 and/or may be offset a distance from the wall channel 249. For example, as shown in fig. 5, the outer end of the gas nozzle 501 may extend partially through the wall passage 249, but the end of the gas nozzle 501 may extend entirely through the wall passage 249, or may be positioned a distance outboard of the wall passage 249, without any portion of the gas nozzle 501 extending through the wall passage 249. In a further embodiment, as shown in fig. 5, the tube 503 may be positioned within the wall channel 249. In still further embodiments, as shown, at least a portion of the thermal control device (e.g., gas nozzle 501) may be positioned within tube 503. In still further embodiments, the thermal control path 253 can extend at least partially through the tube 503. In still further embodiments, the thermal control path 253 may be aligned with the tube 503. In further embodiments, although not explicitly shown, the thermal control device 251 may include a plurality of gas nozzles. In still further embodiments, although not shown, a plurality of gas nozzles may be arranged (e.g., in a column) along the flow direction 208 of the flow path 207 (see fig. 4). In a further embodiment, as shown in fig. 5, the gas nozzle 501 may be configured to eject gas 507 from the gas nozzle 501 to travel along a thermal control path 253. In still further embodiments, the gas 507 may comprise, for example, one or more of air, nitrogen, helium, argon, and carbon dioxide. In still further embodiments, although not shown, the gas 507 may be provided by a gas supply (e.g., one or more of a pump, a tank, a canister, a boiler, a compressor, and a pressure vessel).

In some embodiments, as shown in fig. 6, the thermal control device 251 may include an electric heater 601. In some embodiments, a single electric heater may be provided, but in further embodiments, multiple electric heaters may be provided to allow for the generation of a heat profile along the length of the slot. For example, as shown in fig. 9, the thermal control device may include a plurality of electric heaters (e.g.,

electric heaters

601a, 601b, 601c, and 601 d). In still further embodiments, as shown in fig. 9, a plurality of electric heaters may be arranged (e.g., in a column) along the flow direction 208 of the flow path 207 (see fig. 4). In still further embodiments, an electric heater of the plurality of electric heaters (e.g., electric heater 601a) may be operated independently of another electric heater of the plurality of electric heaters (e.g., electric heater 601 b). In still further embodiments, as shown in fig. 9, a thermal insulator (e.g., thermal insulator 903a) can be positioned between a first electrical heater (e.g., electrical heater 601a) of the plurality of electrical heaters and a second electrical heater (e.g., electrical heater 601b) of the plurality of electrical heaters. In still further embodiments, as shown, a thermal insulator (e.g., thermal insulator 903a) can be positioned between a pair of adjacent electric heaters (e.g., electric heater 601a, electric heater 601b) of the plurality of electric heaters. In still further embodiments, as shown, a thermal insulator (e.g., thermal insulator 903a) may extend from an exterior surface 245 of housing 240. For example, as shown, each

thermal insulator

903a, 903b, and 903c can be attached to housing 240 and extend from an exterior surface 245 of housing 240. Attaching thermal insulation to the housing may further assist in controlling the heating through each slot by the heating element associated with the slot. In still further embodiments, as shown, a thermal insulator (e.g., thermal insulator 903a) extending from an exterior surface 245 of housing 240 may be positioned between a pair of adjacent electric heaters (e.g., electric heater 601a, electric heater 601b) of the plurality of electric heaters. In still further embodiments, as shown, a thermal insulator (e.g., thermal insulator 903a) extending from the exterior surface 245 of the housing 240 can be positioned between each pair of adjacent electric heaters of the plurality of electric heaters.

In some embodiments, the electric heater 601 is configured to emit (e.g., radiate) heat. In a further embodiment, as indicated by arrow 603 of fig. 6, heat may be generated as electricity is circulated through the electric heater 601. In still further embodiments, heat radiated from the electric heater 601 may travel along the thermal control path 253.

In some embodiments, the electric heater 601 may be designed to quickly tune the desired heat output to quickly modify the heat supplied to the molten material. For example, in some embodiments, the heater may be designed to rotate about an axis to immediately change the radiant heat supplied to the molten material exiting the slot of the conduit. In one embodiment, as shown in fig. 6 and 9, the electric heater 601 may comprise a coil extending along a plane including a length 605a (see fig. 6) and a width 605b (see fig. 9) less than the length 605 a. The wall channel 249 may also include a slot including a length 607a and a width 607b less than the length. As shown, the width 607b may extend along the flow direction 208 of the flow channel 207, but in other embodiments, the length 607a may extend along the flow direction 208 of the flow channel 207. To provide maximum heating, the electric heater 601 may be positioned in an aligned position as shown in 601a of FIG. 6 and 601b, 601c, and 601d of FIG. 9, with the length 605a of the coil of the electric heater extending in the same direction as the length 607a of the wall opening 249. In such a position, the thermal control path 253 of the electric heater 601 may be fully exposed to the underlying molten material through the slot to allow for maximum heating of the molten material. If there is a desire to modify the amount of radiant heat applied to the molten material, electric heater 601 may be rotated at least partially about the axis along direction 609 to at least partially misalign length 605a of electric heater 601 with length 607a of wall opening 249. For example, in some embodiments, the electric heater 601a shown in fig. 6 can be rotated (e.g., 90 degrees) from the aligned position shown in fig. 6, wherein the length 605a of the electric heater 601a is aligned with the length 607a of the wall opening, to the misaligned position shown in fig. 9, wherein the length 605a of the electric heater 601a extends in the direction of the width 607b of the wall opening 249. As the width 607b of the wall opening 249 is less than the length 607a of the wall opening 249, the housing wall 241 of the housing 240 blocks relatively more radiant heat transfer from the electric heater 601a (blocked in the aligned position shown in fig. 6). Allowing modification of the transfer by rotating the electric heater may provide the technical benefit of immediately reducing the radiant heat transfer supplied by the electric heater without waiting for the heating element to cool to modify the heat transfer radiated from the heating element.

In some embodiments, the electric heater 601 may comprise a metal or refractory material (e.g., ceramic). Exemplary embodiments of metals include chromium, molybdenum, tungsten, platinum, rhodium, iridium, osmium, palladium, ruthenium, gold, and combinations (e.g., alloys) thereof. As described above, additional exemplary embodiments of metals (e.g., alloys) include nickel-chromium alloys (e.g., nickel-chromium), iron-chromium-aluminum alloys, and platinum alloys. Exemplary embodiments of the ceramic include silicon carbide, chromium disilicide (CrSi)₂) Molybdenum disilicide (MoSi)₂) Tungsten disilicide (WSi)₂) Lanthanum chromite, alumina, barium titanate, lead titanate, zirconia, yttria, and combinations thereof. In some embodiments, the electric heater 601 may comprise platinum or a platinum alloy. In some embodiments, the electric heater 601 may comprise silicon carbide. In some embodiments, the electric heater 601 may comprise molybdenum disilicide. In some embodiments, the electric heater 601 may comprise lanthanum chromite.

As shown in fig. 7-8 and 10-11, the thermal control device 251 may include a laser (e.g., laser diode 701, laser 801, laser 1001). The laser may comprise a gas laser, an excimer laser, a dye laser, or a solid state laser. Exemplary embodiments of gas lasers include helium, neon, argon, krypton, xenon, helium neon (HeNe), xenon neon (XeNe), carbon dioxide (CO)₂) Copper (Cu) vapor, gold (Au) vapor, cadmium (Cd) vapor, ammonia, Hydrogen Fluoride (HF), and Deuterium Fluoride (DF). Exemplary embodiments of excimer lasers include chlorine, fluorine, iodine, or nitrous oxide (N) in an inert environment₂O), the inert environment comprises argon (Ar), krypton (Kr), xenon (Xe), or a combination thereof. Exemplary embodiments of dye lasers include those using organic dyes (e.g., rhodamine, fluorescein, coumarin, stilbene, umbelliferone, and) dissolved in liquid solventsTetraphenyl, or malachite green). Exemplary embodiments of solid state lasers include crystal lasers, fiber lasers, and laser diodes. Crystalline lasers include host crystals doped with lanthanides or transition metals. Exemplary embodiments of the main crystal include Yttrium Aluminum Garnet (YAG), Yttrium Lithium Fluoride (YLF), yttrium aluminum sulfate (YAL), yttrium gallium garnet (YSSG), lithium aluminum hexafluoride (LiSAF), lithium aluminum calcium hexafluoro (LiCAF), zinc selenium (ZnSe), ruby, forsterite, and sapphire. Exemplary examples of the dopant include neodymium (Nd), titanium (Ti), chromium (Cr), iron (Fe), erbium (Er), holmium (Ho), thulium (Tm), ytterbium (Yb), dysprosium (Dy), cerium (Ce), gadolinium (Gd), samarium (Sm), and terbium (Tb). Exemplary embodiments of solid-state crystals include ruby, alexandrite, chromium fluoride, forsterite, lithium fluoride (LiF), sodium chloride (NaCl), potassium chloride (KCl), and rubidium chloride (RbCl). The laser diode may include a heterojunction or PIN diode with three or more materials for the p-type conductor layer, the intrinsic conductor layer, and the n-type semiconductor layer. Exemplary embodiments of laser diodes include AlGaInP, AlGaAs, InGaN, InGaAs, InGaAsP, InGaAsN, InGaAsNSb, GaInP, GaAlAs, GaInAsSb, and lead (Pb) salts. Some laser diodes may represent exemplary embodiments due to their size, tunable output power, and ability to operate at room temperature (e.g., about 20 ℃ to about 25 ℃). As described below, the fiber laser comprises an optical fiber that further comprises a cladding having any of the materials listed above for the crystal laser or laser diode.

Lasers (e.g., laser diode 701, laser 801, laser 1001) are configured to emit a laser beam including a wavelength. The lasers (e.g., laser diode 701, laser 801, laser 1001) may be operated such that the wavelength of the laser beam is reduced by one half (i.e., twice the frequency), reduced by two thirds (i.e., three times the frequency), reduced by three quarters (i.e., four times the frequency), or modified relative to the natural wavelength of the laser beam produced by the laser. In some embodiments, the wavelength of the laser beam may be about 760 nanometers (nm) or more, about 900nm or more, about 980nm or more, about 5000nm or less, about 4000nm or less, about 3000nm or less, about 1700nm or less, about 1660nm or less, about 1570nm or less, about 1330nm or less, or about 1100nm or less. In some embodiments, the wavelength of the laser beam may range from about 760nm to about 5000nm, from about 760nm to about 4000nm, from about 760nm to about 3000nm, from about 760nm to about 1700nm, from about 760nm to about 1660nm, from about 760nm to about 1570nm, from about 760nm to about 1330nm, from about 760nm to about 1100nm, from about 900nm to about 5000nm, from about 900nm to about 4000nm, from about 900nm to about 3000nm, from about 900nm to about 1700nm, from about 900nm to about 1660nm, from about 900nm to about 1570nm, from about 900nm to about 1330nm, from about 900nm to about 1100nm, from about 980nm to about 5000nm, from about 980nm to about 4000nm, from about 980nm to about 3000nm, from about 980nm to about 1700nm, from about 980nm to about 1660nm, from about 980nm to about 1570nm, from about 980nm to about 1100nm, or any range and subranges therebetween. Exemplary embodiments of laser diodes (e.g., laser diode 701) capable of generating laser beams having wavelengths in the above-described range include AlGaAs, InGaAsP, InGaAsN laser diodes. Exemplary embodiments of lasers (other than diode lasers) (e.g., laser 801, laser 1001) capable of generating a laser beam having a wavelength in the above-described range include He — Ne gas lasers, Ar gas lasers, excimer lasers, Nd-doped YAG solid-state lasers, Nd-doped YLF solid-state lasers, Nd-doped YAP solid-state lasers, Ti-doped sapphire solid-state lasers, Cr-doped LiSAF solid-state lasers, chromium fluoride solid-state lasers, forsterite solid-state lasers, LiF solid-state lasers, and NaCl solid-state lasers. Exemplary embodiments of lasers (e.g., laser diode 701, laser 801, laser 1001) that can generate a laser beam having a wavelength in the above-described range at twice the frequency include XeNe gas lasers, HF gas lasers, Ho-doped YAG solid-state lasers, Er-doped YAG solid-state lasers, Tm-doped YAG solid-state lasers, KCl solid-state lasers, RbCl solid-state lasers, and AlGaIn laser diodes. Exemplary embodiments of lasers (e.g., laser 801, laser 1001) that can generate a laser beam having a wavelength in the above-described range at three times the frequency include a HeNe gas laser, a DF gas laser, and a Pb salt laser diode.

The lasers (e.g., laser diode 701, laser 801, laser 1001) may be configured to emit laser beams traveling along the thermal control path 253 to impinge on a location (e.g., location 315) of the molten material 121. The molten material 121 may include an absorption depth at the wavelength of the laser beam. Throughout this disclosure, the absorption depth of a material is defined as the thickness of the material where the intensity (e.g., power density) of the laser beam is reduced to 36.8% (i.e., 1/e) of the initial intensity of the laser beam. Without wishing to be bound by theory, the absorption depth can be estimated using the Beer-Lambert law, which predicts that the intensity decreases exponentially as the thickness of the material is divided by the absorption depth. For some materials, the absorption depth may vary with temperature. Unless otherwise stated, the absorption depth is measured at about 1000 ℃. In some embodiments, the absorption depth of the laser beam in the molten material 121 at the wavelength of the laser beam may be about 50 μm or more, about 500 μm or more, about 1000 μm or more, about 2000 μm or more, 5000 μm or more, about 10000 μm or less, about 5000 μm or less, or about 2000 μm or less. In some embodiments, the absorption depth of the laser beam in the molten material 121 at the wavelength of the laser beam may range from about 50 μm to about 10000 μm, from about 500 μm to about 10000 μm, from about 1000 μm to about 10000 μm, from about 2000 μm to about 10000 μm, from about 5000 μm to about 10000 μm, from about 50 μm to about 5000 μm, from about 500 μm to about 5000 μm, from about 1000 μm to about 5000 μm, from about 2000 μm to about 5000 μm, from about 50 μm to about 2000 μm, from about 500 μm to about 2000 μm, from about 1000 μm to about 2000 μm, or any range or subrange therebetween.

As shown in fig. 8 and 10, the mirrors (e.g., mirror 803, polygon mirror 1003) may be configured to reflect the laser beam emitted from the lasers (e.g., lasers 801, 1001) such that the laser beam impinges on the molten material 121 (see fig. 3) at location 315, wherein the thermal control channel 253 intersects the molten material 121. In some embodiments, the mirrors (e.g., mirror 803, polygon mirror 1003) are configured to be rotatable such that they may be configured to reflect laser beams emitted from lasers (e.g., lasers 801, 1001) to scan the footprint 301 (see fig. 3). In a further embodiment, as shown in FIG. 8, mirror 803 may be rotated using galvanometer 805. In a further embodiment, galvanometer 805 may be configured to rotate along a first direction 807. For example, rotating mirror 803 in a first direction 807 using galvanometer 805 may cause the laser beam to scan a length of conduit 201 (e.g., slot 203) in a direction substantially opposite flow direction 208 (see fig. 4). In still further embodiments, the galvanometer 805 may be configured to rotate in a second direction 809 opposite the first direction 807. For example, rotating mirror 803 along second direction 809 using galvanometer 805 may cause the laser beam to scan a length of conduit 201 (e.g., slot 203) along a direction substantially parallel to flow direction 208 (see fig. 4). In still further embodiments, the galvanometer may be configured to alternate between rotating in a first direction 807 and rotating in a second direction 809 opposite the first direction 807.

In a further embodiment, as shown in FIG. 10, the mirror may comprise a polygonal mirror 1003. As shown, the polygonal mirror 1003 may include a plurality of reflective surfaces. As shown, the polygonal mirror 1003 may be rotated by a motor 1005 to rotate in a first direction 1007 about a rotation axis 1009 of the polygonal mirror 1003. For example, rotating the polygon mirror 1003 along the first direction 1007 with the motor 1005 may cause the laser beam to scan a length of the conduit 201 (e.g., the slot 203) in a direction substantially opposite the flow direction 208 (see fig. 4). In some embodiments, as shown in fig. 10, the motor 1005 may be selectively operated by a control device 1015 (e.g., a programmable logic controller), the control device 1015 being configured (e.g., "programmed," "encoded," "designed," and/or "fabricated") to send command signals to the motor 1005 along a communication line 1017 to rotate, in some embodiments, with a substantially constant angular velocity about the rotational axis 1009 of the polygonal mirror 1003. Rotating the polygon mirror 1003 with a substantially constant angular velocity may help prevent damage to the motor 1005 that may occur due to frequently changing the angular velocity of the polygon mirror 1003. In some embodiments, a laser (e.g., lasers 801, 1001) may be configured to generate a pulsed laser beam. In a further embodiment, as shown in fig. 10, the laser 1001 may be selectively operated by a control device 1011 (e.g., a programmable logic controller), the control device 1011 being configured (e.g., "programmed," "encoded," "designed," and/or "fabricated") to send command signals to the laser along a communication line 1013. It should be understood that

control devices

1011 or 1015 and

corresponding communication lines

1013 or 1017 may be combined with laser 801 and/or galvanometer 805 in fig. 8, respectively.

In some embodiments, as shown in fig. 8 and 10, the laser beam is emitted from

laser

801 or 1001, reflected by mirrors (e.g., mirror 803, polygonal mirror 1003), and travels along thermal control path 253 through wall passage 249 to scan the length of conduit 201 (e.g., slot 203). In further embodiments, the scanned length may be about 10% or more, about 25% or more, about 50% or more, about 100% or less, about 75% or less, or about 50% or less of the length 401 of the slot 203 (see fig. 4). In further embodiments, the scanned length as a percentage of the length 401 of the slot 203 (see fig. 4) may range from about 10% to about 100%, about 10% to about 75%, about 10% to about 50%, about 25% to about 100%, about 25% to about 75%, about 25% to about 50%, about 50% to about 100%, about 50% to about 75%, or any range or subrange therebetween. In a further embodiment, the scanned length may be substantially equal to the length 401 of the slot 203 (see fig. 4). In further embodiments, the shape of the wall passage 249 may correspond to an arc sweep of the laser beam traveling along the thermal control path 253 after reflecting off the rotating mirror (e.g., mirror 803, polygon mirror 1003).

As shown in fig. 7, a laser (e.g., laser diode 701) may be optically coupled to an optical fiber 703. The optical fiber 703 may include a first end 705 and a second end 707 opposite the first end 705. In some embodiments, as shown in fig. 7, the laser may comprise a laser diode 701 optically coupled to a first end 705 of an optical fiber 703, while a second end 707 of the optical fiber may face the slot 203. In some embodiments, as shown in fig. 7, optical fiber 703 may extend partially through wall passage 249. Although not shown, first end 705 may not extend through wall passage 249 or into wall passage 249. In such embodiments, the first ends 705 may be spaced a distance outside of the wall channel 249, while the optical fibers 703 do not extend within the wall channel 249. In further embodiments, first end 705 may be positioned within interior region 247, with optical fiber 703 extending through wall passage 249. In some embodiments, as shown in FIG. 11, the optical fiber 703 may comprise a plurality of optical fibers 703 a-d. In a further embodiment, each of the plurality of optical fibers 703a-d can include a first end 705a-d optically coupled to a laser (e.g., lasers 701 a-d). In a further embodiment, each of the plurality of optical fibers 703a-d can include a second end 707a-d facing the slot 203. In further embodiments, one or more of the plurality of optical fibers 703a-d can extend partially through wall passages 249a-d and be positioned within interior region 247 or outside of interior region 247.

Throughout this disclosure, the length of the optical fiber is defined as the distance between a first point at a first end 705 of the optical fiber 703 and a second point at a second end 707 of the optical fiber 703 when the optical fiber 703 is straightened to align with the elongated axis and the first point is as far apart from the second point as possible. In some embodiments, as shown in FIG. 11, the optical fiber 703 may include a plurality of optical fibers 703a-d, and each of the plurality of optical fibers 703a-d may include a length defined as the distance between the first end 705a-d of an optical fiber of the plurality of optical fibers 703a-d and the second end 707a-d of the corresponding optical fiber 703a-d when the optical fiber 703a-d is straightened into alignment with the elongated axis. In some embodiments, the length of the optical fiber 703 (e.g., the length of an optical fiber of the plurality of optical fibers 703 a-d) may be about 100mm or more, about 1m or more, about 2m or more, about 5m or more, about 1000m or less, about 50m or less, about 30m or less, about 20m or less, or about 10m or less. In some embodiments, the length of the optical fiber 703 may range from about 100mm to about 1000m, from about 100mm to about 50m, from about 100mm to about 30m, from about 100mm to about 20m, from about 100mm to about 10m, from about 1m to about 1000m, from about 1m to about 50m, from about 1m to about 30m, from about 1m to about 20m, from about 1m to about 10m, from about 2m to about 30m, from about 2m to about 20m, from about 2m to about 10m, or from about 5m to about 10 m. In some embodiments, all of the plurality of optical fibers 703a-d may comprise substantially the same length. In other embodiments, at least one of the optical fibers in the plurality of optical fibers 703a-d can comprise a different length than another optical fiber in the plurality of optical fibers.

The optical fiber 703 (e.g., each of the plurality of optical fibers 703 a-d) can include a core (e.g., a core) that includes an optical material. Throughout this disclosure, the width of the core of the optical fiber is defined as the distance between a first point at the second end of the optical fiber and a second point at the second end of the optical fiber, where the first point and the second point comprise the same material as the center of the second end of the fiber, and the first point and the second point are as far apart as possible. For example, when the core of the second end of the optical fiber is circular, the width of the core of the optical fiber may be equal to the diameter. When the core of the second end of the optical fiber is elliptical, the width is equal to twice the half-length axis. In some embodiments, the width of the core of the optical fiber 703 may be about 1 μm or more, about 5 μm or more, about 9 μm or more, about 50 μm or more, about 62.5 μm or more, about 550 μm or less, about 490 μm or less, about 400 μm or less, about 360 μm or less, about 255 μm or less, or about 145 μm or less. In some embodiments, the width of the core of the optical fiber 703 may range from about 1 μm to about 550 μm, from about 1 μm to about 490 μm, from about 1 μm to about 400 μm, from about 1 μm to about 360 μm, from about 1 μm to about 255 μm, from about 1 μm to about 145 μm, from about 5 μm to about 550 μm, from about 5 μm to about 490 μm, from about 5 μm to about 255 μm, from about 9 μm to about 550 μm, from about 9 μm to about 490 μm, from about 9 μm to about 400 μm, from about 9 μm to about 360 μm, from about 9 μm to about 250 μm, from about 9 μm to about 144 μm, from about 50 μm to about 550 μm, from about 50 μm to about 490 μm, from about 50 μm to about 400 μm, from about 50 μm to about 144 μm, from about 62.5 μm to about 550 μm, from about 5.m to about 62.m, from about 5 μm to about 360 μm, from about 360 μm to about 400 μm, from about 5 μm to about 400 μm, About 62.5 μm to about 255 μm, about 62.5 μm to about 150 μm.

In some embodiments, the optical material in the core of the optical fiber 703 (e.g., each of the plurality of optical fibers) may comprise sapphire, fused silica, quartz, or a combination thereof. In further embodiments, the optical material may dope the optical amplifier (e.g., erbium (Er)Ytterbium (Yb), neodymium (Nd), or germanium dioxide (GeO)₂)). In some embodiments, the optical fiber 703 may include a cladding surrounding the core. In further embodiments, the cladding may comprise a refractive index lower than that of the core. In still further embodiments, the cladding may comprise fused silica, quartz, sapphire, or a gas (e.g., air, nitrogen, or argon). In still further embodiments, the cladding may comprise any of the materials listed above for laser diodes or crystal lasers. Doping, cladding, or a combination of the two may be desirable for modifying the amplitude of the laser beam transmitted by the fiber 703 (e.g., the fiber may be a fiber laser). In some embodiments, the core of the optical fiber 703 may comprise a circular cross-section. An optical fiber having a core with a circular cross-section may provide a smooth (e.g., uniform and symmetric) intensity profile for the laser beam exiting the second end 707 of the optical fiber 703. In some embodiments, the first end 705 of the optical fiber 703 may comprise a circular cross-section, while the second end 707 of the optical fiber 703 may comprise a circular cross-section. In some embodiments, providing optical fibers 703 having a circular cross-section may be used for wall passages 249 and/or tubes 503 having a circular cross-section (see fig. 5).

As shown in fig. 11, in some embodiments, a laser (e.g., laser diode 701) may include multiple lasers 701 a-d. In some embodiments, there may be 1 or more, 2 or more, 4 or more, 9 or more, 100 or less, 50 or less, 40 or less, 30 or less, or 20 or less lasers in the plurality of lasers. In some embodiments, the number of lasers in the plurality of lasers can be 1 to 100, 1 to 50, 1 to 40, 1 to 30, 1 to 20, 2 to 100, 2 to 50, 2 to 40, 2 to 30, 2 to 20, 4 to 100, 4 to 50, 4 to 40, 4 to 30, 4 to 20, 9 to 100, 9 to 50, 9 to 40, 9 to 30, or 9 to 20. In some embodiments, as shown in FIG. 11, the number of lasers in the plurality of lasers 701a-d may be equal to the number of optical fibers in the plurality of optical fibers 703a-d, and each laser in the plurality of lasers 701a-d may be optically coupled to a corresponding optical fiber in the plurality of optical fibers 703 a-d. In some embodiments, although not shown, the number of lasers in the plurality of lasers may be less than the number of optical fibers in the plurality of optical fibers. As shown, in some embodiments, each of the plurality of lasers 701a-d may be optically coupled to a first end 705a-d of a respective optical fiber 703 a-d. Thus, at least some of the laser beams generated by each corresponding one of the plurality of lasers 701a-d may be transmitted into the first ends 705a-d of the optical fibers 703a-d, through the lengths of the optical fibers 703a-d, and out of the second ends 707a-d of the corresponding ones of the plurality of optical fibers 703 a-d. In some embodiments, each of the plurality of lasers 701a-d may be optically coupled to a corresponding each of the first ends 705a-d of the optical fibers of the plurality of optical fibers 703a-i without a lens or other optical device positioned therebetween. In other embodiments, lenses or other optical components may be placed between the lasers 701a-d and the first ends 705a-d of the optical fibers 703a-d to direct the laser beams to the core (e.g., center) of the first ends 705a-d of the optical fibers 703 a-d. It may be desirable to direct the laser beam to the core of the first ends 705a-d of the optical fibers 703a-d, while the attenuation (i.e., intensity loss) of the laser beam may be reduced while the laser beam is transmitted from the first ends 705a-d to the second ends 707a-d of the optical fibers 703 a-d. The focal length of the lens may be selected as desired to couple a laser beam from the lasers 701a-d into the first ends 705a-d of the optical fibers 703a-d depending on the properties of the optical fibers 703a-d (e.g., diameter of a portion of the core, aperture value), the properties of the lasers 701a-d (e.g., divergence), the distance from the lasers 701a-d to the lens, and the distance from the lens to the first ends 705a-d of the optical fibers 703 a-d. In further embodiments, the lens may be a spherical lens, and it may be desirable for the lasers 701a-d (e.g., laser diodes) to produce a uniform (i.e., no astigmatism) laser beam. In other further embodiments, the lens may be aspherical (e.g. elliptical) for correcting any astigmatism of the laser beam. In some embodiments, although not shown, the first ends 705a-d optically coupling the lasers 701a-d to the optical fibers 703a-d may include beam splitters and relay fibers. An exemplary embodiment of the beam splitter may be a fiber optic coupler as a beam splitter for an optical fiber or a laser beam within a relay fiber. Other exemplary embodiments of the beam splitter may act on the laser beam outside of the optical fiber or relay fiber and include a metal-coated mirror (e.g., half-silvered mirror), a pellicle, or a waveguide. It should be understood that a beam splitter may be used with any of the embodiments discussed above. In some embodiments, the distance of the lenses to the first ends 705a-d of the optical fibers 703a-d may be varied to control the fraction of the laser beams coupled into the optical fibers 703 a-d. In some embodiments, the optical fibers 703a-d may comprise single mode optical fibers. In some embodiments, the optical fibers 703a-d may comprise multimode optical fibers. In some embodiments, although not shown, a purge gas (e.g., any of the gases listed for the gas nozzle) may be circulated to reduce (e.g., mitigate, prevent) condensation on optical elements associated with the laser.

The power density and/or size of the laser beam impinging on a portion of the molten material 121 may be achieved in a variety of ways, such as one or more of the following: the position of the second end 707 of the optical fiber 703, the type of optical element, or the position of the optical element is adjusted. Throughout the disclosure, the width of the laser beam irradiated on a portion of the molten material 121 is defined as a distance between a first point on the molten material 121 irradiated by the laser beam and a second point on the molten material 121 irradiated by the laser beam, wherein the intensity of the laser beam at a position of the molten material 121 where the first point and the second point are as far as possible is about 13.5% of the maximum intensity of the laser beam (i.e., 1/e)²). In some embodiments, the maximum width of the laser beam may be about 100 μm or more, about 500 μm or more, about 1mm or more, about 5mm or more, about 10mm or more, about 30mm or less, or about 15mm or less. In some embodiments, the maximum width of the laser beam may range from about 100 μm to about 30mm, from about 100 μm to about 15mm, from about 500 μm to about 30mm, from about 500 μm to about 15mm, from about 1mm to about 30mm, from about 1mm to about 15mm, from about 5mm to about 30mm, from about 5mm to about 15mm, from about 10mm to about 30mm, or any range or subrange therebetween. Throughout the disclosure, the region of the molten material 121 irradiated by the laser beam is defined as a portion of the molten material 121 irradiated by the laser beam, among which the region closest to the molten material 121 isThe intensity of the laser beam at the region measured at the surface of the molten material 121 at the second end 707 of the optical fiber 703 is about 13.5% (i.e., 1/e) of the maximum intensity of the laser beam²)。

Throughout this disclosure, the power of the laser beam is the average power of the laser beam transmitted from the second end 707 of the fiber 703 as measured using a thermopile. In some embodiments, the power of the laser beam may be controlled by controlling an optical element between the laser (e.g., laser diode 701) and the second end 707 of the optical fiber 703. In some embodiments, the power of the laser beam may be controlled by adjusting parameters of the laser (e.g., current or voltage, optical pump conditions). Throughout this disclosure, as described above, the power density of the laser beam is the power of the laser beam divided by the area of the molten material 121 that the laser beam is irradiated. In some embodiments, the power density of the laser beam may be about 1 watt/cm²(W/cm²) Or more, about 5W/cm²Or more, about 10W/cm²Or more, about 2000W/cm²Or less, about 1000W/cm²Or less, about 500W/cm²Or less, about 100W/cm²Or less, or about 50W/cm²Or less. In some embodiments, the power density of the laser beam may range from about 1W/cm²To about 2000W/cm²About 1W/cm²To about 1000W/cm²About 1W/cm²To about 500W/cm²About 1W/cm²To about 100W/cm²About 1W/cm²To about 50W/cm²About 5W/cm²To about 2000W/cm²About 5W/cm²To about 1000W/cm²About 5W/cm²To about 500W/cm²About 5W/cm²To about 100W/cm²About 5W/cm²To about 50W/cm²About 10W/cm²To about 2000W/cm²About 10W/cm²To about 1000W/cm²About 10W/cm²To about 500W/cm²About 10W/cm²To about 100W/cm²About 10W/cm²To about 50W/cm²Or any range or subrange therebetween.

A method of making glass from a quantity of molten material 121 using any of the glass manufacturing apparatuses 100 described above may include: the molten material 121 is caused to flow in a flow direction 208 through a flow passage 207 defined by a tube wall 205 of the tube 201. As described above, the slot 203 may extend through the conduit wall 205. Slot 203 may contain a footprint 301 that is limited by an outer perimeter 303 of slot 203. The method may further comprise: molten material 121 is caused to flow from flow path 207 of conduit 201 through the footprint 301 of slot 203. The method may further comprise: the thermal control device 251 is operated. The thermal control device 251 may include one or more of a gas nozzle, an electric heater, and a laser (e.g., a laser diode). Thermal control device 251 may define a thermal control path 253. As described above, the projection of the thermal control path 253 may intersect the footprint 301 and may limit the footprint 301. The method may further comprise: the temperature of the molten material 121 at the location 315 where the thermal control path 253 intersects the molten material 121 is adjusted. In some embodiments, the location 315 may be located entirely within a projection 317 of the footprint 301 extending outward from the slot 203 along an outward direction 319 perpendicular to the flow direction 208.

In some embodiments, adjusting the temperature of the molten material 121 at the location 315 may include: the temperature of the molten material 121 is reduced. For example, as shown in fig. 5, operating the thermal control device 251 may include: gas 507 is ejected from gas nozzle 501. Reducing the temperature of the molten material 121 at the location 315 may increase the viscosity of the molten material 121 at the location; thereby reducing the mass flow rate of the molten material 121 at the location.

In some embodiments, adjusting the temperature of the molten material 121 at the location 315 may include: the temperature of the molten material 121 is increased. For example, as shown in fig. 6 and 9, operating the thermal control device 251 may include: electricity is circulated through the electric heater 601 as indicated by arrow 603. In still further embodiments, as shown, the method may further comprise: the electric heater is rotated about the axis in direction 609 to adjust the radiant heat transfer applied by the electric heater, thereby tuning the temperature and corresponding viscosity and mass flow of the molten material at location 315. In a further embodiment, as shown in fig. 7-8 and 10-11, operating the thermal control device 251 may include: a laser beam is emitted from a laser (e.g., laser diode 701, laser 801, laser 1001). In still further embodiments, the laser beam may comprise an absorption depth in the molten material 121 (which may be within the above-described range (e.g., about 50 μm to about 10 mm)). In still further embodiments, the laser beam can include a wavelength that can be within the above-described range (e.g., about 760nm to about 5000 nm). As mentioned above, in a further embodiment, the method may further comprise: the laser beam is scanned over the length of the slit 203. In a further embodiment, as shown in fig. 8 and 10, the method may comprise: a laser beam emitted from a laser (e.g., laser diode 701, laser 801, laser 1001) is reflected off a mirror (e.g., mirror 803, polygon mirror 1003). In a further embodiment, as shown in fig. 8, the method may comprise: galvanometer 805 is used to rotate the mirrors (e.g., mirror 803, polygon mirror 1003). In a further embodiment, as shown in FIG. 10, the mirror may comprise a polygonal mirror 1003. Increasing the temperature of the molten material 121 at the location 315 may reduce the viscosity of the molten material 121 at the location. Increasing the temperature of the molten material 121 at the location 315 may increase the mass flow rate of the molten material 121 at the location.

In some embodiments, the method may further comprise: the first flow 211 of molten material 121 is flowed from a location 315 along the first outer surface 223 of the forming device 140 in a first direction, with a thermal control path 253 intersecting the molten material 121. In some embodiments, the method may further comprise: the second stream 212 of molten material 121 is flowed from a location 315 in a second direction along the second outer surface 224 of the forming device 140. In a further embodiment, the method may comprise: the first flow 211 of molten material 121 is caused to converge with the second flow 212 of molten material 121 to form the glass ribbon 103.

In some embodiments, the glass ribbon 103 may be traversed along the draw direction 154 with a thickness of about 1 millimeter (mm/s) or more per second, about 10mm/s or more, about 50mm/s or more, about 100mm/s or more, or about 500mm/s or more (e.g., a range of about 1mm/s to about 500mm/s, a range of about 10mm/s to about 500mm/s, a range of about 50mm/s to about 500mm/s, a range of about 100mm/s to about 500mm/s, and all ranges and subranges therebetween). Then, in some embodiments, a glass separator 149 (see fig. 1) may separate the glass sheets from the glass ribbon 103 along a separation path 151. As shown, in some embodiments, the separation path 151 can extend along the width "W" of the glass ribbon 103 between the first outer edge 153 and the second outer edge 155. Further, in some embodiments, the separation path 151 may extend perpendicular to the direction of draw 154 of the glass ribbon 103. Further, in some embodiments, the draw direction 154 may define a direction in which the glass ribbon 103 may be drawn from the forming device 140.

As shown in fig. 2, the glass ribbon 103 can be drawn from a root 235, where the glass ribbon 103 has a first major surface 215 of the glass ribbon 103 and a second major surface 216 of the glass ribbon 103 facing in an opposite direction and defines a thickness 227 (e.g., an average thickness) of the glass ribbon 103. In some embodiments, the thickness 227 of the glass ribbon 103 may be about 2 millimeters (mm) or less, about 1.5mm or less, about 1.2mm or less, about 1mm or less, about 0.5mm or less, about 300 micrometers (μm) or less, or about 200 μm or less, although other thicknesses may be provided in further embodiments. In some embodiments, the thickness 227 of the glass ribbon 103 may be about 100 μm or more, about 200 μm or more, about 300 μm or more, about 600 μm or more, about 1mm or more, about 1.2mm or more, about 1.5mm or more, although other thicknesses may be provided in further embodiments. For example, in some embodiments, the thickness 227 of the glass ribbon 103 may have a thickness ranging from about 100 μm to about 2mm, about 200 μm to about 2mm, about 300 μm to about 2mm, about 600 μm to about 2mm, about 1mm to about 2mm, about 100 μm to about 1.5mm, about 200 μm to about 1.5mm, about 300 μm to about 1.5mm, about 600 μm to about 1.5mm, about 1mm to about 1.5mm, about 100 μm to about 1.2mm, about 200 μm to about 1.2mm, about 600 μm to about 1.2mm, or any range or subrange of thicknesses therebetween.

Exemplary molten materials may be free of or include lithium oxide and include soda lime molten material, aluminosilicate molten material, alkali aluminosilicate molten material, and,A borosilicate molten material, an alkali aluminophosphosilicate molten material, and an alkali aluminoborosilicate glass molten material. In one or more embodiments, the molten material 121 may comprise (in mole percent (mol%)): SiO in the range of about 40 mol% to about 80%₂Al in the range of about 10 mol% to about 30 mol%₂O₃B in the range of about 0 to about 10 mol%₂O₃ZrO in a range of about 0 mol% to about 5 mol%₂P in the range of about 0 to about 15 mol%₂O₅TiO in the range of about 0 to about 2 mol%₂R in the range of about 0 to about 20 mol%₂O, and RO in a range of 0 to about 15 mole%. R as used herein₂O may refer to an alkali metal oxide (e.g., Li)₂O、Na₂O、K₂O、Rb₂O, and Cs₂O). RO as used herein may be referred to as MgO, CaO, SrO, BaO, and ZnO. In some embodiments, the molten material 121 may optionally further comprise Na in a range of about 0 mol% to about 2 mol%₂SO₄、NaCl、NaF、NaBr、K₂SO₄、KCl、KF、KBr、As₂O₃、Sb₂O₃、SnO₂、Fe₂O₃、MnO、MnO₂、MnO₃、Mn₂O₃、Mn₃O₄、Mn₂O₇Each of which is described. In some embodiments, the glass ribbon 103 and/or the formed glass sheet may be transparent, meaning that the glass ribbon 103 drawn from the molten material 121 may comprise an average light transmission over an optical wavelength of 400 nanometers (nm) to 700nm of about 85% or greater, about 86% or greater, about 87% or greater, about 88% or greater, about 89% or greater, about 90% or greater, about 91% or greater, or about 92% or greater.

Embodiments disclosed herein may provide technical benefits of using a thermal control device to adjust the mass flow rate, viscosity, and/or temperature of molten material exiting a slot of a conduit forming the device. Embodiments of the present disclosure may provide local control and/or adjustment of the mass flow rate, viscosity, and/or temperature of the molten material. The location at which the mass flow rate, viscosity, and/or temperature location of the molten material can be controlled may lie entirely within a projection of the footprint defined by the outer perimeter of the slot. Further, in any embodiment of the present disclosure, a heating device or multiple heating devices (e.g., see fig. 4 and 9) may be provided to allow adjustment of the heating profile along the length 401 of the slot 203 to provide a desired temperature profile along the location 315 and thereby provide a desired viscosity and corresponding mass flow rate profile of the molten material at the location 315. Adjusting the mass flow rate profile can provide a desired thickness profile of the glass ribbon drawn from the forming device. In addition, acting on the molten material exiting the slot may reduce the need for additional thermal control at a later stage in the glass making process. The design of the slot may be used to reduce the area of the thermal control device acting on the molten material. Embodiments including thin conduit walls (e.g., about 0.5mm to about 10mm) can reduce the thermal mass of the forming device near where the thermal control device acts on the molten material, and can increase the effectiveness of the thermal control device. Adjusting the mass flow rate, viscosity, and/or temperature of the molten material may also allow for simultaneous control of the first flow of molten material and the second flow of molten material according to embodiments of the present disclosure.

Providing a forming device within the interior region of the enclosure can reduce (e.g., minimize, prevent) uncontrolled heat loss and/or the effect of thermal current on the quality of the produced glass ribbon, while increasing the locality of effect of the thermal control device. Providing access through the wall of the enclosure may allow a thermal control device positioned at least partially outside of the interior region to act on the molten material. Providing a passageway with a tube may further reduce uncontrolled heat loss and/or thermal current, and allow for adjustments (e.g., repositioning, removal, insertion, replacement) to the thermal control device. Providing a thermal insulator extending from the exterior surface of the wall of the housing may further localize the effect of the thermal control device.

It is to be understood that various disclosed embodiments may be directed to combinations of specific features, elements, or steps described in connection with the specific embodiments. It will also be understood that although specific features, elements, or steps are described in connection with a particular embodiment, various alternative embodiments may be interchanged or combined with various combinations or permutations not shown.

It is also to be understood that the terms "the," "an," or "an," as used herein, mean "at least one," and should not be limited to "only one," unless explicitly indicated to the contrary. For example, reference to "a component" includes embodiments having two or more components, unless the context clearly indicates otherwise. Similarly, "a plurality" is intended to mean "more than one".

As used herein, the term "about" refers to quantities, dimensions, formulas, parameters, and other quantities and characteristics that are not and need not be exact, but may be approximated and/or larger or smaller as desired to reflect tolerances, conversion factors, rounding off, measurement error, and the like, as well as other factors known to those of ordinary skill in the art. Ranges expressed herein may be from "about" one particular value, and/or to "about" another particular value. When such a range is expressed, embodiments include from the one particular value and/or to the other particular value. Similarly, when values are expressed in an approximate manner using the antecedent "about," it will be appreciated that the particular value will form another embodiment. It will be further understood that each endpoint of a range is clearly related to, and independent of, the other endpoint.

As used herein, the terms "substantially", "essentially", and variations of the terms are intended to indicate that the feature being described is equal to or approximately equal to a value or description. For example, a "substantially planar" surface is intended to mean a planar or near-planar surface. Further, as defined above, "substantially similar" is intended to mean that the two values are equal or about equal. In some embodiments, "substantially similar" may mean that the values are within about 10% of each other, for example within about 5% of each other, or within about 2% of each other.

Unless expressly stated otherwise, it is not intended that any method described herein be construed as necessarily requiring that its steps be performed in a particular order. Accordingly, where a method claim does not actually recite an order to its steps or it is not otherwise specifically stated that the steps are to be limited to a specific order in the claims or descriptions, it is not intended that any particular order be inferred.

Although the transitional phrase "comprising" may be used to disclose various features, elements, or steps of a particular embodiment, it should be understood that the transitional phrase "comprising" or "consisting essentially of" is also implied to include alternative embodiments that may be disclosed using the transitional phrase. Thus, for example, alternate embodiments that imply an apparatus comprising A + B + C include embodiments of an apparatus consisting of A + B + C and embodiments of an apparatus consisting essentially of A + B + C. As used herein, the terms "comprises" and "comprising," as well as variations thereof, are to be construed as synonymous and open-ended, unless otherwise noted.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the spirit and scope of the claims. Thus, it is intended that the present disclosure cover the modifications and variations of the embodiments provided herein that come within the scope of the appended claims and their equivalents.

Claims

1. A glass manufacturing apparatus comprising:

forming a device comprising a tube having a tube wall defining a flow passage and a slot in fluid communication with the flow passage and extending through the tube wall, the slot comprising an occupied space bounded by an outer perimeter of the slot; and

a thermal control device to define a thermal control path whose projection intersects the footprint.

2. The glass manufacturing apparatus of claim 1, wherein the forming device further comprises:

a first wall comprising a first outer surface, the first wall attached at a first peripheral location to the outer surface of the pipe wall;

a second wall comprising a second outer surface, the second wall attached at a second peripheral location of the outer surface of the conduit wall; and

the first outer surface and the second outer surface converge at a root of the forming device.

3. The glass manufacturing apparatus of any of claims 1 to 2, wherein the projection is limited by the footprint.

4. The glass manufacturing apparatus of any of claims 1-3, wherein the heat control device comprises a plurality of heat control devices arranged along a flow direction of the flow passage.

5. The glass manufacturing apparatus of any of claims 1 to 4, wherein the tube wall comprises a thickness in a range from about 0.5mm to about 10 mm.

6. The glass manufacturing apparatus of any of claims 1 to 5, wherein the tube wall comprises platinum or a platinum alloy.

7. The glass manufacturing apparatus of any of claims 1 to 6, wherein the heat control device comprises an electric heater.

8. The glass manufacturing apparatus of claim 7, wherein the electric heater includes a plurality of electric heaters, and a thermal insulator is positioned between a first electric heater of the plurality of electric heaters and a second electric heater of the plurality of electric heaters.

9. The glass manufacturing apparatus of any of claims 7 to 8, wherein the electrical heater comprises one or more of molybdenum disilicide, silicon carbide, or lanthanum chromite.

10. The glass manufacturing apparatus of any of claims 1 to 6, wherein the heat control device comprises a gas nozzle.

11. The glass manufacturing apparatus of any of claims 1 to 6, wherein the thermal control device comprises a laser.

12. The glass manufacturing apparatus of claim 11, wherein the laser is configured to emit a laser beam comprising a wavelength ranging from about 760 nanometers to about 5000 nanometers.

13. The glass manufacturing apparatus of claim 12, further comprising a mirror configured to reflect the laser beam emitted from the laser such that the laser beam scans the footprint.

14. The glass manufacturing apparatus of claim 13, wherein the mirror is rotatable.

15. The glass manufacturing apparatus of any of claims 13 to 14, wherein the mirror comprises a polygonal mirror.

16. The glass manufacturing apparatus of any of claims 11 to 12, wherein the laser comprises a plurality of laser diodes.

17. The glass manufacturing apparatus of any of claims 1 to 4, further comprising: a housing including a wall defining an interior region and a wall passage extending through the wall, the forming device being positioned in the interior region.

18. The glass manufacturing apparatus of claim 17, wherein the thermal control path is aligned with the wall passage.

19. The glass manufacturing apparatus of any of claims 17 to 18, further comprising a tube positioned within the wall passage.

20. The glass manufacturing apparatus of any of claims 17 to 19, wherein the heat control device comprises a gas nozzle.

21. The glass manufacturing apparatus of claims 17-20, wherein the housing includes an interior surface facing the forming device and an exterior surface opposite the interior surface, a thermal insulator extending from the exterior surface.

22. The glass manufacturing apparatus of claim 21, wherein the heat control device comprises an electric heater.

23. The glass manufacturing apparatus of claim 22, wherein the electric heater includes a plurality of electric heaters, the thermal insulator being positioned between a first electric heater of the plurality of electric heaters and a second electric heater of the plurality of electric heaters.

24. The glass manufacturing apparatus of any of claims 22 to 23, wherein the electric heater is rotatable about an axis.

25. The glass manufacturing apparatus of claim 24, wherein the wall passage includes a slot including a length and a width less than the length.

26. The glass manufacturing apparatus of any of claims 17 to 19, wherein the thermal control device comprises a laser.

27. The glass manufacturing apparatus of claim 26, wherein the laser is configured to emit a laser beam comprising a wavelength ranging from about 760 nanometers to about 5000 nanometers.

28. The glass manufacturing apparatus of claim 27, wherein the laser is configured to scan a length of the tube by emitting the laser beam through the wall passage.

29. The glass manufacturing apparatus of any one of claims 26 to 27, wherein the laser includes a laser diode optically coupled to a first end of an optical fiber with a second end of the optical fiber facing the slot.

30. The glass manufacturing apparatus of claim 29, wherein the optical fiber extends through the wall passage.

31. A method of making glass comprising:

flowing molten material in a flow direction through a flow path defined by a conduit wall of a conduit, a slot extending through the conduit wall and containing a footprint limited by an outer perimeter of the slot;

flowing the molten material through the footprint of the slot;

operating a thermal control device for defining a thermal control path whose projection intersects the footprint; and

adjusting a temperature of the molten material at a location where the thermal control path intersects the molten material.

32. The method of claim 30, further comprising: flowing a first stream of the molten material in a first direction from the location along a first outer surface of a forming device and flowing a second stream of the molten material in a second direction from the location along the second outer surface of the forming device, the first stream and the second stream converging to form a glass ribbon.

33. The method of any of claims 31-32, wherein the location is entirely within a projection of the footprint extending outwardly from the slot along an outward direction perpendicular to the flow direction.

34. The method of any one of claims 31-33, wherein adjusting the temperature of the molten material at the location comprises: reducing the temperature of the molten material.

35. The method of any of claims 31-34, wherein operating the thermal control device comprises: ejecting gas from the gas nozzle.

36. The method of any one of claims 31-33, wherein adjusting the temperature of the molten material at the location comprises: increasing the temperature of the molten material.

37. The method of claim 36, wherein operating the thermal control device comprises: electricity is circulated through the heating element.

38. The method of claim 37, further comprising: rotating the heating element about an axis.

39. The method of claim 36, wherein operating the thermal control device comprises: a laser beam is emitted from a laser.

40. The method of claim 39, wherein the absorption depth of the laser beam in the molten material ranges from about 50 microns to about 10 millimeters.

41. The method of claim 39, wherein the laser beam comprises a wavelength in a range from about 760 nanometers to about 5000 nanometers.

42. The method of any of claims 39 to 41, further comprising: the laser beam is scanned over the length of the slit.

43. The method of any of claims 39 to 42, further comprising: reflecting the laser beam emitted from the laser off a mirror.

44. The method of claim 43, further comprising: the mirror is rotated.

45. The method of any of claims 43 to 44, wherein the mirror comprises a polygonal mirror.