CN114615877B - Chip mounting mechanism and method for improving working efficiency and chip mounting precision of die bonder - Google Patents
Chip mounting mechanism and method for improving working efficiency and chip mounting precision of die bonder Download PDFInfo
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- CN114615877B CN114615877B CN202210191658.XA CN202210191658A CN114615877B CN 114615877 B CN114615877 B CN 114615877B CN 202210191658 A CN202210191658 A CN 202210191658A CN 114615877 B CN114615877 B CN 114615877B
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 230000007246 mechanism Effects 0.000 title claims abstract description 31
- 230000008569 process Effects 0.000 claims description 25
- 230000000712 assembly Effects 0.000 claims description 21
- 238000000429 assembly Methods 0.000 claims description 21
- 230000001360 synchronised effect Effects 0.000 claims description 18
- 238000011179 visual inspection Methods 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 6
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000005299 abrasion Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a chip mounting mechanism for improving the working efficiency and the chip mounting precision of a die bonder and a method thereof, comprising a mechanism base with a mounting bracket arranged at the front end, two groups of mounting components which are arranged on the mechanism base in a adhering way and have the same structure and a fixed interval in the Y-axis direction, and a linear operation assembly.
Description
Technical Field
The invention relates to the technical field of SMT electronic component production, in particular to a chip mounting mechanism and a chip mounting method for improving working efficiency and chip mounting precision of a die bonder.
Background
In the chip mounting mechanism of the die bonder, the following problems exist in a multi-swing arm structure or a single-suction-nozzle linear driving structure of the chip mounting mechanism: (1) The distance from adsorption pickup to lamination of the two structures in the Y direction is larger, the time consumption is longest, the efficiency of the existing lamination capability is poor, and the equipment efficiency limit of the single-suction-nozzle linear driving structure is 14K/H; (2) In the bonding process, the bonding pressure is sensed by a mechanical sensor, but the pressure precision requirement of chip bonding cannot accurately meet the standard requirement; (3) The stroke error or the circumference error on the X, Y, Z shaft existing in the chip attaching process is not compensated with precision, and the precision requirement can not reach the standard requirement; (4) The patch mechanism has overlarge load, the abrasion rate of structural members is too high under the limit production capacity, and the production and maintenance cost is too high.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a chip mounting mechanism and a method for improving the working efficiency and the chip mounting precision of a die bonder.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a chip mounting mechanism for improving the working efficiency and the chip mounting precision of a die bonder,
The device comprises a mechanism base with a mounting bracket at the front end, two groups of mounting components which are arranged on the mechanism base in a adhering manner and have the same structure and a fixed interval in the Y-axis direction, and a linear operation assembly, wherein the two groups of mounting components are set, so that the process of picking up and mounting two chips is reduced by one Y-direction reciprocating motion, the takt time is effectively shortened, and the working efficiency is improved;
The mounting component comprises a mounting head component and a voice coil motor component, the voice coil motor component comprises a motor stator and a motor rotor, the motor stator is fixedly arranged on a mechanism base, the motor rotor is connected with the component, and the motor rotor moves only in the Z-axis direction relative to the motor stator; the mounting head assembly is fixed on the mounting bracket in a circumferential rotation mode through the bearing group, the mounting head assembly is downwards arranged, and the mounting head is arranged at the lowest part of the mounting head assembly; the voice coil motor is set, so that the upper and lower micro processes of the mounting head can be controlled independently in the pick-up process, other chips cannot be touched by mistake in the pick-up process, and the size of mounting acting force can be controlled by adjusting the current during mounting, so that the traditional sensor induction is replaced;
The linear operation assembly comprises three groups of X-axis operation assemblies, Y-axis operation assemblies and Z-axis operation assemblies which are arranged in the directions of an X axis, a Y axis and a Z axis and driven by a linear motor, and the X-axis operation assemblies, the Y-axis operation assemblies and the Z-axis operation assemblies respectively drive the mechanism base and the mounting parts to conduct linear operation along the X axis, the Y axis and the Z axis.
Preferably, the mounting component further comprises a servo motor assembly, wherein the servo motor assembly comprises a servo motor provided with a rotating shaft, two synchronous wheels respectively arranged on the rotating shaft and the mounting head assembly, and a synchronous belt; the synchronous belt is sleeved on the two synchronous wheels, the servo motor is arranged on the mechanism base and is arranged at the rear position of the mounting head assembly, the rear servo motor is utilized and is used for driving the mounting head assembly to rotate, the weight above the mounting head assembly is reduced, the torque of the mounting head assembly, particularly the mounting head, in the circumferential compensation process is reduced, the abrasion of the mounting head assembly and the servo motor is reduced, and the maintenance of equipment and the service life of the equipment are more facilitated.
Preferably, the X-axis running assembly comprises an X-direction motor bracket, an X-direction linear motor and an X-direction linear slide rail; the Y-axis operation assembly comprises a Y-direction motor bracket, a Y-direction linear motor, a Y-direction linear slide rail, a Y-direction sliding assembly and a Y-direction guide assembly; the device comprises a Z-direction motor bracket, a Z-direction linear motor and a Z-direction linear slide rail.
Preferably, the Y-direction motor support is fixed on the X-direction motor support, and the Z-direction motor support is fixed on the Y-direction motor support;
The X-direction linear motor is fixed on the X-direction motor bracket, and the X-direction linear slide rail is fixed on the X-direction motor bracket; the Y-direction linear motor is fixed on the Y-direction motor bracket, and the Z-direction linear motor is fixed on the Z-direction motor bracket;
the Y-direction linear sliding rail is fixed on the Y-direction linear sliding rail assembly, the Z-direction linear sliding rail is fixed on the Y-direction sliding assembly, the Y-direction linear sliding rail assembly is connected with the X-direction linear sliding rail through a first linear sliding block, and the Y-direction sliding assembly is connected with the Y-direction linear sliding rail through a second linear sliding block;
The mounting bracket is connected with the Z-direction linear slide rail through a third linear slide block;
The X-direction linear motor rotor is connected with the Y-direction guide rail assembly, the Y-direction linear motor rotor is connected with the Y-direction sliding assembly, and the Z-direction linear motor rotor is connected with the mounting bracket.
In the linear operation assembly, the structure of the components among the X-axis operation assembly, the Y-axis operation assembly and the Z-axis operation assembly is simplified, and especially the Y-direction sliding assembly and the Y-direction guide assembly are integrated, so that the equipment has a simple path and a simplified structure in the linear operation process, the quality of the equipment is reduced, and the overall equipment operation efficiency is improved.
A chip mounting method for improving working efficiency and chip mounting accuracy of a die bonder comprises the following steps:
s1, setting pick-up and attaching positions: setting the position coordinates of the pick-up chip as a position A, and setting the position coordinates of the two mounting chips as a position B and a coordinate C;
S2, picking up by a left mounting head: the left mounting head is positioned at a position A, the Z-direction linear motor drives the mounting bracket to descend to a first pick-up position, the left voice coil motor drives the left mounting head to descend to a second pick-up position, the left mounting head picks up a chip, and the left voice coil motor drives the left mounting head to ascend to the first pick-up position;
s3, picking up by a right mounting head: the Y-direction linear motor drives the mounting bracket to move left, the right mounting head moves left to a position A, the right voice coil motor drives the right mounting head to descend to a second pick-up position, the right mounting head picks up a chip, and the right voice coil motor drives the right mounting head to ascend to a first pick-up position;
S4, visual inspection and compensation processing: the visual inspection part is used for respectively carrying out error inspection on the positions of chips picked up by the left mounting head and the right mounting head, and comprises the steps of inspecting the position deviation of the chips on an axis and the position deviation of the chips on a circumferential angle, a processing end is used for generating an axis compensation instruction and a circumferential compensation instruction according to the inspection result of the visual inspection part, and the processing end is used for transmitting the axis compensation instruction to a Y-direction linear motor, an X-direction linear motor for execution and transmitting the circumferential compensation instruction to a servo motor for execution;
S5, axial movement and axial compensation: the Y-direction linear motor and the X-direction linear motor receive and execute the axis compensation instruction of the processing end, the Z-direction linear motor drives the mounting bracket to rise to the pre-pick-up position, the Y-direction linear motor drives the mounting bracket to move left to the position B according to the axis compensation instruction, and the X-direction linear motor drives the mounting bracket to perform motion compensation along the X direction according to the axis compensation instruction;
S6, circumference compensation: the servo motor receives and executes a circumference compensation instruction of the processing end, and respectively performs angle rotation compensation on the two mounting head assemblies through the synchronous belt;
s7, right mounting head mounting: the right mounting head is positioned at a position B, the mounting bracket is driven by the Z-direction linear motor to descend to a first mounting position, the right voice coil motor is driven by the right mounting head to descend to a second mounting position, a chip is mounted on the right mounting head, and the right voice coil motor is driven by the right mounting head to ascend to the first mounting position;
S8, mounting by a left mounting head: the Y-direction linear motor drives the mounting bracket to move left, the left mounting head moves left to a position C, the left voice coil motor drives the left mounting head to descend to a second mounting position, the left mounting head mounts a chip, and the left voice coil motor drives the left mounting head to ascend to a first mounting position;
S9, picking and homing: the Z-direction linear motor drives the mounting bracket to ascend, the Y-direction linear motor drives the mounting bracket to move right, the X-direction linear motor drives the mounting bracket to move along the X direction until the left mounting head moves to the coordinate in situ at the position of the A pick-up chip.
Further, in S3 and S9, the Z-direction linear motor, the Y-direction linear motor, and the X-direction linear motor respectively and simultaneously perform driving actions, thereby effectively improving efficiency.
Further, in S7 and S8, the right mounting head mounts a chip, the left mounting head mounts a chip, both the right mounting head and the left mounting head are driven by the voice coil motor, the voice coil motor drives the left mounting head and the right mounting head to descend to the second mounting position, the mounting force value is preset by the processing end, and the voice coil motor controls the actual mounting force to reach the preset mounting force value by adjusting the current on the voice coil motor, so as to achieve the effect of precisely controlling the mounting force.
Further, in the step S3, the Y-direction linear motor drives the mounting bracket to move left, and the X-direction linear motor drives the mounting bracket to perform displacement compensation in the X-axis direction based on the fixed coordinate difference between the left mounting head and the right mounting head on the X-axis in the process of moving the right mounting head to the position a left, so that the right mounting head is precisely moved left to the position a, and the X-axis errors of the two mounting heads in the manufacturing process are compensated.
Further, in the step S8, the mounting bracket is driven by the Y-direction linear motor to move left, the left mounting head moves left to the position C, and the X-direction linear motor drives the mounting bracket to perform displacement compensation in the X-axis direction based on the fixed coordinate difference of the left mounting head and the right mounting head on the X-axis, so that the left mounting precision head moves left to the position C, and the X-axis errors of the two mounting heads in the manufacturing process are compensated.
Compared with the prior art, the invention has the beneficial effects that: (1) The setting of the two groups of mounting components reduces the action of one Y-direction reciprocating motion in the process of picking up and mounting two chips, thereby effectively shortening the beat time and improving the working efficiency; (2) The voice coil motor is set, so that the upper and lower micro processes of the mounting head can be controlled independently in the pick-up process, other chips cannot be touched by mistake in the pick-up process, the mounting acting force can be controlled by adjusting the current during mounting, the traditional sensor induction is replaced, and the mounting precision is improved; (3) The rear servo motor and the synchronous belt are utilized to drive the mounting head assembly to rotate, so that the weight above the mounting head assembly is reduced, the torque of the mounting head assembly, particularly the mounting head, in the circumferential compensation process is reduced, the abrasion of the mounting head assembly and the servo motor is reduced, and the maintenance of equipment is facilitated, and the service life of the equipment is prolonged; (4) In the linear operation assembly, the parts among the X-axis operation assembly, the Y-axis operation assembly and the Z-axis operation assembly are simplified in structure, and especially the Y-direction sliding assembly and the Y-direction guide assembly are integrated, so that the equipment is simple in path and simplified in structure in the linear operation process, the quality of the equipment is reduced, and the overall equipment operation efficiency is improved; (5) The linear motor has the advantages that the linear motor is utilized, so that errors existing in the picking and attaching process can be compensated in a linear manner, and the attaching precision is improved.
Drawings
FIG. 1 is a right schematic view of a linear motion assembly according to embodiment 1 of the present invention;
FIG. 2 is a schematic front view of a linear motion assembly according to embodiment 1 of the present invention;
FIG. 3 is a schematic diagram of a servo motor and voice coil motor according to embodiment 1 of the present invention;
FIG. 4 is a schematic flow chart of embodiment 2 of the present invention;
Description of the reference numerals: 1X to a motor support, 2X to a linear motor, 3X to a linear slide rail, 4Y to a motor support, 5Y to a linear motor, 6Z to a motor support, 7Z to a linear motor, 8 to a mounting support, 9Z to a linear slide rail, 10Y to a sliding component, 11Y to a guide rail component, 12Y to a linear slide rail, 13 to a mounting head component, 131 to a mounting head, 132 to a bearing, 14 to a mechanism base, 15 to a voice coil motor component, 16 to a motor stator, 17 to a motor rotor, 18 to a servo motor, 19 to a rotating shaft, 20 to a synchronous wheel and 21 to a synchronous belt.
Detailed Description
For a further understanding of the objects, construction, features, and functions of the invention, reference should be made to the following detailed description of the preferred embodiments.
Embodiment 1as shown in fig. 1-3, a chip mounting mechanism for improving the working efficiency and the chip mounting accuracy of a die bonder comprises a mechanism base 14 with a front end provided with a chip mounting bracket 8, two groups of chip mounting components attached to the mechanism base 14 and having the same structure and a fixed interval in the Y-axis direction, and a linear operation assembly.
Because the manufacturing process of the chip mounter mechanism of the die bonder has high requirements, in ideal conditions, only mounting components with fixed intervals in the Y-axis direction are needed, the intervals are generally 23-25mm, and in practice, position errors exist in the X-axis in the manufacturing process.
The setting of the two groups of mounting components reduces the action of one Y-direction reciprocating motion in the process of picking and mounting two chips, thereby effectively shortening the beat time, improving the working efficiency and improving the equipment efficiency from the original 14K/H to more than 24K/H.
The mounting component comprises a mounting head component 13 and a voice coil motor component 15, wherein the voice coil motor component 15 comprises a motor stator 16 and a motor rotor 17, the motor stator 16 is fixedly arranged on the mechanism base 14, the motor rotor 17 is connected with the component, and the motor rotor 17 moves relative to the motor stator 16 only in the Z-axis direction; the mounting head assembly 13 is fixed on the mounting bracket 8 in a circumferential rotation manner through a bearing 132 group, the mounting head assembly 13 is downward, and the mounting head 131 is arranged at the lowest part of the mounting head assembly 13.
The voice coil motor is a direct driving motor with special form, has the characteristics of simple structure, small volume, high speed, high acceleration response speed and the like, and the working principle is that the power coil (conductor) generates force when placed in a magnetic field, the force is proportional to the current applied to the coil, and the motion form of the voice coil motor manufactured based on the principle can be straight line or circular arc.
Therefore, the force is proportional to the current applied to the coil, the effect of the mechanical sensor in the mounting process can be improved, the structure of the mounting part can be simplified, and the process requirements of mounting different types of chips can be applied more effectively.
The linear operation assembly comprises three groups of X-axis operation assemblies, Y-axis operation assemblies and Z-axis operation assemblies which are arranged in the directions of X-axis, Y-axis and Z-axis and driven by the linear motor, and the X-axis operation assemblies, the Y-axis operation assemblies and the Z-axis operation assemblies respectively drive the mechanism base 14 and the mounting components to perform linear operation along the X-axis, the Y-axis and the Z-axis.
In the implementation of this embodiment, the mounting component further includes a servo motor 18 assembly, where the servo motor 18 assembly includes a servo motor 18 with a rotating shaft 19, two synchronous wheels 20 respectively disposed on the rotating shaft 19 and the mounting head assembly 13, and a synchronous belt 21; the synchronous belt 21 is sleeved on the two synchronous wheels 20, the servo motor 18 is arranged on the mechanism base 14 in a erected mode and is arranged at the rear position of the mounting head assembly 13, if the servo motor 18 is directly arranged on the mounting head assembly 13, the process requirement is improved, the cost of production equipment can be obviously improved, meanwhile, the weight above the mounting head assembly 13 is increased, the torque used by the mounting head assembly 13, particularly the mounting head 131 in the circumferential compensation process is increased, the abrasion and aging of the mounting head assembly 13 and the servo motor 18 are increased, and the later maintenance difficulty and cost are increased.
When the embodiment is implemented, the X-axis running assembly comprises an X-direction motor bracket 1, an X-direction linear motor 2 and an X-direction linear slide rail 3; the Y-axis running assembly comprises a Y-direction motor bracket 4, a Y-direction linear motor 5, a Y-direction linear slide rail 12, a Y-direction sliding assembly 10 and a Y-direction guide assembly 11; comprises a Z-direction motor bracket 6, a Z-direction linear motor 7 and a Z-direction linear slide rail 9.
In the implementation of the embodiment, the Y-direction motor support 4 is fixed on the X-direction motor support 1, and the Z-direction motor support 6 is fixed on the Y-direction motor support 4;
The X-direction linear motor 2 is fixed on the X-direction motor bracket 1, and the X-direction linear slide rail 3 is fixed on the X-direction motor bracket 1; the Y-direction linear motor 5 is fixed on the Y-direction motor bracket 4, and the Z-direction linear motor 7 is fixed on the Z-direction motor bracket 6;
The Y-direction linear slide rail 12 is fixed on the Y-direction linear slide rail assembly 11, the Z-direction linear slide rail 9 is fixed on the Y-direction slide rail assembly 10, the Y-direction linear slide rail assembly 11 is connected with the X-direction linear slide rail 3 through a first linear slide block, and the Y-direction slide rail assembly 10 is connected with the Y-direction linear slide rail 12 through a second linear slide block;
the mounting bracket 8 is connected with the Z-direction linear slide rail 9 through a third linear slide block;
The rotor of the X-direction linear motor 2 is connected with the Y-direction guide rail assembly 11, the rotor of the Y-direction linear motor 5 is connected with the Y-direction sliding assembly 10, and the rotor of the Z-direction linear motor 7 is connected with the mounting bracket 8.
All structural members in the embodiment are made of aluminum alloy, so that the quality of equipment is reduced as much as possible, and the running speed can be improved to a certain extent.
Embodiment 2, as shown in fig. 4, is a die bonding method for improving the working efficiency and the die bonding precision of a die bonder, comprising the following steps:
s1, setting pick-up and attaching positions: setting the position coordinates of the pick-up chip as a position A, and setting the position coordinates of the two mounting chips as a position B and a coordinate C;
S2, picking up by a left mounting head: the left mounting head is positioned at a position A, the Z-direction linear motor drives the mounting bracket to descend to a first pick-up position, the left voice coil motor drives the left mounting head to descend to a second pick-up position, the left mounting head picks up a chip, and the left voice coil motor drives the left mounting head to ascend to the first pick-up position;
s3, picking up by a right mounting head: the Y-direction linear motor drives the mounting bracket to move left, the right mounting head moves left to a position A, the right voice coil motor drives the right mounting head to descend to a second pick-up position, the right mounting head picks up a chip, and the right voice coil motor drives the right mounting head to ascend to a first pick-up position;
S4, visual inspection and compensation processing: the visual inspection part is used for respectively carrying out error inspection on the positions of chips picked up by the left mounting head and the right mounting head, and comprises the steps of inspecting the position deviation of the chips on an axis and the position deviation of the chips on a circumferential angle, a processing end is used for generating an axis compensation instruction and a circumferential compensation instruction according to the inspection result of the visual inspection part, and the processing end is used for transmitting the axis compensation instruction to a Y-direction linear motor, an X-direction linear motor for execution and transmitting the circumferential compensation instruction to a servo motor for execution;
S5, axial movement and axial compensation: the Y-direction linear motor and the X-direction linear motor receive and execute the axis compensation instruction of the processing end, the Z-direction linear motor drives the mounting bracket to rise to the pre-pick-up position, the Y-direction linear motor drives the mounting bracket to move left to the position B according to the axis compensation instruction, and the X-direction linear motor drives the mounting bracket to perform motion compensation along the X direction according to the axis compensation instruction;
S6, circumference compensation: the servo motor receives and executes a circumference compensation instruction of the processing end, and respectively performs angle rotation compensation on the two mounting head assemblies through the synchronous belt;
s7, right mounting head mounting: the right mounting head is positioned at a position B, the mounting bracket is driven by the Z-direction linear motor to descend to a first mounting position, the right voice coil motor is driven by the right mounting head to descend to a second mounting position, a chip is mounted on the right mounting head, and the right voice coil motor is driven by the right mounting head to ascend to the first mounting position;
S8, mounting by a left mounting head: the Y-direction linear motor drives the mounting bracket to move left, the left mounting head moves left to a position C, the left voice coil motor drives the left mounting head to descend to a second mounting position, the left mounting head mounts a chip, and the left voice coil motor drives the left mounting head to ascend to a first mounting position;
S9, picking and homing: the Z-direction linear motor drives the mounting bracket to ascend, the Y-direction linear motor drives the mounting bracket to move right, the X-direction linear motor drives the mounting bracket to move along the X direction until the left mounting head moves to the coordinate in situ at the position of the A pick-up chip.
In the implementation of this embodiment, in S3 and S9, the Z-direction linear motor, the Y-direction linear motor, and the X-direction linear motor respectively and simultaneously perform driving actions.
In the embodiment, in S7 and S8, the right mounting head mounts a chip and the left mounting head mounts a chip, which are all driven by the voice coil motor, the voice coil motor drives the left mounting head and the right mounting head to descend to the second mounting position, the processing end presets the mounting force value, and the voice coil motor controls the actual mounting force to reach the preset mounting force value by adjusting the current on the voice coil motor coil.
In the embodiment, in S3, the Y-direction linear motor drives the mounting bracket to move left, and the X-direction linear motor drives the mounting bracket to perform displacement compensation in the X-axis direction based on the fixed coordinate difference of the left mounting head and the right mounting head on the X-axis in the process of moving the right mounting head to the position a, so that the right mounting head moves to the position a accurately and left, and the X-axis errors of the two mounting heads in the manufacturing process are compensated.
In the embodiment, in S8, the mounting bracket is driven by the Y-direction linear motor to move left, the left mounting head moves left to the position C, and the X-direction linear motor drives the mounting bracket to perform displacement compensation in the X-axis direction based on the fixed coordinate difference between the left mounting head and the right mounting head on the X-axis, so that the left mounting precision head moves left to the position C, and the X-axis errors of the two mounting heads in the manufacturing process are compensated.
In the implementation of this embodiment, in the processes from S1 to S9, the coordinates of the positions of the two mounting chips are the position B and the coordinate C, and in the next complete mounting process, since the mounting is performed at different mounting points on the lead frame, a new position B and a new coordinate C need to be reset,
The invention has been described with respect to the above-described embodiments, however, the above-described embodiments are merely examples of practicing the invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (7)
1. Improve chip mounter of solid brilliant work efficiency and paster precision constructs, its characterized in that: the device comprises a mechanism base with a mounting bracket at the front end, two groups of mounting components which are arranged on the mechanism base in a adhering manner and have the same structure and a fixed interval in the Y-axis direction, and a linear operation assembly; the mounting component comprises a mounting head component and a voice coil motor component, the voice coil motor component comprises a motor stator and a motor rotor, the motor stator is fixedly arranged on a mechanism base, the motor rotor is connected with the component, and the motor rotor moves only in the Z-axis direction relative to the motor stator; the mounting head assembly is fixed on the mounting bracket in a circumferential rotation mode through the bearing group, the mounting head assembly is downwards arranged, and the mounting head is arranged at the lowest part of the mounting head assembly; the linear operation assembly comprises three groups of X-axis operation assemblies, Y-axis operation assemblies and Z-axis operation assemblies which are arranged in the directions of an X axis, a Y axis and a Z axis and driven by linear motors, and the X-axis operation assemblies, the Y-axis operation assemblies and the Z-axis operation assemblies respectively drive the mechanism base and the mounting parts to perform linear operation along the X axis, the Y axis and the Z axis;
The X-axis running assembly comprises an X-direction motor bracket, an X-direction linear motor and an X-direction linear slide rail; the Y-axis operation assembly comprises a Y-direction motor bracket, a Y-direction linear motor, a Y-direction linear slide rail, a Y-direction sliding assembly and a Y-direction guide assembly; the device comprises a Z-direction motor bracket, a Z-direction linear motor and a Z-direction linear slide rail;
The Y-direction motor support is fixed on the X-direction motor support, and the Z-direction motor support is fixed on the Y-direction motor support; the X-direction linear motor is fixed on the X-direction motor bracket, and the X-direction linear slide rail is fixed on the X-direction motor bracket; the Y-direction linear motor is fixed on the Y-direction motor bracket, and the Z-direction linear motor is fixed on the Z-direction motor bracket; the Y-direction linear sliding rail is fixed on the Y-direction linear sliding rail assembly, the Z-direction linear sliding rail is fixed on the Y-direction sliding assembly, the Y-direction linear sliding rail assembly is connected with the X-direction linear sliding rail through a first linear sliding block, and the Y-direction sliding assembly is connected with the Y-direction linear sliding rail through a second linear sliding block; the mounting bracket is connected with the Z-direction linear slide rail through a third linear slide block; the X-direction linear motor rotor is connected with the Y-direction guide rail assembly, the Y-direction linear motor rotor is connected with the Y-direction sliding assembly, and the Z-direction linear motor rotor is connected with the mounting bracket.
2. The die bonding mechanism for improving the working efficiency and the die bonding precision of a die bonder according to claim 1, wherein: the mounting component further comprises a servo motor assembly, wherein the servo motor assembly comprises a servo motor provided with a rotating shaft, two synchronous wheels respectively arranged on the rotating shaft and the mounting head assembly, and a synchronous belt; the synchronous belt is sleeved on the two synchronous wheels, the servo motor is arranged on the mechanism base in a sleeved mode, and the servo motor is arranged at the rear position of the mounting head assembly.
3. A chip bonding method for improving working efficiency and chip bonding precision of a die bonding machine by using the chip bonding mechanism for improving working efficiency and chip bonding precision of the die bonding machine according to claim 1 is characterized in that: the method comprises the following steps: s1, setting pick-up and attaching positions: setting the position coordinates of the pick-up chip as a position A, and setting the position coordinates of the two mounting chips as a position B and a coordinate C;
S2, picking up by a left mounting head: the left mounting head is positioned at a position A, the Z-direction linear motor drives the mounting bracket to descend to a first pick-up position, the left voice coil motor drives the left mounting head to descend to a second pick-up position, the left mounting head picks up a chip, and the left voice coil motor drives the left mounting head to ascend to the first pick-up position;
s3, picking up by a right mounting head: the Y-direction linear motor drives the mounting bracket to move left, the right mounting head moves left to a position A, the right voice coil motor drives the right mounting head to descend to a second pick-up position, the right mounting head picks up a chip, and the right voice coil motor drives the right mounting head to ascend to a first pick-up position;
S4, visual inspection and compensation processing: the visual inspection part is used for respectively carrying out error inspection on the positions of chips picked up by the left mounting head and the right mounting head, and comprises the steps of inspecting the position deviation of the chips on an axis and the position deviation of the chips on a circumferential angle, a processing end is used for generating an axis compensation instruction and a circumferential compensation instruction according to the inspection result of the visual inspection part, and the processing end is used for transmitting the axis compensation instruction to a Y-direction linear motor, an X-direction linear motor for execution and transmitting the circumferential compensation instruction to a servo motor for execution;
S5, axial movement and axial compensation: the Y-direction linear motor and the X-direction linear motor receive and execute the axis compensation instruction of the processing end, the Z-direction linear motor drives the mounting bracket to rise to the pre-pick-up position, the Y-direction linear motor drives the mounting bracket to move left to the position B according to the axis compensation instruction, and the X-direction linear motor drives the mounting bracket to perform motion compensation along the X direction according to the axis compensation instruction;
S6, circumference compensation: the servo motor receives and executes a circumference compensation instruction of the processing end, and respectively performs angle rotation compensation on the two mounting head assemblies through the synchronous belt;
s7, right mounting head mounting: the right mounting head is positioned at a position B, the mounting bracket is driven by the Z-direction linear motor to descend to a first mounting position, the right voice coil motor is driven by the right mounting head to descend to a second mounting position, a chip is mounted on the right mounting head, and the right voice coil motor is driven by the right mounting head to ascend to the first mounting position;
S8, mounting by a left mounting head: the Y-direction linear motor drives the mounting bracket to move left, the left mounting head moves left to a position C, the left voice coil motor drives the left mounting head to descend to a second mounting position, the left mounting head mounts a chip, and the left voice coil motor drives the left mounting head to ascend to a first mounting position;
S9, picking and homing: the Z-direction linear motor drives the mounting bracket to ascend, the Y-direction linear motor drives the mounting bracket to move right, the X-direction linear motor drives the mounting bracket to move along the X direction until the left mounting head moves to the coordinate in situ at the position of the A pick-up chip.
4. The die bonding method for improving the working efficiency and the die bonding accuracy of the die bonding machine according to claim 3, wherein: in the S3 and the S9, the Z-direction linear motor, the Y-direction linear motor and the X-direction linear motor respectively and simultaneously drive.
5. The die bonding method for improving the working efficiency and the die bonding accuracy of the die bonding machine according to claim 3, wherein: in S7 and S8, the right mounting head mounts a chip, and the left mounting head mounts a chip, both of which are driven by a voice coil motor, the voice coil motor drives the left mounting head and the right mounting head to descend to the second mounting position, a mounting force value is preset by a processing end, and the voice coil motor controls the actual mounting force to reach the preset mounting force value by adjusting the current magnitude on the voice coil motor.
6. The die bonding method for improving the working efficiency and the die bonding accuracy of the die bonding machine according to claim 3, wherein: in the S3, the mounting bracket is driven by the Y-direction linear motor to move left, and the X-direction linear motor performs displacement compensation in the X-axis direction based on the fixed coordinate difference between the left mounting head and the right mounting head on the X-axis during the process of moving the right mounting head left to the position a, so that the right mounting head is precisely moved left to the position a.
7. The die bonding method for improving the working efficiency and the die bonding accuracy of the die bonding machine according to claim 3, wherein: in S8, the Y-direction linear motor drives the mounting bracket to move left, the left mounting head moves left to the position C, and the X-direction linear motor drives the mounting bracket to perform displacement compensation in the X-axis direction based on the fixed coordinate difference of the left mounting head and the right mounting head on the X-axis, so that the left mounting precision head moves left to the position C.
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CN106771977A (en) * | 2016-12-31 | 2017-05-31 | 东莞市求是测试设备有限公司 | A kind of SMT intelligence initial workpiece testing equipment |
CN112234784A (en) * | 2020-09-28 | 2021-01-15 | 湖南大学 | Linear rotating motor for SMD picking and mounting |
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JP4508437B2 (en) * | 2001-02-07 | 2010-07-21 | パナソニック株式会社 | Electronic component mounting equipment |
CN106217038A (en) * | 2012-06-28 | 2016-12-14 | 环球仪器公司 | Make-up machinery, system and method flexibly |
CN103327749B (en) * | 2013-05-24 | 2016-03-02 | 华南理工大学 | A kind of electronic component placement equipment |
JP6276545B2 (en) * | 2013-09-18 | 2018-02-07 | ファスフォードテクノロジ株式会社 | Die bonder |
TWI784622B (en) * | 2020-08-12 | 2022-11-21 | 日商捷進科技有限公司 | Die bonding device and method for manufacturing semiconductor device |
CN113891575B (en) * | 2021-12-08 | 2022-03-08 | 泰姆瑞(北京)精密技术有限公司 | Eutectic pastes dress equipment |
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CN106771977A (en) * | 2016-12-31 | 2017-05-31 | 东莞市求是测试设备有限公司 | A kind of SMT intelligence initial workpiece testing equipment |
CN112234784A (en) * | 2020-09-28 | 2021-01-15 | 湖南大学 | Linear rotating motor for SMD picking and mounting |
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