CN114615360A - Shell, shell temperature measuring method, terminal and storage medium - Google Patents

Shell, shell temperature measuring method, terminal and storage medium Download PDF

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Publication number
CN114615360A
CN114615360A CN202011440835.0A CN202011440835A CN114615360A CN 114615360 A CN114615360 A CN 114615360A CN 202011440835 A CN202011440835 A CN 202011440835A CN 114615360 A CN114615360 A CN 114615360A
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China
Prior art keywords
temperature
shell
temperature measuring
processing module
housing
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CN202011440835.0A
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Chinese (zh)
Inventor
孙长宇
陈朝喜
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Beijing Xiaomi Mobile Software Co Ltd
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Beijing Xiaomi Mobile Software Co Ltd
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Priority to CN202011440835.0A priority Critical patent/CN114615360A/en
Publication of CN114615360A publication Critical patent/CN114615360A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computing Systems (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)

Abstract

The disclosure relates to a shell, a shell temperature measuring method, a terminal and a storage medium. The housing includes: a housing having an outer surface and an inner surface; the temperature measuring component is attached to the inner surface of the shell; the connecting contact is positioned on the inner surface and is connected with the temperature measuring component through a connecting circuit; the connecting contact is used for transmitting the shell temperature detected by the temperature measuring component to a processing module shell connected with the connecting contact, and the inner surface of the connecting contact is attached with the temperature measuring component; the temperature measurement component is connected with the connecting contact through a connecting line, and the connecting contact transmits the shell temperature detected by the temperature measurement component to the processing module connected with the connecting contact. The temperature of the shell is directly obtained by attaching the temperature measuring component to the shell. Then transmit for processing the module through the connecting contact, supply to process the module and acquire the casing temperature value of directly gathering on the casing. For through gathering mainboard temperature, indirectly acquire casing temperature, this shell can provide more accurate casing temperature data, supplies to handle the module and acquires.

Description

Shell, shell temperature measuring method, terminal and storage medium
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to a shell, a shell temperature measurement method, a terminal, and a storage medium.
Background
With the development of intelligent technology, intelligent terminals are becoming popular as a class of embedded computer system devices in the field of terminal devices. The intelligent terminal is used as an application direction of the embedded system, and the application scene setting is definite, so that the system structure is more definite than the structure of a common embedded system. According to different application scenes, the intelligent terminal is divided into a fixed terminal and a mobile terminal. For example, a mobile phone is used as one of mobile intelligent terminals, and the intelligent application degree of the mobile phone is higher and higher. Meanwhile, the degree of integration inside the terminal is higher and higher, and the information processing amount is more and more. This is also increasingly demanding on terminal performance, including terminal processing performance affected by terminal temperature rise due to long-term operation, large data processing, or long-term contact.
Disclosure of Invention
The disclosure provides a shell, a shell temperature measuring method, a terminal and a storage medium.
In a first aspect of the embodiments of the present disclosure, there is provided a housing, including:
a housing having an outer surface and an inner surface;
the temperature measuring component is attached to the inner surface of the shell;
and the connecting contact is positioned on the inner surface and is connected with the temperature measuring component through a connecting circuit, wherein the connecting contact is used for transmitting the shell temperature detected by the temperature measuring component to a processing module connected with the connecting contact.
In some embodiments, the thermometric assembly comprises:
thin film temperature sensitive resistor.
In some embodiments, the temperature measuring component is a plurality of temperature measuring components;
and the plurality of temperature measuring components are attached to different positions of the inner surface in a dispersing way.
In some embodiments, a plurality of the thermometric assemblies are connected to the same connecting contact.
In some embodiments, the number of the connecting contacts is multiple, one temperature measuring component is connected with one connecting contact, and the connecting contacts connected with any two temperature measuring components are different.
In some embodiments, the shell further comprises a spring piece attached to the inner surface of the shell;
the elastic sheet is electrically connected between the connecting contact point and the processing module and is used for conducting electricity between the connecting contact point and the processing module.
In some embodiments, the number of the elastic pieces is multiple, one of the elastic pieces is connected with one of the connection contacts, and the multiple elastic pieces are connected with the processing module.
In a second aspect of the embodiments of the present disclosure, a terminal is provided, including:
the housing of the first aspect; and
a processing module connected with the connection contacts within the housing;
the processing module is used for processing the shell temperature acquired from the shell.
In a third aspect of the embodiments of the present disclosure, a casing temperature measuring method is provided, including:
collecting temperature values of the shell at a plurality of positions through a temperature measuring component attached to the inner surface of the shell;
transmitting the collected temperature values at the plurality of positions to a processing module based on connecting contacts located on the inner surface of the shell; the connecting contact is connected with the temperature measuring component through a connecting circuit;
and processing the temperature values at the positions through the processing module to obtain the average temperature of the shell.
In some embodiments, said processing the temperature values at the plurality of locations by the processing module to obtain an average temperature of the housing comprises:
weighting the temperature value at each position to obtain a temperature weighted value at each position;
obtaining the average temperature based on the temperature weighting value at each of the locations.
In some embodiments, the processing module processes the temperature values at the plurality of locations to obtain an average temperature of the enclosure, including:
acquiring voltage values and current values corresponding to the temperature values at the positions respectively;
acquiring average voltage values and average current values at a plurality of positions based on the voltage values and the current values at the plurality of positions;
and acquiring the average temperature based on the average voltage value and the average current value.
In a fourth aspect of the embodiments of the present disclosure, a terminal is provided, which includes: a processor and a memory for storing a computer program operable on the processor, wherein the processor is operable, when executing the computer program, to perform the steps of the method of the third aspect of the above embodiment.
In a fifth aspect of the embodiments of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored, wherein the computer program, when executed by a processor, implements the steps of the method of the third aspect of the above-mentioned embodiments.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
according to the shell provided by the embodiment of the disclosure, the inner surface is attached with the temperature measuring component; the temperature measurement component is connected with the connecting contact through a connecting line, and the connecting contact transmits the shell temperature detected by the temperature measurement component to the processing module connected with the connecting contact. The temperature of the shell is directly obtained by attaching the temperature measuring component to the shell. Then transmit for processing the module through the connecting contact, supply to process the module and acquire the casing temperature value of directly gathering on the casing. For indirectly obtaining the shell temperature through collecting the temperature of the main board, the shell can provide more accurate shell temperature data for the processing module to obtain.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a first schematic diagram of a housing configuration according to an exemplary embodiment.
Fig. 2 is a structural view of a terminal device shown according to an exemplary embodiment.
Fig. 3 is a schematic diagram of a terminal back cover according to an exemplary embodiment.
Fig. 4 is a schematic diagram of a housing structure shown in accordance with an exemplary embodiment.
Fig. 5 is a schematic diagram of a circuit connection shown in accordance with an example embodiment.
FIG. 6 is a flow chart illustrating a method of measuring a temperature of a housing according to an exemplary embodiment.
Fig. 7 is a block diagram illustrating a terminal device according to an example embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
As one of mobile terminals, smart phones are rapidly developed in the field of smart terminals. Which basically cannot leave the lives of people. When the smart phone is used, the smart phone is basically operated by hands, and the smart phone generates heat after long-time contact operation. Especially, the power consumption of the mobile phone system is very high and the temperature of the whole mobile phone system is seriously increased under the conditions of long-time game playing, long-time charging and the like. Therefore, the system is jammed, the data processing speed of the processor is slowed down, and the user experience is poor. Especially, the temperature of the mobile phone casing is increased, so that the user directly feels the heating state of the mobile phone, which seriously affects the user experience.
To this end, the present disclosure provides a housing. Fig. 1 is a first schematic diagram of a housing configuration according to an exemplary embodiment. As shown in fig. 1, the housing includes:
a housing 10 having an outer surface and an inner surface;
the temperature measuring component 11 is attached to the inner surface of the shell;
and the connecting contact 12 is positioned on the inner surface and is connected with the temperature measuring component through a connecting circuit, wherein the connecting contact is used for transmitting the shell temperature detected by the temperature measuring component to a processing module connected with the connecting contact.
In the embodiment of the present disclosure, fig. 2 is a structural view of a terminal device according to an exemplary embodiment. As shown in fig. 2, the terminal device structure includes a front case 21 and a rear case 22. The back cover can be peeled off over the terminal and flipped over. As shown in fig. 3, fig. 3 is a schematic diagram of a terminal back cover according to an exemplary embodiment. The present disclosure provides a housing to replace the terminal rear case in fig. 2 and 3 or to be mounted on a terminal as a terminal rear case having a temperature measuring function. The terminal device may be an in-service, heat-prone device including, but not limited to, cell phones, ipads, notebooks, wearable devices, and the like. Wearable devices include bracelets and the like.
In the embodiment of the disclosure, the temperature measuring component can directly collect the temperature of the shell. The connection lines may be leads. The connection lines may be embedded in the housing. For example, recesses can be formed in the housing, in which the connection lines are laid. During assembly, the grooves for laying the connecting lines can be sealed. Or, the housing is integrally formed with the housing when the housing is injection molded.
The processing module can be arranged in a main board of the terminal equipment. Processing modules may include, but are not limited to, processors CPU, EC, and general purpose controllers.
In the embodiment of the disclosure, the inner surface of the shell is attached with a temperature measuring component; the temperature measurement component is connected with the connecting contact through a connecting line, and the connecting contact transmits the shell temperature detected by the temperature measurement component to the processing module connected with the connecting contact. The temperature of casing is directly obtained through the temperature measurement subassembly of laminating oneself to this shell. Then transmit for processing the module through the connecting contact, supply to process the module and acquire the casing temperature value of directly gathering on the casing. For indirectly obtaining the shell temperature through collecting the temperature of the main board, the shell can provide more accurate shell temperature data for the processing module to obtain.
In the embodiment of the disclosure, the temperature measuring component can be adhered to the inner surface of the shell through a high-heat-resistance adhesive film. The inner surface of the housing is the surface facing the other components inside the terminal. The outer surface of the housing is the surface facing away from the interior of the terminal and directly accessible to the user, while the outer surface of the housing may form part of the outer surface of the terminal.
In some embodiments, the thermometric assembly comprises:
thin film temperature sensitive resistor.
In the disclosed embodiment, the thin film temperature-sensitive resistor includes an NTC temperature-sensitive resistor and a PCT temperature-sensitive resistor. NTC refers to a thermistor semiconductor material or component with a negative temperature coefficient whose resistance decreases exponentially with increasing temperature. Which is a sensor for measuring temperature using the resistance characteristics of a ceramic/metal composite. The NTC temperature sensor belongs to contact measurement application, and is used for directly collecting the temperature of an object, measuring to obtain an electric signal and calculating a temperature value. PCT refers to a thermistor semiconductor material or component with a positive temperature coefficient, the resistance of which is exponentially reduced along with the temperature rise. The NTC or PTC is a temperature sensitive resistor made by thin film process. The temperature-sensitive resistor manufactured by the process is thinner and does not occupy the stacking space in the terminal.
In some embodiments, the temperature measuring component is a plurality of temperature measuring components;
the temperature measuring components are attached to different positions of the inner surface in a dispersing mode. For, the laminating is in same position department, can enlarge the temperature acquisition scope, acquires the temperature of a plurality of different hotspots for the data of gathering are more reasonable, comprehensive, provide more effective data source for follow-up data processing.
In an embodiment of the present disclosure, the plurality of temperature measurement assemblies dispersedly attached to different positions of the inner surface include:
illustratively, a plurality of temperature measuring components are dispersedly attached to a plurality of symmetrical positions of the inner surface. For example, the number of the temperature measuring components can be 6, the temperature measuring components are symmetrically distributed on two sides of the inner surface of the shell, and one side of the shell is 3.
In the embodiment of the present disclosure, the temperature measuring assemblies are dispersedly attached to different positions of the inner surface, and include:
the temperature measuring components are attached to the inner surface at a plurality of asymmetric designated positions in a dispersed manner. For example, the plurality of temperature measuring components are respectively distributed at the positions of the shell corresponding to the devices with high heat generation rate, the positions of the shell which are easily directly contacted by hands when a person and a machine are contacted, and the like. The temperature measuring point position at least comprises at least one of a shell position right opposite to the memory, a shell position right opposite to the CPU, and a shell position right opposite to the loudspeaker or the display screen. Therefore, the temperature of the shell is comprehensively measured, the whole temperature measurement result is obtained, meanwhile, the temperature data of a certain specified position can be obtained, and the analysis basis is provided for follow-up data analysis and searching of the main heating source.
In some embodiments, a plurality of the thermometric assemblies are connected to the same connecting contact.
In the embodiment of the present disclosure, fig. 4 is a schematic diagram of a housing structure shown in an exemplary embodiment. As shown in fig. 4, a connecting contact 12 may be provided on the inner surface of the housing. A selective connection switch is provided between the connection contact 12 and the plurality of temperature measuring modules 11. The selective connection switch is embedded in the housing. Fig. 5 is a schematic diagram of a circuit connection shown in accordance with an example embodiment. As shown in FIG. 5, the input terminal of the selection connection switch is connected to each temperature measurement component. The output end of the selective connection switch is connected with the connection contact and is connected with the processing module through the connection contact. When the temperature measuring device is applied specifically, the temperature measuring components can be connected and conducted through the selective connecting switch to form a series circuit or a parallel circuit. For example, the number of temperature measurement components is 5. The 5 temperature measuring components can be connected in parallel through the selective connecting switch to form a parallel circuit, and the current and voltage values of the 5 temperature measuring components in the parallel circuit are obtained. And estimating the average temperature value of the whole shell through the voltage value and the average current value. Similarly, the 5 temperature measuring assemblies can be connected and conducted through the selective connection switch to form a series circuit, and the current and voltage values of the 5 temperature measuring assemblies in the series circuit are obtained. And estimating the average temperature value of the whole shell through the average voltage value and the current value.
In some embodiments, the number of the connecting contacts is multiple, one temperature measuring component is connected with one connecting contact, and the connecting contacts connected with any two temperature measuring components are different.
In the embodiment of the disclosure, a plurality of connecting contacts connected with a plurality of temperature measuring components in a one-to-one manner can be arranged on the inner surface of the shell. Each connecting contact is connected with the processing module, so that the processing module can respectively acquire the measured temperature of each temperature measuring component at the same time point. And acquiring the average temperature of the shell after weighting treatment according to different temperature measuring positions of the temperature measuring components and corresponding different weighted values. For example, the temperature values at the 5 temperature measurement locations are A, B, C, D, E, and the weights are a, b, c, d, and e. The average temperature of the shell is L, (a + B + C + D + E)/(a + B + C + D + E). Or, the numerical values of all NTCs are collected by selecting a connection switch to switch a time division multiplexing method, and the integral rear shell temperature is represented by an average fitting formula.
In some embodiments, the shell further comprises a spring piece attached to the inner surface of the shell;
the elastic sheet is electrically connected between the connecting contact point and the processing module and is used for conducting electricity between the connecting contact point and the processing module.
In the embodiment of the disclosure, the elastic sheet has elasticity and conductivity, and is attached to the contact point on the inner surface of the shell to realize the conductive connection between the temperature measurement module and the processing module. The resistance of the elastic sheet has temperature stability, namely the resistance does not change along with the temperature or the speed rate of the resistance changing along with the temperature is lower than a preset value.
In some embodiments, the number of the elastic pieces is multiple, one of the elastic pieces is connected with one of the connection contacts, and the multiple elastic pieces are connected with the processing module.
In the embodiment of the disclosure, when the connecting contacts are multiple and one connecting contact is connected with one temperature measuring module, the elastic sheets are multiple. One spring plate is connected with one connecting contact. At this time, the selection connection switch may be provided on the main board. Meanwhile, the elastic sheet can be fixed on the inner surface of the shell in a welding or bonding mode. Through shell fragment conductive connection temperature measurement module and mainboard, be favorable to increasing the electrically conductive stability between temperature measurement module and the mainboard.
In some embodiments, when a plurality of temperature measuring assemblies are connected with the same connecting contact, an elastic sheet can be arranged on the shell and connected with the connecting contact.
The present disclosure also provides a terminal, including:
the housing provided in the above embodiment; and
a processing module connected with the connection contacts in the housing;
the processing module is used for processing the shell temperature acquired from the shell.
In the embodiment of the disclosure, the processing module may be disposed in a main board of the terminal device. The processing module comprises a processor.
The disclosure also provides a shell temperature measuring method. FIG. 6 is a flow chart illustrating a method of measuring a temperature of a housing according to an exemplary embodiment. As shown in fig. 6, the case temperature measuring method includes:
step 60, collecting temperature values of the shell at a plurality of positions through a temperature measuring component attached to the inner surface of the shell;
step 61, transmitting the acquired temperature values at the positions to a processing module based on connecting contacts positioned on the inner surface of the shell; the connecting contact is connected with the temperature measuring component through a connecting circuit;
and step 62, processing the temperature values at the positions through the processing module to obtain the average temperature of the shell.
In the embodiment of the disclosure, a plurality of temperature measuring components are attached to the inner surface of the shell; the temperature measurement component is connected with the connecting contact through a connecting line, and the connecting contact transmits the shell temperature detected by the temperature measurement component to the processing module connected with the connecting contact. The temperature of a plurality of positions of the shell body is directly obtained by the shell body through a plurality of temperature measuring components attached to the shell body. Then transmit for processing the module through the connecting contact, supply to process the module and acquire the casing temperature value of directly gathering on the casing. The processing module obtains the average temperature of the shell through the temperature values of a plurality of positions of the shell. Compared with the method for indirectly acquiring the shell temperature by acquiring the temperature of the main board, the method can acquire more accurate shell temperature data.
In some embodiments, said processing the temperature values at the plurality of locations by the processing module to obtain an average temperature of the housing comprises:
weighting the temperature value at each position to obtain a temperature weighted value at each position;
obtaining the average temperature based on the temperature weighting value at each of the locations.
In the embodiment of the disclosure, a plurality of connecting contacts connected with a plurality of temperature measuring components in a one-to-one manner can be arranged on the inner surface of the shell. Each connecting contact is connected with the processing module, so that the processing module can respectively acquire the measured temperature of each temperature measuring component at the same time point. And acquiring the average temperature of the shell after weighting treatment according to different temperature measuring positions of the temperature measuring components and corresponding different weighted values. For example, the temperature values at the 5 temperature measurement locations are A, B, C, D, E, and the weights are a, b, c, d, and e, respectively. The average temperature of the shell is L, (a + B + C + D + E)/(a + B + C + D + E).
In some embodiments, the processing module processes the temperature values at the plurality of locations to obtain an average temperature of the enclosure, including:
acquiring voltage values and current values corresponding to the temperature values at the positions respectively;
acquiring average voltage values and average current values at a plurality of positions based on the voltage values and the current values at the plurality of positions;
and acquiring the average temperature based on the average voltage value and the average current value.
In the disclosed embodiment, a connection contact may be provided on the inner surface of the housing. A selective connection switch is arranged between the connection contact and the plurality of temperature measuring components. The selective connection switch is embedded in the housing. The input end of the selective connecting switch is connected with each temperature measuring component, and the output end of the selective connecting switch is connected with the connecting contact. When the temperature measuring device is applied specifically, the temperature measuring components can be connected and conducted through the selective connecting switch to form a series circuit or a parallel circuit. For example, the number of temperature measurement components is 5. The 5 temperature measurement assemblies can be connected in parallel through the selective connection switch to form a parallel circuit, and the current and voltage values of the 5 temperature measurement assemblies in the parallel circuit are obtained. And estimating the average temperature value of the whole shell through the voltage value and the average current value. Similarly, the 5 temperature measuring components can be connected and conducted through the selective connecting switch to form a series circuit, and the current and voltage values of the 5 temperature measuring components in the series circuit are obtained. And estimating the average temperature value of the whole shell through the average voltage value and the current value.
In some embodiments, after obtaining the accurate casing temperature, the adjustment of the thermal power consumption, which is affected by the frequency, the charging power, the screen brightness, the screen refresh rate, and the like of the processor, may be performed according to the accurately measured casing temperature data.
An embodiment of the present disclosure further provides a terminal, including: a processor and a memory for storing a computer program operable on the processor, wherein the processor is configured to perform the steps of the method of the above embodiments when executing the computer program.
The embodiment of the present disclosure further provides a computer-readable storage medium, on which a computer program is stored, where the computer program is executed by a processor to implement the steps of the method in the above-mentioned embodiment.
Fig. 7 is a block diagram illustrating a terminal device according to an example embodiment. For example, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, and the like.
Referring to fig. 7, the terminal device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.
The processing component 802 generally controls overall operation of the terminal device, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the terminal device. Examples of such data include instructions for any application or method operating on the terminal device, contact data, phonebook data, messages, pictures, videos, etc. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The power component 806 provides power to various components of the terminal device. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the terminal device.
The multimedia component 808 includes a screen that provides an output interface between the terminal device and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. When the terminal device is in an operation mode, such as a shooting mode or a video mode, the front camera and/or the rear camera can receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the terminal device is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor component 814 includes one or more sensors for providing various aspects of state assessment for the terminal device. For example, sensor assembly 814 may detect the open/closed status of the terminal device, the relative positioning of components, such as a display and keypad of the terminal device, the change in position of the terminal device or a component of the terminal device, the presence or absence of user contact with the terminal device, the orientation or acceleration/deceleration of the terminal device, and the change in temperature of the terminal device. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate communication between the terminal device and other devices in a wired or wireless manner. The terminal device may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, communications component 816 further includes a Near Field Communications (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the terminal device may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (13)

1. An enclosure, comprising:
a housing having an outer surface and an inner surface;
the temperature measuring component is attached to the inner surface of the shell;
and the connecting contact is positioned on the inner surface and is connected with the temperature measuring component through a connecting circuit, wherein the connecting contact is used for transmitting the shell temperature detected by the temperature measuring component to a processing module connected with the connecting contact.
2. The enclosure of claim 1, wherein the thermometry assembly comprises:
thin film temperature sensitive resistor.
3. A housing according to claim 1 or 2,
the number of the temperature measuring components is multiple;
the temperature measuring components are attached to different positions of the inner surface in a dispersing mode.
4. The housing of claim 3, wherein a plurality of said thermometric assemblies are connected to the same said connection contact.
5. The housing of claim 3, wherein the number of the connecting contacts is plural, one of the temperature measuring components is connected with one of the connecting contacts, and the connecting contacts connected with any two of the temperature measuring components are different.
6. The shell according to claim 5, further comprising a spring plate attached to an inner surface of the shell;
the elastic sheet is electrically connected between the connecting contact point and the processing module and is used for conducting electricity between the connecting contact point and the processing module.
7. The shell according to claim 6, wherein the number of the elastic pieces is multiple, one of the elastic pieces is connected with one of the connection contacts, and the multiple elastic pieces are connected with the processing module.
8. A terminal, comprising:
the housing of any one of claims 1-7; and
a processing module connected with the connection contacts in the housing;
the processing module is used for processing the shell temperature acquired from the shell.
9. A method of measuring a temperature of a housing, comprising:
collecting temperature values of the shell at a plurality of positions through a temperature measuring component attached to the inner surface of the shell;
transmitting the collected temperature values at the plurality of positions to a processing module based on connecting contacts located on the inner surface of the shell; the connecting contact is connected with the temperature measuring component through a connecting circuit;
and processing the temperature values at the positions through the processing module to obtain the average temperature of the shell.
10. The method according to claim 9, wherein the processing the temperature values at the plurality of positions by the processing module to obtain an average temperature of the housing comprises:
weighting the temperature value at each position to obtain a temperature weighted value at each position;
obtaining the average temperature based on the temperature weighting value at each of the locations.
11. The method of claim 9, wherein the processing module processes the temperature values at the plurality of locations to obtain an average temperature of the housing, comprising:
acquiring voltage values and current values corresponding to the temperature values at the positions respectively;
acquiring average voltage values and average current values at a plurality of positions based on the voltage values and the current values at the plurality of positions;
and acquiring the average temperature based on the average voltage value and the average current value.
12. A terminal, comprising: a processor and a memory for storing a computer program operable on the processor, wherein the processor is operable to perform the steps of the method of claims 1 to 7 when executing the computer program.
13. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of claims 1 to 7.
CN202011440835.0A 2020-12-07 2020-12-07 Shell, shell temperature measuring method, terminal and storage medium Pending CN114615360A (en)

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CN202011440835.0A CN114615360A (en) 2020-12-07 2020-12-07 Shell, shell temperature measuring method, terminal and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011440835.0A CN114615360A (en) 2020-12-07 2020-12-07 Shell, shell temperature measuring method, terminal and storage medium

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Publication Number Publication Date
CN114615360A true CN114615360A (en) 2022-06-10

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Family Applications (1)

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