CN114613270B - Display module and protective bracket - Google Patents

Display module and protective bracket Download PDF

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Publication number
CN114613270B
CN114613270B CN202210266684.4A CN202210266684A CN114613270B CN 114613270 B CN114613270 B CN 114613270B CN 202210266684 A CN202210266684 A CN 202210266684A CN 114613270 B CN114613270 B CN 114613270B
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China
Prior art keywords
display panel
bonding
bonding layer
buffer
layer
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CN202210266684.4A
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Chinese (zh)
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CN114613270A (en
Inventor
尹航
付怡琳
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202210266684.4A priority Critical patent/CN114613270B/en
Publication of CN114613270A publication Critical patent/CN114613270A/en
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The embodiment of the application discloses a display module and a protective bracket, wherein the display module comprises a display panel and the protective bracket detachably connected with the display panel; the protective bracket comprises a bracket main body, a bonding part and a supporting part, wherein the bonding part and the supporting part are respectively connected with the bracket main body, the bracket main body at least covers the driving chip and the components, the bonding part is bonded with the backboard, and the supporting part is abutted with the display panel; the bonding part is bonded with the backboard through the buffer bonding layer, the area of the buffer bonding layer is larger than that of the bonding part, and the projection of the bonding part is positioned in the projection area of the buffer bonding layer in the direction perpendicular to the display panel; this application can effectually prevent to tear protection support after the protection support extrusion copper foil, leads to the copper foil to take place to warp, avoids producing the impression, influences the positive demonstration visual effect of display module assembly.

Description

Display module and protective bracket
Technical Field
The application relates to the technical field of display, in particular to a display module and a protective bracket.
Background
The back structure of the conventional display panel is shown in fig. 1, components and driving chips on an FPC in a screen product are located in a lower boundary area of the back of the product, at present, the upper parts of the components and the driving chips are only covered with adhesive tape for protection, and the risk of damaging the components on the display module by collision with a material tray exists in the product shipment and transportation process, so that the damage of the components can cause the product failure. The conventional countermeasure about this risk is to increase the protective bracket with the binding area structure, and because the protective bracket body is hard in material, the copper foil attached to the back plate of the display module is easy to be extruded in the process of tearing the protective bracket, so that the copper foil is deformed, an impression is generated, and the positive display visual effect of the display module is affected.
Disclosure of Invention
The embodiment of the application provides a display module and protective bracket, can effectually prevent to tear protective bracket after removing protective bracket and extrude the copper foil, lead to the copper foil to take place to warp, avoid producing the impression, influence the positive demonstration visual effect of display module.
The embodiment of the application provides a display module, include: a display panel and a protective bracket detachably connected with the display panel;
the display panel comprises a back plate, and a driving chip and components which are arranged on the back plate;
the protection bracket comprises a bracket main body, a bonding part and a supporting part, wherein the bonding part and the supporting part are respectively connected with the bracket main body, the bracket main body at least covers the driving chip and the components, the bonding part is bonded with the backboard, and the supporting part is abutted with the display panel;
the bonding part is bonded with the back plate through the buffer bonding layer, the area of the buffer bonding layer is larger than that of the bonding part, and the projection of the bonding part is positioned in the projection area of the buffer bonding layer in the direction perpendicular to the display panel.
Optionally, the buffer bonding layer includes first tie layer and the second tie layer that the range upon range of setting, first tie layer with the bonding portion is connected, the second tie layer with display panel bonds, the area of second tie layer is greater than the area of first tie layer, first tie layer is the two-sided tie layer, the second tie layer is the single sided tie layer, the adhesion face of second tie layer with the backplate is laminated mutually.
Optionally, in a direction perpendicular to the display panel, a thickness of the second adhesive layer is greater than a thickness of the first adhesive layer.
Optionally, the orthographic projection of the bonding surface of the bonding part contacted with the buffer bonding layer on the display panel covers the orthographic projection of the first bonding layer on the display panel.
Optionally, a side surface of the second adhesive layer, which is close to the first adhesive layer, is a first side surface, a side surface of the second adhesive layer, which is far away from the first adhesive layer, is a second side surface, an area of the second side surface is larger than an area of the first side surface, and in a direction from a center of the second adhesive layer to an edge of the second buffer adhesive layer, a thickness of the second adhesive layer between the edge of the first side surface and the edge of the second side surface is gradually reduced.
Optionally, a distance between an edge of the buffer adhesive layer that is orthographic projected on the display panel and an edge of the adhesive portion that is orthographic projected on the display panel is greater than or equal to 2mm.
Optionally, the display panel includes being close to the binding area at display panel edge, components and parts set up on binding the base plate, binding the base plate and being located bind the district, supporting part butt in bind on the base plate.
Optionally, the support main part includes the edge the horizontal main part of display panel horizontal direction, with a shelter from portion that edge connects of horizontal main part, shelter from the portion with the horizontal main part is a preset contained angle, horizontal main part with shelter from the portion formation accommodation portion, driving chip with components and parts are located accommodation portion.
Optionally, a buffer curved surface is arranged around the bonding surface where the bonding portion contacts with the buffer bonding layer, and the buffer curved surface is bent towards a direction away from the display panel.
In addition, the embodiment of the application also provides a protection bracket, which comprises:
the bracket comprises a bracket body, a bonding part connected with the bracket body and a supporting part connected with the bracket body, wherein the bonding part and the supporting part are positioned on the same side of the bracket body;
the buffer bonding layer is bonded on the bonding portion, the area of the buffer bonding layer is larger than that of the bonding portion, and in the direction perpendicular to the buffer bonding layer, the projection of the bonding portion is located in the projection area of the buffer bonding layer.
The beneficial effects of the invention at least comprise:
the display panel is provided with a protection bracket which is detachably connected, the protection bracket comprises a bracket main body, a bonding part and a supporting part, wherein the bonding part and the supporting part are respectively connected with the bracket main body, the bracket main body covers a driving chip and components, the bonding part is bonded with the backboard through a buffer bonding layer, and the supporting part is abutted with the display panel; the area of buffering tie coat is greater than the area of bond, in the direction of perpendicular display panel, the projection of bond is located the projection region of buffering tie coat for the edge of buffering tie coat expands outward for the bonding face of bond laminating display panel, and the protective cradle also can protect components and parts and the drive chip on the display panel from external force damage, and when the protective cradle was torn, the buffer tie coat that expands simultaneously can play the cushioning effect, prevents the copper foil on the protective cradle extrusion display panel backplate, prevents to produce the impression on tearing the in-process copper foil, has guaranteed display module assembly's display effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural view of a protective bracket according to an embodiment of the present application;
FIG. 3 is a side view of a protective cradle provided in an embodiment of the present application;
FIG. 4 is a side view of another protective cradle provided in an embodiment of the present application;
FIG. 5 is a schematic structural view of another protective bracket according to an embodiment of the present application;
FIG. 6 is a top view of a protective cradle provided in an embodiment of the present application;
FIG. 7 is a bottom view of a protective cradle provided in an embodiment of the present application;
fig. 8 is a schematic structural view of an adhesive portion and a buffer adhesive layer of a protective bracket according to an embodiment of the present application;
fig. 9 is a schematic structural diagram of a display module according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application provides a display module and a protection bracket. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments. In addition, in the description of the present application, the term "comprising" means "including but not limited to". The terms first, second, third and the like are used merely as labels, and do not impose numerical requirements or on the order of construction. Various embodiments of the invention may exist in a range of forms; it should be understood that the description in a range format is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of the invention; it is therefore to be understood that the range description has specifically disclosed all possible sub-ranges and individual values within that range. For example, it should be considered that a description of a range from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the ranges, such as 1, 2, 3, 4, 5, and 6, wherever applicable. In addition, whenever a numerical range is referred to herein, it is meant to include any reference number (fractional or integer) within the indicated range.
In order to solve the technical problems in the background art, the present application provides the following technical solutions, and specific reference is made to the following embodiments.
The embodiment of the application provides a display module, as shown in fig. 1, 2 and 9, including: a display panel 10 and a protective bracket 20 detachably connected to the display panel 10;
in particular, the detachable connection comprises an adhesive;
the display panel 10 includes a back plate, a driving chip 101 and a component 102 disposed on the back plate;
it should be noted that, the display panel 10 includes a display area AA and a binding area BA; as shown in fig. 1, the binding area BA is located near the edge of the display panel 10;
as shown in fig. 1, the display panel 10 includes a back plate, a display functional layer attached to the back plate and located in the display area AA, a driving chip 101 and a plurality of components 102 disposed on a side surface of the back plate away from the display functional layer, where the driving chip 101 and the components 102 are located in the binding area BA, and the components 102 are disposed on a binding substrate 104, the binding substrate 104 is attached to the back plate, and the components 102 may be specifically binding terminals on a flexible circuit board;
copper foil 103 is attached to one side surface of the back plate away from the display function layer, and the driving chip 101 and the component 102 are located on one side surface of the back plate away from the display function layer.
In the product shipment transportation, the driving chip 101 and the top of the component 102 only cover the protection of the adhesive tape, and the plastic tray used for packaging may collide with the display panel 10 during transportation, resulting in the damage of the component 102, so that the display panel 10 cannot display normally, and the common countermeasure is to set the protection support 20 on the back of the display panel 10, but because the protection support 20 is harder, the protection support 20 needs to be torn off during the subsequent assembly process, the protection support 20 is easy to squeeze the copper foil 103, so that the copper foil 103 deforms, and the display panel 10 generates an imprint.
As shown in fig. 2, the protection bracket 20 includes a bracket main body 201, an adhesive portion 202 and a supporting portion 203 connected to the bracket main body 201, wherein the bracket main body 201 covers at least the driving chip 101 and the component 102, the adhesive portion is adhered to the back plate, and the supporting portion 203 is abutted against the display panel 10;
specifically, the protection rack 20 includes a rack main body 201, and the projection of the rack main body 201 on the display panel 10 at least covers the driving chip 101 and the component 102, so as to prevent the driving chip 101 and the component 102 from being knocked during transportation, and influence the normal display of the display panel 10.
Specifically, the protective bracket 20 includes an adhesive portion 202 and at least one supporting portion 203, the supporting portion 203 and the adhesive portion 202 are located on the same side of the bracket main body 201, and as shown in fig. 6 and 7, the protective bracket 20 has three supporting portions 203.
Specifically, as shown in fig. 2, the protection bracket 20 includes a bonding portion 202, the bonding portion 202 may be a block, a bottom surface of the bonding portion 202 is a bonding surface S2 for bonding the display panel 10, the bonding portion 202 may be connected to the bracket main body 201 by an extension arm 2021, the extension arm 2021 extends from an edge of the display panel 10 to a center of the display panel 10, one end of the extension arm 2021 is connected to the bracket main body 201, and the other end of the extension arm 2021 is connected to a top surface (an edge position of the top surface shown in fig. 2) of the bonding portion 202;
the adhesive portion 202 and the back plate are adhered by a buffer adhesive layer 204, the area of the buffer adhesive layer 204 is larger than the area of the adhesive portion 202, and in the direction perpendicular to the display panel 10, the projection of the adhesive portion 202 is located in the projection area of the buffer adhesive layer 204.
Specifically, as shown in fig. 3, 4 and 5, the buffer adhesive layer 204 is disposed on the bottom surface of the adhesive portion 202, the buffer adhesive layer 204 includes a buffer layer with a suitable thickness, the buffer layer may be a foam layer, the thickness of the buffer layer is at least 0.3mm, the edge of the buffer adhesive layer 204 is flared with respect to the edge of the adhesive portion 202 by a distance of at least 2mm, that is, the area of the buffer adhesive layer 204 is larger than the area of the adhesive portion 202, and in the direction perpendicular to the display panel 10, the projection of the adhesive portion 202 is located in the projection area of the buffer adhesive layer 204.
Specifically, the buffer adhesive layer 204 may be a foam adhesive layer with two adhesive sides, or may be a foam adhesive layer with one adhesive side, wherein the adhesive surface S1 of the foam adhesive layer with adhesive properties is used for bonding with the display panel 10, and the non-adhesive side of the foam adhesive layer is bonded with the bottom surface of the bonding portion 202 through a double-sided adhesive.
It can be understood that, by providing the detachably connected protective bracket 20 on the display panel 10, the protective bracket 20 includes a bracket main body 201, an adhesive portion 202 and a supporting portion 203 respectively connected with the bracket main body 201, the bracket main body 201 covers the driving chip 101 and the component 102, the adhesive portion is adhered to the back plate through the buffer adhesive layer 204, and the supporting portion 203 is abutted against the display panel 10; the area of buffer bonding layer 204 is greater than the area of bonding portion 202, in the direction of perpendicular display panel 10, the projection of bonding portion 202 is located the projection region of buffer bonding layer 204 for buffer bonding layer 204' S edge is expanded outward for bonding surface S2 of bonding portion 202 laminating display panel 10, and protection support 20 also can protect components and parts 102 and driver chip 101 on the display panel 10 from external force damage, and simultaneously when protection support 20 tears, the buffer bonding layer 204 that expands outward can play the cushioning effect, prevents the copper foil 103 on the protection support 20 extrusion display panel 10 backplate, prevents to produce the impression on copper foil 103 in the tearing process, has guaranteed the display effect of display module assembly.
In an embodiment, the buffer adhesive layer 204 includes a first adhesive layer 2041 and a second adhesive layer 2042 that are stacked, the first adhesive layer 2041 is connected to the adhesive portion 202, the second adhesive layer 2042 is adhered to the display panel 10, the area of the second adhesive layer 2042 is larger than the area of the first adhesive layer 2041, the first adhesive layer 2041 is a double-sided adhesive layer, the second adhesive layer 2042 is a single-sided adhesive layer, and the adhesive surface of the second adhesive layer 2042 is adhered to the back plate.
Specifically, the first adhesive layer 2041 and the second adhesive layer 2042 are adhered to each other, and as shown in fig. 5 and 9, the protective bracket 20 is adhered to the display panel 10 in the order of the adhesive portion 202, the first adhesive layer 2041, the second adhesive layer 2042, and the display panel 10.
Specifically, the first adhesive layer 2041 may be a double-sided adhesive, the second adhesive layer 2042 may be a single-sided foam adhesive, the thickness of the double-sided adhesive is 0.2mm, and the thickness of the single-sided foam adhesive is 0.4mm.
Specifically, the area of the first adhesive layer 2041 may be equal to the area of the adhesive surface S2, or may be smaller than the area of the adhesive surface S2, that is, the front projection of the first adhesive layer 2041 on the display panel 10 falls within the front projection of the adhesive surface S2 on the display panel 10.
Specifically, when the first adhesive layer 2041 and the second adhesive layer 2042 are provided, the adhesive capacity between the first adhesive layer 2041 and the second adhesive layer 2042 can be smaller than the adhesive capacity between the second adhesive layer 2042 and the display panel 10 by selecting appropriate materials, so that when the protective bracket 20 is torn, the protective bracket 20 can be removed by adopting smaller force, the extrusion force strength of the protective bracket 20 to the copper foil 103 during tearing is reduced, the buffer effect of the second buffer layer can be ensured as much as possible, and the yield of the display panel 10 is improved.
It can be appreciated that by providing the buffer adhesive layer 204 includes the first adhesive layer 2041 and the second adhesive layer 2042, the first adhesive layer 2041 and the second adhesive layer 2042 are stacked, wherein the first adhesive layer 2041 plays a role in double-sided adhesion, and the second adhesive layer 2042 plays a role in adhering the display panel 10 and buffering, so that the second adhesive layer 2042 that the protective bracket 20 expands outwards in use can play a role in buffering better.
In an embodiment, the thickness of the second adhesive layer 2042 is greater than the thickness of the first adhesive layer 2041 in a direction perpendicular to the display panel 10.
Specifically, the thickness of the first adhesive layer 2041 is greater than or equal to 0.05mm, preferably 0.05mm to 0.3mm, and may specifically be 0.2mm, but the thickness of the first adhesive layer 2041 is not limited to the above range, and may specifically be adjusted according to actual production conditions.
Specifically, the thickness of the second adhesive layer 2042 is greater than or equal to 0.3mm, and may be specifically 0.4mm, but the thickness of the second adhesive layer 2042 is not limited to the above range, and may be specifically adjusted according to actual production conditions.
Specifically, the thickness of the second adhesive layer 2042 is greater than that of the first adhesive layer 2041, the second adhesive layer 2042 is directly contacted with the display panel 10, the second adhesive layer 2042 plays a role in buffering and pasting, and the first adhesive layer 2041 only plays a role in pasting.
It can be appreciated that, since the second adhesive layer 2042 is attached to the display panel 10, the thickness of the second adhesive layer 2042 is greater than that of the first adhesive layer 2041, so that the second adhesive layer 2042 can be more uniformly dispersed when the protective frame 20 is torn and pulled, and the buffering effect is better.
In an embodiment, the front projection of the adhesive surface S2 of the adhesive portion 202 contacting the buffer adhesive layer 204 on the display panel 10 covers the front projection of the first adhesive layer 2041 on the display panel 10.
Specifically, the area of the first adhesive layer 2041, i.e. the double-sided adhesive layer, is set smaller than the area of the adhesive surface S2, so that the distance of the first adhesive layer 2041 shrinking inside the first adhesive layer 2041 is not displayed, and can be specifically adjusted according to actual production requirements.
It can be appreciated that by arranging the front projection of the bonding surface S2 on the display panel 10 to cover the front projection of the first adhesive layer 2041 on the display panel 10, when the protective bracket 20 is attached to the display panel 10, the adhesive layer is not overflowed, so that other impurities in the transportation process are prevented from adhering to the exposed adhesive material, and the connection of BA elements in the bonding area of the display panel 10 is affected.
In an embodiment, as shown in fig. 8, a side of the second adhesive layer 2042 near the first adhesive layer 2041 is a first side, a side of the second adhesive layer 2042 far from the first adhesive layer 2041 is a second side, an area of the second side is larger than an area of the first side, and a thickness of the second adhesive layer 2042 between an edge of the first side and an edge of the second side gradually decreases in a direction from a center of the second adhesive layer 2042 to an edge of the second buffer adhesive layer 204.
It should be noted that, since the second adhesive layer 2042 may be a single-sided foam adhesive layer, the second adhesive layer 2042 has a limited thickness and is soft, and when the second adhesive layer 2042 is adhered to the display panel 10, the edge portion of the second adhesive layer 2042 is easy to curl, so that the adhesion between the protective bracket 20 and the display panel 10 is uneven, and the accuracy is low.
It can be appreciated that, as shown in fig. 8, by thinning the edge thickness of the second adhesive layer 2042, the vertical section of the second adhesive layer 2042 is trapezoidal, so that the probability of edge curling of the second adhesive layer 2042 can be reduced, and the accuracy of the second adhesive layer 2042 when being attached to the display panel 10 can be improved.
In the above embodiment, as shown in fig. 6 and 7, before the second adhesive layer 2042 is attached to the display panel 10, a release paper 2043 is covered on the adhesive side of the second adhesive layer 2042, and the release paper 2043 has a certain stiffness compared with the second adhesive layer 2042, so that the second adhesive layer 2042 can maintain a certain flatness.
In one embodiment, as shown in fig. 6 and 7, a distance between an edge of the front projection of the buffer adhesive layer 204 on the display panel 10 and an edge of the front projection of the adhesive portion 202 on the display panel 10 is greater than or equal to 2mm.
Specifically, in comparison with fig. 3 and 4, in fig. 4, the bonding portion 202 may include a bonding surface S2 and a buffer inclined surface (not shown) formed at the periphery of the bonding surface S2, so that the front projection of the bonding portion 202 on the display panel 10 may be greater than or equal to the front projection of the bonding surface S2 on the display panel 10.
Specifically, as shown in fig. 6 and 7, the distance between the edge of the front projection of the buffer adhesive layer 204 on the display panel 10 and the edge of the front projection of the adhesive portion 202 on the display panel 10 may be actually understood as a shortest distance between the outer contour of the buffer surface and the outer contour of the buffer adhesive layer 204 in the direction perpendicular to the display panel 10 is greater than or equal to 2mm.
It can be appreciated that by setting a reasonable outward expansion distance, when the display panel 10 and the protective support 20 are torn away, the protective support 20 can be torn away from any direction to disperse the extrusion force of the protective support 20 on the copper foil 103, so as to prevent the copper foil 103 from being stamped.
In an embodiment, the display panel 10 includes a binding area BA near the edge of the display panel 10, the component 102 is disposed on the binding substrate 104, the binding substrate 104 is located in the binding area BA, and the supporting portion 203 abuts against the binding substrate 104.
Specifically, as shown in fig. 6 and fig. 7, the number of the supporting portions 203 may be three, the three supporting portions 203 are arranged in a dispersed manner to form a stable supporting structure, as shown in fig. 1, a plurality of components 102 are arranged on the binding substrate 104, a non-component area (i.e. a position where no component is arranged) is arranged on the binding substrate 104, no component 102 is arranged in the non-component area, as shown in fig. 9, the supporting portions 203 may abut against the binding substrate 104 in the non-component area, as the binding substrate 104 is made of a harder material and has a larger area, no imprint is left on the copper foil 103, the supporting manner of the supporting portions 203 can enable the support of the protective bracket 20 to be more stable, and meanwhile, the arrangement of more than three supporting portions 203 can reduce the extrusion force of the bonding portion 202 on the copper foil 103 as much as possible, i.e. when the protective bracket 20 is extruded, the stress points are mainly concentrated on the supporting portions 203 instead of the bonding portion 202.
It can be appreciated that the reasonable placement of the supporting portion 203 can reduce the risk of the copper foil 103 on the display panel 10 being printed as much as possible, and protect the components 102 of the display panel 10 from being damaged by impact during transportation, thereby affecting the normal display of the display panel 10.
In an embodiment, as shown in fig. 2, the stand main body 201 includes a horizontal main body 2011 along a horizontal direction of the display panel 10, a shielding portion 2012 connected to an edge of the horizontal main body 2011, the shielding portion 2012 forms a preset angle with the horizontal main body 2011, the horizontal main body 2011 and the shielding portion 2012 form a containing portion, and the driving chip 101 and the component 102 are located in the containing portion.
Specifically, as shown in fig. 3, 4 and 5, the shielding portion 2012 may form an included angle of 90 ° with the bracket main body 201, the shielding portion 2012 is disposed at an edge of the bracket main body 201, the shielding portion 2012 includes two shielding sub-portions, the two supporting portions 203 and the horizontal main body 2011 together form a containing portion, the driving chip 101 and the component 102 of the display panel 10 are disposed in the containing portion, as shown in fig. 9, an inner edge line of the containing portion is similar to an outer contour line of the corresponding binding area BA of the display panel 10.
Specifically, the shielding part 2012 does not contact the display panel 10, and the shielding part 2012 and the horizontal main body 2011 form an eave-like structure (see the L-shaped structure on the right side of fig. 3, 4 and 5), so that the probability of the side surface of the display panel 10 being impacted can be effectively reduced, and the protection performance of the protection bracket 20 is improved.
Specifically, the connection between the shielding portion 2012 and the horizontal main body 2011 is a rounded corner, so that the probability of cracking the protection bracket 20 after being impacted can be reduced, and the service life of the protection bracket 20 is prolonged.
Specifically, as shown in fig. 2 and 6, when the horizontal main body 2011 is square, an inner edge near the center of the display panel 10 among four side edges of the horizontal main body 2011 is connected to the adhesive part 202, and an outer edge opposite to the inner edge is connected to the shielding part 2012.
It can be appreciated that, by arranging the stand main body 201 in a half-package structure, the driving chip 101 and the components 102 on the display panel 10 can be protected as much as possible, so that the loss of the driving chip 101 or the components 102 caused by the unoriented impact of the display panel 10 in the transportation process is prevented, and the yield of the display panel 10 is reduced.
In an embodiment, as shown in fig. 4, a buffer curved surface is disposed around the bonding surface S2 where the bonding portion 202 contacts the buffer adhesive layer 204, and the buffer curved surface is curved in a direction away from the display panel 10.
It can be understood that, a rounded structure is formed between the bottom surface and the side surface of the bonding portion 202, and compared with a structure in which a right angle (acute angle) is formed between the bottom surface and the side surface of the bonding portion 202, the rounded structure can increase the contact area between the protective bracket 20 (especially the bonding portion 202) and the copper foil 103 on the display panel 10 when the protective bracket 20 is torn away from the display panel 10, thereby reducing the pressure generated by the extrusion force and preventing the copper foil 103 from generating an imprint.
In addition, the embodiment of the present application further provides a protection support 20, as shown in fig. 2-8, including:
a holder main body 201, an adhesive portion 202 connected to the holder main body 201, and a support portion 203 connected to the holder main body 201, the adhesive portion 202 and the support portion 203 being located on the same side of the holder main body 201;
specifically, the structure of the stand main body 201 is not limited, and the shapes of the driving chip 101 and the component 102 to be protected on the corresponding display panel 10 can be covered within the protection scope of the present application.
Specifically, the shape of the bonding portion 202 is not particularly limited, and one of the bonding portions 202 is bonded to the back plate of the display panel 10 through the buffer adhesive layer 204, and can also cooperate with the supporting portion 203 to a certain extent to support the protective bracket 20.
Specifically, the supporting portion 203 does not directly abut against the back plate, and the supporting portion 203 is supported in the non-device region on the bonded substrate 104 (the position and structure of the bonded substrate 104 are described in the above embodiments).
Wherein, the buffer adhesive layer 204 is adhered to the adhesive portion 202, the area of the buffer adhesive layer 204 is larger than the area of the adhesive portion 202, and in the direction perpendicular to the buffer adhesive layer 204, the projection of the adhesive portion 202 is located in the projection area of the buffer adhesive layer 204.
Specifically, the area of the buffer adhesive layer 204 is larger than the area of the adhesive portion 202, that is, after the protective bracket 20 is adhered to the display panel 10, the area of the front projection of the buffer adhesive layer 204 on the display panel 10 is larger than the area of the front projection of the adhesive portion 202 on the display panel 10, and the front projection of the adhesive portion 202 on the display panel 10 is located in the front projection area of the buffer adhesive layer 204 on the display panel 10.
It can be appreciated that by reasonably setting the area relationship between the area of the buffer adhesive layer 204 and the area relationship between the adhesive portion 202 of the protective bracket 20, the buffer adhesive layer 204 is spread out a certain distance with respect to the adhesive portion 202, so that when the protective bracket 20 is torn off, the spread buffer adhesive portion 202 can play a role of dispersing and relieving the extrusion force, and prevent the adhesive portion 202 of the protective bracket 20 from leaving an imprint on the copper foil 103 of the display panel 10, thereby affecting the visual effect of the display panel 10.
The application further provides an application of the protection support 20, as shown in fig. 9, the bonding portion 202 of the protection support 20 is bonded on a back plate (a region where the copper foil 103 is attached on the back plate) of the backlight surface of the display panel 10 through the buffer bonding layer 204, the supporting portion 203 of the protection support 20 is abutted to a non-device region on the binding substrate 104, the support main body 201 of the protection support 20 covers the driving chip 101 and the component 102 to be protected, the area of the buffer bonding layer 204 is larger than that of the bonding portion 202, and in the direction perpendicular to the buffer bonding layer 204, the projection of the bonding portion 202 is located in the projection region of the buffer bonding layer 204.
In summary, the protection bracket 20 detachably connected to the display panel 10 is provided, the protection bracket 20 includes a bracket main body 201, an adhesive portion 202 and a supporting portion 203 respectively connected to the bracket main body 201, the bracket main body 201 covers the driving chip 101 and the component 102, the adhesive portion is adhered to the back plate through a buffer adhesive layer 204, and the supporting portion 203 is abutted to the display panel 10; the area of buffer bonding layer 204 is greater than the area of bonding portion 202, in the direction of perpendicular display panel 10, the projection of bonding portion 202 is located the projection region of buffer bonding layer 204 for buffer bonding layer 204' S edge is expanded outward for bonding surface S2 of bonding portion 202 laminating display panel 10, and protection support 20 also can protect components and parts 102 and driver chip 101 on the display panel 10 from external force damage, and simultaneously when protection support 20 tears, the buffer bonding layer 204 that expands outward can play the cushioning effect, prevents the copper foil 103 on the protection support 20 extrusion display panel 10 backplate, prevents to produce the impression on copper foil 103 in the tearing process, has guaranteed the display effect of display module assembly.
The display module and the protection bracket provided by the embodiment of the present application are described in detail, and specific examples are applied to illustrate the principle and the implementation of the present application, and the description of the above embodiments is only used for helping to understand the method and the core idea of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims (8)

1. A display module, comprising: a display panel and a protective bracket detachably connected with the display panel;
the display panel comprises a back plate, and a driving chip and components which are arranged on the back plate;
the protection bracket comprises a bracket main body, a bonding part and a supporting part, wherein the bonding part and the supporting part are respectively connected with the bracket main body, the bracket main body at least covers the driving chip and the components, the bonding part is bonded with the backboard, and the supporting part is abutted with the display panel;
the bonding part is bonded with the backboard through a buffer bonding layer, the area of the buffer bonding layer is larger than that of the bonding part, and the projection of the bonding part is positioned in the projection area of the buffer bonding layer in the direction perpendicular to the display panel;
the buffer bonding layer comprises a first bonding layer and a second bonding layer which are stacked, the first bonding layer is connected with the bonding part, and the second bonding layer is bonded with the display panel;
a side surface of the second bonding layer, which is close to the first bonding layer, is a first side surface, a side surface of the second bonding layer, which is far away from the first bonding layer, is a second side surface, the area of the second side surface is larger than that of the first side surface, and the thickness of the second bonding layer between the edge of the first side surface and the edge of the second side surface is gradually reduced in the direction from the center of the second bonding layer to the edge of the second bonding layer;
the periphery of the bonding surface, which is contacted with the buffer bonding layer, of the bonding part is provided with a buffer curved surface, the buffer curved surface is bent towards the direction deviating from the display panel, and a round corner structure is arranged between the bottom surface and the side surface of the bonding part;
when the protective bracket is torn away from the display panel, the fillet structure increases the contact area between the protective bracket and the copper foil on the display panel;
the support main body includes the edge the horizontal main body of display panel horizontal direction, with the shielding part of a horizontal main body edge connection, shielding part with the junction of horizontal main body is the fillet.
2. The display module assembly of claim 1, wherein the second adhesive layer has an area greater than an area of the first adhesive layer, the first adhesive layer is a double sided adhesive layer, the second adhesive layer is a single sided adhesive layer, and an adhesive surface of the second adhesive layer is bonded to the back plate.
3. The display module of claim 2, wherein a thickness of the second adhesive layer is greater than a thickness of the first adhesive layer in a direction perpendicular to the display panel.
4. A display module according to claim 3, wherein the orthographic projection of the bonding surface of the bonding portion in contact with the buffer bonding layer on the display panel covers the orthographic projection of the first bonding layer on the display panel.
5. The display module of claim 1, wherein a distance between an edge of the buffer adhesive layer that is orthographic projected on the display panel and an edge of the adhesive portion that is orthographic projected on the display panel is greater than or equal to 2mm.
6. The display module of claim 1, wherein the display panel includes a binding region proximate to an edge of the display panel, the component is disposed on a binding substrate, the binding substrate is disposed in the binding region, and the support portion is abutted to the binding substrate.
7. The display module assembly of claim 6, wherein the shielding portion forms a predetermined angle with the horizontal body, the horizontal body and the shielding portion form a receiving portion, and the driving chip and the component are located in the receiving portion.
8. A protective cradle, comprising:
the bracket comprises a bracket body, a bonding part connected with the bracket body and a supporting part connected with the bracket body, wherein the bonding part and the supporting part are positioned on the same side of the bracket body;
the bonding part is bonded with a buffer bonding layer, the area of the buffer bonding layer is larger than that of the bonding part, and the projection of the bonding part is positioned in the projection area of the buffer bonding layer in the direction perpendicular to the buffer bonding layer;
the buffer bonding layer comprises a first bonding layer and a second bonding layer which are stacked, the first bonding layer is connected with the bonding part, and the second bonding layer is bonded with the display panel;
a side surface of the second bonding layer, which is close to the first bonding layer, is a first side surface, a side surface of the second bonding layer, which is far away from the first bonding layer, is a second side surface, the area of the second side surface is larger than that of the first side surface, and the thickness of the second bonding layer between the edge of the first side surface and the edge of the second side surface is gradually reduced in the direction from the center of the second bonding layer to the edge of the second bonding layer;
the periphery of the bonding surface, which is contacted with the buffer bonding layer, of the bonding part is provided with a buffer curved surface, the buffer curved surface is bent towards the direction deviating from the display panel, and a round corner structure is arranged between the bottom surface and the side surface of the bonding part;
when the protective bracket is torn away from the display panel, the fillet structure increases the contact area between the protective bracket and the copper foil on the display panel;
the support main body includes the edge the horizontal main body of display panel horizontal direction, with the shielding part of a horizontal main body edge connection, shielding part with the junction of horizontal main body is the fillet.
CN202210266684.4A 2022-03-17 2022-03-17 Display module and protective bracket Active CN114613270B (en)

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CN115978368A (en) * 2022-12-21 2023-04-18 京东方科技集团股份有限公司 Protective bracket for supporting display screen and forming method of protective bracket

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